TWI380395B

TWI380395B - Test handler, method for unloading and manufacturing packaged chips and method for transferring test trays

Info

Publication number: TWI380395B
Application number: TW097144672A
Authority: TW
Inventors: Hee Rak Beom; Kyeong Tae Kim
Original assignee: Mirae Corp
Priority date: 2008-04-21
Filing date: 2008-11-19
Publication date: 2012-12-21
Also published as: US20090261817A1; CN101566668A; TW200945482A; KR100938466B1; KR20090111028A; CN101566668B

Description

1380395 九、發明說明：【發明所屬之技術領域】本發明係關於一種測試搬運機，沾’该測試搬運機用以將待測試的封裝晶片連接至測試機並基於列今汰认 ' Λ、、*°果透過分級將經測試機測 5式後的封袭晶片進行分類。【先前技術】試測試搬運射祕在縣製轉料對縣^進行電測測試搬運機係連接至用以測試測試機包含高舰倾，㈣高^=，測試機。此試插槽且賴w射独找^^^制㈣數個測與測試搬運齡連。 9 °此祕奴位板係封裝搬運機係使用測試托盤執行裝載製程氣程，此職滅包麵數練容單元Μ容㈣裝晶片及啦測試搬運機可用以執行裝载製程。在封裝晶片從用戶托盤被傳送至測紐盤。μ，待測試的測試搬運機可用以執行測試製程。在測試程中容納於測試她中的封裝晶片將被連接二於裝載製疋封裝曰曰片作業是否正常，對纖高精度定位板之封裝晶片進行：確_試 7 1380395 搬運機還包含複數個腔室，制藉以確定封I .，、飞冷部封裝晶片地作苹。衣兄卜疋否能夠正常制。:趣麵抓㈣執行卸載製程。在卸難程巾，於收容於相應物齡―封裝晶片之時間強了產其能夠透過縮短裝載製程、測試製程及卸載製程所用時間内製造出更多的封料片，因此以縮減成本加口口的競爭力。的封裝晶片執因而’本領域需要-種能夠在短時間内對更多仃裝载製程、測試製程及卸紐程之職搬運機。【發明内容】1380395 IX. Description of the Invention: [Technical Field] The present invention relates to a test handler for attaching a packaged wafer to be tested to a test machine and based on the identification *° The classification of the sealed wafers after the tester 5 is classified by the classification. [Prior Art] The test test is carried out in the county system. The electric meter is tested on the county. The test handler is connected to the test machine. The test machine includes a high ship tilt, (4) high ^=, test machine. This test slot is also used to find the ^^^ system (four) several test and test carrying age. 9 ° This secret slave system The package handler uses the test tray to carry out the loading process. The gas path is used to fill the surface of the package. (4) Loading the wafer and the test handler can be used to perform the loading process. The package wafer is transferred from the user tray to the test chuck. μ, the test handler to be tested can be used to perform the test process. In the test process, the packaged wafers contained in the test will be connected to the loading and unpacking. The wafers are processed normally. The packaged wafers of the high-precision positioning boards are: _ test 7 1380395 The carrier also contains a plurality of The chamber is made up to determine the sealing of the package. Can the brothers and sisters be able to work normally? : Fun face grab (four) to perform the uninstall process. In the unloading of the towel, it is strong in the time of being contained in the corresponding age-packaged wafer. It can manufacture more sealing sheets by shortening the loading process, the testing process and the unloading process, thus reducing the cost. The competitiveness of the mouth. The packaged wafers are thus required to be able to carry more processing, test processes and unloading jobs in a short period of time. [Summary of the Invention]

為了解決以上所述之問題，本發明之目的之 :短時間内對更多的封裝晶片執行裝載製程與卸载= 試搬運機及封裝晶片卸載方法種測試托盤傳送方法，係可透盤之等待咖並可減少裝載製本發明之另一目的在於提供一過高效傳送測試托盤而減少測試托程與卸載製程所用之時間。本發明之另一目的還在於提供一種封裝晶片製造方法，係能 395 裝载製程與卸載製程所用之時間而在短時間内製造更 ua>j ’進㈣成本縮減來加強產品的競爭力。為獲得上述之目的，本發明可分為以下幾方面： -本發明之—方面在於提供_細馳運機，係包含：裝兀此裝载早疋包含農载拾取器，此裝载拾取器用以在位於料托盤上執行裝程，此裝載位置係為測試托盤中'收 :有待測試的封裝晶騎測試托盤所處的位置；腔㈣統，在腔了中收各於攸裝載單元傳送而來的測試托盤之中的封裝曰 =被連接至高精度定位板並進行測試；卸鮮元，此卸載單= =有至少-個卸載緩衝器及一卸載拾取器，卸載緩衝器係沿著二於位於卸載位置的測試托盤之上方的卸載移動路捏移動，此载位置係為從測試托盤上分離測試後的封裝晶片時測試托盤所处的位置’卸載拾取器_以在位於卸載位置_試托盤上執行 :載製程’並且此卸载單元係被設置於錄單元的旁邊；通路位，係配置於裝載單元與卸載單元之間並將裝载單元與卸載單元連魅腔㈣統贿得收容有制試的縣晶片之測試托盤可從 =載早轉送至腔室系魅錄容麵試後的封裝日日日片之測試托揽可從腔室系統傳送至卸載單元；以及傳送單元，係用以將測試托盤，裝鮮元傳送至稱位置，將戦城從桃位置傳送至 P載單元，以及將托盤從卸載單元傳送至裝載單元。本發明之另-方面在於提供一種封裝晶片卸载方法，係包含 1380395 以;下步驟··使第二卸載拾取器從位於卸載㈣的測試托盤上分離測試後的封裝晶片，此卸載位置係為從測試托盤上分離測試後的封裝a曰片時測試托盤所處的位置；使複數個卸載緩衝器中的至少一個卸载緩衝ϋ沿著形成於位於卸載位置的測試托盤之上方的卸载移動路徑移動，以使得至少一個卸載緩衝器係位於處在卸載位跡贱托盤之上方’·使第二卸載拾取器將測試後的封裝晶片收 >口者卸載鶴路徑機至第—卸載拾取器能夠從卸倾衝器中於封裝⑼之位置；以及使第—㈣拾取器從卸载緩衝。。中认測試後的封裝晶片並將所拾取的縣晶片收容於位載堆疊機中的用戶托盤之中。、本發明之另—方面還在於提供—種_托鱗送方法，係包 s以下步驟n鮮元執行將制朗封裝⑼收容於位於裝载位置之職㈣巾的賴伽，此賴錢麵峨托盤情谷有待測試的域晶㈣職托盤所處的位置；將已經過裝载製私的測試托做賴位置下降錄於賴位置的第-脫離位置；將位於第-卿健的職托㈣送至連聽辭林腔室 _路位置旧嫌通路位置巾並且_裝絲_她盤 ^通路位置傳技腔室系統；使腔錢_整收容於測試托盤中声雖晶㈣—溫度，連接調整至第一溫度的封編至高精度疋位板並測試封裝晶片，並絲測試後的封裝晶片調整至第二溫度，將收对戦_封裝晶片之職托搬腔㈣通路位置；驗於祕位置巾且收財職後_裝“之_ 托盤從通路位置傳送至位於卸雜置之下方的第-抵達位置，此 =載位置係為從測_盤上分離測試後的封裝晶片時測試托盤所處的位置；使位於第一抵達位置的測試托盤上升至卸載位置.在位於卸載位置_試脑上執行卸賴程；贼將已經過卸载制程的測試托盤通過介於卸載位置與第二抵達位置之間的第二脫= 位置以及介魏雜置與第—麟位置之_第— 卸載位置傳送至裝載位置。置而攸本㈣之I方面還在於提供—觀裝；製造方法，係包 3以下步驟.製備_試的雜晶片；使裝鮮元執行將已製的封裝4收祕位於裝載位置之測試滅巾的魏製程，此載位置係為測試托盤中收容有待測試的封裝晶片時測試托盤所處的位置，將已㈣裝賴程的測試托盤從裝触置下降至低於載位置的第-麟位置；將位於第—麟位置的峨托盤傳送至連接裝裁單元與腔室系統的通路位置， ·將位於通路位置中並且已經過裝賴_職鋪從通職送魏㈣統；使腔統調整收容於測試托盤中的封裝晶片至第一溫度，連接調整至第 /一溫度的封裝晶片至高精度定位板姻試封裝“，並且將測試後的封裝晶片調整至第二溫度；將收容有測試後的封農晶片之測試托盤從腔室系統傳送㈣路位置；將位於通路位置中且收容有 11 1380395 測試後的封裝晶片之測試托盤從通路位置傳送至位於卸载位置之下方的第一抵達位置，此卸載位置係為從測試托盤上分離測試後的封裝晶片時測試托盤所處的位置；使位於第一抵達位置的測試托盤上升至卸載位置；在位於卸載位置的測試托盤上執行卸載製程；以及將已經過卸載製程的測試托盤通過介於卸載位置與第二抵達位置之間的第二脫離位置以及介於裝載位置與第—脫離位置之間的第一抵達位置而從卸載位置傳送至裝載位置。【實施方式】施例以下，將結合圖示部分對本發明之測試搬運機的較佳實作终細說明。 ' —「第1圖」為本發明—實施例之職搬運機的平面示意圖。第2圖」為裝载單疋與卸载單元的立體示意圖。「第从圖」至「第3D圖」為裝載緩衝器與裝載拾取器作業位置之一㈣_ =罟「第4A圖」至「第4D圖」為裝载緩衝器與裝载拾取 :業置之另—實例的側面示錢。「第5圖」為於輯單元、位置及域單元之⑽送測試域之路㈣示賴。「第6 卸载單元及通路位置之前視圖。「第7圖」為裝載早讀卸载早元之平面示意圖。「第8A圖」至卸載緩衝器與卸裁拾取5!作# _ 圖」為 9A圖至「㈣同實例的側面示意圖。「第」弟®」為卸載緩衝器與卸載拾取器作孝一~意圖，〗。圖」為於本發明之實施= 12 1380395 v 在「第5圖」與「第 -體示意圖 1G圖」中代表多個測試托盤的多個泉考 ^虎表不了這些測試托盤所位於的測試搬運機之元件。在「第10 圖」中由虛線表示的多個測試托盤㈣·r測試托―，並且來表示出在裝載單元、通路位置及卸載單^中測試盤用托盤的傳送路請參考「第1圖」所示，本發明包含L…u Μ麵之魏搬運機i係匕裝載料2、卸载單元3、通路位置4、腔咖5及傳送早TC6 (如第11圖」與「第12圖」所示）。裝載單元2用以執行裳載製程並且包拾取器22及錢咖! 23。财4 、裳载裝載堆疊機21儲存有複數個收容有待測試的封農晶片之用戶托盤。裝載拾取器22用以在測試域T上執行裝的魄晶片被收容於測試托盤T中之時，此㈣h胃待咐餘置2a。此㈣盤了係位於裂裝載拾取器22能夠沿X軸方向與γ轴方向移動並可上下降。此裝載拾取器22包含用以吸取和固定封^片的多_ 13 1380395 嘴，並且此裝載拾取器22包含第_## 取器222。錄拾取器221與第二裝载拾第-娜取㈣從辦.疊機心之中。測賴職！可包含複數個第_裝载拾取器功。 •·In order to solve the above problems, the object of the present invention is to perform a loading process and an unloading process for a plurality of packaged wafers in a short time = a test carrier transfer method for a test carrier and a package wafer unloading method, and a waiting tray for a tray. It is also possible to reduce the loading time. Another object of the present invention is to provide a time for efficient transfer of test trays to reduce test and unloading processes. Another object of the present invention is to provide a method of manufacturing a package wafer which is capable of 305 loading and unloading processes and manufacturing a more short-term cost reduction in a short period of time to enhance the competitiveness of the product. In order to achieve the above object, the present invention can be divided into the following aspects: - an aspect of the present invention is to provide a _ 驰运 , , , , , , , , , 兀兀兀兀兀兀兀兀兀兀疋疋疋疋疋疋疋疋疋疋To perform the process on the material tray, the loading position is the position of the test tray in the test tray: the chamber (four) system is in the cavity, and the loading unit is transported in the chamber. The package 曰 in the test tray is connected to the high-precision positioning board and tested; the unloading unit, the unloading sheet == there are at least one unloading buffer and one unloading picker, and the unloading buffer is along the second The unloading movement path above the test tray at the unloading position is the position at which the test tray is located when the test package wafer is separated from the test tray. 'Unloading the pickup _ to be in the unloading position _ test tray Execution: carrier process 'and this unloading unit is set beside the recording unit; the passage position is arranged between the loading unit and the unloading unit and the loading unit and the unloading unit are connected to each other (4) The test tray of the county wafer containing the test can be transferred from the morning to the chamber. The test of the package day and day can be transferred from the chamber system to the unloading unit; and the transfer unit. It is used to transfer the test tray, the fresh element to the weighing position, transfer the Yucheng from the peach position to the P-loading unit, and transfer the tray from the unloading unit to the loading unit. Another aspect of the present invention provides a package wafer unloading method comprising: 1380395; the following step: separating the second unloading picker from the test tray located on the unloading (four), the unloading position is from Testing the position of the test tray when the test package is separated from the test tray; causing at least one of the plurality of unloading buffers to move along the unloading movement path formed above the test tray at the unloading position, So that at least one of the unloading buffers is located above the unloading track stacking tray. 'After the second unloading picker will test the packaged wafers> the unloading of the crane path to the first-unloading picker can be unloaded The tilter is in the position of the package (9); and the first (four) pickup is buffered from the unloading. . The test package wafer is recognized and the picked county wafer is housed in a user tray in the load stacker. Another aspect of the present invention is to provide a method for sending a seed to a scale, and the following steps: a package of the following: a fresh element is executed to hold the packaging (9) in the position of the loading position (four) towel, the Laijia face峨Tray in the valley of the valley to be tested (4) where the tray is located; the test tray that has already been loaded and manufactured is lowered to the position of the detachment position recorded in the Lai position; (4) sent to the even-talking forest chamber _ road location old suspected access location towel and _ wire _ her disk ^ path location transmission technology room system; so that the cavity money _ whole contained in the test tray sound although crystal (four) - temperature, The package is adjusted to the first temperature to the high-precision clamping plate and the packaged wafer is tested, and the packaged wafer after the wire test is adjusted to the second temperature, and the position of the storage tray (4) of the package is received; The location of the towel and the receipt of the post _ loading "the tray is transferred from the path position to the first-arrival position below the unloading miscellaneous, this = position is tested when the test package wafer is separated from the test disk The position of the tray; the test tray in the first arrival position The disk rises to the unloading position. The unloading process is performed on the unloading position _ the brain; the thief passes the test tray that has passed the unloading process through the second off position between the unloading position and the second arriving position, and the Wei Wei And the position of the first-unloading position is transferred to the loading position. The first aspect of the fourth (4) is to provide - the installation; the manufacturing method, the following steps of the package 3. Preparation of the test wafer; The fresh element performs the manufacturing process of the package 4, which is located in the loading position of the test wipe, which is the position of the test tray when the test tray contains the packaged wafer to be tested, and will be installed. The test tray is lowered from the mounting touch to the first-lin position below the load position; the pick-up tray at the first-lin position is transferred to the access position connecting the trimming unit and the chamber system, and will be located in the access position and After the slogan _ _ shop from the general duty to send Wei (four) system; make the system adjust the packaged wafer contained in the test tray to the first temperature, connect the packaged wafer adjusted to the first temperature to the high-precision positioning board test package " And adjusting the packaged wafer after testing to a second temperature; transferring the test tray containing the tested sealing wafer from the chamber system to the (four) position; and placing the test wafer in the path position and containing the 11 1380395 test package The test tray is transferred from the access position to a first arrival position below the unloading position, the unloading position being the position at which the test tray is located when the tested packaged wafer is separated from the test tray; and the test tray at the first arriving position Raising to the unloading position; performing an unloading process on the test tray at the unloading position; and passing the test tray that has been unloaded through the second disengaged position between the unloading position and the second arriving position and between the loading position and the - Transfer from the unloading position to the loading position from the first arrival position between the disengaged positions. [Embodiment] Hereinafter, a preferred embodiment of the test handler of the present invention will be described in detail with reference to the drawings. '-' Fig. 1' is a schematic plan view of the carrier of the present invention. Figure 2 is a perspective view of the loading unit and the unloading unit. "From the map" to "3D map" is one of the load buffer and load picker working positions (4) _ = 罟 "4A map" to "4D map" is the load buffer and load pick: industry Another - the side of the example shows money. "5th picture" is the road to the test domain (4) in the unit, location and domain unit (4). "The 6th unloading unit and the front view of the path position. "Fig. 7" is a plan view of the loading and unloading early element. "8A" to unloading buffer and unloading picking 5! Making # _ Fig. is a side view of the same example from 9A to (4). "Di" is an unloading buffer and unloading the pickup. ,〗. Figure 2 is an implementation of the present invention = 12 1380395 v A plurality of test tubes representing a plurality of test trays in "figure 5" and "first body diagram 1G diagram" can not indicate the test handling in which the test trays are located The components of the machine. In the "10th drawing", a plurality of test trays (four) and r test trays indicated by broken lines are used, and the transmission path of the test tray tray in the loading unit, the passage position, and the unloading unit is shown in Fig. 1 As shown in the present invention, the present invention includes a conveyor belt i, a conveyor belt i, an unloading unit 3, a passage position 4, a chamber coffee 5, and a transmission early TC6 (such as Fig. 11) and "Fig. 12". Shown). The loading unit 2 is used to execute the carry-out process and package the pickup 22 and the money coffee! The load stacker 21 stores a plurality of user trays containing the wafers to be tested. When the pick-up picker 22 is used to execute the loaded wafer on the test field T to be contained in the test tray T, the (4) h waits for the remaining 2a. This (4) disk is located in the split loading pickup 22 and is movable in the X-axis direction and the γ-axis direction and can be lowered. The pick-up picker 22 includes a multi- 13 1380395 nozzle for picking up and securing the seal, and the pick-up picker 22 includes a _## picker 222. The pickup 221 and the second loading pick-up-na take (four) from the stacking machine. Measure the job! Can include a plurality of _load picker functions. •·

•J 第-裝載拾取器如一次可從位於裝载堆疊劾中的用戶托 ^上拾取魏域於矩陣單元巾㈣裝⑼並且每次可將所拾取的封裝晶以謝車單元之形級容於輯緩_ 23中。第二裝載拾取器222用以從褒載緩衝器23中拾取待測試的封 ^片並將所拾取的封裝晶片收容於位於裝載位置&的測試托盤丁中。測試搬運機！可包含複數個第二裝載拾取器您。第二裝載拾取器222可將位於裳載位置&的測試托盤丁割分成硬數個收容區並在這魏容區情容待戦的封裝晶片。收容區由多個封裝晶片形成的矩陣單元形式以使第二裝载拾取器222能夠-次就將其收容於測試托盤τ之中。也就是說，收容區係為由複數_裝晶片所形成的矩陣單元，這些封裝^片月匕夠被第二裝載拾取器222 —次性吸取和固定。第二裝載拾取器222能夠一次從裝載緩衝器Μ中拾取複數個祕矩陣單元中的缝晶片並且每次可將所拾取的封裳晶片以矩陣單元之形式收容於測試托盤丁之中。 14 1380395 、請參考「第1圖」及「第2圖」所示，裝載緩衝器23可沿γ .軸方向移動並可臨時收容待測試的封裝晶片。裝触_23還可沿X軸方向與γ轴方向移動。測試搬運機！可包含至少一個裝載緩衝器23。儘管附圖巾未示出，裝銳_23係可與連接有複數個皮帶歡皮帶相触，藉崎馬達轉缺少—個皮帶輪時此裝載緩衝 • j 23可隨之赫。當測試搬運機1包含複數個裝載緩衝器23時，這些裝載緩衝器23可單獨地移動。、—-月參考第2圖」及「第3A圖」所示’裝载緩衝器23係可 ^著开y成於裝載位置2&之上方的魏移祕徑A移動。裝載緩衝器23可沿著裝載移動路徑a移動藉以經過位於裝載位置^的測試托盤T之上方。沿魏_齡徑A，裝做脑23可_至錄裝載堆疊機中的用戶托盤與裝載位置2a之間的區域（區域b)或者位於處在裝載位置2a的測試托盤τ之上方的區域（「第3a圖」中的區域C)中。裝载緩衝23㈣被可移祕連接絲载導執23a。裝載導軌23a用以引導裝戴緩衝器23沿著裝载移動路徑A移動。 , 裝舰_ 23飾缝過位於輯域2a _試托盤T之上方’因此縮短了移動裝載拾取器222以執行裝載製程之距離。 15 1380395 也就是說，裝載緩衝器23可 v 者裝载移動路徑Α移動藓以於筮 -裝載拾取馳行裝健料 a、第離。兀乐一裝載拾取器之移動距因此，效率。其能夠縮絲朗程_之_並且提高裝載製程之事載於f3A圖」至「第3D圖」對裝载緩衝器231 裝私取$22之作#位£之—實例進行描述。 “=此實施财，裝顧衝器23可沿著輯移動路徑八移鸯 ==物繼㈣—個幢⑽—個收侧 2、=趣取請將御機的封㈣收_嫌裝載位置 2a的測斌托盤τ中之收容區相鄰。如《3Α圖」所不，當裝載緩衝器巧位於裝載堆疊機u 中的用:托盤與賴位置2a之間的區域（區域Β)中時，第一裝載^取$ 221可將制試的封裝晶片收容於裝載緩衝器Μ中。當待：式，曰曰片被收容於農載緩衝器23中之後，裂載緩衝器 23 έ沿著裝载移動路徑a移動。第B圖」所示’裝載緩衝$ η能夠傳送待測試的封裝晶片至另-個收容區Μ之中，此收容區Μ係與第二裝載拾取器 222將待顺的封裝晶㈣容於位於錄位置2a的測試托盤τ中之收谷區L相鄰。 1380395 如「第3C圖」所示，第二裝載拾取器222從裝載緩衝器^ 拾取封裝W，_定之距離施移_相應的收容區l，並於隨後將所拾取㈣裝“收容於位於裝雜置2a _試托盤τ 47。因此，第二裝載拾取器222可於魏緩衝器23位於裝載堆最仙中的用戶鋪與輯位置2a之間的區域（區域b)中時且• J-loading picker can pick up the Wei domain in the matrix unit (4) from the user tray in the loading stack, and can pick up the packaged crystal in the shape of the thank-you unit each time. In the series _ 23. The second loading picker 222 is for picking up the package to be tested from the load buffer 23 and accommodating the picked package wafer in the test tray at the loading position & Test the carrier! Can include multiple second load pickers for you. The second loading picker 222 can divide the test trays located at the carrying position & into a plurality of receiving areas and package the wafers in the Weirong area. The housing area is in the form of a matrix unit formed by a plurality of packaged wafers to enable the second loading picker 222 to be received in the test tray τ in a timely manner. That is to say, the housing area is a matrix unit formed by a plurality of wafers, and the package sheets are sucked and fixed by the second loading picker 222. The second loading picker 222 can pick up the slit wafers in the plurality of secret matrix units from the loading buffer cassette at a time and can accommodate the picked wafers in the test tray in the form of matrix units each time. 14 1380395, Please refer to "1" and "2", the loading buffer 23 can be moved along the γ. axis direction and can temporarily accommodate the packaged wafer to be tested. The contact _23 can also move in the X-axis direction and the γ-axis direction. Test the carrier! At least one load buffer 23 can be included. Although not shown in the drawing, the sharp _23 can be in contact with a plurality of belts connected to the belt, and the load buffer can be used when the smashing motor is missing a pulley. When the test handler 1 includes a plurality of load buffers 23, these load buffers 23 can be individually moved. The "loading buffer 23" as shown in Fig. 2 and "3A" can be moved to the upper side of the loading position 2 & The loading buffer 23 is movable along the loading movement path a to pass over the test tray T located at the loading position. Along the Wei-A-path A, the brain 23 can be mounted to the area between the user tray and the loading position 2a in the loading stacker (area b) or the area above the test tray τ at the loading position 2a ( In the area C) in "Fig. 3a". The load buffer 23 (four) is connected to the wire load guide 23a by the transferable secret. The loading rail 23a is used to guide the loading buffer 23 to move along the loading movement path A. The loading _ 23 is over the top of the field 2a _ trial tray T. This shortens the distance from which the loading picker 222 is moved to perform the loading process. 15 1380395 That is to say, the loading buffer 23 can load the moving path, move it, and load the picking material.兀乐一Loading the moving distance of the pickup, therefore, efficiency. The method of reducing the length of the load and increasing the loading process is described in the figure "f3A" to "3D", and the load buffer 231 is loaded with $22. "=This implementation of the financial, the loading of the punch 23 can be moved along the movement path eight == thing following (four) - a building (10) - a side 2, = interesting to take the Royal machine's seal (four) received _ suspect loading position The receiving area in the bin tray τ of 2a is adjacent. As in the "3" diagram, when the loading buffer is located in the loading stacker u: in the area between the tray and the lands 2a (area Β) The first load of $ 221 can accommodate the packaged packaged wafer in the load buffer cassette. After the cymbal is housed in the agricultural load buffer 23, the split buffer 23 is moved along the loading movement path a. The loading buffer $n shown in FIG. B can transfer the package wafer to be tested to another storage area, and the receiving area and the second loading picker 222 are located in the package crystal (four) to be processed. The valleys L in the test tray τ of the recorded position 2a are adjacent. 1380395 As shown in "FIG. 3C", the second loading picker 222 picks up the package W from the loading buffer, and shifts the distance to the corresponding receiving area l, and then "loads" the (4) in the loading device. Miscellaneous 2a _ trial tray τ 47. Therefore, the second loading picker 222 can be located in the region (region b) between the user shop and the position 2a in the loading stack

猶小^驗離皿的距離222a，並能夠執行裝載製程。因此，其旎夠縮短裝載製程所用之時間。心裝戴拾取器222將待測試的封裳晶片收容於位於裝載 a的測試托盤T中時，裳載緩衝器23能堆叠機2W繼軸 Z ’當第二裝載拾取器功將待測試的新的待_^_盤T中時’第i载拾取_能夠收容步縮短裝23以° ’其能夠& 裝載衣私所用之時間並且進一步提高裝载製程之效率。如「第3D圖」所示，裝载緩晶片至另—個炫區L之中，缝容傳送制試的封裝將待測試的封裝晶片收容於位於裝載位置2^二魏拾取器222 容區1/相鄰。置^的剩試托盤Τ中之收 23拾取待測試的封裝晶第二裝載拾取器222從賴緩衝器 17 w :二定之距離222a移動到相應的收容區L，，並於隨後將封裝日日片收令於位於裝載位置2a的測試托盤T中。 " 如上所述’裝載緩衝器23可傳送收容於其中的封裝容y、L，，或最鄰近於_ L^二二取盗222收容待測試的封裝晶片之收容區Μ。、。也就是說，當第二裝裁拾取器222收容待測試的封裝位於裝載位置的測試托盤Τ中之收容區L、L，或μ發生包變:時 23可傳送待戦的封μ片至最喊於相應的收容區L、L或Μ之收容區L、L，或Μ。 _ = = ^位於收容區L、L，及Μ的何處，其均關駭夕動弟一錄拾取器222以執行辣製程之距離。在將”第4Α圖」至「第4D圖」對裝載緩衝器23與裝載拾取器22之健位置之另―實例進行描述。㈣23可沿著裝载移動路徑A移動藉以傳送待測試將待測=片至一個收容區，這—收容區係為第二袭載拾取器222 容區。的封裝晶片收容於位於裝載位置2a的測試把盤T中之收如「第4A圖,所千， ’、§裝載緩衝器23位於裝載堆疊機21 載拾取器22ΓΪ裳載位置之間的區域（區域B)中時，第一裝〇 β將待測試的封裝晶片收容於裝載緩衝器23中。當 18 曰片=ΐ4Β圖」所示，裝魏衝器23能夠傳送待測試的封裝 :封,!ΓΜ ’此收容區Μ係為第二裝载拾取器222將制試的封裝^收容於位魏齡置2a _試域τ巾之收容區。 23Μ圖」所示’當第二裝载拾取器222從裝載緩衝器 :取=試的縣晶片時，裝载緩衝器3會移動至位於裝載機21中的用戶托盤與裝载位置2a之間的區域(區域Β)β 當襄載緩衝器23離開收容區Μ時，第二裝载拾取器也將糾收容於位於梅置2a 因此，當裝載緩衝器23位於震載堆疊機21中的用戶托盤與 • 麵位置以之間的區域（區域B)中時’第二農载拾取器222可移動小於_輯之雜，越_行裝賴程。因此，其能夠縮短裝載製程所用之時間。 …當第二裝載拾取器222將封I晶片收容於位於裳载位置2a的測。式托盤τ中時，第-農載拾取器221能夠收容新的待測試的封 .裝晶片於裝紐翻23之中，此，其_進—步縮崎載製程 .所用之時間並且進一步提高裝载製程之效率。第4D圖」所示’虽位於相應的收容區％中的裝載製程 19 1380395 結束時，第二裝載拾取器容區L。 222 會移動至與收容區 Μ相鄰的另一收此後’震載緩衝H23能夠傳送待測試的封裝晶片至位於一個收谷區L之上方的區域，此收容區L係為第另 =測試的封㈣收容於位於裝載位置2a的測試當::裝載拾取器222從裝載緩衝器23拾取_ 片時，魏緩_ 23將鷄至倾輯堆錢2ι中的用戶托盤與錄位[2_a之間的區域（區域B)。當域緩衝器_開收容 =L ¥ ’第二裝載拾取器μ2將移動至收容區^並將封裝晶片收谷於位於裝載位置2a的測試托盤τ中。〜如上所述’裝載緩衝器Μ可傳送待測試的封裝晶片至位於收谷品]V[或L之上的區域，此收容區M或L係為第二裝載拾取器 222收容封裝晶片於位於裝載位置2a的測試托盤了中之收容區。也就是5兒，當第二裝載拾取器222收容封裝晶片於位於裝载位置的測聰盤T巾之收容區M或L發生改變時，裝載緩衝器 23月匕夠將縣晶片傳送至相應的收容區^或^。因此，無論位於收容區中的何處，其均能夠縮短移動第二裝載拾取器222以執行裝載製程之距離。如「第5圖」及「第6圖」所示，裝載單元2還可包含第— 20 丄獨395 上升/下降單元24。帛—上升/下降單元24可使職減了沿著形成於裝載位置 ^第-抵達位置2b及第—脫離位置以之中的第—上升/下降路徑E上升和下降。裝載位置2a、第一抵達位置2b及第-脫離位置2c係攸上到下（沿箭頭N之方向）依序侧於第—上升/下降路徑E中。鲁帛抵輕置2b係為從卸鮮元3傳送之測試托盤τ抵達之置從卸鮮元3傳送之測試托盤τ係為已經經過卸載製程之 1式托盤T ’並且此測試托盤τ在移動至裝載位置&之前會於此第一抵達位置處等待。第-脫離位置2c係為經過裝載製程之測試托盤τ脫離以前往通路位置4之位置。'經過裝載製程之測試托盤τ在移動至通路位置4之前會於此第一脫離位置2c處等待。此第一脫離位置2c可 _ 與通路位置4之高度相同。第-上升/下降單元24包含第一上升/下降元件241與第一驅動單元242。卜卜升/下降元件241用以支樓測試托盤τ並能夠藉由第驅動單το 242而沿著第一上升/下降路徑£上升和下降。此第上升/下降兀件241可與測試托盤τ之底部相接觸進而支樓測 “ 試托盤Τ。 21 1380395 第上升/下降兀件糾可沿著從裝載單元2至卸載單元s ，方向（「第6圖」中箭頭P之方向）形成開放式格局。因此，其能夠於將測舰盤T從第—脫離位置以傳送至通路位置4以及將取托盤Τ购鮮元3傳送至第—抵達位置㉛之時，不會對第一上升/下降元件241產生干擾。第一驅動單元242可使第一上升/下降元件24】上升和下Still small, the distance 222a of the dish is checked, and the loading process can be performed. Therefore, it is enough to shorten the time taken for the loading process. When the heart-worn pickup 222 accommodates the wafer to be tested in the test tray T placed in the load a, the load buffer 23 can stack the machine 2W with the relay Z' when the second load picker is to be tested. When the device is in the tray T, the 'i-loading _ can accommodate the step shortening device 23 to 'the ability to & load the time used for the clothing and further improve the efficiency of the loading process. As shown in the "3D", the buffer chip is loaded into another H-zone, and the package for the test transfer is placed in the package at the loading position 2^Wei pickup 222. 1/ adjacent. The packaged second loading picker 222 of the remaining test tray is moved from the damper buffer 17w to the corresponding receiving area L, and will be packaged for the next day. The film is received in the test tray T at the loading position 2a. " As described above, the loading buffer 23 can transmit the package contents y, L, or the storage area 最 which is closest to the _L^2 thief 222 to accommodate the packaged wafer to be tested. ,. That is to say, when the second loading picker 222 receives the receiving area L, L in the test tray 待 of the package to be tested in the loading position, or when the package change occurs: 23 can transmit the sealing piece to be smashed to the most Shout in the corresponding containment area L, L or the containment area L, L, or Μ. _ = = ^ Where is the location L, L, and 收容 in the containment area, all of which are related to the picking device 222 to perform the distance of the spicy process. A further example of the position of the load buffer 23 and the loading picker 22 will be described in the "4th drawing" to "4D drawing". (4) 23 can be moved along the loading movement path A to transfer the test piece to be tested to a receiving area, which is the second loading device 222. The package wafer is housed in the test tray T at the loading position 2a, such as "4A, 1000," and § loading buffer 23 is located between the loading stacker 21 and the loading position of the loader 22 ( In the area B), the first package β accommodates the package wafer to be tested in the load buffer 23. When the 18 ΐ ΐ ΐ Β , , , , , , , , , 装装装装装装装装装装装装装装装装装装装装装!ΓΜ 'This containment area is the second loading picker 222. The package of the test is housed in the containment area of the Weiling 2a _ test area. As shown in Fig. 23, when the second loading picker 222 is loaded from the buffer: the test wafer is taken, the loading buffer 3 is moved between the user tray located in the loader 21 and the loading position 2a. Area (area Β) β When the load buffer 23 leaves the accommodating area ,, the second loading picker will also be retracted to the user located in the mei 2a. Therefore, when the loading buffer 23 is located in the seismic load stacker 21 When the tray and the surface position are in the area (area B), the second agricultural load picker 222 can be moved less than the _ series. Therefore, it can shorten the time taken for the loading process. ...when the second loading picker 222 holds the sealed I wafer in the measurement at the carrying position 2a. In the tray τ, the first-agricultural pick-up 221 can accommodate a new packaged wafer to be tested in the loading and unloading 23, and the time taken for it is further increased. The efficiency of the loading process. The second loading loader area L is shown at the end of the loading process 19 1380395 in the corresponding housing area % shown in Fig. 4D. 222 will move to another adjacent to the receiving area '. The shock buffer H23 can transfer the packaged wafer to be tested to an area located above a valley receiving area L, which is the second test. The seal (4) is accommodated in the test at the loading position 2a: When the loading picker 222 picks up the _ slice from the loading buffer 23, Wei _ 23 puts the user tray between the chicken and the dumped money 2i with the recording position [2_a Area (area B). When the domain buffer_open housing = L ¥ ' the second loading picker μ2 will move to the receiving area ^ and the packaged wafer will be packed in the test tray τ at the loading position 2a. ~ As described above, the 'load buffer Μ can transfer the packaged wafer to be tested to the area above the valley T] or the L, the accommodating area M or L is the second loading picker 222 to accommodate the packaged wafer. The test tray in position 2a is loaded into the containment area. That is, when the second loading picker 222 receives the package wafer and the storage area M or L of the measuring disk T in the loading position is changed, the loading buffer 23 can transfer the county wafer to the corresponding one. Containment area ^ or ^. Therefore, regardless of where in the housing area, it is possible to shorten the distance by which the second loading picker 222 is moved to perform the loading process. As shown in "Fig. 5" and "Fig. 6", the loading unit 2 may further include a -20th 395 rise/fall unit 24. The 上升-rise/fall unit 24 can increase and decrease the position along the first rising/falling path E formed in the loading position ^first-arrival position 2b and the first-disengagement position. The loading position 2a, the first arriving position 2b, and the first-departing position 2c are sequentially moved up and down (in the direction of the arrow N) in the first rising/lowering path E. The R&D 2b is a test tray that is transported from the unloading unit 3, and the test tray τ that is transported from the unloading unit 3 is a type 1 tray T' that has been subjected to the unloading process and the test tray τ is moving. Wait until the first arrival position before the loading position & The first-disengagement position 2c is a position at which the test tray τ that has passed the loading process is detached to reach the path position 4. The test tray τ that has passed the loading process waits at this first escape position 2c before moving to the path position 4. This first disengagement position 2c can be the same as the height of the passage position 4. The first rising/falling unit 24 includes a first rising/falling element 241 and a first driving unit 242. The bubbling/decreasing element 241 is used to support the test tray τ and can be raised and lowered along the first ascending/descending path by the first driving single το 242. The first ascending/descending member 241 can be in contact with the bottom of the test tray τ to test the "test tray". 21 1380395 The first ascending/descending member can be corrected along the direction from the loading unit 2 to the unloading unit s (" The direction of the arrow P in Fig. 6 forms an open pattern. Therefore, it is possible to prevent the first rise/fall element 241 from being transferred from the first-disengaged position to the path position 4 and the take-up tray 3 to the first-arrival position 31. Interference. The first driving unit 242 can cause the first rising/lowering element 24 to rise and fall

降。此第-驅動單元242可使第一上升/下降元件241沿著第一下降路徑£移動。此第一上升々降元件241可藉由第一驅動早兀242在裝载位置2a、第—抵達位置❿及第—脫離位置 2c之間上升和下降。弟-驅動單元242可包含複數個汽域藉由這下降元件％係與這些桿體相連並能夠‘ 干 ❿上升和下降。上述汽紅可驗觀紅或氣壓汽虹。於所示，卸鮮元3 _執行卸麵程並被設置敌1早％之旁邊。此卸载單元3包含卸载堆疊機3卜卸载拾取益32及卸载缓衝器％。卸載堆or機31儲存有複數佩容有測試後戶托盤。測試後的_日ΰ 衣日日片之用顧結果在卸载堆疊機Μ中收紗位於不同位置處的不同_戶托盤中。卸載拾取器32用以在測試托盤τ上執行卸载製程。當從測試 22 1380395 托盤τ分離收容於其中的測試後的封裝⑼時此測試托盤丁係位於卸載位置3a。 ' 卸載拾取器32能夠沿X轴方向與¥轴方向移動並能夠上升和下降。此卸載拾取器32包含多個用以吸取和固槐裝晶片之嗔，。此卸載拾取器32還包含第一卸載拾取器321與第二卸載拾取器 322 λ 弟一卸载拾取器321從卸載緩衝、，料1叹巧合取測試後的封裝日日月並將所拾取的封裝晶片收容於位於卸載堆疊機Μ中的用戶^曰中。測試搬運機1可包含複數個第一卸载拾取器功。第拾取器切可將從卸載緩衝器33戶斤拾取的封裝晶片按昭神= 分級後收容於相應的用戶牦盤中。 °果 /第一卸载拾取㈣可從卸载緩衝器33巾拾取至少— 後的封裝晶Μ將所拾取的雜晶片收容於位於卸载堆 :的用戶托盤中。第一卸載拾取器321 一次可從卸载緩二才。取複數個處於矩陣單元中的測試後的封裝晶片並且 ^封裝日W車單元之形极容於位於__ Μ : 戶托盤之中。中的用上中载緩衝器 23 1380395 •、—第二卸载拾取器322可將位於卸载位置3a的測試托盤τ劃分 •成複數個分離區並將測試後的封裝晶片收容到這些分離區之中。分離區係採用由多個封裝晶片形成的矩陣單元形式以使第二卸載拾取器322能夠一次就將其從測試托盤中分離。也就是說，分離區係為由複數侧裝晶片所職的轉單元，這些封裝晶片能夠被第二卸載拾取器322 一次性吸取和固定。日 • 帛一卸载拾取器322 一次能夠從位於卸载位置3a的測試托盤 T上分離處於矩陣單元中的多個測試後的封褒晶片。並且第二卸載拾取器322每次可將測試後的賴晶片以矩陣單元之形式收容於卸載緩衝器Β之中。第二卸载拾取器從可將分離後的封裳晶片依h測试結果分級後收容於卸載緩衝器％之中。如「第1圖」及「第2圖」所示，卸載緩衝器33可沿著γ 軸方向移動並可臨時地收容測試後的封農晶片。測試搬運機i可 • 包含至少一個卸載緩衝器33。儘官附圖中未示出，卸載緩衝器33係可與連接有複數個皮帶輪之皮帶相連接，藉赚馬達轉輕少—個絲麵此卸載緩衝器33可隨之移動。當測試搬運機i包含細_緩衝器叫這些卸載緩衝器33可單獨地移動。請爹哼1第7圖」久不回，所-^ 」吗」所不，卸載緩衝沿著形成於卸載位置3a之上方的卸戴移動路徑F移動 24 1380395 沿著卸載轉職F，卸舰_ 33 器32!能夠從_衝謂辦載拾取沿著卸載移動频F，卸載緩魅33射 =322能夠將測試後的咖收容、^ 卸載緩衝H 33能夠被可飾地連接執刻以物鑛魅33峨載軸输移二。卸载導由：=:_個能夠單獨移動的卸載緩衝器33。由於似搬顯1包含有更多的卸载緩触，_ 短裝卸載程_之_並概-步 =車更^ 第一卸載拾取器切與第二卸载拾取器由於器33上作業，因此作章巴石知了在不_卸载緩衝業&不會相互重疊，進而縮短了等待時間。然而，由於觀搬運機i包測試搬運機^之寬度1H (「第1圖」有衝器33,因此變大。當測試搬運軸方向之長度）也會切及第二卸載拾取器時，移動第-卸載拾取器 , 執仃卸载製程之距離也會變大。為了解決這一問題，當測試搬運機器33時，至少-個卸載緩碰個卸载緩衝經過位於娜置3a的動路徑^動藉以因此，即使當測試揪運機1包含有大量的卸載緩衝器33時， 25 1380395 ，試搬運機丨之寬度1H也可在_喊度或增加量最小的長度範圍内加以配置。口此由於其1夠縮短移動第—卸載拾取器奶及第二卸載拾取器322以執行卸載製程之距離並能夠縮短等待時間，所以其能夠縮短卸載製程所用之_並且提高卸絲程之效率。drop. This first drive unit 242 can move the first ascending/descending member 241 along the first descending path £. The first ascending/descending member 241 can be raised and lowered between the loading position 2a, the first-arrival position ❿, and the first-departure position 2c by the first driving early 242. The drive unit 242 can include a plurality of steam zones by which the drop element % is coupled to the rods and capable of 'dry rise and fall. The above steam red can be observed red or pneumatic steam. As shown, the unloading element 3 _ performs the unloading process and is set next to the enemy 1%. This unloading unit 3 includes an unloading stacker 3, an unloading pick-up 32, and an unloading buffer %. The unloading stacker 31 stores a plurality of containers with a test post. After the test, the result of the film is in the unloading stacker. The yarn is placed in different trays at different positions. The unloading picker 32 is used to perform an unloading process on the test tray τ. The test tray is placed in the unloading position 3a when the test package (9) contained therein is separated from the test tray 22 1380395 tray τ. The unloading picker 32 is movable in the X-axis direction and the ¥-axis direction and is capable of ascending and descending. The unloading picker 32 includes a plurality of pick-ups for picking up and securing the wafer. The unloading picker 32 further includes a first unloading picker 321 and a second unloading picker 322 λ an unloading picker 321 from the unloading buffer, and the material 1 sings the packaged day and night of the package and picks up the package. The wafer is housed in a user located in the unloading stacker. The test handler 1 can include a plurality of first unloader pickers. The first picker cuts the packaged wafers picked up from the unloading buffer 33 and is stored in the corresponding user's tray according to the classification. ° The first unloading pick (4) can pick up at least the subsequent package wafer from the unloading buffer 33 to receive the picked wafers in the user tray located in the unloading stack:. The first unloading picker 321 can be unloaded from the unloading one at a time. A plurality of test package wafers in the matrix unit are taken and the package type of the vehicle unit is located in the __ Μ : household tray. The upper load buffer 23 1380395 •, the second unloading picker 322 can divide the test tray τ at the unloading position 3a into a plurality of separation zones and accommodate the tested package wafers into the separation zones. . The separation zone takes the form of a matrix unit formed of a plurality of packaged wafers to enable the second unloading picker 322 to be detached from the test tray at a time. That is, the separation zone is a transfer unit that is occupied by a plurality of side-mounted wafers, and these packaged wafers can be sucked and fixed at one time by the second unloading picker 322. Day • The unloading picker 322 is capable of separating a plurality of tested packaged wafers in the matrix unit from the test tray T located at the unloading position 3a at a time. And the second unloading picker 322 can accommodate the tested wafers in the unloading buffer cassette in the form of a matrix unit each time. The second unloading picker can be accommodated in the unloading buffer % after classifying the separated sealing wafer according to the h test result. As shown in "Fig. 1" and "Fig. 2", the unloading buffer 33 is movable in the γ-axis direction and can temporarily accommodate the sealed agricultural wafer. The test handler i can include at least one unloading buffer 33. Not shown in the drawings, the unloading damper 33 is connectable to a belt to which a plurality of pulleys are attached, whereby the unloading buffer 33 can be moved with the help of the motor. When the test handler i contains a fine buffer, these unloading buffers 33 can be moved separately. Please 爹哼1, Figure 7, "Don't go back, -^"? No, the unloading buffer moves along the unloading movement path F formed above the unloading position 3a. 24 1380395 _ 33 32! Can be picked up from the _ 冲冲冲随随随随随随随随随随随随随随随随随随随随随随随随随随随随随随随随随随随随随随随随随随Mine charm 33 峨 load shaft transfer two. The unloading guide: =:_ is an unloading buffer 33 that can be moved separately. Since the moving display 1 contains more unloading slow touches, _ short loading and unloading process _ _ and _ _ step = car more ^ first unloading picker cutting and second unloading picker due to the work on the device 33, therefore Zhang Ba Shi knows that the unloading buffer industry & does not overlap each other, thus shortening the waiting time. However, since the width of the transporter i-package test handler 1H ("1" has a punch 33, it becomes larger. When the length of the test transport shaft direction is also cut), the second unloading picker is also moved. The first-unloading picker will also increase the distance from the unloading process. In order to solve this problem, when the transporting machine 33 is tested, at least one unloading and unloading unloading buffer passes through the moving path located at Na'a 3a, so that even when the test picker 1 contains a large number of unloading buffers 33 At 25 1380395, the width 1H of the test carrier can also be configured within the length of the _ shout or the minimum increase. Since it can shorten the moving first-unloading picker milk and the second unloading picker 322 to perform the unloading process distance and can shorten the waiting time, it can shorten the use of the unloading process and improve the efficiency of the unloading process.

,如「第7圖」中所示’複數個卸载緩衝器33中的一個卸載緩衝器33能_動以使得其—部分可轉過位於卸載位置％的測式托盤τ之上方。儘管附圖中未示出，但與農載緩衝器μ相類似，，數個卸載緩衝器33中的至少—個卸載緩衝器％能夠移動以使得其整個部分可以經過位於卸載位置3a _試托盤τ之上方。除了移動藉以經過位於卸載位置3a的測試托盤τ之上方的至少一個卸載緩衝器33以外的其它卸载緩衝器能夠沿著卸載移動路徑F在裂載位置2a與卸載位£ ^之間移動。卸載緩衝器33能約透過基於測試結果之分級來收容封襄晶片。也就是說’第二卸載拾取器322可將從位於卸載位置^的^ 試托盤T中分__晶片依照測試結果分級後分別收容庫的卸載緩衝器33之中。馬包含有更多的卸载緩衝器 32之等待時間。因此，其卸載製程之效率。在此情況下，由於測試搬運機1 33，因而其能触—步驗卸載拾取器能夠縮短裝卸載程所用之時間並且提高 26 1380395 ‘ 33二：對=緩衝器23相類似的，當複數個卸載緩衝器 r的至吵一個卸载緩衝哭測试托盤了之上方時，此卸_衝載位置如的位置進行說明。如33與卸載拾取器32之作業由於複數個卸载緩衝器％中移動藉以經過位於卸載位置，/、一個卸载缓衝器33簡縮短移動第二卸载拾取器3執^盤丁之上方，因而其能夠 , 執仃卸载製程之距離。也就杲 •卸載缓衝H33賴沿著㈣也就疋二卸载拾取器322以執行卸載製程之距離/夕動猎以驗移動第效率因此，其能夠縮短卸载製程所用之時間並且提高卸载製程之現在將結合「第8A圖」至「第8 卸載拾取器㈣業之-實例進行描述。卸衝器33與如弟8A圖」所示，知裁續播^哭μ _ 一封裝二：:卸：器 J只托盤T中分離之分離區尺相鄰。如「第8B圖」所示，第二卸载拾取器3 後將測試後肢雜卸舰_ 33f❹，並於隨 27 因此，其能夠縮短移動第二卸載拾取器322以執行卸載製程之距離並能夠縮短裝卸载程所用之時間。、如「第8C圖」所示，卸载緩衝器33可沿著卸載移動路㈣向上移動至位於卸麟疊機31中_戶托盤與卸餘置^之工間 ^區域（區域G)。亚且第—卸載拾取器321可從卸中拾取測試後的封裝晶片。戈衡°〇33 如「第8D圖」所示，第一卸載拾取器321可將從器％中所拾取的封裝晶片收容於位於卸載堆疊機31中的用= 盤之中。與此同時，卸載緩衝器33可沿著卸載移動路徑F向上移 ^至另、Γ個分離㈣，這另一個分離區U係與第二卸載拾取器322 、測越的封裝晶片從位於卸载位置义的測試托射中分離之分離區S相鄰。此後，第二卸載拾取器322以預定之距離322a向上移動到位於另一個分離區U中的卸載緩衝器33之上方的區域，並於隨後將測试後的封裝晶片收容於卸载緩衝器33之中。如上所述’卸載緩衝器33可移動至最鄰近於分離區&和^ 之分離區S和U，在分離區R和s，第二卸載拾取請測試後的封裝晶片。刀離也就疋祝’當第二卸載拾取器322從位於卸載位置的測試托 Τ中分離測試後的封裝晶片之分離區R和S發生變化時，卸载 28 1380395 緩衝器33可移動至最鄰近於相應的分離區R和S之分離區S和U。因此’無論位於分離區R、S及U中的何處，其均能夠縮短移動第二卸載拾取器322以執行卸載製程之距離。現在將結合「第9A圖」至「第9D圖」對卸載緩衝器33與 32之作業之另—實例進行描述。第9A圖」所示，第二卸载拾取器322可將收容於分離區R中的測試後的封裝晶片從位於卸載位置3a的測試托盤T中如「第兜圖」所示，卸載緩衝器33可沿著却載移動路徑F 向上移動到-個區域’這個區域係低於第二卸載拾取器322將測成後的封裝⑼從位於卸載位置3a的峨托盤τ中分離之區域。 R’第二卸載拾取器322可將測試後的封裝晶片從位也就是說，卸載緩衝器33係位於分離區R之上方，在分離區於卸載位置 3a的’則5式托盤τ中分離。如「第9C圖As shown in Fig. 7, an unloading buffer 33 of the plurality of unloading buffers 33 can be moved so that its portion can be rotated over the measuring tray τ at the unloading position %. Although not shown in the drawings, similar to the agricultural load buffer μ, at least one of the plurality of unloading buffers 33 can be moved so that the entire portion thereof can pass through the unloading position 3a_test tray Above τ. In addition to moving at least one of the unloading buffers 33, which passes over the test tray τ located above the unloading position 3a, it is possible to move along the unloading path F between the splitting position 2a and the unloading position £^. The unloading buffer 33 can accommodate the sealing wafer by grading based on the test results. That is to say, the second unloading picker 322 can divide the __ wafers from the test tray T located at the unloading position by the test results, and respectively accommodate them in the unloading buffer 33 of the library. The horse contains more waiting times for the unload buffer 32. Therefore, it is efficient in unloading the process. In this case, since the test carrier 1 33 is tested, the touch-reading unloading of the pick-up can shorten the time taken for loading and unloading and increase 26 1380395 ' 33 2: pair = buffer 23 is similar, when plural When unloading the buffer r to the top of the unloading buffer crying test tray, the position of the unloading position is explained. For example, the operation of unloading the pickup 32 is performed because the movement of the plurality of unloading buffers % passes through the unloading position, and the /unloading buffer 33 simply shortens the movement of the second unloading picker 3, thereby Yes, the distance to unload the process. In other words, the unloading buffer H33 depends on (4), and the second unloading of the picker 322 to perform the unloading process distance/vacuum hunting to check the moving efficiency. Therefore, it can shorten the time taken for the unloading process and improve the unloading process. Now, it will be described in conjunction with "8A" to "8th Unloading Picker (4) Industry - Example. Unloader 33 and Ruan 8A", the sequel will continue to broadcast ^ crying μ _ a package two:: unloading : The separate separation zone of the J-only tray T is adjacent. As shown in "Fig. 8B", the second unloading picker 3 will test the hindlimb unloader _33f❹, and accordingly, it can shorten the distance of moving the second unloading picker 322 to perform the unloading process and can be shortened The time taken to load the unloading process. As shown in Fig. 8C, the unloading buffer 33 can be moved up along the unloading moving path (4) to the inter-working area (area G) located in the unloading machine 31. The sub-first-unloading picker 321 can pick up the tested packaged wafer from the unloading.戈衡°〇33 As shown in Fig. 8D, the first unloading picker 321 can house the packaged wafer picked up from the % of the package in the use-disc located in the unloading stacker 31. At the same time, the unloading buffer 33 can be moved up to the other, separated (four) along the unloading moving path F, the other separating area U and the second unloading picker 322, the measuring package wafer from the unloading position The separation zone S separated in the test test is adjacent. Thereafter, the second unloading picker 322 is moved upward by a predetermined distance 322a to an area above the unloading buffer 33 in the other separating area U, and then the tested packaged wafer is accommodated in the unloading buffer 33. in. As described above, the unloading buffer 33 can be moved to the separation areas S and U which are closest to the separation areas & and, in the separation areas R and s, the second unloading picks up the packaged wafer after the test. The knife disengagement also means that when the second unloading picker 322 is separated from the separation areas R and S of the packaged wafer after the test in the unloading position, the unloading 28 1380395 buffer 33 can be moved to the nearest position. Separation zones S and U in the respective separation zones R and S. Therefore, regardless of where in the separation areas R, S, and U, it is possible to shorten the distance by which the second unloading picker 322 is moved to perform the unloading process. A further example of the operation of unloading buffers 33 and 32 will now be described in conjunction with "9A" to "9D". As shown in FIG. 9A, the second unloading picker 322 can unload the test package wafer contained in the separation area R from the test tray T located at the unloading position 3a as shown in the "first pocket map", and unload the buffer 33. This area can be moved up to the -loading path F. This area is lower than the area in which the second unloading picker 322 separates the measured package (9) from the stack tray τ located at the unloading position 3a. The R' second unloading picker 322 can separate the tested package wafer from the position, that is, the unloading buffer 33 is located above the separation zone R, and is separated in the 5th tray τ of the separation zone 3a. Such as "9C

。與此同時，第二卸载拾取器此後’第一卸載拾取器321 的封農晶片。虡此因眭，筮一 4 可從卸載緩衝器33中拾取測試後 322可移動至另一個分 29 1380395 離區s，這另一個分離區s係與分離區R相鄰。而後，第二卸載拾取器322可將收容於相應的分離區S中的測試後的封裝晶片從位於卸載位置3a的測試托盤T中分離。。。如「第9D圖」所示1 一卸載拾取器321可將從卸載緩衝器33所拾取的封裝晶片收容於位於卸載堆疊機31中的用戶托盤之中。與此晴’城緩翻33可沿著城軸路徑F向上移動到-個區域，這個區域係低於第二卸載拾取器322將測試後的封裝晶片從位於卸載位置3a的測試托盤τ中分離之區域。也就是說’卸載緩衝器％係位於分離區s之上方，在分離區 s ’第二卸載拾取器322將測試後的封裝晶片從位於卸載位置允的測試托盤T中分離。. At the same time, the second unloading picker thereafter "first unloads the wafer of the picker 321". For this reason, the 44 can be picked up from the unloading buffer 33 and the 322 can be moved to another sub-section 29 1380395, which is adjacent to the separation area R. Then, the second unloading picker 322 can separate the tested package wafers accommodated in the respective separation areas S from the test tray T located at the unloading position 3a. . . The unloading picker 321 as shown in "Fig. 9D" can accommodate the packaged wafer picked up from the unloading buffer 33 in the user tray located in the unloading stacker 31. With this clear, the city flap 33 can be moved up to the area along the city axis path F, which is lower than the second unloading picker 322 to separate the tested package wafer from the test tray τ located at the unloading position 3a. The area. That is, the 'unloading buffer %' is located above the separation area s, and the second unloading picker 322 separates the tested packaged wafer from the test tray T located at the unloading position in the separation area s '.

如上所述，當第二卸載拾取器322從位於卸載位置3a的測髮盤中刀離測5式後的封裝晶片之分離區凡和s發生變化時，卸載緩衝器33可移動至相應的分離區尺和s之上方的區域。 ★因此’热論位於分離區尺和s中的何處，其均能夠縮短移動策二卸載拾取器322以執行卸載製程之距離。第5圖」及「第6圖」所示，卸載單元3還可包含第二上升/下降單元34。 3a 第一上升/下降單元34 可使測試托盤T沿著形成於卸載位置、第二脫離位置Bh .4· 及第一抵達位置3c之中的第二上升/下降 30 1380395 路徑J上升和下降。卸載位置3a、第二脫離位置％及第二抵達位置3c係從上到T (沿箭頭N之方向）依序排列於苐二上升路徑J中。午〃第-脫離位置3b係為經過卸麵程之測試托盤現離以前往第-達位置％之位置。經過卸載製程之測試托盤τ在被傳送至第-抵達位置2b之前會於此第二脫離位置处處等待。此第參離位置3b可與第一抵達位置2b之高度相互平齊。第二抵達位置3e係為從通路位置4傳送之測試托盤τ抵達之位置。從通路位置4傳送之測試托盤τ係為收容有測試後的封裝 j片之測試托盤Τ ’並且脑m托盤τ在被魏至卸齡置％: 前會於此第二抵達位置3e處等待。此第二抵達位置&可盘位置4及第一脫離位置七之高度相同。帛二上升/下降單元34包含第二上升/下降元件％ _ _ 驅動單元342。 ’、第二上升/下降元件341用以支撐測試托盤τ並能夠藉由第二驅動單元342而沿著第二上升/下降路徑了上升和下降。此第下降元件341可與測試托盤τ之底部相接觸進而支撐測第二上升/下降元件341可沿著從卸載單元3至之方向（「第6圖」中箭頭P之反方向）形成。因此，其能夠於將 31 1380395 測試托盤τ從第二麟位置3b魏至第—抵達位置⑪以及將測試托盤T從通路位置4傳送至第二抵達位置％之時，不會對第二上升/下降元件341產生干擾。第二驅動單元342可使第二上升八降元件糾上升和下降。此第二驅動單元342可使第二上升/下降元件糾沿著第二上下降路徑J上升和下降。此第二上升々降元件341 _ •由弟二驅動單元342在卸载位置如、第二脫離位置3b及第9 達位置3c之間上升和下降。一抵移動之隨著這曰第-驅動單元342可包含複數個汽虹及藉由這些汽^ 桿，。第二上升/下降元件341係與這些桿體相連並能夠些才干體的運動而上升和下降。 ^上所述’由於測試搬運機可在位於不同位置的測試托盤丁上執行裝載製程與卸載製鞋As described above, when the second unloading picker 322 changes from the separation area of the package wafer after the knife-off type 5 in the unloading position 3a, the unloading buffer 33 can be moved to the corresponding separation. The area above the area and the area above s. ★ Therefore, where the thermal theory is located in the separation zone and the s, it is possible to shorten the distance that the mobile device unloads the pickup 322 to perform the unloading process. As shown in Fig. 5 and Fig. 6, the unloading unit 3 may further include a second ascending/descending unit 34. 3a The first ascending/descending unit 34 causes the test tray T to ascend and descend along the second rise/fall 30 1380395 path J formed in the unloading position, the second disengaged position Bh .4·, and the first arriving position 3c. The unloading position 3a, the second disengaging position %, and the second arriving position 3c are sequentially arranged in the second rising path J from the top to the T (in the direction of the arrow N). The noon-off position 3b is the position where the test tray that has passed the unloading process is away from the first position. The test tray τ that has passed through the unloading process waits at this second disengagement position before being conveyed to the first-arrival position 2b. This first entry position 3b can be flush with the height of the first arrival position 2b. The second arrival position 3e is the position at which the test tray τ transmitted from the path position 4 arrives. The test tray τ transmitted from the path position 4 is a test tray 收容 ‘ containing the package j piece after the test, and the brain m tray τ is waited at the second arrival position 3e before being placed by the Wei to the age. The second arrival position & disc position 4 and the first disengagement position 7 have the same height. The second rising/falling unit 34 includes a second rising/falling element %__ driving unit 342. The second rising/falling element 341 is for supporting the test tray τ and can be raised and lowered along the second rising/falling path by the second driving unit 342. The first descending member 341 is in contact with the bottom of the test tray τ to support the second rising/lowering member 341 to be formed in the direction from the unloading unit 3 (the reverse direction of the arrow P in "Fig. 6"). Therefore, it is possible to move the 31 1380395 test tray τ from the second lining position 3b to the first-arrival position 11 and transfer the test tray T from the passage position 4 to the second arrival position % without the second rise/ The falling element 341 produces interference. The second driving unit 342 can cause the second rising and falling elements to be raised and lowered. This second driving unit 342 can cause the second rising/falling element to be raised and lowered along the second upper descending path J. The second rising and lowering element 341 _ is raised and lowered by the second driving unit 342 between the unloading position, for example, the second disengagement position 3b, and the ninth position 3c. As a result of the movement, the first drive unit 342 can include a plurality of steam and the steam. The second ascending/descending member 341 is connected to the rods and is capable of ascending and descending by the movement of the stems. ^上上«Because the test handler can perform loading and unloading of shoes on test trays located at different locations

程。因而，W 夠簡化裝載製程與卸载製㈣4與卸賴程巾的難發生率可顺個製程也能^π Μ與卸賴程中的- 程之效率〶地執仃。因此’其能夠提高軸製程與卸裁製盤Τ在裝載單元2與卸載單元3中上升 /、月b夠減小測試搬運機 Γ 機之長度1L (如「第1圖」所示）。如「第1圖」及「笛弟1〇圖」所示，通路位置4係位於裝载單 32 1380395 • 70 2與卸載單元3之間並且將裝載單元2與卸載單幻連接至腔至糸統5。 4 因此’透過通路位置4，收容有待測試的封裝晶片之測試托盤T係可從裂載單元2被傳送至腔室系統5。並且透過通路位置 4 ’收容有測試後的封裝晶片之測試托盤T可從腔室系統5被傳送至卸載單元3。 • 儘管附圖令未示出，但通路位置4可配置有複數個皮帶輪、一條連接這些皮帶輪的皮帶以及連接於皮帶藉以透過推動或拉動測試托盤T來傳送測試托盤τ之傳送工具。此傳送工具可設置於腔室系統5之中。通路位置4可設置於第一脫離位置2c與第二抵達位置允之間。此通路位置4可與第一脫離位置2c及第二抵達位置允之高度相同。 •通路位置4可進-步包含轉動料41肋轉_試托盤τ。 •此通路位置4可包含複數個轉動單元41。轉動單元41用以將從裝載單元2傳送而來的測試托盤τ從水平狀態轉動至垂餘態。透補解元41 結直狀態的測試托盤Τ係將被傳送至腔室系統5。 % 轉動單元41還用以將從腔室系統5傳送而來的測試托盤τ從垂直狀態轉動至水平狀態。透過轉動單元41轉動至水平狀態的測 33 丄爛395 試托盤T係將被傳送至卸載單元3。因此，測試搬運機1可在具有水平狀態的測試托盤τ之上執订裝載製程及卸載製程並可在具有垂直狀態的測試托行測試製程。如第1圖」及「第10圖」所示，設置於測試搬運機中的腔二系統5包含第-腔室5卜第二腔室52及第三腔室53以使得測销能夠在H錄與健環境錢常溫環境下對封裝硎試。第-腔室51用以將收容於從觀位置4傳送而來的測試扣中的封裝晶片輕到第—溫度。此第—溫度係處於當測試樹 01封裝晶片時封裝晶片之溫度範圍内。 ▲第-腔室51可配置有電加熱器與減注人設備巾的至少-=備藉以調整待測試的封裝晶片至第—溫度。第—腔室51可名、垂直狀態的戦域了移軸其腔㈣部。第封裝W被調整辦-溫麟，測試托盤τ卿腔至51被傳送至第二腔室52。的封係肋㈣整至第—溫度錄容於麟托盤τ中 ‘或者全部的高精度定位板η係***於接觸單元521 34 1380395 定後取機可對封裝晶片進行測試藉以確定連接至高精度又位板Η之封裝晶片的電特性。 q藏個第二腔室52可配置_郝與液纽人設針的至少一 ==將待測試_裝晶片保持於第_溫度。測試搬運機丨 ^ 3设個第―腔至52,並且高精度定位板Η可配置於每一個弟一腔室52之中。、當封裝晶片完全經過測試錢，測試減Τ將從第二腔室52 被傳送至第三腔室53。二第二腔室53用以將收容於測試托盤τ中的雖式後的封裝晶片調整至第二溫度。此第二溫度係處於包含常溫或者接近常溫之溫度的溫度1_。第三腔室53可配置有有電加熱ϋ與液氮注入設射的至少-個設縣以將職後的域晶片難至第二溫度。弟二腔室53可使具有垂直狀態的測試托移動到其腔室内部。當測試後的封裝晶片被至第二溫麟，測試托盤τ將從第三腔室53被傳送至通路位置4。秦如「第10圖」中所示，第一腔室Μ、第二腔室52及第三腔室53可沿垂直方向制。複數個第二腔室&可被垂直地加以堆儘管附圖中未示出，但第一腔室51、第二腔室52及第三腔室53可被垂直地加以堆疊。在此情況下，第一腔室51可配置於 35 1380395 第二腔室52之上方’且第三腔室53可配置於第二腔室％之下方。 . 如「第10圖」所示’傳送單元6係用以將測試托盤τ從裝載單凡2傳送至通路位置4，並將測試托盤τ從通路位置4傳送至卸载單元3 ’以及將測試托盤T從卸載單元3傳送至裝載單元2。傳达單元6可包含第一傳送單元61與第二傳送單元62。如「第10圖」及「第11圖」所示，第一傳送單元61用以將 • 位於第一脫離位置2C的測試托盤T傳送至通路位置4並將位於通路位置的測試托盤T傳送至第二抵達位置3C。 …從第-脫離位置2c傳送至通路位置4的測試托盤τ收容有待測试的封裝⑸，·通路位置4傳送至第二抵達位置的測試托盤T收容有測試後的封裝晶片。第一傳送單元61包含第-傳送元件6n、第二傳送元件612 及移動元件613。 • 产— ，第傳运讀611帛以將位於第一麟位置&的測試托盤τ 傳达至通路位置4。此第一傳送元件6ιι係能夠推動並傳送位於第一脫離位置2C的測試托盤τ。，第二傳送元件612用以將位於通路位置4的測試托盤Τ傳送至第二抵達位置3c。此第二傳送元件612係能夠推動並傳送位於通路位置4的測試托盤τ。第二傳送元件612可推動並且傳送職托盤τ。因此，即使 36 1380395 當測試托盤τ在第二抵達位置3c等待時，第二傳送元件6i2也可 .移動至初始位置。由於第二傳送元件612能夠移動至用於傳送下 .一個測試托盤T的位置而無需等待時間，因此其能夠縮短下一個測試托盤T於通路位置4中等待的時間。因此’其能夠透過高效地傳制試托盤τ來縮短測試把盤τ 之等待時間並由此縮短裝載製程與卸载製程所用之時間。 • *一傳送元件611與第二傳送元件犯可連接至移動元件 613。因此，移動元件613可透過使第一傳送元件6ιι與第二傳送請612同時移動而將位於第一脫離位置2c的測試托盤τ及位於通路位置4中的測試托盤τ同時傳送。第一傳送元件⑴與第二傳送元件6听連接至移動元件613 並且第-傳送元件611與第二傳送元件612之間具有一預定之間隔以使得第-及第二傳送元件可麵試托盤T相接觸。儘管附圖 •中未示出’但移動元件犯可與連接有複數個皮帶輪之皮帶相連並可隨皮帶之運動而鶴，其巾魏做帶輪可_馬達加動。啊如第10圖」及「第12圖」所示，第二傳送單元幻用以將位於第二脫離位置3b之測試絲τ傳送至第—抵達位置％。從 “ Γ離位置3b傳$至第—抵達位置2b之測試托盤τ係透過於 ρ Ή將其中之峨後的輯晶片分離而得以清空。、 37 1380395 第二傳送單元62可包含第三傳送元件621用以推動和傳送測試托盤T。此第三傳送元件621可與連接有複數個皮帶輪之皮帶相連並可隨皮帶之運動而移動，其中複數個皮帶輪可透過馬達加以轉動。第二傳送元件621可推動並且傳送測試扼盤τ。Q此，即使當測試托盤τ在第-抵達位置2b等待時，第三傳送元件621也可移動至初始㈣。由於第三傳送元件621能夠機於傳送下 -個測試托盤T的位置而無需等待時間，因此其能夠縮短下—個測試托盤τ於第二脫雜置3b等待的時間。因此’其能夠透過高效地傳送測試托盤T來縮短測試托盤τ 之等待時間舶_縣纏程與卸賴程關之時間。 y現在將結合_對本發明—實_之封裝“域方法進行洋細描述。如「第1圖」至厂第】2闯成-Cheng. Therefore, it is easy to simplify the loading process and the unloading system. (4) 4 and the unsatisfactory rate of the unloading of the towel can be processed in a smooth manner and can be executed in the process of unloading. Therefore, it is possible to increase the shaft process and the unloading plate 上升 in the loading unit 2 and the unloading unit 3, and the month b is enough to reduce the length of the test carrier 1 1L (as shown in Fig. 1). As shown in "1" and "Bai Di 1", the access position 4 is located between the loading list 32 1380395 • 70 2 and the unloading unit 3 and connects the loading unit 2 and the unloading single to the cavity to the 糸System 5. 4 Thus, through the via position 4, the test tray T containing the packaged wafer to be tested can be transferred from the split unit 2 to the chamber system 5. And the test tray T containing the tested packaged wafer through the path position 4' can be transferred from the chamber system 5 to the unloading unit 3. • Although not illustrated, the access position 4 can be configured with a plurality of pulleys, a belt connecting the pulleys, and a transfer tool coupled to the belt for transporting the test tray τ by pushing or pulling the test tray T. This transfer tool can be placed in the chamber system 5. The passage position 4 can be disposed between the first disengagement position 2c and the second arrival position. This path position 4 can be the same as the first disengagement position 2c and the second arrival position. • The path position 4 can be advanced to include the rotating material 41 rib rotation _ test tray τ. • This path position 4 can include a plurality of rotating units 41. The rotating unit 41 is for rotating the test tray τ transmitted from the loading unit 2 from a horizontal state to a sag state. The test solution of the dialysis unit 41 in the straight state will be transferred to the chamber system 5. The % rotation unit 41 is also used to rotate the test tray τ transmitted from the chamber system 5 from a vertical state to a horizontal state. The test tray T is sent to the unloading unit 3 by the rotation unit 41 rotating to the horizontal state. Therefore, the test handler 1 can perform the loading process and the unloading process on the test tray τ having the horizontal state and can perform the test test process in the vertical state. As shown in Fig. 1 and Fig. 10, the cavity 2 system 5 provided in the test handler includes a first chamber 5, a second chamber 52 and a third chamber 53 to enable the pin to be in the H. Record and health environment money in the normal temperature environment for the package test. The first chamber 51 serves to light the package wafer accommodated in the test button transferred from the viewing position 4 to the first temperature. This first temperature is within the temperature range of the packaged wafer when the test tree 01 is packaged. ▲ The first chamber 51 may be configured with at least one of the electric heater and the deductor equipment towel to adjust the package wafer to be tested to the first temperature. The first chamber 51 can be named, and the vertical state of the region is shifted to the cavity (four) portion. The first package W is adjusted - Wen Lin, and the test tray τ qing cavity 51 is transferred to the second chamber 52. The sealing ribs (4) are integrated into the first temperature-capacity in the lining tray τ' or all the high-precision positioning plates η are inserted into the contact unit 521 34 1380395. After taking the machine, the package wafer can be tested to determine the connection to high precision. The electrical characteristics of the packaged wafer of the bit plate. q The second chamber 52 can be configured to hold at least one of the needles of the Hao and liquid contacts == to hold the wafer to be tested at the _th temperature. The test handler 丨 ^ 3 is provided with a first chamber to 52, and a high-precision positioning plate Η can be disposed in each of the chambers 52. When the packaged wafer is completely tested, the test enthalpy will be transferred from the second chamber 52 to the third chamber 53. The second chamber 53 is configured to adjust the packaged wafer that is received in the test tray τ to a second temperature. This second temperature is at a temperature 1_ containing a temperature at or near normal temperature. The third chamber 53 may be provided with at least one set of electric heating enthalpy and liquid nitrogen injection to make it difficult to reach the second temperature of the post-service domain wafer. The second chamber 53 can move the test holder having the vertical state to the inside of the chamber. When the tested package wafer is transferred to the second temperature, the test tray τ will be transferred from the third chamber 53 to the path position 4. As shown in Fig. 10, the first chamber Μ, the second chamber 52 and the third chamber 53 can be formed in the vertical direction. The plurality of second chambers & can be stacked vertically. Although not shown in the drawings, the first chamber 51, the second chamber 52, and the third chamber 53 can be vertically stacked. In this case, the first chamber 51 can be disposed above the 35 1380395 second chamber 52 and the third chamber 53 can be disposed below the second chamber %. As shown in Fig. 10, the transfer unit 6 is used to transfer the test tray τ from the loading unit 2 to the path position 4, and transfer the test tray τ from the path position 4 to the unloading unit 3' and the test tray. T is transferred from the unloading unit 3 to the loading unit 2. The communication unit 6 can include a first transfer unit 61 and a second transfer unit 62. As shown in FIG. 10 and FIG. 11 , the first transfer unit 61 is configured to transfer the test tray T located at the first release position 2C to the path position 4 and transfer the test tray T located at the path position to The second arrival position is 3C. The test tray τ which is transported from the first-disengagement position 2c to the path position 4 accommodates the package (5) to be tested, and the test tray T which is transported to the second arrival position by the path position 4 accommodates the packaged wafer after the test. The first transfer unit 61 includes a first transfer element 6n, a second transfer element 612, and a moving element 613. • Production — The first transmission of 611 帛 to convey the test tray τ at the first lining position & to the path position 4. This first transport element 6 ι is capable of pushing and transporting the test tray τ at the first disengagement position 2C. The second transport element 612 is configured to transport the test tray 位于 at the path position 4 to the second arrival position 3c. This second transport element 612 is capable of pushing and transporting the test tray τ at the path position 4. The second transport element 612 can push and transport the job tray τ. Therefore, even if 36 1380395, when the test tray τ is waiting at the second arrival position 3c, the second conveying member 6i2 can be moved to the initial position. Since the second transporting member 612 can be moved to the position for transporting one test tray T without waiting time, it can shorten the waiting time of the next test tray T in the path position 4. Therefore, it is possible to shorten the waiting time of the test disk τ and thereby shorten the time taken for the loading process and the unloading process by efficiently transferring the test tray τ. • A transport element 611 and a second transport element can be connected to the mobile element 613. Therefore, the moving member 613 can simultaneously transmit the test tray τ at the first detachment position 2c and the test tray τ at the passage position 4 by simultaneously moving the first transport member 6 and the second transport 612. The first transport element (1) and the second transport element 6 are audibly coupled to the moving element 613 and have a predetermined interval between the first transport element 611 and the second transport element 612 such that the first and second transport elements can interrogate the tray T phase contact. Although not shown in the drawings, the moving component can be connected to a belt to which a plurality of pulleys are connected, and can be carried with the movement of the belt, and the towel can be moved by the motor. As shown in Fig. 10 and Fig. 12, the second transfer unit is operative to transfer the test wire τ at the second release position 3b to the first-arrival position %. The test tray τ from the "off position 3b" to the arrival position 2b is emptied by separating the wafer after the ρ 。. 37 1380395 The second transfer unit 62 may include the third transfer element The 621 is used to push and transport the test tray T. The third transporting member 621 can be connected to a belt connected to a plurality of pulleys and can move along with the movement of the belt, wherein the plurality of pulleys can be rotated by the motor. The test disc τ can be pushed and transferred. Thus, even when the test tray τ is waiting at the first-arrival position 2b, the third transport element 621 can be moved to the initial (four). Since the third transport element 621 can be transported - The position of the test tray T is not required to wait for time, so it can shorten the waiting time of the next test tray τ at the second detachment 3b. Therefore, it can shorten the waiting of the test tray τ by efficiently transmitting the test tray T The time of the ship_ county and the time of the unloading process. y will now be combined with the invention - the actual package of the "domain method". Such as "1st picture" to the factory number] 2闯成-

BB 八冑圖」戶斤不，本發明一實施例之封裝片卸載方法包含如下步驟。首先’第二卸·取謂從懈卸她置％卿 /刀離測錢的封裝晶片。第二卸裁拾取器您、離區R中的測試後的封褒晶片從位於 Μ :合於刀上分離。、Ρ载位置3a的測試托盤Τ 器33沿著卸使複數個卸载緩衝器33中的至少—個卸載緩衝 38 區域。触置3a的測試托盤τ之上方的一二 33<π==322 &絲繼衝器封裝晶峨===:r結細分級後的The package unloading method according to an embodiment of the present invention comprises the following steps. First of all, the second unloading is to unload the packaged wafer from which she left the company. The second unloading picker, the test wafer after the test in the area R is separated from the 位于: combined with the knife. The test tray switch 33 of the load position 3a is disposed along at least one of the plurality of unload buffers 33 of the unloading buffer 33. Touching the test tray τ above the 3a one or two 33<π==322 & silk relay package crystal 峨 ===: r after the subdivision level

路猶的封褒晶片之卸载緩衝器33沿著卸載移動 ::動至第-卸载拾取器能夠從卸氣緩衝器^中拾取測試後的，裝曰日片之位置。卸载緩衝器％可位於處在卸载堆疊機Η中的用戶托盤與卸载位置3a之間的區域（區域G)。弟-卸载拾取器321從卸載緩衝器％中拾取測試後的封裝晶片並將所拾取的封裝晶片收容於位於卸載堆疊機Μ中的用戶托The unloading buffer 33 of the sealing chip of the road is moved along the unloading movement until the first-unloading picker can pick up the position of the tested and loaded day film from the unloading buffer. The unloading buffer % may be located in an area (area G) between the user tray and the unloading position 3a in the unloading stacker. The unloading picker 321 picks up the tested package wafer from the unloading buffer % and houses the picked packaged wafer in a user tray located in the unloading stacker

中帛告P載拾取杰321可將測試後的封裝晶片依據測試結果分級後收容至相應的用戶托盤之中。如第8八圖」至「第SD圖」所示，使第二卸載拾取器您將測試後的封裝晶片收容於卸載緩衝器33之中的步驟可進一步包含如下步驟。首先，將第二_载拾取器322移動至位於卸载緩衝器％之上方的位置。卸倾衝H 33可沿著卸載移動路徑F向上移動至另一個分離區S，這另-個分離以係與第二卸载拾取器切將測試 39 1380395 後的封裝晶片從位於卸載位置3a的測試托盤T中分離之分離區R 攻為接近。第二卸載拾取器322將測試後的封裝晶片收容於卸載緩衝器 33之中。如上所述，第二卸載拾取器322可將測試後的封裝晶片收容於卸載緩衝器33之中並移動至最鄰近於分離區R或s之分離區s • 或U之上方，在分離區R或S，測試後的封裝晶片將從位於卸載位置3a的測試托盤τ中被分離。因此，無淪位於分離區R、S及ϋ中的何處，其均能夠縮短移動第二卸載拾取器322以執行卸載製程之距離。如「第9Α圖」至「第9D圖」所示，使複數個卸載緩衝器 33中的至少—個卸載緩衝器33沿著卸載移動路徑f向上移動至位於卸載位置3_測試托盤τ之上方的區域之步驟可包含如下步將複數個却载緩衝器33中的至少一個卸載緩衝器％移動到置這個位置係低於第二卸載拾取器322將測試後的封裝晶片從位於㈣位置3a _試托盤τ巾分離之位置。 & 也就是說，卸賴_ 33餘於分_ R之上方，在分離區 R第^卸载拾取益322可將測試後的封裂晶片從位於卻載位置 3a的測试托盤τ中分離。如上所述’當第二卸载拾取器322從位於卸載位置繼中分離測試後崎晶片之分離區R或s發生變化時:卸載緩如33可移動至相應的分離區R或S之上方的區域。因此，热餘於分離區W s中的何處，其均能醜短移動弟二卸載拾取器322以執行卸載製程之距離。，現在將〜關對本發明—實關之測觀鱗送方法進詳細描述。如第1圖」至「第12圖」所示，本發明一實施例之盤傳送方法包含如下步驟。百先，使裝载單元2執行將待測試的封農晶片收容於位於裝載位置2a之測試域τ中的裝載製程。如上所述，^ =與裝载緩衝器23可依照「第3A圖」至「第犯圖」中户= :例或第4A圖」至「第4D圖」中所示之另一實例進行作業，藉以構成裴載製程。位置2a下降至低於裝可透過第一上升/下將已經過装载製程的測試托盤T從裝載載位置2a的第—脫離位置2c。測試托盤τ 降單元24得以下降。 =位於第-脫離位置2e的測試托盤τ傳送至連接裝載單元2 =腔室系=5的通路位置4。測試托盤T可透過第_傳送單元 61 將位於通路位置4中並且已經過裝載製程的測試托盤T從通位I4傳送至腔咖5。測試托盤Τ可透過配置於通路位置4. 4被傳送至第-腔室51。中未付以從通路位置备通路位置4包含轉解元W時，戦托射可透過轉動元㈣水平狀態被轉動至垂直狀態，並於隨後至腔室系統5。 H运 7室系統5中’ 收容於測試托盤τ中的 ::接:整至第-溫度的繼片至高精度定位板Η並：褒日日片，並且將測試後的封裝晶片調整至第二溫度。在傳送測試托盤Τ至第—腔室51、第：腔室5 腔室51將待測試的封袭― 作―位板^腔至％將調整至第一溫度的封裝晶片連接至高精度疋位板Η且進行測試，裝晶片調整至第二溫度。透過“腔室53將測試後的封將收容有測試後的封裝晶片之測試托盤τ從腔室*** Τ可透舰置料触置4級室系統^ 路位置t 中未示出）得以從第三腔室53被傳送至通田通路位置4包含轉動單元41時，測試托盤T可透過轉動單 42 1380395 兀41從垂直狀態被轉動至水平狀態，並於隨後從腔室系統$傳送至通路位置4。 "將位於通路位置4中且收容有測試後的封裝晶片之測試托盤 T攸通路位置4傳送至位於卸載位置％之下方的第—抵達位置加。測試托盤τ可透過第一傳送單元61得以被傳送。此處，將條觀位置4中且收容有顧後的縣晶片之測雜盤T從通路位置4傳送至第—抵達位置⑪之步射與將位於弟-脫離位置2c的測試托盤τ傳送至通路位置4之步驟同時進行。而職托盤τ可透過第—傳送單元61得以被同時傳送。使位於第-抵軌置2b的_碰τ上歧㈣位置^。測試托盤T可透過第二上升/下降單元34得以上升。透過使用封裝晶片卸載方法，在位於卸載位置如的測試托盤執订卸載。如上所述，卸載拾取器32與 =「第_」至「物圖」中所示之軸「第从圖」弟沁圖」中所示之另一實例進行作業，藉以構成卸栽製程。將已經過㈣製程的測試托盤τ通過第二脫離位置抵達位置2b而從卸載位置如傳送至裝載位置以。測試托盤 ^過第二上升"降單幻4從卸載位置如下降至第位置％’並可魏第二傳送單元62從第二麟㈣％傳送至= 抵達位置❿’以及透過第一上升/下降單元Μ從第-抵達位置 43 1380395 2b上升至裝載位置2a。，現在將結合關對本發明—實關之職⑼製造方法進行詳細描述。此封裝晶片製造方法包含與測試托盤傳送方法相似之步驟。因此為了不使本發明之魏不清楚，以下㈣略對此聽晶片製造方法之詳細說明而僅描述其不同點。如第1圖」至「第i2圖」所示，本發明一實施例之· 片製造方法與測試托盤傳送方法之差異在於以下幾點。 f先，將製備待測試的縣晶片。待測試的封裝晶片可透儲存收容有封裝晶片之用戶把盤於裝載堆疊機η之中來得以備此封裝晶片可為記憶型或非記憶型封裝晶片。然後，透過重複地執行上述步驟，即可完成封裝晶片之製造定本㈣叙錄魏觸露如上，糾麟用則相像技藝者，在不脫離本翻之精神和範I 内’虽可作些許之更動觸飾，因此本發明之專利保本說明書咖以料__界定麵準。 [圖式簡單說明】第1圖為本發明一實施例之戦搬的平面示意圖· 第2圖為f鮮元與卸載單摘立體示意圖； 44 1380395 第3A圖至第犯圖為裝载緩衝器與裝載拾取器作實例的侧面示意圖； ” 第4A圖至第仍圖為裝載緩衝器與裝載拾取器作業位置之一實例的側面示意圖；通路位置及卸载單元之間傳送測試托弟5圖為於裝載單元、盤之路徑的示意圖；第6圖為裝鮮元、卸載單元及通路位置之前視圖；第7圖為裝載單元與卸載單元之平面示意圖；第8A圖至第8D圖為卸載緩衝器與卸載拾取器作業位置之一實例的侧面示意圖；〃第9A圖至第9D圖為卸載緩衝器與卸載拾取器作業位置之另一實例的側面示意圖；第10圖為於本發明之實施例之顧搬運機巾傳送測試托盤之路徑的示意圖；以及 1 第11圖與第I2 為本發明之實施例之測試搬運機中的傳送單元之立體示意圖。【主要元件符號說明】測試搬運機裝載單元 45 2 1380395The 帛帛载载载 321 321 321 can be used to pack the tested packaged wafers according to the test results and then stored in the corresponding user tray. As shown in Figs. 8-8 to SD, the step of causing the second unloading picker to accommodate the tested packaged wafer in the unloading buffer 33 may further include the following steps. First, the second_load pickup 322 is moved to a position above the unloading buffer %. The unloading punch H 33 can be moved up along the unloading movement path F to another separation zone S, which is further separated to test the packaged wafer after the test 39 1380395 from the unloading position 3a with the second unloading picker The separation zone R separated in the tray T is approached. The second unloading picker 322 houses the packaged wafer after the test in the unloading buffer 33. As described above, the second unloading picker 322 can house the tested packaged wafer in the unloading buffer 33 and move it to the separation zone s • or U closest to the separation zone R or s, in the separation zone R. Or S, the tested package wafer will be separated from the test tray τ located at the unloading position 3a. Therefore, where no flaw is located in the separation areas R, S and ϋ, it is possible to shorten the distance by which the second unloading picker 322 is moved to perform the unloading process. As shown in "9th to 9th", at least one of the plurality of unloading buffers 33 is moved up along the unloading path f to be located above the unloading position 3_test tray τ. The step of the area may include the step of moving at least one of the plurality of load buffers 33 to the position of the load buffer 332 lower than the second unloader 322 to position the packaged wafer from the (4) position 3a _ Test the position where the tray is separated. In other words, the unloading _ 33 is above the _R, and the unsealing pick 322 in the separation area R can separate the tested cracked wafer from the test tray τ at the load position 3a. As described above, when the second unloading picker 322 changes from the separation region R or s of the snagging wafer in the unloading position, the unloading tempo 33 can be moved to the area above the corresponding separation region R or S. . Therefore, wherever heat is left in the separation zone Ws, it is possible to ugly the distance that the second brother unloads the pickup 322 to perform the unloading process. Now, it will be described in detail in the method of measuring the scale of the present invention. As shown in Figs. 1 to 12, a disk transfer method according to an embodiment of the present invention includes the following steps. First, the loading unit 2 is caused to perform a loading process for accommodating the agricultural wafer to be tested in the test field τ at the loading position 2a. As described above, ^= and the load buffer 23 can be operated in accordance with another example shown in the "No. 3:" or "4D" to "4D". , in order to constitute an unloading process. The position 2a is lowered to be lower than the first undone/lower position of the test tray T that has passed the loading process from the loading position 2a. The test tray τ drop unit 24 is lowered. = The test tray τ at the first-disengagement position 2e is transferred to the path position 4 of the connection loading unit 2 = chamber system = 5. The test tray T can transfer the test tray T located in the passage position 4 and having passed the loading process from the passage I4 to the chamber coffee 5 through the first conveying unit 61. The test tray Τ can be transferred to the first chamber 51 through the passage position 4.4. When the unreceived path position 4 includes the transfer element W, the 戦-ray is rotated to the vertical state by the rotation element (4) horizontal state, and then to the chamber system 5. In the H-box 7 system 5, the one contained in the test tray τ:: is connected to the first-temperature-sequential to the high-precision positioning plate and: the next day, and the packaged wafer after the test is adjusted to the second temperature. In the transfer test tray Τ to the first chamber 51, the chamber 5 chamber 51, the seal to be tested is made to the position plate, and the package wafer adjusted to the first temperature is connected to the high precision clamp plate. And testing is performed to load the wafer to the second temperature. Through the "chamber 53, the test package will contain the test tray τ containing the tested package wafer from the chamber system, the permeable container is placed in the four-stage system, and the circuit position t is not shown) When the three chambers 53 are transferred to the through-field position 4 including the rotating unit 41, the test tray T can be rotated from the vertical state to the horizontal state through the rotary unit 42 1380395 兀 41, and then transferred from the chamber system $ to the passage position. 4. The test tray T攸 path position 4 in the path position 4 and containing the tested package wafer is transferred to the first-arrival position below the unloading position %. The test tray τ can pass through the first transfer unit. 61 is transmitted. Here, the measuring tray T of the county wafer in the strip position 4 is transported from the path position 4 to the first-arrival position 11 and the step will be located at the discarding position 2c. The step of transporting the test tray τ to the path position 4 is performed simultaneously. The job tray τ can be simultaneously transmitted through the first transfer unit 61. The _ bump τ upper (four) position at the first-to-rail position 2b is ^. Test tray T Can pass through the second The / descent unit 34 is raised. By using the package wafer unloading method, the unloading is performed at the test tray located at the unloading position, for example, as described above, the unloading of the pickup 32 and the axis shown in the "#" to "object" Another example shown in the "Graphic Diagram", "Diagram", is used to construct the unloading process. The test tray τ that has passed the (four) process is passed through the second disengaged position to the position 2b and from the unloading position to the loading position. The test tray ^ is over the second rise " drop single magic 4 from the unloading position to the first position %' and can be transferred from the second lin (four)% to the = arrival position ❿ ' and through the first rise / The lowering unit 上升 is raised from the first-arrival position 43 1380395 2b to the loading position 2a. Now, a detailed description will be made of the manufacturing method of the present invention-------------------------- This package wafer fabrication method includes steps similar to the test tray transfer method. Therefore, in order not to obscure the present invention, the following (four) will only describe the details of the wafer manufacturing method and only describe the differences. As shown in Fig. 1 to Fig. 2, the difference between the sheet manufacturing method and the test tray conveying method according to an embodiment of the present invention lies in the following points. f First, the county wafer to be tested will be prepared. The packaged wafer to be tested can be stored in a stacker η by a user storing the packaged wafer to prepare the packaged wafer as a memory or non-memory packaged wafer. Then, by repeatedly performing the above steps, the manufacturing of the packaged wafer can be completed. (4) The description of the Wei Touche is as above, and the correcting technique is used by the same artist, without any departure from the spirit and the norm of the present, although some changes can be made. The touch-up, therefore, the patent-protected manual of the present invention is defined by the material__. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing a 戦 moving according to an embodiment of the present invention. FIG. 2 is a schematic view showing a f fresh element and an unloading single pick; 44 1380395 FIG. 3A to the first drawing are loading buffers. A side view of an example of loading a picker; "Fig. 4A through Fig. are side views of an example of a loading buffer and a loading picker working position; a transfer test between the path position and the unloading unit is shown in Fig. 5 Schematic diagram of the path of the loading unit and the disc; Fig. 6 is a front view of the loading unit, the unloading unit and the passage position; Fig. 7 is a plan view of the loading unit and the unloading unit; Figs. 8A to 8D are the unloading buffer and A side view of an example of unloading a picker job position; 〃 9A to 9D are side views of another example of an unloading buffer and an unloading picker operation position; FIG. 10 is a view of an embodiment of the present invention Schematic diagram of the path of the transport towel transporting the test tray; and 1 and 11 and FIG. 2 are perspective views of the transport unit in the test handler of the embodiment of the present invention. REFERENCE SIGNS test transporter loading unit 4521380395

3 卸載單元 4 通路位置 5 腔室系統 6 傳达早7G 2a 裝載位置 2b 第一抵達位置 2c 第一脫離位置 3a 卸載位置 3b 第二脫離位置 3c 第二抵達位置 21 裝載堆疊機 22 裝載拾取器 23 裝載缓衝器 24 第一上升/下降單元 31 卸載堆疊機 32 卸載拾取器 33 卸載緩衝器 34 第二上升/下降單元 41 轉動單元 51 第一腔室 52 第二腔室 46 1380395 53 * 61 " 62 23a 33a 221 222 # 241 242 321 322 341 342 521 • 611 612 613 621 222a 222b 气 322a 第三腔室第一傳送單元第二傳送單元裝載導執卸載導執第一裝載拾取器第二裝載拾取器第一上升/下降元件第一驅動單元第一卸載拾取器第二卸載拾取器第二上升/下降元件第二驅動單元接觸單元第一傳送元件第二傳送元件移動元件第三傳送元件距離移動距離距離 47 13803953 Unloading unit 4 Path position 5 Chamber system 6 Communication early 7G 2a Loading position 2b First arrival position 2c First departure position 3a Unloading position 3b Second departure position 3c Second arrival position 21 Loading stacker 22 Loading pickup 23 Loading buffer 24 first ascending/descending unit 31 unloading stacker 32 unloading picker 33 unloading buffer 34 second ascending/descending unit 41 rotating unit 51 first chamber 52 second chamber 46 1380395 53 * 61 " 62 23a 33a 221 222 # 241 242 321 322 341 342 521 • 611 612 613 621 222a 222b Gas 322a Third chamber First transfer unit Second transfer unit Load guide Unloading guide First load picker Second load picker First rising/lowering element first driving unit first unloading picker second unloading picker second rising/lowering element second driving unit contact unit first conveying element second conveying element moving element third conveying element distance moving distance 47 1380395

A 裝載移動路徑 B 區域 C 區域 E 第一上升/下降路徑 F 卸載移動路徑 G 區域 H 南精度定位板 J 第二上升/下降路徑 L 收容區 L, 收容區 M 收容區 R 分離區 S 分離區 T 測試托盤 u 分離區 1H 寬度 1L 長度 48A loading movement path B area C area E first ascending/descending path F unloading movement path G area H south-precision positioning plate J second ascending/descending path L housing area L, housing area M housing area R separation area S separation area T Test tray u separation area 1H width 1L length 48

Claims

1380395 十、申請專利範圍： ί·—種測試搬運機，係包含·· 一裝载單元’該裝載單元包含口器用以在贿-裝裁位置該裝載拾取職位置之-測試托盤上執行—裝载製裝載位置係為該測試括盤中。托盤所處的位置；有制試的封叫時該測試1380395 X. Patent application scope: ί·—Testing conveyor, including... Loading unit' The loading unit contains a mouthpiece for performing on the test tray in the bribe-installation position. The load loading position is in the test tray. The position of the tray; the test when there is a test seal

而來^:在該腔㈣射，收容於從該裝载單元傳送並進封裝“储連接至—絲度定位板一一卸鮮元，該域單姑含有至少—個卸載緩衝器以及一卸载拾取H ’所述卸載緩衝⑽沿著形成於位於—卸载位置測試托盤之上方的—卸載移動路徑移動，該卸载位置係為從該測試鋪上分離職後的封裝晶料該測試托盤所處的位置，該卸載拾取器係用以在位於該卸載位置的該測試托盤上執行一卸賴程，並且該卸鮮元係被設置_賴單元的旁邊；一通路位置，係配置於該裝載單元與該卸載單元之間並將該裝載單元與該卸載單元連接至該腔室系統以使得收容有待測試的封裝晶片之測試托盤可從該裝載單元傳送至該腔室系統並且收容有測試後的封裝晶片之測試托盤可從該腔室系統傳送至該卸載單元；以及 —傳送單元，係用以將測試托盤從該裝載單元傳送至該通路位置，並將該測試托盤從該通路位置傳送至該卸載單元，以 49 及將該4滅從該卸載單元傳送至該裝載單元。 2.如:求項丨所述之測試搬運機，其中該卸載單姑含複數個卸載緩衝盗，該等卸载緩衝器可單獨地移動， +其中讀個卸載緩衝器中的至少—個卸載緩衝器係可沿著該卸載移祕彳以㈣位於該卸餘置_試托盤之上方。 3·如請求項1所述之測試搬運機，其中該裝載單元係包含至少一個裝載緩衝器’所述裝載緩衝器係沿著形成於位於該裝載位置的測4托盤之上方的一裝载移動路徑移動。 4·如凊求項3所述之測試搬職，其巾該裝載緩脑係沿著該裝載移動路鄕動藉以經過位於該裝載位置的該職托盤之上方。 5.如請求項1所述之測試搬運機，其中該裝載單元包含一第一上升/下降單，伽以使該戦減沿著形成於該裝载位置、 -第-抵達位置及一第一脫離位置之中的一第一上升，下降路敉上升和下降’其中該第一抵達位置係位於該裝載位置之下方且係為該測試托盤抵達之位置，該第一脫離位置係位於該第一抵達位置之下方且係為該測試托盤脫離之位置，其中該告P載單元包含-第二上升/下降單元，係用以使該測試托盤沿著形成於該卸載位置、一第二脫離位置及一第二抵達位置之中的一第二上升/下降路獲上升和下降，其中該第二 50 1J80395 脫離位置触於該域位置之下方且縣該測試托置，該第二抵達位置係位於該第二脫離位試托盤抵達之位置盤脫離之位置之下方且係為該測And ^: in the cavity (four) shot, is accommodated from the loading unit and into the package "storage connection to the silk positioning plate one by one unloading element, the domain single aunt contains at least one unloading buffer and an unloading pick H' the unloading buffer (10) moves along an unloading movement path formed above the test tray located at the unloading position, which is the position of the test tray from which the packaged wafer is separated from the test booth. The unloading picker is configured to perform a unloading process on the test tray located at the unloading position, and the unloading element is disposed beside the _ _ unit; a passage position is disposed at the loading unit and the Unloading units and connecting the loading unit and the unloading unit to the chamber system such that a test tray containing the packaged wafer to be tested can be transferred from the loading unit to the chamber system and containing the tested packaged wafer a test tray can be transferred from the chamber system to the unloading unit; and a transfer unit for transferring the test tray from the loading unit to the access position and The test tray is transferred from the path to the unloading unit to transfer the 4 out of the unloading unit to the loading unit. 2. For example, the test handler described in item ,, wherein the unloading list includes a plurality of unloading buffers, the unloading buffers being individually movable, + wherein at least one of the unloading buffers in the unloading buffer is read along the unloading secret to (4) located in the unloading_test tray 3. The test handler of claim 1, wherein the loading unit comprises at least one loading buffer, the loading buffer being along a top of the test 4 tray formed at the loading position The loading movement path moves. 4. The test movement as described in claim 3, wherein the loading slow-brain system is moved along the loading path to pass over the tray at the loading position. The test transporter of claim 1, wherein the loading unit includes a first ascending/descending order, the gamma being reduced to be along the loading position, the -first-arrival position, and a first disengagement position. One of the first And wherein the first arrival position is below the loading position and is the position at which the test tray arrives, the first disengagement position being below the first arrival position and being the a position at which the test tray is detached, wherein the acknowledgment unit comprises a second ascending/descending unit for causing the test tray to be formed along the unloading position, a second disengagement position and a second arrival position A second rising/falling path is raised and lowered, wherein the second 50 1J80395 disengagement position is below the position of the domain and the county is placed in the test, and the second arriving position is located in the second disengaged test tray. Below the position where the position disc is detached and is the test

6.如請求項5所述之測試搬運機，其中該傳送單元包含： -第-傳送單元，該第—傳送單位於該第—脫離位置的該測試托盤傳送至該通路位置並將位於該通路位置的該測試托盤傳送至該第二抵達位置；以及 -第二傳送單元，該第二傳送單元用贿位於該第位置的該測試托盤傳送至該第一抵達位置。離如請求項6所述之戦搬職，其中該第—傳送單元包含：第傳送元件’該第-傳送元件用以將位於該第一脫離位置的該測試托盤傳送至該通路位置； -第二傳送元件’該第二傳送元件用以將位於該通路位置的該測試托盤傳送至該第二抵達位置；以及 :-移動元件’該第—傳送元件與該第二傳送元件係連接至該移動元件，並且該移動元件使該第一傳送元件與該第二傳送元件同時移動。月求項1所述之測試搬運機，其中該卸載拾取器包含：一第一卸載拾取器，係從該卸載緩衝器拾取測試後的封裝 b曰片並將所拾取的封裝晶片收容於位於該卸載堆疊機中的一用戶托盤中；以及 51 1380395 -第二卸載拾取H，_以從位於該卸齡置的該測試托盤上分離測試後的封裝晶片並將分離後的封裝晶片收容於該卸載緩衝器中，其中該第二卸载拾取H係將位於該卸齡置的該測試托盤劃分成複數個分離H並透過鮮分離區將摩猶的封衷晶月分離。 9·如請求項8所述之測試搬運機，其中該卸载緩衝器係沿著該卸 _動路郷_使得當該第二卸載拾取器執行該卸載製程時’該第二#卩載拾取||之軸距離縮短。 ίο.如請求項i所述之測試搬運機，其中該卸載單元包含複數侧立移動之卸載緩衝器，其中魏個卸载緩衝財的至少—個卸魏衝器係沿著 P載移祕郷_峨雜於鞠餘置的铜試托盤之上方’以及位置與健祕躲該裝載 U.—種封裝晶片卸載方法，係包含以下步驟：使-第二卸載拾取器從位於分離測試後的封，罝的㈣托盤上測試後的封裝晶片二曰、，該卸載位置係為從該測試托盤上分離、日日片τ該測試托盤所處的位置；使複數個卸載緩衝器中的至少一個卸载緩衝器沿著形成 52 1380395 於位於該卸載位置的該測試托盤之上方的—卸載移動路徑移動以使得至J-個卸载緩衝器係位於處在該卸載位置的該測試托盤之上方；使該第二卸载拾取11將職後的職^收容於該卸載緩衝器之中；使收谷有測試後的封裝晶片之該域緩_沿著該卸載移動路#移紐-第—卸載拾取器能夠從該卸載緩衝器中拾取測試後的封裝晶片之位置；以及使k第#社取盗從該卸載緩衝器中拾取測試後的封裝晶片並將所拾取的封裳晶片收容於位於該卸載堆疊機中的一用戶托盤之中。 12. 如請求項11所述之_物財法，其中使複數個卸載緩衝— ==至少-個卸载緩衝器沿著形成於位於該卸载位置的該測喊托盤之上糾該喊移鱗徑移動錢得至少— 器係位於處在該卸載位置的該衝 m桃紅上方的_係包含使複數個卸載緩衝器中的至少一個卸載緩衝器移動到低科第二罐_繼她娜卩酬魄魏盤中分離之位置的步驟。 ^ 13. 如請求項η所述之封裝晶片卸載方法其中使器將測試細裝晶^娜卩軸㈣的以下步驟： 53 1380395 使該苐二㈣拾取器移動至該卸载緩衝器之上方；以及使該第二卸胁取器將測試後的封裝晶片收容於該卸載緩衝器之中。 14.-種測試讀傳送方法，係包含以下步驟使-裝载單元執行將待測試的封裝晶片收容於位於一裝置Γ測試托盤中的—裝载製程，該裝载位置係為該測試托6. The test handler of claim 5, wherein the transfer unit comprises: - a first transfer unit, the test tray in the first transfer position is transferred to the path and will be located in the path The test tray of the position is transported to the second arrival location; and - a second transport unit that transports the test tray in the first position to the first arrival location. Moving from the position as described in claim 6, wherein the first transfer unit comprises: a first transport element for transporting the test tray at the first disengaged position to the access position; a second transfer element for transferring the test tray at the path position to the second arrival position; and: - a moving element 'the first transfer element and the second transfer element are coupled to the movement An element, and the moving element moves the first conveying element and the second conveying element simultaneously. The test handler of claim 1, wherein the unloading picker comprises: a first unloading picker, picking up the tested package b-chip from the unloading buffer and accommodating the picked packaged wafer at the Unloading a user tray in the stacker; and 51 1380395 - second unloading pick H, _ to separate the tested package wafer from the test tray located at the ageing and accommodating the separated package wafer in the unloading In the buffer, the second unloading picking H divides the test tray located at the ageing into a plurality of separations H and separates the sealed crystals from the fresh separation zone. 9. The test handler of claim 8, wherein the unloading buffer is along the unloading path _ such that when the second unloading picker performs the unloading process, the second #卩 picking| |The shaft distance is shortened. Ίο. The test transporter of claim i, wherein the unloading unit comprises a plurality of unloading buffers for lateral movement, wherein at least one unloading buffer of the unloading buffer is along the P-loading secret _ The method of unloading the copper test tray above the remaining one and the location and the hidden U.-package wafer unloading method includes the following steps: The second unloading picker is removed from the seal after the separation test. The packaged wafer after testing on the (four) tray, the unloading position is the position where the test tray is separated from the test tray, and the day tray τ; at least one of the plurality of unloading buffers is unloaded and buffered Moving along the unloading movement path forming the 52 1380395 above the test tray at the unloading position such that the J-unloading buffer is located above the test tray at the unloading position; The job of unloading the pick-up 11 is contained in the unloading buffer; the domain of the packaged wafer after the test is received is slowed along the unloading path #---unloading and picking up Capable of picking up the position of the tested package wafer from the unloading buffer; and causing the k-stack to pick up the tested packaged wafer from the unloading buffer and accommodating the picked-up packaged wafer on the unloading stack In a user tray in the machine. 12. The method of claim 11, wherein the plurality of unloading buffers - == at least one unloading buffer are corrected along the shouting tray located at the unloading position; Moving the money at least - the _ system above the rushing m peach in the unloading position includes moving at least one of the plurality of unloading buffers to the second tank of the lower section _ following her reward The step of separating the position of Wei Panzhong. ^ 13. The package wafer unloading method of claim n wherein the actuator will test the following steps of the fine-grained wafer (4): 53 1380395 moves the second (four) pickup to the top of the unloading buffer; The second unloader is configured to receive the tested package wafer in the unloading buffer. 14. A test read transfer method comprising the steps of: causing a load cell to carry a package wafer to be tested in a loading process in a device test tray, the load position being the test tray

收今有制4贿裝晶片時朗試托盤所處的位置；使已、’’工過雜麵程的酬試域㈣裝载位置下降至低於該裝載位置的一第—脫離位置; 將位於該第一脫離位置的該測試托盤傳送至連接該裝載單元與一腔室系統的-通路位置處；褒載將位於該通路位置並且已經過裝载製程的測試域從該通路位置傳送至該腔室系統；使該腔室系統調整收容於該測試托盤中的封裝晶片至— 第一溫度’連接調整至該第一溫度的封裝晶片至-高精度定位板並測细裝晶片，並且將測試後的封裝晶片調整至一第二溫度，將收容有職後的封裝晶片之職托雜該腔送至該通路位置；汍得將位於該通路位置且收容有測試後的魄晶片之序式托盤從該通路位置傳送至位於—卸餘置之下方的―第—抵達位 54 f處’該卸載位置麵魏測試滅上分離測試後的封農晶片時該測試托盤所處的位置；使位於該第一抵達位置的該測試托盤上升至該卸載位置丨在位於該卸载位置的該測試托盤上執行一卸載製程；以及將已經過該卸載製程的該測試托盤通過介於該卸載位置與該=二抵達位置之_—第二脫離位置以及介於該裝載位置When the system has a system to make a bribe, the position of the pallet is tested; the loading position of the vehicle (4) has been lowered to a position below the loading position; The test tray located in the first disengaged position is transferred to a path position connecting the loading unit and a chamber system; the load is transmitted from the path position to the test field at the path position and having passed the loading process a chamber system; causing the chamber system to adjust a package wafer contained in the test tray to - a first temperature 'connecting the package wafer to the first temperature to a high precision positioning plate and measuring the fine wafer, and testing The post-packaged wafer is adjusted to a second temperature, and the chamber containing the post-installation package wafer is transported to the path of the device; and the sequence tray of the wafer after the test is placed at the path position is received from The path position is transmitted to the "first-arrival position 54f" located below the unloading reserve. The position of the test tray when the unloading position surface is tested and the sealed agricultural wafer is separated. Lifting the test tray at the first arrival position to the unloading position, performing an unloading process on the test tray located at the unloading position; and passing the test tray that has passed the unloading process through the unloading position __the second detachment position of the arrival position and the loading position

A第脫離位置之間的一第一抵達位置而從該卸載位置傳送至該裝載位置， /、中在位於該卸载位置的該測試托盤上執行該_載製程之步驟係包含以下步驟：使-第二卸載拾取器從位於該卸載位置哺測試托盤上刀離測S式後的封裝晶片；使複數個卸載緩衝器中的至少一個卸载緩衝器沿著形成A first arrival position between the first disengagement positions is transferred from the unloading position to the loading position, and the step of performing the _-loading process on the test tray located at the unloading position comprises the following steps: a second unloading picker that feeds the test tray from the unloading position on the test tray, and at least one of the plurality of unloading buffers is formed along the formation

=位於該㈣位置的該測試托盤之上方的—卸載移動路徑移 '吏H娜卩触衝n係位於處在該卸載位置的試托盤之上方；、使該第二卸載拾取器將測試後的封裝晶片收容於緩衝器之中；使收容有測試後的封裝晶片之該卸载緩衝器沿著該卸载移動路t移動至—第—卸载拾取器能夠從該卸载緩衝器中拾取測試後的封裝晶片之位置；以及 55 1380395 使該第#载拾取器從該卸載緩衝器中拾取測試後的封裝晶片並將所拾取的封裝晶片收容於位於-卸載堆疊機中的一用戶托盤之中。 15^請求項14所述之測試托盤傳送方法，其中使複數個卸載緩衝器t的至少-個卸载緩衝器沿著形成於位於該_位置的該測試托盤之上方的該卸載移祕郷動贿得至少—個卸載緩衝器係位於處在該卸载位置的該測試托盤之上方的步驟係包含使複數個卸載緩衝器中的至少一個卸載緩衝器移動到低於該第二卸载拾取器將測試後的封裝晶片從位於該卸裁位置的該測試把盤中分離之位置的步驟。 16.域求項14所述之職托盤傳送方法，其中使該第：卸載拾取盗將測试後的封裝晶片收容於該卸載緩衝器之中的步驟係包含以下步驟：= above the test tray at the (four) position - the unloading movement path is moved to the top of the test tray at the unloading position; the second unloading picker will be tested The packaged wafer is received in the buffer; the unloading buffer containing the tested packaged wafer is moved along the unloading movement path t to - the first unloading picker can pick up the tested packaged wafer from the unloading buffer And 55 1380395 cause the #1 picker to pick up the tested package wafer from the unloading buffer and house the picked package wafer in a user tray located in the unloading stacker. 15) The test tray transfer method of claim 14, wherein at least one unloading buffer of the plurality of unloading buffers t is used to sneak a bribe along the unloading formed above the test tray at the _ position Having at least one unloading buffer located above the test tray at the unloading position includes moving at least one of the plurality of unloading buffers below the second unloading picker to be tested The step of packaging the wafer from a position in the test tray at the unloading position. 16. The method of transferring a tray according to claim 14, wherein the step of: unloading the pirate to receive the packaged wafer after the test in the unloading buffer comprises the steps of:

使該第二域拾取器移動至該卸載緩衝器之上方；以及 _第二卸·取器將測試後的封裝晶片收容於該卸载請求項14所狀峨_^方法，射__-脫離 :置的該測試托盤傳送至連接該裝載單元與該腔室系統的： =置處之㈣係與紐於該桃位置錄容有戰後㈣裝 =之測雜餘料魏置傳送纽於慰卩齡置之下涊第一抵達位置處之步驟同時進行。 56 18.- 種封袭晶片製造方法，係包含以下步驟：製備待測試的封裝晶片；，-裝裁單元執行將已製備的封裝日日日片收容於位於盤^收2趣財的—裝健程，該裝敏置係為該測試托谷待測試的封裝晶片時該測試托盤所處的位置；Moving the second domain picker to the top of the unloading buffer; and the second unloading device accommodating the tested packaged wafer in the unloading request item 14 by the method of __- detachment: The test tray is transferred to the connection unit and the chamber system: = (4) and the new position of the peach position after the war (four) installed = the measurement of the miscellaneous materials The step of placing the first arrival position under the age is performed simultaneously. 56 18.- A method for manufacturing a sealed wafer, comprising the steps of: preparing a packaged wafer to be tested; and - performing a cutting unit to perform the preparation of the packaged Japanese and Japanese film in a tray The position of the test tray when the test wafer is to be tested by the test tray;

使已經過雜健㈣制試域從難餘置下降至低於該裝.置的—第一麟位置；將位於該第-脫離位置的制試㈣傳送至連接該單元與—腔n 统的-通路位置處；、、將位於該通路位置並且已經過魏製程的測試托盤從該通路位置傳送至該腔室系統；使該腔室系賴整收容於關試減巾的縣晶片至一第一溫度’連接至該第-溫度的難⑼至—高精度定位Passing the test domain that has passed the hybrid (four) test from the difficult position to the position below the first position of the device; transferring the test (4) located at the first-disengaged position to the connection between the unit and the cavity - at the position of the passage; transferring the test tray located at the position of the passage and having passed the Wei process to the chamber system from the passage position; causing the chamber to be housed in the county wafer to be tested A temperature 'connected to the first temperature is difficult (9) to - high precision positioning

板並測試封裝晶片，並且將測試後的封裝晶片調整至一第二溫度；將收容有測試後的封裝晶片之測試托盤從該腔室系統傳送至該通路仇置；將位於該通路位置且收容有測試後的封裝晶片之測試托盤從該通路位置傳送至位於一卸載位置之下方的一第—抵達位置處，該卸載位置係為從該測試托盤上分離測試後的封裝晶片時該測試托盤所處的位置； 57 使位於該第—抵達位置的朗試托盤上升至該喊位置；在位於該卸触置的制試域上執行-卸賴程；以及將已經過該卸賴㈣該職托盤通過介於該卸載位置 /、該第一抵達位置之間的__第二脫離位置以及介於該裝載位置與該第-脫離位置之間的—第—抵達位置而從該却載位置傳送至該裝載位置，And testing the packaged wafer, and adjusting the tested packaged wafer to a second temperature; transferring the test tray containing the tested packaged wafer from the chamber system to the access; A test tray having a tested packaged wafer is transferred from the path to a first-arrival position below an unloading position, the unloading position being the test tray when the tested package wafer is separated from the test tray Position of the place; 57 to raise the test tray at the first-arrival position to the shout position; perform the unloading procedure on the test area located in the dismounting; and the tray that has passed the revocation (four) Transmitting from the loaded position to the __second disengagement position between the unloading position/the first arrival position and the -first arrival position between the loading position and the first disengagement position The loading position,

其中在位㈣卸載位置的制試謎上騎該卸載製程之步驟係包含以下步驟：使第一卸载拾取器從位於該卸载位置的該測試托盤上分離測試後的封裝晶片；試把盤之上方；使複數個卸魏魅巾縣少i卸賴衝ϋ沿著形成於位於=卩齡置的朗試城之上㈣—域移動路徑移動以使付至少-個卸载緩衝器係位於處在該卸載位置的該測The step of riding the unloading process on the test puzzle of the (4) unloading position comprises the steps of: separating the first unloading picker from the test tray located at the unloading position; and testing the packaged wafer; Having a plurality of unloading scented scented scented smuggling smuggling smuggling smuggling along the ridge (4)-domain moving path formed at 卩置置以以以以以以域域域域域域域域域域域域域The test of the unloading position

使該弟一卸載拾取器緩衝器之中；將測試後的封裝晶片收容於該卸載使收容有測試後的封裝晶片之該卸載緩衝器沿著該卸載移動路徑機至-第—卸餘取說触該域測試後的封裝晶片之位置；以及 ^ 吏k第卸載拾取$從該卸載緩衝器中拾取測試後的封裝B曰片並將所拾取的封裝晶片收容於位於—卸載堆疊機中的一 58 〇υ395 用戶托盤之中。 19·如請求項18所述之封裝晶片製造方法，其中使複數個卸載緩衝器中的至少-個卸載緩衝器沿著形成於位於該卸载位置的該測試托盤之上方的該卸载移祕徑移細使得至少—個卸載緩衝器係位於處在該卸她置的_試托盤之上方的步驟係包含使複數個卸載緩衝器中的至少一個卸載緩衝器移動到低於該第二Having the younger one unloaded in the pick-up buffer; accommodating the tested packaged wafer in the unloading so that the unloading buffer containing the tested packaged wafer moves along the unloading path to the first-to-unloading Touching the position of the packaged wafer after the domain test; and ^ 第 k first unloading picking $ picking up the tested package B 从 from the unloading buffer and accommodating the picked packaged wafer in the unloading stacker 58 〇υ395 among the user trays. The packaged wafer manufacturing method of claim 18, wherein at least one of the plurality of unloading buffers is moved along the unloading path formed above the test tray at the unloading position The step of causing at least one of the unloading buffers to be located above the unloading test tray comprises moving at least one of the plurality of unloading buffers to be lower than the second

卸載拾取器將測試後的封裝晶片從位於該卸載位置的制試托盤中分離之位置的步驟。 m如請求項18所述之封裝晶片製造方法，其中使該第二卸載拾取器將測試後的封裝晶片收容於該卸載緩衝器之中的步驟係包含以下步驟晶片收容於該卸載使該第二卸載拾取器移動至該㈣緩衝器之上方;以及使該第二卸載拾取器將測試後的封裝，緩衝器之中。The step of unloading the picker to separate the tested packaged wafer from the test tray located at the unloading position. The method of manufacturing a packaged wafer according to claim 18, wherein the step of causing the second unloading picker to receive the packaged packaged wafer in the unloading buffer comprises the step of: receiving the second wafer in the unloading The unloading picker moves over the (four) buffer; and the second unloading picker will be tested in the package, in the buffer.

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