WO2009116165A1 - Tray conveying device and electronic part test device with the same - Google Patents

Tray conveying device and electronic part test device with the same Download PDF

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Publication number
WO2009116165A1
WO2009116165A1 PCT/JP2008/055255 JP2008055255W WO2009116165A1 WO 2009116165 A1 WO2009116165 A1 WO 2009116165A1 JP 2008055255 W JP2008055255 W JP 2008055255W WO 2009116165 A1 WO2009116165 A1 WO 2009116165A1
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WO
WIPO (PCT)
Prior art keywords
tray
test
holding
tested
transport
Prior art date
Application number
PCT/JP2008/055255
Other languages
French (fr)
Japanese (ja)
Inventor
健一 島田
佳貴 竹内
Original Assignee
株式会社アドバンテスト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アドバンテスト filed Critical 株式会社アドバンテスト
Priority to PCT/JP2008/055255 priority Critical patent/WO2009116165A1/en
Priority to TW098105427A priority patent/TWI490970B/en
Publication of WO2009116165A1 publication Critical patent/WO2009116165A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Definitions

  • the present invention relates to a tray transport apparatus for transporting a tray that can accommodate various electronic components (hereinafter also referred to as IC devices) such as semiconductor integrated circuit elements, and an electronic component test apparatus including the tray transport apparatus. .
  • IC devices electronic components
  • semiconductor integrated circuit elements semiconductor integrated circuit elements
  • an electronic component test apparatus In the manufacturing process of an IC device, an electronic component test apparatus is used to test the performance and function of the IC device in a packaged state.
  • a handler constituting the electronic component testing apparatus includes a loader unit, a chamber unit, an unloader unit, and a storage unit.
  • the loader unit reloads the IC device from the customer tray to the test tray, and loads the test tray into the chamber unit.
  • the customer tray is a tray for storing a pre-test or a tested IC device.
  • the pre-test IC device is supplied to the handler from the previous process while being stored in the customer tray. Then, it is sent out from the handler to the subsequent process while being accommodated in the customer tray.
  • the test tray is a dedicated tray that is circulated and conveyed in the handler.
  • the chamber portion applies a high or low temperature thermal stress to the IC device with the IC device mounted on the test tray, and then presses the IC device against the socket provided in the test head.
  • a tester constituting the electronic component testing apparatus performs a test of the IC device via the test head.
  • the unloader unit sorts out the test tray containing the tested IC device from the chamber unit, and places the IC device on the customer tray according to the test result, thereby classifying the product into a category such as a non-defective product or a defective product.
  • the storage unit supplies the customer tray containing the IC device before the test to the loader unit, and accepts the customer tray containing the tested IC device from the unloader unit.
  • the storage unit includes a stocker that stores a plurality of customer trays in a stacked state, a lifting device that feeds and unloads the customer tray to and from the loader unit and the unloader unit by moving the customer tray up and down, a stocker, and a lifting device And a tray transfer device for transferring the customer tray between the printer and the customer.
  • the tray transfer device When exchanging the customer tray mounted on the lifting device, the tray transfer device must reciprocate between the stocker and the lifting device, which is likely to cause a neck process.
  • the number of IC devices that can be simultaneously tested in the electronic component test apparatus (the number of simultaneous measurements) is inevitably increased, it is necessary to speed up the replacement operation of the customer tray, and this tendency becomes remarkable.
  • the problem to be solved by the present invention is to provide a tray conveying device and an electronic component testing device capable of shortening replacement work.
  • a tray transport apparatus for transporting a tray capable of accommodating an electronic device under test, the storage means storing the tray, the holding means holding the tray, and the tray temporarily.
  • a tray transfer device is provided (see claim 1).
  • the storage means is a storage plate that can be temporarily stored by holding the tray only by being placed by the transport means.
  • the holding means contains a first holding means for holding a pre-test tray that contains the electronic device under test before testing, and houses the electronic device under test that has been tested.
  • a second holding means for holding the tested tray, and the storage means is preferably disposed between the first holding means and the second holding means. Item 2).
  • the moving distance of the tray by the conveying means from the holding means to the storage means is shorter than the moving distance of the tray by the conveying means from the holding means to the storing means. It is preferable (see claim 3).
  • the storage means includes a first storage means for storing a pre-test tray containing the electronic device under test before testing, and a test containing the tested electronic device under test. It is preferable to include a second storing means for storing a finished tray and a third storing means for storing an empty tray that does not contain the electronic device under test (see claim 4).
  • the at least one transporting unit includes first and second transporting units capable of independently transporting the tray
  • the control unit includes A first transport unit transports the tray between the first storage unit, the first holding unit, the storage unit, and a third storage unit, and the second transport unit performs the storage. Controlling the first and second transport means to transport the tray between the means, the second holding means, the second storage means, and the third storage means. Is preferable (see claim 5).
  • control means may be configured such that the first transport means holds the pre-test tray storing the electronic device under test before the test from the first storage means to the first holding means.
  • the empty tray in which the electronic device under test before being tested is emptied is conveyed from the first holding device to the storage device, and the second conveying device removes the electronic device under test.
  • An empty tray that is not accommodated is transported from the storage means or the third storage means to the second holding means, and the tested tray that contains the tested electronic component to be tested is contained in the second holding means. It is preferable to control the first and second conveying means so as to convey from the means to the second storage means (see claim 6).
  • control means is configured such that the second transport means transports the tested tray containing the tested electronic components to be tested from the second holding means to the storage means.
  • first transport means controls the first and second transport means so that the tested tray is transported from the storage means to the first holding means or the first storage means. It is preferable to do so (see claim 7).
  • the first and second holding means are capable of moving the tray along a first direction
  • the first and second transport means are The tray can be moved independently along the first direction and a second direction different from the first direction, and the first, second and third storages are possible.
  • the means is arranged along the second direction, and the first and second holding means and the storage means are arranged in the first direction with respect to the first to third storage means. It is preferable that it is located in (refer Claim 8).
  • the first transport means has a plurality of first gripping portions capable of gripping the tray, and the plurality of first gripping portions are the first gripping portions. It is preferable that they can move independently along the direction and can move together along the second direction (see claim 9).
  • the second conveying means has a plurality of second gripping portions capable of gripping the tray, and the plurality of second gripping portions include the first and the second gripping portions. It is preferable that they can move independently along the second direction (see claim 10).
  • each of the first and second holding portions can hold a plurality of the trays, and each of the storage means and the holding means can hold a plurality of the trays. There is preferably (see claim 11).
  • an electronic component testing apparatus used for testing the electronic device under test by bringing an input / output terminal of the electronic device under test into electrical contact with a contact portion of a test head.
  • an electronic component testing apparatus provided with the tray conveying device is provided (see claim 12).
  • a loader unit for transferring the electronic device under test from the tray to the second tray, and the electronic device under test loaded from the loader unit are mounted on the second tray.
  • the tray conveying device supplies the tray in which the electronic device under test before testing is accommodated to the loader unit, and receives the tray in which the electronic device under test has been accommodated from the unloader unit. Is preferable (see claim 13).
  • the tray replacement work can be shortened.
  • FIG. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of the electronic component testing apparatus of FIG.
  • FIG. 3 is a conceptual diagram showing a tray handling method in the electronic component testing apparatus of FIG.
  • FIG. 4 is an exploded perspective view showing a stocker used in the electronic component testing apparatus of FIG.
  • FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus of FIG.
  • FIG. 6 is a front view showing a storage unit of the electronic component testing apparatus of FIG.
  • FIG. 7 is a side view of the storage unit of FIG.
  • FIG. 8 is a front view illustrating a first transfer arm of the tray transfer device in the storage unit of FIG. 6.
  • FIG. 9 is a front view showing a second transfer arm of the tray transfer device in the storage unit of FIG.
  • FIG. 10 is a block diagram showing a control system of the storage unit of the electronic component test apparatus of FIG.
  • FIG. 11 is an exploded perspective view of a test tray used in the electronic component testing apparatus of FIG.
  • FIG. 12A is a schematic front view (No. 1) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 12B is a schematic front view (No. 2) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 12C is a schematic front view (No.
  • FIG. 12D is a schematic front view (No. 4) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 12E is a schematic front view (No. 5) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 12F is a schematic front view (No. 6) illustrating a first example of a method for transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 12G is a schematic front view (No.
  • FIG. 12H is a schematic front view (No. 8) illustrating the first example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 12I is a schematic front view (No. 9) illustrating the first example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 12J is a schematic front view (No. 10) illustrating a first example of a method for transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 12K is a schematic front view (No.
  • FIG. 12L is a schematic front view (No. 12) illustrating a first example of a method for transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 12M is a schematic front view (No. 13) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 13A is a schematic front view (No. 1) illustrating a second example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention.
  • FIG. 13B is a schematic front view (No.
  • FIG. 13C is a schematic front view (No. 3) illustrating a second example of the customer tray transport method in the storage unit according to the embodiment of the present invention.
  • FIG. 13D is a schematic front view (No. 4) illustrating a second example of the customer tray transport method in the storage unit according to the embodiment of the present invention.
  • FIG. 13E is a schematic front view (No. 5) illustrating a second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 13F is a schematic front view (No. 6) illustrating a second example of the customer tray transport method in the storage unit according to the embodiment of the present invention.
  • FIG. 13G is a schematic front view (No. 7) illustrating the second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 13H is a schematic front view (No. 8) illustrating the second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 13I is a schematic front view (No. 9) illustrating a second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 13J is a schematic front view (No. 10) illustrating a second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 13K is a schematic front view (No. 11) illustrating a second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
  • FIG. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to the present embodiment
  • FIG. 2 is a perspective view of the electronic component testing apparatus of FIG. 1
  • FIG. 3 is a concept showing a tray handling method in the electronic component testing apparatus of FIG. FIG.
  • FIG. 3 is a view for understanding the tray handling method in the electronic component testing apparatus, and there is actually a portion in which the members arranged in the vertical direction are shown in a plan view. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.
  • the electronic component test apparatus tests (inspects) whether or not the IC device properly operates in a state where a high-temperature or low-temperature thermal stress is applied to the IC device, and the IC device is determined based on the test result. It is an apparatus for classifying, and includes a handler 1, a test head 5, and a tester 6. The test of the IC device by the electronic component test apparatus is performed in a state where the IC device is transferred from the customer tray KST to the test tray TST and mounted on the test tray TST.
  • the handler 1 in this embodiment includes a storage unit 200 that stores a customer tray KST that contains a pre-test or a tested IC device, and a customer tray KST supplied from the storage unit 200.
  • the IC device is mounted on the test tray TST, and the IC device is loaded in the test tray TST while applying a predetermined thermal stress to the loader unit 300 for feeding the test tray TST to the chamber unit 100 and the IC device.
  • the socket 50 mounted on the top of the test head 5 is connected to the tester 6 through the cable 7 shown in FIG.
  • the IC device electrically connected to the socket 50 is connected to the tester 6 via the cable 7, and a test signal is exchanged between the IC device and the tester 6.
  • a space 8 is formed in the lower portion of the handler 1, and the test head 5 is replaceably disposed in the space 8, and an opening 101 a formed in the main base (base) 101 of the handler 1.
  • the IC device and the socket 50 on the test head 5 can be brought into electrical contact with each other.
  • the socket 50 on the test head 5 is replaced with a socket suitable for the type after replacement.
  • ⁇ Storage unit 200> 4 is an exploded perspective view showing a stocker used in the electronic component testing apparatus of FIG. 1
  • FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus of FIG. 1
  • FIG. 6 is an electronic component testing apparatus of FIG. 7 is a side view of the storage unit of FIG. 6
  • FIG. 8 is a front view of the first transfer arm of the tray transfer device in the storage unit of FIG. 6
  • FIG. 9 is the storage of FIG.
  • FIG. 10 is a block diagram showing a control system of a storage unit of the electronic component test apparatus of FIG. 1.
  • the storage unit 200 includes stockers 211 to 213 for storing customer trays KST, lifting devices 220A and 220B that can hold the customer trays KST and can be lifted and lowered, and stockers 211 to 213. And a tray transfer device 230 that conveys the customer tray KST between the lifting devices 220A and 220B.
  • the storage unit 200 includes a pre-test stocker 211 that stores a customer tray KST containing pre-test IC devices, and a customer that contains IC devices classified according to test results.
  • a tested stocker 212 for storing the tray KST and an empty tray stocker 213 for storing an empty customer tray KST that does not contain an IC device are provided.
  • these stockers 211 to 213 include a frame-like tray support frame 214 and an elevator 215 that can be moved up and down by entering from the lower part of the tray support frame 214.
  • a plurality of customer trays KST are stacked and accommodated in the tray support frame 214, and the stacked customer trays KST are moved up and down by an elevator 215.
  • the numbers of the pre-test stocker 211, the tested stocker 212, and the empty tray stocker 213 can be appropriately set as necessary.
  • the pre-test stocker 211, the tested stocker 212, and the empty tray stocker 213 are arranged side by side in the X-axis direction.
  • one stocker STK-B is provided in the storage unit 200 as the pre-test stocker 211.
  • seven stockers STK-1, STK-2,..., STK-7 are provided in the storage unit 200 as the tested stockers 212, and are sorted and stored in up to seven categories according to the test results. It is configured to be able to. In other words, in addition to distinguishing between non-defective products and defective products, it is possible to sort non-defective products that have a high operating speed, medium-speed products, low-speed products, or defective products that require retesting. It has become.
  • empty tray stocker 213 two stockers STK-E are provided between STK-4 and STK-5.
  • empty customer trays KST to be sent to the window part 406 opened in the unloader part 400 are stacked.
  • the electronic component testing apparatus includes two first lifting devices 220A and five second lifting devices 220B.
  • the first lifting / lowering device 220 ⁇ / b> A is disposed in each of the two window portions 306 opened in the main base 101 in the loader unit 300.
  • one second lifting device 220B is disposed in each of the five window portions 406 opened in the main base 101 in the unloader portion 400.
  • each of the lifting devices 220 ⁇ / b> A and 220 ⁇ / b> B includes a Z-axis rail 211 provided so as to hang from the main base 101, and a table 222 provided on the Z-axis rail 221 so as to be able to be raised and lowered It is composed of, in particular an actuator (not shown), the table 222 it is possible to lift between the first restricting position H 1 and the second regulation position H 2.
  • First restricting position H 1 is the upper limit of the Z-axis direction of the table 222, the table 222 to the restricting position H 1 of the first is located, via the window 306 (or the window 406), customer tray The KST faces the loader unit 300 (or the unloader unit 400).
  • the second restricting position H 2 is the lower limit in the Z-axis direction of the table 222, in a state where the table 222 is positioned at the restricting position of H 2 the second, customer between the tray transfer apparatus 230 The tray KST is delivered.
  • the lifting devices 220A and 220B move the customer tray KST between the storage unit 200 and the loader unit 300 (or the unloader unit 400) by holding and lifting the customer tray KST on the table 222. It is possible.
  • the tray transfer device 230 includes an X-axis rail 231 installed along the X-axis direction between the main base 101 and the stockers 211 to 213, and is provided on the X-axis rail 231.
  • the first transfer arm 240 and the second transfer arm 250 are provided.
  • the first transfer arm 240 and the second transfer arm 250 can move on the X-axis rail 231 independently along the X-axis direction by an actuator (not shown).
  • the first transfer arm 240 includes a base 241 provided on the X-axis rail 241 so as to be movable in the X-axis direction, two Z-axis rails 242 and 245 fixed to the base 241, Two holding heads 243 and 246 are provided on the Z-axis rails 242 and 245 so as to be movable along the Z-axis direction, respectively.
  • the first holding head 243 is shown in a lowered state
  • the second holding head 246 is shown in a raised state.
  • the first moving arm 240 may be movable along the Y-axis direction.
  • the holding heads 243 and 246 can be moved independently along the Z-axis direction by an actuator (not shown). Since the two holding heads 243 and 246 are attached to the same base 241 via the Z-axis rails 242 and 245, they cannot move independently in the horizontal direction.
  • the holding heads 243 and 246 respectively have open and close gripping claws 244 and 247 for gripping the customer tray KST.
  • the holding heads 243 and 246 can respectively hold the two customer trays KST at the same time.
  • the number of customer trays KST that can be held simultaneously by the holding heads 243 and 246 is not particularly limited.
  • the first transfer arm 240 conveys the customer tray KST containing the IC device before the test from the pre-test stocker 211 to the first elevating device 220A, or from the first elevating device 220A to the storage plate 290.
  • the empty customer tray KST in which no IC device is accommodated is conveyed.
  • the first holding head 243 of the first transfer arm 240 conveys the customer tray containing the IC device before the test from the pre-test stocker 211 to the first lifting device 220A, and the second holding head. 246 transports an empty customer tray that does not contain an IC device from the first lifting device 220A to the storage plate 290.
  • the second transfer arm 250 includes two movable heads 260 and 270 provided on the X-axis rail 241 as shown in FIG.
  • the first and second movable heads 260 and 270 can be moved independently of each other along the X-axis direction by an actuator (not shown).
  • the movable heads 260 and 270 of the second moving arm 250 may be movable along the Y-axis direction.
  • the first movable head 260 includes a first base 261 provided on the X-axis rail 241 so as to be movable in the X-axis direction, a first Z-axis rail 262 fixed to the first base 261, and a Z-axis A first holding head 263 provided on the rail 262 so as to be movable along the Z-axis direction. In FIG. 9, the first holding head 263 is shown in a raised state.
  • the first holding head 263 can be moved along the Z-axis direction by an actuator (not shown). Further, the first holding head 263 has an openable first gripping claw 264 for gripping the customer tray KST downward. In the present embodiment, the first holding head 263 can grip two customer trays KST at the same time. The number of customer trays KST that can be simultaneously held by the first holding head 263 is not particularly limited.
  • the second movable head 270 also includes a second base 271 provided on the X-axis rail 241 so as to be movable along the X-axis direction, and a second Z-axis rail fixed to the second base 271. 272 and a second holding head 273 provided on the Z-axis rail 272 so as to be movable along the Z-axis direction. In FIG. 9, the second holding head 273 is shown in a lowered state.
  • the second holding head 273 can be moved along the Z-axis direction by an actuator (not shown). Further, the second holding head 273 has an openable first gripping claw 274 for gripping the customer tray KST downward. In the present embodiment, the second holding head 273 can simultaneously grip two customer trays KST. The number of customer trays KST that can be simultaneously gripped by the second holding head 273 is not particularly limited.
  • the second transfer arm 250 conveys an empty customer tray KST that does not contain an IC device from the storage plate 290 or the empty tray stocker 213 to the second lifting device 220B, or from the second lifting device 220B.
  • the customer tray KST containing the tested IC device is transported to the tested stocker 212.
  • the tray transfer device 230 is connected to the control device 280.
  • the control device 280 can control the operations of the first transfer arm 240 and the second transfer arm 250 by sending a control signal to each actuator (not shown) of the tray transfer device 230. Yes.
  • the lifting devices 220A and 220B are also connected to the control device 280.
  • the control device 280 sends a control signal to each actuator (not shown) of the lifting devices 220A and 220B, so that the lifting operation of the table 222 is performed. Can be controlled.
  • the tray transfer device 230 in the present embodiment has a height position at which the holding heads 243, 246, 263, and 273 can move horizontally without interfering with the table 222 of the elevating devices 220 ⁇ / b> A and 220 ⁇ / b> B.
  • M 1 and M 2 (hereinafter also simply referred to as movable positions M 1 and M 2 ).
  • the first movable position M 1 is lifting device 220A, is positioned between the first restricting position H 1 and second regulating position of H 2 220B.
  • the second movable position M 2 is lifting device 220A, is positioned between the second regulating position H 2 and stockers 211-213 of 220B.
  • a space having a size through which the holding heads 243, 246, 263, and 273 can pass is formed between the stockers 211 to 213 and the table 222 located at the second restriction position H2. ing.
  • both the holding heads 243, 246, 263, and 273 of the first transfer arm 240 and the second transfer arm 250 move in the horizontal direction at any movable position M 1 , M 2.
  • both the holding heads 243 and 246 are located at the first movable position M 1 (or the second movable position M 2 ), and the holding heads 243 and 246 are in the state. Is moved horizontally, or one holding head 243 is positioned at the first movable position M 1 (or the second movable position M 2 ) and the other holding head 246 is moved to the second movable position.
  • Both holding heads 243 and 246 can be moved in the horizontal direction while being positioned at M 2 (or the first movable position M 1 ).
  • the lifting device 220A while the 220B is moved up and down, the holding head 243,246,263,273 in the second movable position M 2 moves on the stocker 211-213 horizontally moved
  • the holding heads 243, 246, 263, and 273 can be moved horizontally regardless of the position of the table 222 of the elevating devices 220A and 220B.
  • the storage unit 200 includes a storage plate 290 for temporarily storing the customer tray KST.
  • the storage plate 290 is composed of a plate-like member, and the storage plate 290 can hold the customer tray KST only by placing the customer tray KST on the storage plate 290 by the tray transfer device 230. Yes.
  • the storage plate 290 in the present embodiment can hold six customer trays KST in a stacked manner. Note that the storage plate in the present invention is not particularly limited to a plate shape as long as the tray conveying means can be placed thereon.
  • the storage plate 290 is provided between the first movable position M 1 and the second movable position M 2 of the tray transfer device 230, and includes the first lifting device 220 A and the second lifting device. 220B and located above the stocker STK-3 of the tested stocker 212.
  • the moving distance of the customer tray KST by the first transfer arm 240 from the table 222 of the first lifting device 220A located at the second restriction position H2 to the storage table 290 is the table 222.
  • To the empty tray stocker 213 is relatively shorter than the moving distance of the customer tray by the first transfer arm 240.
  • the moving distance of the customer tray in the present invention includes moving distances in all directions.
  • FIG. 11 is an exploded perspective view of a test tray used in the electronic component testing apparatus of FIG.
  • the above-described customer tray KST is conveyed from the pre-test stocker 211 to the first lifting device 220A by the tray transfer device 230, and further opened to the main base 101 in the loader unit 300 by the first lifting device 220A. It is carried from the lower side of the main base 101 to the window portion 306 of the location.
  • the IC device loaded on the customer tray KST is once transferred to the precursor 305 by the device transport apparatus 310, where the mutual positional relationship between the IC devices is corrected. Thereafter, the IC device transferred to the precursor 305 is reloaded on the test tray TST stopped by the loader unit 300 by the device transport apparatus 310.
  • the test tray TST has a plurality of attachments on both sides of the crosspiece 13 and on the side 12 a of the frame 12 facing the crosspiece 13.
  • the pieces 14 are provided protruding at equal intervals.
  • An insert accommodating portion 15 is configured by the space between the rails 13 or between the rails 13 and the side 12 a and the two attachment pieces 14.
  • Each insert accommodating portion 15 can accommodate one insert 16, and this insert 16 is attached to two attachment pieces 14 in a floating state using fasteners 17. Therefore, attachment holes 19 for attaching the insert 16 to the attachment piece 14 are formed at both ends of the insert 16. As shown in FIG. 11, 64 of these inserts 16 are attached to one test tray TST and arranged in 4 rows and 16 columns.
  • inserts 16 have the same shape and the same dimensions, and an IC device is accommodated in each insert 16.
  • the device housing portion 18 of the insert 16 depends on the shape of the IC device to be housed, and is a rectangular recess in the example shown in FIG.
  • the loader unit 300 includes a device transfer device 310 that transfers IC devices from the customer tray KST to the test tray TST.
  • the device transport apparatus 310 includes two Y-axis rails 311 that are installed on the main base 101 along the Y-axis direction, an operation arm 312 that can move on the Y-axis rails 311 along the Y-axis direction,
  • the movable arm 312 is provided with a movable head 313 supported so as to be movable along the X-axis direction, and a plurality of suction pads (not shown) provided downward on the movable head 313. Each suction pad can be moved up and down by an actuator (not shown), and a plurality of IC devices can be transferred from the customer tray KST to the test tray TST at a time.
  • a precursor 305 is provided between the customer tray KST and the test tray TST.
  • the precursor 305 has a relatively deep recess, and the periphery of the recess is surrounded by an inclined surface. Therefore, before the IC device to be transferred from the customer tray KST to the test tray TST is moved to the test tray TST, the IC device is once dropped into the precursor 305 so that the mutual positional relationship of the IC devices can be accurately determined. Therefore, it is possible to accurately transfer the IC device to the test tray TST.
  • test tray TST When IC devices are accommodated in all the inserts 16 of the test tray TST, the test tray TST is carried into the chamber unit 100 by the tray circulation device 102.
  • the first lifting / lowering device 220A lowers the empty tray and delivers it to the first transfer arm 240 of the tray transfer device 230.
  • the first transfer arm 240 temporarily stores the empty tray in the storage plate 290.
  • the second transfer arm 240 of the tray transfer device 230 conveys the empty tray from the storage plate 290 to the second lifting device 220B. .
  • test tray TST is loaded into the chamber unit 100 after the IC devices are loaded by the loader unit 300, and each IC device is tested while being accommodated in the test tray TST.
  • the chamber unit 100 includes a soak chamber 110 that applies a target high-temperature or low-temperature heat stress to the IC device accommodated in the test tray TST, and the heat stress in the soak chamber 110.
  • a soak chamber 110 that applies a target high-temperature or low-temperature heat stress to the IC device accommodated in the test tray TST, and the heat stress in the soak chamber 110.
  • the soak chamber 110 protrudes upward from the test chamber 120 as shown in FIG.
  • a vertical transfer device is provided in the soak chamber 110, and a plurality of test trays TST are held by the vertical transfer device until the test chamber 120 is empty. Waiting while being. Mainly, thermal stress of about ⁇ 55 to + 155 ° C. is applied to the IC device during this standby.
  • a test head 5 is arranged in the center of the test chamber 120.
  • a test tray TST is carried above the test head 5 by a horizontal conveying device conceptually shown in FIG. 3, and an IC device is formed by a pressing device (not shown). Is pressed against the socket 50 on the test head 5. As a result, the input / output terminals of the IC device are brought into electrical contact with the contact pins of the socket 50. In this state, the tester 6 executes the test of the IC device via the test head 5.
  • the result of this test is stored in the storage device of the electronic component test apparatus in association with, for example, the identification number assigned to the test tray TST and the IC device number assigned in the test tray TST.
  • the unsoak chamber 130 also protrudes upward from the test chamber 110.
  • a vertical transfer device is provided in the interior.
  • the IC device when a high temperature is applied to the IC device in the soak chamber 110, the IC device is cooled to the room temperature by air blowing, and then the heat-removed IC device is carried out to the unloader unit 400.
  • the IC device when a low temperature is applied to the IC device in the soak chamber 110, the IC device is heated with warm air or a heater to return it to a temperature at which dew condensation does not occur, and then the removed IC device is unloaded. Carry out to 400.
  • An inlet for carrying the test tray TST from the main base 101 is formed in the upper part of the soak chamber 110.
  • an outlet for carrying out the test tray TST to the main base 101 is formed in the upper part of the unsoak chamber 130.
  • a tray circulation device 102 for taking the test tray TST out and in and out of the chamber unit 100 through these inlets and outlets is provided on the main base 101.
  • the tray circulation device 102 is configured to convey the test tray TST by, for example, a rotating roller. By this tray circulation device 102, the test tray TST carried out from the unsoak chamber 130 is returned to the soak chamber 110 via the unloader unit 400 and the loader unit 300.
  • the tested IC devices are transferred from the test tray TST carried out from the unsoak chamber 130 while being classified into customer trays KST corresponding to the test results.
  • five windows 406 are opened in the main base 101 in the unloader unit 400.
  • the customer tray KST carried from the storage part 200 by the 2nd lifting / lowering apparatus 220B is arrange
  • the unloader unit 400 includes two device classification devices 410 that transfer a tested IC device from the test tray TST to the customer tray KST. Similar to the device transport apparatus 310, the device classification apparatus 410 includes a Y-axis rail 411, a movable arm 412, and a movable head 413, and simultaneously loads a plurality of IC devices from the test tray TST to the customer tray KST. Is possible.
  • a second lifting device 202B for lifting and lowering the customer tray KST is provided below each window 406 .
  • the loaded customer tray KST loaded with the tested IC devices is loaded and lowered, and the second transfer arm 250 of the tray transfer device 230 receives the full tray, and the second transfer arm 250 The full tray is conveyed to the tested stocker 212 according to the test result.
  • the five window portions 406 are formed in the unloader portion 400, the five categories (test results) can be classified in real time.
  • the customer tray KST corresponding to 5 categories with high occurrence frequency is always positioned in the window 406, and the category with low occurrence frequency is placed in the buffer unit 405 (see FIG. 3).
  • the customer tray KST corresponding to the category may be temporarily stored and called to the window unit 406 at a predetermined timing.
  • FIGS. 13A to 13K are views of a customer tray transport method in the storage unit of the present embodiment. It is a schematic front view which shows two examples.
  • the shaded customer trays indicate trays that accommodate IC devices, and the non-shaded customer trays indicate empty trays that do not accommodate IC devices. .
  • the description in the figure and the following description do not limit the tray transfer source and transfer destination windows 306 and 406.
  • the customer tray is an empty tray KST e that does not contain an IC device.
  • the customer tray becomes empty tray KST e, as shown in FIG. 12B, descends first lifting device 220A that holds the empty tray KST e until second restricting position H 2.
  • the empty tray KST e is stacked on the customer tray KST f full of IC devices.
  • the first transfer arm 240 moves horizontally so that the second holding head 246 is positioned above the lowered first lifting device 220A. Then, as shown in FIG. 12D, the second holding head 246 descends to receive the empty tray KST e from the first lifting device 220A.
  • the full tray KSTf is exposed on the table 222 of the first lifting device 220A.
  • the first transfer arm 240 is horizontally moved a first movable position M 1 above, further, The second holding head 246 is lowered to place the empty tray KST e on the storage plate 290.
  • the first transfer arm 240 In the absence of the storage plate 290, the first transfer arm 240 must transport the empty tray KST e to the empty tray stocker 213. In contrast, in the present embodiment, by temporarily storing the empty tray KST e in storage plate 290, since the number of accesses to the stocker 211-213 of the first transfer arm 240 is reduced, the customer tray Exchange work can be shortened. If the storage plate 290 is full of customer trays, the first transfer arm 240 may move the empty tray KST e to the empty tray stocker 213.
  • the second holding head 246 of the first transfer arm 240 is raised to the first movable position M1, and as shown in FIG. 12H, the first transfer arm 240 is moved horizontally. It moves and retracts from above the storage plate 290 and the first lifting device 220A.
  • the first movable head 260 of the second transfer arm 250 moves horizontally on the first movable position M 1 and stops above the storage plate 290.
  • the 2nd raising / lowering apparatus 220B arrange
  • the customer tray held by the second lifting / lowering device 220B is fully loaded with IC devices by the device classification device 410 of the unloader unit 400, and becomes a full tray KST f .
  • the first holding head 263 of the first movable head 260 is lowered to receive the empty tray KST e from the storage plate 290. Further, the second lifting device 220B is lowered to the second regulation position H 2, the first lifting device 220A which has been lowered starts increasing.
  • the first holding head 263 of the first movable head 260 rises to a first movable position M 1.
  • the first elevating device 220 ⁇ / b> A moves up to the first restriction position H ⁇ b> 1 and the full tray KST f faces the loader unit 300 through the window unit 306.
  • the device transfer device 310 of the loader unit 300 resumes the reloading operation of the IC device before the test from the full tray KST f .
  • the first movable head 260 moves horizontally above the lowered second elevating device 220B, and the first holding head 263 descends to move to the second elevating device 220B.
  • the empty tray KST e is stacked on the full tray KST f originally held on the table 222 of the second lifting device 220.
  • a first holding head 263 is raised to the movable position M 1 first, the first movable head 260 is horizontally moved, lowered to have a second lifting device 220B Retreat from above.
  • the second lifting device 220B is first increased to the restricting position H 1, facing the unloader section 400 empty tray KST e via the window 406.
  • the device classification device 410 of the unloader unit 400 resumes loading of the tested IC device onto the empty tray KST e .
  • the empty tray is supplied from the empty tray stocker 213 to the second lifting device 220B by the first or second movable heads 260 and 270.
  • the customer tray KST r accommodating the required IC devices retested, the window 406 of the unloader section 400 by the tray transfer device 230, the window portion 306 of the loader unit 300 A method of transporting will be described.
  • FIGS. 13A to 13K show only the procedure for transporting the retest tray using the storage plate 290 extracted from the tray transporting operation.
  • the transfer arms 240 and 250 and the lifting / lowering devices 220A and 220B carry out a plurality of customer trays simultaneously and independently.
  • second tray from the second lifting device 220B of the table 222 located in the second regulating position H 2 until storage table 290
  • the moving distance of the retest tray by the transfer arm 250 may be relatively shorter than the moving distance of the retest tray by the second tray transfer arm 250 from the table 222 to the pre-test stocker 211.
  • the moving distance of the retest tray in the present invention includes moving distances in all directions.
  • the second lifting device 220B When an IC device that needs to be retested is loaded on the customer tray located in the first window 406 from the right in FIG. 13A, as shown in FIG. 13B, the second lifting device 220B lowered to the regulatory position H 2.
  • the retest tray KST r is stacked on an empty tray KST e that does not contain an IC device.
  • the first movable head 260 of the second transfer arm 250 moves horizontally above the lowered second elevating device 220A.
  • the second movable head 270 also moves horizontally in order to avoid interference with the first movable head 260.
  • the first holding head 263 of the first movable head 260 is lowered to receive the retest tray KST r from the second lifting device 220B.
  • the first holding head 263 is lowered to the second movable position M 2, placing the re-test trays KST r a storage plate 290.
  • the first lifting device 220A second from the right in FIG. 13E starts to descend.
  • the first lifting device 220A is thereby lowered to the second regulation position H 2
  • the first movable head 260 is raised to the movable position M 1 first.
  • the second lifting device 220B that has been lowered is raised to a first restricting position H 1.
  • the device transport apparatus 410 of the unloader unit 400 resumes loading of IC devices that require retesting into the empty tray KST e .
  • the first movable head 260 moves horizontally and retracts from above the storage plate 290. Further, the first transfer arm 240 moves in the horizontal direction so that the second holding head 246 is positioned above the storage plate 290.
  • the second holding head 246 descends and receives the retest tray KST r from the storage plate 290.
  • the first transfer arm 240 and the second transfer arm 250 must each access the tested stocker 212 that stores the retest tray.
  • by storing temporarily retested trays KST r in storage plate 290 since the number of accesses to the stocker is reduced, it is possible to shorten the replacement of the customer tray.
  • the first transfer arm 240 moves horizontally so as to be positioned above the first lifting device 220A.
  • the second holding head 246 is lowered to place the retest tray KST r on the table 222 of the first lifting device 220A.
  • the first lifting device 220A is first increased to the restricting position H 1, retest trays KST r faces the loader section 300 through the window 306.
  • Device conveying apparatus 310 of the loader unit 300 to re-test IC devices, reloading IC devices from retested tray KST r the test tray TST.
  • the first transfer arm 240 may move the retest KST r to the pre-test stocker 211. Further, by using the first holding head 243 of the first transfer arm 240 may carry a re-test tray TST r from storage plate 290 to the first lifting device 220A.
  • the customer tray KST is temporarily deposited in the storage plate 290, so that the number of accesses to the stockers 211 to 213 of the tray transfer device 230 can be reduced.
  • the customer tray KST replacement time in 406 can be shortened.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A tray conveying device comprises stockers (211-213) for storing customer trays (KST), lifting devices (220A, 220B) for lifting the held trays, a storage plate (290) for temporarily storing the customer trays (KST), transfer arms (240, 250) for transferring the customer trays (KST) between the stockers (211-213), the lifting devices (220A, 220B) and the storage plate (290), and a controller (280) for controlling the transfer arms (240, 250).

Description

トレイ搬送装置およびそれを備えた電子部品試験装置Tray transfer device and electronic component testing device including the same
　本発明は、半導体集積回路素子等の各種電子部品（以下、代表的にＩＣデバイスとも称する。）を収容可能なトレイを搬送するためのトレイ搬送装置、及び、それを備えた電子部品試験装置に関する。 The present invention relates to a tray transport apparatus for transporting a tray that can accommodate various electronic components (hereinafter also referred to as IC devices) such as semiconductor integrated circuit elements, and an electronic component test apparatus including the tray transport apparatus. .
　ＩＣデバイスの製造過程では、パッケージングされた状態でのＩＣデバイスの性能や機能を試験するために電子部品試験装置が用いられている。この電子部品試験装置を構成するハンドラ（Handler）は、ローダ部、チャンバ部、アンローダ部及び格納部を備えている。 In the manufacturing process of an IC device, an electronic component test apparatus is used to test the performance and function of the IC device in a packaged state. A handler constituting the electronic component testing apparatus includes a loader unit, a chamber unit, an unloader unit, and a storage unit.
　ローダ部は、カスタマトレイからテストトレイにＩＣデバイスを積み替えて、そのテストトレイをチャンバ部に搬入する。なお、カスタマトレイは、試験前或いは試験済みのＩＣデバイスを収容するトレイであり、試験前のＩＣデバイスは、カスタマトレイに収容された状態で前工程からハンドラに供給され、試験済みのＩＣデバイスは、カスタマトレイに収容された状態でハンドラから後工程に送り出される。一方、テストトレイは、ハンドラ内を循環搬送される専用のトレイである。 The loader unit reloads the IC device from the customer tray to the test tray, and loads the test tray into the chamber unit. The customer tray is a tray for storing a pre-test or a tested IC device. The pre-test IC device is supplied to the handler from the previous process while being stored in the customer tray. Then, it is sent out from the handler to the subsequent process while being accommodated in the customer tray. On the other hand, the test tray is a dedicated tray that is circulated and conveyed in the handler.
　チャンバ部は、テストトレイにＩＣデバイスを搭載した状態で、ＩＣデバイスに高温又は低温の熱ストレスを印加した後、テストヘッドに設けられたソケットにＩＣデバイスを押し付ける。この状態で、電子部品試験装置を構成するテスタ（Tester）が、テストヘッドを介して、ＩＣデバイスの試験を実施する。 The chamber portion applies a high or low temperature thermal stress to the IC device with the IC device mounted on the test tray, and then presses the IC device against the socket provided in the test head. In this state, a tester (Tester) constituting the electronic component testing apparatus performs a test of the IC device via the test head.
　アンローダ部は、試験済みのＩＣデバイスを収容したテストトレイをチャンバ部から搬出し、試験結果に応じたカスタマトレイにＩＣデバイスを載せ替えることで、良品や不良品といったカテゴリへの仕分けを行う。 The unloader unit sorts out the test tray containing the tested IC device from the chamber unit, and places the IC device on the customer tray according to the test result, thereby classifying the product into a category such as a non-defective product or a defective product.
　格納部は、試験前のＩＣデバイスを収容したカスタマトレイをローダ部に供給するとともに、試験済みのＩＣデバイスが収容されたカスタマトレイをアンローダ部から受け入れる。 The storage unit supplies the customer tray containing the IC device before the test to the loader unit, and accepts the customer tray containing the tested IC device from the unloader unit.
　この格納部は、複数のカスタマトレイを積層した状態で格納しているストッカと、カスタマトレイを上下動させることでローダ部やアンローダ部にカスタマトレイを供給・搬出する昇降装置と、ストッカと昇降装置との間でカスタマトレイを移送するトレイ移送装置と、を備えている。 The storage unit includes a stocker that stores a plurality of customer trays in a stacked state, a lifting device that feeds and unloads the customer tray to and from the loader unit and the unloader unit by moving the customer tray up and down, a stocker, and a lifting device And a tray transfer device for transferring the customer tray between the printer and the customer.
　昇降装置に載置されているカスタマトレイを交換する際、トレイ移送装置がストッカと昇降装置との間を往復移動しなければならないため、ネック工程になり易いという問題がある。特に、電子部品試験装置において同時に試験可能なＩＣデバイスの数（同時測定数）が増加すると、必然的にカスタマトレイの交換作業のスピードアップも要求されるため、この傾向は顕著となる。 When exchanging the customer tray mounted on the lifting device, the tray transfer device must reciprocate between the stocker and the lifting device, which is likely to cause a neck process. In particular, when the number of IC devices that can be simultaneously tested in the electronic component test apparatus (the number of simultaneous measurements) is inevitably increased, it is necessary to speed up the replacement operation of the customer tray, and this tendency becomes remarkable.
　本発明が解決しようとする課題は、交換作業の短縮化を図ることが可能なトレイ搬送装置及び電子部品試験装置を提供することである。 The problem to be solved by the present invention is to provide a tray conveying device and an electronic component testing device capable of shortening replacement work.
　本発明によれば、被試験電子部品を収容可能なトレイを搬送するためのトレイ搬送装置であって、前記トレイを格納する格納手段と、前記トレイを保持する保持手段と、前記トレイを一時的に保管する保管手段と、前記格納手段、前記保持手段、及び、前記保管手段の間で、前記トレイを搬送する少なくとも一つの搬送手段と、前記搬送手段の動作を制御する制御手段と、を備えたトレイ搬送装置が提供される（請求項１参照）。 According to the present invention, there is provided a tray transport apparatus for transporting a tray capable of accommodating an electronic device under test, the storage means storing the tray, the holding means holding the tray, and the tray temporarily. Storage means for storing the paper, at least one transport means for transporting the tray between the storage means, the holding means, and the storage means, and a control means for controlling the operation of the transport means. A tray transfer device is provided (see claim 1).
上記発明においては特に限定されないが、前記保管手段は、前記搬送手段が載置するだけで前記トレイを保持して一時的に保管することが可能な保管プレートであることが好ましい。 Although not particularly limited in the above invention, it is preferable that the storage means is a storage plate that can be temporarily stored by holding the tray only by being placed by the transport means.
　上記発明においては特に限定されないが、前記保持手段は、試験前の前記被試験電子部品を収容している試験前トレイを保持する第１の保持手段と、試験済みの前記被試験電子部品を収容している試験済トレイを保持する第２の保持手段と、を含み、前記保管手段は、前記第１の保持手段と前記第２の保持手段との間に配置されていることが好ましい（請求項２参照）。 Although not particularly limited in the above invention, the holding means contains a first holding means for holding a pre-test tray that contains the electronic device under test before testing, and houses the electronic device under test that has been tested. A second holding means for holding the tested tray, and the storage means is preferably disposed between the first holding means and the second holding means. Item 2).
　上記発明においては特に限定されないが、前記保持手段から前記保管手段までの前記搬送手段による前記トレイの移動距離は、前記保持手段から前記格納手段までの前記搬送手段による前記トレイの移動距離よりも短いことが好ましい（請求項３参照）。 Although not particularly limited in the above invention, the moving distance of the tray by the conveying means from the holding means to the storage means is shorter than the moving distance of the tray by the conveying means from the holding means to the storing means. It is preferable (see claim 3).
　上記発明においては特に限定されないが、前記格納手段は、試験前の前記被試験電子部品を収容した試験前トレイを格納する第１の格納手段と、試験済みの前記被試験電子部品を収容した試験済トレイを格納する第２の格納手段と、前記被試験電子部品を収容していない空トレイを格納する第３の格納手段と、を含むことが好ましい（請求項４参照）。 Although not particularly limited in the above invention, the storage means includes a first storage means for storing a pre-test tray containing the electronic device under test before testing, and a test containing the tested electronic device under test. It is preferable to include a second storing means for storing a finished tray and a third storing means for storing an empty tray that does not contain the electronic device under test (see claim 4).
　上記発明においては特に限定されないが、前記少なくとも一つの搬送手段は、前記トレイをそれぞれ独立して搬送することが可能である第１及び第２の搬送手段を含んでおり、前記制御手段は、前記第１の搬送手段が、前記第１の格納手段、前記第１の保持手段、前記保管手段及び第３の格納手段の間で、前記トレイを搬送し、前記第２の搬送手段が、前記保管手段、前記第２の保持手段、前記第２の格納手段、及び、前記第３の格納手段の間で、前記トレイを搬送するように、前記第１及び前記第２の搬送手段を制御することが好ましい（請求項５参照）。 Although not particularly limited in the above invention, the at least one transporting unit includes first and second transporting units capable of independently transporting the tray, and the control unit includes A first transport unit transports the tray between the first storage unit, the first holding unit, the storage unit, and a third storage unit, and the second transport unit performs the storage. Controlling the first and second transport means to transport the tray between the means, the second holding means, the second storage means, and the third storage means. Is preferable (see claim 5).
　上記発明においては特に限定されないが、前記制御手段は、前記第１の搬送手段が、試験前の前記被試験電子部品を収容した試験前トレイを、前記第１の格納手段から前記第１の保持手段に搬送し、試験前の前記被試験電子部品が空となった空トレイを、前記第１の保持手段から前記保管手段に搬送し、前記第２の搬送手段が、前記被試験電子部品を収容していない空トレイを、前記保管手段又は前記第３の格納手段から前記第２の保持手段に搬送し、試験済みの前記被試験電子部品を収容した試験済トレイを、前記第２の保持手段から前記第２の格納手段に搬送するように、前記第１及び前記第２の搬送手段を制御することが好ましい（請求項６参照）。 Although not particularly limited in the above invention, the control means may be configured such that the first transport means holds the pre-test tray storing the electronic device under test before the test from the first storage means to the first holding means. The empty tray in which the electronic device under test before being tested is emptied is conveyed from the first holding device to the storage device, and the second conveying device removes the electronic device under test. An empty tray that is not accommodated is transported from the storage means or the third storage means to the second holding means, and the tested tray that contains the tested electronic component to be tested is contained in the second holding means. It is preferable to control the first and second conveying means so as to convey from the means to the second storage means (see claim 6).
　上記発明においては特に限定されないが、前記制御手段は、前記第２の搬送手段が、試験済みの前記被試験電子部品を収容した試験済トレイを、前記第２の保持手段から前記保管手段に搬送し、前記第１の搬送手段が、前記試験済トレイを前記保管手段から前記第１の保持手段又は前記第１の格納手段に搬送するように、前記第１及び前記第２の搬送手段を制御することが好ましい（請求項７参照）。 Although not particularly limited in the above invention, the control means is configured such that the second transport means transports the tested tray containing the tested electronic components to be tested from the second holding means to the storage means. And the first transport means controls the first and second transport means so that the tested tray is transported from the storage means to the first holding means or the first storage means. It is preferable to do so (see claim 7).
　上記発明においては特に限定されないが、前記第１及び第２の保持手段は、前記トレイを第１の方向に沿って移動させることが可能であり、前記第１及び前記第２の搬送手段は、前記トレイを前記第１の方向、及び、前記第１の方向とは異なる第２の方向に沿って独立して移動させることが可能であり、前記第１、前記第２及び前記第３の格納手段は、前記第２の方向に沿って配置されており、前記第１及び第２の保持手段、並びに、前記保管手段は、前記第１～３の格納手段に対して、前記第１の方向に位置していることが好ましい（請求項８参照）。 Although not particularly limited in the above invention, the first and second holding means are capable of moving the tray along a first direction, and the first and second transport means are The tray can be moved independently along the first direction and a second direction different from the first direction, and the first, second and third storages are possible. The means is arranged along the second direction, and the first and second holding means and the storage means are arranged in the first direction with respect to the first to third storage means. It is preferable that it is located in (refer Claim 8).
　上記発明においては特に限定されないが、前記第１の搬送手段は、前記トレイを把持可能な複数の第１の把持部を有しており、前記複数の第１の把持部は、前記第１の方向に沿って独立して移動可能であると共に、前記第２の方向に沿って一体で移動可能であることが好ましい（請求項９参照）。 Although not particularly limited in the above invention, the first transport means has a plurality of first gripping portions capable of gripping the tray, and the plurality of first gripping portions are the first gripping portions. It is preferable that they can move independently along the direction and can move together along the second direction (see claim 9).
　上記発明においては特に限定されないが、前記第２の搬送手段は、前記トレイを把持可能な複数の第２の把持部を有しており、前記複数の第２の把持部は、前記第１及び前記第２の方向に沿ってそれぞれ独立して移動可能であることが好ましい（請求項１０参照）。 Although not particularly limited in the above invention, the second conveying means has a plurality of second gripping portions capable of gripping the tray, and the plurality of second gripping portions include the first and the second gripping portions. It is preferable that they can move independently along the second direction (see claim 10).
　上記発明においては特に限定されないが、前記第１及び前記第２の把持部はいずれも複数の前記トレイを把持可能であり、前記保管手段及び前記保持手段はいずれも複数の前記トレイを保持可能であることが好ましい（請求項１１参照）。 Although not particularly limited in the above invention, each of the first and second holding portions can hold a plurality of the trays, and each of the storage means and the holding means can hold a plurality of the trays. There is preferably (see claim 11).
　（２）本発明によれば、被試験電子部品の入出力端子をテストヘッドのコンタクト部に電気的に接触させて、前記被試験電子部品のテストを行うために用いられる電子部品試験装置であって、上記のトレイ搬送装置を備えた電子部品試験装置が提供される（請求項１２参照）。 (2) According to the present invention, there is provided an electronic component testing apparatus used for testing the electronic device under test by bringing an input / output terminal of the electronic device under test into electrical contact with a contact portion of a test head. Thus, an electronic component testing apparatus provided with the tray conveying device is provided (see claim 12).
　上記発明においては特に限定されないが、前記被試験電子部品を前記トレイから第２のトレイに積み替えるローダ部と、前記ローダ部から搬入された前記被試験電子部品を前記第２のトレイに搭載したままの状態で前記テストヘッドのコンタクト部に押し付けるテスト部と、試験結果に応じて、試験済みの前記被試験電子部品を前記第２のトレイから前記トレイに積み替えるアンローダ部と、を備えており、前記トレイ搬送装置は、試験前の前記被試験電子部品が収容された前記トレイを前記ローダ部に供給し、試験済みの前記被試験電子部品が収容された前記トレイを前記アンローダ部から受け取ることが好ましい（請求項１３参照）。 Although not particularly limited in the above invention, a loader unit for transferring the electronic device under test from the tray to the second tray, and the electronic device under test loaded from the loader unit are mounted on the second tray. A test part that is pressed against the contact part of the test head as it is, and an unloader part that reloads the tested electronic components from the second tray to the tray according to a test result. The tray conveying device supplies the tray in which the electronic device under test before testing is accommodated to the loader unit, and receives the tray in which the electronic device under test has been accommodated from the unloader unit. Is preferable (see claim 13).
　本発明では、トレイを保管手段に一時的に預けることで、格納手段への移動回数を低減することができるので、トレイの交換作業の短縮化を図ることができる。 In the present invention, by temporarily depositing the tray in the storage means, the number of times of movement to the storage means can be reduced, so that the tray replacement work can be shortened.
図１は、本発明の実施形態における電子部品試験装置を示す概略断面図である。FIG. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention. 図２は、図１の電子部品試験装置の斜視図である。FIG. 2 is a perspective view of the electronic component testing apparatus of FIG. 図３は、図１の電子部品試験装置におけるトレイの取り廻し方法を示す概念図である。FIG. 3 is a conceptual diagram showing a tray handling method in the electronic component testing apparatus of FIG. 図４は、図１の電子部品試験装置に用いられるストッカを示す分解斜視図である。FIG. 4 is an exploded perspective view showing a stocker used in the electronic component testing apparatus of FIG. 図５は、図１の電子部品試験装置に用いられるカスタマトレイを示す斜視図である。FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus of FIG. 図６は、図１の電子部品試験装置の格納部を示す正面図である。FIG. 6 is a front view showing a storage unit of the electronic component testing apparatus of FIG. 図７は、図６の格納部の側面図である。FIG. 7 is a side view of the storage unit of FIG. 図８は、図６の格納部におけるトレイ移送装置の第１の移送アームを示す正面図である。FIG. 8 is a front view illustrating a first transfer arm of the tray transfer device in the storage unit of FIG. 6. 図９は、図６の格納部におけるトレイ移送装置の第２の移送アームを示す正面図である。9 is a front view showing a second transfer arm of the tray transfer device in the storage unit of FIG. 図１０は、図１の電子部品試験装置の格納部の制御系を示すブロック図である。FIG. 10 is a block diagram showing a control system of the storage unit of the electronic component test apparatus of FIG. 図１１は、図１の電子部品試験装置に用いられるテストトレイの分解斜視図である。FIG. 11 is an exploded perspective view of a test tray used in the electronic component testing apparatus of FIG. 図１２Ａは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第１例を示す概略正面図（その１）である。FIG. 12A is a schematic front view (No. 1) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention. 図１２Ｂは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第１例を示す概略正面図（その２）である。FIG. 12B is a schematic front view (No. 2) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention. 図１２Ｃは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第１例を示す概略正面図（その３）である。FIG. 12C is a schematic front view (No. 3) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention. 図１２Ｄは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第１例を示す概略正面図（その４）である。FIG. 12D is a schematic front view (No. 4) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention. 図１２Ｅは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第１例を示す概略正面図（その５）である。FIG. 12E is a schematic front view (No. 5) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention. 図１２Ｆは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第１例を示す概略正面図（その６）である。FIG. 12F is a schematic front view (No. 6) illustrating a first example of a method for transporting a customer tray in the storage unit according to the embodiment of the present invention. 図１２Ｇは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第１例を示す概略正面図（その７）である。FIG. 12G is a schematic front view (No. 7) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention. 図１２Ｈは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第１例を示す概略正面図（その８）である。FIG. 12H is a schematic front view (No. 8) illustrating the first example of the customer tray conveying method in the storage unit according to the embodiment of the present invention. 図１２Ｉは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第１例を示す概略正面図（その９）である。FIG. 12I is a schematic front view (No. 9) illustrating the first example of the customer tray conveying method in the storage unit according to the embodiment of the present invention. 図１２Ｊは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第１例を示す概略正面図（その１０）である。FIG. 12J is a schematic front view (No. 10) illustrating a first example of a method for transporting a customer tray in the storage unit according to the embodiment of the present invention. 図１２Ｋは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第１例を示す概略正面図（その１１）である。FIG. 12K is a schematic front view (No. 11) illustrating a first example of a method for transporting a customer tray in the storage unit according to the embodiment of the present invention. 図１２Ｌは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第１例を示す概略正面図（その１２）である。FIG. 12L is a schematic front view (No. 12) illustrating a first example of a method for transporting a customer tray in the storage unit according to the embodiment of the present invention. 図１２Ｍは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第１例を示す概略正面図（その１３）である。FIG. 12M is a schematic front view (No. 13) illustrating a first example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention. 図１３Ａは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第２例を示す概略正面図（その１）である。FIG. 13A is a schematic front view (No. 1) illustrating a second example of a method of transporting a customer tray in the storage unit according to the embodiment of the present invention. 図１３Ｂは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第２例を示す概略正面図（その２）である。FIG. 13B is a schematic front view (No. 2) illustrating a second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention. 図１３Ｃは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第２例を示す概略正面図（その３）である。FIG. 13C is a schematic front view (No. 3) illustrating a second example of the customer tray transport method in the storage unit according to the embodiment of the present invention. 図１３Ｄは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第２例を示す概略正面図（その４）である。FIG. 13D is a schematic front view (No. 4) illustrating a second example of the customer tray transport method in the storage unit according to the embodiment of the present invention. 図１３Ｅは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第２例を示す概略正面図（その５）である。FIG. 13E is a schematic front view (No. 5) illustrating a second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention. 図１３Ｆは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第２例を示す概略正面図（その６）である。FIG. 13F is a schematic front view (No. 6) illustrating a second example of the customer tray transport method in the storage unit according to the embodiment of the present invention. 図１３Ｇは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第２例を示す概略正面図（その７）である。FIG. 13G is a schematic front view (No. 7) illustrating the second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention. 図１３Ｈは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第２例を示す概略正面図（その８）である。FIG. 13H is a schematic front view (No. 8) illustrating the second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention. 図１３Ｉは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第２例を示す概略正面図（その９）である。FIG. 13I is a schematic front view (No. 9) illustrating a second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention. 図１３Ｊは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第２例を示す概略正面図（その１０）である。FIG. 13J is a schematic front view (No. 10) illustrating a second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention. 図１３Ｋは、本発明の実施形態の格納部におけるカスタマトレイの搬送方法の第２例を示す概略正面図（その１１）である。FIG. 13K is a schematic front view (No. 11) illustrating a second example of the customer tray conveying method in the storage unit according to the embodiment of the present invention.
符号の説明Explanation of symbols
１…ハンドラ
　２００…格納部
　　２１１～２１３…ストッカ
　　２２０Ａ，２２０Ｂ…昇降装置
　　　２２２…テーブル
　　２３０…トレイ移送装置
　　　　２３１…Ｘ軸レール
　　　２４０…第１の移送アーム
　　　　２４３…第１の保持ヘッド
　　　　２４６…第２の保持ヘッド
　　　２５０…第２の移送アーム
　　　　２６０…第１の可動ヘッド
　　　　　２６３…第１の保持ヘッド
　　　　２７０…第２の可動ヘッド
　　　　　２７３…第２の保持ヘッド
　　２８０…制御装置
　　２９０…保管プレート
　３００…ローダ部
　　３０６…窓部
　４００…アンローダ部
　　４０６…窓部 DESCRIPTION OF SYMBOLS 1 ... Handler 200 ... Storage part 211-213 ... Stocker 220A, 220B ... Elevating device 222 ... Table 230 ... Tray transfer device 231 ... X axis rail 240 ... 1st transfer arm 243 ... 1st holding head 246 ... 2nd Holding head 250 ... second transfer arm 260 ... first movable head 263 ... first holding head 270 ... second movable head 273 ... second holding head 280 ... control device 290 ... storage plate 300 ... loader unit 306 ... window 400 ... unloader 406 ... window
　以下、本発明の実施形態を図面に基づいて説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
　図１は本実施形態における電子部品試験装置を示す概略断面図、図２は図１の電子部品試験装置の斜視図、図３は図１の電子部品試験装置におけるトレイの取り廻し方法を示す概念図である。 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to the present embodiment, FIG. 2 is a perspective view of the electronic component testing apparatus of FIG. 1, and FIG. 3 is a concept showing a tray handling method in the electronic component testing apparatus of FIG. FIG.
　なお、図３は電子部品試験装置におけるトレイの取り廻し方法を理解するための図であり、実際には上下方向に並んで配置されている部材を平面的に示した部分もある。従って、その機械的（三次元的）構造は図２を参照して説明する。 Note that FIG. 3 is a view for understanding the tray handling method in the electronic component testing apparatus, and there is actually a portion in which the members arranged in the vertical direction are shown in a plan view. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.
　本実施形態における電子部品試験装置は、ＩＣデバイスに高温又は低温の熱ストレスを印加した状態でＩＣデバイスが適切に動作するか否かを試験（検査）し、当該試験結果に基づいてＩＣデバイスを分類する装置であり、ハンドラ１、テストヘッド５及びテスタ６から構成されている。この電子部品試験装置によるＩＣデバイスのテストは、カスタマトレイＫＳＴからテストトレイＴＳＴにＩＣデバイスを載せ替え、テストトレイＴＳＴに搭載した状態で実施される。 The electronic component test apparatus according to the present embodiment tests (inspects) whether or not the IC device properly operates in a state where a high-temperature or low-temperature thermal stress is applied to the IC device, and the IC device is determined based on the test result. It is an apparatus for classifying, and includes a handler 1, a test head 5, and a tester 6. The test of the IC device by the electronic component test apparatus is performed in a state where the IC device is transferred from the customer tray KST to the test tray TST and mounted on the test tray TST.
　本実施形態におけるハンドラ１は、図１～図３に示すように、試験前或いは試験済みのＩＣデバイスを収容したカスタマトレイＫＳＴを格納する格納部２００と、格納部２００から供給されたカスタマトレイＫＳＴからテストトレイＴＳＴにＩＣデバイスを載せ替えて、そのテストトレイＴＳＴをチャンバ部１００に送り込むローダ部３００と、ＩＣデバイスに所定の熱ストレスを印加し、テストトレイＴＳＴに収容したままの状態でＩＣデバイスをテストヘッド５に押し付けるチャンバ部１００と、試験済みのＩＣデバイスをチャンバ部１００から搬出し、テストトレイＴＳＴからカスタマトレイＫＳＴに分類しながら載せ替えるアンローダ部４００と、から構成されている。 As shown in FIGS. 1 to 3, the handler 1 in this embodiment includes a storage unit 200 that stores a customer tray KST that contains a pre-test or a tested IC device, and a customer tray KST supplied from the storage unit 200. The IC device is mounted on the test tray TST, and the IC device is loaded in the test tray TST while applying a predetermined thermal stress to the loader unit 300 for feeding the test tray TST to the chamber unit 100 and the IC device. Are pressed against the test head 5, and an unloader unit 400 that unloads tested IC devices from the chamber unit 100 and replaces them while classifying them from the test tray TST to the customer tray KST.
　テストヘッド５の上部に装着されているソケット５０は、図１に示すケーブル７を通じてテスタ６に接続されている。ＩＣデバイスのテスト時には、ソケット５０に電気的に接続されたＩＣデバイスが、ケーブル７を介してテスタ６に接続され、ＩＣデバイスとテスタ６との間で試験信号の授受を行う。図１に示すように、ハンドラ１の下部に空間８が形成されており、この空間８にテストヘッド５が交換可能に配置され、ハンドラ１のメインベース（基台）１０１に形成された開口１０１ａを介して、ＩＣデバイスとテストヘッド５上のソケット５０とを電気的に接触させることが可能となっている。ＩＣデバイスの品種交換の際には、テストヘッド５上のソケット５０を、交換後の品種に適したソケットに交換する。 The socket 50 mounted on the top of the test head 5 is connected to the tester 6 through the cable 7 shown in FIG. When testing the IC device, the IC device electrically connected to the socket 50 is connected to the tester 6 via the cable 7, and a test signal is exchanged between the IC device and the tester 6. As shown in FIG. 1, a space 8 is formed in the lower portion of the handler 1, and the test head 5 is replaceably disposed in the space 8, and an opening 101 a formed in the main base (base) 101 of the handler 1. The IC device and the socket 50 on the test head 5 can be brought into electrical contact with each other. When changing the type of IC device, the socket 50 on the test head 5 is replaced with a socket suitable for the type after replacement.
　以下に、ハンドラ１の各部について詳述する。 Below, each part of the handler 1 will be described in detail.
　＜格納部２００＞
　図４は図１の電子部品試験装置に用いられるストッカを示す分解斜視図、図５は図１の電子部品試験装置に用いられるカスタマトレイを示す斜視図、図６は図１の電子部品試験装置の格納部を示す正面図、図７は図６の格納部の側面図、図８は図６の格納部におけるトレイ移送装置の第１の移送アームを示す正面図、図９は図６の格納部におけるトレイ移送装置の第２の移送アームを示す正面図、図１０は図１の電子部品試験装置の格納部の制御系を示すブロック図である。 <Storage unit 200>
4 is an exploded perspective view showing a stocker used in the electronic component testing apparatus of FIG. 1, FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus of FIG. 1, and FIG. 6 is an electronic component testing apparatus of FIG. 7 is a side view of the storage unit of FIG. 6, FIG. 8 is a front view of the first transfer arm of the tray transfer device in the storage unit of FIG. 6, and FIG. 9 is the storage of FIG. FIG. 10 is a block diagram showing a control system of a storage unit of the electronic component test apparatus of FIG. 1.
　格納部２００は、図２及び図６に示すように、カスタマトレイＫＳＴを格納するストッカ２１１～２１３と、カスタマトレイＫＳＴを保持可能であるとともに昇降可能な昇降装置２２０Ａ，２２０Ｂと、ストッカ２１１～２１３と昇降装置２２０Ａ，２２０Ｂとの間でカスタマトレイＫＳＴを搬送するトレイ移送装置２３０と、を備えている。 As shown in FIGS. 2 and 6, the storage unit 200 includes stockers 211 to 213 for storing customer trays KST, lifting devices 220A and 220B that can hold the customer trays KST and can be lifted and lowered, and stockers 211 to 213. And a tray transfer device 230 that conveys the customer tray KST between the lifting devices 220A and 220B.
　図２及び図３に示すように、格納部２００には、試験前のＩＣデバイスを収容したカスタマトレイＫＳＴを格納する試験前ストッカ２１１と、試験結果に応じて分類されたＩＣデバイスを収容したカスタマトレイＫＳＴを格納する試験済ストッカ２１２と、ＩＣデバイスを収容していない空のカスタマトレイＫＳＴを格納する空トレイストッカ２１３と、が設けられている。 As shown in FIGS. 2 and 3, the storage unit 200 includes a pre-test stocker 211 that stores a customer tray KST containing pre-test IC devices, and a customer that contains IC devices classified according to test results. A tested stocker 212 for storing the tray KST and an empty tray stocker 213 for storing an empty customer tray KST that does not contain an IC device are provided.
　これらのストッカ２１１～２１３は、図４に示すように、枠状のトレイ支持枠２１４と、このトレイ支持枠２１４の下部から進入して昇降可能となっているエレベータ２１５と、を備えている。トレイ支持枠２１４には、カスタマトレイＫＳＴが複数積み重ねられて収容されており、この積み重ねられたカスタマトレイＫＳＴがエレベータ２１５によって上下に移動するようになっている。 As shown in FIG. 4, these stockers 211 to 213 include a frame-like tray support frame 214 and an elevator 215 that can be moved up and down by entering from the lower part of the tray support frame 214. A plurality of customer trays KST are stacked and accommodated in the tray support frame 214, and the stacked customer trays KST are moved up and down by an elevator 215.
　本実施形態では、カスタマトレイＫＳＴは、図５に示すように、ＩＣデバイスを収容するための６０個の収容部９１が１０行×６列に配列されているが、実際には、ＩＣデバイスの品種に応じて様々な配列のバリエーションが存在する。 In the present embodiment, as shown in FIG. 5, in the customer tray KST, 60 accommodating portions 91 for accommodating IC devices are arranged in 10 rows × 6 columns. There are various arrangement variations depending on the variety.
　ストッカ２１１～２１３は、同一構造となっているので、試験前ストッカ２１１、試験済ストッカ２１２及び空トレイストッカ２１３のそれぞれの数を、必要に応じて適宜数に設定することができる。 Since the stockers 211 to 213 have the same structure, the numbers of the pre-test stocker 211, the tested stocker 212, and the empty tray stocker 213 can be appropriately set as necessary.
　本実施形態では、図２に示すように、試験前ストッカ２１１、試験済ストッカ２１２及び空トレイストッカ２１３がＸ軸方向に並んで配列されている。図２及び図３に示すように、試験前ストッカ２１１として、１つのストッカＳＴＫ－Ｂが格納部２００に設けられている。一方、試験済ストッカ２１２として、７つのストッカＳＴＫ－１，ＳＴＫ－２，・・・，ＳＴＫ－７が格納部２００に設けられており、試験結果に応じて最大７つの分類に仕分けして格納できるように構成されている。つまり、良品と不良品の区別のほかに、良品の中でも動作速度が高速なもの、中速なもの、低速なもの、或いは、不良の中でも再試験が必要なもの等を仕分けすることが可能となっている。 In this embodiment, as shown in FIG. 2, the pre-test stocker 211, the tested stocker 212, and the empty tray stocker 213 are arranged side by side in the X-axis direction. As shown in FIGS. 2 and 3, one stocker STK-B is provided in the storage unit 200 as the pre-test stocker 211. On the other hand, seven stockers STK-1, STK-2,..., STK-7 are provided in the storage unit 200 as the tested stockers 212, and are sorted and stored in up to seven categories according to the test results. It is configured to be able to. In other words, in addition to distinguishing between non-defective products and defective products, it is possible to sort non-defective products that have a high operating speed, medium-speed products, low-speed products, or defective products that require retesting. It has become.
　また、空トレイストッカ２１３として、２つのストッカＳＴＫ－ＥがＳＴＫ－４とＳＴＫ－５との間に設けられている。このストッカＳＴＫ－Ｅには、アンローダ部４００に開口している窓部４０６に送られる空のカスタマトレイＫＳＴが積み重ねられている。 Also, as the empty tray stocker 213, two stockers STK-E are provided between STK-4 and STK-5. In this stocker STK-E, empty customer trays KST to be sent to the window part 406 opened in the unloader part 400 are stacked.
　本実施形態における電子部品試験装置は、図６に示すように、２台の第１の昇降装置２２０Ａと、５台の第２の昇降装置２２０Ｂと、を備えている。第１の昇降装置２２０Ａは、ローダ部３００においてメインベース１０１に開口している２箇所の窓部３０６にそれぞれ１つずつ配置されている。一方、第２の昇降装置２２０Ｂは、アンローダ部４００においてメインベース１０１に開口している５箇所の窓部４０６にそれぞれ１つずつ配置されている。 As shown in FIG. 6, the electronic component testing apparatus according to this embodiment includes two first lifting devices 220A and five second lifting devices 220B. The first lifting / lowering device 220 </ b> A is disposed in each of the two window portions 306 opened in the main base 101 in the loader unit 300. On the other hand, one second lifting device 220B is disposed in each of the five window portions 406 opened in the main base 101 in the unloader portion 400.
　昇降装置２２０Ａ，２２０Ｂはいずれも、図７に示すように、メインベース１０１から垂下するように設けられたＺ軸レール２１１と、このＺ軸レール２２１に昇降可能に設けられているテーブル２２２と、から構成されており、特に図示しないアクチュエータにより、テーブル２２２が第１の規制位置Ｈ１と第２の規制位置Ｈ２との間を昇降することが可能となっている。 As shown in FIG. 7, each of the lifting devices 220 </ b> A and 220 </ b> B includes a Z-axis rail 211 provided so as to hang from the main base 101, and a table 222 provided on the Z-axis rail 221 so as to be able to be raised and lowered It is composed of, in particular an actuator (not shown), the table 222 it is possible to lift between the first restricting position H 1 and the second regulation position H 2.
　第１の規制位置Ｈ１は、テーブル２２２のＺ軸方向の上限であり、この第１の規制位置Ｈ１にテーブル２２２が位置すると、窓部３０６（又は窓部４０６）を介して、カスタマトレイＫＳＴがローダ部３００（又はアンローダ部４００）に臨むようになっている。 First restricting position H 1 is the upper limit of the Z-axis direction of the table 222, the table 222 to the restricting position H 1 of the first is located, via the window 306 (or the window 406), customer tray The KST faces the loader unit 300 (or the unloader unit 400).
　これに対し、第２の規制位置Ｈ２は、テーブル２２２のＺ軸方向の下限であり、この第２の規制位置Ｈ２にテーブル２２２が位置した状態で、トレイ移送装置２３０との間でカスタマトレイＫＳＴの受け渡しが行われる。 In contrast, the second restricting position H 2 is the lower limit in the Z-axis direction of the table 222, in a state where the table 222 is positioned at the restricting position of H 2 the second, customer between the tray transfer apparatus 230 The tray KST is delivered.
　このように、昇降装置２２０Ａ，２２０Ｂは、テーブル２２２上にカスタマトレイＫＳＴを保持して昇降することで、格納部２００とローダ部３００（又はアンローダ部４００）との間でカスタマトレイＫＳＴを移動させることが可能となっている。 As described above, the lifting devices 220A and 220B move the customer tray KST between the storage unit 200 and the loader unit 300 (or the unloader unit 400) by holding and lifting the customer tray KST on the table 222. It is possible.
　トレイ移送装置２３０は、図６及び図７に示すように、メインベース１０１とストッカ２１１～２１３との間にＸ軸方向に沿って架設されたＸ軸レール２３１と、このＸ軸レール２３１に設けられた第１の移送アーム２４０及び第２の移送アーム２５０と、を備えている。第１の移送アーム２４０及び第２の移送アーム２５０は、特に図示しないアクチュエータにより、Ｘ軸方向に沿ってそれぞれ独立してＸ軸レール２３１上を移動することが可能となっている。 As shown in FIGS. 6 and 7, the tray transfer device 230 includes an X-axis rail 231 installed along the X-axis direction between the main base 101 and the stockers 211 to 213, and is provided on the X-axis rail 231. The first transfer arm 240 and the second transfer arm 250 are provided. The first transfer arm 240 and the second transfer arm 250 can move on the X-axis rail 231 independently along the X-axis direction by an actuator (not shown).
　第１の移送アーム２４０は、図８に示すように、Ｘ軸レール２４１にＸ軸方向に移動可能に設けられたベース２４１と、ベース２４１に固定された２つのＺ軸レール２４２，２４５と、Ｚ軸レール２４２，２４５上にそれぞれＺ軸方向に沿って移動可能に設けられた２つの保持ヘッド２４３，２４６と、を備えている。なお、図８において、第１の保持ヘッド２４３が下降した状態で図示され、第２の保持ヘッド２４６が上昇した状態で図示されている。なお、この第１の移動アーム２４０をＹ軸方向に沿って移動可能としてもよい。 As shown in FIG. 8, the first transfer arm 240 includes a base 241 provided on the X-axis rail 241 so as to be movable in the X-axis direction, two Z- axis rails 242 and 245 fixed to the base 241, Two holding heads 243 and 246 are provided on the Z- axis rails 242 and 245 so as to be movable along the Z-axis direction, respectively. In FIG. 8, the first holding head 243 is shown in a lowered state, and the second holding head 246 is shown in a raised state. Note that the first moving arm 240 may be movable along the Y-axis direction.
　各保持ヘッド２４３，２４６は、特に図示しないアクチュエータにより、Ｚ軸方向に沿って相互に独立して移動することが可能になっている。なお、２つの保持ヘッド２４３，２４６は、Ｚ軸レール２４２，２４５を介して、同一のベース２４１に取り付けられているため、水平方向には独立して移動することはできない。 The holding heads 243 and 246 can be moved independently along the Z-axis direction by an actuator (not shown). Since the two holding heads 243 and 246 are attached to the same base 241 via the Z- axis rails 242 and 245, they cannot move independently in the horizontal direction.
　また、保持ヘッド２４３，２４６は、カスタマトレイＫＳＴを把持するための開閉式の把持爪２４４，２４７を下向きにそれぞれ有している。本実施形態では、保持ヘッド２４３，２４６は、２枚のカスタマトレイＫＳＴを同時に把持することがそれぞれ可能となっている。なお、保持ヘッド２４３，２４６が同時に把持可能なカスタマトレイＫＳＴの枚数は特に限定されない。 Further, the holding heads 243 and 246 respectively have open and close gripping claws 244 and 247 for gripping the customer tray KST. In this embodiment, the holding heads 243 and 246 can respectively hold the two customer trays KST at the same time. The number of customer trays KST that can be held simultaneously by the holding heads 243 and 246 is not particularly limited.
　この第１の移送アーム２４０は、試験前ストッカ２１１から第１の昇降装置２２０Ａに、試験前のＩＣデバイスが収容されたカスタマトレイＫＳＴを搬送したり、第１の昇降装置２２０Ａから保管プレート２９０に、ＩＣデバイスが収容されていない空のカスタマトレイＫＳＴを搬送する。 The first transfer arm 240 conveys the customer tray KST containing the IC device before the test from the pre-test stocker 211 to the first elevating device 220A, or from the first elevating device 220A to the storage plate 290. The empty customer tray KST in which no IC device is accommodated is conveyed.
　通常は、第１の移送アーム２４０の第１の保持ヘッド２４３が、試験前ストッカ２１１から第１の昇降装置２２０Ａに、試験前のＩＣデバイスを収容したカスタマトレイを搬送し、第２の保持ヘッド２４６が、第１の昇降装置２２０Ａから保管プレート２９０に、ＩＣデバイスを収容していない空のカスタマトレイを搬送する。 Normally, the first holding head 243 of the first transfer arm 240 conveys the customer tray containing the IC device before the test from the pre-test stocker 211 to the first lifting device 220A, and the second holding head. 246 transports an empty customer tray that does not contain an IC device from the first lifting device 220A to the storage plate 290.
　一方、第２の移送アーム２５０は、図９に示すように、Ｘ軸レール２４１に設けられた２つの可動ヘッド２６０，２７０を備えている。この第１及び第２の可動ヘッド２６０，２７０は、特に図示しないアクチュエータにより、Ｘ軸方向に沿って相互に独立して移動することが可能となっている。なお、この第２の移動アーム２５０の各可動ヘッド２６０，２７０をＹ軸方向に沿って移動可能としてもよい。 On the other hand, the second transfer arm 250 includes two movable heads 260 and 270 provided on the X-axis rail 241 as shown in FIG. The first and second movable heads 260 and 270 can be moved independently of each other along the X-axis direction by an actuator (not shown). The movable heads 260 and 270 of the second moving arm 250 may be movable along the Y-axis direction.
　第１の可動ヘッド２６０は、Ｘ軸方向に移動可能にＸ軸レール２４１に設けられた第１のベース２６１と、第１のベース２６１に固定された第１のＺ軸レール２６２と、Ｚ軸レール２６２上にＺ軸方向に沿って移動可能に設けられた第１の保持ヘッド２６３と、を備えている。なお、図９において、第１の保持ヘッド２６３は上昇した状態で図示されている。 The first movable head 260 includes a first base 261 provided on the X-axis rail 241 so as to be movable in the X-axis direction, a first Z-axis rail 262 fixed to the first base 261, and a Z-axis A first holding head 263 provided on the rail 262 so as to be movable along the Z-axis direction. In FIG. 9, the first holding head 263 is shown in a raised state.
　第１の保持ヘッド２６３は、特に図示しないアクチュエータにより、Ｚ軸方向に沿って移動することが可能となっている。また、この第１の保持ヘッド２６３は、カスタマトレイＫＳＴを把持するための開閉式の第１の把持爪２６４を下向きに有している。本実施形態では、第１の保持ヘッド２６３は、２枚のカスタマトレイＫＳＴを同時に把持することが可能となっている。なお、第１の保持ヘッド２６３が同時に把持可能なカスタマトレイＫＳＴの枚数は特に限定されない。 The first holding head 263 can be moved along the Z-axis direction by an actuator (not shown). Further, the first holding head 263 has an openable first gripping claw 264 for gripping the customer tray KST downward. In the present embodiment, the first holding head 263 can grip two customer trays KST at the same time. The number of customer trays KST that can be simultaneously held by the first holding head 263 is not particularly limited.
　同様に、第２の可動ヘッド２７０も、Ｘ軸方向に沿って移動可能にＸ軸レール２４１に設けられた第２のベース２７１と、第２のベース２７１に固定された第２のＺ軸レール２７２と、Ｚ軸レール２７２上にＺ軸方向に沿って移動可能に設けられた第２の保持ヘッド２７３と、を備えている。なお、図９において、第２の保持ヘッド２７３は下降した状態で図示されている。 Similarly, the second movable head 270 also includes a second base 271 provided on the X-axis rail 241 so as to be movable along the X-axis direction, and a second Z-axis rail fixed to the second base 271. 272 and a second holding head 273 provided on the Z-axis rail 272 so as to be movable along the Z-axis direction. In FIG. 9, the second holding head 273 is shown in a lowered state.
　第２の保持ヘッド２７３は、特に図示しないアクチュエータにより、Ｚ軸方向に沿って移動することが可能となっている。また、この第２の保持ヘッド２７３は、カスタマトレイＫＳＴを把持するための開閉式の第１の把持爪２７４を下向きに有している。本実施形態では、第２の保持ヘッド２７３は、２枚のカスタマトレイＫＳＴを同時に把持することが可能となっている。なお、第２の保持ヘッド２７３が同時に把持可能なカスタマトレイＫＳＴの枚数は特に限定されない。 The second holding head 273 can be moved along the Z-axis direction by an actuator (not shown). Further, the second holding head 273 has an openable first gripping claw 274 for gripping the customer tray KST downward. In the present embodiment, the second holding head 273 can simultaneously grip two customer trays KST. The number of customer trays KST that can be simultaneously gripped by the second holding head 273 is not particularly limited.
　この第２の移送アーム２５０は、保管プレート２９０や空トレイストッカ２１３から第２の昇降装置２２０Ｂに、ＩＣデバイスを収容していない空のカスタマトレイＫＳＴを搬送したり、第２の昇降装置２２０Ｂから試験済ストッカ２１２に、試験済みのＩＣデバイスを収容したカスタマトレイＫＳＴを搬送する。 The second transfer arm 250 conveys an empty customer tray KST that does not contain an IC device from the storage plate 290 or the empty tray stocker 213 to the second lifting device 220B, or from the second lifting device 220B. The customer tray KST containing the tested IC device is transported to the tested stocker 212.
　図１０に示すように、トレイ移送装置２３０は、制御装置２８０に接続されている。制御装置２８０は、トレイ移送装置２３０の有する各アクチュエータ（不図示）に制御信号を送出することで、第１の移送アーム２４０及び第２の移送アーム２５０の動作を制御することが可能となっている。 As shown in FIG. 10, the tray transfer device 230 is connected to the control device 280. The control device 280 can control the operations of the first transfer arm 240 and the second transfer arm 250 by sending a control signal to each actuator (not shown) of the tray transfer device 230. Yes.
　また、昇降装置２２０Ａ，２２０Ｂもこの制御装置２８０に接続されており、制御装置２８０が、昇降装置２２０Ａ，２２０Ｂの有する各アクチュエータ（不図示）に制御信号を送出することで、テーブル２２２の昇降動作を制御することが可能となっている。 The lifting devices 220A and 220B are also connected to the control device 280. The control device 280 sends a control signal to each actuator (not shown) of the lifting devices 220A and 220B, so that the lifting operation of the table 222 is performed. Can be controlled.
　本実施形態におけるトレイ移送装置２３０は、図６及び図７に示すように、昇降装置２２０Ａ，２２０Ｂのテーブル２２２に干渉せずに保持ヘッド２４３，２４６，２６３，２７３が水平移動可能な高さ位置Ｍ１，Ｍ２（以下、単に、移動可能位置Ｍ１，Ｍ２とも称する。）を有している。第１の移動可能位置Ｍ１は、昇降装置２２０Ａ，２２０Ｂの第１の規制位置Ｈ１と第２の規制位置Ｈ２との間に位置している。これに対し、第２の移動可能位置Ｍ２は、昇降装置２２０Ａ，２２０Ｂの第２の規制位置Ｈ２とストッカ２１１～２１３との間に位置している。本実施形態では、ストッカ２１１～２１３と、第２の規制位置Ｈ２に位置しているテーブル２２２との間に、保持ヘッド２４３，２４６，２６３，２７３が通過可能な大きさの空間が形成されている。 As shown in FIGS. 6 and 7, the tray transfer device 230 in the present embodiment has a height position at which the holding heads 243, 246, 263, and 273 can move horizontally without interfering with the table 222 of the elevating devices 220 </ b> A and 220 </ b> B. M 1 and M 2 (hereinafter also simply referred to as movable positions M 1 and M 2 ). The first movable position M 1 is lifting device 220A, is positioned between the first restricting position H 1 and second regulating position of H 2 220B. In contrast, the second movable position M 2 is lifting device 220A, is positioned between the second regulating position H 2 and stockers 211-213 of 220B. In the present embodiment, a space having a size through which the holding heads 243, 246, 263, and 273 can pass is formed between the stockers 211 to 213 and the table 222 located at the second restriction position H2. ing.
　本実施形態では、第１の移送アーム２４０も第２の移送アーム２５０も、いずれの保持ヘッド２４３，２４６，２６３，２７３が、いずれの移動可能位置Ｍ１，Ｍ２でも水平方向に移動することが可能となっている。特に、第１の移送アーム２４０では、両方の保持ヘッド２４３，２４６を第１の移動可能位置Ｍ１（又は第２の移動可能位置Ｍ２）に位置させた状態で、当該保持ヘッド２４３，２４６を水平方向に移動させたり、一方の保持ヘッド２４３を第１の移動可能位置Ｍ１（又は第２の移動可能位置Ｍ２）に位置させるとともに、他方の保持ヘッド２４６を第２の移動可能位置Ｍ２（又は第１の移動可能位置Ｍ１）に位置させた状態で、両方の保持ヘッド２４３，２４６を水平方向に移動させることが可能となっている。 In this embodiment, both the holding heads 243, 246, 263, and 273 of the first transfer arm 240 and the second transfer arm 250 move in the horizontal direction at any movable position M 1 , M 2. Is possible. In particular, in the first transfer arm 240, both the holding heads 243 and 246 are located at the first movable position M 1 (or the second movable position M 2 ), and the holding heads 243 and 246 are in the state. Is moved horizontally, or one holding head 243 is positioned at the first movable position M 1 (or the second movable position M 2 ) and the other holding head 246 is moved to the second movable position. Both holding heads 243 and 246 can be moved in the horizontal direction while being positioned at M 2 (or the first movable position M 1 ).
　また、例えば、昇降装置２２０Ａ，２２０Ｂが昇降動作している間に、第２の移動可能位置Ｍ２において保持ヘッド２４３，２４６，２６３，２７３が水平移動してストッカ２１１～２１３上を移動することができ、昇降装置２２０Ａ，２２０Ｂのテーブル２２２の位置に関わらず、保持ヘッド２４３，２４６，２６３，２７３を水平移動させることが可能となっている。 Further, for example, the lifting device 220A, while the 220B is moved up and down, the holding head 243,246,263,273 in the second movable position M 2 moves on the stocker 211-213 horizontally moved The holding heads 243, 246, 263, and 273 can be moved horizontally regardless of the position of the table 222 of the elevating devices 220A and 220B.
　さらに、本実施形態では、図６に示すように、格納部２００は、カスタマトレイＫＳＴを一時的に保管するための保管プレート２９０を備えている。この保管プレート２９０は板状の部材から構成されており、トレイ移送装置２３０が保管プレート２９０にカスタマトレイＫＳＴを載置するだけで、保管プレート２９０がカスタマトレイＫＳＴを保持することが可能となっている。本実施形態における保管プレート２９０は、６枚のカスタマトレイＫＳＴを重ねて保持することが可能となっている。なお、本発明における保管プレートは、トレイ搬送手段が載置可能な形状であれば、板状形状に特に限定されない。 Furthermore, in this embodiment, as shown in FIG. 6, the storage unit 200 includes a storage plate 290 for temporarily storing the customer tray KST. The storage plate 290 is composed of a plate-like member, and the storage plate 290 can hold the customer tray KST only by placing the customer tray KST on the storage plate 290 by the tray transfer device 230. Yes. The storage plate 290 in the present embodiment can hold six customer trays KST in a stacked manner. Note that the storage plate in the present invention is not particularly limited to a plate shape as long as the tray conveying means can be placed thereon.
　この保管プレート２９０は、トレイ移送装置２３０の第１の移動可能位置Ｍ１と第２の移動可能位置Ｍ２との間に設けられており、第１の昇降装置２２０Ａと、第２の昇降装置２２０Ｂと、の間に配置され、試験済ストッカ２１２のストッカＳＴＫ－３の上方に位置している。本実施形態では、第２の規制位置Ｈ２に位置する第１の昇降装置２２０Ａのテーブル２２２から、保管テーブル２９０までの、第１の移送アーム２４０によるカスタマトレイＫＳＴの移動距離は、当該テーブル２２２から、空トレイストッカ２１３までの、第１の移送アーム２４０によるカスタマトレイの移動距離よりも相対的に短くなっている。なお、本発明における上記のカスタマトレイの移動距離には、全ての方向の移動距離を含む。 The storage plate 290 is provided between the first movable position M 1 and the second movable position M 2 of the tray transfer device 230, and includes the first lifting device 220 A and the second lifting device. 220B and located above the stocker STK-3 of the tested stocker 212. In this embodiment, the moving distance of the customer tray KST by the first transfer arm 240 from the table 222 of the first lifting device 220A located at the second restriction position H2 to the storage table 290 is the table 222. To the empty tray stocker 213 is relatively shorter than the moving distance of the customer tray by the first transfer arm 240. The moving distance of the customer tray in the present invention includes moving distances in all directions.
　＜ローダ部３００＞
　図１１は図１の電子部品試験装置に用いられるテストトレイの分解斜視図である。 <Loader unit 300>
FIG. 11 is an exploded perspective view of a test tray used in the electronic component testing apparatus of FIG.
　上述したカスタマトレイＫＳＴは、トレイ移送装置２３０により試験前ストッカ２１１から第１の昇降装置２２０Ａに搬送され、さらにその第１の昇降装置２２０Ａによって、ローダ部３００においてメインベース１０１に開口している２箇所の窓部３０６に、メインベース１０１の下側から運ばれる。 The above-described customer tray KST is conveyed from the pre-test stocker 211 to the first lifting device 220A by the tray transfer device 230, and further opened to the main base 101 in the loader unit 300 by the first lifting device 220A. It is carried from the lower side of the main base 101 to the window portion 306 of the location.
　そして、このローダ部３００において、カスタマトレイＫＳＴに積み込まれたＩＣデバイスを、デバイス搬送装置３１０がプリサイサ（preciser）３０５に一旦移送し、ここでＩＣデバイス間の相互位置関係を修正する。その後、このプリサイサ３０５に移送されたＩＣデバイスを、デバイス搬送装置３１０が、ローダ部３００に停止しているテストトレイＴＳＴに再び積み替える。 In the loader unit 300, the IC device loaded on the customer tray KST is once transferred to the precursor 305 by the device transport apparatus 310, where the mutual positional relationship between the IC devices is corrected. Thereafter, the IC device transferred to the precursor 305 is reloaded on the test tray TST stopped by the loader unit 300 by the device transport apparatus 310.
　テストトレイＴＳＴは、図１１に示すように、方形フレーム１２に桟１３が平行且つ等間隔に設けられ、桟１３の両側、及び、桟１３に対向するフレーム１２の辺１２ａに、それぞれ複数の取付片１４が等間隔に突出して設けられている。これら桟１３の間又は桟１３と辺１２ａとの間と、２つの取付片１４とによって、インサート収容部１５が構成されている。 As shown in FIG. 11, the test tray TST has a plurality of attachments on both sides of the crosspiece 13 and on the side 12 a of the frame 12 facing the crosspiece 13. The pieces 14 are provided protruding at equal intervals. An insert accommodating portion 15 is configured by the space between the rails 13 or between the rails 13 and the side 12 a and the two attachment pieces 14.
　各インサート収容部１５には、それぞれ１個のインサート１６が収容可能となっており、このインサート１６はファスナ１７を用いて２つの取付片１４にフローティング状態で取り付けられている。このため、インサート１６の両端には、当該インサート１６を取付片１４に取り付けるための取付孔１９が形成されている。こうしたインサート１６は、図１１に示すように、１枚のテストトレイＴＳＴに６４個取り付けられており、４行１６列に配列されている。 Each insert accommodating portion 15 can accommodate one insert 16, and this insert 16 is attached to two attachment pieces 14 in a floating state using fasteners 17. Therefore, attachment holes 19 for attaching the insert 16 to the attachment piece 14 are formed at both ends of the insert 16. As shown in FIG. 11, 64 of these inserts 16 are attached to one test tray TST and arranged in 4 rows and 16 columns.
　なお、インサート１６は、同一形状、同一寸法とされており、それぞれのインサート１６にＩＣデバイスが収容される。インサート１６のデバイス収容部１８は、収容するＩＣデバイスの形状に依存し、図１１に示す例では方形の凹部となっている。 Note that the inserts 16 have the same shape and the same dimensions, and an IC device is accommodated in each insert 16. The device housing portion 18 of the insert 16 depends on the shape of the IC device to be housed, and is a rectangular recess in the example shown in FIG.
　図２に戻り、ローダ部３００は、カスタマトレイＫＳＴからテストトレイＴＳＴにＩＣデバイスを積み替えるデバイス搬送装置３１０を備えている。デバイス搬送装置３１０は、メインベース１０１上にＹ軸方向に沿って架設された２本のＹ軸レール３１１と、このＹ軸レール３１１上をＹ軸方向に沿って移動可能な稼動アーム３１２と、可動アーム３１２にＸ軸方向に沿って移動可能に支持されている可動ヘッド３１３と、可動ヘッド３１３に下向きに設けられた複数の吸着パッド（不図示）と、を備えている。それぞれの吸着パッドは、特に図示しないアクチュエータにより上下動可能となっており、複数のＩＣデバイスをカスタマトレイＫＳＴからテストトレイＴＳＴに一度に積み替えることが可能となっている。 Referring back to FIG. 2, the loader unit 300 includes a device transfer device 310 that transfers IC devices from the customer tray KST to the test tray TST. The device transport apparatus 310 includes two Y-axis rails 311 that are installed on the main base 101 along the Y-axis direction, an operation arm 312 that can move on the Y-axis rails 311 along the Y-axis direction, The movable arm 312 is provided with a movable head 313 supported so as to be movable along the X-axis direction, and a plurality of suction pads (not shown) provided downward on the movable head 313. Each suction pad can be moved up and down by an actuator (not shown), and a plurality of IC devices can be transferred from the customer tray KST to the test tray TST at a time.
　図２及び図３に示すように、カスタマトレイＫＳＴとテストトレイＴＳＴとの間には、プリサイサ３０５が設けられている。プリサイサ３０５は、特に図示しないが、比較的深い凹部を有し、この凹部の周縁が傾斜面で囲まれている。従って、カスタマトレイＫＳＴからテストトレイＴＳＴに積み替えるＩＣデバイスを、テストトレイＴＳＴに移動させる前に、このプリサイサ３０５にＩＣデバイスを一旦落とし込むことにより、ＩＣデバイスの相互位置関係を正確に定めることができるので、ＩＣデバイスをテストトレイＴＳＴに精度良く積み替えることが可能となっている。 As shown in FIG. 2 and FIG. 3, a precursor 305 is provided between the customer tray KST and the test tray TST. Although not shown, the precursor 305 has a relatively deep recess, and the periphery of the recess is surrounded by an inclined surface. Therefore, before the IC device to be transferred from the customer tray KST to the test tray TST is moved to the test tray TST, the IC device is once dropped into the precursor 305 so that the mutual positional relationship of the IC devices can be accurately determined. Therefore, it is possible to accurately transfer the IC device to the test tray TST.
　テストトレイＴＳＴの全てのインサート１６にＩＣデバイスが収容されると、トレイ循環装置１０２により当該テストトレイＴＳＴがチャンバ部１００に搬入される。 When IC devices are accommodated in all the inserts 16 of the test tray TST, the test tray TST is carried into the chamber unit 100 by the tray circulation device 102.
　一方、カスタマトレイＫＳＴに搭載されていた全てのＩＣデバイスがテストトレイＴＳＴに積み替えられると、第１の昇降装置２２０Ａがこの空トレイを下降させてトレイ移送装置２３０の第１の移送アーム２４０に受け渡し、第１の移送アーム２４０は、この空トレイを保管プレート２９０に一旦保管する。そして、窓部４０６に位置するカスタマトレイＫＳＴがＩＣデバイスで満載となったら、トレイ移送装置２３０の第２の移送アーム２４０が、その空トレイを保管プレート２９０から第２の昇降装置２２０Ｂに搬送する。 On the other hand, when all the IC devices mounted on the customer tray KST are transferred to the test tray TST, the first lifting / lowering device 220A lowers the empty tray and delivers it to the first transfer arm 240 of the tray transfer device 230. The first transfer arm 240 temporarily stores the empty tray in the storage plate 290. When the customer tray KST located in the window 406 is full of IC devices, the second transfer arm 240 of the tray transfer device 230 conveys the empty tray from the storage plate 290 to the second lifting device 220B. .
　＜チャンバ部１００＞
　上述したテストトレイＴＳＴは、ローダ部３００でＩＣデバイスが積み込まれた後にチャンバ部１００に送り込まれ、当該テストトレイＴＳＴに収容された状態で各ＩＣデバイスがテストされる。 <Chamber part 100>
The above-described test tray TST is loaded into the chamber unit 100 after the IC devices are loaded by the loader unit 300, and each IC device is tested while being accommodated in the test tray TST.
　チャンバ部１００は、図２及び図３に示すように、テストトレイＴＳＴに収容されたＩＣデバイスに、目的とする高温又は低温の熱ストレスを印加するソークチャンバ１１０と、このソークチャンバ１１０で熱ストレスが印加された状態にあるＩＣデバイスをテストヘッド５に押し付けるテストチャンバ１２０と、試験が終了したＩＣデバイスから熱ストレスを除去するアンソークチャンバ１３０と、を備えている。 As shown in FIGS. 2 and 3, the chamber unit 100 includes a soak chamber 110 that applies a target high-temperature or low-temperature heat stress to the IC device accommodated in the test tray TST, and the heat stress in the soak chamber 110. Is provided with a test chamber 120 that presses the IC device in a state of being applied to the test head 5 and an unsoak chamber 130 that removes thermal stress from the IC device that has been tested.
　ソークチャンバ１１０は、図２に示すように、テストチャンバ１２０より上方に突出している。そして、図３に概念的に示すように、このソークチャンバ１１０の内部には垂直搬送装置が設けられており、テストチャンバ１２０が空く迄の間、複数のテストトレイＴＳＴがこの垂直搬送装置に保持されながら待機している。主として、この待機中において－５５～＋１５５℃程度の熱ストレスがＩＣデバイスに印加される。 The soak chamber 110 protrudes upward from the test chamber 120 as shown in FIG. As conceptually shown in FIG. 3, a vertical transfer device is provided in the soak chamber 110, and a plurality of test trays TST are held by the vertical transfer device until the test chamber 120 is empty. Waiting while being. Mainly, thermal stress of about −55 to + 155 ° C. is applied to the IC device during this standby.
　テストチャンバ１２０には、その中央にテストヘッド５が配置されており、図３に概念的に示す水平搬送装置によりテストヘッド５の上方にテストトレイＴＳＴを運び込み、押圧装置（不図示）によりＩＣデバイスをテストヘッド５上のソケット５０に押し付ける。これにより、ＩＣデバイスの入出力端子をソケット５０のコンタクトピンに電気的に接触するので、この状態で、テスタ６がテストヘッド５を介してＩＣデバイスのテストを実行する。 A test head 5 is arranged in the center of the test chamber 120. A test tray TST is carried above the test head 5 by a horizontal conveying device conceptually shown in FIG. 3, and an IC device is formed by a pressing device (not shown). Is pressed against the socket 50 on the test head 5. As a result, the input / output terminals of the IC device are brought into electrical contact with the contact pins of the socket 50. In this state, the tester 6 executes the test of the IC device via the test head 5.
　この試験の結果は、例えば、テストトレイＴＳＴに附された識別番号と、テストトレイＴＳＴ内で割り当てられたＩＣデバイスの番号と、に対応付けて、電子部品試験装置の記憶装置に記憶される。 The result of this test is stored in the storage device of the electronic component test apparatus in association with, for example, the identification number assigned to the test tray TST and the IC device number assigned in the test tray TST.
　アンソークチャンバ１３０も、ソークチャンバ１１０と同様に、テストチャンバ１１０より上方に突出している。図３に概念的に示すように、その内部に垂直搬送装置が設けられている。このアンソークチャンバ１３０では、ソークチャンバ１１０でＩＣデバイスに高温を印加した場合には、ＩＣデバイスを送風により冷却して室温に戻した後に、当該除熱されたＩＣデバイスをアンローダ部４００に搬出する。一方、ソークチャンバ１１０でＩＣデバイスに低温を印加した場合には、ＩＣデバイスを温風又はヒータ等で加熱して結露を生じない程度の温度に戻した後に、除熱されたＩＣデバイスをアンローダ部４００に搬出する。 Similarly to the soak chamber 110, the unsoak chamber 130 also protrudes upward from the test chamber 110. As conceptually shown in FIG. 3, a vertical transfer device is provided in the interior. In the unsoak chamber 130, when a high temperature is applied to the IC device in the soak chamber 110, the IC device is cooled to the room temperature by air blowing, and then the heat-removed IC device is carried out to the unloader unit 400. . On the other hand, when a low temperature is applied to the IC device in the soak chamber 110, the IC device is heated with warm air or a heater to return it to a temperature at which dew condensation does not occur, and then the removed IC device is unloaded. Carry out to 400.
　ソークチャンバ１１０の上部には、メインベース１０１からテストトレイＴＳＴを搬入するための入口が形成されている。一方、アンソークチャンバ１３０の上部には、メインベース１０１にテストトレイＴＳＴを搬出するための出口が形成されている。そして、メインベース１０１上には、これら入口及び出口を通じて、テストトレイＴＳＴをチャンバ部１００から出し入れするためのトレイ循環装置１０２が設けられている。このトレイ循環装置１０２は、例えば回転ローラ等によりテストトレイＴＳＴを搬送するように構成されている。このトレイ循環装置１０２によって、アンソークチャンバ１３０から搬出されたテストトレイＴＳＴが、アンローダ部４００及びローダ部３００を経由して、ソークチャンバ１１０に返送される。 An inlet for carrying the test tray TST from the main base 101 is formed in the upper part of the soak chamber 110. On the other hand, an outlet for carrying out the test tray TST to the main base 101 is formed in the upper part of the unsoak chamber 130. On the main base 101, a tray circulation device 102 for taking the test tray TST out and in and out of the chamber unit 100 through these inlets and outlets is provided. The tray circulation device 102 is configured to convey the test tray TST by, for example, a rotating roller. By this tray circulation device 102, the test tray TST carried out from the unsoak chamber 130 is returned to the soak chamber 110 via the unloader unit 400 and the loader unit 300.
　＜アンローダ部４００＞
　アンローダ部４００では、アンソークチャンバ１３０から運び出されたテストトレイＴＳＴから、試験済みのＩＣデバイスが、試験結果に応じたカスタマトレイＫＳＴに分類されながら積み替えられる。 <Unloader unit 400>
In the unloader unit 400, the tested IC devices are transferred from the test tray TST carried out from the unsoak chamber 130 while being classified into customer trays KST corresponding to the test results.
　図２に示すように、アンローダ部４００におけるメインベース１０１には、５つの窓部４０６が開口している。この窓部４０６には、第２の昇降装置２２０Ｂにより格納部２００から運び込まれたカスタマトレイＫＳＴがアンローダ部４００に臨むように配置される。 As shown in FIG. 2, five windows 406 are opened in the main base 101 in the unloader unit 400. In this window part 406, the customer tray KST carried from the storage part 200 by the 2nd lifting / lowering apparatus 220B is arrange | positioned so that the unloader part 400 may be faced.
　アンローダ部４００は、試験済みのＩＣデバイスをテストトレイＴＳＴからカスタマトレイＫＳＴに積み替える２台のデバイス分類装置４１０を備えている。このデバイス分類装置４１０は、デバイス搬送装置３１０と同様に、Ｙ軸レール４１１、可動アーム４１２及び可動ヘッド４１３をそれぞれ備えており、複数のＩＣデバイスをテストトレイＴＳＴからカスタマトレイＫＳＴに同時に積み替えることが可能となっている。 The unloader unit 400 includes two device classification devices 410 that transfer a tested IC device from the test tray TST to the customer tray KST. Similar to the device transport apparatus 310, the device classification apparatus 410 includes a Y-axis rail 411, a movable arm 412, and a movable head 413, and simultaneously loads a plurality of IC devices from the test tray TST to the customer tray KST. Is possible.
　図６及び図７に示すように、それぞれの窓部４０６の下方には、カスタマトレイＫＳＴを昇降させるための第２の昇降装置２０２Ｂが設けられている。ここでは、試験済みのＩＣデバイスが積み込まれて満載となったカスタマトレイＫＳＴを載せて下降し、この満載トレイをトレイ移送装置２３０の第２の移送アーム２５０が受け取り、第２の移送アーム２５０は、その満載トレイを、試験結果に応じた試験済ストッカ２１２に搬送する。 As shown in FIGS. 6 and 7, below each window 406, a second lifting device 202B for lifting and lowering the customer tray KST is provided. Here, the loaded customer tray KST loaded with the tested IC devices is loaded and lowered, and the second transfer arm 250 of the tray transfer device 230 receives the full tray, and the second transfer arm 250 The full tray is conveyed to the tested stocker 212 according to the test result.
　本実施形態では、アンローダ部４００に５つの窓部４０６が形成されているため、５つのカテゴリ（試験結果）をリアルタイムに分類することができる。これに対し、６カテゴリ以上に対応する場合には、発生頻度の高い５カテゴリに対応したカスタマトレイＫＳＴを窓部４０６に常時位置させ、発生頻度の低いカテゴリをバッファ部４０５（図３参照）に一時的に預かり、所定のタイミングで、そのカテゴリに対応したカスタマトレイＫＳＴを窓部４０６に呼び出してもよい。 In this embodiment, since the five window portions 406 are formed in the unloader portion 400, the five categories (test results) can be classified in real time. On the other hand, when dealing with 6 categories or more, the customer tray KST corresponding to 5 categories with high occurrence frequency is always positioned in the window 406, and the category with low occurrence frequency is placed in the buffer unit 405 (see FIG. 3). The customer tray KST corresponding to the category may be temporarily stored and called to the window unit 406 at a predetermined timing.
　以下に、本実施形態の格納部におけるカスタマトレイの搬送方法について説明する。 Hereinafter, a method for transporting the customer tray in the storage unit of the present embodiment will be described.
　図１２Ａ～図１２Ｍは本実施形態の格納部におけるカスタマトレイの搬送方法の第１例を示す概略正面図であり、図１３Ａ～図１３Ｋは本実施形態の格納部におけるカスタマトレイの搬送方法の第２例を示す概略正面図である。 12A to 12M are schematic front views showing a first example of the customer tray transport method in the storage unit of the present embodiment, and FIGS. 13A to 13K are views of a customer tray transport method in the storage unit of the present embodiment. It is a schematic front view which shows two examples.
　なお、図１２Ａ～図１３Ｋにおいて網掛けされているカスタマトレイは、ＩＣデバイスを収容しているトレイを示し、網掛けされていないカスタマトレイは、ＩＣデバイスを収容していない空トレイを示している。また、同図の記載及び以下の説明は、トレイの搬送元及び搬送先の窓部３０６，４０６を限定するものではない。 In FIG. 12A to FIG. 13K, the shaded customer trays indicate trays that accommodate IC devices, and the non-shaded customer trays indicate empty trays that do not accommodate IC devices. . In addition, the description in the figure and the following description do not limit the tray transfer source and transfer destination windows 306 and 406.
　先ず、図１２Ａ～図１２Ｍを参照しながら、保管プレート２９０を用いて、トレイ移送装置２３０によりローダ部３００の窓部３０６から、アンローダ部４００の窓部４０６に空トレイＫＳＴｅを搬送する方法について説明する。 First, with reference to FIGS. 12A to 12M, a method of transporting an empty tray KST e from the window 306 of the loader unit 300 to the window 406 of the unloader unit 400 by the tray transfer device 230 using the storage plate 290 will be described. explain.
　なお、図１２Ａ～図１２Ｍは、理解を容易にするために、トレイの搬送作業の中から、保管プレート２９０を利用した空トレイの搬送手順のみを抽出して図示しており、実際の搬送作業では、移送アーム２４０，２５０及び昇降装置２２０Ａ，２２０Ｂが、複数のカスタマトレイの搬送作業を、同時に且つ独立して実行している。 12A to 12M, for ease of understanding, only the procedure for transporting the empty tray using the storage plate 290 is extracted from the tray transporting work, and the actual transporting work is illustrated. Then, the transfer arms 240 and 250 and the lifting / lowering devices 220A and 220B simultaneously and independently carry out a plurality of customer trays.
　ローダ部３００のデバイス搬送装置３１０が、図１２Ａ中の左から２番目の窓部３０６に位置しているカスタマトレイから、全てのＩＣデバイスをテストトレイＴＳＴに積み替えると、同図に示すように、そのカスタマトレイは、ＩＣデバイスを収容していない空トレイＫＳＴｅとなる。カスタマトレイが空トレイＫＳＴｅとなったら、図１２Ｂに示すように、その空トレイＫＳＴｅを保持している第１の昇降装置２２０Ａが第２の規制位置Ｈ２まで下降する。なお、空トレイＫＳＴｅは、ＩＣデバイスで満載のカスタマトレイＫＳＴｆの上に積み重ねられている。 When the device transport device 310 of the loader unit 300 reloads all IC devices from the customer tray located in the second window unit 306 from the left in FIG. 12A to the test tray TST, as shown in FIG. The customer tray is an empty tray KST e that does not contain an IC device. When the customer tray becomes empty tray KST e, as shown in FIG. 12B, descends first lifting device 220A that holds the empty tray KST e until second restricting position H 2. The empty tray KST e is stacked on the customer tray KST f full of IC devices.
　次いで、図１２Ｃに示すように、下降した第１の昇降装置２２０Ａの上方に第２の保持ヘッド２４６が位置するように、第１の移送アーム２４０が水平移動する。そして、図１２Ｄに示すように、第２の保持ヘッド２４６が下降して、第１の昇降装置２２０Ａから空トレイＫＳＴｅを受け取る。 Next, as shown in FIG. 12C, the first transfer arm 240 moves horizontally so that the second holding head 246 is positioned above the lowered first lifting device 220A. Then, as shown in FIG. 12D, the second holding head 246 descends to receive the empty tray KST e from the first lifting device 220A.
　次いで、第２の保持ヘッド２４６は、図１２Ｅに示すように、空トレイＫＳＴｅを保持したまま、第１の移動可能位置Ｍ１まで上昇する。これにより、第１の昇降装置２２０Ａのテーブル２２２上において満載トレイＫＳＴｆが露出する。 Then, the second holding head 246, as shown in FIG. 12E, while holding the empty tray KST e, rises to a first movable position M 1. As a result, the full tray KSTf is exposed on the table 222 of the first lifting device 220A.
　次いで、図１２Ｆに示すように、第２の保持ヘッド２４６が保管プレート２９０の上方に位置するように、第１の移送アーム２４０が第１の移動可能位置Ｍ１上を水平移動し、さらに、第２の保持ヘッド２４６が下降して、保管プレート２９０に空トレイＫＳＴｅを載置する。 Then, as shown in FIG. 12F, as the second holding head 246 is positioned above the storage plate 290, the first transfer arm 240 is horizontally moved a first movable position M 1 above, further, The second holding head 246 is lowered to place the empty tray KST e on the storage plate 290.
　この保管プレート２９０がない場合には、第１の移送アーム２４０は、空トレイストッカ２１３まで空トレイＫＳＴｅを搬送しなければならない。これに対し、本実施形態では、保管プレート２９０で一時的に空トレイＫＳＴｅを保管することで、第１の移送アーム２４０のストッカ２１１～２１３へのアクセス回数が低減されるので、カスタマトレイの交換作業を短縮することができる。なお、保管プレート２９０がカスタマトレイで満載の場合には、第１の移送アーム２４０が、空トレイストッカ２１３まで、空トレイＫＳＴｅを移動させてもよい。 In the absence of the storage plate 290, the first transfer arm 240 must transport the empty tray KST e to the empty tray stocker 213. In contrast, in the present embodiment, by temporarily storing the empty tray KST e in storage plate 290, since the number of accesses to the stocker 211-213 of the first transfer arm 240 is reduced, the customer tray Exchange work can be shortened. If the storage plate 290 is full of customer trays, the first transfer arm 240 may move the empty tray KST e to the empty tray stocker 213.
　次いで、図１２Ｇに示すように、第１の移送アーム２４０の第２の保持ヘッド２４６が第１の移動可能位置Ｍ１まで上昇し、図１２Ｈに示すように、第１の移送アーム２４０は水平移動して、保管プレート２９０及び第１の昇降装置２２０Ａの上方から退避する。 Then, as shown in FIG. 12G, the second holding head 246 of the first transfer arm 240 is raised to the first movable position M1, and as shown in FIG. 12H, the first transfer arm 240 is moved horizontally. It moves and retracts from above the storage plate 290 and the first lifting device 220A.
　これと同時に、同図に示すように、第２の移送アーム２５０の第１の可動ヘッド２６０が第１の移動可能位置Ｍ１上を水平移動して、保管プレート２９０の上方で停止する。また、同図に示すように、同図中の右から４番目の窓部４０６に配置された第２の昇降装置２２０Ｂが下降を開始する。なお、この第２の昇降装置２２０Ｂが保持しているカスタマトレイは、アンローダ部４００のデバイス分類装置４１０によりＩＣデバイスが満載され、満載トレイＫＳＴｆとなっている。 At the same time, as shown in the figure, the first movable head 260 of the second transfer arm 250 moves horizontally on the first movable position M 1 and stops above the storage plate 290. Moreover, as shown in the figure, the 2nd raising / lowering apparatus 220B arrange | positioned at the 4th window part 406 from the right in the figure starts a fall. The customer tray held by the second lifting / lowering device 220B is fully loaded with IC devices by the device classification device 410 of the unloader unit 400, and becomes a full tray KST f .
　次いで、図１２Ｉに示すように、第１の可動ヘッド２６０の第１の保持ヘッド２６３が下降して、保管プレート２９０から空トレイＫＳＴｅを受け取る。また、第２の昇降装置２２０Ｂが第２の規制位置Ｈ２まで下降するとともに、下降していた第１の昇降装置２２０Ａが上昇を開始する。 Next, as shown in FIG. 12I, the first holding head 263 of the first movable head 260 is lowered to receive the empty tray KST e from the storage plate 290. Further, the second lifting device 220B is lowered to the second regulation position H 2, the first lifting device 220A which has been lowered starts increasing.
　次いで、第１の可動ヘッド２６０の第１の保持ヘッド２６３は、図１２Ｊに示すように、空トレイＫＳＴｅを保持したまま、第１の移動可能位置Ｍ１まで上昇する。また、第１の昇降装置２２０Ａは、第１の規制位置Ｈ１まで上昇し、満載トレイＫＳＴｆが窓部３０６を介してローダ部３００に臨む。ローダ部３００のデバイス搬送装置３１０は、満載トレイＫＳＴｆからの試験前のＩＣデバイスの積替作業を再開する。 Then, the first holding head 263 of the first movable head 260, as shown in FIG. 12 J, while holding the empty tray KST e, rises to a first movable position M 1. Further, the first elevating device 220 </ b> A moves up to the first restriction position H <b> 1 and the full tray KST f faces the loader unit 300 through the window unit 306. The device transfer device 310 of the loader unit 300 resumes the reloading operation of the IC device before the test from the full tray KST f .
　次いで、図１２Ｋに示すように、第１の可動ヘッド２６０は、下降した第２の昇降装置２２０Ｂの上方に水平移動し、第１の保持ヘッド２６３が下降して、第２の昇降装置２２０Ｂに空トレイＫＳＴｅを載置する。この際、空トレイＫＳＴｅは、第２の昇降装置２２０のテーブル２２２に元々保持されている満載トレイＫＳＴｆの上に積み重ねられる。 Next, as shown in FIG. 12K, the first movable head 260 moves horizontally above the lowered second elevating device 220B, and the first holding head 263 descends to move to the second elevating device 220B. Place an empty tray KST e . At this time, the empty tray KST e is stacked on the full tray KST f originally held on the table 222 of the second lifting device 220.
　次いで、図１２Ｌに示すように、第１の保持ヘッド２６３が第１の移動可能位置Ｍ１まで上昇し、第１の可動ヘッド２６０が水平移動して、下降している第２の昇降装置２２０Ｂの上方から退避する。 Then, as shown in FIG. 12L, a first holding head 263 is raised to the movable position M 1 first, the first movable head 260 is horizontally moved, lowered to have a second lifting device 220B Retreat from above.
　次いで、図１２Ｍに示すように、第２の昇降装置２２０Ｂが、第１の規制位置Ｈ１まで上昇し、空トレイＫＳＴｅが窓部４０６を介してアンローダ部４００に臨む。アンローダ部４００のデバイス分類装置４１０は、空トレイＫＳＴｅへの試験済みのＩＣデバイスの積み込みを再開する。 Then, as shown in FIG. 12M, the second lifting device 220B is first increased to the restricting position H 1, facing the unloader section 400 empty tray KST e via the window 406. The device classification device 410 of the unloader unit 400 resumes loading of the tested IC device onto the empty tray KST e .
　なお、保管プレート２９０に空トレイがない場合には、第１又は第２の可動ヘッド２６０，２７０により、空トレイストッカ２１３から第２の昇降装置２２０Ｂに空トレイが供給される。 When there is no empty tray in the storage plate 290, the empty tray is supplied from the empty tray stocker 213 to the second lifting device 220B by the first or second movable heads 260 and 270.
　次に、図１３Ａ～図１３Ｋを参照しながら、再試験の必要なＩＣデバイスを収容したカスタマトレイＫＳＴｒを、トレイ移送装置２３０によりアンローダ部４００の窓部４０６から、ローダ部３００の窓部３０６に搬送する方法について説明する。 Next, with reference to FIGS. 13A ~ FIG 13K, the customer tray KST r accommodating the required IC devices retested, the window 406 of the unloader section 400 by the tray transfer device 230, the window portion 306 of the loader unit 300 A method of transporting will be described.
　なお、図１３Ａ～図１３Ｋは、理解を容易にするために、トレイの搬送作業の中から、保管プレート２９０を利用した再試験トレイの搬送手順のみを抽出して図示しており、実際の搬送作業では、移送アーム２４０，２５０及び昇降装置２２０Ａ，２２０Ｂが、複数のカスタマトレイの搬送作業を、同時に且つ独立して実行している。また、以下に説明する再試験トレイの搬送作業を効率的に行うために、第２の規制位置Ｈ２に位置する第２の昇降装置２２０Ｂのテーブル２２２から、保管テーブル２９０までの第２のトレイ移送アーム２５０による再試験トレイの移動距離を、当該テーブル２２２から試験前ストッカ２１１までの第２のトレイ移送アーム２５０による再試験トレイの移動距離よりも相対的に短くしてもよい。なお、本発明における上記の再試験トレイの移動距離には、全ての方向の移動距離を含む。 In order to facilitate understanding, FIGS. 13A to 13K show only the procedure for transporting the retest tray using the storage plate 290 extracted from the tray transporting operation. In the work, the transfer arms 240 and 250 and the lifting / lowering devices 220A and 220B carry out a plurality of customer trays simultaneously and independently. Further, in order to perform the carrying operation of the re-test tray to be described below efficiently, second tray from the second lifting device 220B of the table 222 located in the second regulating position H 2, until storage table 290 The moving distance of the retest tray by the transfer arm 250 may be relatively shorter than the moving distance of the retest tray by the second tray transfer arm 250 from the table 222 to the pre-test stocker 211. The moving distance of the retest tray in the present invention includes moving distances in all directions.
　図１３Ａ中の右から１番目の窓部４０６に位置しているカスタマトレイに、再試験の必要なＩＣデバイスが積み込まれると、図１３Ｂに示すように、第２の昇降装置２２０Ｂが第２の規制位置Ｈ２まで下降する。なお、再試験トレイＫＳＴｒは、ＩＣデバイスを収容してない空トレイＫＳＴｅの上に積み重ねられている。 When an IC device that needs to be retested is loaded on the customer tray located in the first window 406 from the right in FIG. 13A, as shown in FIG. 13B, the second lifting device 220B lowered to the regulatory position H 2. The retest tray KST r is stacked on an empty tray KST e that does not contain an IC device.
　次いで、図１３Ｃに示すように、第２の移送アーム２５０の第１の可動ヘッド２６０が、下降した第２の昇降装置２２０Ａの上方に水平移動する。これと同時に、第１の可動ヘッド２６０との干渉を回避するために、第２の可動ヘッド２７０も水平移動する。 Next, as shown in FIG. 13C, the first movable head 260 of the second transfer arm 250 moves horizontally above the lowered second elevating device 220A. At the same time, the second movable head 270 also moves horizontally in order to avoid interference with the first movable head 260.
　次いで、第１の可動ヘッド２６０の第１の保持ヘッド２６３が下降して、第２の昇降装置２２０Ｂから再試験トレイＫＳＴｒを受け取る。 Next, the first holding head 263 of the first movable head 260 is lowered to receive the retest tray KST r from the second lifting device 220B.
　次いで、第１の保持ヘッド２６３は、図１３Ｅに示すように、再試験トレイＫＳＴｒを保持したまま、第１の移動可能位置Ｍ１まで上昇し、第１の可動ヘッド２６０が水平方向に移動して、第１の保持ヘッド２６３を保管プレート２９０の上方に位置させる。これにより、第１の可動ヘッド２６０が第２の昇降装置２２０Ｂの上方から退避するとともに、第２の昇降装置２２０Ｂのテーブル２２２上において空トレイＫＳＴｅが露出する。 Then the mobile first holding head 263, as shown in FIG. 13E, while maintaining the retest tray KST r, the first raised to the movable position M 1, the first movable head 260 in the horizontal direction Then, the first holding head 263 is positioned above the storage plate 290. Accordingly, the first movable head 260 with retracted from above the second lifting device 220B, empty tray KST e are exposed on the table 222 of the second lifting device 220B.
　次いで、第１の保持ヘッド２６３が第２の移動可能位置Ｍ２まで下降し、保管プレート２９０に再試験トレイＫＳＴｒを載置する。これと同時に、図１３Ｅにおいて右から２番目の第１の昇降装置２２０Ａが下降を開始する。 Then, the first holding head 263 is lowered to the second movable position M 2, placing the re-test trays KST r a storage plate 290. At the same time, the first lifting device 220A second from the right in FIG. 13E starts to descend.
　次いで、図１３Ｆに示すように、第１の昇降装置２２０Ａが第２の規制位置Ｈ２まで下降するとともに、第１の可動ヘッド２６０が第１の移動可能位置Ｍ１まで上昇する。また、下降していた第２の昇降装置２２０Ｂが第１の規制位置Ｈ１まで上昇する。アンローダ部４００のデバイス搬送装置４１０は、再試験を必要とするＩＣデバイスの空トレイＫＳＴｅへの積み込みを再開する。 Then, as shown in FIG. 13F, the first lifting device 220A is thereby lowered to the second regulation position H 2, the first movable head 260 is raised to the movable position M 1 first. The second lifting device 220B that has been lowered is raised to a first restricting position H 1. The device transport apparatus 410 of the unloader unit 400 resumes loading of IC devices that require retesting into the empty tray KST e .
　次いで、図１３Ｇに示すように、第１の可動ヘッド２６０が水平移動して保管プレート２９０の上方から退避する。また、第２の保持ヘッド２４６が保管プレート２９０の上方に位置するように、第１の移送アーム２４０が水平方向に移動する。 Next, as shown in FIG. 13G, the first movable head 260 moves horizontally and retracts from above the storage plate 290. Further, the first transfer arm 240 moves in the horizontal direction so that the second holding head 246 is positioned above the storage plate 290.
　次いで、図１３Ｈに示すように、第２の保持ヘッド２４６が下降して、保管プレート２９０から再試験トレイＫＳＴｒを受け取る。この保管プレート２９０がない場合には、第１の移送アーム２４０及び第２の移送アーム２５０が、再試験トレイを格納している試験済ストッカ２１２までそれぞれアクセスしなければならない。これに対し、本実施形態では、保管プレート２９０で一時的に再試験トレイＫＳＴｒを保管することで、ストッカへのアクセス回数が低減されるので、カスタマトレイの交換作業を短縮することができる。 Next, as shown in FIG. 13H, the second holding head 246 descends and receives the retest tray KST r from the storage plate 290. In the absence of this storage plate 290, the first transfer arm 240 and the second transfer arm 250 must each access the tested stocker 212 that stores the retest tray. In contrast, in the present embodiment, by storing temporarily retested trays KST r in storage plate 290, since the number of accesses to the stocker is reduced, it is possible to shorten the replacement of the customer tray.
　次いで、図１３Ｉに示すように、第２の保持ヘッド２４６は、再試験トレイＫＳＴｒを保持したまま、第１の移動可能位置Ｍ１まで上昇し、さらに、第２の保持ヘッド２４６が、下降している第１の昇降装置２２０Ａの上方に位置するように、第１の移送アーム２４０が水平移動する。次いで、第２の保持ヘッド２４６が下降して、第１の昇降装置２２０Ａのテーブル２２２の上に再試験トレイＫＳＴｒを載置する。 Then, as shown in FIG. 13I, the second holding head 246, while holding the retest tray KST r, the first raised to the movable position M 1, further second holding head 246, downward The first transfer arm 240 moves horizontally so as to be positioned above the first lifting device 220A. Then, the second holding head 246 is lowered to place the retest tray KST r on the table 222 of the first lifting device 220A.
　次いで、図１３Ｊに示すように、第２の保持ヘッド２４６が第１の移動可能位置Ｍ１まで上昇した後、第１の移送アーム２４０が第１の昇降装置２２０Ａの上方から退避する。 Then, as shown in FIG. 13J, after the second holding head 246 is raised to the movable position M 1 first, the first transfer arm 240 is retracted from above the first lifting device 220A.
　次いで、図１３Ｋに示すように、第１の昇降装置２２０Ａが、第１の規制位置Ｈ１まで上昇し、再試験トレイＫＳＴｒが窓部３０６を介してローダ部３００に臨む。ローダ部３００のデバイス搬送装置３１０は、ＩＣデバイスを再試験するために、再試験トレイＫＳＴｒからテストトレイＴＳＴにＩＣデバイスを積み替える。 Then, as shown in FIG. 13K, the first lifting device 220A is first increased to the restricting position H 1, retest trays KST r faces the loader section 300 through the window 306. Device conveying apparatus 310 of the loader unit 300 to re-test IC devices, reloading IC devices from retested tray KST r the test tray TST.
　なお、全ての第１の昇降装置２２０ＡがカスタマトレイＫＳＴで満載の場合には、第１の移送アーム２４０が再試験ＫＳＴｒを試験前ストッカ２１１に移動させてもよい。また、第１の移送アーム２４０の第１の保持ヘッド２４３を用いて、再試験トレイＴＳＴｒを保管プレート２９０から第１の昇降装置２２０Ａに搬送してもよい。 If all the first lifting devices 220A are fully loaded with the customer tray KST, the first transfer arm 240 may move the retest KST r to the pre-test stocker 211. Further, by using the first holding head 243 of the first transfer arm 240 may carry a re-test tray TST r from storage plate 290 to the first lifting device 220A.
　以上のように、本実施形態では、カスタマトレイＫＳＴを保管プレート２９０に一時的に預けることで、トレイ移送装置２３０のストッカ２１１～２１３へのアクセス回数を低減することができるので、窓部３０６，４０６におけるカスタマトレイＫＳＴの交換時間を短縮することができる。 As described above, in this embodiment, the customer tray KST is temporarily deposited in the storage plate 290, so that the number of accesses to the stockers 211 to 213 of the tray transfer device 230 can be reduced. The customer tray KST replacement time in 406 can be shortened.
　なお、以上説明した実施形態は、本発明の理解を容易にするために記載されたものであって、本発明を限定するために記載されたものではない。したがって、上記の実施形態に開示された各要素は、本発明の技術的範囲に属する全ての設計変更や均等物をも含む趣旨である。 The embodiment described above is described for easy understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

Claims (13)

  1. 　被試験電子部品を収容可能なトレイを搬送するためのトレイ搬送装置であって、
    　前記トレイを格納する格納手段と、
    　前記トレイを保持する保持手段と、
    　前記トレイを一時的に保管する保管手段と、
    　前記格納手段、前記保持手段、及び、前記保管手段の間で、前記トレイを搬送する少なくとも一つの搬送手段と、
    　前記搬送手段の動作を制御する制御手段と、を備えたトレイ搬送装置。     A tray transport device for transporting a tray capable of accommodating an electronic device under test,
    Storage means for storing the tray;
    Holding means for holding the tray;
    Storage means for temporarily storing the tray;
    At least one transporting means for transporting the tray between the storage means, the holding means, and the storage means;
    A tray transport apparatus comprising: control means for controlling the operation of the transport means.
  2. 　前記保持手段は、
    　試験前の前記被試験電子部品を収容している試験前トレイを保持する第１の保持手段と、
    　試験済みの前記被試験電子部品を収容している試験済トレイを保持する第２の保持手段と、を含み、
    　前記保管手段は、前記第１の保持手段と前記第２の保持手段との間に配置されている請求項１記載のトレイ搬送装置。     The holding means is
    First holding means for holding a pre-test tray housing the electronic device under test before testing;
    A second holding means for holding a tested tray containing the tested electronic component that has been tested,
    The tray conveying apparatus according to claim 1, wherein the storage unit is disposed between the first holding unit and the second holding unit.
  3. 　前記保持手段から前記保管手段までの前記搬送手段による前記トレイの移動距離は、前記保持手段から前記格納手段までの前記搬送手段による前記トレイの移動距離よりも短い請求項１又は２記載のトレイ搬送装置。 3. The tray conveyance according to claim 1, wherein a movement distance of the tray by the conveyance unit from the holding unit to the storage unit is shorter than a movement distance of the tray by the conveyance unit from the holding unit to the storage unit. apparatus.
  4. 　前記格納手段は、
    　試験前の前記被試験電子部品を収容した試験前トレイを格納する第１の格納手段と、
    　試験済みの前記被試験電子部品を収容した試験済トレイを格納する第２の格納手段と、
    　前記被試験電子部品を収容していない空トレイを格納する第３の格納手段と、を含む請求項１～３の何れかに記載のトレイ搬送装置。     The storage means includes
    First storage means for storing a pre-test tray containing the electronic device under test before testing;
    A second storage means for storing a tested tray containing the tested electronic component under test;
    The tray transfer device according to any one of claims 1 to 3, further comprising a third storage unit that stores an empty tray that does not contain the electronic component to be tested.
  5. 　前記少なくとも一つの搬送手段は、前記トレイをそれぞれ独立して搬送することが可能である第１及び第２の搬送手段を含んでおり、
    　前記制御手段は、
    　前記第１の搬送手段が、前記第１の格納手段、前記第１の保持手段、前記保管手段及び第３の格納手段の間で、前記トレイを搬送し、
    　前記第２の搬送手段が、前記保管手段、前記第２の保持手段、前記第２の格納手段、及び、前記第３の格納手段の間で、前記トレイを搬送するように、前記第１及び前記第２の搬送手段を制御する請求項４記載のトレイ搬送装置。     The at least one transport means includes first and second transport means capable of independently transporting the tray,
    The control means includes
    The first conveying means conveys the tray between the first storing means, the first holding means, the storage means and the third storing means;
    The first and the second transport means transport the tray between the storage means, the second holding means, the second storage means, and the third storage means. The tray transport apparatus according to claim 4, wherein the second transport unit is controlled.
  6. 　前記制御手段は、
    　前記第１の搬送手段が、試験前の前記被試験電子部品を収容した試験前トレイを、前記第１の格納手段から前記第１の保持手段に搬送し、試験前の前記被試験電子部品が空となった空トレイを、前記第１の保持手段から前記保管手段に搬送し、
    　前記第２の搬送手段が、前記被試験電子部品を収容していない空トレイを、前記保管手段又は前記第３の格納手段から前記第２の保持手段に搬送し、試験済みの前記被試験電子部品を収容した試験済トレイを、前記第２の保持手段から前記第２の格納手段に搬送するように、前記第１及び前記第２の搬送手段を制御する請求項４又は５記載のトレイ搬送装置。     The control means includes
    The first transport means transports the pre-test tray accommodating the electronic device under test before the test from the first storage means to the first holding means, and the electronic device under test before the test is Transport empty trays from the first holding means to the storage means;
    The second transport means transports an empty tray that does not contain the electronic device under test from the storage means or the third storage means to the second holding means, and the tested electronic devices to be tested 6. The tray conveyance according to claim 4 or 5, wherein the first and second conveying means are controlled so that a tested tray containing components is conveyed from the second holding means to the second storage means. apparatus.
  7. 　前記制御手段は、
    　前記第２の搬送手段が、試験済みの前記被試験電子部品を収容した試験済トレイを、前記第２の保持手段から前記保管手段に搬送し、
    　前記第１の搬送手段が、前記試験済トレイを前記保管手段から前記第１の保持手段又は前記第１の格納手段に搬送するように、前記第１及び前記第２の搬送手段を制御する請求項４～６の何れかに記載のトレイ搬送装置。     The control means includes
    The second transport means transports the tested tray containing the tested electronic components to be tested from the second holding means to the storage means;
    The first conveying means controls the first and second conveying means so as to convey the tested tray from the storage means to the first holding means or the first storage means. Item 7. The tray conveyance device according to any one of Items 4 to 6.
  8. 　前記第１及び第２の保持手段は、前記トレイを第１の方向に沿って移動させることが可能であり、
    　前記第１及び前記第２の搬送手段は、前記トレイを前記第１の方向、及び、前記第１の方向とは異なる第２の方向に沿って独立して移動させることが可能であり、
    　前記第１、前記第２及び前記第３の格納手段は、前記第２の方向に沿って配置されており、
    　前記第１及び第２の保持手段、並びに、前記保管手段は、前記第１～３の格納手段に対して、前記第１の方向に位置している請求項４～７の何れかに記載のトレイ搬送装置。     The first and second holding means can move the tray along a first direction;
    The first and second transport means can move the tray independently along the first direction and a second direction different from the first direction,
    The first, second and third storage means are arranged along the second direction;
    The first and second holding means and the storage means are located in the first direction with respect to the first to third storage means. Tray transport device.
  9. 　前記第１の搬送手段は、前記トレイを把持可能な複数の第１の把持部を有しており、
    　前記複数の第１の把持部は、前記第１の方向に沿って独立して移動可能であると共に、前記第２の方向に沿って一体で移動可能である請求項８記載のトレイ搬送装置。     The first transport means has a plurality of first gripping portions capable of gripping the tray,
    The tray conveying device according to claim 8, wherein the plurality of first gripping portions are independently movable along the first direction and are integrally movable along the second direction.
  10. 　前記第２の搬送手段は、前記トレイを把持可能な複数の第２の把持部を有しており、
    　前記複数の第２の把持部は、前記第１及び前記第２の方向に沿ってそれぞれ独立して移動可能である請求項９記載のトレイ搬送装置。     The second conveying means has a plurality of second gripping portions capable of gripping the tray,
    The tray transport device according to claim 9, wherein the plurality of second gripping portions are independently movable along the first and second directions.
  11. 　前記第１及び前記第２の把持部はいずれも複数の前記トレイを把持可能であり、
    　前記保管手段及び前記保持手段はいずれも複数の前記トレイを保持可能である請求項１０記載のトレイ搬送装置。     Each of the first and second gripping units can grip a plurality of the trays,
    The tray conveying apparatus according to claim 10, wherein both the storage unit and the holding unit can hold a plurality of the trays.
  12. 　被試験電子部品の入出力端子をテストヘッドのコンタクト部に電気的に接触させて、前記被試験電子部品のテストを行うために用いられる電子部品試験装置であって、
    　請求項１～１１の何れかに記載のトレイ搬送装置を備えた電子部品試験装置。     An electronic component testing apparatus used to test the electronic device under test by bringing an input / output terminal of the electronic device under test into electrical contact with a contact portion of a test head,
    An electronic component test apparatus comprising the tray transport device according to any one of claims 1 to 11.
  13. 　前記被試験電子部品を前記トレイから第２のトレイに積み替えるローダ部と、
    　前記ローダ部から搬入された前記被試験電子部品を前記第２のトレイに搭載したままの状態で前記テストヘッドのコンタクト部に押し付けるテスト部と、
    　試験結果に応じて、試験済みの前記被試験電子部品を前記第２のトレイから前記トレイに積み替えるアンローダ部と、を備えており、
    　前記トレイ搬送装置は、試験前の前記被試験電子部品が収容された前記トレイを前記ローダ部に供給し、試験済みの前記被試験電子部品が収容された前記トレイを前記アンローダ部から受け取る請求項１２記載の電子部品試験装置。     A loader unit for transferring the electronic device under test from the tray to a second tray;
    A test section for pressing the electronic device under test carried in from the loader section against the contact section of the test head while being mounted on the second tray;
    An unloader unit that reloads the tested electronic components from the second tray to the tray according to a test result,
    The tray conveying device supplies the tray in which the electronic device under test before testing is accommodated to the loader unit, and receives the tray in which the electronic device under test that has been tested is accommodated from the unloader unit. 12. The electronic component testing apparatus according to 12.
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