TWI378750B - - Google Patents

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Publication number
TWI378750B
TWI378750B TW098102044A TW98102044A TWI378750B TW I378750 B TWI378750 B TW I378750B TW 098102044 A TW098102044 A TW 098102044A TW 98102044 A TW98102044 A TW 98102044A TW I378750 B TWI378750 B TW I378750B
Authority
TW
Taiwan
Prior art keywords
solder ball
printing
screen
substrate
flux
Prior art date
Application number
TW098102044A
Other languages
English (en)
Chinese (zh)
Other versions
TW200945978A (en
Inventor
Makoto Honma
Noriaki Mukai
Shinichiro Kawabe
Akio Igarashi
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Publication of TW200945978A publication Critical patent/TW200945978A/zh
Application granted granted Critical
Publication of TWI378750B publication Critical patent/TWI378750B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
TW098102044A 2008-01-25 2009-01-20 Solder ball printing device TW200945978A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008015215A JP5076922B2 (ja) 2008-01-25 2008-01-25 ハンダボール印刷装置

Publications (2)

Publication Number Publication Date
TW200945978A TW200945978A (en) 2009-11-01
TWI378750B true TWI378750B (ja) 2012-12-01

Family

ID=40924698

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098102044A TW200945978A (en) 2008-01-25 2009-01-20 Solder ball printing device

Country Status (4)

Country Link
JP (1) JP5076922B2 (ja)
KR (1) KR101027491B1 (ja)
CN (1) CN101494181B (ja)
TW (1) TW200945978A (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5018062B2 (ja) * 2006-12-15 2012-09-05 株式会社日立プラントテクノロジー ハンダボール印刷装置
US8424748B2 (en) * 2009-12-21 2013-04-23 Intel Corporation Solder in cavity interconnection technology
CN103717339B (zh) * 2011-09-12 2015-12-23 欧姆龙株式会社 检查用夹具
JP6069723B2 (ja) * 2012-06-06 2017-02-01 澁谷工業株式会社 微小ボール搭載ワークのリペア装置
JP6109609B2 (ja) * 2013-03-14 2017-04-05 Ａｉメカテック株式会社 ハンダボール印刷機およびハンダボール印刷方法
CN104090505B (zh) * 2014-04-10 2017-02-15 广东骏亚电子科技股份有限公司 一种高精密电路板小间隙自动填补矫正方法
CN105789086B (zh) * 2014-12-24 2019-03-05 北京中电科电子装备有限公司 一种芯片双面助焊剂涂敷的装置
JP6475030B2 (ja) * 2015-01-30 2019-02-27 Ａｉメカテック株式会社 基板処理システム及び基板処理方法
JP6567290B2 (ja) * 2015-02-20 2019-08-28 Ａｉメカテック株式会社 基板処理装置、基板処理システム、及び基板処理方法
KR102000008B1 (ko) * 2015-04-20 2019-07-15 야마하하쓰도키 가부시키가이샤 점성 유체 공급 장치 및 부품 실장 장치
KR101935518B1 (ko) * 2016-02-15 2019-01-04 주식회사 이오테크닉스 레이저 솔더링 수선 공정, 레이저 솔더링 공정 및 레이저 솔더링 시스템
US10973161B2 (en) 2017-01-13 2021-04-06 Raytheon Company Electronic component removal device
KR102670836B1 (ko) * 2017-10-19 2024-05-30 엘지디스플레이 주식회사 제조 장치
KR20210058962A (ko) 2018-09-28 2021-05-24 보스턴 프로세스 테크놀로지스, 아이엔씨. 다중 모듈 칩 제조 장치
KR102406310B1 (ko) * 2018-10-31 2022-06-13 마이크로·텍 가부시끼가이샤 바이브레이션 장치, 바이브레이션 방법 및 진동 투입 장치
JP7477758B2 (ja) * 2019-04-30 2024-05-02 デクセリアルズ株式会社 摺動対象物の表面に対する摺動処理物の供給又は排除方法
US20220250110A1 (en) * 2019-04-30 2022-08-11 Dexerials Corporation Sliding device
JP6939950B1 (ja) * 2020-06-01 2021-09-22 住友金属鉱山株式会社 検査装置および検査方法
CN112687570B (zh) * 2020-12-28 2023-02-28 中国电子科技集团公司第十三研究所 用于陶瓷外壳焊盘焊接性能检验的试验方法
JP7489140B2 (ja) 2022-04-28 2024-05-23 Ａｉメカテック株式会社 検査・リペア装置
WO2024105918A1 (ja) * 2022-11-14 2024-05-23 パナソニックＩｐマネジメント株式会社 部品実装基板の製造方法および製造システム、ならびに搭載装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3635068B2 (ja) * 2002-03-06 2005-03-30 株式会社日立製作所 バンプ形成装置
JP3822834B2 (ja) * 2002-04-12 2006-09-20 新日本製鐵株式会社 リペア方法及び装置
JP2006066413A (ja) * 2004-08-24 2006-03-09 Hitachi Metals Ltd 導電性ボールの搭載方法及び搭載装置並びにバンプ形成方法及びバンプ形成装置
JP4683326B2 (ja) 2005-04-19 2011-05-18 日立金属株式会社 導電性ボールの搭載装置
JP2008004775A (ja) * 2006-06-22 2008-01-10 Athlete Fa Kk ボール搭載装置およびその制御方法

Also Published As

Publication number Publication date
KR20090082112A (ko) 2009-07-29
KR101027491B1 (ko) 2011-04-06
CN101494181A (zh) 2009-07-29
TW200945978A (en) 2009-11-01
JP5076922B2 (ja) 2012-11-21
CN101494181B (zh) 2010-10-06
JP2009177015A (ja) 2009-08-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees