TWI371058B - - Google Patents

Info

Publication number
TWI371058B
TWI371058B TW095113975A TW95113975A TWI371058B TW I371058 B TWI371058 B TW I371058B TW 095113975 A TW095113975 A TW 095113975A TW 95113975 A TW95113975 A TW 95113975A TW I371058 B TWI371058 B TW I371058B
Authority
TW
Taiwan
Application number
TW095113975A
Other versions
TW200644053A (en
Inventor
Yukiyasu Masuda
Hitoshi Hoshino
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW200644053A publication Critical patent/TW200644053A/zh
Application granted granted Critical
Publication of TWI371058B publication Critical patent/TWI371058B/zh

Links

TW095113975A 2005-05-19 2006-04-19 Tape applier TW200644053A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005146814A JP4676247B2 (ja) 2005-05-19 2005-05-19 テープ貼り機

Publications (2)

Publication Number Publication Date
TW200644053A TW200644053A (en) 2006-12-16
TWI371058B true TWI371058B (zh) 2012-08-21

Family

ID=37543954

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113975A TW200644053A (en) 2005-05-19 2006-04-19 Tape applier

Country Status (2)

Country Link
JP (1) JP4676247B2 (zh)
TW (1) TW200644053A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100941984B1 (ko) * 2007-09-28 2010-02-11 삼성전기주식회사 웨이퍼를 패키징하는 방법
JP5558300B2 (ja) * 2010-09-30 2014-07-23 株式会社ディスコ 粘着シート貼り替え用補助治具

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0829861B2 (ja) * 1986-08-20 1996-03-27 株式会社デイスコ マグネツト式テ−プフレ−ム位置決め装置
JPH10233430A (ja) * 1997-02-19 1998-09-02 Nitto Denko Corp 粘着テープ貼付け装置
JPH10305420A (ja) * 1997-03-04 1998-11-17 Ngk Insulators Ltd 酸化物単結晶からなる母材の加工方法、機能性デバイスの製造方法
JP2003045943A (ja) * 2001-07-31 2003-02-14 Sony Corp 半導体素子ハンドリング装置
JP2004063644A (ja) * 2002-07-26 2004-02-26 Renesas Technology Corp 半導体ウェハの保護シート着脱方法及び半導体ウェハの保護シート着脱装置

Also Published As

Publication number Publication date
JP4676247B2 (ja) 2011-04-27
JP2006324502A (ja) 2006-11-30
TW200644053A (en) 2006-12-16

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