TWI370508B - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method

Info

Publication number
TWI370508B
TWI370508B TW096150474A TW96150474A TWI370508B TW I370508 B TWI370508 B TW I370508B TW 096150474 A TW096150474 A TW 096150474A TW 96150474 A TW96150474 A TW 96150474A TW I370508 B TWI370508 B TW I370508B
Authority
TW
Taiwan
Prior art keywords
substrate processing
processing apparatus
processing method
substrate
processing
Prior art date
Application number
TW096150474A
Other languages
English (en)
Other versions
TW200901357A (en
Inventor
Mitsuyoshi Ichiro
Shibukawa Jun
Kiyokawa Shinji
Kurebayashi Tomohiro
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200901357A publication Critical patent/TW200901357A/zh
Application granted granted Critical
Publication of TWI370508B publication Critical patent/TWI370508B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW096150474A 2006-12-27 2007-12-27 Substrate processing apparatus and substrate processing method TWI370508B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006351999A JP4744426B2 (ja) 2006-12-27 2006-12-27 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
TW200901357A TW200901357A (en) 2009-01-01
TWI370508B true TWI370508B (en) 2012-08-11

Family

ID=39582200

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096150474A TWI370508B (en) 2006-12-27 2007-12-27 Substrate processing apparatus and substrate processing method

Country Status (5)

Country Link
US (3) US20080156351A1 (zh)
JP (1) JP4744426B2 (zh)
KR (1) KR100927301B1 (zh)
CN (1) CN101211757B (zh)
TW (1) TWI370508B (zh)

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JP5107122B2 (ja) * 2008-04-03 2012-12-26 大日本スクリーン製造株式会社 基板処理装置
JP5744382B2 (ja) * 2008-07-24 2015-07-08 株式会社荏原製作所 基板処理装置および基板処理方法
KR101958874B1 (ko) 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법
KR100868685B1 (ko) * 2008-07-28 2008-11-13 참앤씨(주) 평판 디스플레이 패널 검사용 반전기
KR100866831B1 (ko) * 2008-07-28 2008-11-04 주식회사 줌텍 업다운 쇼바를 갖는 평판 디스플레이 패널 검사용 반전기
KR20110106178A (ko) * 2010-03-22 2011-09-28 삼성전자주식회사 기판 처리 장치 및 방법
JP5490639B2 (ja) * 2010-07-14 2014-05-14 大日本スクリーン製造株式会社 基板処理装置および基板搬送方法
JP5877016B2 (ja) * 2011-08-26 2016-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置および基板処理装置
US9016289B2 (en) * 2011-11-28 2015-04-28 Intermolecular, Inc. System and method for reducing particles and marks on wafer surface following reactor processing
JP5959914B2 (ja) * 2012-04-18 2016-08-02 東京エレクトロン株式会社 基板処理システム、基板搬送方法および記憶媒体
JP6009832B2 (ja) 2012-06-18 2016-10-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6045869B2 (ja) * 2012-10-01 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR101441976B1 (ko) * 2013-03-27 2014-09-25 주식회사 제우스 반전유닛과 이것을 이용한 기판 이송 장치
KR101441977B1 (ko) * 2013-03-27 2014-09-25 주식회사 제우스 반전유닛과 이것을 이용한 기판 이송 장치
KR101421548B1 (ko) * 2013-04-17 2014-07-29 주식회사 제우스 기판처리장치
KR102069077B1 (ko) * 2014-08-11 2020-01-23 주식회사 제우스 기판반전장치
KR101663648B1 (ko) * 2015-03-11 2016-10-07 주식회사 영우디에스피 플렉시블 디스플레이 패널 검사용 반전기
KR102478317B1 (ko) * 2015-04-08 2022-12-16 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
US10449641B2 (en) * 2016-02-18 2019-10-22 Panasonic Intellectual Property Management Co., Ltd. System for manufacturing assembly board and method for installing undersupporting device of the system
JP6557625B2 (ja) * 2016-03-23 2019-08-07 東芝メモリ株式会社 基板の生産方法、および基板の生産システム
JP6698446B2 (ja) * 2016-07-05 2020-05-27 東京エレクトロン株式会社 基板液処理装置、基板液処理方法および記憶媒体
JP6601360B2 (ja) * 2016-09-30 2019-11-06 株式会社ダイフク 物品搬送設備
JP2018093045A (ja) * 2016-12-02 2018-06-14 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラム
US20180174873A1 (en) * 2016-12-15 2018-06-21 Applied Materials, Inc. Apparatus And Method For Processing Thin Substrates
PT3376530T (pt) * 2017-03-16 2019-11-20 Atotech Deutschland Gmbh Dispositivo automatizado de carregamento de suporte de substratos
CN108666232B (zh) * 2017-03-28 2021-11-12 雷仲礼 基板处理***、基板翻转装置和方法
JP7114424B2 (ja) * 2018-09-13 2022-08-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7152338B2 (ja) 2019-03-25 2022-10-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7359610B2 (ja) * 2019-09-13 2023-10-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7446073B2 (ja) 2019-09-27 2024-03-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7377659B2 (ja) 2019-09-27 2023-11-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2022051028A (ja) * 2020-09-18 2022-03-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

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Also Published As

Publication number Publication date
US10040102B2 (en) 2018-08-07
US20080156351A1 (en) 2008-07-03
JP2008166369A (ja) 2008-07-17
US20140202501A1 (en) 2014-07-24
KR100927301B1 (ko) 2009-11-18
JP4744426B2 (ja) 2011-08-10
KR20080061289A (ko) 2008-07-02
CN101211757A (zh) 2008-07-02
TW200901357A (en) 2009-01-01
CN101211757B (zh) 2012-02-01
US20140202499A1 (en) 2014-07-24
US8919358B2 (en) 2014-12-30

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