TWI370325B - Positive photosensitive resin composition,relief pattern and solid camera element using it - Google Patents
Positive photosensitive resin composition,relief pattern and solid camera element using itInfo
- Publication number
- TWI370325B TWI370325B TW094107131A TW94107131A TWI370325B TW I370325 B TWI370325 B TW I370325B TW 094107131 A TW094107131 A TW 094107131A TW 94107131 A TW94107131 A TW 94107131A TW I370325 B TWI370325 B TW I370325B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- photosensitive resin
- positive photosensitive
- relief pattern
- solid camera
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials For Photolithography (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004070229 | 2004-03-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200532374A TW200532374A (en) | 2005-10-01 |
TWI370325B true TWI370325B (en) | 2012-08-11 |
Family
ID=34975743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094107131A TWI370325B (en) | 2004-03-12 | 2005-03-09 | Positive photosensitive resin composition,relief pattern and solid camera element using it |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080193718A1 (zh) |
EP (1) | EP1724640B1 (zh) |
JP (1) | JP4743115B2 (zh) |
KR (1) | KR101150593B1 (zh) |
CN (1) | CN1930522B (zh) |
TW (1) | TWI370325B (zh) |
WO (1) | WO2005088396A1 (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004310076A (ja) * | 2003-03-26 | 2004-11-04 | Sumitomo Bakelite Co Ltd | ポジ型感光性樹脂組成物並びに半導体装置及び表示素子 |
JP2007122024A (ja) * | 2005-09-28 | 2007-05-17 | Toray Ind Inc | 感光性組成物 |
JP5299739B2 (ja) * | 2007-10-15 | 2013-09-25 | 富士電機株式会社 | X線用屈折レンズユニットおよびx線用屈折レンズの製造方法 |
KR101461123B1 (ko) * | 2008-05-08 | 2014-11-14 | 삼성디스플레이 주식회사 | 표시 기판의 제조 방법 및 이를 포함하는 표시 장치의 제조방법 |
KR101113063B1 (ko) * | 2008-05-22 | 2012-02-15 | 주식회사 엘지화학 | 폴리이미드와 노볼락 수지를 포함하는 감광성 수지 조성물 |
US8137901B2 (en) * | 2008-05-28 | 2012-03-20 | United Microelectronics Corp. | Method for fabricating an image sensor |
JP5343738B2 (ja) * | 2008-08-05 | 2013-11-13 | Jsr株式会社 | 樹脂組成物、光学膜及び光学用部材 |
JP5425005B2 (ja) * | 2009-08-19 | 2014-02-26 | 日本電波工業株式会社 | 圧電部品及びその製造方法 |
CN102472964B (zh) * | 2009-09-29 | 2013-08-07 | 东丽株式会社 | 正型感光性树脂组合物、使用其的固化膜及光学设备 |
MY162630A (en) * | 2010-07-02 | 2017-06-30 | Toray Industries | Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or the photosensitive resin composition film |
WO2012050400A2 (ko) * | 2010-10-14 | 2012-04-19 | 주식회사 엘지화학 | 용융 가공용 수지 혼합물 |
CN102759859B (zh) * | 2011-04-27 | 2017-10-24 | 富士胶片株式会社 | 树脂组成物、硬化物的制造方法、树脂图案制造方法、硬化物及光学部件 |
JP6110107B2 (ja) * | 2012-03-13 | 2017-04-05 | 東京応化工業株式会社 | パターン形成方法 |
JP6155823B2 (ja) * | 2012-07-12 | 2017-07-05 | Jsr株式会社 | 有機el素子、感放射線性樹脂組成物および硬化膜 |
TWI585522B (zh) * | 2012-08-31 | 2017-06-01 | 富士軟片股份有限公司 | 感光性樹脂組成物、硬化物及其製造方法、樹脂圖案的製造方法、硬化膜、液晶顯示裝置、有機el顯示裝置、以及觸控面板顯示裝置 |
WO2014136922A1 (ja) * | 2013-03-08 | 2014-09-12 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、液晶表示装置、有機el表示装置、並びに、タッチパネル表示装置 |
JP5799182B1 (ja) * | 2014-10-03 | 2015-10-21 | 富士フイルム株式会社 | シロキサン樹脂組成物、これを用いた透明硬化物、透明画素、マイクロレンズ、固体撮像素子 |
JPWO2016148176A1 (ja) * | 2015-03-19 | 2017-12-28 | 東レ株式会社 | ポジ型感光性樹脂組成物、硬化膜、tft基板、層間絶縁膜、表示装置、およびその製造方法 |
TW201800860A (zh) * | 2015-12-17 | 2018-01-01 | 陶氏全球科技責任有限公司 | 具有高介電常數之光可成像薄膜 |
TW201741765A (zh) * | 2015-12-17 | 2017-12-01 | 陶氏全球科技責任有限公司 | 具有高介電常數之光可成像薄膜 |
TW201802587A (zh) * | 2016-03-24 | 2018-01-16 | 陶氏全球科技責任有限公司 | 具有高介電常數之光可成像薄膜 |
KR102373030B1 (ko) * | 2016-03-28 | 2022-03-11 | 도레이 카부시키가이샤 | 감광성 수지 조성물 |
JP7296746B2 (ja) * | 2019-03-06 | 2023-06-23 | 太陽ホールディングス株式会社 | ポジ型感光性樹脂組成物、ドライフィルム、硬化物、および電子部品 |
US11675266B2 (en) | 2021-04-15 | 2023-06-13 | Industrial Technology Research Institute | Photosensitive compound, photosensitive composition, and patterning method |
CN113485072B (zh) * | 2021-06-22 | 2023-11-07 | 北京科华微电子材料有限公司 | 一种光刻胶组合物及其用途 |
JPWO2023281584A1 (zh) * | 2021-07-05 | 2023-01-12 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61184828A (ja) * | 1985-02-12 | 1986-08-18 | Matsushita Electronics Corp | 半導体装置の製造方法 |
DE69126975T2 (de) * | 1990-05-21 | 1997-11-27 | Nashua Corp | Mikrolinsen-bildschirme aus photopolymerisierbaren materialien und verfahren zur ihrer herstellung |
EP0483693B1 (en) * | 1990-10-29 | 1998-12-30 | Toyo Gosei Kogyo Co., Ltd. | Photosensitive colored resin composition, colored image formation method of color filter, and formation method of black matrix |
JPH05323599A (ja) * | 1992-05-22 | 1993-12-07 | Sumitomo Chem Co Ltd | 感光性フォトレジスト組成物 |
DE69408709T2 (de) * | 1993-04-28 | 1998-10-01 | Hitachi Chemical Co Ltd | Photoempfindliche Harzzusammensetzung |
JPH1164608A (ja) * | 1997-08-26 | 1999-03-05 | Dainippon Printing Co Ltd | レンチキュラーレンズ |
JP2000039503A (ja) * | 1998-07-22 | 2000-02-08 | Matsushita Electric Ind Co Ltd | レンズアレイ |
JP4390028B2 (ja) * | 2000-10-04 | 2009-12-24 | 日産化学工業株式会社 | ポジ型感光性ポリイミド樹脂組成物 |
JP3672085B2 (ja) * | 2000-10-11 | 2005-07-13 | シャープ株式会社 | 固体撮像素子およびその製造方法 |
JP3622201B2 (ja) * | 2001-02-19 | 2005-02-23 | Jsr株式会社 | 感放射線性屈折率変化性組成物 |
JP3959735B2 (ja) * | 2001-03-13 | 2007-08-15 | Jsr株式会社 | 感放射線性屈折率変化性組成物およびその利用 |
KR100739283B1 (ko) * | 2001-03-13 | 2007-07-12 | 제이에스알 가부시끼가이샤 | 감방사선성 굴절율 변화성 조성물 및 그의 이용 |
JP4310968B2 (ja) * | 2001-06-22 | 2009-08-12 | 東レ株式会社 | ポジ型感光性樹脂組成物を用いて得られるレンズおよび光導波路 |
JP4673513B2 (ja) * | 2001-08-01 | 2011-04-20 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
CN100336137C (zh) * | 2002-01-28 | 2007-09-05 | 捷时雅株式会社 | 形成电介体的光敏组合物以及利用该组合物的电介体 |
JP4062087B2 (ja) * | 2002-01-28 | 2008-03-19 | Jsr株式会社 | 感光性誘電体形成用組成物、転写フィルム、誘電体および電子部品 |
-
2005
- 2005-03-02 US US10/590,366 patent/US20080193718A1/en not_active Abandoned
- 2005-03-02 KR KR1020067018518A patent/KR101150593B1/ko active IP Right Grant
- 2005-03-02 EP EP05719779.0A patent/EP1724640B1/en not_active Not-in-force
- 2005-03-02 JP JP2006510911A patent/JP4743115B2/ja not_active Expired - Fee Related
- 2005-03-02 CN CN2005800079347A patent/CN1930522B/zh not_active Expired - Fee Related
- 2005-03-02 WO PCT/JP2005/003464 patent/WO2005088396A1/ja not_active Application Discontinuation
- 2005-03-09 TW TW094107131A patent/TWI370325B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP1724640A1 (en) | 2006-11-22 |
TW200532374A (en) | 2005-10-01 |
CN1930522A (zh) | 2007-03-14 |
JPWO2005088396A1 (ja) | 2008-01-31 |
KR20070007095A (ko) | 2007-01-12 |
JP4743115B2 (ja) | 2011-08-10 |
CN1930522B (zh) | 2013-06-12 |
EP1724640A4 (en) | 2010-04-07 |
WO2005088396A1 (ja) | 2005-09-22 |
EP1724640B1 (en) | 2015-11-18 |
US20080193718A1 (en) | 2008-08-14 |
KR101150593B1 (ko) | 2012-06-01 |
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