TWI364406B - Glass substrate for flat panel display device - Google Patents
Glass substrate for flat panel display device Download PDFInfo
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- TWI364406B TWI364406B TW094121801A TW94121801A TWI364406B TW I364406 B TWI364406 B TW I364406B TW 094121801 A TW094121801 A TW 094121801A TW 94121801 A TW94121801 A TW 94121801A TW I364406 B TWI364406 B TW I364406B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
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- Life Sciences & Earth Sciences (AREA)
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- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Glass Compositions (AREA)
- Electroluminescent Light Sources (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
ί364406 " 九、發明說明: 【發明所屬之技術領域】 本發明疋關於平面面板顯示器裝置,尤其是關於適用 於電漿顯示器裝置的玻璃基板。 【先前技術】 - 電漿顯示器裝置是以如下方式來製作。首先,在前面 玻璃基板表面形成由ΙΤ0膜或透明導電膜(以⑽膜)等所構 成的透明電極,並且在其上方塗布介電體材料,然後以500 _至600C左右的溫度進行燒成而形成介電體層。並且,在 .形成有由Α卜Ag、Ni等所構成之電極的背面玻璃基板塗布 _背面介電體材料,然後以500至60(rc左右的溫度進行燒 成而形成介電體層,並且在其上方塗布隔壁材料,然後以 500至600C左右的溫度進行燒成而形成隔壁,藉此形成電 路。然後,使前面破璃基板及背面玻璃基板相對向而進行 電極等的位置對準,然後以500至6〇(rc&右的溫度對周 鲁圍進行熔封(frit seal)而製成。 過去的玻璃基板一般是使用藉由浮式法等而形成L 8 至3. 0mm厚度的鹼石灰(socia lime)玻璃(熱膨脹係數約84 X io'7/°c)。另外,絕緣漿料、阻隔壁漿料(rib paste)、 炫封等周邊材料的熱膨脹係數也配合鹼石灰玻璃而調整成 70至90x 10_V°C的範圍。 然而’驗石灰玻璃的應變點(strain point)為500 左右之低值,因此以570至600°C的溫度進行熱處理時, 會引起熱變形或熱收縮、造成尺寸之明顯變化。結果使前 317203 5 1364406 面玻璃基板及背面玻璃基板相對向時,就不易以良好精产 實現電極之位置對準’尤其在製作大型高精細的電聚頻示 器裝置上會產生因難。 而且,鹼石灰玻璃在15〇。〇下的體積電阻率(1〇gp )是 8. 4Ω · Cm之低值,玻璃中之鹼(alkali)成分的移動度大。 因此,也有玻璃中的鹼成分會與IT0膜或透明導電膜等薄 膜電極反應,而有使電極材料之電阻值產生變化的問題。 由於這些情況,具有與驗石灰玻璃同等之熱膨脹係 數、並且具有比鹼石灰玻璃高的體積電阻率及應變點的玻 璃,乃被使用為玻璃基板以製作大型高精細的電漿顯示器 裝置。 [專利文獻1]曰本特開平8_290938號公報 [專利文獻2]日本特開平8 —29〇939號公報 【發明内容】 a电水顯示器比起其他的顯示器裝置有消耗電力大的問 年來,從環保及省能源的觀點來看,急需降低顯示 ^ 耗電力,因而期待―種可降低消耗電力的玻璃 電力之目的在於提供—種可降低顯示器裝置之消耗 的千面面板顯示器裝置用玻璃基板。 板的人進行各種檢討結果發現,藉由降低玻璃基 可降低顯示器裝置的消耗電力,於是完成 方即,本發明之平面面板顯示器裳置用玻璃基板’其 317203 6 1364406 % " 特徵為在25°C、1MHz下的介電常數為7. 〇以下。 本發明之玻璃基板由於介電常數低、可降低顯示器裝 置的消耗電力,因此適合用來作為平面面板顯示器裝置, 尤其是電激顯示器裝置的玻璃基板》 、 【實施方式】 : 本發明之平面面板顯示器裝置用玻璃基板在25。(:、 -1MHz下的介電常數是7. 〇以下之低值,因此可降低顯示器 裝置的消耗電力。如果玻璃基板的介電常數變高,就很難 #使顯示斋裝置的消耗電力降低。玻璃基板之介電常數的較 佳值為6. 9以下’更佳為6. 8以下,又更佳為6. 7以下。 此外’藉由降低玻璃基板的介電常數而可降低顯示器 裝置之消耗電力的理由,應是由於玻璃基板的介電常數低 時則為使晶胞發光一次所需的電流量就會變/小之故。 而且’在本發明的玻璃基板中,為了抑制在製造顯示 器裝置時之熱處理步驟中玻璃基板之熱變形或熱收縮的發 _生,最好是使玻璃的應變點成為58(rc以上(更佳為585它 以上、又更佳為595Ϊ以上)。 另外’在使熔融玻璃形成板狀時,為了不對成形裝置 造成負擔而使成形容易,最好是使相當於丨〇4dpa · s之黏 度的玻璃熔液的溫度成為12〇(rc以下(更佳為118(rc& 下、又更佳為117(TC以下)。 再者’為了可取得與絕緣漿料、阻隔壁漿料、熔封等 遇邊材料之熱膨脹係數的整合性,並且獲得即使急速冷卻 也不易破裂之耐熱衝擊性佳的玻璃基板,最好是使玻璃的 7 317203 ϊ364406 " 熱膨脹係數成為60至80χ 1『7°C (更佳為65至75χ 10·7 °C、又更佳為 67 至 73x 10—7/°C )。 此外’為了使玻璃基板的介電常數成為7. 〇以下,可 藉由增加S1O2的含量、或是減少MgO、CaO、SrO、BaO的 * 含量來調整’具體而言,只要在質量百分比:Si〇2為50 :至 75%、Ah〇3 為 0 至 20%、B2O3 為 0 至 20%、MgO 為 0 至 15%、Ί364406 " IX. Description of the Invention: [Technical Field] The present invention relates to a flat panel display device, and more particularly to a glass substrate suitable for use in a plasma display device. [Prior Art] - The plasma display device is fabricated in the following manner. First, a transparent electrode made of a ITO film or a transparent conductive film (by a (10) film) or the like is formed on the surface of the front glass substrate, and a dielectric material is applied thereon, and then fired at a temperature of about 500 Å to 600 C. A dielectric layer is formed. Further, the back surface glass substrate on which the electrode composed of Ag, Ni, or the like is formed is coated with a back dielectric material, and then fired at a temperature of about 500 to 60 (rc) to form a dielectric layer, and The partition material is applied to the upper portion thereof, and then fired at a temperature of about 500 to 600 C to form a partition wall, thereby forming an electric circuit. Then, the front glass substrate and the rear glass substrate are opposed to each other to position the electrodes and the like, and then The thickness of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs. (social lime) glass (thermal expansion coefficient is about 84 X io'7/°c). In addition, the thermal expansion coefficient of the insulating material, the rib paste, and the surrounding material is also adjusted to match the soda lime glass. 70 to 90x 10_V ° C. However, the limestone glass has a strain point of about 500, so when heat treated at 570 to 600 ° C, it will cause thermal deformation or heat shrinkage. Significant change in size As a result, when the front 317203 5 1364406 surface glass substrate and the rear glass substrate are opposed to each other, it is difficult to achieve the alignment of the electrodes with good precision production, which is particularly difficult to produce in a large-scale high-definition electro-frequency display device. The soda lime glass is at 15 〇. The volume resistivity (1 〇 gp ) of the underarm is 8. 4 Ω · Cm low value, and the alkali component of the glass has a large mobility. Therefore, there is also an alkali component in the glass. It reacts with a thin film electrode such as an IT0 film or a transparent conductive film, and has a problem of changing the resistance value of the electrode material. Because of these cases, it has the same thermal expansion coefficient as the limestone glass and has a higher volume resistance than the soda lime glass. The glass of the rate and the strain point is used as a glass substrate to produce a large-scale high-definition plasma display device. [Patent Document 1] JP-A-H08-290938 [Patent Document 2] Japanese Patent Laid-Open No. 8-29-939 Bulletin [Invention] A water-electric display has a large power consumption compared to other display devices. From the viewpoint of environmental protection and energy saving, it is urgent to reduce the display. In view of the power consumption, it is expected that the glass power for reducing the power consumption of the glass power supply is to provide a glass substrate for a thousand-panel panel display device which can reduce the consumption of the display device. The panel people conducted various reviews and found that the glass base was lowered. The power consumption of the display device can be reduced, so that the glass substrate of the flat panel display of the present invention is 317203 6 1364406% " characterized by a dielectric constant of 7 at 25 ° C and 1 MHz. Since the glass substrate of the present invention has a low dielectric constant and can reduce the power consumption of the display device, it is suitable for use as a flat panel display device, in particular, a glass substrate for an electro-optic display device. [Embodiment]: The plane of the present invention The glass substrate for the panel display device is at 25. (:, the dielectric constant at -1MHz is a low value of 7. 〇 below, so the power consumption of the display device can be reduced. If the dielectric constant of the glass substrate becomes high, it is difficult to reduce the power consumption of the display device. The preferred value of the dielectric constant of the glass substrate is 6.9 or less, preferably 6.8 or less, and more preferably 6.7 or less. Further, the display device can be lowered by lowering the dielectric constant of the glass substrate. The reason for the power consumption is that when the dielectric constant of the glass substrate is low, the amount of current required to cause the unit cell to emit light once is reduced/small. Moreover, in the glass substrate of the present invention, in order to suppress In the heat treatment step in the manufacture of the display device, the thermal deformation or the thermal contraction of the glass substrate is preferably such that the strain point of the glass is 58 (rc or more (more preferably 585 or more, still more preferably 595 Å or more). In addition, when the molten glass is formed into a plate shape, it is easy to form the mold so as not to burden the molding apparatus, and it is preferable to set the temperature of the glass melt corresponding to the viscosity of 丨〇4dpa·s to 12 〇 or less (more preferably Is 118 (rc& More preferably, it is 117 (below TC). In addition, in order to obtain the thermal expansion coefficient of the material encountered with the insulating paste, the barrier wall slurry, and the melt seal, and to obtain heat resistance which is not easily broken even if it is rapidly cooled. Preferably, the glass substrate has a thermal expansion coefficient of 60 to 80 χ 1 『 7 ° C (more preferably 65 to 75 χ 10·7 ° C, still more preferably 67 to 73× 10 ). -7/°C). In order to adjust the dielectric constant of the glass substrate to 7. 〇 or less, it can be adjusted by increasing the content of S1O2 or reducing the content of MgO, CaO, SrO, and BaO. As long as the mass percentage: Si〇2 is 50: to 75%, Ah〇3 is 0 to 20%, B2O3 is 0 to 20%, and MgO is 0 to 15%.
CaO 為 0 至 15%、SrO 為 0 至 15%、BaO 為 〇 至 15%、ZnO 為 0 至 5%、Li2〇 為 0 至 5%、Na2〇 為 0 至 15%、κ2〇 為 0 至 15%、 φ ZrCh為0至10%的範圍内適當選擇即可。 另外’為了獲得具有7. 0以下的介電常數、580°C以上 的應變點、1180°C以下之相當於l〇4dPa · s之黏度的玻璃 溶液的溫度及60至80x l(T7/t:之熱膨脹係數的玻璃基 板’在上述組成範圍當中’最好是從質量百分比:Si〇2為 55 至 74%、Al2〇3 為 0· 5 至 4%、Bz〇3 為 〇 至 20%、MgO 為 1 至 15% 、 CaO 為 〇 至 8% 、 SrO 為 1 至 15% 、 BaO 為 0 至 5% 、 籲__他〇編為15至m、Zn〇為〇至5%、Ll2〇為〇 至 5% ' Na2〇 為 〇 至 8%、K2〇 為 2 至 12%、Zr〇2 為 0 至 7%的 範圍内(組成範圍A);或質量百分比:以〇2為55至7掮、CaO is 0 to 15%, SrO is 0 to 15%, BaO is 〇 to 15%, ZnO is 0 to 5%, Li2〇 is 0 to 5%, Na2〇 is 0 to 15%, and κ2 is 0 to 15 %, φ ZrCh may be appropriately selected within the range of 0 to 10%. In addition, in order to obtain a dielectric constant having a dielectric constant of 7.0 or less, a strain point of 580 ° C or more, a viscosity of a glass solution corresponding to a viscosity of 1 ° 4 dPa · s at 1180 ° C or lower, and 60 to 80 x 1 (T7/t The thermal expansion coefficient of the glass substrate 'in the above composition range' is preferably from mass percentage: Si〇2 is 55 to 74%, Al2〇3 is 0·5 to 4%, and Bz〇3 is 〇 to 20%. MgO is 1 to 15%, CaO is 〇 to 8%, SrO is 1 to 15%, BaO is 0 to 5%, __他〇 is 15 to m, Zn〇 is 〇 to 5%, Ll2〇 is 〇 to 5% 'Na2〇 is 8% to 8%, K2〇 is 2 to 12%, Zr〇2 is in the range of 0 to 7% (composition range A); or mass percentage: 〇2 is 55 to 7掮,
Ah〇3 為 〇 至未滿 2. 5%、B2O3 為 〇 至 20%、MgO 為 1 至 1 5%、 CaO 為 0 至 8%、SrO 為 1 至 15%、BaO 為 0 至 5%、 MgO+CaO+SrO+BaO 為 15 至 27%、ZnO 為 0 至 5°/。、Li2〇 為 〇 至5%、Na2〇為〇至8%、K2〇為2至12%、Zr〇2為超過1〇/0至 7%,且Zr〇2含量>Α12〇3含量的範圍内(組成範圍β)適當選 擇玻璃組成為宜。 8 317203 1364406 尤其,從組成範圍B選擇玻璃組成時,較容易獲得具 有6. 9以下的介電常數、595。(:以上的應變點、1170°C以下 之相當於104dPa· s之黏度的玻璃熔液的溫度、以及67至 73x l〇-7/°C之熱膨脹係數的玻璃基板。 在本發明之平面面板顯示器裝置用玻璃基板當中,將 : 玻璃的組成如纟且成範圍A所示加以限定的理由如下所述。Ah〇3 is 〇 to less than 2.5%, B2O3 is 〇 to 20%, MgO is 1 to 5%, CaO is 0 to 8%, SrO is 1 to 15%, BaO is 0 to 5%, MgO +CaO+SrO+BaO is 15 to 27%, and ZnO is 0 to 5°/. , Li2〇 is 5% to 5%, Na2〇 is 〇 to 8%, K2〇 is 2 to 12%, Zr〇2 is more than 1〇/0 to 7%, and Zr〇2 content > Α12〇3 content It is preferable to appropriately select the glass composition within the range (composition range β). 8 317203 1364406 In particular, when the glass composition is selected from the composition range B, it is easier to obtain a dielectric constant of 5.9 or less, 595. (: the above strain point, a glass substrate having a viscosity equivalent to a viscosity of 104 dPa·s at 1170 ° C or less, and a glass substrate having a thermal expansion coefficient of 67 to 73 x 1 〇 -7 / ° C. Among the glass substrates for display devices, the reason why the composition of the glass is limited as shown in the range A is as follows.
Si〇2是降低玻璃的介電常數、或形成玻璃之網路成形 劑的成分。其含量為55至74% ’較佳為56至70%,更佳為 58至70%。如果Si〇2的含量變多,可降低玻璃的介電常數, 但疋玻璃的尚溫黏度會變高’以致溶融、成形變得困難、 或是熱膨脹係數會變得過小,以致不易取得與周邊材料的 整合性。另一方面,如果含量變少,則玻璃的介電常數會 變南’以致不易使顯示器裝置的消耗電力降低。而且,熱 膨脹係數會變大以致玻璃的耐熱衝擊性降低、或是玻璃的 應k點降低,在製造顯示器裝置時的熱處理步驟當中,便Si〇2 is a component that lowers the dielectric constant of the glass or forms a network forming agent for the glass. The content is 55 to 74%', preferably 56 to 70%, more preferably 58 to 70%. If the content of Si〇2 is increased, the dielectric constant of the glass can be lowered, but the viscosity of the glass will become higher, so that melting, forming becomes difficult, or the coefficient of thermal expansion becomes too small, so that it is difficult to obtain and the periphery. The integration of materials. On the other hand, if the content is small, the dielectric constant of the glass becomes south, so that it is difficult to lower the power consumption of the display device. Moreover, the coefficient of thermal expansion becomes so large that the thermal shock resistance of the glass is lowered, or the point of the glass is lowered, and during the heat treatment step in manufacturing the display device,
容易在玻璃基板發生破裂或引起熱變形或熱收縮。It is easy to crack or cause thermal deformation or heat shrinkage on the glass substrate.
AhO3是提高玻璃之應變點的成分。其含量為〇5%至 4%、較佳為1至4%、更佳為}至3·5ρ如果Ah〇3的含量 父夕’則玻璃的向溫黏度會變高’以致炼融 '成形變得困 難、或是熱膨脹係數會變小以致不易取得與周邊材料的整 合性。另一方面,如果含量變少,則熱膨脹係數會變大以 致玻璃的耐熱衝擊性降低,或是玻璃的應變點降低,在势 造顯示器裝置時的熱處理步驟當中,便容易在玻璃基板發 生破裂或引起熱變形或熱收縮。 317203 9 1364406 ML是降低介電常數的成分。其含量為〇至2〇%、較佳 為0至1 0%、更佳為0至5%。如杲β2〇3的含量變多,則破 璃的應變點會降低,在製造顯示器裝置時的熱處理步驟當 t,便容易在玻璃基板發生破裂或引起熱變形或熱收縮。AhO3 is a component that increases the strain point of the glass. The content is 〇5% to 4%, preferably 1% to 4%, more preferably 至3·5ρ. If the content of Ah 〇3 is the parent's temperature, the viscosity of the glass will become higher, so that the smelting is formed. It becomes difficult, or the coefficient of thermal expansion becomes small, so that it is difficult to obtain integration with peripheral materials. On the other hand, if the content is small, the coefficient of thermal expansion becomes so large that the thermal shock resistance of the glass is lowered, or the strain point of the glass is lowered, and in the heat treatment step in the case of the display device, the glass substrate is liable to be broken or Causes thermal deformation or heat shrinkage. 317203 9 1364406 ML is a component that lowers the dielectric constant. The content is from 〇 to 2% by weight, preferably from 0 to 10%, more preferably from 0 to 5%. If the content of 杲β2〇3 is increased, the strain point of the glass is lowered, and the heat treatment step at the time of manufacturing the display device is likely to cause cracking or thermal deformation or thermal contraction on the glass substrate.
MgO疋使破璃的高溫黏度降低而提高炫融性及成形性 的成分。其含量為i至15%、較佳為2至13%、更佳為3 至12%。如果Mg〇的含量變多,則玻璃的介電常數會變高, 而不易使顯示器裝置的消耗電力降低。而且,玻璃變得容 •易失透而不易成形。另一方自,如果含量變少,則玻璃的 高溫黏度會上升,以致熔融、成形變得困難。The MgO 降低 reduces the high-temperature viscosity of the glass to improve the smelting and formability. The content is from i to 15%, preferably from 2 to 13%, more preferably from 3 to 12%. If the content of Mg 变 is increased, the dielectric constant of the glass becomes high, and it is difficult to reduce the power consumption of the display device. Moreover, the glass becomes easy to devitrify and is not easily formed. On the other hand, if the content is small, the high-temperature viscosity of the glass rises, so that melting and forming become difficult.
CaO與MgO同樣是使玻璃的高溫黏度降低而提高熔融 性及成形性的成分。其含量為〇至8%、較佳為】至8%、更 佳為1至7%。如果Ca0的含量變乡,則玻璃的介電常數會 變高,以致不易使顯示器裝置的消耗電力降低。而且,‘ 璃變得容易失透而不易成形。 S r 0是使玻璃的高溫黏度降低而提高炫融性及成形性 的成分。其含量為1至15%、較佳為3至15%、更佳為4 至13%。如果SrO的令吾树夕 a,,. ]S里文多,則玻璃的介電常數會明顯 變高,以致不易使顯示哭奘荖^ 只丁态衣置的泊耗電力降低。另一方面, 如果含量變少,則破璃的高1 两曰问/皿4度會上升’以致熔融、成 形變得困難。Similarly to MgO, CaO is a component which lowers the high-temperature viscosity of glass and improves the meltability and formability. The content is from 〇 to 8%, preferably from 8% to 8%, more preferably from 1 to 7%. If the content of Ca0 changes, the dielectric constant of the glass becomes high, so that it is difficult to reduce the power consumption of the display device. Moreover, 'the glass becomes easy to devitrify and is not easy to form. S r 0 is a component which lowers the high-temperature viscosity of the glass and improves the smelting property and the formability. The content is from 1 to 15%, preferably from 3 to 15%, more preferably from 4 to 13%. If SrO's saplings a,,., S Rivin, the dielectric constant of the glass will become significantly higher, so that it is not easy to reduce the power consumption of the display. On the other hand, if the content is small, the height of the glass is increased, and the height of the glass is increased by 4 degrees, so that melting and forming become difficult.
BaO是使玻璃的高溫京疮 ^ —占度卩牛低而k向溶融性及成形性 的成分。其含量為〇至5〇/、卜& η ^ 主W、較佳為0至4% '更佳為〇至 3%。如果BaO的含量轡炙曰β a 夕,則玻㈣的;丨電常數會明顯變高 317203 1364406 - 以致不易使顯示益裝置的消耗電力降低。而且,玻璃變得 容易失透而不易成形。 此外,為了降低玻續的高溫黏度,使炫融性及成形性 提升而不致增強玻璃的失透性,Mg〇、Ca〇 ' Sr〇及Ba〇的 總罝杈佳為15至27%(較佳為16 8至27%、更佳為18以上 •至27%)。如不这些成分的總量變多’則玻璃會變得容易失 透。如果這些成分的總量變少,則玻璃的高溫黏度會上升, 以致炫融、成形變得困難。 • Zn〇是使玻璃的高溫黏度降低而提高熔融性及成形性 的成分。其含I為〇至5%、較佳為〇至、更佳為〇至 1%。如果ZnO的含量變多,則玻璃的介電常數會變高,以 致不易使顯示器裝置的消耗電力降低。BaO is a component that makes the glass high-temperature Beijing sore--the calf is low and k-direction meltability and formability. The content is 〇 to 5 〇 /, 卜 & η ^ main W, preferably 0 to 4% 'more preferably 〇 to 3%. If the content of BaO is 辔炙曰β a, then the glass (four); the 丨 electric constant will become significantly higher 317203 1364406 - so that it is not easy to reduce the power consumption of the display device. Moreover, the glass becomes easily devitrified and is not easily formed. In addition, in order to reduce the high-temperature viscosity of the glass, the smelting property and the formability are improved without enhancing the devitrification of the glass, the total enthalpy of Mg 〇, Ca 〇 ' Sr 〇 and Ba 罝杈 is preferably 15 to 27% (Comparative) Good is 16 8 to 27%, more preferably 18 or more to 27%). If the total amount of these components does not increase, the glass will become easily devitrified. If the total amount of these components is small, the high-temperature viscosity of the glass rises, so that it becomes difficult to melt and form. • Zn〇 is a component that lowers the high-temperature viscosity of glass and improves meltability and formability. It contains I from 〇 to 5%, preferably 〇 to, more preferably from 〇 to 1%. If the content of ZnO is increased, the dielectric constant of the glass becomes high, so that it is difficult to reduce the power consumption of the display device.
LnO疋使玻璃的高溫黏度降低而提高熔融性及成形性 的成分。而且也是調整玻璃之熱膨脹係數的成分。其含量 為0至5°/。、較佳為〇至3%、更佳為〇至1%。如果Li2〇的 含量變多,則玻璃的應變點會明顯降低,以致在製造顯示 器裝置時的熱處理步驟當中,容易引起熱變形或熱收縮。 而且,熱%脹係數會變得過大,以致玻璃的耐熱衝擊性降 低、或不易與週邊材料的熱膨脹係數整合。LnO疋 reduces the high-temperature viscosity of the glass to improve the meltability and formability of the component. It is also a component that adjusts the thermal expansion coefficient of the glass. Its content is 0 to 5 ° /. Preferably, it is from 3% to 3%, more preferably from 〇 to 1%. If the content of Li2〇 is increased, the strain point of the glass is remarkably lowered, so that heat deformation or heat shrinkage is likely to occur during the heat treatment step in manufacturing the display device. Moreover, the coefficient of thermal % expansion becomes too large, so that the thermal shock resistance of the glass is lowered or it is difficult to integrate with the coefficient of thermal expansion of the peripheral material.
Na2〇是使玻璃的高溫黏度降低而提高熔融性及成形性 的成分。而且也是調整玻璃之熱膨脹係數的成分。其含量 為0至8%、較佳為〇至6% '更佳為〇 5至5%。如果Na2〇 的含f變多,則玻璃的應變點會降低,以致在製造顯示器 裝置時的熱處理步驟當中’容易引起熱變形或熱收縮。而 11 317203 ^04406 且,熱膨脹係數會變得過纟,以致玻璃的耐熱衝擊性降低、 或不易與週邊材料的熱膨脹係數整合。 K2〇與Na2〇同樣是使玻璃❾高溫點度降低而提高炫融 性及成形性的成分。而且也是調整玻璃之熱膨脹係數的成 分。其含量為2至12%、較佳為2至11%、更佳為2至1〇%。 如果Κβ的含量變多,則玻璃的應變點會降低,以致在製 造顯示器裝置時的熱處理步驟當中,容易引起熱變形或熱 收鈿。而且,熱膨脹係數會變得過大,以致玻璃的耐熱衝 鳙擊性降低、或不易與週邊材料的熱膨脹係數整合。另一方 .面,如果含量變少,則玻璃的高溫黏度會上升,以致熔融、 成形變得困難。而且’熱膨脹係數會變得過小,以致不易 與周邊材料的熱膨脹係數整合。Na2 is a component which lowers the high-temperature viscosity of glass and improves the meltability and formability. It is also a component that adjusts the thermal expansion coefficient of the glass. The content is from 0 to 8%, preferably from 〇 to 6%', more preferably from 5 to 5%. If the f content of Na2〇 is increased, the strain point of the glass is lowered, so that heat deformation or heat shrinkage is easily caused in the heat treatment step in manufacturing the display device. On the other hand, 11 317203 ^04406, the coefficient of thermal expansion becomes too large, so that the thermal shock resistance of the glass is lowered, or it is difficult to integrate with the thermal expansion coefficient of the peripheral material. K2〇 and Na2〇 are components which lower the high temperature of the glass crucible and improve the smelting property and formability. It is also a component that adjusts the coefficient of thermal expansion of the glass. The content is 2 to 12%, preferably 2 to 11%, more preferably 2 to 1% by weight. If the content of Κβ is increased, the strain point of the glass is lowered, so that heat deformation or heat entanglement is liable to occur during the heat treatment step in the manufacture of the display device. Moreover, the coefficient of thermal expansion may become too large, so that the heat shock resistance of the glass is lowered or it is not easily integrated with the coefficient of thermal expansion of the peripheral material. On the other hand, if the content is small, the high-temperature viscosity of the glass rises, so that melting and forming become difficult. Moreover, the coefficient of thermal expansion becomes too small to be easily integrated with the coefficient of thermal expansion of the peripheral material.
Zr〇2是提南玻璃之應變點的成分。其含量為〇至7%、 較佳為0至3%、更佳為〇至1%。如果Zr〇2的含量變多, 則’丨電4數會變南’以致不易使顯示器裝置的消耗電力降Zr〇2 is the composition of the strain point of the Tyrann glass. The content is from 〇 to 7%, preferably from 0 to 3%, more preferably from 〇 to 1%. If the content of Zr 〇 2 is increased, the number of 丨 4 4 will become south, so that it is difficult to reduce the power consumption of the display device.
低。而且會產生失透物’以致成形變得困難。 此外’在包含1 %以上之A12〇3的組成系當中,如果包 έ大里Ζι*〇2 ’則-谷易發生由於Zi*〇2所引起的失透物,因此 最好是將Zr〇2的含量限制在1%以下。 另外’在本發明之平面面板顯示器裝置用玻璃基板當 中’將玻璃的組成如組成範圍B加以限定的理由如下所述。low. Moreover, a devitrified substance is generated so that forming becomes difficult. In addition, in the composition system containing more than 1% of A12〇3, if the package is large, Ζι*〇2', then the valley is susceptible to devitrification caused by Zi*〇2, so it is better to use Zr〇2. The content is limited to less than 1%. Further, the reason why the composition of the glass is limited to the composition range B in the glass substrate for a flat panel display device of the present invention is as follows.
Si 〇2是降低玻璃的介電常數、或形成玻璃之網路成形 劑的成分。其含量為55至74%,較佳為56至70%,更佳為 58至70%。如果Si〇2的含量變多,可降低玻璃的介電常數, 317203 J364406 但是卻會使玻璃的高溫黏度變高,以致溶融、成形變彳寻困 難、或是熱膨脹係數會變得過小以致不易取得與周邊材才斗 的整合性。另一方面,如果含量變少’則玻璃的介電常數 會變高,以致不易使顯示器裝置的消耗電力降低。而且, 熱膨脹係數會變大以致玻璃的耐熱衝擊性降低、或是玻璃 : 的應變點降低,在製造顯示器裝置時的熱處理步驟當中, . 便容易在玻璃基板發生破裂或引起熱變形或熱收縮。 A 12〇3是提高玻璃之應變點的成分。其含量為〇至未滿 鲁5%、較佳為0至1. δ%、更佳為0至未滿1%。如果Ah .的含量變多,則玻璃的高溫黏度會明顯變高,以致熔融、 •成形變得困難、或是熱膨脹係數會變小以致不易取得與周 邊材料的整合性。 IM)3疋降低介電常數的成分。其含量為〇至、較佳 為〇至10%、更佳為〇至5%。如果B2〇3的含量變多,則玻 2的應變點會降低,在製造顯示器裝置時的熱處理步驟當 ,便容易在玻璃基板發生破裂或引㈣變形或敎收缩。 使破璃的高溫黏度降低而提高熔融性及成形性 刀、、含置為1至⑽、較佳為6.5至11%、更佳為 」至11%。如*Mg0的含量變多,則破璃的介 兩’以致不易# Jg _τ· 口口 a士巾 曰又 合變得1 ^ Μ的消耗電力降低。而且,玻璃 玻严溫黏度會上升,以致炫融、成形變得困難。 性及二==::: =度降低而提高熔融 ” 3里為0至8%、較佳為〇至5%、更 317203 13 J364406 佳為1至3. 5%。如果ca〇的含量變多 又夕則玻璃的介電常數 會變高,以致不易使顯示器裝置的消耗電力 玻璃會變得容易失透以致成形變得困難。 _ ’Si 〇 2 is a component that lowers the dielectric constant of the glass or forms a network forming agent for the glass. The content is from 55 to 74%, preferably from 56 to 70%, more preferably from 58 to 70%. If the content of Si〇2 is increased, the dielectric constant of the glass can be lowered, but 317203 J364406 can increase the high-temperature viscosity of the glass, so that the melting, forming becomes difficult, or the coefficient of thermal expansion becomes too small to be easily obtained. Integration with the surrounding materials. On the other hand, if the content becomes small, the dielectric constant of the glass becomes high, so that it is difficult to lower the power consumption of the display device. Further, the coefficient of thermal expansion becomes so large that the thermal shock resistance of the glass is lowered, or the strain point of the glass is lowered, and during the heat treatment step in manufacturing the display device, it is easy to cause cracking or thermal deformation or thermal contraction on the glass substrate. A 12〇3 is a component that increases the strain point of the glass. The content is from 〇 to less than 5%, preferably from 0 to 1. δ%, more preferably from 0 to less than 1%. If the content of Ah is increased, the high-temperature viscosity of the glass becomes so high that melting, forming becomes difficult, or the coefficient of thermal expansion becomes small so that integration with peripheral materials is not easily obtained. IM) 3疋 reduces the composition of the dielectric constant. The content is 〇, preferably 〇 to 10%, more preferably 〇 to 5%. If the content of B2〇3 is increased, the strain point of the glass 2 is lowered, and when the heat treatment step is performed in the manufacture of the display device, it is easy to cause cracking or (four) deformation or shrinkage of the glass substrate. The high-temperature viscosity of the glass is lowered to improve the meltability and formability, and the knives are set to 1 to (10), preferably 6.5 to 11%, more preferably "11%". If the content of *Mg0 is increased, the amount of the glass is so small that it is not easy. #Jg _τ· 口 口 士 士 曰 曰 变得 变得 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Moreover, the glass-bright temperature viscosity will rise, making it difficult to melt and form. Sex and the second ==::: = degree decreases and increases the melting" 3 to 0 to 8%, preferably 〇 to 5%, more 317203 13 J364406 preferably 1 to 3. 5%. If the content of ca〇 changes In many cases, the dielectric constant of the glass becomes high, so that it is difficult to make the power consuming glass of the display device easily devitrified, so that forming becomes difficult.
SrO是使玻璃的高溫黏度降低而提高㈣性及成形性 的成分。其含量為1至i 5%、較佳為7至(3%、更佳為7.5 :至13%。如果SirG的含量變多,則麵的介電常數會明顯 ’變高,以致不易使顯示器裝置的消耗電力降低。另一方面, .如果含量變少,.則玻螭的高溫黏度會上升,以致熔融、成 籲形變得困難。SrO is a component which lowers the high-temperature viscosity of glass and improves (tetra) and formability. The content is from 1 to i 5%, preferably from 7 to (3%, more preferably from 7.5 to 13%. If the content of SirG is increased, the dielectric constant of the surface is significantly 'high, so that the display is not easily made The power consumption of the device is lowered. On the other hand, if the content is small, the high-temperature viscosity of the glass bottle will rise, so that melting and forming a shape become difficult.
BaO是使玻璃的高溫黏度降低而提高熔融性及成形性 的成分。其含量為0至5%、較佳為〇至4%、更佳為〇至 2.5%。如果BaO的含量變多,則玻璃的介電常數會明顯變 高,以致不易使顯示器裝置的消耗電力降低。而且,玻璃 會變得容易失透以致成形變得困難。 此外,為了降低玻璃的高溫黏度,使熔融性及成形性 鲁提升而不致增強玻璃的失透性’ Mg〇、ca〇、SrO及BaO的 總量敎佳為15至27%(更佳為16. 8至27%、又更佳為18 以上至27%)。如果這些成分的總量變多,則玻璃會變得容 易失透。另外,如果這些成分的總量變少,則玻璃的高溫 黏度會上升’以致熔融、成形變得困難。BaO is a component which lowers the high-temperature viscosity of glass and improves the meltability and formability. The content is from 0 to 5%, preferably from 〇 to 4%, more preferably from 〇 to 2.5%. If the content of BaO is increased, the dielectric constant of the glass is remarkably high, so that it is difficult to reduce the power consumption of the display device. Moreover, the glass becomes easily devitrified so that forming becomes difficult. In addition, in order to lower the high-temperature viscosity of the glass, the meltability and formability are improved without increasing the devitrification of the glass. The total amount of Mg〇, ca〇, SrO and BaO is preferably 15 to 27% (more preferably 16). 8 to 27%, more preferably 18 or 27%). If the total amount of these ingredients is increased, the glass becomes devitrified. Further, if the total amount of these components is small, the high-temperature viscosity of the glass rises, so that melting and molding become difficult.
ZnO是使玻璃的高溫黏度降低而提高熔融性及成形性 的成分。其含量為〇至5%、較佳為〇至3%、更佳為〇至 1 %。如果ZnO的含量變多,則玻璃的介電常數會變高,以 致不易使顯示器裝置的消耗電力降低。 14 317203 ^364406ZnO is a component which lowers the high-temperature viscosity of glass and improves the meltability and formability. The content is from 〇 to 5%, preferably from 〇 to 3%, more preferably from 〇 to 1%. If the content of ZnO is increased, the dielectric constant of the glass becomes high, so that it is difficult to reduce the power consumption of the display device. 14 317203 ^364406
LizO是使玻璃的高溫黏度降低而提高熔融性及成形性 的成分。而且也是調整玻璃之熱膨脹係數的成分。其含量 為0至5%、較佳為〇至3%、更佳為〇至1%。如果Ll2〇的 含s變多,則玻璃的應變點會明顯降低,以致在製造顯示 器裝置時的熱處理步驟當中,容易引起熱變形或熱收縮。 而且,熱膨脹係數會變得過大,以致玻璃的耐熱衝擊性降 低、或不易與週邊材料的熱膨脹係數整合。LizO is a component which lowers the high-temperature viscosity of glass and improves the meltability and formability. It is also a component that adjusts the thermal expansion coefficient of the glass. The content is from 0 to 5%, preferably from 〇 to 3%, more preferably from 〇 to 1%. If the s content of Ll2〇 is increased, the strain point of the glass is remarkably lowered, so that heat deformation or heat shrinkage is likely to occur during the heat treatment step in manufacturing the display device. Moreover, the coefficient of thermal expansion may become too large, so that the thermal shock resistance of the glass is lowered or it is not easily integrated with the coefficient of thermal expansion of the peripheral material.
NazO是使玻璃的高溫黏度降低而提高熔融性及成形性 籲的成分。而且也是調整玻璃之熱膨脹係數的成分。其含量 為0至8%、較佳為1至5%、更佳為1至3%。如果肋2〇的 含畺差多,則玻璃的應變點會降低,以致在製造顯示器裝 置時的熱處理步驟當中,容易引起熱變形或熱收縮。而且, 熱%脹係數會變得過大,以致玻璃的耐熱衝擊性降低、或 不易與週邊材料的熱膨脹係數整合。NazO is a component that lowers the high-temperature viscosity of glass and improves the meltability and formability. It is also a component that adjusts the thermal expansion coefficient of the glass. The content is from 0 to 8%, preferably from 1 to 5%, more preferably from 1 to 3%. If the ribs of the ribs 2〇 are large, the strain point of the glass is lowered, so that heat deformation or heat shrinkage is likely to occur during the heat treatment step in manufacturing the display device. Moreover, the coefficient of thermal % expansion becomes too large, so that the thermal shock resistance of the glass is lowered or it is difficult to integrate with the coefficient of thermal expansion of the peripheral material.
K2〇與NazO同樣是使玻璃的高溫黏度降低而提高熔融 性及成形性的成分。而且也是調整玻璃之熱膨脹係數的成 刀其含里為2至12%、較佳為3至10%、吏佳為4至7%。 如果κα的含量變多,則玻璃的應變點會降低,以致在製 造顯示器裝置時的熱處理步驟當中,容易引起熱變形或熱 收縮。而且,熱膨脹係數會變得過大,以致玻璃的耐熱衝 4性降低、或不易與週邊材料的熱膨脹係數整合。另一方 面’如果含量變少’則玻璃的高溫黏度會上升,以致熔融、 成形變得困難。而且,熱膨脹係.數會變得過小,以致不易 與周邊材料的熱膨脹係數整合。 317203 1364406Like NazO, K2 is a component that lowers the high-temperature viscosity of glass and improves the meltability and formability. Further, the knives for adjusting the thermal expansion coefficient of the glass are 2 to 12%, preferably 3 to 10%, and preferably 4 to 7%. If the content of κα is increased, the strain point of the glass is lowered, so that heat deformation or heat shrinkage is liable to occur during the heat treatment step in the manufacture of the display device. Moreover, the coefficient of thermal expansion may become too large, so that the heat resistance of the glass is lowered or it is not easily integrated with the coefficient of thermal expansion of the peripheral material. On the other hand, if the content is small, the high-temperature viscosity of the glass rises, so that melting and molding become difficult. Moreover, the number of thermal expansion systems becomes too small to be easily integrated with the thermal expansion coefficient of the peripheral material. 317203 1364406
Zr〇2疋不提南玻璃之南溫黏度而明顯提高玻璃之應變 點的成分。其含量為超過1%至7%、較佳為超過1%至㈣、 更佳為超過1%至3%。如杲Zr〇2的含量變多,則介電常數 會變高,以致不易使顯示器裝置的消粍電力降低。而且會 產生失透物’以致成形變得困難。另一方面,如果含量^ 少’則不易獲得使玻璃之應變點提高的效果。 此外,為了明顯提高玻璃的應變點而不致顯著提高玻 璃的高溫黏度,只要使Zr〇2的含量比Al2〇3的含量多即可。 肇而且,為了降低玻璃的高溫黏度使成形變得容易,在 A12〇3的含罝未滿1 %的組成系當中,為了提高玻璃的應變點 最好是使Zr〇2的含量多於1 %。 此外,本發明當中,除了上述組成範圍人及B所記載 的成分以外’例如亦可為了防止紫外線上色而將τ丨〇2添加 至5%、為了提升耐破裂性而將pa5添加至4%、為了使液相 溫度降低’使成形性提升而將LI、La』3、Nb2〇3各添加至 参3%、就著色劑而言可將Fe2〇3、C〇0、NiO、〇2〇3 '齡〇3各 添加至2%、就澄清劑而言可將As2〇3、Sb2〇3、Sn〇2、s〇3、F、Zr〇2 does not mention the south temperature viscosity of the south glass and significantly increases the composition of the strain point of the glass. The content is more than 1% to 7%, preferably more than 1% to (4), more preferably more than 1% to 3%. If the content of 杲Zr〇2 is increased, the dielectric constant becomes high, so that it is difficult to reduce the power consumption of the display device. Moreover, a devitrified substance is generated so that forming becomes difficult. On the other hand, if the content is small, it is difficult to obtain an effect of improving the strain point of the glass. Further, in order to significantly increase the strain point of the glass without significantly increasing the high-temperature viscosity of the glass, the content of Zr〇2 may be made larger than the content of Al2〇3. Furthermore, in order to reduce the high-temperature viscosity of the glass, it is easy to form. In the composition of A12〇3 containing less than 1% of yttrium, in order to increase the strain point of the glass, it is preferable to make the content of Zr〇2 more than 1%. . Further, in the present invention, in addition to the components described in the above-mentioned composition range and B, for example, τ 丨〇 2 may be added to 5% in order to prevent ultraviolet ray coloring, and pa 5 may be added to 4% in order to improve crack resistance. In order to lower the liquidus temperature, 'LI, La』3, Nb2〇3 are added to the reference 3%, and the coloring agent can be Fe2〇3, C〇0, NiO, 〇2〇. 3 'age 〇3 each added to 2%, for clarifying agents, As2〇3, Sb2〇3, Sn〇2, s〇3, F,
Cl等的總量添加至1%。但是,利用浮式法成形的情況下, AszO3、Sbz〇3會在浮槽(fi〇at bath)中還原而變成金屬異 物,因此應該避免導入。 接下來’針對製造本發明之平面面板顯示器裝置用玻 璃基板的方法加以說明。 首先’調和玻璃原料使其形成上述玻璃組成範圍。接 下來’將調和後的玻璃原料投入連續熔融爐而進行加熱熔 317203 1364406 j • 融及脫泡之後,供應至成形裝置而形成板狀,使其徐冷即 可獲得玻璃基板。 此外,玻璃基板的成形方法有浮式(fl〇at)法、流孔下 弓I (slot downdraw)法、溢流下弓丨(〇vern〇w加抓打㈣)法、 回引(redraw)法等各種成形方法,但以利用浮式法形成板 ·-狀為佳。其理由是因為容易以較為便宜的價格獲得大型的 . 玻璃基板。 較佳管施例的說明The total amount of Cl or the like was added to 1%. However, in the case of forming by the floating method, AszO3 and Sbz〇3 are reduced in a float bath to become a metal foreign matter, so introduction should be avoided. Next, a method of manufacturing a glass substrate for a flat panel display device of the present invention will be described. First, the glass raw materials are blended to form the above glass composition range. Next, the tempered glass raw material is put into a continuous melting furnace and heated and melted. 317203 1364406 j. After melting and defoaming, it is supplied to a molding apparatus to form a plate shape, and the glass substrate can be obtained by being cooled. In addition, the glass substrate is formed by a float method, a slot downdraw method, an overflow lower bow (〇vern〇w plus scratching (four)) method, and a redraw method. Various molding methods are preferred, but it is preferable to form the sheet shape by the floating method. The reason is because it is easy to obtain a large glass substrate at a relatively low price. Description of preferred pipe examples
• 以下,根據實施例來詳細說明本發明之平面面板顯示 .器裝置用玻璃基板。 〜7F 表1至表4顯示本發明之實施例(試料N〇.丄至2〇)及 比較例(試料Mo.21)。試料No.21是市售的電聚顯示器裝 置用的而應變點破璃。 317203 17 ,1364406 表1 實施例 No. 1 No. 2 No. 3 No. 4 No. 5 No. 6 組成(質量%) Si〇2 65. 2 67. 5 67. 4 66. 5 68. 5 67. 7 A 1 2〇3 3. 3 1.5 2. 2 3. 0 1. 0 1.0 MgO 7.0 7. 0 6. 5 7. 0 6. 9 6. 9 CaO 3. 3 3. 0 2. 8 3. 0 3. 1 3.1 SrO 12. 5 12. 5 12. 5 12. 4 12. 4 12. 4 BaO _ — — — 0. 2 Na2〇 3. 5 3. 5 2. 5 2. 0 2. 0 1.0 K2〇 5· 0 5. 0 6.0 6. 0 6.0 7.5 Zr〇2 0.2 _ 0. 1 _ — _ S〇3 — — — 0.1 0. 1 0.2 P2O5 — — — 一 _ — 介電常數 6. 8 6. 7 6. 8 6. 7 6. 6 6. 8 應變點(°C ) 585 580 590 595 590 605 104(°C ) 1140 1140 1145 1160 1165 1180 熱膨脹係數[30至 >380°C](x 10"7/°C) 74. 0 75. 0 70. 0 71.0 71.0 71. 0 317203 1364406 表2 實施例 No. 7 No. 8 No. 9 No. 10 No. 11 No. 12 組成(質量%) Si〇2 66. 9 68. 8 64. 7 67. 4 67. 4 67. 4 A 1 2〇3 1· 0 1.0 4. 6 — — 0. 5 MgO 6. 9 8. 0 6.6 8. 2 8. 2 8. 2 CaO 5. 6 2. 8 2. 5 2. 8 2. 8 2. 8 SrO 10. 0 12. 4 7. 7 9. 3 11.3 10. 8 BaO 0.1 — 0. 1 2. 2 0. 2 0. 7 Na2〇 0. 3 4. 0 4. 0 2. 1 2.1 2.1 K2〇 9.0 2. 8 5. 9 5. 8 5. 8 5. 8 Zr.〇2 — _ 3.7 2. 0 2. 0 1‘ 5 S〇3 0· 2 0. 2 0.2 0. 2 0. 2 0· 2 P2O5 — — — — — — 介電常數 6. 9 6. 5 7. 0 6. 7 6. 7 6. 7 應變點(°C ) 620 580 600 600 600 600 i〇Vc ) 1170 1150 1190 1165 1160 1160 熱膨脹係數[30至 >380〇C](x 10'7/°C) 73. 0 70. 0 73. 0 69. 0 69. 0 69. 0 19 317203 P64406 表3 實施例 No. 13 No. 14 No. 15 No. 16 No. 17 No. 18 組成(質量%) Si〇2 67. 4 66. 4 66. 4 67. 4 66. 5 65. 5 A 1 2〇3 — — — 一 0. 9 0. 9 MgO 8. 2 8. 2 8. 2 10. 2 8. 2 8. 2 CaO 4. 8 4. 8 4. 8 2. 8 4.8 4. 8 SrO 9. 3 9. 3 9. 3 9. 3 9. 3 9. 3 BaO 0. 2 0· 2 0. 2 0. 2 0. 2 0. 2 Na2〇 2. 1 2.1 2· 1 2. 1 2. 1 2.1 K2〇 5. 8 5. 8 5. 8 5. 8 5. 8 5. 8 Zr〇2 2. 0 3. 0 4. 0 2. 0 2.0 3. 0 S〇3 0. 2 0. 2 0· 2 0· 2 0. 2 0. 2 P2O5 — — — _ — — 介電常數 6.8 6. 9 6. 9 6.7 6. 8 6. 9 應變點(°C ) 605 610 615 610 605 615 104(°C ) 1150 1150 1150 1160 1155 1150 熱膨脹係數[30至 70. 0 70. 0 69.0 67. 0 70. 0 70. 0 ► 380〇C ](xlO'7/°C) 20 317203 .1364406 Λ 表In the following, a glass substrate for a flat panel display device of the present invention will be described in detail based on an embodiment. ~7F Tables 1 to 4 show examples of the present invention (samples N〇.丄 to 2〇) and comparative examples (sample Mo.21). Sample No. 21 was used for a commercially available electro-concentration display device and the strain point was broken. 317203 17 , 1364406 Table 1 Example No. 1 No. 2 No. 3 No. 4 No. 5 No. 6 Composition (% by mass) Si〇2 65. 2 67. 5 67. 4 66. 5 68. 5 67 . 7 A 1 2〇3 3. 3 1.5 2. 2 3. 0 1. 0 1.0 MgO 7.0 7. 0 6. 5 7. 0 6. 9 6. 9 CaO 3. 3 3. 0 2. 8 3. 0 3. 1 3.1 SrO 12. 5 12. 5 12. 5 12. 4 12. 4 12. 4 BaO _ — — — 0. 2 Na2〇3. 5 3. 5 2. 5 2. 0 2. 0 1.0 K2〇5· 0 5. 0 6.0 6. 0 6.0 7.5 Zr〇2 0.2 _ 0. 1 _ — _ S〇3 — — — 0.1 0. 1 0.2 P2O5 — — — — _ — Dielectric constant 6. 8 6 7 6. 8 6. 7 6. 6 6. 8 Strain point (°C) 585 580 590 595 590 605 104 (°C) 1140 1140 1145 1160 1165 1180 Thermal expansion coefficient [30 to > 380 °C] (x 10"7/°C) 74. 0 75. 0 70. 0 71.0 71.0 71. 0 317203 1364406 Table 2 Example No. 7 No. 8 No. 9 No. 10 No. 11 No. 12 Composition (% by mass) Si〇2 66. 9 68. 8 64. 7 67. 4 67. 4 67. 4 A 1 2〇3 1· 0 1.0 4. 6 — — 0. 5 MgO 6. 9 8. 0 6.6 8. 2 8 . 2 8. 2 CaO 5. 6 2. 8 2. 5 2. 8 2. 8 2. 8 SrO 10. 0 12. 4 7. 7 9. 3 11.3 10. 8 BaO 0.1 — 0. 1 2. 2 0. 2 0. 7 Na2〇0. 3 4. 0 4. 0 2. 1 2.1 2.1 K2〇9.0 2. 8 5. 9 5. 8 5. 8 5. 8 Zr.〇2 — _ 3.7 2. 0 2. 0 1' 5 S〇3 0· 2 0. 2 0.2 0. 2 0. 2 0· 2 P2O5 — — — — — — Dielectric constant 6. 9 6. 5 7. 0 6. 7 6. 7 6. 7 Strain point (°C) 620 580 600 600 600 600 i〇Vc ) 1170 1150 1190 1165 1160 1160 Thermal expansion coefficient [30 to >380〇C] (x 10'7/°C) 73. 0 70. 0 73. 0 69 0 69. 0 69. 0 19 317203 P64406 Table 3 Example No. 13 No. 14 No. 15 No. 16 No. 16 No. 18 No. 14 No. 14 No. 16 No. 16 No. 67. 4 66. 5 65. 5 A 1 2〇3 — — — A 0. 9 0. 9 MgO 8. 2 8. 2 8. 2 10. 2 8. 2 8. 2 CaO 4. 8 4. 8 4. 8 2. 8 4.8 4. 8 SrO 9. 3 9. 3 9. 3 9. 3 9. 3 9. 3 BaO 0. 2 0· 2 0. 2 0. 2 0. 2 0. 2 Na2〇 2. 1 2.1 2· 1 2. 1 2. 1 2.1 K2〇5. 8 5. 8 5. 8 5. 8 5. 8 5. 8 Zr〇2 2. 0 3. 0 4. 0 2. 0 2.0 3. 0 S〇3 0. 2 0. 2 0· 2 0· 2 0. 2 0. 2 P2O5 — — — _ — — Dielectric constant 6.8 6. 9 6. 9 6.7 6. 8 6. 9 Strain point (°C) 605 610 615 610 605 615 104(°C) 1150 1150 1150 1 160 1155 1150 Coefficient of thermal expansion [30 to 70. 0 70. 0 69.0 67. 0 70. 0 70. 0 ► 380〇C ](xlO'7/°C) 20 317203 .1364406 Λ Table
表中的各試料是以如下方式製作。 首先,調和玻璃原料使其形成如表所示的組成,使用 白金鍋以1450至16〇〇。(:進行四個小時的熔融。然後,使 炼融玻璃流出至石墨板上而形成板狀,徐冷之後,進行兩 面研磨使板厚形成2· 8mm,然後將所獲得的板玻璃切斷加 工成20〇mm見方的大小而製成試料玻璃。 針對如上述所獲得的各試料測定介電常數、應變點、 317203 21 1364406 Λ 相當於104dPa · s之黏度的玻璃熔液的溫度及熱膨脹係 數。5玄結果顯示於表中。 從表中可以明白,實施例之試料No. 1至20之各試料 . 的介電常數是7. 〇以下之低值,可降低顯示器裝置的消耗 私力。而且,應變點為5 8 0 °C,可抑制熱處理步驟中玻璃 • 基板之熱變形或熱收縮。再者,熱膨脹係數為67. 0至75. 0 • x 1 0 "°C,耐熱衝擊性佳,並且具有可與周邊材料良好整 合的熱膨脹係數。另外,關於試料N〇. 1至18的各試料, •相當於l〇4clPa · s之黏度的玻璃熔液的溫度比丨丨⑽它低, .成形性亦佳。 相對於此,比較例之No_ 21的介電常數為7. 5之高值。 此外,介電常數是根據ASTM D1 50-87來測定25°C、 1MHz時的值。 而應變點是根據ASTMC336-71來測定。此外,此溫度 越高,越可抑制在製造顯示器裝置時之熱處理步驟中玻璃 馨基板之熱變形或熱收縮。 而且,玻璃之黏度相當於104dPa· s的玻璃熔液的溫 度是藉由白金球提拉法來測定。此溫度是使玻璃形成板狀 時的指標,此溫度越低,成形性就越好。 熱膨脹係數是製作直徑5. 0mm、長度2〇_的圓柱狀試 料,以恥脹計測定30至380X:時的平均熱膨脹係數。 本發明之平面面板顯示器裝置用玻璃基板並不限於電 漿顯示器裝置用途,例如亦可使用在電場發射型顯示器、 電激發光顯示器用途。 °° 317203 22Each sample in the table was produced in the following manner. First, the glass raw materials were blended to form a composition as shown in the table, using a white gold pot at 1450 to 16 Torr. (: Four hours of melting was carried out. Then, the molten glass was poured out onto the graphite plate to form a plate shape, and after cooling, the surface was double-grinded to form a thickness of 2·8 mm, and then the obtained plate glass was cut. The sample glass was prepared to have a size of 20 mm square. The dielectric constant and strain point of each sample obtained as described above, and the temperature and thermal expansion coefficient of the glass melt corresponding to a viscosity of 104 dPa·s were measured for 317203 21 1364406 Λ. The results are shown in the table. It can be understood from the table that the dielectric constants of the samples No. 1 to 20 of the examples are 7. The lower values below , can reduce the consumption power of the display device. The strain point is 580 ° C, which can suppress the thermal deformation or heat shrinkage of the glass substrate in the heat treatment step. Further, the coefficient of thermal expansion is 67. 0 to 75. 0 • x 1 0 " ° C, thermal shock resistance Good, and has a coefficient of thermal expansion which is well integrated with the surrounding materials. In addition, for each sample of samples N〇. 1 to 18, • the temperature of the glass melt corresponding to the viscosity of l〇4clPa·s is lower than that of 丨丨(10) , Formability is also good. For this, the dielectric constant of No. 21 of the comparative example is a high value of 7.5. Further, the dielectric constant is a value measured at 25 ° C and 1 MHz in accordance with ASTM D1 50-87. The strain point is according to ASTM C336- In addition, the higher the temperature, the more the thermal deformation or thermal contraction of the glass substrate in the heat treatment step in manufacturing the display device can be suppressed. Moreover, the viscosity of the glass is equivalent to the temperature of the glass melt of 104 dPa·s. It is measured by a platinum ball pulling method. The temperature is an index when the glass is formed into a plate shape, and the lower the temperature, the better the formability. The coefficient of thermal expansion is a cylindrical sample having a diameter of 5.0 mm and a length of 2 〇. The average thermal expansion coefficient at 30 to 380X is measured by a dilatometer. The glass substrate for a flat panel display device of the present invention is not limited to the use of a plasma display device, and can be used, for example, in an electric field emission type display or an electroluminescent display. °° 317203 22
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CN1722347A (en) | 2006-01-18 |
TW200604125A (en) | 2006-02-01 |
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