TWI351730B - - Google Patents

Download PDF

Info

Publication number
TWI351730B
TWI351730B TW094111194A TW94111194A TWI351730B TW I351730 B TWI351730 B TW I351730B TW 094111194 A TW094111194 A TW 094111194A TW 94111194 A TW94111194 A TW 94111194A TW I351730 B TWI351730 B TW I351730B
Authority
TW
Taiwan
Prior art keywords
wiring
sheet
contact terminals
electrodes
contact
Prior art date
Application number
TW094111194A
Other languages
English (en)
Chinese (zh)
Other versions
TW200605253A (en
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of TW200605253A publication Critical patent/TW200605253A/zh
Application granted granted Critical
Publication of TWI351730B publication Critical patent/TWI351730B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/22—Details
    • B65D77/30—Opening or contents-removing devices added or incorporated during filling or closing of containers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/6802—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form specific machines, engines or vehicles
    • B65D2585/6835—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form specific machines, engines or vehicles audio-visual devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW094111194A 2004-04-09 2005-04-08 Method of manufacturing semiconductor integrated circuit and probe card TW200605253A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004115048A JP4521611B2 (ja) 2004-04-09 2004-04-09 半導体集積回路装置の製造方法

Publications (2)

Publication Number Publication Date
TW200605253A TW200605253A (en) 2006-02-01
TWI351730B true TWI351730B (ja) 2011-11-01

Family

ID=35061059

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094111194A TW200605253A (en) 2004-04-09 2005-04-08 Method of manufacturing semiconductor integrated circuit and probe card

Country Status (5)

Country Link
US (2) US7271015B2 (ja)
JP (1) JP4521611B2 (ja)
KR (1) KR20060046627A (ja)
CN (3) CN100435317C (ja)
TW (1) TW200605253A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI714778B (zh) * 2017-03-27 2021-01-01 鴻海精密工業股份有限公司 調校探針位置的測試板及測試方法

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136246A (ja) * 2003-10-31 2005-05-26 Renesas Technology Corp 半導体集積回路装置の製造方法
JP4521611B2 (ja) * 2004-04-09 2010-08-11 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
CN100508154C (zh) 2004-11-18 2009-07-01 株式会社瑞萨科技 半导体集成电路器件的制造方法
CN100585826C (zh) 2005-03-11 2010-01-27 株式会社瑞萨科技 半导体集成电路器件的制造方法
JP2006343182A (ja) * 2005-06-08 2006-12-21 Renesas Technology Corp 半導体集積回路装置の製造方法
JP4800007B2 (ja) 2005-11-11 2011-10-26 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法およびプローブカード
JP4974022B2 (ja) * 2006-02-22 2012-07-11 軍生 木本 格子状配列プローブ組立体
TWI397696B (zh) * 2006-02-19 2013-06-01 Gunsei Kimoto Probe assembly
JP4936275B2 (ja) * 2006-04-06 2012-05-23 軍生 木本 接触子組立体
JP4974021B2 (ja) * 2006-02-19 2012-07-11 軍生 木本 プローブ組立体
JP4692423B2 (ja) * 2006-07-10 2011-06-01 Ｊｓｒ株式会社 異方導電性コネクター及び検査装置用変換アダプタ並びに異方導電性コネクターの製造方法
JP5077735B2 (ja) * 2006-08-07 2012-11-21 軍生 木本 複数梁合成型接触子組立
US20080265428A1 (en) * 2007-04-26 2008-10-30 International Business Machines Corporation Via and solder ball shapes to maximize chip or silicon carrier strength relative to thermal or bending load zero point
US7847568B2 (en) * 2007-08-17 2010-12-07 Advanced Micro Devices, Inc. Multi-site probe
JP5424675B2 (ja) * 2008-03-18 2014-02-26 キヤノン株式会社 半導体装置の製造方法及び半導体装置
WO2009130793A1 (ja) * 2008-04-25 2009-10-29 株式会社アドバンテスト 試験システムおよびプローブ装置
WO2010048971A1 (en) * 2008-10-30 2010-05-06 Verigy (Singapore) Pte., Ltd. Test arrangement, pogo-pin and method for testing a device under test
JP2011149938A (ja) * 2010-01-22 2011-08-04 Kodi-S Co Ltd フィルムタイプのプローブユニット及びその製造方法
CN101846696B (zh) * 2010-03-19 2012-10-03 华映光电股份有限公司 探针及其制作方法
US8323992B2 (en) 2010-09-09 2012-12-04 Renesas Electronics Corporation Method of manufacturing semiconductor integrated circuit device
JP5707222B2 (ja) * 2011-05-20 2015-04-22 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
KR101765656B1 (ko) * 2010-12-23 2017-08-08 삼성디스플레이 주식회사 구동 집적회로 및 이를 포함하는 표시장치
JP2013246153A (ja) 2012-05-29 2013-12-09 Micronics Japan Co Ltd プローブカード
CN103575294B (zh) * 2012-07-27 2016-02-24 中国航空工业第六一八研究所 硅微陀螺芯片探针卡
KR101439343B1 (ko) 2013-04-18 2014-09-16 주식회사 아이에스시 포고핀용 탐침부재
KR101439342B1 (ko) * 2013-04-18 2014-09-16 주식회사 아이에스시 포고핀용 탐침부재
TWI503554B (zh) * 2013-06-04 2015-10-11 Mpi Corp 探針卡與其之製作方法
US10451652B2 (en) * 2014-07-16 2019-10-22 Teradyne, Inc. Coaxial structure for transmission of signals in test equipment
KR20180014781A (ko) * 2015-05-29 2018-02-09 알&디 설킷트스 인크. 집적 회로 테스트 환경에서 프로브 카드 어셈블리의 개선된 전력 공급 과도 성능(전력 무결성)
JP6360502B2 (ja) * 2015-07-31 2018-07-18 日本電子材料株式会社 プローブカード
JP6556612B2 (ja) * 2015-12-04 2019-08-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
TWI583963B (zh) * 2016-04-18 2017-05-21 旺矽科技股份有限公司 探針卡
CN111913019A (zh) * 2017-09-15 2020-11-10 中华精测科技股份有限公司 探针卡装置的圆形探针
JP7237474B2 (ja) * 2018-06-18 2023-03-13 京セラ株式会社 セラミック配線基板およびプローブ基板
IT201800006903A1 (it) * 2018-07-04 2020-01-04 Scheda di misura per applicazioni ad alta frequenza
KR102605620B1 (ko) * 2018-09-13 2023-11-23 삼성전자주식회사 프로브 카드 검사용 웨이퍼, 프로브 카드 검사 시스템 및 프로브 카드 검사 방법
US10893605B2 (en) * 2019-05-28 2021-01-12 Seagate Technology Llc Textured test pads for printed circuit board testing
CN110412321B (zh) * 2019-07-17 2021-08-13 上海华力微电子有限公司 触点单元结构及其构成的矩阵探针卡
CN112305395B (zh) * 2020-11-06 2021-05-28 法特迪精密科技（苏州）有限公司 一种探针结构及其安装方法、闭路方法、抗干扰方法
CN116953485B (zh) * 2023-08-08 2024-06-25 苏州法特迪科技股份有限公司 一种高温老化测试插座调节方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5180977A (en) * 1991-12-02 1993-01-19 Hoya Corporation Usa Membrane probe contact bump compliancy system
JPH05283490A (ja) 1992-04-02 1993-10-29 Fuji Electric Co Ltd 集積回路装置の試験方法
US6525555B1 (en) * 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
JP3677027B2 (ja) * 1994-02-21 2005-07-27 株式会社ルネサステクノロジ 接続装置
JPH0883825A (ja) * 1994-09-09 1996-03-26 Tokyo Electron Ltd プローブ装置
JPH09172143A (ja) * 1995-12-19 1997-06-30 Mitsubishi Electric Corp 半導体集積回路装置及びそのテスト方法
JPH09232435A (ja) * 1996-02-22 1997-09-05 Oki Electric Ind Co Ltd 半導体集積回路
JPH1123615A (ja) * 1997-05-09 1999-01-29 Hitachi Ltd 接続装置および検査システム
JPH11295343A (ja) * 1998-04-09 1999-10-29 Mitsubishi Materials Corp コンタクトプローブおよびその製造方法
TW379432B (en) * 1998-09-14 2000-01-11 Worldwide Semiconductor Mfg Method of manufacturing self-aligned shield wires
EP0990918B1 (en) * 1998-09-28 2009-01-21 NEC Electronics Corporation Device and method for nondestructive inspection on semiconductor device
JP2001108706A (ja) 1999-10-06 2001-04-20 Tokyo Electron Ltd ハンダボール用コンタクタ
JP3715160B2 (ja) * 1999-12-02 2005-11-09 株式会社ルネサステクノロジ プロービング装置及び半導体素子の製造方法
JP4480258B2 (ja) 2000-03-29 2010-06-16 株式会社日本マイクロニクス 半導体デバイス検査装置における電気的接触装置
JP2002228682A (ja) 2001-02-02 2002-08-14 Tokyo Electron Ltd プローブ
US7102367B2 (en) * 2002-07-23 2006-09-05 Fujitsu Limited Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof
JP2004061299A (ja) * 2002-07-29 2004-02-26 Renesas Technology Corp 半導体装置
KR100519657B1 (ko) * 2003-03-13 2005-10-10 삼성전자주식회사 테스트 패드를 갖는 반도체 칩과 그를 이용한 테이프캐리어 패키지
JP4099412B2 (ja) * 2003-03-19 2008-06-11 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
JP4521611B2 (ja) * 2004-04-09 2010-08-11 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI714778B (zh) * 2017-03-27 2021-01-01 鴻海精密工業股份有限公司 調校探針位置的測試板及測試方法

Also Published As

Publication number Publication date
US20050227383A1 (en) 2005-10-13
CN100435317C (zh) 2008-11-19
CN1681106A (zh) 2005-10-12
US20070190671A1 (en) 2007-08-16
JP2005302917A (ja) 2005-10-27
CN101308819A (zh) 2008-11-19
CN101308819B (zh) 2010-09-15
JP4521611B2 (ja) 2010-08-11
KR20060046627A (ko) 2006-05-17
CN101308820B (zh) 2010-06-02
US7517707B2 (en) 2009-04-14
CN101308820A (zh) 2008-11-19
US7271015B2 (en) 2007-09-18
TW200605253A (en) 2006-02-01

Similar Documents

Publication Publication Date Title
TWI351730B (ja)
KR101250167B1 (ko) 반도체 집적 회로 장치의 제조 방법
US6672876B1 (en) Probe card with pyramid shaped thin film contacts
TWI422833B (zh) Method for manufacturing a semiconductor integrated circuit device and method for manufacturing a thin film probe sheet
KR100777356B1 (ko) 검사 프로브 및 검사 프로브의 제조 방법
US7888953B2 (en) Probe card
JP4919365B2 (ja) 半導体集積回路の製造方法
JP2007212472A (ja) 半導体集積回路の製造方法及びプローブカード
TW200827730A (en) Method of manufacturing a semiconductor integrated circuit device
JP4755597B2 (ja) 半導体集積回路装置の製造方法
JP2009250697A (ja) 半導体集積回路装置の製造方法およびメンブレン型のプローブ・カード
JP4769474B2 (ja) 半導体集積回路装置の製造方法
JP5058032B2 (ja) コンタクトプローブの製造方法
JP2008008774A (ja) 半導体集積回路装置の製造方法
JP4716454B2 (ja) 半導体集積回路装置の製造方法
JP2007212471A (ja) 半導体集積回路の製造方法及びプローブカード
JP2010266467A (ja) 半導体集積回路装置の製造方法
JP3219008B2 (ja) コンタクトプローブおよびその製造方法と前記コンタクトプローブを備えたプローブ装置
JPH1116961A (ja) 屈曲部を有する金属体およびその成形方法と前記金属体を用いたコンタクトプローブおよびその製造方法
KR101149808B1 (ko) 프로브 및 프로브 카드 제조방법
JP5203136B2 (ja) コンタクトプローブの製造方法
JP2006300960A (ja) コンタクトプローブ及びその製造方法