TWI349585B - - Google Patents
Info
- Publication number
- TWI349585B TWI349585B TW096108756A TW96108756A TWI349585B TW I349585 B TWI349585 B TW I349585B TW 096108756 A TW096108756 A TW 096108756A TW 96108756 A TW96108756 A TW 96108756A TW I349585 B TWI349585 B TW I349585B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/20—Measuring; Control or regulation
- B01F35/21—Measuring
- B01F35/213—Measuring of the properties of the mixtures, e.g. temperature, density or colour
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/20—Measuring; Control or regulation
- B01F35/21—Measuring
- B01F35/2132—Concentration, pH, pOH, p(ION) or oxygen-demand
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/80—Forming a predetermined ratio of the substances to be mixed
- B01F35/83—Forming a predetermined ratio of the substances to be mixed by controlling the ratio of two or more flows, e.g. using flow sensing or flow controlling devices
- B01F35/833—Flow control by valves, e.g. opening intermittently
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006070538A JP4999338B2 (en) | 2006-03-15 | 2006-03-15 | Substrate cleaning method, substrate cleaning apparatus, program, and recording medium |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200804008A TW200804008A (en) | 2008-01-16 |
TWI349585B true TWI349585B (en) | 2011-10-01 |
Family
ID=38121662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096108756A TW200804008A (en) | 2006-03-15 | 2007-03-14 | Method and apparatus for cleaning substrate, and program recording medium |
Country Status (6)
Country | Link |
---|---|
US (2) | US8347901B2 (en) |
EP (1) | EP1834708B1 (en) |
JP (1) | JP4999338B2 (en) |
KR (1) | KR101191549B1 (en) |
DE (1) | DE602007006704D1 (en) |
TW (1) | TW200804008A (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4576270B2 (en) * | 2005-03-29 | 2010-11-04 | 昭和電工株式会社 | Method for manufacturing solder circuit board |
WO2007007865A1 (en) * | 2005-07-11 | 2007-01-18 | Showa Denko K.K. | Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board |
WO2007029866A1 (en) * | 2005-09-09 | 2007-03-15 | Showa Denko K.K. | Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board |
JP4890919B2 (en) * | 2006-04-13 | 2012-03-07 | 東京エレクトロン株式会社 | Substrate cleaning method, substrate cleaning apparatus, program, and recording medium |
US20090173358A1 (en) * | 2008-01-09 | 2009-07-09 | Micron Technology, Inc. | Megasonic cleaning with controlled boundary layer thickness and associated systems and methods |
JP2009231579A (en) * | 2008-03-24 | 2009-10-08 | Dainippon Screen Mfg Co Ltd | Board treatment device and board treatment method |
JP5154991B2 (en) * | 2008-03-27 | 2013-02-27 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
JP5526118B2 (en) * | 2011-12-26 | 2014-06-18 | ジルトロニック アクチエンゲゼルシャフト | Ultrasonic cleaning method |
JP5453487B2 (en) | 2012-05-24 | 2014-03-26 | ジルトロニック アクチエンゲゼルシャフト | Ultrasonic cleaning method and ultrasonic cleaning apparatus |
JP5453488B2 (en) | 2012-05-24 | 2014-03-26 | ジルトロニック アクチエンゲゼルシャフト | Ultrasonic cleaning method and ultrasonic cleaning apparatus |
JP5894858B2 (en) * | 2012-05-24 | 2016-03-30 | ジルトロニック アクチエンゲゼルシャフトSiltronic AG | Ultrasonic cleaning method |
JP5872382B2 (en) | 2012-05-24 | 2016-03-01 | ジルトロニック アクチエンゲゼルシャフトSiltronic AG | Ultrasonic cleaning method |
US9406501B2 (en) * | 2012-05-31 | 2016-08-02 | Semes Co., Ltd. | Apparatus and method for cleaning substrate |
US20140196744A1 (en) * | 2013-01-11 | 2014-07-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and device for cleaning a brush surface having a contamination |
CN103752557A (en) * | 2014-02-13 | 2014-04-30 | 苏州众显电子科技有限公司 | Ultrasonic liquid crystal display screen substrate cleaning technology |
DE102015226300A1 (en) | 2015-12-21 | 2017-07-06 | Siltronic Ag | Method and device for cleaning slices of semiconductor material |
CN106449474A (en) * | 2016-09-29 | 2017-02-22 | 无锡宏纳科技有限公司 | Wafer edge cleaning treatment apparatus |
TWI718794B (en) * | 2019-10-08 | 2021-02-11 | 辛耘企業股份有限公司 | Wet processing device |
CN112992740A (en) * | 2021-03-01 | 2021-06-18 | 李军平 | Cleaning equipment for cutting wafer |
CN113975860B (en) * | 2021-12-23 | 2022-03-22 | 常州铭赛机器人科技股份有限公司 | Glue vibration defoaming device |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5090432A (en) * | 1990-10-16 | 1992-02-25 | Verteq, Inc. | Single wafer megasonic semiconductor wafer processing system |
EP0592740B1 (en) * | 1992-10-16 | 1997-03-05 | Yoshihide Shibano | Ultrasonic cleaning apparatus |
US5505785A (en) * | 1994-07-18 | 1996-04-09 | Ferrell; Gary W. | Method and apparatus for cleaning integrated circuit wafers |
JPH0910468A (en) * | 1995-06-28 | 1997-01-14 | Yoshihide Shibano | Ultrasonic cleaning of cloth product |
JP3690619B2 (en) * | 1996-01-12 | 2005-08-31 | 忠弘 大見 | Cleaning method and cleaning device |
US6058945A (en) * | 1996-05-28 | 2000-05-09 | Canon Kabushiki Kaisha | Cleaning methods of porous surface and semiconductor surface |
JP3274389B2 (en) * | 1996-08-12 | 2002-04-15 | 株式会社東芝 | Semiconductor substrate cleaning method |
JPH10109072A (en) * | 1996-10-04 | 1998-04-28 | Puretetsuku:Kk | High frequency washing device |
JP3349636B2 (en) * | 1996-10-04 | 2002-11-25 | 株式会社プレテック | High frequency cleaning equipment |
US5800626A (en) * | 1997-02-18 | 1998-09-01 | International Business Machines Corporation | Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates |
DE19840989A1 (en) * | 1997-09-09 | 1999-03-18 | Tokyo Electron Ltd | Object wet cleaning method for e.g. semiconductor wafer |
JP2000077376A (en) * | 1998-08-27 | 2000-03-14 | Toshiba Corp | Ultrasonic cleaning method and its device |
JP2001284306A (en) * | 2000-03-28 | 2001-10-12 | Toshiba Corp | Apparatus and method for cleaning substrate |
JP2003031535A (en) * | 2001-07-11 | 2003-01-31 | Mitsubishi Electric Corp | Ultrasonic cleaning method of semiconductor manufacturing apparatus |
US20030029479A1 (en) | 2001-08-08 | 2003-02-13 | Dainippon Screen Mfg. Co, Ltd. | Substrate cleaning apparatus and method |
JP4036626B2 (en) * | 2001-09-27 | 2008-01-23 | シャープ株式会社 | Ultrasonic cleaning method and ultrasonic cleaning apparatus |
JP2003234320A (en) * | 2002-02-06 | 2003-08-22 | Nec Electronics Corp | Method, chemical liquid, and device for cleaning substrate, and semiconductor device |
US7156927B2 (en) * | 2002-04-03 | 2007-01-02 | Fsi International, Inc. | Transition flow treatment process and apparatus |
JP4472234B2 (en) * | 2002-06-12 | 2010-06-02 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and inert gas concentration control method |
-
2006
- 2006-03-15 JP JP2006070538A patent/JP4999338B2/en active Active
-
2007
- 2007-03-13 US US11/717,170 patent/US8347901B2/en active Active
- 2007-03-14 TW TW096108756A patent/TW200804008A/en unknown
- 2007-03-14 KR KR1020070024996A patent/KR101191549B1/en active IP Right Grant
- 2007-03-14 EP EP07005245A patent/EP1834708B1/en not_active Expired - Fee Related
- 2007-03-14 DE DE602007006704T patent/DE602007006704D1/en active Active
-
2012
- 2012-12-10 US US13/709,331 patent/US9358588B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US9358588B2 (en) | 2016-06-07 |
TW200804008A (en) | 2008-01-16 |
JP4999338B2 (en) | 2012-08-15 |
EP1834708A2 (en) | 2007-09-19 |
KR101191549B1 (en) | 2012-10-15 |
EP1834708B1 (en) | 2010-05-26 |
US20070215172A1 (en) | 2007-09-20 |
US8347901B2 (en) | 2013-01-08 |
JP2007250726A (en) | 2007-09-27 |
US20130152964A1 (en) | 2013-06-20 |
EP1834708A3 (en) | 2007-10-31 |
KR20070093894A (en) | 2007-09-19 |
DE602007006704D1 (en) | 2010-07-08 |
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