TWI348742B - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- TWI348742B TWI348742B TW096131363A TW96131363A TWI348742B TW I348742 B TWI348742 B TW I348742B TW 096131363 A TW096131363 A TW 096131363A TW 96131363 A TW96131363 A TW 96131363A TW I348742 B TWI348742 B TW I348742B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
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- H01L2924/1304—Transistor
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- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
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- H01L2924/11—Device type
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- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006230730A JP5073992B2 (ja) | 2006-08-28 | 2006-08-28 | 半導体装置 |
Publications (2)
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TW200811972A TW200811972A (en) | 2008-03-01 |
TWI348742B true TWI348742B (en) | 2011-09-11 |
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TW096131363A TWI348742B (en) | 2006-08-28 | 2007-08-24 | Semiconductor device |
Country Status (5)
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US (1) | US7772704B2 (zh) |
JP (1) | JP5073992B2 (zh) |
KR (1) | KR100884675B1 (zh) |
CN (1) | CN101136430B (zh) |
TW (1) | TWI348742B (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4664833B2 (ja) * | 2006-02-15 | 2011-04-06 | 株式会社東芝 | 半導体記憶装置 |
JP5511124B2 (ja) * | 2006-09-28 | 2014-06-04 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 絶縁ゲート型半導体装置 |
JP2008085188A (ja) * | 2006-09-28 | 2008-04-10 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
JP5337470B2 (ja) * | 2008-04-21 | 2013-11-06 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 絶縁ゲート型半導体装置 |
CN101826472A (zh) * | 2010-03-04 | 2010-09-08 | 江阴新顺微电子有限公司 | 芯片背面复合材料多层金属化方法 |
US8759209B2 (en) * | 2010-03-25 | 2014-06-24 | Stats Chippac, Ltd. | Semiconductor device and method of forming a dual UBM structure for lead free bump connections |
CN204030643U (zh) * | 2013-06-01 | 2014-12-17 | 快捷半导体(苏州)有限公司 | 用于电池管理和保护的***及设备 |
JP6404591B2 (ja) * | 2014-04-23 | 2018-10-10 | 富士電機株式会社 | 半導体装置の製造方法、半導体装置の評価方法および半導体装置 |
TWI690083B (zh) | 2015-04-15 | 2020-04-01 | 杰力科技股份有限公司 | 功率金氧半導體場效電晶體及其製作方法 |
JP6480795B2 (ja) | 2015-04-16 | 2019-03-13 | ルネサスエレクトロニクス株式会社 | 半導体装置およびそれを用いた回路装置 |
JP6598037B2 (ja) * | 2015-07-01 | 2019-10-30 | パナソニックIpマネジメント株式会社 | 半導体装置 |
US9564406B1 (en) * | 2015-07-30 | 2017-02-07 | Alpha And Omega Semiconductor Incorporated | Battery protection package and process of making the same |
CN108028234B (zh) * | 2015-12-04 | 2021-12-31 | 瑞萨电子株式会社 | 半导体芯片、半导体器件以及电子器件 |
KR102163602B1 (ko) * | 2017-07-13 | 2020-10-12 | 매그나칩 반도체 유한회사 | 실리콘-전도층-실리콘 스택 구조의 반도체 소자 |
JP6847887B2 (ja) | 2018-03-23 | 2021-03-24 | 株式会社東芝 | 半導体装置 |
JP2022154154A (ja) | 2021-03-30 | 2022-10-13 | 株式会社東芝 | 半導体装置 |
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JPH03224272A (ja) * | 1989-12-25 | 1991-10-03 | Fuji Electric Co Ltd | パワーic |
JP2796919B2 (ja) * | 1992-05-11 | 1998-09-10 | インターナショナル・ビジネス・マシーンズ・コーポレーション | メタライゼーション複合体および半導体デバイス |
KR100284746B1 (ko) * | 1999-01-15 | 2001-03-15 | 김덕중 | 소스 영역 하부의 바디 저항이 감소된 전력용 디모스 트랜지스터 |
JP4270773B2 (ja) | 2001-06-08 | 2009-06-03 | 三洋電機株式会社 | 1チップデュアル型絶縁ゲート型半導体装置 |
JP2002368218A (ja) * | 2001-06-08 | 2002-12-20 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
JP2003045875A (ja) * | 2001-07-30 | 2003-02-14 | Nec Kagobutsu Device Kk | 半導体装置およびその製造方法 |
JP3601529B2 (ja) | 2001-08-09 | 2004-12-15 | 株式会社デンソー | 半導体装置 |
JP2003101025A (ja) * | 2001-09-26 | 2003-04-04 | Toshiba Corp | 半導体装置 |
JP2003318130A (ja) * | 2002-04-24 | 2003-11-07 | Sanyo Electric Co Ltd | 半導体装置 |
TWI361490B (en) * | 2003-09-05 | 2012-04-01 | Renesas Electronics Corp | A semiconductor device and a method of manufacturing the same |
JP2005101334A (ja) * | 2003-09-25 | 2005-04-14 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
JP2006059929A (ja) * | 2004-08-18 | 2006-03-02 | Fuji Electric Device Technology Co Ltd | 半導体装置の製造方法 |
JP4153932B2 (ja) * | 2004-09-24 | 2008-09-24 | 株式会社東芝 | 半導体装置および半導体装置の製造方法 |
US7446354B2 (en) * | 2005-04-25 | 2008-11-04 | Semiconductor Components Industries, L.L.C. | Power semiconductor device having improved performance and method |
DE102006037118B3 (de) * | 2006-08-07 | 2008-03-13 | Infineon Technologies Ag | Halbleiterschaltmodul für Bordnetze mit mehreren Halbleiterchips, Verwendung eines solchen Halbleiterschaltmoduls und Verfahren zur Herstellung desselben |
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- 2007-08-24 TW TW096131363A patent/TWI348742B/zh not_active IP Right Cessation
- 2007-08-27 US US11/845,473 patent/US7772704B2/en active Active
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TW200811972A (en) | 2008-03-01 |
KR20080019549A (ko) | 2008-03-04 |
KR100884675B1 (ko) | 2009-02-18 |
US20080061326A1 (en) | 2008-03-13 |
JP5073992B2 (ja) | 2012-11-14 |
JP2008053623A (ja) | 2008-03-06 |
CN101136430B (zh) | 2011-01-26 |
CN101136430A (zh) | 2008-03-05 |
US7772704B2 (en) | 2010-08-10 |
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