TWI342952B - Improved vertical probe card and space transformer design method - Google Patents

Improved vertical probe card and space transformer design method Download PDF

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Publication number
TWI342952B
TWI342952B TW96137758A TW96137758A TWI342952B TW I342952 B TWI342952 B TW I342952B TW 96137758 A TW96137758 A TW 96137758A TW 96137758 A TW96137758 A TW 96137758A TW I342952 B TWI342952 B TW I342952B
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TW
Taiwan
Prior art keywords
probe card
space conversion
line space
circuit board
board
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TW96137758A
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Chinese (zh)
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TW200916786A (en
Inventor
Min Chieh Chou
Jung Kang Peng
Wen Liang Huang
Fuh Yu Chang
Meng Chi Huang
Tune Hune Kao
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Ind Tech Res Inst
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Priority to TW96137758A priority Critical patent/TWI342952B/en
Publication of TW200916786A publication Critical patent/TW200916786A/en
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Publication of TWI342952B publication Critical patent/TWI342952B/en

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

1342952 並利用若干定位銷44穿置三者,形成初步之固定結構,同 時該定位銷4 4亦具有將探針頭4與線路空間轉換板2同時固 定的作用,再利用若干固定元件45 (如:螺絲、鉚釘), 將三者做一確實的固定,而若干探針(411、421 )係為裝 設於上板41及下板43之容置槽(412、422)中,依照探針 的數量多寡,亦可僅裝置於上板41或下板42之容置槽 (412、422 );當然間隔板43亦對設探針(411、421)位 置設置一剖溝431,以供探針(411、421)容置於其中。 藉由上述圖二至圖七之揭露,即可瞭解本發明主要的 技術手段為藉由一主電路板、一垂直探針頭、線路空間轉 換板及上、下熱平衡板所構成之結構,其中該線路空間轉 換板的設計,採取導電墊及銲墊分離而不重疊的空間配 置,且適用於印刷電路板所慣用增層法來製作,以作為主 電路板與垂直式探針頭之探針電性導通介面,其優點為可 利用細導線做為線路空間轉換板及主電路板之電性連接元 件,以形成一不同結構之垂直式探針卡,如此便可達成成 本較低、製作速度較快,且亦可探測奈米級的裸晶的探針 設備。本發明應用於半導體的測試製程中具有極大的商 機,故提出專利申請以尋求專利權之保護。 综上所述,本發明之結構特徵及各實施例皆已詳細揭 示,而可充分顯示出本發明案在目的及功效上均深富實施 之進步性,極具產業之利用價值,且為目前市面上前所未 見之運用,依專利法之精神所述,本發明案完全符合發明 專利之要件。 唯以上所述者,僅為本發明之較佳實施例而已,當不能 r: s一 1342952 以之限定本發明所實施之範圍,即大凡依本發明申請專利 範圍所作之均等變化與修飾,皆應仍屬於本發明專利涵蓋 之範圍内,謹請 貴審查委員明鑑,並析惠准,是所至 禱。 【圖式簡單說明】 圖一 A係為習知陶瓷探針卡之線路空間轉換板結構的俯視 圖; 圖一B係為習知陶瓷探針卡之線路空間轉換板結構的剖面 側視圖; 圖一C係為習知陶瓷探針卡之線路空間轉換板結構的仰視 圖, 圖二係為本發明垂直式探針卡之立體外觀結構分解示意 圖; 圖三係為本發明垂直式探針卡組立後之剖面侧視結構示意 圖; 圖四A係為本發明線路空間轉換板之俯視結構示意圖; 圖四B係為本發明線路空間轉換板之剖面側視結構示意圖; 圖四C係為本發明線路空間轉換板之仰視結構示意圖; 圖五A係為本發明線路空間轉換板利用細銅線銲接於主電 路板之示意圖; 圖五B係為本發明線路空間轉換板利用球閘陣列封裝方式 銲接於主電路板之示意圖; 圖五C係為本發明線路空間轉換板利用支撐板及若干彈簧 針方式電性連接於主電路板之示意圖; <:s 1342952 圖六係為本發明探針頭之立體外觀結構分解示意圖; 圖七係為本發明探針頭組立於線路空間轉換板之結構示意 圖。 【主要元件符號說明】 1〜線路空間轉換板 11〜銲墊 12〜針墊 2〜線路空間轉換板 21〜辉塾 22〜針墊 23〜導電墊 3〜主電路板 31〜鲜塾 4〜探針頭 41 - '"上板 411〜 探針 412〜 容置槽 42- -下板 421〜 探針 422〜 容置槽 43〜間隔板 431〜 剖溝 44、 -定位銷 45、 -固定元件 1342952 5〜第一熱平衡板 6〜第二熱平衡板 7〜支撐板 71〜彈簧針1342952 and using a plurality of positioning pins 44 to wear the three to form a preliminary fixed structure, and the positioning pin 44 also has the function of fixing the probe head 4 and the line space conversion plate 2 at the same time, and then using a plurality of fixing elements 45 (such as : screws, rivets), the three are fixed, and a plurality of probes (411, 421) are installed in the receiving grooves (412, 422) of the upper plate 41 and the lower plate 43 according to the probe. The number of the slabs (412, 422) can be only applied to the upper plate 41 or the lower plate 42; of course, the partition plate 43 is also provided with a groove 431 for the position of the probes (411, 421) for exploration. The needles (411, 421) are accommodated therein. With the disclosure of FIG. 2 to FIG. 7 above, it can be understood that the main technical means of the present invention is a structure composed of a main circuit board, a vertical probe head, a line space conversion board, and upper and lower heat balance boards, wherein The design of the line space conversion board adopts a space arrangement in which the conductive pads and the pads are separated without overlapping, and is suitable for the conventional layering method of the printed circuit board, and is used as a probe of the main circuit board and the vertical probe head. The electrical conduction interface has the advantage that the thin wire can be used as the electrical connection component of the line space conversion board and the main circuit board to form a vertical probe card of different structure, so that the cost can be reduced and the production speed can be achieved. Faster, and can also detect nano-scale bare-crystal probe devices. The invention has great business opportunities in the testing process for semiconductors, so patent applications are filed to seek protection of patent rights. In summary, the structural features and embodiments of the present invention have been disclosed in detail, and can fully demonstrate that the present invention has deep progress in the purpose and efficacy of the present invention, and has great industrial value, and is currently The unprecedented use in the market, according to the spirit of the patent law, the invention is fully in line with the requirements of the invention patent. The above is only the preferred embodiment of the present invention, and when r: s - 1342952 is not limited to the scope of the present invention, that is, the equal variation and modification of the scope of the patent application of the present invention are It should still fall within the scope covered by the patent of the present invention. I would like to ask your review committee to explain it and analyze it. It is the prayer. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a plan view showing the structure of a line space conversion board of a conventional ceramic probe card; FIG. 1B is a cross-sectional side view showing the structure of a line space conversion board of a conventional ceramic probe card; C is a bottom view of the structure of the line space conversion board of the conventional ceramic probe card, and FIG. 2 is a schematic exploded view of the vertical appearance structure of the vertical probe card of the present invention; FIG. 3 is a vertical probe card set of the present invention. FIG. 4A is a schematic plan view of a line space conversion board of the present invention; FIG. 4B is a schematic side view of a line space conversion board of the present invention; FIG. 4C is a line space of the present invention. FIG. 5A is a schematic view showing the line space conversion board of the present invention welded to the main circuit board by using a thin copper wire; FIG. 5B is a line space conversion board of the present invention, which is welded to the main by a ball gate array package. Schematic diagram of the circuit board; Figure 5C is a schematic diagram of the line space conversion board of the present invention electrically connected to the main circuit board by using a support plate and a plurality of pogo pins; <:s 1 342952 Figure 6 is a schematic exploded view of the stereoscopic appearance of the probe head of the present invention; Figure 7 is a schematic view of the structure of the probe head of the present invention standing on the line space conversion board. [Main component symbol description] 1 to line space conversion board 11 to pad 12 to pin pad 2 to line space conversion board 21 to 塾 22 to pin pad 23 to conductive pad 3 to main circuit board 31 to fresh 塾 4 ~ Needle 41 - '" upper plate 411~ probe 412~ accommodating groove 42--lower plate 421~ probe 422~ accommodating groove 43~ spacer plate 431~ grooving groove 44, - locating pin 45, - fixing element 1342952 5~first heat balance plate 6~second heat balance plate 7~support plate 71~spring pin

Claims (1)

十、申請專利範圍: 1 —種垂直式探針卡之結構,其係包括有下列: 主電路板,利用設置於其中的銲塾來連接一測試儀 器; '探針頭,用以接觸待測裸晶的表面; 線路空間轉換板’而其導電墊及銲墊分離而不重疊的 空間配置,以作為主電路板與探針頭之探針電性導 通介面;以及 至少—熱平衡板’設置於主電路板之外部,用以加強整 2 體機械強度與熱均勻性。 凊專利範圍第1項所述之垂直式探針卡之結構,其 主電路板與線路空間轉換板係為印刷電路板、橡膠 3. 如串I㈣板及陶1板之其中—者做為基材。 =專她’2項所述之垂直式探針卡之結構,其 4. 如;=電路板係為玻纖環氧樹脂基板所構成。 利乾圍第1項所述之垂直式探針卡之結構,其 干二十頭係為一橡膠板、一不鏽鋼板、-陶瓷板及若 5 铋針所組成。 中該2利& 11第1項所述之垂直式探針卡之結構,其 撐板,、、:路板與線路空間轉換板之間更係設置有一支 與線路内設置若干彈簧針,用祕主電路板 到電性轉換板藉由該彈簧針連接二者之銲墊來達 令該主苐1項所述之垂直式探針卡之結構,其 板與線路空間轉換板之間係為利用細導線 1342952Ten, the scope of application for patents: 1 - the structure of a vertical probe card, which includes the following: The main circuit board, using a soldering iron provided in it to connect a test instrument; 'probe head for contact with the test The surface of the bare crystal; the line space conversion board' and the conductive pad and the pad are separated from each other without overlapping, so as to serve as a probe electrical interface of the main circuit board and the probe head; and at least the heat balance plate is disposed at The outside of the main circuit board is used to strengthen the mechanical strength and thermal uniformity of the whole body.结构The structure of the vertical probe card according to item 1 of the patent scope, the main circuit board and the line space conversion board are printed circuit boards and rubber 3. For example, among the strings I (four) and the ceramic 1 material. = The structure of the vertical probe card described in her item 2. The wiring plate is made of glass epoxy resin substrate. The structure of the vertical probe card described in Item 1 of Liganwei is composed of a rubber sheet, a stainless steel plate, a ceramic plate and a 铋 pin. In the structure of the vertical probe card described in the above item 1, the support plate, the: between the road plate and the line space conversion plate is further provided with a plurality of pogo pins arranged in the line, The structure of the vertical probe card of the main item 1 is obtained by connecting the master circuit board to the electrical conversion board by the spring pin, and the structure between the board and the line space conversion board is To take advantage of the thin wire 1342952 串孔輝接來達到電性連接。 7. 如申請專利範圍第1項所述之垂直式探針卡之結構,其 中該主電路板與線路空間轉換板之間係為利用球閘陣 '列封裝方式銲接來達到電性連接。 8. 如申請專利範圍第1項所述之垂直式探針卡之結構,其 中該熱平衡板係為二片式,用以包覆主電路板的二側。 • 9.如申請專利範圍第8項所述之垂直式探針卡之結構,其 中該熱平衡板係由不鏽鋼材質所構成。 • 10, —種線路空間轉換板之設計方法,其線路空間轉換板 的設計,採取導電墊及銲墊分離而不重疊的空間配置, 以作為主電路板與探針頭之探針電性導通介面。 11. 如申請專利範圍第10項所述之線路空間轉換板之設 計方法,其中該線路空間轉換板的製作方法先以一印刷 電路板製作銲墊與導電墊的線路,再以微機電方式來製 作導電墊與針墊之間的微線路。 15The string holes are connected to achieve an electrical connection. 7. The structure of the vertical probe card according to claim 1, wherein the main circuit board and the line space conversion board are electrically connected by a ballast array 'column package method. 8. The structure of a vertical probe card according to claim 1, wherein the heat balance plate is a two-piece type for covering two sides of the main circuit board. 9. The structure of the vertical probe card of claim 8, wherein the heat balance plate is made of stainless steel. • 10, the design method of the line space conversion board, the design of the line space conversion board, adopting the space arrangement of the conductive pad and the pad separated without overlapping, as the probe of the main circuit board and the probe head is electrically connected interface. 11. The method for designing a line space conversion board according to claim 10, wherein the method for manufacturing the line space conversion board is to first make a circuit of a pad and a conductive pad by using a printed circuit board, and then use a micro-electromechanical method. Make a microcircuit between the conductive pad and the pin cushion. 15
TW96137758A 2007-10-09 2007-10-09 Improved vertical probe card and space transformer design method TWI342952B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
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CN104569514A (en) * 2013-10-22 2015-04-29 旺矽科技股份有限公司 Space transformer using carrier plate for chip packaging and manufacturing method thereof
TWI767803B (en) * 2021-07-26 2022-06-11 旭光科國際有限公司 The method of implanting needles of IC test socket and its fixture

Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
US8430676B2 (en) * 2009-08-10 2013-04-30 Sv Probe Pte. Ltd. Modular space transformer for fine pitch vertical probing applications
US9651578B2 (en) 2011-04-21 2017-05-16 Mpi Corporation Assembly method of direct-docking probing device
CN107272046B (en) * 2017-06-09 2023-10-03 东莞中子科学中心 Detector for measuring beam profile
CN109496054A (en) * 2017-09-11 2019-03-19 无锡旺矽科技有限公司 A kind of vertical fine probe card high frequency connector MVW structure of ceramic base

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104569514A (en) * 2013-10-22 2015-04-29 旺矽科技股份有限公司 Space transformer using carrier plate for chip packaging and manufacturing method thereof
CN104569514B (en) * 2013-10-22 2017-10-03 旺矽科技股份有限公司 Space transformer using carrier plate for chip packaging and manufacturing method thereof
TWI767803B (en) * 2021-07-26 2022-06-11 旭光科國際有限公司 The method of implanting needles of IC test socket and its fixture

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