TWI330982B

TWI330982B - Image capture device

Info

Publication number: TWI330982B
Application number: TW96118730A
Authority: TW
Inventors: ying cheng Wu; Kun Hsiao Liu
Original assignee: Hon Hai Prec Ind Co Ltd
Priority date: 2007-05-25
Filing date: 2007-05-25
Publication date: 2010-09-21
Also published as: TW200847773A

Description

1330982 六、發明說明： 099年06月【發明所屬之技術領域】 [0001]本發明係關於影像攝取裝置，特別係關於一種小型化影像攝取裝置。【先前技術】 [0002] 影像攝取裝置係數位攝像産品中最重要之組件，其演進對數位攝像産品之發展有著决定性之影響，隨著數位攝像産品之大衆化，數位攝像産品之小蜇化、輕量化、高品質成爲消費者挑選數位攝像産品標準，高品質及小尺寸之數位攝像産品便成爲各個商家競相追逐之目標。而作爲數位攝像產品核心組件之影像攝取裝置更是首當其衝地朝小尺寸及高品質方向發展，而影像攝取裝置中之影像感測器封裝之尺寸及品質則是决定影像攝取裝置之尺寸及品質之重要因素。爲提高影像攝取裝置之成像品質’.將些被動元件與影像感測器整合成一體，來减少影像感測器於訊號切換及傳輸過程中產生之雜訊串音。 [0003] 請參閱圖1，現有之一種整合有被動元件之影像感測器封裝10，其包括一基體1 、一支撑件2、一影像感測晶片3 、兩個被動元件4、一透明蓋板5。所述支撑件2設置於所述基體1上與其形成一容腔6，所述影像感測晶片3容置於該容腔6内且與基體丨電性及結構性連接。兩個被動元件4 也容置於所述容腔6内與所述基體1電性及結構性連接。所述透明蓋板5固設於所述支撑件2上將所述容腔6密封。該影像感測器將被動元件4與影像感測晶片3整合於同一封裝體内’從而達到改善訊號傳輸質量之目的，但是， 096118730 表單煸號A0101 第5頁/共18頁 0993202883-0 1330982 099年 06月此種封裝結構需於基體1上爲被動元件4之安裝預留一定之空間，因此使得整個影像感測器封裝之體積增大’從而致使應用此種影像感測器封裝之影像攝取裝置之體積魔大，不利於輕量化及小型化之發展。【發明内容】 [0004]有鑒於此，有必要提供一種小型化之影像攝取裝置。 [0005] —影像攝取裝置，其包括：一鏡頭；一影像感測器封裝，該影像感測封裝與所述鏡頭對正設置之；該影像感測器封裝包括：一基體，該基體上形戍有一凹槽；至少一被動元件’該被動元件設置於所述基體之凹槽内；一填充材料 ’該填充材料填充於所述基體之凹槽内，覆蓋所述被動元件；一影像感測晶片，該影像感測晶片由所述填充材料支撑於所述被動元件上方且與所述基體電性連接；一第一枯接材料，第一粘接材料塗佈於所述影像感測晶片邊緣；及一蓋板，該蓋板由所述第一黏接材料支律於影像感測晶片上方。一影像攝取裝置，其包括：一鏡頭；一影像感測器封裝，該影像感測封裝與所述鏡頭對正設置；該影像感測器封裝包括：一基體，該基體上形成有至少一凹槽；至少一被動元件，該被動元件對應設置於所述基體之凹槽内；一密封材料’該密封材料填充於所述基體之凹槽内，覆蓋所述被動元件；—影像感測晶片，該影像感測晶片由所述密封材料支撑於所述被動元件上方且與所述基體電性連 =一第-枯接材料’第一枯接村料塗佈於所述影像感測緣；及一蓋板’該蓋板由所述第一黏接材料支撑於表單編號A0101 第6頁/共18頁 0993202883-01330982 VI. Description of the Invention: June, 099 [Technical Field of the Invention] [0001] The present invention relates to an image pickup apparatus, and more particularly to a miniaturized image pickup apparatus. [Prior Art] [0002] The most important component of the image capturing device of the image capturing device, its evolution has a decisive influence on the development of digital camera products. With the popularity of digital camera products, the digital camera products have become less and less Lightweight and high quality have become the standard for consumers to select digital camera products. High-quality and small-sized digital camera products have become the target of various businesses. The image capture device, which is the core component of the digital camera product, is the first to develop toward small size and high quality. The size and quality of the image sensor package in the image capture device determine the size and quality of the image capture device. Key factor. In order to improve the imaging quality of the image capture device, the passive components and the image sensor are integrated to reduce the noise crosstalk generated by the image sensor during signal switching and transmission. [0003] Referring to FIG. 1 , an existing image sensor package 10 incorporating a passive component includes a substrate 1 , a support member 2 , an image sensing wafer 3 , two passive components 4 , and a transparent cover . Board 5. The support member 2 is disposed on the substrate 1 and forms a cavity 6 . The image sensing chip 3 is received in the cavity 6 and electrically and structurally connected to the substrate. The two passive components 4 are also accommodated in the cavity 6 in an electrically and structurally connected manner to the substrate 1 . The transparent cover plate 5 is fixed on the support member 2 to seal the cavity 6 . The image sensor integrates the passive component 4 and the image sensing die 3 in the same package to improve the quality of the signal transmission. However, the 096118730 form nickname A0101 page 5 / 18 pages 0993202883-0 1330982 099 In June of this year, the package structure needs to reserve a certain space for the installation of the passive component 4 on the substrate 1, thus increasing the volume of the entire image sensor package, thereby causing image pickup of the image sensor package. The size of the device is huge, which is not conducive to the development of lightweight and miniaturization. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a miniaturized image pickup device. An image capturing device includes: a lens; an image sensor package, the image sensing package is disposed opposite to the lens; the image sensor package includes: a substrate, the substrate is shaped戍 a recess; at least one passive component 'the passive component is disposed in the recess of the base; a filler material' is filled in the recess of the base to cover the passive component; an image sensing a wafer, the image sensing wafer is supported by the filling material over the passive component and electrically connected to the substrate; a first bonding material, the first bonding material is coated on the edge of the image sensing wafer And a cover plate that is bound by the first bonding material over the image sensing wafer. An image capturing device includes: a lens; an image sensor package, the image sensing package is aligned with the lens; the image sensor package includes: a substrate, the substrate is formed with at least one concave a passive component that is disposed in a recess of the substrate; a sealing material filled in the recess of the substrate to cover the passive component; an image sensing wafer, The image sensing wafer is supported by the sealing material over the passive component and electrically connected to the substrate; a first-battery material is applied to the image sensing edge; and A cover plate is supported by the first bonding material in form number A0101. Page 6 of 18 pages 0993202883-0

[0006] 096118730 1330982 影像感測晶片上方。 [〇〇〇7] 相較於先前技術’該影像攝取裝置采用將被動元件設置於基體之凹槽内從而節省空間，滅小影像攝取裝置之體積，從而適應輕量化及小型化之發展趨勢。【實施方式】 [0008] 請參閱圖2，本發明影像攝取裝置之較佳實施例，該影像攝取裝置1〇〇包括一影像感測器封裝110及一鏡頭模組 130。所述影像感剩器封裝110與鏡頭模組130對正設置〇 [0009] 所述影像感測器封裝11〇包括有一基體112、多個被動元件114、填充材料115、一影像感測晶片116、多條導線 117、第一粘接材料118、及一蓋板119。 [0010] 所述基體112用於承載所述影像感測晶片116等電氣元件[0006] 096118730 1330982 The image is sensed above the wafer. [〇〇〇7] Compared with the prior art, the image pickup device employs a passive element in a recess of the substrate to save space and eliminate the volume of the small image pickup device, thereby adapting to the trend of light weight and miniaturization. [0008] Referring to FIG. 2, in a preferred embodiment of the image capture device of the present invention, the image capture device 1 includes an image sensor package 110 and a lens module 130. The image sensor package 110 and the lens module 130 are aligned. [0009] The image sensor package 11 includes a substrate 112, a plurality of passive components 114, a filling material 115, and an image sensing wafer 116. A plurality of wires 117, a first bonding material 118, and a cover plate 119. [0010] The base 112 is used to carry electrical components such as the image sensing chip 116.

β該基體112包括一頂面1122及一與所述上表面對應之底面1124。於該基體112之頂面1122上開設有一四槽1221 。優選地’該凹槽之1221之尺寸大於所述影像感測晶片 116之尺寸並用以容置所述被動元件114。所述四槽1221 内還可設置有可與外部電路相電連接之電路（圖未示）。該基體112之頂面1122上還設置有多個圍繞所述凹槽 1221用於傳輸訊號之輸入端1123 ’於其下表面上Π24設置有多個對應於所述輸入端1123之輸出端1125 ’所述輸入端1123與輸出端丨125通過設置於該基體112内部之電路相電連接。所述設置於凹槽1221内之電路通過設置於該基體112上之輪入端1123及輸出端1125與外部電路相電連接。可以理解，所述凹槽1221亦可以係由多個凹槽的表單編號Α0101 第7頁/共18頁 0993202883-0 1330982 _ 099年06月09日梭正替换頁組合。 [0011] 所述被動元件114是用以改善影像感測訊號傳輸品質之元件，其可以是電感元件、電容元件或者電阻元件。該被動元件114收容於所述基體112之凹槽1221内並與所述基體電性連接。 [0012] 填充材料115可爲樹脂等高分子聚合物。該填充材料115The base 112 includes a top surface 1122 and a bottom surface 1124 corresponding to the upper surface. A four-slot 1221 is defined in the top surface 1122 of the base 112. Preferably, the size of the recess 1221 is larger than the size of the image sensing wafer 116 and accommodates the passive component 114. A circuit (not shown) that can be electrically connected to an external circuit can also be disposed in the four slots 1221. The top surface 1122 of the base body 112 is further provided with a plurality of input ends 1123 ′ for transmitting signals around the recesses 1221. On the lower surface thereof, the Π 24 is provided with a plurality of output ends 1125 ′ corresponding to the input ends 1123. The input end 1123 and the output end 丨 125 are electrically connected by a circuit disposed inside the base body 112. The circuit disposed in the recess 1221 is electrically connected to an external circuit through a wheel terminal 1123 and an output terminal 1125 disposed on the base 112. It can be understood that the groove 1221 can also be composed of a plurality of grooves. Form number Α0101 Page 7/18 pages 0993202883-0 1330982 _ 0999 0909 Shuttle replacement page combination. [0011] The passive component 114 is an element for improving the quality of the image sensing signal transmission, and may be an inductance component, a capacitance component or a resistance component. The driven component 114 is received in the recess 1221 of the base 112 and electrically connected to the base. [0012] The filler 115 may be a polymer such as a resin. The filling material 115

填充於所述基體112之凹槽1221内，將設置於凹槽1221 内之被動元件114包覆，並將所述影像感測晶片116支撑於所述被動元件114之上方。可以理解該填充材料115可將該凹槽1221完全填充，且該填充材料115之表面與基體 11 2之頂面1122之高度一致，從形成一具有平整表面之基體112。此外，該填充材料11 5也可填充部分凹槽1221，從而使凹槽1221留出部分空間，將所述影像感測晶片116 部分收容至該凹槽1221内，從而降低該影像感測封裝110 之高度。該填充材料11 5亦可由其它密封在料替代。 [0013] 影像感測晶片116爲一光敏元件，可將光訊號轉化爲電訊號，該影像感測晶片116有一上表面1162及一下表面 1164，其上表面1162設置有一感測區1165及環繞該感測區1165之多個晶片焊墊1167。該影像感測晶片116通過其下表面1164固設於所述填充材料115上。可以理解於該影像晶片116之下表面與所填充材料115之間可設置絕緣、隔熱或者電磁屏蔽層，也可以設置上述三者或者任意兩者組合形成之複合層，從而防止於使用過程中由設置於其下部之被動元件産生之熱量及電磁波對影像感測晶片116之正常工作造成影響，從而提高該影像攝取裝置之 096118730 表單編號A0101 第8頁/共18頁 0993202883-0Filled in the recess 1221 of the base 112, the passive component 114 disposed in the recess 1221 is covered, and the image sensing wafer 116 is supported above the passive component 114. It can be understood that the filling material 115 can completely fill the groove 1221, and the surface of the filling material 115 coincides with the height of the top surface 1122 of the base 11 2 to form a substrate 112 having a flat surface. In addition, the filling material 11 5 can also fill a portion of the recess 1221 , so that the recess 1221 leaves a part of the space, and the image sensing chip 116 is partially received into the recess 1221 , thereby reducing the image sensing package 110 . The height. The filler material 115 can also be replaced by other seal materials. The image sensing chip 116 is a photosensitive element that converts the optical signal into an electrical signal. The image sensing wafer 116 has an upper surface 1162 and a lower surface 1164. The upper surface 1162 is provided with a sensing area 1165 and surrounds the image. A plurality of wafer pads 1167 of the sensing region 1165. The image sensing wafer 116 is secured to the fill material 115 by a lower surface 1164 thereof. It can be understood that an insulating, heat insulating or electromagnetic shielding layer may be disposed between the lower surface of the image wafer 116 and the filling material 115, and a composite layer formed by combining the above three or any combination of the two may be provided, thereby preventing the use process. The heat generated by the passive component disposed at the lower portion thereof and the electromagnetic wave affect the normal operation of the image sensing wafer 116, thereby improving the image capturing device 096118730 Form No. A0101 Page 8 / 18 pages 0993202883-0

1330982 |^年06^日修正躲頁I 可靠性。 [0014] 導線117爲導電性佳、抗氧化材料構成，所述每一導線 117之一端連接於影像感測晶片116之晶片焊墊i 167上，另一端連接於基體112之輸入端1123上，從而將影像感測晶片116電連接至基體Π 2上。可以理解所述影像感測晶片116也可通過導電片電性連接，或者於所述基體112上設置電連接架，采用覆晶連接之方式將所述影像感測晶片116與基體112電性連接。1330982 | ^ Year 06^ Day corrected hiding page I reliability. The wire 117 is formed of a conductive material and an anti-oxidation material. One end of each of the wires 117 is connected to the wafer pad i 167 of the image sensing wafer 116, and the other end is connected to the input end 1123 of the substrate 112. The image sensing wafer 116 is thereby electrically connected to the substrate Π 2 . It can be understood that the image sensing wafer 116 can also be electrically connected through the conductive sheet, or an electrical connection frame is disposed on the substrate 112, and the image sensing wafer 116 is electrically connected to the substrate 112 by using a flip chip connection. .

t〇015] 所述第一粘接材料118塗佈於影像感測晶片116之周緣側壁及其上表面1162之四周邊緣上’並進一步延伸至影像感測晶片116周圍之基體112之上表面上。該第一粘接材料118覆蓋所述影像感測晶片116之晶片焊墊1167及設置於基體112上之輸入端1123，並包覆所述連接晶片焊墊 Η 67及輸入端1123之導線117。 t〇0l6] 透光蓋板119設置於所述第一粘接材料118上，由所述第〆點接材料118支撑於影像感測晶片116之上方，並與該第--柏接材料118 —同將影像感測晶片11 6之感測區116 5 密封，與基體112 —同將影像感測晶片116密封，從而將彩像感測晶片116與外部環堍隔離，提高影像感測晶片 116之玎靠性。 [0017] 所述鐃頭130包括一鏡筒132、一鏡座134及一第二粘接讨科136，所述鏡筒132爲一中空枉體，其内部設置有至少〆鏡片1323及一濾波片1324，用以供所需之光線穿過，该鐃筒132之一端容置於鏡座134内。表單蹁號Α0101 第9頁/共18頁 0993202883-0 ι96Π8730 [0018] [0019] [0020] [0021] 096118730 鏡座l34爲呈中空狀，其包括一筒部1342及一座部1344 ，所述筒部1342呈中空圓柱狀’該筒部1342***述鏡筒132 β所述座部1344位於所述筒部1342之一端，並與所述筒部1342相連接。所述筒部1342及座部1344之連接處形成，肩部1345 ° 該鏡頭130罩設於所述影像感測器封裝110上，其中，鏡座134罩設於影像感測器封裝Π0之透光蓋板119上，鏡座134之肩部1345之底面通過塗佈於透光蓋板11 9頂面周緣之第 >粘接材料丨36固設於所述透光蓋板119之頂面。可以理解，所述鏡座130通過鏡座134之肩部1345設置於所述影像感測封裝110上，因此，其鏡座134之對應於所述影像威測器封裝11 〇之基體112之頂面112 2之端部可僅與所述基體112之頂面1122相接觸，或者與所述基體112 之頂面Π22相分離。此外，爲加强所述鏡座134與所述影像感測器封裝110之粘接强度，也可於所述鏡座134之端部與所述基體112之頂面1122之間添加粘接材料，從而提高其粘接可靠性。本實施例中，通過於影像感測器封裝110之基體112上設置凹槽1221，將被動元件114設置於該凹槽，無需於基體丨12上爲被動元件再預留⑽，提高了影像感測器封裝110之封裝密度，從而减小影像感測器封裝110之封裝體積，同時也相應之减小影像攝取裝置100之體積，達釗小型化影像攝取裝置1 〇〇之目的。可以理解，於本發明中設置於基體112之頂面1122之凹槽 1221也可設置於該基體112之底面1124上所述被動元The first bonding material 118 is applied to the peripheral edge of the image sensing wafer 116 and the peripheral edge of the upper surface 1162 and extends further to the upper surface of the substrate 112 around the image sensing wafer 116. . The first bonding material 118 covers the wafer pad 1167 of the image sensing wafer 116 and the input end 1123 disposed on the substrate 112, and covers the connecting pad Η 67 and the wire 117 of the input end 1123. The transparent cover 119 is disposed on the first bonding material 118, and is supported by the second contact material 118 above the image sensing wafer 116, and is connected to the first burying material 118. - sealing the sensing region 116 5 of the image sensing wafer 116, sealing the image sensing wafer 116 with the substrate 112, thereby isolating the color image sensing wafer 116 from the external ring, and improving the image sensing wafer 116. It depends on sex. [0017] The boring head 130 includes a lens barrel 132, a lens holder 134 and a second bonding 136. The lens barrel 132 is a hollow body, and at least the 〆 lens 1323 and a filter are disposed inside. A sheet 1324 is provided for the desired light to pass therethrough, and one end of the cartridge 132 is received in the lens holder 134. Form Α Α 0101 Page 9 / 18 pages 0993202883-0 ι96 Π 8730 [0019] [0021] 096118730 The lens holder l34 is hollow, including a tube portion 1342 and a portion 1344, the tube The portion 1342 has a hollow cylindrical shape. The tubular portion 1342 accommodates the lens barrel 132. The seat portion 1344 is located at one end of the tubular portion 1342 and is connected to the tubular portion 1342. The lens portion 1342 and the seat portion 1344 are formed at a joint portion, and the shoulder portion 1345 ° is disposed on the image sensor package 110. The lens holder 134 is disposed on the image sensor package Π0. On the light cover 119, the bottom surface of the shoulder portion 1345 of the lens holder 134 is fixed to the top surface of the transparent cover plate 119 by a bonding material 丨 36 applied to the periphery of the top surface of the transparent cover plate 119. . It can be understood that the lens holder 130 is disposed on the image sensing package 110 through the shoulder 1345 of the lens holder 134. Therefore, the mirror holder 134 corresponds to the top of the base 112 of the image detector package 11 . The end of the face 112 2 may only be in contact with the top surface 1122 of the substrate 112 or be separated from the top surface 22 of the substrate 112. In addition, in order to strengthen the bonding strength between the lens holder 134 and the image sensor package 110, an adhesive material may be added between the end of the lens holder 134 and the top surface 1122 of the substrate 112. Thereby improving the bonding reliability. In this embodiment, by providing the recess 1221 on the base 112 of the image sensor package 110, the passive component 114 is disposed in the recess, and the passive component is not reserved on the base 12 (10), thereby improving the image sense. The package density of the detector package 110 reduces the package volume of the image sensor package 110, and at the same time reduces the volume of the image capture device 100, thereby achieving the goal of miniaturizing the image capture device. It can be understood that the recess 1221 disposed on the top surface 1122 of the base 112 may also be disposed on the bottom surface 1124 of the base 112.

表單煸號A0101 第10頁/共18頁 0993202883-0 1330982 [0022]Form nickname A0101 Page 10 of 18 0993202883-0 1330982 [0022]

[0023] [0024] [0025][0025] [0025]

[0026] [0027] [0028] [0029] [0030] [0031] 099年06月09日接正替換頁件114設置於所述凹槽1221内，影像感測晶片116對應於所述被動兀件114設置於所述基體112之頂面1122上並與所述基體112相電連接。從而使得於使用過程中由被動元件114所産生之熱量由基體112之下部向外擴散，從而减少因被動兀件産生之熱對該影像攝取裝置1〇〇之成像品質之影響》〇〇貝综上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，本發明之範圍並不以上述實施方式為限，舉凡熟習本案技藝之人士援依本發明之精神所作之等效修飾或變化皆應涵蓋於以下申請專利範圍内。【圖式簡單說明】圖1係現有之一種影像感測器之剖視圖。圖2係本發明影像攝取裝置較佳實施例之剖視圖。【主要元件符號說明】 (習知）基體：1 支撑件：2 影像感測晶月· 3 被動元件：4 透明蓋板：5 容腔：6 096118730 表單編號A0101 第Π頁/共18貞 0993202883-0 1330982 [0032] 影像感測器封裝：10 [0033] (本發明） [0034] 影像攝取裝置：100 [0035] 影像感測器封裝：110 [0036] 基體：112 [0037} 凹槽：1221 [0038] 頂面：1122 [0039] 輸入端：1123 [0040] 底面：1124 [0041] 輸出端：1125 [0042] 被動元件：114 [0043] 填充材料：115 [0044] 影像感測晶片：116 [0045] 上表面：1162 [0046] 下表面：1164 [0047] 感測區：1165 [0048] 晶片焊墊：1167 [0049] 導線：117 [0050] 第一粘接材料：118 096118730 表單編號A0101 第12頁/共18頁 099年06月09日核=正替換頁 0993202883-0[0028] [0019] [0031] The correct replacement page member 114 is disposed in the groove 1221 on June 9, 099, and the image sensing wafer 116 corresponds to the passive 兀The member 114 is disposed on the top surface 1122 of the base 112 and electrically connected to the base 112. Therefore, the heat generated by the passive component 114 during use is diffused outward from the lower portion of the substrate 112, thereby reducing the influence of the heat generated by the passive component on the imaging quality of the image capturing device 1 》 As described above, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art should make equivalent modifications or changes in accordance with the spirit of the present invention. It is covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a conventional image sensor. Figure 2 is a cross-sectional view showing a preferred embodiment of the image pickup apparatus of the present invention. [Main component symbol description] (General) Base: 1 Support: 2 Image sensing crystal · 3 Passive components: 4 Transparent cover: 5 Cavity: 6 096118730 Form No. A0101 Page / Total 18贞0993202883- 0 1330982 [0032] Image sensor package: 10 [0033] (Invention) [0034] Image pickup device: 100 [0035] Image sensor package: 110 [0036] Base: 112 [0037] Groove: 1221 Top surface: 1122 [0039] Input: 1123 [0040] Bottom surface: 1124 [0041] Output: 1125 [0042] Passive component: 114 [0043] Filling material: 115 [0044] Image sensing wafer: 116 [0045] Upper surface: 1162 [0046] Lower surface: 1164 [0047] Sensing area: 1165 [0048] Wafer pad: 1167 [0049] Wire: 117 [0050] First bonding material: 118 096118730 Form No. A0101 Page 12 of 18 Page 999 June 09 Core = Positive Replacement Page 0993202883-0

1330982 [0051] [0052] [0053] [0054] [0055] [0056] [0057][0055] [0055] [0057] [0057]

[0058] [0059] 透光蓋板：119 鏡頭：130 鏡筒：132 鏡片：1323 濾波片：1324 鏡座：134 筒部：1342 座部：1344 肩部：1345 099年06月09日修正替換頁[0059] Light transmissive cover: 119 Lens: 130 Lens barrel: 132 Lens: 1323 Filter: 1324 Mirror base: 134 Tube: 1342 Seat: 1344 Shoulder: 1345 Correction replacement on June 09, 099 page

096118730 表單编號A0101 第13頁/共18頁 0993202883-0096118730 Form No. A0101 Page 13 of 18 0993202883-0

Claims

1330982 099年06月09日修正替換頁七、申請專利範圍： 1 . 一種影像攝取裝置’其包括：一鏡頭；一影像感測器封裝，該影像感測封裳與所述鏡頭對正設置 :該影像感測器封裝包括：一基體，該基體包括一頂面且在該項面上形成有一凹槽；至少一被動元件’該被動元件設置於所述基體之凹槽内；一填充材料，該填充材料填充於所述基體之凹槽内，覆蓋所述被動元件；一影像感測晶片，該影像感測晶片由所述填充材料支撑於所述被動元件上方且與所述基體電性連接；一第一粘接材料，第一粘接材料塗佈於所述影像感測晶片邊緣；及一蓋板，該蓋板由所述第一黏接材料支撑於影像感測晶片上方。 2 .如申請專利範圍第1項所述之影像攝取裝置，其中，所述鏡頭進一步包括一鏡座、一鏡筒及一第二粘接材料，所述鏡筒中收容有鏡片及濾波片’該鏡筒與所述鏡座相配合，所述鏡座通過所述第二枯接材料罩設於所述影像感測器封裝之蓋板上。 3 .如申請專利範圍第2項所述之影像攝取袭置，其中，所述鏡座包括一筒部及與其相連接一座部’所述筒部***述鏡筒，所述筒部及座部之連接處形成一肩部，所述鏡座通過所述肩部罩設於所述影像感測器封裝之蓋板上。 4.如申請專利範圍第3項所述之影像攝取裝置，其中，所述 096118730 表單編號A0101 第14頁/共18頁 0993202883-0 1099 年06 月鏡座對應於所述影像感測器封裝之基體之一端與所述基體之間設置有粘接材料。 .如申請專利範圍第丨項所述之影像攝取裝置，其中，所述凹槽之尺寸大於所述影像感測晶片之尺寸。 .如申請專利範圍第5項所述之影像攝取裝置，其中，所述填充材料之表面低於所述基體形成有凹槽之一側表面，所述影像感測晶片部分容置於所述凹槽内。 .如申請專利範圍第1項所述之影像攝取裝置，其中’該影像感測器封裝還包括一絕緣層，該絕緣層設置於所述填充材料上，所述影像感測晶片設置於所述絕緣層上。 •如申請專利範圍第7項所述之影像攝取裝置，其中，該影像感測器封裝還包括一絕緣層及隔熱層，所述絕緣層設置於所述填充材料上，所述隔熱層設置於所述絕緣層上，所述影像感測晶片設置於所述隔熱層上。 .如申請專利範圍第8項所述之影像攝取裝置，其中，該影像感測器封裝還包括一絕緣層、一隔熱層及一電磁屏蔽層，所述絕緣層設置於所述填充材料上，所述隔熱層設置於所述絕緣層上，所述電磁屏蔽層設置於所述隔熱層上，所述影像感測晶片設置於所述電磁屏蔽層上》 .如申請專利範圍第1項所述之影像攝取裝置，其中，所述影像感測晶片包括—感測區及圍繞該感測區之多個晶片焊墊，所述基體上形成有多個與所述晶片焊墊相對應之輸入端，所述晶片每一焊墊與對應之輸入端通過導線相電連接〇 •如申請專利範圍第10項所述之影像攝取裝置，其中，所述晶片焊墊、輪入端及導線被所述第一粘接材料所包覆。表單编號A0101 第丨5頁/共18頁 0993202883-0 1330982 _ 099年06月09日梭正替换頁. 12 . —種影像攝取裝置，其包括： . 一鏡頭；一影像感測器封裝，該影像感測封裝與所述鏡頭對正設置 :該影像感測器封裝包括：一基體，該基體包括一頂面且在該頂面上形成有至少一凹槽；至少一被動元件，該被動元件對應設置於所述基體之凹槽内；一密封材料，該密封材料填充於所述基體之凹槽内，覆蓋1330982 Correction and replacement page on June 09, 099. Patent application scope: 1. An image pickup device comprising: a lens; an image sensor package, the image sensing package is aligned with the lens: The image sensor package includes: a substrate comprising a top surface and a recess formed on the surface; at least one passive component disposed in the recess of the substrate; a filling material, The filling material is filled in the recess of the substrate to cover the passive component; an image sensing wafer supported by the filling material over the passive component and electrically connected to the substrate a first bonding material, the first bonding material is applied to the edge of the image sensing wafer; and a cover plate supported by the first bonding material over the image sensing wafer. The image capturing device of claim 1, wherein the lens further comprises a lens holder, a lens barrel and a second bonding material, wherein the lens barrel houses a lens and a filter The lens barrel cooperates with the lens holder, and the lens holder is disposed on the cover of the image sensor package through the second abutting material. 3. The image ingestion method of claim 2, wherein the lens holder comprises a tubular portion and a portion connected thereto, the cylindrical portion housing the lens barrel, the tube portion and the seat portion A joint is formed at the joint of the portion, and the mirror seat is disposed on the cover of the image sensor package through the shoulder cover. 4. The image capture device of claim 3, wherein the 096118730 form number A0101 page 14/18 pages 0993202883-0 1099 June lens holder corresponds to the image sensor package An adhesive material is disposed between one end of the base body and the base body. The image pickup device of claim 2, wherein the size of the groove is larger than a size of the image sensing wafer. The image capturing device of claim 5, wherein a surface of the filling material is lower than a side surface of the substrate formed with a groove, and the image sensing wafer portion is received in the concave portion. Inside the slot. The image capturing device of claim 1, wherein the image sensor package further comprises an insulating layer disposed on the filling material, the image sensing wafer being disposed on the On the insulation layer. The image capturing device of claim 7, wherein the image sensor package further comprises an insulating layer and a heat insulating layer, wherein the insulating layer is disposed on the filling material, the heat insulating layer The image sensing wafer is disposed on the insulating layer. The image sensor device of claim 8, wherein the image sensor package further comprises an insulating layer, a heat insulating layer and an electromagnetic shielding layer, wherein the insulating layer is disposed on the filling material. The heat insulating layer is disposed on the insulating layer, the electromagnetic shielding layer is disposed on the heat insulating layer, and the image sensing wafer is disposed on the electromagnetic shielding layer. The image sensing device of claim 1, wherein the image sensing wafer comprises a sensing area and a plurality of wafer pads surrounding the sensing area, and the substrate is formed with a plurality of corresponding to the wafer pads At the input end, each of the pads of the wafer and the corresponding input end are electrically connected by a wire. The image pickup device of claim 10, wherein the wafer pad, the wheel end and the wire It is covered by the first bonding material. Form No. A0101 Page 5 of 18 pages 0993202883-0 1330982 _ June 09, 2017 Shuttle replacement page. 12 - Image capture device, including: . A lens; an image sensor package, The image sensing package is disposed opposite to the lens: the image sensor package includes: a base body including a top surface and at least one groove formed on the top surface; at least one passive component, the passive The component is correspondingly disposed in the groove of the base body; a sealing material filled in the groove of the base body, covering

所述被動元件；一影像感測晶片，該影像感測晶片由所述密封材料支撑於所述被動元件上方且與所述基體電性連接；一第一粘接材料，第一粘接材料塗佈於所述影像感測晶片邊緣；及一蓋板，該蓋板由所述第一黏接材料支撑於影像感測晶片上方。 096118730 表單編號A0101 第16頁/共18頁 0993202883-0The passive sensing component; an image sensing wafer supported by the sealing material over the passive component and electrically connected to the substrate; a first bonding material, the first bonding material is coated Providing an edge of the image sensing wafer; and a cover plate supported by the first bonding material over the image sensing wafer. 096118730 Form No. A0101 Page 16 of 18 0993202883-0