TWI343740B - Image sensor package and imageing device therewith - Google Patents
Image sensor package and imageing device therewith Download PDFInfo
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1343740 100年03月31日修正替換π 六、發明說明: 【發明所屬之技術領域】 [0001] 本發明是關於影像感測器封裝及其應用之影像攝取裝置 尤其係關於一種小尺寸影像感測器封裝及一種小尺寸影 像攝取裝置。 【先前技術】1343740 Correction and replacement of π on March 31, 100. Description of the Invention: [Technical Field] [0001] The present invention relates to an image pickup device and an image pickup device thereof, particularly for a small size image sensing Package and a small size image capture device. [Prior Art]
[0002] 影像感測器係數位攝像産品中之核心元件之一,爲改善 其成像品質,將一些被動元件與影像感測器整合為一體 ,從而減少影像感測器於訊號切換及傳輸過程中産生之 雜訊串音。 [0003]請參閱圖1,習知之一整合測器封裝 10,其包括-基體1、- JE 測晶片3、 二被動元件4、一透明蓋板5,所述支撐伴2設置於所述基 體1上與其形成一容腔6,所述影像感測晶片容置於該容 腔6内且與所述基體1電性及結構I性連接,二被動元件4也 容置於所述容腔6内與所述基雔1電性尽結構性連接,所 述透明蓋板5固設於所述支撐件:2上將所述容腔6密封。該 影像感測器將被動元件4及影像感測晶片3整合於同一封 裝體内,從而達到改善訊號傳輸置質量之目的,然,此 種封裝結構需於基體1上爲被動元件4安裝預留一定之空 間,因此使得整個影像感測器封裝之體積增大,不利於 影像感測器封裝之小型化及應用該影像感測器封裝之産 品小型化。 【發明内容】 [0004] 有鑒於此,有必要提供一有效利用空間之小型化影像感 096110286 表單煸號Α0101 第4頁/共30頁 1003111032-0 1343740 - 100年03月31日後正替換頁 測器封裝。 [0005] 還有必要提供一可有效利用空間之應用該影像感測器封 裝之影像攝取裝置 [0006] —種影像感測器封裝,包括一影像感測晶片、一基體、 一蓋板及至少一被動元件,所述影像感測晶片包括一上 表面及一下表面,於其上表面上形成有感測區及環繞該 感測區之非感測區,所述感測區用以感測光線並將其轉 換爲電訊號,該影像感測晶片電性及結構性連接於所述 φ 基體上,蓋板由基體支撐於影像感測晶片之上方,該影 像感測器封裝還包括一載體,該載體設置於所述影像感 測晶片之非影像感測區上,被動元件設置於該載體上, 並與該上述基體電性連接。[0002] One of the core components of the image sensor coefficient camera product, in order to improve the imaging quality, integrate some passive components with the image sensor, thereby reducing the image sensor in the signal switching and transmission process. Generated noise crosstalk. Referring to FIG. 1 , a conventional integrated detector package 10 includes a base body 1 , a JE test wafer 3 , a second passive component 4 , and a transparent cover 5 . The support partner 2 is disposed on the base body. 1 is formed with a cavity 6 , the image sensing chip is received in the cavity 6 and electrically connected to the substrate 1 , and the passive component 4 is also accommodated in the cavity 6 . The inner cover is electrically connected to the base 1 , and the transparent cover 5 is fixed to the support member 2 to seal the cavity 6 . The image sensor integrates the passive component 4 and the image sensing die 3 into the same package, thereby improving the quality of the signal transmission. However, the package structure needs to be reserved for the passive component 4 on the substrate 1. A certain space, thus increasing the size of the entire image sensor package, is not conducive to miniaturization of the image sensor package and miniaturization of the product using the image sensor package. SUMMARY OF THE INVENTION [0004] In view of this, it is necessary to provide an effective use space for miniaturized imagery 096110286 Form Α Α 0101 Page 4 / Total 30 pages 1003111032-0 1343740 - Replacement page measurement after March 31, 100 Package. [0005] It is also necessary to provide an image capturing device that can effectively utilize space for the image sensor package. [0006] An image sensor package includes an image sensing chip, a substrate, a cover, and at least a passive component, the image sensing die includes an upper surface and a lower surface, and a sensing area and a non-sensing area surrounding the sensing area are formed on the upper surface thereof, wherein the sensing area is used for sensing light And converting the image into a signal, the image sensing chip is electrically and structurally connected to the φ substrate, and the cover is supported by the substrate above the image sensing chip, the image sensor package further comprising a carrier. The carrier is disposed on the non-image sensing area of the image sensing chip, and the passive component is disposed on the carrier and electrically connected to the substrate.
[0007] 一種影像感測器封裝其包括一基體;一影像感測晶片,所 述影像感測晶片包括一上表面及一下表面,於其上表面 上形成有感測區及壤繞該感測區之非感測區’所述感測 區用以感測光線並將其轉換爲電訊號*該影像感測晶片 電性及結構性連接於所述基體上;一蓋板,該蓋板包括 一電極區及一非電極區,所述非電極區與所述影像感測 晶片之感測區相對正,該蓋板由所述基體支撐於所述影 像感測晶片上方;至少一被動元件,該被動元件設置於所 述蓋板之電極區内並與所述基體電性連接。 [0008] 一影像攝取裝置,其包括一鏡頭模組及與該鏡頭模組相 對正設置之影像感測器封裝,該影像感測器封裝包括一 影像感測晶月、一基體、一蓋板及至少一被動元件,所 096110286 表單編號A0101 第5頁/共30頁 1003111032-0 1343740 [0009] [0010] [0011] 096110286[0007] An image sensor package includes a substrate; an image sensing wafer, the image sensing wafer includes an upper surface and a lower surface, and a sensing region is formed on the upper surface thereof and the sensing is performed on the upper surface The sensing area of the area is for sensing light and converting it into an electrical signal. The image sensing chip is electrically and structurally connected to the substrate; a cover plate, the cover plate includes An electrode region and a non-electrode region, the non-electrode region being opposite to the sensing region of the image sensing chip, the cover plate being supported by the substrate above the image sensing wafer; at least one passive component, The passive component is disposed in the electrode region of the cover plate and electrically connected to the base. An image capturing device includes a lens module and an image sensor package disposed opposite the lens module, the image sensor package including an image sensing crystal, a substrate, and a cover And at least one passive component, 096110286 Form No. A0101 Page 5 / Total 30 Page 1003111032-0 1343740 [0009] [0010] [0011] 096110286
100年03月31日梭正替换W 述影像感測晶片包括一上表面及一下表面,於其上表面 上形成有感測區及環繞該感測區之非感測區,所述感測 區用以感測光線並將其轉換爲電訊號,該影像感測晶片 電性及結構性連接於所述基體上,蓋板由基體支撐於影 像感測晶片上方,該影像感測器封裝還包括一載體,該 載體設置於所述影像感測晶片之非影像感測區上,被動 元件設置於該載體上,並與所述基體電性連接。 一種影像攝取裝置,其包括:一電路板;一影像感測晶 片,該影像感測晶片包括一上表面及一下表面,於其上表 面上形成有感測區及環纔該感測篆之彝感測區,所述感 測區用以μ光線並將其像感測晶 片電性及結構性連減所,該載體 設置於所述影像感測晶片之非影像感測區上;至少一個 被動元件,該被動元件設置於所述載體上,並與所述基 體電性連接;一鏡頭模組,,該鏡踴模組罩設於所述電路 • ·. * ' * ,*· , * *' C * ' . 板上並將所述影像感測晶片.收容於莫内。 相較習知技術,本發明採用释被動元件設置於影像感測 晶片之非影像感測區上,無需於基體上再爲被動元件之 安裝預留空間,能夠有效利用空間,從而達成減小封裝 體積之目的。On March 31, 100, the shuttle is replacing the image sensing wafer including an upper surface and a lower surface, and a sensing area and a non-sensing area surrounding the sensing area are formed on the upper surface thereof, the sensing area For sensing light and converting it into an electrical signal, the image sensing chip is electrically and structurally connected to the substrate, and the cover is supported by the substrate above the image sensing wafer, and the image sensor package further includes A carrier is disposed on the non-image sensing area of the image sensing chip, and the passive component is disposed on the carrier and electrically connected to the substrate. An image capturing device includes: a circuit board; an image sensing chip, the image sensing chip includes an upper surface and a lower surface, and the sensing area and the ring are formed on the upper surface thereof to sense the flaw a sensing area, the sensing area is used for μ light and is connected to the sensing chip electrically and structurally, and the carrier is disposed on the non-image sensing area of the image sensing chip; at least one passive An element is disposed on the carrier and electrically connected to the base; a lens module, the mirror module is disposed on the circuit: ·. * ' * , *· , * * 'C*'. The board and the image sensing wafer are housed in Monet. Compared with the prior art, the present invention uses the passive component to be disposed on the non-image sensing area of the image sensing chip, and does not need to reserve space for the installation of the passive component on the substrate, thereby effectively utilizing the space, thereby achieving the reduction of the package. The purpose of volume.
【實施方式】 以下結合附圖對本技術方案實施例提供之影像攝取裝置 進一步說明。 請參閱圖2,本發明影像攝取裝置之第一較佳實施例,該 影像攝取裝置1 00包括一影像感測器封裝11 0及一鏡頭模 表單編號A0101 第6頁/共30頁 1003111032-0 [0012] 1343740 -_ 100年03月31日修正替換頁 組130。所述影像感測器封裝110與鏡頭模組對正設置。 [0013] 影像感測器封裝11 0包括有一基體11 2、一影像感測晶片 114、一載體116、二個被動元件117、多條導線118及一 蓋板119。 [0014] 基體112用於容置影像感測晶片114,該基體112包括一 上表面1122及一下表面1124,於其上表面1122上設置有 多個電性連接塊1123,於其下表面上1124設置有多個對 應於電性連接塊1123之導電凸塊1125,所述電性連接塊 • Π 23與導電凸塊11 25通過設置於該基體112内部之電路 相電連接。 [0015] 影像感測晶片114爲一光敏元件,可將光訊號轉化爲電訊 號’該影像感測晶片114有一上表面11 42及一下表面 1144,其上表面Π 42包括一感測區Π45及環繞該感測區 1145之非感測區1146,於所述非感測區1146上設置有多 個晶片焊墊1147。該影像感測晶片114通過其下表面 1144固設於基體112之上表面1122上。 [0016] 載體116爲一薄形連接層,主要爲被連接件提供結構性連 接。可以理解該載體116也可同時爲被連接件提供電性連 接’該載體116主要由樹脂粘著劑組成,此外也可於樹脂 粘著劑中填充一些導電粒子構成異方性導電連接層,即 該導電膜於同一方向可電氣導通,而於其他方向絕緣, 同時結合一些電極1162組成一結構性及電性連接層,該 電極11 62形成於充有導電粒子之樹脂中。該載體丨丨6中樹 脂粘著劑部分可用以提供防濕氣、接著、耐熱、絕緣以 096110286 表單編號A010丨 第7頁/共30頁 1003111032-0 1343740 100年〇3月31日後正替换寅 及固定被連接件與該載體Πβ内之電極1162之相對位置, 並提供一定之壓迫力以維持電極與導電粒子間之接觸面 積。導電粒子用於將被連接件之電極與設置於載體116内 之電極11 62電連接。該載體ι16設置於影像感測晶片114 上表面114 2之非感測區114 6上。 [0017] 被動元件117係用以改善影像感測訊號傳輸品質之元件, 其可以疋電感元件、電谷元件或者電阻元件,其設置於[Embodiment] The image pickup apparatus provided in the embodiment of the present technical solution will be further described below with reference to the accompanying drawings. Referring to FIG. 2, in a first preferred embodiment of the image capturing device of the present invention, the image capturing device 100 includes an image sensor package 110 and a lens module form number A0101. Page 6 of 30 pages 1003111032-0 [0012] 1343740 - _ March 31, 100 revised replacement page group 130. The image sensor package 110 is aligned with the lens module. The image sensor package 110 includes a substrate 11 , an image sensing wafer 114 , a carrier 116 , two passive components 117 , a plurality of wires 118 , and a cover 119 . The substrate 112 is configured to receive the image sensing wafer 114. The substrate 112 includes an upper surface 1122 and a lower surface 1124. The upper surface 1122 is provided with a plurality of electrical connecting blocks 1123, and the lower surface thereof is 1124. A plurality of conductive bumps 1125 corresponding to the electrical connection blocks 1123 are disposed, and the electrical connection blocks Π 23 and the conductive bumps 11 25 are electrically connected by a circuit disposed inside the substrate 112. The image sensing chip 114 is a photosensitive element that converts the optical signal into an electrical signal. The image sensing wafer 114 has an upper surface 11 42 and a lower surface 1144. The upper surface 42 includes a sensing region 45 and A non-sensing area 1146 surrounding the sensing area 1145 is disposed on the non-sensing area 1146 with a plurality of wafer pads 1147. The image sensing wafer 114 is secured to the upper surface 1122 of the substrate 112 by a lower surface 1144 thereof. [0016] The carrier 116 is a thin connecting layer that provides a structural connection primarily by the connector. It can be understood that the carrier 116 can also provide electrical connection for the connected member at the same time. The carrier 116 is mainly composed of a resin adhesive. In addition, some conductive particles can be filled in the resin adhesive to form an anisotropic conductive connecting layer, that is, The conductive film is electrically conductive in the same direction and insulated in other directions. At the same time, a plurality of electrodes 1162 are combined to form a structural and electrical connection layer. The electrode 1162 is formed in a resin filled with conductive particles. The resin adhesive portion of the carrier 6 can be used to provide moisture resistance, followed by heat resistance, insulation, 096110286, form number A010, page 7 / total 30 pages, 1003111032-0 1343740, 100 years, after March 31, replacement And fixing the relative position of the connected member to the electrode 1162 in the carrier Πβ, and providing a certain pressing force to maintain the contact area between the electrode and the conductive particles. The conductive particles are used to electrically connect the electrodes of the connected member to the electrodes 11 62 disposed in the carrier 116. The carrier ι16 is disposed on the non-sensing area 114 6 of the upper surface 114 2 of the image sensing wafer 114. [0017] The passive component 117 is used to improve the quality of the image sensing signal transmission, and may be an inductor component, a battery component or a resistor component.
載體116上,該被動元件117上還設置有多個電極(圖未標 ),所述被動元件117之電極與載體U6内之電極1162通 過載體116内之導電粗子相電連接。 [0018] 導線118用於將影像感測晶 連接至基體112上,其中On the carrier 116, the passive component 117 is further provided with a plurality of electrodes (not labeled). The electrodes of the passive component 117 are electrically connected to the electrodes 1162 in the carrier U6 through the conductive fins in the carrier 116. [0018] A wire 118 is used to connect the image sensing crystal to the substrate 112, wherein
1 7分別電 端連接於影 像感測晶片114之晶片焊塾114 7上’另一端連接於基體 11 2之電性連接塊11 23上,用以將影像感測晶片114電連 接至基體112上;另一部分;導線、π8之一鴻漣接於與被動The seventh end is connected to the wafer pad 114 7 of the image sensing wafer 114 and the other end is connected to the electrical connection block 11 23 of the substrate 11 2 for electrically connecting the image sensing wafer 114 to the substrate 112. Another part; the wire, one of the π8 is connected and passive
V . J 元件11 7之電極相電連接之載體1丨&之電極11 6 2上,該導 線118之另一端連接於基體.112之電性連接塊1123,用以 將被動元件11 7電連接至基體11 2上。 [0019]The electrode of the V. J element 11 7 is electrically connected to the carrier 1 丨 & the electrode 11 6 2, the other end of the wire 118 is connected to the electrical connection block 1123 of the substrate 112 for electrically connecting the passive component 11 7 Connected to the substrate 11 2 . [0019]
透光蓋板119設置於基體Π2上,與基體112一同將影像 感測晶片114密封,從而將影像感測晶片i i 4與外部環境 隔離’提高影像感測晶片11 4之可靠性。 所述鏡頭130包括一鏡筒132、一鏡座134及一枯接材料 136 ’所述鏡商132爲一中空柱體,其内部設置有至少一 組鏡片1324,用以供所需之光線穿過,該鏡筒132之一端 096110286 表單編號A0101 第8頁/共30頁 1003111032-0 [0020] 100年03月31日梭正替換頁 谷置於鏡座134内。鏡座丨34爲一階梯狀中空柱體,其包 括第—容置部1 342及位於其下方且與其相連通之第二容 置部1344,所述第二容置部丨344之内徑大於第一容置部 I 344之内杈。所述第二容置部1344包括一側壁丨346,該 鏡座134由其第二容置部丨344之側壁1346通過所述粘接 材料136與影像感測器封裝丨1〇相連接成一體,並將影像 感測器封裝11 〇收容于其第二容置部1内。可以理解, 所述鏡座134之第一容置部1342及第二容置部1 344之内 φ 徑可以根據不同需求而作相應變化,如上兩者内徑相同 或者後者小於前者亦可適用於本發明。所述鏡頭模組丨3 〇 亦可通過其鏡座13 4固設於影像感測器丨1 〇之頂部。 [0021] 本實施例中,用載體116將被動元件117設置於影像感測 晶片114之非影像感測區1146上,與影像感測晶片114一 同封裝’從而提高了影像感測晶片114之非影像感測區 II 46之表面利用率’節省空間,無需於基體丨丨2上爲被動 元件再預留空間,提高了該影像感測器封裝u 〇及應用該 • 影像感測器封裝Π0之影像攝取裝置1〇〇之空間利用率, 從實現小型化影像攝取裝置1〇〇之目的。 [0022] 請參閱圖3,本發明影像攝取裝置之第二較佳實施例,該 影像攝取裝置2〇〇與影像攝取裝置ι〇〇相似,其包括影像 感測器封裝210、載體230、被動元件240及鏡頭模組260 [0023]所述影像感測器封裝210包括一基體212、一影像感測晶 片214及一蓋板216。該基體212包括第一表面2122及第 二表面2124 ’其第一表面2122上還形成有一凸框2126, 3 表單編號A0101 第9頁/共30頁 1003111032-0 1343740 100年03月31日按正替换頁_ 該凸框2126及所述第一表面2122圍成一容腔2127,所述 影像感測晶片214設置於該容腔212 7内。影像感測晶片 214爲一光敏元件,可將光訊號轉化爲電訊號,該影像感 測晶片214有一上表面2142及一下表面2144,其上表面 2142包括一感測區2145及環繞該感測區2145之非感測區 2146,該影像感測晶片214通過其下表面2144固設於基 體212之上並與該基體212電性連接。蓋板216包括正面 2162及背面2164 ’該蓋板216通過其背面2164之邊緣部The transparent cover 119 is disposed on the base Π2 to seal the image sensing wafer 114 together with the substrate 112 to isolate the image sensing wafer i i 4 from the external environment. The reliability of the image sensing wafer 11 is improved. The lens 130 includes a lens barrel 132, a lens holder 134 and a splicing material 136'. The mirror quotient 132 is a hollow cylinder, and at least one set of lenses 1324 is disposed inside the lens for the required light to be worn. Over, one end of the lens barrel 132 is 096110286 Form No. A0101 Page 8 / Total 30 pages 1003111032-0 [0020] On March 31, 100, the shuttle replacement page is placed in the mirror holder 134. The mirror holder 34 is a stepped hollow cylinder, and includes a first receiving portion 1 342 and a second receiving portion 1344 located below and communicating therewith. The inner diameter of the second receiving portion 丨 344 is larger than The inside of the first accommodating portion I 344 is 杈. The second accommodating portion 1344 includes a side wall 346. The lens holder 134 is integrally connected to the image sensor package 丨1 through the side wall 1346 of the second accommodating portion 344 via the bonding material 136. And the image sensor package 11 〇 is received in the second accommodating portion 1 thereof. It can be understood that the diameters of the first accommodating portion 1342 and the second accommodating portion 1 344 of the lens holder 134 can be changed according to different requirements. The inner diameters of the two or the latter are the same or the latter is smaller than the former. this invention. The lens module 丨3 亦可 can also be fixed on the top of the image sensor 丨1 通过 through the lens holder 13 4 . [0021] In this embodiment, the passive component 117 is disposed on the non-image sensing area 1146 of the image sensing chip 114 by the carrier 116, and is packaged together with the image sensing chip 114 to improve the non-image sensing chip 114. The surface utilization of the image sensing area II 46 'saves space, no need to reserve space for the passive component on the substrate ,2, which improves the image sensor package u 应用 and the application of the image sensor package Π0 The space utilization rate of the image pickup device 1 is aimed at achieving a miniaturized image pickup device. [0022] Referring to FIG. 3, a second preferred embodiment of the image capture device of the present invention, the image capture device 2 is similar to the image capture device ι, including an image sensor package 210, a carrier 230, and a passive The image sensor package 210 includes a substrate 212, an image sensing wafer 214, and a cover 216. The base body 212 includes a first surface 2122 and a second surface 2124. A first frame 2122 is further formed with a convex frame 2126. 3 Form No. A0101 Page 9 / Total 30 Page 1003111032-0 1343740 100 March 31 The embossed frame 126 and the first surface 2122 define a cavity 2127. The image sensing wafer 214 is disposed in the cavity 212 7 . The image sensing chip 214 is a photosensitive element that converts the optical signal into an electrical signal. The image sensing wafer 214 has an upper surface 2142 and a lower surface 2144. The upper surface 2142 includes a sensing region 2145 and surrounds the sensing region. The non-sensing area 2146 of the 2145 is fixed on the base 212 and electrically connected to the base 212 through the lower surface 2144 of the image sensing wafer 2144. The cover 216 includes a front side 2162 and a back side 2164'. The cover 216 passes over the edge of the back side 2164
分設置於基體212之凸框2126上,用於將影像感測晶片 214與外部環境隔離’從提高影像感測·晶片214之可靠性 [0024]It is disposed on the convex frame 2126 of the base 212 for isolating the image sensing wafer 214 from the external environment. [Improving the reliability of the image sensing and wafer 214 [0024]
材料266 ’所述鏡筒262内設置有至少一組鏡片2624,該 鏡筒262之一端容置於鏡座264之一端,煞鏡座264未設 置雀見清262之一端通過袖接.:材料^ 3 6與所述.影像感測器封 裝210連接成一體。 ::’ r :The lens barrel 262 is provided with at least one set of lenses 2624. One end of the lens barrel 262 is disposed at one end of the lens holder 264, and the lens holder 264 is not provided with one end of the FF 262 through the sleeve. ^ 3 6 is integrated with the image sensor package 210. ::’ r :
[0025] 該影像攝取裝置200與影像攝取裝置1〇〇之區別在於: [0026] 所述影像感測器封裝210中基體212之凸框21 26之頂部還 設置有多個導電片2128,該導電片2128通過設置於基體 212内部之電路電性連接至212之下表面2144上,並可通 過設置於下表面2144上之電性連接點2129電連接。 [0027] 所述蓋板216之背面21 64還包括有一非電極區21 65及環 繞該非電極區21 65之電極區2166,所述非電極區2165與 設置於該蓋板216下方之影像感測晶片‘214之感測區2145 096110286 表單編號Α0101 第10頁/共30頁 1003111032-0 1343740[0025] The difference between the image capturing device 200 and the image capturing device 1 is: [0026] a plurality of conductive sheets 2128 are further disposed on the top of the convex frame 21 26 of the base 212 in the image sensor package 210. The conductive sheet 2128 is electrically connected to the lower surface 2144 of the 212 through a circuit disposed inside the substrate 212, and can be electrically connected through an electrical connection point 2129 disposed on the lower surface 2144. [0027] The back surface 21 64 of the cover plate 216 further includes a non-electrode region 21 65 and an electrode region 2166 surrounding the non-electrode region 21 65. The non-electrode region 2165 and the image sensing disposed under the cover plate 216 Sensing area of wafer '214 2145 096110286 Form number Α 0101 Page 10 / Total 30 pages 1003111032-0 1343740
1DD年03月31日核正替换"S 相對正’非電極區2165之面積等於或者大於所述感測區 2145之面積,蓋板216之電極區2166上設置有多個電極 2167 ’所述每一電極2167之一端均由蓋板216壓合於所 述基體212之凸框2126之頂部之導電片21 28上與其電性 連接。 [0028] 所述載體230爲一薄形連接層,可起到電性連接及結構性 連接之作用,如異方性導電膜或異方性導電膏等連接材 料’該載體230設置於上述蓋板216背面2164之電極區 2166 上。 [0029] 所述被動元件240設置於上述載體230上,由所述载體 2 3 0結構性及電性連接於蓋板21 &之電極區21 6 6。 [0030] 本實施例中’採用於影像感測器封裝21〇之蓋板216上設 置導電電極2167,將被動元件240通過載體230結構性及 電性連接於該蓋板216上,再將該蓋板216壓合於基體 212之凸框2126上,並將導電電極2〗67分別壓合於凸框 21 26頂部之導電片2128上,並經由設置於基體2丨2内部 之電路與電性連接點2129電連接。將被動元件240設置於 影像感測器封裝210中蓋板6與影像感測晶片21 4之非 感測區2146之間所形成之空間内,從而提高該影像感測 器封裝21 0及應用該影像感測器封裝2〗〇之影像攝取裝置 200之空間利用率,達到影像攝取裝置2〇〇及影像感測器 封裝21 0小型化之目的。 [0031]請參閱圖4本發明影像攝取裝置之第三較佳實施例,該影 像攝取裝置300與影像攝取裝置2〇〇相似,其包括影像感 096110286 表單編珑A0101 第】1頁/共30頁 10031U032-0 1343740 [0032] [0033] [0034] [0035] 096110286 100年03月31日梭頁1 測器封裝310、載體330、被動元件340及鏡頭模組360。 所述影像感測器封裝310包括一基體312、一影像感測晶 片314及一蓋板316。該基體312包括第一表面3122及第 二表面31 24,其第一表面3122上還形成有一凸框3126, 該凸框3126及所述第一表面3122圍成一容腔3127,所述 影像感測晶片314設置於該容腔3127内。所述基體312之 凸框3126之頂部還設置有多個導電片3128,該導電片 3128通過設置於基體312内部之電路與設置於基體312下 表面3124上之電性連接點31⑼相電連接。 影像感測晶片314爲一光 號’該影像感測晶片314有 3144,其上表面3142包括On March 31, 1DD, the positive replacement "S is relatively positive; the area of the non-electrode region 2165 is equal to or larger than the area of the sensing region 2145, and the electrode region 2166 of the cover plate 216 is provided with a plurality of electrodes 2167'. One end of each of the electrodes 2167 is electrically connected to the conductive sheet 21 28 of the top of the convex frame 2126 of the base 212 by a cover plate 216. [0028] The carrier 230 is a thin connecting layer, which can function as an electrical connection and a structural connection, such as an anisotropic conductive film or an anisotropic conductive paste. The carrier 230 is disposed on the cover. The electrode region 2166 of the back surface 2164 of the plate 216 is on. [0029] The passive component 240 is disposed on the carrier 230, and is electrically and electrically connected to the electrode region 21 6 of the cover 21 & [0030] In the embodiment, the conductive electrode 2167 is disposed on the cover 216 of the image sensor package 21, and the passive component 240 is structurally and electrically connected to the cover 216 through the carrier 230, and then The cover plate 216 is pressed against the convex frame 2126 of the base 212, and the conductive electrodes 2 67 are respectively pressed onto the conductive piece 2128 at the top of the convex frame 21 26, and the circuit and the electrical property disposed inside the base 2 2 are electrically connected. The connection point 2129 is electrically connected. The passive component 240 is disposed in a space formed between the cover 6 of the image sensor package 210 and the non-sensing area 2146 of the image sensing chip 214, thereby improving the image sensor package 210 and applying the same. The space utilization rate of the image capturing device 200 of the image sensor package 2 is achieved for the purpose of miniaturization of the image capturing device 2 and the image sensor package. [0031] Please refer to FIG. 4, which is a third preferred embodiment of the image capturing device of the present invention. The image capturing device 300 is similar to the image capturing device 2A, and includes an image sense 096110286 Form Compilation A0101 Page 1 of 30 Page 10031U032-0 1343740 [0033] [0035] 096110286 On March 31, 100, the shuttle module 310, the carrier 330, the passive component 340, and the lens module 360. The image sensor package 310 includes a substrate 312, an image sensing wafer 314, and a cover 316. The base 312 includes a first surface 3122 and a second surface 314. The first surface 3122 further defines a convex frame 3126. The convex frame 3126 and the first surface 3122 define a cavity 3127. The test wafer 314 is disposed in the cavity 3127. A plurality of conductive sheets 3128 are disposed on the top of the convex frame 3126 of the base 312. The conductive sheets 3128 are electrically connected to the electrical connection points 31 (9) provided on the lower surface 3124 of the base 312 through a circuit disposed inside the base 312. The image sensing wafer 314 is a light number. The image sensing wafer 314 has 3144, and the upper surface 3142 includes
养轉化爲電訊 下表面 繞該感測區 314 5之非感測區31 4 6,該影像感測晶片.3.14通過其下表 面3144固設於基體312上並與該基體3Ϊ2電性連接。蓋板 316包括正面31Μ及背面31从,_、蓋板澡過其背面3164 -· . · - .. ·、 之邊緣部分設置於基體312.·乏凸框3126上,用於將影像感 測晶片314與外部環境隔離,從提高影像感測晶片3 j 4之 可靠性。 所述鏡頭模組360包括一鏡筒362、一鏡座364及一枯接 材料366,所述鏡筒362内設置有至少·一組鏡片3624,該 鏡筒362之一端容置於鏡座364之一端,該鏡座364未設 置鏡筒362之一端通過粘接材料366與影像感測器封褒 310連接成一體。 該影像攝取裝置300與影像攝取裝置2〇〇之區別在於: 表單編號Α0101 第12頁/共30頁 1003111032-0The image-sensing wafer 3.14 is fixed on the substrate 312 and electrically connected to the substrate 3Ϊ2 through the lower surface 3144 of the sensing region 314 5 . The cover plate 316 includes a front surface 31 and a rear surface 31, and a cover portion is provided on the back surface of the base 312. The wafer 314 is isolated from the external environment to improve the reliability of the image sensing wafer 3j4. The lens module 360 includes a lens barrel 362, a lens holder 364 and a dry material 366. The lens barrel 362 is provided with at least one set of lenses 3624. One end of the lens barrel 362 is placed on the lens holder 364. At one end, the lens holder 364 is not provided with one end of the lens barrel 362 and is integrally connected to the image sensor package 310 by an adhesive material 366. The difference between the image capturing device 300 and the image capturing device 2 is: Form No. Α0101 Page 12 of 30 1003111032-0
1343740 100年03月31日梭正替換頁 [0036]1343740 On March 31, 100, the shuttle replacement page [0036]
所述蓋板316之正面3162還包括有一非電極區3165及環 繞該非電極區31 65之電極區3166,所述非電極區3165與 設置於該蓋板31 6下方之影像感測晶片314之感測區3145 相對正,非電極區3165之面積等於或者大於所述感測區 3145之面積’蓋板316之電極區3166上設置有多個導電 電極3167 ’所述每一導電電極3167之一端設置於所述電 極區3166内’其另一端沿蓋板316之端側經兩次彎折後固 設於蓋透明板31 6之背面3164之邊緣,所述導電電極 3167均由蓋板316壓合於所述基體312之凸框3126頂部之 導電片3128上並與其電性連接。 [0037]所述載體330爲一薄形連接層,可起到電性連接及結構性 連接之作用,如異方性導電膜或異方性導電膏等連接材 料’該載體330設置於上述蓋板316正面3162之電極區 3166 上。 [0038] 所述被動元件340設置於上述載體330上,由所述載體 330結構性及電性連接於蓋板316之電極區域内。 [0039] 本實施中採用將被動元件340設置於影像感測器封裝310 之透明蓋316上之電極區3166内,該電極區3166對應與 影像感測器封裝310中影像感測晶片314之非影像感測區 3146 ’從而無需再於電路板32〇上爲被動元件34〇預留空 間’從而節省空間,達到減小影像感測器封裝31〇及應用 該影像感測器封裝310之影像攝取裝置300之體積之目的 [0040]請參閱圖5,本發明影像攝取裝置之第四較佳實施例,該 096110286 表單編號A0101 第13頁/共30頁 1003111032-0 1343740 100年03月31日接正替换頁' 影像攝取裝置400與影像攝取裝置300相似,其包括影像 感測器封裝410、載體430、被動元件440及鏡頭模組460 〇 [0041] 所述影像感測器封裝410包括一基體412、一影像感測晶 片414及一蓋板416。該基體412包括第一表面4122及第 二表面4124,其第一表面4122上還形成有一凸框4126, 該凸框4126及所述第一表面4122圍成一容腔4127,所述 影像感測晶片414設置於該容腔4127内。 [0042] 影像感測晶片414爲一光敏志件,可將光訊號轉化爲電訊The front surface 3162 of the cover plate 316 further includes a non-electrode region 3165 and an electrode region 3166 surrounding the non-electrode region 31 65. The non-electrode region 3165 and the image sensing chip 314 disposed under the cover plate 316 are sensed. The measurement area 3145 is relatively positive, and the area of the non-electrode area 3165 is equal to or larger than the area of the sensing area 3145. The electrode area 3166 of the cover 316 is provided with a plurality of conductive electrodes 3167. One end of each of the conductive electrodes 3167 is disposed. In the electrode region 3166, the other end of the cover plate 316 is bent twice and then fixed on the edge of the back surface 3164 of the cover transparent plate 316. The conductive electrodes 3167 are respectively pressed by the cover plate 316. The conductive sheet 3128 on the top of the convex frame 3126 of the base 312 is electrically connected to the conductive sheet 3128. [0037] The carrier 330 is a thin connecting layer, which can function as an electrical connection and a structural connection, such as an anisotropic conductive film or an anisotropic conductive paste. The carrier 330 is disposed on the cover. Plate 316 has an electrode region 3166 on front side 3162. [0038] The passive component 340 is disposed on the carrier 330, and is electrically and electrically connected to the electrode region of the cover 316 by the carrier 330. [0039] In the present embodiment, the passive component 340 is disposed in the electrode region 3166 of the transparent cover 316 of the image sensor package 310. The electrode region 3166 corresponds to the image sensing chip 314 in the image sensor package 310. The image sensing area 3146' eliminates the need to reserve space for the passive component 34 on the circuit board 32', thereby saving space, reducing the image sensor package 31 and applying image capture of the image sensor package 310. The purpose of the volume of the device 300 [0040] Please refer to FIG. 5, a fourth preferred embodiment of the image capturing device of the present invention, the 096110286 form number A0101 page 13 / total 30 pages 1003111032-0 1343740 100 March 31 The image capture device 400 includes a video sensor package 410, a carrier 430, a passive component 440, and a lens module 460. [0041] The image sensor package 410 includes a substrate. 412. An image sensing wafer 414 and a cover 416. The base 412 includes a first surface 4122 and a second surface 4124. The first surface 4122 further defines a convex frame 4126. The convex frame 4126 and the first surface 4122 define a cavity 4127. The image sensing is performed. The wafer 414 is disposed in the cavity 4127. [0042] The image sensing chip 414 is a photosensitive member that converts the optical signal into telecommunications.
號,該影像感測晶片414有一 4144,其上表面4142包括及$繞該感測區 4145之非感測區4146,^過其下表 面4144固設於基體412上並與該基體412電性連接。 [0043]The image sensing wafer 414 has a 4144, and the upper surface 4142 includes and the non-sensing region 4146 around the sensing region 4145. The lower surface 4144 is fixed on the substrate 412 and electrically connected to the substrate 412. connection. [0043]
一下表面 蓋板416包括正面4162及背面4164 ’該蓋板之正面4162 還包括有一非電極區4165友瓖幾讓極區41 6 5之電極 區4166 ’所述非電極區4165與歲置於該蓋板416下方之 影像感測晶片414之感測區4145_相對正,非電極區4165 之面積等於或者大於所述感測區4145之面積,蓋板416之 電極區4166内設置有多個導電電極4167,該蓋板通過其 背面4164之邊緣部分設置於基體412之凸框4126上,用 於將影像感測晶片414與外部環境隔離,從提高影像感測 晶片414之可靠性。 所述載體430爲一薄形連接層,可起到電性連接及結構性 連接之作用,如異方性導電膜或異方性導電膏等連接材 096110286 表單編號A0101 第14頁/共30頁 1003111032-0 [0044] 1343740 100年D3月31日梭IE替换頁 料,該載體430設置於上述蓋板416之正面4162之電極區 41 6 6 上。 [0045] 所述被動元件440設置於上述載體430上,由所述載體 430結構性及電性連接於蓋板416之電極區域内。 [0046] 所述鏡頭模組460包括一鏡筒462及鏡座464,所述鏡筒 462内設置有至少一組鏡片,該鏡筒462之一端容置於鏡 座4 6 4之一端。 [0047] 該影像攝取裝置400與影像攝取裝置300之區別在於: [0048] 該影像攝取裝置400還包括一電路板420及多條導線450 ,該電路板420上設置圖形化線路,用以進行電氣傳輸。 所述影像感測器封裝410通過其基體412之第二表面4124 結構性及電性連接於所述電路板420之上,所述鏡頭模組 4β〇未設置鏡筒462之一端連接於所述電路板420上並將 所述影像感測器封裝41 0收容於器内部。 [0049] 所述多條導線450之一端連接於所述蓋板41 6之電極4167 • 上,另一端連接於所述電路板之圖像形化線路上,用於 將設置於蓋板41 6上之被動元件440電連接至所述電路板 420上g可以理解,亦可於載體430中設置一些電極,並 通過導線450電性連接於所述電路板420之上,從而將被 動元件440電連接至電路板420上。 [0050] 本實施中影像攝取裝置400與影像攝取裝置300相似,採 用將被動元件440設置於影像感測器封裝4】0之蓋板41 6 上之電極區4166内,該電極區4166對應與影像感測器討 裝410中影像感測晶片414之非影像感測區4146,從而無 096110286 表單編洗Α0101 第15頁/共30頁 1003111032-0 1343740 100年03月31日修正替换頁 需再在電路板420上爲被動元件440預留空間,從而節省 空間,達到減小影像感測器封裝41 0及應用該影像感測器 封裝410之影像攝取裝置400體積之目的。 [0051] 請參閱圖6,本發明影像攝取裝置之第五較佳實施例,該 影像攝取裝置500包括電路板510、影像感測晶片520、 載體530、被動元件540、導線550、鏡座560及鏡筒570The lower surface cover 416 includes a front surface 4162 and a rear surface 4164. The front surface 4162 of the cover further includes a non-electrode region 4165. The electrode region 4166 of the electrode region 41 6 5 is disposed. The sensing area 4145_ of the image sensing wafer 414 under the cover 416 is relatively positive, the area of the non-electrode area 4165 is equal to or larger than the area of the sensing area 4145, and a plurality of conductive areas are disposed in the electrode area 4166 of the cover 416. The electrode 4167 is disposed on the convex frame 4126 of the base 412 through the edge portion of the back surface 4164 for isolating the image sensing wafer 414 from the external environment, thereby improving the reliability of the image sensing wafer 414. The carrier 430 is a thin connecting layer, which can function as an electrical connection and a structural connection, such as an anisotropic conductive film or an anisotropic conductive paste, etc. 096110286 Form No. A0101 Page 14 of 30 1003111032-0 [3434] 1343740 100 DJ 31st, the shuttle IE replaces the sheet material, and the carrier 430 is disposed on the electrode region 41 6 6 of the front surface 4162 of the cover plate 416. [0045] The passive component 440 is disposed on the carrier 430, and is electrically and electrically connected to the electrode region of the cover 416 by the carrier 430. [0046] The lens module 460 includes a lens barrel 462 and a lens holder 464. The lens barrel 462 is provided with at least one set of lenses, and one end of the lens barrel 462 is disposed at one end of the mirror holder 436. The difference between the image capturing device 400 and the image capturing device 300 is as follows: [0048] The image capturing device 400 further includes a circuit board 420 and a plurality of wires 450, and the circuit board 420 is provided with a patterned circuit for performing Electrical transmission. The image sensor package 410 is structurally and electrically connected to the circuit board 420 via a second surface 4124 of the base 412. The lens module 4β is not provided with one end of the lens barrel 462 connected to the The circuit board 420 is mounted on the inside of the device. [0049] One end of the plurality of wires 450 is connected to the electrode 4167 of the cover plate 416, and the other end is connected to the image forming circuit of the circuit board for being disposed on the cover plate 41 6 The upper passive component 440 is electrically connected to the circuit board 420. It can be understood that some electrodes may be disposed in the carrier 430 and electrically connected to the circuit board 420 through the wires 450, thereby electrically connecting the passive component 440. Connected to the circuit board 420. [0050] In the present embodiment, the image capturing device 400 is similar to the image capturing device 300, and the passive component 440 is disposed in the electrode region 4166 of the cover 41 6 of the image sensor package 4*0, and the electrode region 4166 corresponds to The image sensor is used to view the non-image sensing area 4146 of the image sensing chip 414 in 410, so that no 096110286 form is prepared, 101 0101, page 15 / total 30 pages 1003111032-0 1343740, and the replacement page needs to be revised on March 31, 100. Space is reserved for the passive component 440 on the circuit board 420, thereby saving space, and the purpose of reducing the volume of the image sensor package 41 0 and the image capturing device 400 of the image sensor package 410 is achieved. Referring to FIG. 6, a fifth preferred embodiment of the image capture device of the present invention includes a circuit board 510, an image sensing chip 520, a carrier 530, a passive component 540, a wire 550, and a mirror mount 560. And lens barrel 570
[0052] 電路板510用於承載影像感測晶片520及鏡座560,其上 設置有圖案化線路,用於傳輸影像感測晶片520之感測訊The circuit board 510 is configured to carry the image sensing chip 520 and the lens holder 560, and is provided with a patterned circuit for transmitting the sensing signal of the image sensing chip 520.
號。 [0053] 影像感測晶片520爲一光敏 轉化爲電訊 號,該影像感測晶片520有下表面524 ,其上表面5 2 2包括一感測區5 2 5及環霉:該感測區5 2 5之 非感測區526,於所述非感測區526上設置有多個晶片焊 ι } 墊527。該影像感測晶片5扣邊4:其Τ'表面固設於電路板 51 0 上》 [0054] 載體530爲一薄形連接層,主要爲被動元件提供電性及結 構性連接。主要由樹脂粘著劑、導電離子組成及電極532 異方性導電薄膜,即該導電膜於一方向可電氣導通,而 於其他方向絕緣。所述導電粒子填充於樹脂粘著劑中, 電極532填充有導電粒子之樹脂中,其中樹脂粘著劑部分 可用以提供防濕氣、接著、耐熱、絕緣以及固定被動元 件540與該載體530内之電極532置,並提供一定之壓迫 力以維持電極532粒子間之接觸面積。導電粒子用於將被 1003111032-0 0961 10286 表單編號Α0101 第16頁/共30頁 1343740 • ·· 100年〇3月31日修正“百| 連接件之電極與設置於載體530内之電極532電連接,載體 530設置於影像感測晶片520上表面522之非感測區526上 〇 [0055] 被動元件540係用以改善影像感測訊號傳輸品質之元件, 其可以係電感元件 '電容元件或者電阻元件,其設置於 載體530上,該被動元件540上還設置有多個電極(圖未標 ),所述被動元件540之電極與載體530内之電極530通過 設置於載體5 30之導電粒子相電連接。 φ [0056] 導線550用於將影像感測晶片520及被動元件540分別電 連接至電路板510上,其中部分導線550之一端連接於影 像感測晶片520之晶片焊墊527上,另一端連接於電路板, 51 0之圖案化線路上,用以將影像感測晶片5 2 0電連接至 電路板510上;另一部分導線550之一端連接於載體530 之電極上,另一端連接於電路板510之導電線路上,用以 將被動元件540電連接至電路板510上。 [0057] • 鏡座560爲一階梯狀中空枉體,其包括第一容置部562及 位於其下方且與其相連通之第二容置部564,所述第二容 置部564之内徑大於第一容置部562之内徑。所述第二容 置部564包括一惻壁566,該鏡座560通過第二容置部564 之側壁566固設於電路板510之上,並將影像感測晶片 520及設置於影像感測晶片520上之被動元件收容與其第 二容置部564内。 [0058] 所述鏡筒570爲一中孔柱體,該鏡筒570内依次設置有濾 光片572及透鏡574,該鏡筒570之一端收容於鏡座560之 096110286 表單煸珑A0101 第17頁/共30頁 1003111032-0 1343740 100年03月31日梭正替换英 第一容置部562内。光線可通過濾光片572及透鏡574射 入並照射於設置於影像感測晶片5 2 0之感測區5 2 5上。 [0059] 本實施例中,將被動元件540通過載體530設置於影像感 測晶片520之非感測區526上,將影像感測晶片520之感 測區525與晶片焊墊527之間間置之空間充分利用,無需 再爲被動元件540安裝額外預留空間,從而節省空間,實 現該影像攝取裝置小型化之目的。 [0060]number. The image sensing wafer 520 is converted into a photoelectric signal. The image sensing wafer 520 has a lower surface 524, and the upper surface 52 2 includes a sensing region 520 and a ring mold: the sensing region 5 A non-sensing area 526 of 25 is disposed on the non-sensing area 526 with a plurality of wafer solder pads 527. The image sensing wafer 5 is crimped 4: its surface is fixed on the circuit board 51 0. [0054] The carrier 530 is a thin connecting layer, which mainly provides electrical and structural connections for passive components. It is mainly composed of a resin adhesive, a conductive ion, and an electrode 532 anisotropic conductive film, that is, the conductive film can be electrically conducted in one direction and insulated in other directions. The conductive particles are filled in a resin adhesive, and the electrode 532 is filled with a resin of conductive particles, wherein the resin adhesive portion can be used to provide moisture-proof, heat-resistant, insulating, and fixed passive components 540 and the carrier 530. The electrode 532 is placed and provides a certain pressing force to maintain the contact area between the particles of the electrode 532. Conductive particles are used to be numbered 1003111032-0 0961 10286 Form number Α0101 Page 16 / Total 30 pages 1343740 • ·· 100 years 〇 March 31 revision "100 | The electrode of the connector and the electrode 532 set in the carrier 530 The carrier 530 is disposed on the non-sensing area 526 of the upper surface 522 of the image sensing chip 520. [0055] The passive component 540 is used to improve the quality of the image sensing signal transmission, and may be an inductive component or a capacitive component. The resistor element is disposed on the carrier 530. The passive component 540 is further provided with a plurality of electrodes (not labeled). The electrode of the passive component 540 and the electrode 530 of the carrier 530 pass through the conductive particles disposed on the carrier 530. The electrical connection φ [0056] The wire 550 is used to electrically connect the image sensing chip 520 and the passive component 540 to the circuit board 510, wherein one end of the partial wire 550 is connected to the die pad 527 of the image sensing die 520. The other end is connected to the circuit board, on the patterned circuit of 51, to electrically connect the image sensing wafer 50 to the circuit board 510; the other end of the wire 550 is connected to the electrode of the carrier 530. One end is connected to the conductive line of the circuit board 510 for electrically connecting the passive component 540 to the circuit board 510. [0057] The mirror mount 560 is a stepped hollow body including a first receiving portion 562 and located The second accommodating portion 564 is disposed below the second accommodating portion 564, and the inner diameter of the second accommodating portion 564 is larger than the inner diameter of the first accommodating portion 562. The second accommodating portion 564 includes a dam wall 566. The lens holder 560 is fixed on the circuit board 510 through the sidewall 566 of the second receiving portion 564 , and the image sensing chip 520 and the passive component disposed on the image sensing chip 520 are received by the second receiving portion 564 . [0058] The lens barrel 570 is a middle-hole cylinder, and the lens barrel 570 is sequentially provided with a filter 572 and a lens 574. One end of the lens barrel 570 is received in the mirror holder 560 096110286 Form 煸珑A0101 Page 17 of 30 1003111032-0 1343740 On March 31, 100, the shuttle is replacing the first accommodating portion 562. The light can be incident through the filter 572 and the lens 574 and irradiated on the image sensing wafer. 5 2 0 sensing area 5 2 5 . [0059] In this embodiment, the passive component 540 is set by the carrier 530 The non-sensing area 526 of the image sensing chip 520 is disposed, and the space between the sensing area 525 of the image sensing chip 520 and the wafer pad 527 is fully utilized, and no additional reservation is required for the passive component 540. Space, thereby saving space, and achieving the purpose of miniaturizing the image capturing device. [0060]
綜上所述,本發明符合發明專利要件,爰依法提出專利 申請。惟,以上所述者僅為本發明之數佳實施方式,本 發明之範圍並不以上述實熟悉本案技 藝之人士,在援依本案發明,或變化 ,皆應包含於以下之申請專I 【圖式簡單說明】 [0061] 圖1係習知之一種影像感測器之剖視圖。 [0062] 圖2係本發明影像攝取裝置粢一凌雈〶施之剖視圖。 [0063] 圖3係本發明影像攝取裝置第二較佳實施例之剖視圖。 [0064] 圖4係本發明影像攝取裝置第三較佳實施例之剖視圖。 [0065] 圖5係本發明影像攝取裝置第四較佳實施例之剖視圖。 [0066] 圖6係本發明影像攝取裝置第五較佳實施例之剖視圖。 【主要元件符號說明】 [0067](習知)影像感測器封裝:10 [0068]基體:1 096110286 表單編號A0101 第18頁/共30頁 1003111032-0 1343740In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a few preferred embodiments of the present invention, and the scope of the present invention is not limited to those skilled in the art, and the invention may be included in the following application. BRIEF DESCRIPTION OF THE DRAWINGS [0061] FIG. 1 is a cross-sectional view of a conventional image sensor. 2 is a cross-sectional view of the image pickup device of the present invention. 3 is a cross-sectional view showing a second preferred embodiment of the image pickup apparatus of the present invention. 4 is a cross-sectional view showing a third preferred embodiment of the image pickup apparatus of the present invention. 5 is a cross-sectional view showing a fourth preferred embodiment of the image pickup apparatus of the present invention. 6 is a cross-sectional view showing a fifth preferred embodiment of the image pickup apparatus of the present invention. [Description of Main Component Symbols] [0067] (Regular) Image Sensor Package: 10 [0068] Base: 1 096110286 Form No. A0101 Page 18 of 30 1003111032-0 1343740
100年D3月31日修正钥^頁 [0069] 支撐件:2 [0070] 影像感測晶片:3 [0071] 被動元件:4 [0072] 透明蓋板:5 [0073] 容腔:6 [0074] (本發明) [0075] 影像攝取裝置:1〇〇、200、300、400 ' 500 [0076] 影像感測器封裝:110、210、310、410 [0077] 基體:112、212、312、412 [0078] 上表面:1122、2122、3122、4122 [0079] 下表面:1124、2124、3124、4124 [0080] 電性連接塊:1123 [0081] 導電&塊:1125 [0082] 影像感測晶片:114、214、314、414 ' 520 [0083] 上表面:1142、2142、3142、4142、 522 [0084] 下表面:1144、2144、3144、4144、 524 [0085] 感測區:1145、2145、3145、4145、 525 [0086] 非感測區:1146、2146、3146、4146 ' 526 [0087] 晶片焊墊:1147、527 表單煸號Λ0101 第19頁/共30頁 096110286 1003111032-0 1343740 100年03月31日修正替换頁 [0088] [0089] [0090] [0091] [0092] [0093] [0094] [0095] [0096] [0097] [0098] [0099] [0100] [0101] [0102] [0103] [0104] [0105] [0106] 載體:116 ' 230 ' 330 ' 430 ' 530 電極:1162、532 被動元件:117、240、340、440、540 導線:118、450、550 蓋板:119、216、316、416 鏡頭:130 鏡筒:132、262、362、462、570 凸框:2126、3126、4126、 容腔:2127、3127、4127 導電片:2128、3128 電性連接點:2129、2129、3129 (蓋板)正面:2162、3162、4162 (蓋板)背面:2164、3164、4164100 years D3 month 31 revision key ^ page [0069] support: 2 [0070] image sensing chip: 3 [0071] passive component: 4 [0072] transparent cover: 5 [0073] cavity: 6 [0074 [Invention] [0075] Image capturing device: 1 〇〇, 200, 300, 400 '500 [0076] Image sensor package: 110, 210, 310, 410 [0077] Base: 112, 212, 312, 412 [0078] Upper surface: 1122, 2122, 3122, 4122 [0079] Lower surface: 1124, 2124, 3124, 4124 [0080] Electrical connection block: 1123 [0081] Conductive & block: 1125 [0082] Image sense Test wafer: 114, 214, 314, 414 '520 [0083] Upper surface: 1142, 2142, 3142, 4142, 522 [0084] Lower surface: 1144, 2144, 3144, 4144, 524 [0085] Sensing area: 1145 2145, 3145, 4145, 525 [0086] Non-sensing area: 1146, 2146, 3146, 4146 '526 [10487] Wafer pads: 1147, 527 Form number Λ 0101 Page 19 / Total 30 pages 096110286 1003111032-0 1343740 Correction replacement page on March 31, 100 [0088] [0010] [0099] [0099] [0099] [0099] 0101] [010 2] [0105] Carrier: 116 ' 230 ' 330 ' 430 ' 530 Electrode: 1162, 532 Passive components: 117, 240, 340, 440, 540 Conductor: 118, 450, 550 Cover Board: 119, 216, 316, 416 Lens: 130 Lens barrel: 132, 262, 362, 462, 570 convex frame: 2126, 3126, 4126, cavity: 2127, 3127, 4127 Conductive sheet: 2128, 3128 Electrical connection Points: 2129, 2129, 3129 (cover) front: 2162, 3162, 4162 (cover) back: 2164, 3164, 4164
鏡片:1324、2624、3格24Lens: 1324, 2624, 3 grid 24
第二容置部:1 344、564 側壁:1 346、566 粘接材料:136、266、366、Second accommodating part: 1 344, 564 Side wall: 1 346, 566 Bonding material: 136, 266, 366,
096110286 表單編號A0101 第20頁/共30頁 1003111032-0 1343740 100年03月31日梭正替换頁 [0107] 非電極區:2165、3165、4165 [0108] 電極區:2166、3166、4166 [0109] 導電電極:2167、3167、4167 [0110] 鏡頭模組:260、360、460 [0111] 電路板:420、510 [0112] 濾光片:572 [0113] 透鏡:574096110286 Form No. A0101 Page 20/Total 30 Page 1003111032-0 1343740 The shuttle is replacing the page on March 31, 100 [0107] Non-electrode area: 2165, 3165, 4165 [0108] Electrode area: 2166, 3166, 4166 [0109 Conductive electrode: 2167, 3167, 4167 [0110] Lens module: 260, 360, 460 [0111] Circuit board: 420, 510 [0112] Filter: 572 [0113] Lens: 574
096110286 表單編號A0101 第21頁/共30頁 1003111032-0096110286 Form No. A0101 Page 21 of 30 1003111032-0
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