1268128 九、發明說明： 【發明所屬之技術領域】 線路的形成方法」，其主 法，特別是針對先前技 尤其是採無钱刻阻膜以 本發明係為「印刷電路板超細 要係涉及印刷電路板線路的形成方 術無法達成的超細線路形成方法， 形成線路之方法技術者。 【先前技術】 現有印刷電路板上線路的形成方法，係於銅箱基板上 ，經過化學鍍銅、電鍍銅以及蝕刻等 ，而後，如果是 以正片之做法’則以乾膜做為_阻膜以形成線路；如果 是以負片的做法，則是以錫錯或錫做為電鑛阻膜以形成線 路。顯知，現有方法係藉有蝕刻阻膜以形成線路。 習知印刷電路板上的線路，因豪 、卷#&妨_ 口牽涉到侧蝕之技術限制 ，導致線路之形成無法過細，例如1 J如無法製作〇· lmm以下之 線路，如此將致得印刷電路板之寬度與 者，現有印刷電路板的製作過程合產 “、、’縮減。再 上 曰座生大垔廢水，不符環 保要求。 如圖- A所示，傳統㈣前，以線寬25^之負片做 法來說，非線路區銅厚11為20；^，線i 而认、丨仰上 八丄乙7予為40 // m，線 12 , uT^T 13 a#] ； ，如圖一6，線12“為4°"m’但線12寬最窄處因側餘 因素變成約48· 4/zm(以蝕刻因子 的取乍匙口惻饿 ’單邊側姓為13 3 兩邊共計26.6“），顯見1則蝕為 得、、先餘刻方式造成側蝕 1268128 相當嚴重，不利於製做超細線路。 又如圖二A所示，傳統餘刻前，以正片做法來說，銅 21厚為4Mm，以乾膜22為餘刻阻劑，寬度為？5^;經 蝕刻處理後，如圖二卜銅21厚仍為4〇//m，但銅21之頂 部寬度卻因側蝕因素變成約48 4 "m(以蝕刻因子3計單 邊側餘為13.3#m，兩邊共計26 6 /zm)，顯見，傳統姓刻 方式造成側蝕相當嚴重，不利於製做超細線路。 發明人有鑑於此’認為印刷電路板之線路形成方法應 能再謀求改進，遂特戮力研發成本案，期能藉由本案之提 出，俾突破現有技術層級。 【發明内容】 本發明「印刷電路板超細線路的形成方法」，其主要是 為了超越現有技術無法製作出超細線路之瓶頸限制，以獲 得製作出超細線路之主要目的。 本案主要是提出一種前所未有的線路形成方法，特別 是在於：係以無銅f|之基板或絕緣層為基礎，經多道線路 之形成程序後，藉微蝕刻方式以去除非線路區之導電層， 以完成超細線路；藉此，可具有下述優點： 一、 因採微蝕刻方式，不會有線路之側蝕問題，如此 ，將可製作出〇.imm以下，甚至25//m以下的印刷 電路板之超細線路。 二、 由於採微蝕刻方式製作，可不須藉由乾膜、錫鉛 或錫做為蝕刻阻膜，具無蝕刻阻臈之特點，將獲致 製作速度快，產生之廢水少等優點。 1268128 【實施方式】 茲謹就本發明「印刷電路板超細線路的形成方法 實施方法，舉一最佳實施例詳細說明如下·· /」之 本案「印刷電路板超細線路的形成方法」，如圖二，苴 線路之主要形成方法包括下述步驟·· ㈤ 其 (a )以無銅箔之基板或絕緣層為基材91 ; (b )粗化基材表面92 ··可以藉由機械或化學方法進行·1268128 IX. Description of the invention: [Technical field of invention] Method for forming a line", the main method thereof, especially for the prior art, especially the use of a moneyless etched film, the invention is "a printed circuit board superfine A method for forming an ultra-fine line that cannot be achieved by forming a circuit board circuit, and a method for forming a line. [Prior Art] A method for forming a line on a printed circuit board is formed on a copper box substrate by electroless copper plating. Electroplating of copper and etching, etc., and then, if it is a positive film, the dry film is used as a resist film to form a line; if it is a negative film, it is made of tin or tin as an electric resist film to form It is obvious that the existing method utilizes an etch resist film to form a line. Conventional wiring on a printed circuit board, due to the technical limitations of the side eclipse, causes the formation of the line to be too thin. For example, if 1 J can't make a line below 〇·1mm, the width of the printed circuit board will be the same, and the production process of the existing printed circuit board will be reduced. The wastewater from the cockroach is also inconsistent with environmental protection requirements. As shown in Figure-A, before the traditional (four), in terms of the negative film width of 25^, the non-line area copper thickness 11 is 20; ^, line i and recognize, 丨 上 丄 丄 丄 予 7 to 40 * m, line 12, uT^T 13 a#] ; , as shown in Fig. 6, line 12 "is 4 ° " m' but the narrowest part of the line 12 width becomes about 48·4/zm due to the lateral factor (with an etch factor) The key point of the hungry is that the unilateral side surname is 13 3 and the total number of sides is 26.6"). It is obvious that the first eclipse is obtained, and the first etching method causes the side eclipse 1268128 to be quite serious, which is not conducive to making ultra-fine lines. As shown in Figure 2A, before the traditional remnant, in terms of positive film, the copper 21 is 4Mm thick, and the dry film 22 is the residual resist, and the width is? 5^; After etching, the thickness of copper 21 is still 4〇//m, but the top width of copper 21 is about 48 4 "m due to the side etching factor (single side with etch factor 3) The remainder is 13.3#m, and the total number is 26 6 /zm on both sides. It is obvious that the traditional surname engraving method causes the side erosion to be quite serious, which is not conducive to making ultra-fine lines. In view of this, the inventor believes that the circuit formation method of the printed circuit board should be able to further improve, and the special research and development cost case can be made by the present case and break through the existing technology level. SUMMARY OF THE INVENTION The present invention "method for forming a super-fine circuit of a printed circuit board" is mainly for the purpose of making it possible to produce an ultra-fine line by overcoming the bottleneck limitation of the ultra-fine line beyond the prior art. In this case, an unprecedented method for forming a line is proposed, in particular, based on a substrate or an insulating layer without copper f|, after a multi-channel forming process, a micro-etching method is used to remove the conductive layer in the non-line region. In order to complete the ultra-fine line; thereby, it can have the following advantages: 1. Due to the micro-etching method, there is no problem of side etching of the line, so that it can be made below im.imm, even below 25//m. Ultra-fine lines for printed circuit boards. Second, due to the micro-etching method, it is not necessary to use dry film, tin-lead or tin as the etching resist film, and it has the characteristics of no etching resistance, which will result in high production speed and less waste water. 1268128 [Embodiment] In the present invention, a method for forming a method for forming an ultra-fine circuit of a printed circuit board will be described in detail below with reference to a preferred embodiment of the method for forming a printed circuit board ultra-fine line. As shown in Fig. 2, the main forming method of the tantalum line includes the following steps: (5) (a) using a copper foil-free substrate or insulating layer as the substrate 91; (b) roughening the substrate surface 92 ··by mechanical Or chemical methods
(c )形成導電層93 :可以藉由化學沉積、黑化或導電聚 合物等方式沉積出導電層； A (d )於導電層上形成感光膜94 ••其可採塗佈或壓製等方 法； (e )去除線路上的感光膜95 :採負片作法，以底片、光 罩曝光及顯影等方法，將線路上的感光膜除去； (f )電鍍銅96:在已除去感光膜之線路上，鍍上所需厚 度的銅； (g )除去剩餘的感光膜後，以微蝕刻方式去除在非線路 區域之導電層，藉以形成線路9 7。 再請參閱圖四A，本案實施時以線寬25 # m來說，非線 路區銅31厚約〇· 3 // m，線路32厚度約12 // m，寬度約 25 // m，經以本發明之方法微蝕後，如圖四B，線路32厚 度約為11 · 7 // m，寬度約為24· 4 // m，足證，無習知側蝕嚴 重之缺失’因此可適合於製做超細線路。 前述本發明之微蝕刻，並非使用維子束或電漿加工方 1268128 丨；本案利㈣錢納或過硫 故具有成本低之優點，如此， 式，原因是該等方式成本過高； 酸銨或硫酸雙氧水為微蝕液，故 可用以去除非線路區之導電層。 印刷電路板超細線路的形成方(c) forming a conductive layer 93: a conductive layer may be deposited by chemical deposition, blackening or a conductive polymer; A (d) forming a photosensitive film 94 on the conductive layer • • coating or pressing thereof (e) Removing the photosensitive film 95 on the line: taking the negative film method, removing the photosensitive film on the line by the method of filming, mask exposure and development; (f) Electroplating copper 96: on the line from which the photosensitive film has been removed And plating a copper of a desired thickness; (g) after removing the remaining photosensitive film, the conductive layer in the non-line region is removed by micro-etching, thereby forming a line 97. Referring to Figure 4A, in the implementation of this case, the line width 25 # m, the non-line area copper 31 is about 〇 · 3 // m, the line 32 is about 12 // m thick, and the width is about 25 // m. After micro-etching by the method of the present invention, as shown in Fig. 4B, the thickness of the line 32 is about 11 · 7 // m, and the width is about 24 · 4 // m, which proves that there is no serious lack of conventional side etching. Suitable for making ultra-fine lines. The microetching of the present invention does not use the dimension beam or the plasma processing method 1268128 丨; the advantage of the case is that the cost is low, so the cost is too high; the ammonium acid or Sulfuric acid hydrogen peroxide is a micro-etching solution, so it can be used to remove the conductive layer in the non-line region. The formation of ultra-fine lines of printed circuit boards
’ 4專利，懇請鈞局詳查，並早日賜准，以勳創新。 綜上所述，本發明「印刷 法」’其提供一種印刷雷玖如 【圖式簡單說明】 圖 A:習知負片做法蝕刻前之示意圖。 圖一B:習知負片做法蝕刻後之示意圖。 圖二A··習知正片做法蝕刻前之示意圖。 圖二B:習知正片做法蝕刻後之示意圖。 圖二：本發明線路形成之步驟圖。 圖四A:本發明微蝕刻前之示意圖。 圖四B :本發明微蝕刻後之示意圖。 【主要元件符號說明】 非線路區銅厚 〜一錫或錫船 8 1268128 22-----乾膜 31 -----非線路區銅 32 -----線路 91 -----以無銅箔之基板或絕緣層為基材 92 -----粗化基材表面 93 -----形成導電層 94 -----於導電層上形成感光膜 95 -----去除線路上的感光膜 96 -----電鍍銅 97 -----以微蝕刻方式去除在非線路區域之導電層藉以形 成線路‘4 patents, please ask the bureau to investigate in detail, and give them as soon as possible to innovate. In summary, the "printing method" of the present invention provides a printing thunder. [Simplified description of the drawing] Fig. A: A schematic view of a conventional negative film before etching. Figure 1B: Schematic diagram of the conventional negative film after etching. Figure 2A.·The schematic diagram of the conventional film before etching. Figure 2B: Schematic diagram of the conventional positive film after etching. Figure 2: Step diagram of the formation of the circuit of the present invention. Figure 4A: Schematic diagram of the microetching of the present invention. Figure 4B is a schematic view of the microetch after the present invention. [Main component symbol description] Non-line area copper thickness ~ one tin or tin boat 8 1268128 22-----dry film 31 ----- non-line area copper 32 ----- line 91 ----- Using a copper-free foil substrate or insulating layer as the substrate 92 ----- roughening the substrate surface 93 ---- forming a conductive layer 94 ---- forming a photosensitive film 95 on the conductive layer ---- -Removing the photosensitive film 96 on the line -----Electroplating copper 97 ----- Micro-etching to remove the conductive layer in the non-line area to form a line