CN103898498A - Blackening liquid medicine and manufacturing method of transparent printed circuit board - Google Patents
Blackening liquid medicine and manufacturing method of transparent printed circuit board Download PDFInfo
- Publication number
- CN103898498A CN103898498A CN201210582410.2A CN201210582410A CN103898498A CN 103898498 A CN103898498 A CN 103898498A CN 201210582410 A CN201210582410 A CN 201210582410A CN 103898498 A CN103898498 A CN 103898498A
- Authority
- CN
- China
- Prior art keywords
- layer
- transparent
- circuit board
- printed circuit
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention discloses a blackening liquid medicine. The blackening liquid medicine is prepared from the following materials in percentage by weight: 3%-5% of sodium hydroxide, 10%-15% of sodium hypophosphite, 2%-4% of benzotriazole and 70%-75% of water. A manufacturing method of a transparent printed circuit board comprises the following steps: providing a copper-coated substrate, wherein the copper-coated substrate comprises a transparent insulated substrate layer and a copper foil layer with one blackened surface; the first blackening layer is arranged on the surface of the substrate layer; manufacturing the copper foil layer to form a conductive circuit graphic and forming a circuit substrate; performing blackening treatment on the non-blackened surface and side surfaces of the conductive circuit graphic in the blackening liquid medicine so as to form black second blackening layers on the non-blackened surface and side surfaces of the copper foil layer of the conductive circuit graphic; forming transparent covering films on the surface of the second blackening layers and the surface, which is exposed out of the substrate layer, of the conductive circuit graphic so as to form the transparent printed circuit board.
Description
Technical field
The present invention relates to circuit board making technology, relate in particular to the making method of a kind of melanism liquid medicine and transparent printed circuit board (PCB).
Background technology
Printed circuit board (PCB) is widely used because having packaging density advantages of higher.Refer to document Takahashi about the application of circuit card, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992,15 (4): 1418-1425.
Because electronic product is to individualized development, also more and more diversified for the requirement of printed circuit board (PCB) that is applied to electronic product.There is at present a kind of transparent printed circuit board (PCB); it is transparent material for carrying and protecting insulated substrate, the welding resisting layer etc. of conductive circuit pattern; circuit in its conductive circuit pattern is generally slender type; and the material of its conductive circuit pattern is the copper through two-sided Darkening process, the black of the transparent and conductive circuit pattern of insulating material makes described printed circuit board (PCB) visually have transparent feel.The making method of described printed circuit board (PCB) is generally as follows: first, provide a copper-clad base plate, and the copper foil layer that it comprises a transparent insulation stratum basale and is arranged at described stratum basale surface, described copper foil layer is because being black through two-sided Darkening process; Secondly, at described copper foil layer surface label dry film, and through overexposure, development, etching and stripping technique, form conductive circuit pattern on described stratum basale surface; Finally the surperficial pressing transparent mulch film of stratum basale surperficial in described conductive circuit pattern and that expose from described conductive circuit pattern, forms transparent printed circuit board (PCB).
Wherein, tradition Darkening process liquid medicine used is generally the melanism liquid medicine containing hypochlorite, after Darkening process, form the zone of oxidation containing cupric oxide and Red copper oxide of a black on copper foil layer surface, this zone of oxidation is blackening layer, the blackening layer of traditional melanism liquid medicine is fine hair shape (referring to Fig. 1), villous blackening layer easily comes off and pollutes circuit region around, affects the transparency of wiring board.And, because Darkening process is that only process on the surface to copper foil layer, therefore, after etching step, in copper foil layer, the side adjacent with etched removal region can appear because exposing the internal layer of copper foil layer the reddish-brown of fine copper, thereby the final printed circuit board (PCB) forming can be poor due to the reddish-brown transparent feel of described conductive circuit pattern side.
Summary of the invention
In view of this, be necessary to provide the making method of a kind of melanism liquid medicine and transparent printed circuit board (PCB), to improve the transparent feel of transparent printed circuit board (PCB).
A kind of melanism liquid medicine, it comprises the water that sodium hydroxide that quality percentage composition is 3%-5%, sodium hypophosphite that quality percentage composition is 10%-15%, sodium-chlor that quality percentage composition is 10%-15%, benzotriazole that quality percentage composition is 2%-4% and quality percentage composition are 70%-75%.
A kind of making method of transparent printed circuit board (PCB), comprise step: provide copper-clad base plate, described copper-clad base plate comprises transparent dielectric base layer and is arranged at the copper foil layer of the one side melanism on described dielectric base layer surface, described copper foil layer comprises copper body layer and the first blackening layer, described copper body layer comprises the 3rd surface, four surface relative to the 3rd surface and connects the side on the 3rd surface and the 4th surface, described the first blackening layer is formed at described the 3rd surface, and described the first blackening layer is between copper body layer and described stratum basale.Described copper foil layer is made and formed conductive circuit pattern, the described stratum basale of part is exposed from described conductive circuit pattern, thereby described copper-clad base plate is made to circuit substrate.Form the 4th surface of copper body layer of conductive circuit pattern and side and be placed in above-mentioned melanism liquid medicine and carry out Darkening process making so that described the 4th surface is upper and side on all form the second blackening layer of black.On at least part of described the second blackening layer surface and the surface of the stratum basale exposing from described conductive circuit pattern form transparent mulch film, thereby make transparent printed circuit board (PCB).
Adopt the melanism liquid medicine of this case and the 4th surface that makes the copper body layer that forms conductive circuit pattern of the transparent printed circuit board (PCB) that making method forms and side all by melanism, thereby the transparent feel of the wiring board that the reddish-brown that can prevent fine copper causes is not good, the transparent feel of transparent printed circuit board (PCB) is strengthened; In addition, the melanism liquid medicine that this case is used, compared to traditional melanism liquid medicine, can not produce villous blackening layer, thus avoided fine hair come off and fine hair pollutes other regions of wiring board, also make the transparent feel of transparent printed circuit board (PCB) better.
Brief description of the drawings
Fig. 1 is the scanning electron microscope picture that traditional melanism liquid medicine is processed the blackening layer of copper foil layer formation.
Fig. 2 is the diagrammatic cross-section of the copper-clad base plate that provides of the embodiment of the present invention.
Fig. 3 is the diagrammatic cross-section of the wiring board that forms after laminating dry film, exposure, development, etching, stripping on the copper layer surface of the copper-clad base plate of Fig. 2.
Fig. 4 is by the diagrammatic cross-section after the surface of the copper layer of the wiring board of Fig. 3 and side melanism.
Fig. 5 is by the scanning electron microscope picture after the surface of the copper layer of the wiring board in Fig. 3 and side melanism.
Fig. 6 will form transparent mulch film and from transparent mulch film, expose the diagrammatic cross-section of electric connection pad on the wiring board in Fig. 4.
Fig. 7 is the diagrammatic cross-section that forms the transparent printed circuit board (PCB) forming after surface-treated layer on the electric connection pad of the wiring board in Fig. 6.
Main element nomenclature
| Copper- |
10 |
| |
11 |
| |
12 |
| The first adhesive- |
13 |
| |
111 |
| |
112 |
| |
121 |
| The |
122 |
| The |
123 |
| The |
124 |
| |
15 |
| |
20 |
| |
125 |
| |
16 |
| The |
126 |
| |
18 |
| |
181 |
| The second adhesive- |
182 |
| |
17 |
| Through |
183 |
| Surface-treated |
19 |
| Transparent printed circuit board (PCB) | 30 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Transparent printed circuit board (PCB) the technical program being provided below in conjunction with drawings and Examples and preparation method thereof is described in further detail.
Refer to Fig. 1 to Fig. 5, the making method of the transparent printed circuit board (PCB) that the technical program embodiment provides comprises the following steps:
Step 1: refer to Fig. 2, copper-clad base plate 10 is provided, described copper-clad base plate 10 comprises dielectric base layer 11, copper foil layer 12 and the first adhesive-layer 13 between dielectric base layer 11 and copper foil layer 12.
Described dielectric base layer 11 can be transparent flexible resin material or hard resin material.Described flexible resin material can be the conventional flexible materials of flexible circuit board, as polyimide (Polyimide, PI), polyethylene terephthalate glycol (Polyethylene Terephthalate, or PEN (Polyethylene Naphthalate PET), PEN) etc., be preferably the good polyimide of thermotolerance.Described hard resin material can be transparent rigid epoxy resin etc.In the present embodiment, described dielectric base layer 11 is transparent flexible resin material.Described dielectric base layer 11 comprises first surface 111 and second surface 112.
Described copper foil layer 12 is the copper foil layer of one side melanism, the first blackening layer 122 that it comprises copper body layer 121 and is formed at copper body layer 121 1 sides, described copper body layer 121 comprises relative the 3rd surface 123 and the 4th surface 124, and described the first blackening layer 122 is formed at the 3rd surface 123 of described copper body layer 121.Described the first blackening layer 122, for wherein to carry out after Darkening process forming in a surface at a copper foil layer without Darkening process, is not formed described copper body layer 121 by the part of Darkening process.
Described the first adhesive-layer 13 is a transparent bonding sheet, and its material can be transparent epoxy resin, acrylic resin or its mixture.Certainly described the first adhesive-layer 13 can be also other transparent matrix material, is not limited with the present embodiment.Relative two surfaces of described the first adhesive-layer 13 are bonding with the first surface 111 of described dielectric base layer 11 and the first blackening layer 122 of described copper foil layer 12 respectively, for described copper foil layer 12 being bonded in to the first surface 111 of described dielectric base layer 11.Be appreciated that copper foil layer 12 also can directly be made in the first surface 111 of dielectric base layer 11, now without the first adhesive-layer 13 is set.
Step 2: refer to Fig. 3, adopt image transfer technique and etch process that described copper foil layer 12 is made and formed conductive circuit pattern 15, form circuit substrate 20.
In the present embodiment, by laminating dry film, exposure, development, etching and stripping technique, described copper foil layer 12 is made and formed conductive circuit pattern 15, specific as follows: first, microetch processing to be carried out in described copper foil layer 12 surfaces; Secondly, pressing one dry film on described copper foil layer 12; Then, the dry film on described copper foil layer 12 is carried out to selectivity exposure; Again, dry film is developed through the part of exposure, form the photopolymer layer of patterning, the part that makes copper foil layer 12 need etching to remove is not covered by dry film, and copper foil layer 12 need to form the part of circuit and still covered by dry film; Afterwards, utilize copper etchant solution to carry out etching, the copper foil layer 12 that exposes dry film to remove is copper body layer 121 and the first blackening layer 122, thereby makes the part that dry film that copper foil layer 12 is patterned covers form conductive circuit pattern 15; Finally, utilize stripping technique that the copper foil layer 12 remaining dry films in surface are divested, form circuit substrate 20.Described circuit substrate 20 comprises dielectric base layer 11, conductive circuit pattern 15 and by described stratum basale and bonding the first adhesive-layer 13 of described conductive circuit pattern 15, wherein, described conductive circuit pattern 15 comprise copper body layer 121 and be formed at the 3rd surface 123 of described copper body layer 121 and with bonding the first blackening layer 122 of described the first adhesive-layer 13.Described copper body layer 121 also comprises the side 125 between the 3rd surface 123 and the 4th surface 124, because described copper foil layer 12 has only carried out one side Darkening process, and copper foil layer 12 has passed through etch processes, come out in the side 125 of copper body layer 121, therefore, the 4th of described copper body layer 121 the surface 124 and side 125 all show the reddish-brown of fine copper.
Certainly, also can described copper foil layer 12 be made and form conductive circuit pattern 15 by wet film technique.In addition, before described copper foil layer 12 is made to formation conductive circuit pattern 15, can also comprise punching technology, to form multiple tooling hole (not shown), described tooling hole connects dielectric base layer 11 and copper foil layer 12.Described tooling hole positions wiring board for subsequent step.
Step 3: refer to Fig. 4-5, form the second blackening layer 126 in the 4th surface 124 and the side 125 of the copper body layer 121 of described conductive circuit pattern 15, make the 4th surface 124 and the side 125 of described copper body layer 121 all show black.After Darkening process, described conductive circuit pattern 15 is transformed into conductive circuit pattern 16, the first blackening layer 122 and the second blackening layer 126 that described conductive circuit pattern 16 comprises copper body layer 121 and described copper body layer 121 is coated.
In the present embodiment, on the 4th surface 124 of the copper body layer 121 of described conductive circuit pattern 15 and side 125 form the second blackening layer 126 and comprise the steps:
First, microetch processing is carried out on the 4th surface 124 to described copper body layer 121 and the surface of side 125, makes the 4th surface 124 and side 125 roughenings.Described micro-etching solution can be to comprise that concentration is that 80 to 100g/L Sodium Persulfate (SPS) and weight hundred score concentration are 2% sulfuric acid (H
2sO
4) mixing solutions.Temperature of reaction can be 30 ± 5 DEG C, and the reaction times can be 30 to 60s.
Then, circuit substrate 20 is placed in to melanism liquid medicine, carry out blackening reaction with the 4th surface 124 and side 125 described in the copper body layer 121 in conductive circuit pattern 15, thereby the 4th surface 124 and side 125 in copper body layer 121 form the second blackening layer 126, make described the 4th surface 124 and side 125 present black.Wherein, described melanism liquid medicine comprises: the mixed solution of the water that the sodium hydroxide that quality percentage composition is 3%-5%, the sodium hypophosphite that quality percentage composition is 10%-15%, sodium-chlor that quality percentage composition is 10%-15%, benzotriazole that quality percentage composition is 2%-4% and quality percentage composition are 70%-75%; Described reaction can be carried out under the situation of room temperature or heating, and the reaction times is relevant with the temperature of reaction, and temperature is low must the reaction times longer, and the reaction times can shorten temperature height; Range of reaction temperature can be 50 DEG C to 80 DEG C, and in described range of reaction temperature, the reaction times can be 5 to 20 minutes (min).In the time that temperature of reaction is 50 DEG C, the reaction times can be 20 minutes.In the time that temperature of reaction is 70 DEG C, the reaction times can be 10 minutes.In the time that temperature of reaction is 80 DEG C, the reaction times can be 5 minutes.In this melanism step, the copper body layer 121 of the 4th surface 124 and side 125 reacts with blackening reaction liquid, the second blackening layer 126 that generation main raw is cupric oxide, thus make the 4th surface 124 and side 125 present black.
Finally, thereby the residual working liquid on 20 surfaces of the circuit substrate after melanism is cleaned in washing, by dry the circuit substrate 20 of removing residual solution, obtain forming in the 4th surperficial 124 and side 125 of copper body layer 121 circuit substrate 20 of the second blackening layer 126 afterwards.
Comparison diagram 1 and Fig. 5 can obviously find out: the blackening layer of traditional melanism liquid medicine is fine hair shape, thereby villous blackening layer easily comes off and pollutes circuit region around, affects the transparency of wiring board; And the blackening layer that the melanism liquid medicine of this case forms is finer and close, and there is no the generation of villous blackening layer, thereby can prevent villus shedding and pollute circuit region around, thereby the transparency of the wiring board forming is better.
Step 4: refer to Fig. 6, first adhesive-layer 13 surfaces of exposing in the surface element subregion of described conductive circuit pattern 16 and from described conductive circuit pattern 16 form transparent mulch film 18, make the position not covered by transparent mulch film 18 in described conductive circuit pattern 16 form electric connection pad 17.
In the present embodiment, described transparent mulch film 18 comprises the rete 181 and the second adhesive-layer 182 that fit, the material of described rete 181 can be transparent PET, PEN or PI, and described the second adhesive-layer 182 is transparent epoxy resin, acrylic resin or its mixture.Certainly described the second adhesive-layer 182 can be also other transparent matrix material, is not limited with the present embodiment.
Described transparent mulch film 18 can be formed at by the method for pressing conductive circuit pattern 16 surfaces of described wiring board, wherein, described the second adhesive-layer 182 is directly affixed with the surface element subregion of described conductive circuit pattern 16 and the first adhesive-layer 13 exposing from described conductive circuit pattern 16.The generation type of described electric connection pad 17 can be: before transparent mulch film described in pressing 18, utilize the method for stamp etc. to form at transparent mulch film 18 through hole 183 that runs through transparent mulch film 18, or after transparent mulch film described in pressing 18, utilize the method for laser ablation to form at transparent mulch film 18 opening that runs through transparent mulch film 18, partially conductive line pattern 16 is exposed from described through hole 183, thereby form electric connection pad 17.In the present embodiment, the quantity of electric connection pad 17 is one, and certainly, the quantity of electric connection pad 17 can be also multiple.
Step 5: refer to Fig. 7, form the surface-treated layer 19 of conduction on described electric connection pad 17, form transparent printed circuit board (PCB) 30.
Before forming surface-treated layer 19, first utilize cupric oxide etching solution that second blackening layer 126 etchings on electric connection pad 17 surfaces are removed, expose the copper body layer 121 of internal layer.In the present embodiment, the mode that forms described surface-treated layer 19 is electrogilding.Described surface-treated layer 19 conducts with electric connection pad 17.Be appreciated that forming the method for described surface-treated layer 19 also can be substituted by plating nickel gold, change nickel and soak gold, nickel plating porpezite, zinc-plated etc., is not limited with the present embodiment.Acting as with electronic devices and components of described electric connection pad 17 is electrically connected, be appreciated that, according to actual needs, described electric connection pad 17 also can omit, at this moment, described transparent mulch film 18 covers all surfaces of conductive circuit pattern 16 and the surface of the first adhesive-layer 13 of exposing from described conductive circuit pattern 16.
In the present embodiment, described transparent printed circuit board (PCB) 30 is single-clad board, only comprises one deck conductive circuit pattern 16.Be appreciated that, also can adopt the method that is similar to the present embodiment to adopt Layer increasing method to make formation multi-layer transparent printed circuit board (PCB) 30, be that described dielectric base layer 11 can be multilager base plate, comprise the multi-layer transparent resin layer of alternative arrangement and the conductive circuit pattern of multilayer side and relative two equal melanism in surface, described multilayer conductive circuit figure can adopt Layer increasing method to make by the method that is similar to the present embodiment and form.In addition, the making method of described transparent printed circuit board (PCB) 30 also can be applied to rigid-flex combined board.
The side of the conductive circuit pattern 16 of the transparent printed circuit board (PCB) 30 that employing the present embodiment melanism liquid medicine and making method form and two apparent surfaces are all by melanism, thereby the transparent feel of the wiring board that the reddish-brown that can prevent fine copper causes is not good, the transparent feel of transparent printed circuit board (PCB) 30 is strengthened; In addition, the melanism liquid medicine that this case is used, compared to traditional melanism liquid medicine, can not produce villous blackening layer, thus avoided fine hair come off and fine hair pollutes other regions of wiring board, also make the transparent feel of transparent printed circuit board (PCB) 30 better.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection domain that all should belong to the claims in the present invention with distortion.
Claims (10)
1. a melanism liquid medicine, it comprises the water that sodium hydroxide that quality percentage composition is 3%-5%, sodium hypophosphite that quality percentage composition is 10%-15%, sodium-chlor that quality percentage composition is 10%-15%, benzotriazole that quality percentage composition is 2%-4% and quality percentage composition are 70%-75%.
2. a making method for transparent printed circuit board (PCB), comprises step:
Copper-clad base plate is provided, described copper-clad base plate comprises transparent dielectric base layer and is arranged at the copper foil layer of the one side melanism on described dielectric base layer surface, described copper foil layer comprises copper body layer and the first blackening layer, described copper body layer comprises the 3rd surface, four surface relative to the 3rd surface and connects the side on the 3rd surface and the 4th surface, described the first blackening layer is formed at described the 3rd surface, and described the first blackening layer is between copper body layer and described stratum basale;
Described copper foil layer is made and formed conductive circuit pattern, the described stratum basale of part is exposed from described conductive circuit pattern, thereby described copper-clad base plate is made to circuit substrate;
Form the 4th surface of copper body layer of conductive circuit pattern and side and be placed in melanism liquid medicine claimed in claim 1 and carry out Darkening process making so that described the 4th surface is upper and side on all form the second blackening layer of black; And
On at least part of described the second blackening layer surface and the surface of the stratum basale exposing from described conductive circuit pattern form transparent mulch film, thereby make transparent printed circuit board (PCB).
3. the making method of transparent printed circuit board (PCB) as claimed in claim 2, it is characterized in that, form the 4th surface of copper body layer of conductive circuit pattern and side to be placed in the temperature that described melanism liquid medicine carries out Darkening process be 50 DEG C to 80 DEG C making, the time is 5 to 20 minutes.
4. the making method of transparent printed circuit board (PCB) as claimed in claim 2, it is characterized in that, forming the 4th surface of copper body layer of conductive circuit pattern and side and be placed in described melanism liquid medicine and carry out before Darkening process making, microetch processing is carried out on the 4th surface to described copper body layer and the surface of side.
5. the making method of transparent printed circuit board (PCB) as claimed in claim 4, is characterized in that, it is to comprise that concentration is that 80 to 100g/L Sodium Persulfate and weight hundred score concentration are the mixing solutions of 2% sulfuric acid that microetch is processed micro-etching solution used.
6. the making method of transparent printed circuit board (PCB) as claimed in claim 2, it is characterized in that, forming the 4th surface of copper body layer of conductive circuit pattern and side and be placed in after described melanism liquid medicine carries out Darkening process making, wash successively and dry described circuit substrate.
7. the making method of transparent printed circuit board (PCB) as claimed in claim 2, it is characterized in that, described copper-clad base plate further comprises the transparent adhesive-layer being arranged between described stratum basale and described copper foil layer, and described transparent adhesive-layer is used for adhering to described stratum basale and described copper foil layer.
8. the making method of transparent printed circuit board (PCB) as claimed in claim 2, it is characterized in that, described transparent mulch film covers the surface of described the second blackening layer, described transparent mulch film has the described transparent mulch film through hole of perforation, and the conductive circuit pattern of exposing from the through hole of described transparent mulch film forms electric connection pad.
9. the making method of transparent printed circuit board (PCB) as claimed in claim 8, is characterized in that, the making method of described printed circuit board (PCB) further comprises step: the second blackening layer etching on described electric connection pad surface is removed to expose copper body layer; And form surface-treated layer in the copper body layer of exposing.
10. the making method of transparent printed circuit board (PCB) as claimed in claim 9, is characterized in that, the method that forms described surface-treated layer is that electrogilding, plating nickel gold, change nickel soak gold, nickel plating porpezite or zinc-plated.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210582410.2A CN103898498B (en) | 2012-12-28 | 2012-12-28 | The making method of melanism liquid medicine and transparent printed circuit board (PCB) |
| TW102103533A TWI457466B (en) | 2012-12-28 | 2013-01-30 | Blacken reagent and method for manufacturing transparent printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210582410.2A CN103898498B (en) | 2012-12-28 | 2012-12-28 | The making method of melanism liquid medicine and transparent printed circuit board (PCB) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103898498A true CN103898498A (en) | 2014-07-02 |
| CN103898498B CN103898498B (en) | 2016-06-01 |
Family
ID=50990061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210582410.2A Active CN103898498B (en) | 2012-12-28 | 2012-12-28 | The making method of melanism liquid medicine and transparent printed circuit board (PCB) |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103898498B (en) |
| TW (1) | TWI457466B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108156763A (en) * | 2016-12-05 | 2018-06-12 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board and preparation method thereof |
| CN109576696A (en) * | 2017-09-29 | 2019-04-05 | 蓝思科技（长沙）有限公司 | For the melanism medical fluid of metal grill, its melanism method and metal grill and touch screen |
| CN113660788A (en) * | 2020-05-12 | 2021-11-16 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board and manufacturing method thereof |
| CN115433930A (en) * | 2022-07-06 | 2022-12-06 | 南通群安电子材料有限公司 | Phosphorus-free blackening solution for copper metal grid conductive film and preparation and use methods thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6054061A (en) * | 1997-12-11 | 2000-04-25 | Shipley Company, L.L.C. | Composition for circuit board manufacture |
| US6528409B1 (en) * | 2002-04-29 | 2003-03-04 | Advanced Micro Devices, Inc. | Interconnect structure formed in porous dielectric material with minimized degradation and electromigration |
| CN101467501A (en) * | 2007-02-06 | 2009-06-24 | 揖斐电株式会社 | Printed wiring board and method for manufacturing the same |
| CN102286739A (en) * | 2011-08-31 | 2011-12-21 | 上海应用技术学院 | Blackening agent for inner layer of multilayer board of printed circuit board and preparation method and application thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5869130A (en) * | 1997-06-12 | 1999-02-09 | Mac Dermid, Incorporated | Process for improving the adhesion of polymeric materials to metal surfaces |
-
2012
- 2012-12-28 CN CN201210582410.2A patent/CN103898498B/en active Active
-
2013
- 2013-01-30 TW TW102103533A patent/TWI457466B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6054061A (en) * | 1997-12-11 | 2000-04-25 | Shipley Company, L.L.C. | Composition for circuit board manufacture |
| US6528409B1 (en) * | 2002-04-29 | 2003-03-04 | Advanced Micro Devices, Inc. | Interconnect structure formed in porous dielectric material with minimized degradation and electromigration |
| CN101467501A (en) * | 2007-02-06 | 2009-06-24 | 揖斐电株式会社 | Printed wiring board and method for manufacturing the same |
| CN102286739A (en) * | 2011-08-31 | 2011-12-21 | 上海应用技术学院 | Blackening agent for inner layer of multilayer board of printed circuit board and preparation method and application thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108156763A (en) * | 2016-12-05 | 2018-06-12 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board and preparation method thereof |
| CN108156763B (en) * | 2016-12-05 | 2020-08-07 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board and manufacturing method thereof |
| CN109576696A (en) * | 2017-09-29 | 2019-04-05 | 蓝思科技（长沙）有限公司 | For the melanism medical fluid of metal grill, its melanism method and metal grill and touch screen |
| CN109576696B (en) * | 2017-09-29 | 2021-02-26 | 蓝思科技（长沙）有限公司 | Blackening liquid medicine for metal grid, blackening method of blackening liquid medicine, metal grid and touch screen |
| CN113660788A (en) * | 2020-05-12 | 2021-11-16 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board and manufacturing method thereof |
| CN115433930A (en) * | 2022-07-06 | 2022-12-06 | 南通群安电子材料有限公司 | Phosphorus-free blackening solution for copper metal grid conductive film and preparation and use methods thereof |
| CN115433930B (en) * | 2022-07-06 | 2023-11-28 | 南通群安电子材料有限公司 | Non-phosphorus blackening liquid for copper metal grid conductive film and preparation and use methods thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103898498B (en) | 2016-06-01 |
| TW201425644A (en) | 2014-07-01 |
| TWI457466B (en) | 2014-10-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103582304B (en) | Transparent printed circuit board (PCB) and preparation method thereof | |
| CN103687344B (en) | Circuit board manufacturing method | |
| CN102271463A (en) | Manufacturing method for circuit board | |
| TWI538590B (en) | Printed circuit board and method for manufacturing same | |
| JP2005322868A (en) | Method for electrolytic gold plating of printed circuit board | |
| CN103898498B (en) | The making method of melanism liquid medicine and transparent printed circuit board (PCB) | |
| CN102196668A (en) | Method for manufacturing circuit board | |
| CN102469691A (en) | Printed circuit board and method of manufacturing the same | |
| US8828247B2 (en) | Method of manufacturing printed circuit board having vias and fine circuit and printed circuit board manufactured using the same | |
| CN104735899A (en) | Flexible circuit board and manufacturing method thereof | |
| JP2010045155A (en) | Multilayer laminated circuit board | |
| CN101626661A (en) | Method for manufacturing double-side hollowed-out plates | |
| CN102686052A (en) | Flexible printed circuit board and manufacture method thereof | |
| JP2001196738A (en) | Metal base circuit board and manufacturing method therefor | |
| TWI420992B (en) | Method for manufacturing printed circuit board | |
| CN104131278B (en) | Melanism liquid medicine and the manufacture method of circuit board | |
| KR101156776B1 (en) | A method of manufacturing a printed circuit board | |
| TWI386132B (en) | Method for manufacturing printed circuit board | |
| JP2009094330A (en) | Substrate for wiring board and method for manufacturing the same | |
| JP2015060960A (en) | Wiring board manufacturing method | |
| TW201218886A (en) | Method for manufacturing printed circuit board | |
| JP2002299386A (en) | Double-sided wiring film carrier and manufacturing method therefor | |
| JP2010050116A (en) | Multilayer laminated circuit board | |
| JP4337408B2 (en) | Method for manufacturing printed wiring board | |
| KR20120001044A (en) | Imbeded printed circuit board member and manufacturing method the same and imbeded printed circuit board using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170317 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |