TWI318300B - Shielded probe apparatus for probing semiconductor wafer - Google Patents
Shielded probe apparatus for probing semiconductor waferInfo
- Publication number
- TWI318300B TWI318300B TW092117657A TW92117657A TWI318300B TW I318300 B TWI318300 B TW I318300B TW 092117657 A TW092117657 A TW 092117657A TW 92117657 A TW92117657 A TW 92117657A TW I318300 B TWI318300 B TW I318300B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor wafer
- probe apparatus
- shielded probe
- probing semiconductor
- probing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39239402P | 2002-06-28 | 2002-06-28 | |
US10/607,768 US6992495B2 (en) | 2002-06-28 | 2003-06-27 | Shielded probe apparatus for probing semiconductor wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200405019A TW200405019A (en) | 2004-04-01 |
TWI318300B true TWI318300B (en) | 2009-12-11 |
Family
ID=29782678
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097122234A TWI327226B (en) | 2002-06-28 | 2003-06-27 | Shielded probe apparatus |
TW092117657A TWI318300B (en) | 2002-06-28 | 2003-06-27 | Shielded probe apparatus for probing semiconductor wafer |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097122234A TWI327226B (en) | 2002-06-28 | 2003-06-27 | Shielded probe apparatus |
Country Status (3)
Country | Link |
---|---|
US (3) | US6992495B2 (zh) |
CN (1) | CN100480714C (zh) |
TW (2) | TWI327226B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI623759B (zh) * | 2013-09-04 | 2018-05-11 | 克萊譚克公司 | 用於測量電流對電壓特性之裝置 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6201402B1 (en) | 1997-04-08 | 2001-03-13 | Celadon Systems, Inc. | Probe tile and platform for large area wafer probing |
US6586954B2 (en) * | 1998-02-10 | 2003-07-01 | Celadon Systems, Inc. | Probe tile for probing semiconductor wafer |
TWI327226B (en) * | 2002-06-28 | 2010-07-11 | Celadon Systems Inc | Shielded probe apparatus |
US6847219B1 (en) * | 2002-11-08 | 2005-01-25 | Cascade Microtech, Inc. | Probe station with low noise characteristics |
US7170305B2 (en) | 2005-02-24 | 2007-01-30 | Celadon Systems, Inc. | Apparatus and method for terminating probe apparatus of semiconductor wafer |
US6975128B1 (en) * | 2003-03-28 | 2005-12-13 | Celadon Systems, Inc. | Electrical, high temperature test probe with conductive driven guard |
WO2006028812A1 (en) * | 2004-09-03 | 2006-03-16 | Celadon Systems, Inc. | Replaceable probe apparatus for probing semiconductor wafer |
US7355422B2 (en) * | 2005-09-17 | 2008-04-08 | Touchdown Technologies, Inc. | Optically enhanced probe alignment |
US7728609B2 (en) * | 2007-05-25 | 2010-06-01 | Celadon Systems, Inc. | Replaceable probe apparatus for probing semiconductor wafer |
US8674715B2 (en) * | 2010-01-20 | 2014-03-18 | Celadon Systems, Inc. | Test apparatus having a probe core with a twist lock mechanism |
US9746496B2 (en) | 2010-04-01 | 2017-08-29 | Koninklijke Philips N.V. | Signal measuring system, method for electrically conducting signals and a signal cable |
US8698515B2 (en) | 2010-08-16 | 2014-04-15 | Celadon Systems, Inc. | Probe test equipment for testing a semiconductor device |
US8994390B2 (en) | 2011-07-06 | 2015-03-31 | Celadon Systems, Inc. | Test systems with a probe apparatus and index mechanism |
US9024651B2 (en) | 2011-07-06 | 2015-05-05 | Celadon Systems, Inc. | Test apparatus having a probe card and connector mechanism |
TWI574013B (zh) * | 2013-03-15 | 2017-03-11 | 穩懋半導體股份有限公司 | 探針卡、探針結構及其製造方法 |
EP3131481B1 (en) * | 2014-04-11 | 2019-03-20 | Koninklijke Philips N.V. | Needle with thin film piezoelectric sensors |
JP6686846B2 (ja) * | 2016-11-11 | 2020-04-22 | 住友電装株式会社 | 電線接合部の保護構造及びワイヤハーネス |
CN108107230A (zh) * | 2017-12-01 | 2018-06-01 | 中广核工程有限公司 | 一种核电站主泵转速测量***及方法 |
US20200234854A1 (en) * | 2019-01-22 | 2020-07-23 | Kyzen Corporation | Cabling apparatus for high resistance applications |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3787768A (en) * | 1970-12-25 | 1974-01-22 | Matsushita Electric Ind Co Ltd | Inspection apparatus for printed circuit boards |
US3963986A (en) * | 1975-02-10 | 1976-06-15 | International Business Machines Corporation | Programmable interface contactor structure |
US4480223A (en) * | 1981-11-25 | 1984-10-30 | Seiichiro Aigo | Unitary probe assembly |
JPS6177286A (ja) | 1984-09-21 | 1986-04-19 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 同軸ケーブル用インターフェース装置 |
US4667523A (en) * | 1986-03-07 | 1987-05-26 | Orion Research Inc. | Electrode friction chuck |
US4731577A (en) * | 1987-03-05 | 1988-03-15 | Logan John K | Coaxial probe card |
US4845426A (en) * | 1987-05-20 | 1989-07-04 | Signatone Corporation | Temperature conditioner for tests of unpackaged semiconductors |
US5003254A (en) * | 1989-11-02 | 1991-03-26 | Huntron, Inc. | Multi-axis universal circuit board test fixture |
JP2769015B2 (ja) * | 1990-03-08 | 1998-06-25 | 株式会社神戸製鋼所 | 電子回路基板検査用プローバーピンヘッド及びその製造方法 |
US5015947A (en) * | 1990-03-19 | 1991-05-14 | Tektronix, Inc. | Low capacitance probe tip |
US5168218A (en) * | 1990-06-01 | 1992-12-01 | Rich Donald S | Tray-to-tray circuit package handler |
EP0477821A2 (en) * | 1990-09-25 | 1992-04-01 | S.P.E.A. S.r.l. | Electronic module handling device for an automatic test apparatus |
US5150040A (en) * | 1990-10-22 | 1992-09-22 | International Business Machines Corporation | Dual-mode z-stage |
US5325052A (en) * | 1990-11-30 | 1994-06-28 | Tokyo Electron Yamanashi Limited | Probe apparatus |
KR0138618B1 (ko) * | 1993-08-04 | 1998-06-15 | 이노우에 아끼라 | 프로브카드, 프로브카드용 동축 프로브빔 및 그 제조방법 |
US5488292A (en) * | 1993-10-04 | 1996-01-30 | Tokyo Seimitsu Co., Ltd. | Wafer inspecting system |
US5473254A (en) * | 1994-08-12 | 1995-12-05 | At&T Corp. | Test probe assembly provides precise and repeatable contact forces |
US5742174A (en) * | 1995-11-03 | 1998-04-21 | Probe Technology | Membrane for holding a probe tip in proper location |
US6075376A (en) * | 1997-12-01 | 2000-06-13 | Schwindt; Randy J. | Low-current probe card |
US5729150A (en) * | 1995-12-01 | 1998-03-17 | Cascade Microtech, Inc. | Low-current probe card with reduced triboelectric current generating cables |
US6050829A (en) * | 1996-08-28 | 2000-04-18 | Formfactor, Inc. | Making discrete power connections to a space transformer of a probe card assembly |
US6603322B1 (en) * | 1996-12-12 | 2003-08-05 | Ggb Industries, Inc. | Probe card for high speed testing |
US5949018A (en) * | 1996-12-23 | 1999-09-07 | Commscope, Inc. Of North Carolina | Water blocked shielded coaxial cable |
US6586954B2 (en) * | 1998-02-10 | 2003-07-01 | Celadon Systems, Inc. | Probe tile for probing semiconductor wafer |
US6201402B1 (en) * | 1997-04-08 | 2001-03-13 | Celadon Systems, Inc. | Probe tile and platform for large area wafer probing |
WO1999004273A1 (en) | 1997-07-15 | 1999-01-28 | Wentworth Laboratories, Inc. | Probe station with multiple adjustable probe supports |
JP3188876B2 (ja) * | 1997-12-29 | 2001-07-16 | インターナショナル・ビジネス・マシーンズ・コーポレ−ション | プロダクト・チップをテストする方法、テスト・ヘッド及びテスト装置 |
US5952843A (en) * | 1998-03-24 | 1999-09-14 | Vinh; Nguyen T. | Variable contact pressure probe |
US6124723A (en) * | 1998-08-31 | 2000-09-26 | Wentworth Laboratories, Inc. | Probe holder for low voltage, low current measurements in a water probe station |
US6276956B1 (en) * | 1999-04-12 | 2001-08-21 | Sencore, Inc. | Dual point test probe for surface mount type circuit board connections |
TWI327226B (en) | 2002-06-28 | 2010-07-11 | Celadon Systems Inc | Shielded probe apparatus |
US6727726B1 (en) * | 2002-11-12 | 2004-04-27 | Actel Corporation | Field programmable gate array architecture including a buffer module and a method of distributing buffer modules in a field programmable gate array |
US6860756B2 (en) * | 2003-01-14 | 2005-03-01 | Uta Auto Industrial Co., Ltd. | Terminal with a heat shrink collar for wrapping connected wires |
-
2003
- 2003-06-27 TW TW097122234A patent/TWI327226B/zh not_active IP Right Cessation
- 2003-06-27 TW TW092117657A patent/TWI318300B/zh not_active IP Right Cessation
- 2003-06-27 US US10/607,768 patent/US6992495B2/en not_active Expired - Lifetime
- 2003-06-30 CN CNB031524613A patent/CN100480714C/zh not_active Expired - Lifetime
-
2005
- 2005-11-09 US US11/270,044 patent/US7259577B2/en not_active Expired - Lifetime
-
2007
- 2007-07-18 US US11/779,669 patent/US7545157B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI623759B (zh) * | 2013-09-04 | 2018-05-11 | 克萊譚克公司 | 用於測量電流對電壓特性之裝置 |
Also Published As
Publication number | Publication date |
---|---|
TW200912342A (en) | 2009-03-16 |
US20060114009A1 (en) | 2006-06-01 |
CN1508555A (zh) | 2004-06-30 |
US7545157B2 (en) | 2009-06-09 |
CN100480714C (zh) | 2009-04-22 |
US20070252606A1 (en) | 2007-11-01 |
US6992495B2 (en) | 2006-01-31 |
TWI327226B (en) | 2010-07-11 |
US20040000920A1 (en) | 2004-01-01 |
TW200405019A (en) | 2004-04-01 |
US7259577B2 (en) | 2007-08-21 |
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Legal Events
Date | Code | Title | Description |
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MK4A | Expiration of patent term of an invention patent |