TWI317817B - Testing equipment and setup method - Google Patents

Testing equipment and setup method

Info

Publication number
TWI317817B
TWI317817B TW093107212A TW93107212A TWI317817B TW I317817 B TWI317817 B TW I317817B TW 093107212 A TW093107212 A TW 093107212A TW 93107212 A TW93107212 A TW 93107212A TW I317817 B TWI317817 B TW I317817B
Authority
TW
Taiwan
Prior art keywords
testing equipment
setup method
setup
testing
equipment
Prior art date
Application number
TW093107212A
Other languages
English (en)
Other versions
TW200428009A (en
Inventor
Takeshi Yaguchi
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200428009A publication Critical patent/TW200428009A/zh
Application granted granted Critical
Publication of TWI317817B publication Critical patent/TWI317817B/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/319Tester hardware, i.e. output processing circuits
    • G01R31/31903Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31908Tester set-up, e.g. configuring the tester to the device under test [DUT], down loading test patterns
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/3183Generation of test inputs, e.g. test vectors, patterns or sequences
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)
TW093107212A 2003-03-19 2004-03-18 Testing equipment and setup method TWI317817B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003074898 2003-03-19

Publications (2)

Publication Number Publication Date
TW200428009A TW200428009A (en) 2004-12-16
TWI317817B true TWI317817B (en) 2009-12-01

Family

ID=33027852

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093107212A TWI317817B (en) 2003-03-19 2004-03-18 Testing equipment and setup method

Country Status (9)

Country Link
US (2) US7107172B2 (zh)
EP (1) EP1612572B1 (zh)
JP (1) JP4520942B2 (zh)
KR (1) KR20050109548A (zh)
CN (1) CN100445761C (zh)
DE (1) DE602004007906T2 (zh)
MY (2) MY146849A (zh)
TW (1) TWI317817B (zh)
WO (1) WO2004083879A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8547125B2 (en) 2010-01-26 2013-10-01 Advantest Corporation Test apparatus and test module

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011001462A1 (ja) * 2009-06-29 2012-12-10 株式会社アドバンテスト 試験装置
CN104730448B (zh) * 2013-12-20 2017-07-28 致茂电子股份有限公司 自动测试设备资源配置方法与自动测试通道配置装置
CN104764942B (zh) * 2014-01-02 2018-08-14 致茂电子股份有限公司 自动测试设备及其控制方法
TWI588504B (zh) * 2015-12-23 2017-06-21 致茂電子股份有限公司 自動測試通道配置裝置及其控制方法
CN106019120B (zh) * 2016-05-12 2018-12-04 中国电子科技集团公司第四十一研究所 基于可扩展器件测试库的测试管理方法
CN109507569A (zh) * 2018-12-20 2019-03-22 深圳市长龙铁路电子工程有限公司 一种机车信号车载设备解码板的io测试方法
CN111208380A (zh) * 2020-04-17 2020-05-29 北京全路通信信号研究设计院集团有限公司 一种轨道电路室外设备测试装置、***及方法
JP2022044114A (ja) * 2020-09-07 2022-03-17 キオクシア株式会社 半導体集積回路およびその試験方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4070565A (en) * 1976-08-18 1978-01-24 Zehntel, Inc. Programmable tester method and apparatus
US5390129A (en) * 1992-07-06 1995-02-14 Motay Electronics, Inc. Universal burn-in driver system and method therefor
JPH07218602A (ja) 1994-02-07 1995-08-18 Advantest Corp 半導体試験装置
US5805610A (en) * 1997-04-28 1998-09-08 Credence Systems Corporation Virtual channel data distribution system for integrated circuit tester
US6374379B1 (en) * 1999-02-05 2002-04-16 Teradyne, Inc. Low-cost configuration for monitoring and controlling parametric measurement units in automatic test equipment
US6557128B1 (en) * 1999-11-12 2003-04-29 Advantest Corp. Semiconductor test system supporting multiple virtual logic testers
US6567941B1 (en) * 2000-04-12 2003-05-20 Advantest Corp. Event based test system storing pin calibration data in non-volatile memory
JP2002062340A (ja) * 2000-08-23 2002-02-28 Toshiba Corp 半導体試験装置
US7003697B2 (en) * 2001-07-02 2006-02-21 Nextest Systems, Corporation Apparatus having pattern scrambler for testing a semiconductor device and method for operating same
US6885961B2 (en) * 2002-02-28 2005-04-26 Teradyne, Inc. Hybrid tester architecture
US6941232B2 (en) * 2003-01-28 2005-09-06 Texas Instruments Incorporated Method and apparatus for performing multi-site integrated circuit device testing
JP4520945B2 (ja) * 2003-05-21 2010-08-11 株式会社アドバンテスト 試験装置及びテストモジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8547125B2 (en) 2010-01-26 2013-10-01 Advantest Corporation Test apparatus and test module

Also Published As

Publication number Publication date
US20060212252A1 (en) 2006-09-21
CN1761885A (zh) 2006-04-19
CN100445761C (zh) 2008-12-24
JPWO2004083879A1 (ja) 2006-06-22
US7107172B2 (en) 2006-09-12
DE602004007906D1 (de) 2007-09-13
EP1612572A4 (en) 2006-04-19
JP4520942B2 (ja) 2010-08-11
KR20050109548A (ko) 2005-11-21
EP1612572A1 (en) 2006-01-04
US20040220763A1 (en) 2004-11-04
DE602004007906T2 (de) 2008-04-10
TW200428009A (en) 2004-12-16
MY146074A (en) 2012-06-29
MY146849A (en) 2012-09-28
WO2004083879A1 (ja) 2004-09-30
EP1612572B1 (en) 2007-08-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees