TWI315688B - Bulk metallic glass solder - Google Patents
Bulk metallic glass solderInfo
- Publication number
- TWI315688B TWI315688B TW095125108A TW95125108A TWI315688B TW I315688 B TWI315688 B TW I315688B TW 095125108 A TW095125108 A TW 095125108A TW 95125108 A TW95125108 A TW 95125108A TW I315688 B TWI315688 B TW I315688B
- Authority
- TW
- Taiwan
- Prior art keywords
- metallic glass
- glass solder
- bulk metallic
- bulk
- solder
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C45/00—Amorphous alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/203,546 US7628871B2 (en) | 2005-08-12 | 2005-08-12 | Bulk metallic glass solder material |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200719998A TW200719998A (en) | 2007-06-01 |
TWI315688B true TWI315688B (en) | 2009-10-11 |
Family
ID=37398325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095125108A TWI315688B (en) | 2005-08-12 | 2006-07-10 | Bulk metallic glass solder |
Country Status (6)
Country | Link |
---|---|
US (2) | US7628871B2 (zh) |
JP (1) | JP2009509767A (zh) |
KR (1) | KR101026316B1 (zh) |
CN (1) | CN101282817B (zh) |
TW (1) | TWI315688B (zh) |
WO (1) | WO2007021492A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI409128B (zh) * | 2009-11-30 | 2013-09-21 | Jx Nippon Mining & Metals Corp | Reflow Sn plating components |
Families Citing this family (50)
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US7628871B2 (en) | 2005-08-12 | 2009-12-08 | Intel Corporation | Bulk metallic glass solder material |
US7830021B1 (en) * | 2005-09-06 | 2010-11-09 | Rockwell Collins, Inc. | Tamper resistant packaging with transient liquid phase bonding |
US7863639B2 (en) * | 2006-04-12 | 2011-01-04 | Semileds Optoelectronics Co. Ltd. | Light-emitting diode lamp with low thermal resistance |
US8373195B2 (en) | 2006-04-12 | 2013-02-12 | SemiLEDs Optoelectronics Co., Ltd. | Light-emitting diode lamp with low thermal resistance |
DE102007005780A1 (de) * | 2006-08-10 | 2008-02-14 | Carl Zeiss Smt Ag | Verbundstruktur für die Mikrolithographie und optische Anordnung |
US8030757B2 (en) | 2007-06-29 | 2011-10-04 | Intel Corporation | Forming a semiconductor package including a thermal interface material |
US20090032970A1 (en) * | 2007-07-31 | 2009-02-05 | Park Chang-Min | Stacking of integrated circuits using glassy metal bonding |
KR100975652B1 (ko) * | 2007-10-05 | 2010-08-17 | 한국과학기술원 | 아연 및 아연합금을 이용한 비아 및 그의 형성 방법, 그를3차원 다중 칩 스택 패키지 제조 방법 |
US20110132437A1 (en) * | 2007-12-10 | 2011-06-09 | Alan Kost | Methods to bond or seal glass pieces of photovoltaic cell modules |
WO2009076411A2 (en) * | 2007-12-10 | 2009-06-18 | Davis, Joseph And Negley | Methods for bond or seal glass pieces of photovoltaic cell modules |
WO2009110458A1 (ja) * | 2008-03-05 | 2009-09-11 | 千住金属工業株式会社 | 鉛フリーはんだ接続構造体およびはんだボール |
US8378504B2 (en) * | 2008-06-30 | 2013-02-19 | Intel Corporation | Microelectronic package with self-heating interconnect |
US8493746B2 (en) * | 2009-02-12 | 2013-07-23 | International Business Machines Corporation | Additives for grain fragmentation in Pb-free Sn-based solder |
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KR101741683B1 (ko) | 2010-08-05 | 2017-05-31 | 삼성전자주식회사 | 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지 |
US8987586B2 (en) | 2010-08-13 | 2015-03-24 | Samsung Electronics Co., Ltd. | Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste |
US8668847B2 (en) | 2010-08-13 | 2014-03-11 | Samsung Electronics Co., Ltd. | Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste |
KR101741682B1 (ko) | 2010-08-24 | 2017-05-31 | 삼성전자주식회사 | 도전성 페이스트와 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지 |
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US9105370B2 (en) | 2011-01-12 | 2015-08-11 | Samsung Electronics Co., Ltd. | Conductive paste, and electronic device and solar cell including an electrode formed using the same |
US8940195B2 (en) | 2011-01-13 | 2015-01-27 | Samsung Electronics Co., Ltd. | Conductive paste, and electronic device and solar cell including an electrode formed using the same |
CN103476539B (zh) * | 2011-02-04 | 2016-08-17 | 安塔亚技术公司 | 无铅焊料组合物 |
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KR101796658B1 (ko) | 2011-03-28 | 2017-11-13 | 삼성전자주식회사 | 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지 |
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JP6100269B2 (ja) * | 2011-10-20 | 2017-03-22 | クルーシブル インテレクチュアル プロパティ エルエルシーCrucible Intellectual Property Llc | バルクアモルファス合金ヒートシンク |
US9624137B2 (en) * | 2011-11-30 | 2017-04-18 | Component Re-Engineering Company, Inc. | Low temperature method for hermetically joining non-diffusing ceramic materials |
KR101985929B1 (ko) | 2011-12-09 | 2019-06-05 | 삼성전자주식회사 | 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지 |
KR101360142B1 (ko) * | 2012-01-13 | 2014-02-11 | 서정환 | 무연 솔더 조성물 |
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CN103286406B (zh) * | 2013-05-31 | 2015-10-07 | 哈尔滨工业大学 | 一种Zr基块体金属玻璃与Sn基钎料的低温连接方法 |
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CN105436724B (zh) * | 2014-09-23 | 2020-03-03 | 苹果公司 | 通过焊接整修块体金属玻璃(bmg)制品中的表面特征的方法 |
KR102409913B1 (ko) * | 2017-12-06 | 2022-06-16 | 삼성전자주식회사 | 솔더 리플로우 장치 및 이를 이용한 전자 장치의 제조 방법 |
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KR100753415B1 (ko) | 2006-03-17 | 2007-08-30 | 주식회사 하이닉스반도체 | 스택 패키지 |
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US7705458B2 (en) | 2006-06-20 | 2010-04-27 | Intel Corporation | Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same |
US20090032970A1 (en) | 2007-07-31 | 2009-02-05 | Park Chang-Min | Stacking of integrated circuits using glassy metal bonding |
-
2005
- 2005-08-12 US US11/203,546 patent/US7628871B2/en not_active Expired - Fee Related
-
2006
- 2006-07-10 TW TW095125108A patent/TWI315688B/zh not_active IP Right Cessation
- 2006-07-27 CN CN2006800376992A patent/CN101282817B/zh not_active Expired - Fee Related
- 2006-07-27 KR KR1020087003432A patent/KR101026316B1/ko active IP Right Grant
- 2006-07-27 WO PCT/US2006/029360 patent/WO2007021492A1/en active Application Filing
- 2006-07-27 JP JP2008526055A patent/JP2009509767A/ja active Pending
-
2009
- 2009-10-26 US US12/606,080 patent/US20100037990A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI409128B (zh) * | 2009-11-30 | 2013-09-21 | Jx Nippon Mining & Metals Corp | Reflow Sn plating components |
Also Published As
Publication number | Publication date |
---|---|
US7628871B2 (en) | 2009-12-08 |
US20100037990A1 (en) | 2010-02-18 |
US20070034305A1 (en) | 2007-02-15 |
CN101282817B (zh) | 2012-07-18 |
TW200719998A (en) | 2007-06-01 |
WO2007021492A1 (en) | 2007-02-22 |
JP2009509767A (ja) | 2009-03-12 |
KR20080025762A (ko) | 2008-03-21 |
CN101282817A (zh) | 2008-10-08 |
KR101026316B1 (ko) | 2011-03-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |