TWI315649B - - Google Patents
Info
- Publication number
- TWI315649B TWI315649B TW096100546A TW96100546A TWI315649B TW I315649 B TWI315649 B TW I315649B TW 096100546 A TW096100546 A TW 096100546A TW 96100546 A TW96100546 A TW 96100546A TW I315649 B TWI315649 B TW I315649B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/80—Turntables carrying articles or materials to be transferred, e.g. combined with ploughs or scrapers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Specific Conveyance Elements (AREA)
- Feeding Of Articles To Conveyors (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Sorting Of Articles (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006050615A JP4906058B2 (ja) | 2006-02-27 | 2006-02-27 | ワーク搬送システム |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200733829A TW200733829A (en) | 2007-09-01 |
TWI315649B true TWI315649B (ko) | 2009-10-01 |
Family
ID=38551647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096100546A TW200733829A (en) | 2006-02-27 | 2007-01-05 | Workpiece transport system |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4906058B2 (ko) |
KR (1) | KR100854993B1 (ko) |
CN (1) | CN101028892B (ko) |
TW (1) | TW200733829A (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4750899B1 (ja) * | 2010-09-10 | 2011-08-17 | 株式会社ダイシン | ワーク分離ユニット及び振動式搬送装置 |
KR101855886B1 (ko) | 2011-02-28 | 2018-05-10 | 주식회사 탑 엔지니어링 | 전자부품 분류장치 |
JP2012228638A (ja) * | 2011-04-25 | 2012-11-22 | Young Tek Electronics Corp | 実装チップ検査・選別装置 |
JP5679195B2 (ja) * | 2011-05-27 | 2015-03-04 | 株式会社 東京ウエルズ | ワーク搬送検査装置およびワーク搬送検査方法 |
CN103964164B (zh) * | 2013-01-28 | 2016-09-21 | 达丰(上海)电脑有限公司 | 一种自动送料装置及其自动送料方法 |
CN103863790B (zh) * | 2013-07-17 | 2016-03-16 | 浙江百新机电科技有限公司 | 一种灭火器筒体封头选料装置 |
CN104418056B (zh) * | 2013-09-05 | 2017-03-01 | 产台股份有限公司 | 料件回吹分离装置 |
KR101591242B1 (ko) * | 2014-04-07 | 2016-02-03 | 나승옥 | 워크 배출장치 |
CN106458465B (zh) * | 2014-06-04 | 2019-03-19 | 株式会社村田制作所 | 搬运装置 |
CN104118711A (zh) * | 2014-07-18 | 2014-10-29 | 中磁科技股份有限公司 | 一种自动送料装置 |
FR3058404B1 (fr) * | 2016-11-09 | 2020-09-18 | Sidel Participations | Systeme de convoyage d'objets en matiere thermoplastique comportant un corps creux muni d'un col |
JP6879822B2 (ja) * | 2017-05-18 | 2021-06-02 | 株式会社 東京ウエルズ | ワーク外観検査装置およびワーク外観検査方法 |
CN110314866A (zh) * | 2019-06-17 | 2019-10-11 | 杭州众道光电科技有限公司 | 一种半导体器件的分选装匣*** |
CN112351670B (zh) * | 2019-08-09 | 2022-03-18 | Ykk株式会社 | 部件供给装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0635284B2 (ja) * | 1984-03-31 | 1994-05-11 | 神鋼電機株式会社 | 振動部品供給機の部品受容器 |
JP3262400B2 (ja) * | 1993-03-17 | 2002-03-04 | 日東工業株式会社 | チップ自動分離送給装置 |
JP3256362B2 (ja) * | 1994-01-24 | 2002-02-12 | エヌティエヌ株式会社 | 振動部品供給装置 |
JP3339390B2 (ja) * | 1997-11-12 | 2002-10-28 | 株式会社村田製作所 | 電子部品の搬送装置 |
JP3363421B2 (ja) * | 1999-12-28 | 2003-01-08 | 株式会社 東京ウエルズ | ワークの自動供給装置 |
JP3687503B2 (ja) * | 2000-07-11 | 2005-08-24 | 株式会社村田製作所 | 電子部品の搬送装置およびこの搬送装置を用いた検査装置 |
JP3723070B2 (ja) * | 2000-11-10 | 2005-12-07 | 株式会社 東京ウエルズ | ワーク搬送装置 |
JP2002302244A (ja) * | 2001-04-05 | 2002-10-18 | Nitto Kogyo Co Ltd | チップの1個分離搬送装置 |
JP2004115273A (ja) * | 2002-09-30 | 2004-04-15 | Far East Engineering Co Ltd | チップ自動分離搬送装置 |
JP4388286B2 (ja) * | 2003-01-31 | 2009-12-24 | 喜彦 蒲田 | 微小物体検査装置 |
JP4241439B2 (ja) * | 2003-06-18 | 2009-03-18 | 株式会社村田製作所 | チップ型電子部品の取扱い装置 |
JP4446089B2 (ja) * | 2004-07-01 | 2010-04-07 | 株式会社 東京ウエルズ | ワーク搬送システム |
-
2006
- 2006-02-27 JP JP2006050615A patent/JP4906058B2/ja active Active
-
2007
- 2007-01-05 TW TW096100546A patent/TW200733829A/zh unknown
- 2007-02-08 KR KR1020070013268A patent/KR100854993B1/ko active IP Right Grant
- 2007-02-27 CN CN2007100843553A patent/CN101028892B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR100854993B1 (ko) | 2008-08-28 |
JP2007230661A (ja) | 2007-09-13 |
TW200733829A (en) | 2007-09-01 |
CN101028892B (zh) | 2011-07-06 |
JP4906058B2 (ja) | 2012-03-28 |
KR20070089051A (ko) | 2007-08-30 |
CN101028892A (zh) | 2007-09-05 |
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