TWI311568B - - Google Patents
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- Publication number
- TWI311568B TWI311568B TW94138522A TW94138522A TWI311568B TW I311568 B TWI311568 B TW I311568B TW 94138522 A TW94138522 A TW 94138522A TW 94138522 A TW94138522 A TW 94138522A TW I311568 B TWI311568 B TW I311568B
- Authority
- TW
- Taiwan
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094138522A TW200718725A (en) | 2005-11-03 | 2005-11-03 | Phosphorus-containing epoxy composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094138522A TW200718725A (en) | 2005-11-03 | 2005-11-03 | Phosphorus-containing epoxy composition |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200718725A TW200718725A (en) | 2007-05-16 |
TWI311568B true TWI311568B (zh) | 2009-07-01 |
Family
ID=45072449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094138522A TW200718725A (en) | 2005-11-03 | 2005-11-03 | Phosphorus-containing epoxy composition |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200718725A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103724936A (zh) * | 2012-10-10 | 2014-04-16 | 慧智科技(中国)有限公司 | 改善抗冲击性能的无卤低介电环氧树脂组合物 |
US9394438B2 (en) | 2012-12-21 | 2016-07-19 | Elite Material Co., Ltd. | Resin composition, copper-clad laminate and printed circuit board for use therewith |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI424021B (zh) * | 2009-06-30 | 2014-01-21 | Elite Material Co Ltd | 熱固性樹脂組成以及銅箔層合板 |
EP2518115B1 (en) | 2009-12-25 | 2017-10-18 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate |
TWI494340B (zh) * | 2010-08-02 | 2015-08-01 | Taiwan Union Technology Corp | 環氧樹脂組成物及其製成的預浸材和印刷電路板 |
TWI417339B (zh) * | 2011-01-14 | 2013-12-01 | Elite Material Co Ltd | Resin composition |
CN103540101B (zh) * | 2012-07-17 | 2016-01-20 | 台光电子材料(昆山)有限公司 | 无卤素树脂组合物及应用其的铜箔基板及印刷电路板 |
-
2005
- 2005-11-03 TW TW094138522A patent/TW200718725A/zh unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103724936A (zh) * | 2012-10-10 | 2014-04-16 | 慧智科技(中国)有限公司 | 改善抗冲击性能的无卤低介电环氧树脂组合物 |
CN103724936B (zh) * | 2012-10-10 | 2016-08-03 | 慧智科技(中国)有限公司 | 改善抗冲击性能的无卤低介电环氧树脂组合物 |
US9394438B2 (en) | 2012-12-21 | 2016-07-19 | Elite Material Co., Ltd. | Resin composition, copper-clad laminate and printed circuit board for use therewith |
Also Published As
Publication number | Publication date |
---|---|
TW200718725A (en) | 2007-05-16 |
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