TWI306157B - - Google Patents
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- TWI306157B TWI306157B TW095138363A TW95138363A TWI306157B TW I306157 B TWI306157 B TW I306157B TW 095138363 A TW095138363 A TW 095138363A TW 95138363 A TW95138363 A TW 95138363A TW I306157 B TWI306157 B TW I306157B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
.1306157 • 九、發明說明: 【發明所屬之技術領域】 本發明,係關於用以檢查如液晶顯示面板用玻璃基板 之具備多數線路之被檢查基板的感測器基板、以及使用其 之檢查方法及裝置。 【先前技術】 如用於液晶顯示面板之玻璃基板般之具備縱橫延伸之 多數線路(亦即電路)的被檢查基板,會檢查該等線路有無 • 斷線及短路。而作為用於上述檢查之感測器基板以及使用 其之檢查方法及裝置之一,係有一種專利文獻1所記載的 • 技術。 【專利文獻1】特開2〇〇4 — 19 13 8 1號公報 此習知技術之感測器基板,具備在形成於玻璃基板(即 被檢查基板)之線路的長邊方向相距間隔的至少一對供電電 極及受電電極。 使用此種感測器基板之檢查,係使感測器基板之供電 鲁電極及收訊之電極分別與線路之被檢查區域一端部及另一 端部對向的狀態下,一邊從供電電極向線路供應交流訊 號、一邊以受電電極透過線路接收其檢查訊號,同時使感 測器基板橫越待檢查之複數個線路,藉此來進行。 線路之異常,係當即使供電電極及受電電極與線路對 向、檢查訊號仍無法透過該線路而被受電電極接收時,即 判定該線路為斷線。 然而,上述習知技術,係在使兩電極於線路長邊方向 5 1306157 刀離之狀態下,使感測器基板移動於橫過線路的方向。因 匕此種檢查雖能檢測有無斷線,但無法檢測在線路長邊 方向之斷線位置。 因此’上述習知技術中,為了特定出斷線位置,係依 斷線之線路來進行下述作業,亦即使兩電極返回斷線之 路位置’再度進行檢查訊號之收發送,同時使兩電極之 —者接近另一者來檢測出受電電極無法接收檢查訊號的位 置。 此種習知技術’不僅須與有無斷線之檢查步驟另外進 订特定出在線路長邊方向之斷線位置的步驟’且須就斷線 之各線路進行。 【發明内容】 本發明之目的,係藉由使感測器基板與被檢查基板相 對移動一次,即能特定出有無斷線與斷線位置。 本發明之感測器基板及使用其之檢查方法及裝置,係 用以檢查具備在第1方向相隔間隔且延伸於第2方向之複 數個電路的被檢查基板(如顯示用面板之玻璃基板)。 本發明之感測器基板,包含:至少一個供電電極,係 以非接觸方式將檢查訊號供應至該電路;複數個受電電 極,係至少於該第丨方向相距間隔,且從該供電電極往該 第2方向相距間隔,來分別以非接觸方式接收供應至該電 路之檢查訊號;以及複數個感測器電路’係輸出用以表示 在該受電電極有無收訊訊號的電氣訊號。 本發明亦可為:具備於該第1方向相距間隔之至少兩 • 1306157 個该供電電極;且該複數個 | w又罨電極,係區分成至少兩個 分別於該第1方向相距間陪 门相距間隔且與該供電電極以一對一形皞 對應的受電電極群,且包含可接 " 接收來自各自對應之供電電 極之檢查訊號的複數個受電電極。 方向相距間隔之複數個 ,係以一對一形態與該 本發明亦可為··具備於該第i 該供電電極;且該複數個受電電極 供電電極對應。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor substrate for inspecting a substrate to be inspected having a plurality of lines for inspecting a glass substrate for a liquid crystal display panel, and an inspection method using the same And equipment. [Prior Art] If the substrate to be inspected, which has a plurality of lines (i.e., circuits) extending in the vertical and horizontal directions, such as a glass substrate for a liquid crystal display panel, it is checked whether or not the lines are broken or short-circuited. Further, as one of the sensor substrate used for the above inspection and the inspection method and apparatus therefor, there is a technique described in Patent Document 1. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. Hei 2 No. Hei. No. Hei. A pair of power supply electrodes and power receiving electrodes. The inspection of the sensor substrate is performed such that the power supply electrode and the reception electrode of the sensor substrate face the one end portion and the other end portion of the inspection region of the line, respectively, while the power supply electrode is routed to the line. The communication signal is supplied, and the inspection signal is received by the power receiving electrode through the line, and the sensor substrate is traversed through a plurality of lines to be inspected. The abnormality of the line is determined to be disconnected even if the power supply electrode and the power receiving electrode are opposed to the line and the inspection signal cannot be received by the power receiving electrode through the line. However, the above conventional technique is to move the sensor substrate in a direction crossing the line in a state where the electrodes are cut away in the longitudinal direction 5 1306157 of the line. Because this type of inspection can detect the presence or absence of a broken line, it cannot detect the position of the broken line in the long side of the line. Therefore, in the above-mentioned prior art, in order to specify the disconnection position, the following operations are performed according to the broken line, and even if the two electrodes return to the disconnection position, the inspection signal is transmitted and received again, and the two electrodes are simultaneously made. It is close to the other to detect the position where the power receiving electrode cannot receive the check signal. This prior art technique is not only required to additionally perform the step of specifying the disconnection position in the longitudinal direction of the line with or without the inspection step of the disconnection, and must be performed for each line of the disconnection. SUMMARY OF THE INVENTION An object of the present invention is to specify whether or not there is a disconnection or a disconnection position by moving a sensor substrate and a substrate to be inspected relatively once. The sensor substrate of the present invention and an inspection method and apparatus therefor are used for inspecting an inspected substrate (such as a glass substrate for a display panel) having a plurality of circuits extending in the first direction and extending in the second direction. . The sensor substrate of the present invention comprises: at least one power supply electrode, wherein the inspection signal is supplied to the circuit in a non-contact manner; and the plurality of power receiving electrodes are spaced apart from each other at least in the second direction, and from the power supply electrode The second direction is spaced apart to receive the inspection signal supplied to the circuit in a non-contact manner; and the plurality of sensor circuits are outputting an electrical signal indicating whether the receiving electrode has a receiving signal at the receiving electrode. The present invention may be configured to: have at least two 1306157 power supply electrodes spaced apart from each other in the first direction; and the plurality of |w and 罨 electrodes are separated into at least two gates respectively spaced apart from each other in the first direction A group of power receiving electrodes spaced apart from each other and having a one-to-one shape corresponding to the power supply electrode, and including a plurality of power receiving electrodes that can receive the inspection signals from the respective power supply electrodes. The plurality of directions are spaced apart from each other, and the present invention may be provided in the first power supply electrode; and the plurality of power receiving electrode power supply electrodes.
連接:::::::該複數個感測器電路係"-形態 本發明亦可為:該被檢查基板,進一步具備於該第2 方向相距間隔且延伸於該第丨方向之複數個第2電路;且 :感測器基板,進一步包含用以將第2檢查訊號供應至該 弟2電路的至少—個第2供電電極。 本發明亦可為:該第2供電電極係配置在偏離該供電 電極及該受電電極於該第i方向之配置區域的位置。 本發月之檢查方法,包含·移動步驟,係在該供電電 極與該受電電極於該第2方向相距間隔對向之狀態下,使 如上述之感測器基板與被檢查基板相對移動於該第2方向 供電步驟,係於該移動步驟中對該供電電極供應檢查訊 就;以及判定步驟,係於該供電步驟中根據該感測器電路 之輪出訊號判定該電路之良筹。 本發明亦可為:該供電步驟係以不同時序對複數個供 電電極供應該檢查訊號;且該判定步驟,係與對該供電電 極之供電時序同步判定該電路之良筹。 7 1306157 本發明亦可為:該判定步驟,係根據連接於與該電路 、°之党電電極的感測器電路之輸出訊號、以及連接於未 7該電路對向之受電電極的感測器電路之輸出訊號 疋該電路之良莠。 將可為:該供電步驟或檢查訊號產生電路,係 字2檢查訊號供應至該第2供電電極;該判定 電:;=,係將與接收該第2檢查訊號之該電極對向的 电裕列疋為父又不良。 係進明亦可為:當該判定步驟判定該電路為不良時, 對位置=㈣2方向中該感測器基板與被檢查基板之相 對位置特疋出該電路的不良位置。 本發明之檢查裝置,包含:檢查訊號產生電路,係用 以產生供應至該供電電極之檢查訊號;移動裝置 二=與該受電電極於該,2方向相距間隔對向之㈣ 上述之感測器基板與被檢查基板 2方向;判定電路,係根據該感測器基板與被== 由該移動裝置而移動、且該檢查二 ^間之錢測H電路的輸出訊號,來判定該電路之良 料本發明亦可為:該判定電路,係根據連接於與該電路 、向之受電電極的感測器電路之輸出訊號、以及連 與該電路對向Μ電電極的感;未 定該電路之良筹。 ❹電路之輸出訊號,來判 本發明亦可為:該檢查訊號產生電路,係進一步地將 8 • j3〇6157 言亥第2檢查訊號供應至該第2供電電極;該判定電路,係 進一步地將與接收該第2檢查訊號之該電極對向的電路判 定為交又不良。 本發明亦可為:當該判定電路判定該電路為不良時, 係進-步從該第2方向中該感測器基板與被檢查基板之相 對位置特定出該電路的不良位置。 本發明’係使至少一個供電電極與於第i方向相距間 ㈤之㈣個受電電極在電路之長邊方向分離的狀態下,使 感測器基板與被檢查基板彼此對向並相對移動於電路長邊 方向的期間中,使檢查訊號從供電電極向電路供應且由 受電電極接收流動於電路的檢查訊號。 當電路斷線時,由於檢查訊號即無法到達與電路對向 之,電電極,因此會從感測器電路輸出表示該電路已斷線 之無況號」的異常訊號"藉此能判定「電路已斷線」。 …在電路長邊方向之斷線位置,可從選自群組(包含在受 • ^電極無收訊訊號時,應以受電電極接收之檢查訊號從有 憂化成無之時點’以及在受電電極之收訊訊號從無變化成 有之時點)之至少—個時點之第2方向中感測器基板與被檢 查基板之相對位置(亦即座標值)來加以特定。 如上所述,根據本發明,可藉由使感測器基板與被檢 查基板相對移動一次,來特定出有無斷線與斷線位置。 感測器基板具備於第丨方向相距間隔之至少兩個供電 電極1複數個受電電極,係區分成至少兩個分別於該第 方向相距間隔而與供f電極以一對一形態對應#受電電 9 1306157 極群,且包含可接收來自各自對應之供電電極之檢查訊號The connection::::::: the plurality of sensor circuit systems"-forms may be: the substrate to be inspected further includes a plurality of intervals spaced apart from the second direction and extending in the second direction The second circuit; and the sensor substrate further includes at least one second power supply electrode for supplying the second inspection signal to the second circuit. In the present invention, the second power supply electrode may be disposed at a position deviated from the arrangement region of the power supply electrode and the power receiving electrode in the ith direction. The inspection method of the present month includes a moving step of moving the sensor substrate and the substrate to be inspected relative to each other while the power supply electrode and the power receiving electrode are opposed to each other in the second direction. The second direction power supply step is to supply a check signal to the power supply electrode in the moving step; and a determining step is to determine a good condition of the circuit according to the rounding signal of the sensor circuit in the power supply step. In the present invention, the power supply step is to supply the check signal to the plurality of power electrodes at different timings; and the determining step determines the circuit to be synchronized with the power supply timing of the power supply electrode. 7 1306157 The present invention may also be: the determining step is based on an output signal of a sensor circuit connected to the circuit electrode of the circuit, and a sensor connected to the power receiving electrode opposite to the circuit. The output signal of the circuit is good for this circuit. The power supply step or the check signal generating circuit, the word 2 check signal is supplied to the second power supply electrode; the determination power: ; = is the power supply that is opposite to the electrode receiving the second check signal. Lennon is a bad father. The system may also be: when the determining step determines that the circuit is defective, the position of the sensor substrate and the substrate to be inspected in the position = (four) 2 direction is particularly good for the defective position of the circuit. The inspection device of the present invention comprises: an inspection signal generating circuit for generating an inspection signal supplied to the power supply electrode; and a moving device 2 = opposite to the power receiving electrode at the distance between the two directions (4) the sensor described above The direction of the substrate and the substrate 2 to be inspected; the determination circuit determines the goodness of the circuit based on the sensor substrate and the output signal of the H circuit that is moved by the mobile device and the test device The invention may also be: the determination circuit is based on an output signal connected to the sensor circuit connected to the circuit and the power receiving electrode, and a sense of the opposite electrode of the circuit; Raise. The output signal of the circuit, the invention may also be: the check signal generating circuit further supplies the 8th, j3, 6157, the second check signal to the second power supply electrode; the decision circuit is further The circuit that faces the electrode that receives the second inspection signal is determined to be defective. In the present invention, when the determination circuit determines that the circuit is defective, the step further determines a defective position of the circuit from a relative position of the sensor substrate and the substrate to be inspected in the second direction. In the present invention, the at least one power supply electrode and the (four) power receiving electrodes spaced apart from each other in the ith direction are separated from each other in the longitudinal direction of the circuit, and the sensor substrate and the substrate to be inspected are opposed to each other and relatively moved to the circuit. In the period in the longitudinal direction, the inspection signal is supplied from the power supply electrode to the circuit and the power receiving electrode receives the inspection signal flowing through the circuit. When the circuit is disconnected, the inspection signal will not reach the opposite side of the circuit, and the electric electrode will output an abnormal signal indicating that the circuit has been disconnected from the sensor circuit. The circuit has been disconnected." ...where the disconnection position in the long-side direction of the circuit can be selected from the group (including when the receiving electrode receives no signal, the inspection signal received by the receiving electrode should be delayed from the time of failure) and the receiving electrode The relative position (ie, the coordinate value) of the sensor substrate and the substrate to be inspected in the second direction of at least one time point of the received signal is changed from at least one time point. As described above, according to the present invention, the presence or absence of the disconnection and the disconnection position can be specified by relatively moving the sensor substrate and the inspected substrate once. The sensor substrate includes at least two power supply electrodes 1 spaced apart from each other in the second direction, and the plurality of power receiving electrodes are divided into at least two intervals corresponding to the first direction and corresponding to the f electrodes in a one-to-one manner. 9 1306157 pole group, and includes inspection signals that can receive power electrodes from their respective
电笔極之供電時序同步判定電路之良筹。 同樣地’當感測器基板具備於第1方向相距間隔之複 數個供電電極,且複數個受電電極係與供電電極以一對一 元L對應時,Φ以不同時序對複數個供電電極供應檢查訊 戒,且與對供電電極之供電時序同步判定該電路之良筹。 藉由上述方式,縱使係檢查訊號未供應至特定電路之 時序,與該特定電路對向之受電電極均可能接收檢查訊 號。此時,由於該特定電路與其他電路呈短路,因此能容 易地特定出電路彼此之短路及短路位置。 “當被檢查基板具備與如上述之電路交又的複數個第2 電路’且感測器基板包含用以將帛2檢查訊號供應至該第 2電路的至少一個第2供電電極時,有時即以受電電極來 接收第2檢查訊號。此時,由於與接收第2檢查訊號之受 電電極對向的電路與第2電路呈短路,因此能容易地特定 出該電路係呈交又短路及其位置。 【實施方式】 以下’參照圖式說明本發明之實施例。 [被檢查基板之實施例] 參照圖1及圖2,檢J 板12。被檢查基板12,4 般之未完成的被檢查基板, 檢查裝置10,係用於檢查被檢查基 ’係如液晶顯示面板用之玻璃基板 板’且具有複數個(圖示之例中為六 10 * 1306157 顯不面板之破螭基板作用的線路區 個)在元成後可發揮液晶 域0 被檢查基板12,# 係於具有可撓性之長方形玻璃板14 之各線路區域—面,具一 具有並排之稷數個第1電路16與並 排:複數個第2電路以…及第2電路…,藉由 配^該等間之透明絕緣層(未圖示)來予以電氣絕緣。 1電路16’係在與玻璃板14平行之面内於第^ 向相距間隔而延伸於笛The power supply timing synchronization determination circuit of the electric pen pole is well-funded. Similarly, when the sensor substrate is provided with a plurality of power supply electrodes spaced apart from each other in the first direction, and the plurality of power receiving electrodes are corresponding to the power supply electrodes by a pair of one-dimensional L, Φ supplies the plurality of power supply electrodes with different timings. Ring, and the power supply timing of the power supply electrode is synchronized to determine the circuit's good. In the above manner, even if the timing of the signal is not supplied to the specific circuit, the power receiving electrode opposed to the specific circuit may receive the inspection signal. At this time, since the specific circuit is short-circuited with other circuits, it is possible to easily specify the short-circuit and short-circuit positions of the circuits. "When the substrate to be inspected has a plurality of second circuits that are connected to the circuit as described above and the sensor substrate includes at least one second power supply electrode for supplying the 帛2 inspection signal to the second circuit, sometimes That is, the second inspection signal is received by the power receiving electrode. At this time, since the circuit facing the power receiving electrode that receives the second inspection signal is short-circuited with the second circuit, it is possible to easily specify that the circuit system is short-circuited and short-circuited. [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. [Example of substrate to be inspected] Referring to Fig. 1 and Fig. 2, the J plate 12 is inspected. The unfinished substrate 12, 4 is incompletely completed. The substrate is inspected, and the inspection device 10 is used to inspect the substrate to be inspected, such as a glass substrate plate for a liquid crystal display panel, and has a plurality of (in the illustrated example, six 10 * 1306157 panels of the substrate are not damaged) In the circuit area, after the element is formed, the liquid crystal field 0 can be used to be inspected, and the substrate 12 is placed on each of the line regions of the rectangular glass plate 14 having flexibility, and has a plurality of first circuits 16 and a side by side. Side by side: multiple The 2 circuit is electrically insulated by a transparent insulating layer (not shown) provided between the ... and the second circuit. The circuit 16' is spaced apart from the glass plate 14 in the second direction. Extended over the flute
说彳… 伸於第2方向’第2電路18則在與玻璃 板14平行之面内, “够 於與第1方向父又之第2方向相距間 而延伸於第1方向。 18均係導電性線路圖案之一部 緣層積層為第2電路18較第1 第1及第2電路16及 分(亦即線路),且透過該絕 電路16更靠玻璃板14側。 [感測器基板之實施例] 檢查裝置1 0包含感測器基板2〇。 如圖3所示,感測器基板2〇,係於長方形玻璃板36 形成有具備後述之複數個感測器電路⑼的感測 。電路群22、至少兩個之供電電極24及26m 態連接於感測器電路38之端子的複數個端子%、以及^ 2-形態連料供電餘24及26的至少兩個 供電電極2…6’係於玻璃板36之長邊方向(圖示 开:中為第1方向)呈長帶狀形狀,且於第^方向相距間隔 形成於玻璃板36之寬度方向(圖示之例中為第… 11 1306157 端部。 圖示之例中,供電電極24 向(在圖3中A亡士 士人 刀別具有於第1方 圖中為左右方向)連續之中央區 從中本卩坫26a、以及 、-域24a及26a寬度方向之各 間隔且突出於篦7 , + m π弟1方向相距 及26b。第2方向(在圖3中為上下方向)的凸部- 又电电極In other words, the second circuit 18 extends in the second direction and is parallel to the second direction of the first direction and extends in the first direction. The edge layer of one of the circuit patterns is such that the second circuit 18 is closer to the first and second circuits 16 and the sub-circuits (that is, the lines), and passes through the insulating circuit 16 on the side of the glass plate 14. [Sensor substrate EMBODIMENT OF THE INVENTION The inspection device 10 includes a sensor substrate 2A. As shown in Fig. 3, the sensor substrate 2 is formed by a rectangular glass plate 36 having sensing electrodes (9) having a plurality of sensor circuits (9) to be described later. The circuit group 22, the at least two power supply electrodes 24 and 26m are connected to the plurality of terminals % of the terminals of the sensor circuit 38, and the at least two power supply electrodes 2 of the form-connected power supply ports 24 and 26... 6' is formed in a long strip shape in the longitudinal direction of the glass plate 36 (the first direction in the drawing: the middle direction), and is formed in the width direction of the glass plate 36 at intervals in the second direction (in the illustrated example, No. 11 1306157 End. In the example shown, the power supply electrode 24 is oriented (in Figure 3, the A sergeant knife has the first pattern) In the left-right direction, the continuous central region is spaced from the width direction of the center 26a, and the - domains 24a and 26a and protrudes from the 篦7, +m π1 direction and 26b. The second direction (in FIG. 3) Convex for the up and down direction - electric electrode
|小Μ仰州1心电桠28在第1方向與第2 方向相距間隔之方式,於玻璃板丄 、第 形忐心見度万向中央區域 &‘、、、鋸w狀,且區分成與供電電極24或26以―對一妒 悲對應之兩個電極群。 ' y 係與所對應之供 以能接收來自所 示之例中,為了 方向之各受電電 24b或26b的位 在第1方向之各受電電極28之位置, 電電極24或%在第i方向之位置一致, =應之供電電極2“戈26之檢查訊號。圖 提高檢查訊號之收發送的確實性,在第丄 極28之位置,係設為在同一方向之凸部 置。 端子30,係於第丄方向相距間隔形成於破璃板%寬 度方向的另-端部。端子32及34,係分別形成於第1方 向之端子30配置區域一端部及另一端部的外區域。 供電電極24及26,係分別以線路39及4〇連接於端 子32及34,各受電電極28則以線路41連接於所對應之 感測器電路3 8。 各端子30,如參照圖4而後述般,係藉由線路44連 接於感測H電路38之任-端子。端子3〇, 32及34,連接 12 1306157 於具可撓性之複數個扁平纜線42之任一線路。 如圖 4 # 4 /、,感測器電路群22之各感測器電路3 8, 八備場校型4膜電晶體46、―端連接於電晶體46之源電 極的負載電阻48、以及_端連接於電晶體Μ《源電極與 負載電阻48之間的輸出二極體50。 ’、 感貝丨器電路38之輸出訊號’係在對所對應之供電電極 24或26供應檢查訊號時依序被後述之控制裝置78讀取’ 且在控制裝置78用认命% ^ 8用於電路16之良莠判定及不良位置之特 定。 電晶體46之閘電極藉由線路41連接於所對應的供電 極28,負載電阻48之另一端藉由線路44連接於端子3〇, 輸出二《 50之另_端藉由另—線路44連接於端子3〇。 二目對於此,電晶體46之汲電極,係藉由内部線路W鱼另 -電晶體46之沒電極共通連接於接地電極。|小Μ Yangzhou 1 ECG 28 is spaced apart from the 2nd direction in the first direction, in the glass plate 丄, the first 忐 忐 万 万 万 万 万 万 万 万 万 万Divided into two electrode groups corresponding to the supply electrode 24 or 26 in a one-to-one relationship. The y system corresponds to the position in which the respective receiving electrodes 24b or 26b for the direction are in the position of the respective power receiving electrodes 28 in the first direction, and the electric electrodes 24 or % are in the ith direction. The position is the same, = the power supply electrode 2 "go 26 check signal. The figure improves the accuracy of the check signal transmission, at the position of the second pole 28, is set to the convex portion in the same direction. Terminal 30, The ends are formed at the other end portions in the width direction of the glass plate at intervals in the second direction. The terminals 32 and 34 are formed in the outer regions of the one end portion and the other end portion of the terminal 30 arrangement region in the first direction. 24 and 26 are connected to terminals 32 and 34 by lines 39 and 4, respectively, and each power receiving electrode 28 is connected to corresponding sensor circuit 38 by line 41. Each terminal 30 will be described later with reference to Fig. 4 . Connected to any of the terminals of the sense H circuit 38 by means of a line 44. Terminals 3A, 32 and 34, and 12 1306157 are connected to any of a plurality of flexible flat cables 42. 4 /,, each sensor circuit of the sensor circuit group 22 3 8, eight field calibration 4 The transistor 46, the load resistor 48 whose terminal is connected to the source electrode of the transistor 46, and the _ terminal are connected to the transistor Μ "the output diode 50 between the source electrode and the load resistor 48.", the sensor circuit The output signal of 38 is read by the control device 78, which will be described later, when the inspection signal is supplied to the corresponding power supply electrode 24 or 26, and is used for the good judgment of the circuit 16 by the control device 78. The gate electrode of the transistor 46 is connected to the corresponding supply electrode 28 via the line 41, and the other end of the load resistor 48 is connected to the terminal 3〇 via the line 44, and the output of the other 50 is terminated by In addition, the line 44 is connected to the terminal 3A. For this purpose, the tantalum electrode of the transistor 46 is commonly connected to the ground electrode by the internal electrode W and the electrode of the capacitor 46.
、表垃至少一個端子3〇係接地用端子,且藉由任一線路52 連接於上述接地電極。 Z 感測器電路群22,可兹λ八* ** „ 藉由公知之薄膜半導體積體電踗 之裝造技術與供電電極24, 26、檢測電極28、端子 34、線路39,40,41,44一起製作於玻璃板36下面。,, 被檢查基板12與感測器基板2〇,係以感測器電 位於被檢查基板12之形成有電群22 Λ <面側、且供Φ 電極24, 26與受電電極28在電路16之長邊方向 式彼此對向,相對被檢查基夺反12維持 # m)。 \叫丨承G(例如5〇 13 1306157 上述狀態下,被檢查基板12與感測器基板2 0,係於 電路16之長邊方向相對移動。被檢查基板12與感測器基 板20之相對移動,可是連續或間歇進行。 [檢查方法之實施例] 如圖6至圖8所示,受電電極28在第!方向之配置間 距,係電路16在同一方向之配置間距的兩倍以上(在圖示 之例中為12倍)。因此’在被檢查基板12與感測器基板20 鲁 相對移動之期間,至少一個受電電極28係與一個電路16 對向’另—至少一個受電電極28則不與任一個電路1 6對 向。 在被檢查基板12與感測器基板20如上所述般相對移 動之期間’交流之檢查訊號係交互反覆供應至供電電極24 及26。藉此’交流之檢查訊號即於各電路16被誘發,反 覆進行斷線、彼此短路、交叉短路之有無及用以特定該等 不良位置的檢查。 _ 所有感測器電路3 8之輸出訊號,係在檢查訊號供應至 供電電極24之期間’被後述之控制裝置78依序讀取至少 一次來用於判定電路16的良莠,且在檢查訊號供應至供 電電極26之期間,被控制裝置78依序讀取至少一次來用 於判定電路16的良II。 圖5(A)係顯示供應至供電電極24之檢查訊號波形例, 圖5(B),係供應至供電電極%之檢查訊號波形例。 圖5(C)至圖5(G) ’係顯示對感測器電路38之輸出訊 號進行整"IL而經波形整形後的訊號。不過,以下說明中, 14 l3〇6l 57 …、了谷易理解,係將 「處理訊號」。、圖 至圖5(G)所示之訊號單純稱為 供應至供雷曾权* λ 之檢查訊跋的招… 檢查訊號與供應至供電電極26 相位);:;:不率雖相同’但供應時序亦即供電時序(供電 應至供電電桎26過,供應至供電電極24之檢查訊號與供 匕土仏电電極2 6之檢杳邙% . ^ 铽查訊谠,亦可具有不同頻率。 右电路16正常,與兮雷改κ ★丄人 ' μ電路16對向之受電電極28即會 接收檢查訊號,與該夸雷 1賞 ^ ^ ^ ^ . 參28對應之感測器電路 二既疋時序亦即受電時序(受電 的訊號。 必1 有Λ唬」 由於檢查訊號不會被未與 接收,固I兮够, 、電路16對向之受電電極28 目此與該〇電電極28對應之感測 會以應輸出訊號之時序(亦即受 的訊號。 于序)輸出表不「有訊號」 猎由上述兩個條件,可判定 常」。 电塔16目刖之位置為正 圖5(C),係顯示用以處理受電電極 電極24斜麻之雷搞我aa i (係屬於與供電 电往μ對應之電極群的受電電極28 之又電電極)之收訊訊號之感測器電路3 理訊號。 所輸出訊號的處 圖5(D),係顯示用以處理受電電 電極26對應之電極群的受電電極2 (係屬於與供電 之受電電極)之收訊訊號之感測器電:電路16對向 理訊號。 δ所輸出訊號的處 15 1306157 不過如圖6中以符號54顯示之斷線位置般,當電路 。斷線時,檢查訊號即不會到達與該電路1 6a對向之受 電電極28&。其結果,與該受電電極28a對應之感測器電 ,38即不會以應輸出訊號之時序(亦即供電時序)輸出表示 「有訊號」之訊號(為圖5(E)中以虛線所示之處理訊號輸 β係表示無訊號」之訊號)。藉此,即能判定「電路 1 6已斷線」。 “圖5(Ε) ’係顯示用以處理受電電極28a(係屬於與供電 電極24對應之電極群的受電電極28中、與已斷線之電路 對向之又電電極)之收訊訊號之感測器電路3 8所輪出 訊號的處理訊號。 如圖7中以符號56所示之短路圖案般,當至少兩個電 路16b,16b因短路圖案%而短路時,不與任一電路“對 向且對向於短路圖案56之受電電極28b即接收檢查訊號。 其結果,與受電電極28b對應之感測器電路38即輸出表 示「有訊號」之訊號(為圖5(F)所示之處理訊號)。據此, 即能判定「至少兩個電路1 6b彼此短路」。 如圖8中以符號58所示之短路位置般’當電路i6c與 至少一個電路18c呈短路時,與該電路16c對向之受電電 極28c即以不應接收訊號之時序(亦即非受電時序)接收經 由電路18c的檢查訊號。其結果,與受電電極28c對應之 感測器電路38即輸出表示「有訊號」之訊號(為圖5(g)所 示之處理訊號)。藉此,即能判定「電路16與18^交又短 路J ° 16 1306157 用以處理受電電極28(屬於與供電電極26對應之電極 群)之收訊訊號的感測器電路38,僅有其輸出用以表示「有 訊號」或「無訊號」之訊號的時序(亦即受電時序)方面, 與用以處理受電電極28(屬於與供電電極24對應之電極群) 之收訊訊號的感測器電路38不同,其他動作則相同。 如上所述,「電路16呈斷線、彼此短路或交又短路」 之判定,可從選自群組(包含在所對應之受電電極無收訊訊At least one terminal 3 is used as a grounding terminal, and is connected to the ground electrode by any line 52. Z sensor circuit group 22, which can be λ8*** „ by the well-known thin film semiconductor integrated circuit fabrication technology and power supply electrodes 24, 26, detection electrode 28, terminal 34, line 39, 40, 41 44 is fabricated under the glass plate 36. The substrate 12 to be inspected and the sensor substrate 2 are electrically connected to the substrate 12 to be inspected by the sensor to form an electric group 22 Λ < face side, and for Φ The electrodes 24, 26 and the power receiving electrode 28 oppose each other in the longitudinal direction of the circuit 16, and are opposite to the inspected base by 12 to maintain the #m). \"丨承承G (for example, 5〇13 1306157, the substrate to be inspected in the above state) 12 and the sensor substrate 20 are relatively moved in the longitudinal direction of the circuit 16. The relative movement of the substrate 12 to be inspected and the sensor substrate 20 may be performed continuously or intermittently. [Example of Inspection Method] FIG. As shown in FIG. 8, the arrangement pitch of the power receiving electrodes 28 in the + direction is twice or more than the arrangement pitch of the circuit 16 in the same direction (12 times in the illustrated example). Therefore, the substrate 12 to be inspected is During the relative movement of the sensor substrate 20, at least one power receiving electrode 28 is connected to a circuit 16 The opposite-at least one power receiving electrode 28 is not opposed to any one of the circuits 16. During the period in which the substrate 12 to be inspected and the sensor substrate 20 are relatively moved as described above, the 'interrogation signal of the alternating current is alternately supplied to The power supply electrodes 24 and 26, by means of the 'AC test signal, are induced in each circuit 16, and are repeatedly disconnected, shorted to each other, cross-shorted, and inspected to identify such defective positions. _ All sensor circuits The output signal of 3 8 is used for the determination of the circuit 16 by the control device 78 described later in sequence during the period when the inspection signal is supplied to the power supply electrode 24, and is supplied to the power supply electrode 26 at the inspection signal. During this period, the controlled device 78 sequentially reads at least once to determine the good II of the circuit 16. Fig. 5(A) shows an example of the waveform of the inspection signal supplied to the power supply electrode 24, and Fig. 5(B) shows the supply to the power supply. Example of the inspection signal waveform of the electrode %. Fig. 5(C) to Fig. 5(G) ' show the signal after the waveform is shaped by the integral signal of the sensor circuit 38. However, in the following description, 14 l3〇6l 57 ... In the case of Gu Yi, the signal is “processing signal”. The signal shown in Figure 5(G) is simply called the inspection signal supplied to Lei Zengquan* λ... Check signal and supply to power supply electrode 26 Phase);:;: The rate is the same 'but the supply timing is the power supply timing (the power supply should be connected to the power supply 26, the inspection signal supplied to the power supply electrode 24 and the inspection of the supply electrode 24) ^ 铽 铽 谠 谠 谠 谠 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 ' ^ ^ . The corresponding sensor circuit 2 of the reference 28 is the timing, that is, the power receiving timing (the signal received). Since the check signal is not received and received, the circuit 16 is opposite to the power receiving electrode 28, and the sensing corresponding to the battery electrode 28 is based on the timing of the output signal ( That is, the signal received. In the order of the output table, there is no "signal". The two conditions can be judged by the above two conditions. The position of the electric tower 16 is shown in FIG. 5(C), which shows that the power receiving electrode 24 is used to process the oblique electrode of the power receiving electrode 24, and it is the power receiving electrode 28 of the electrode group corresponding to the power supply to μ. The sensor circuit 3 of the receiving signal of the electric electrode). FIG. 5(D) of the output signal shows the sensor power for processing the receiving signal of the power receiving electrode 2 (which belongs to the power receiving electrode of the power supply) for the electrode group corresponding to the power receiving electrode 26: circuit 16 To the RX. The output signal of δ is 15 1306157. However, as shown in Figure 6, the position of the broken line shown by symbol 54 is used as the circuit. When the line is broken, the check signal does not reach the power receiving electrode 28& which is opposite to the circuit 16a. As a result, the sensor power corresponding to the power receiving electrode 28a does not output a signal indicating "signal" at the timing of the output signal (ie, the power supply timing) (as shown by the dotted line in FIG. 5(E). The processing signal shown in the figure is β signal indicating no signal. Thereby, it can be determined that "the circuit 16 is disconnected". "Fig. 5 (Ε)' shows the reception signal for processing the power receiving electrode 28a (which is the electric electrode opposite to the circuit that is disconnected from the electrode group 28 corresponding to the electrode group corresponding to the power supply electrode 24). The processing signal of the signal that is rotated by the sensor circuit 38. As shown by the short-circuit pattern shown by the symbol 56 in FIG. 7, when at least two circuits 16b, 16b are short-circuited due to the short-circuit pattern %, they are not associated with either circuit. The power receiving electrode 28b that is opposite and opposite to the short-circuit pattern 56 receives the inspection signal. As a result, the sensor circuit 38 corresponding to the power receiving electrode 28b outputs a signal indicating "signal" (the processing signal shown in Fig. 5(F)). Accordingly, it can be determined that "at least two circuits 16b are short-circuited with each other". When the circuit i6c is short-circuited with at least one of the circuits 18c as shown by the short-circuit position shown by the symbol 58 in FIG. 8, the power receiving electrode 28c opposite to the circuit 16c is at a timing at which the signal should not be received (that is, the timing of the non-power receiving timing) Receiving a check signal via circuit 18c. As a result, the sensor circuit 38 corresponding to the power receiving electrode 28c outputs a signal indicating "signal" (the processing signal shown in Fig. 5(g)). Thereby, it can be determined that "the circuit 16 and the 18^ are connected and short-circuited J ° 16 1306157 for processing the received signal of the power receiving electrode 28 (the electrode group corresponding to the power supply electrode 26), only the sensor circuit 38 The timing of outputting the signal with "signal" or "no signal" (that is, the timing of receiving power) is outputted, and the sensing signal for processing the receiving electrode 28 (the electrode group corresponding to the power supply electrode 24) is sensed. The circuit 38 is different, and the other actions are the same. As described above, the determination that the circuit 16 is disconnected, shorted or shorted to each other can be selected from the group (including the corresponding power receiving electrode without receiving the signal)
號之時點、在所對應之受電電極之收訊訊號從有變化成無 之時點、在所對應之受電電極之收訊訊號從無變化成 時點、以及該等組合之時點)之至少一個時點來進行。 斷線之電路16a、彼此短路之電路16b及i6b、交叉短 :之電路16c&18c等,係能在判定為斷線、彼此短路、 父叉紐路時’從第1方向中感測器基板2〇與被檢查基板12 之相對位置亦即座標值(例如第1方向中電路16或受電電 極28之位置、亦即電路16 ^ 飞又電電極28之編號)來加以 将疋。 電路16之不良位置 第2方向中感測器基板 如第2方向中受電電極 座標值)來加以特定。 ’能從判$ 4「電路為+良」時之 0與被檢查基板12之相對位置(例 8與被檢查基板12或電路16的 如上所述,不良電路與 為不良」時之第2方向中感 之相對位置來加以·特定。 具體而言,電路在長邊 不良位置,能從判定為「電路 測器基板20與被檢查基板12 方向之斷線位置,可從選自群 17 1306157 組(包含在叉電電極28無收訊訊號時應以受電電極28接收 之檢查訊號從有變化成無之時點,以及在€電電極Μ之 收訊訊號從無變化成有之時點)之至少一個時點之第2方向 中感測益基板20與被檢查基板12之相對位置(亦即座標值) 來加以特定。 [感測器基板之另一實施例] 參照圖9及圖10,感測器基板60,係取代圖3所示之 感測器基板20之供電電極24及26,將各與受電電極28 • 以一對一形態對應之複數個供電電極62,以在第丄方向與 第2方向相距間隔之方式設於玻璃板14之寬度方向一端 部。 圖不之例中’受電電極62在第1方向之配置間距,係 電路16在同一方向之配置間距的兩倍以上(在圖示之例中 為4倍)。因此,供電電極62係區分為各四個之電極群。 以下,當表示各電極群之供電電極62時,係分別稱為 「第1供電電極62」、「第2供電電極62」、「第3供 籲電電極62」或「第4供電電極62」。 感測器基板60,係取代圖3所示之感測器基板2〇之 端子32及34,各包含具有第1,第2,第3及第4端子的 兩組端子64及64。一組及另一組之端子64及64,分別 形成於第1方向中端子3〇之配置區域一端部及另—端At the time of the number, at the time when the receiving signal of the corresponding receiving electrode changes from at least one point, at the time when the receiving signal of the corresponding receiving electrode is changed from no change point, and the time of the combination get on. The circuit 16a for disconnection, the circuits 16b and i6b which are short-circuited to each other, and the circuit 16c & 18c which are short-circuited, etc., can be used as the sensor substrate from the first direction when it is determined that the wire is broken, shorted to each other, or the parent fork The position relative to the substrate 12 to be inspected, that is, the coordinate value (for example, the position of the circuit 16 or the power receiving electrode 28 in the first direction, that is, the number of the circuit 16 and the electrode 28) is used. The defective position of the circuit 16 is specified in the sensor substrate in the second direction as the power receiving electrode coordinate value in the second direction. 'The relative position of 0 to the substrate 12 to be inspected when the circuit is judged to be "good" (the eighth direction when the defective circuit is defective as described above in Example 8 and the substrate 12 to be inspected or the circuit 16) Specifically, the relative position of the middle sense is specified. Specifically, the circuit can be determined from the position of the disconnection of the circuit board 20 and the substrate 12 to be inspected from the defective position of the long side, and can be selected from the group selected from group 17 1306157. (included at least one of the time when the inspection signal received by the power receiving electrode 28 is changed from no change to the time when the fork electrode 28 is not received, and when the receiving signal of the electric electrode is changed from no change to the time) In the second direction of the time point, the relative position (ie, the coordinate value) of the sensing substrate 20 and the substrate 12 to be inspected is specified. [Another embodiment of the sensor substrate] Referring to FIG. 9 and FIG. 10, the sensor The substrate 60 replaces the power supply electrodes 24 and 26 of the sensor substrate 20 shown in FIG. 3, and the plurality of power supply electrodes 62 corresponding to the power receiving electrodes 28 in a one-to-one manner in the second direction and the second direction. The direction of the spacing is set to the width of the glass plate 14 In the example of the drawing, the arrangement pitch of the power receiving electrode 62 in the first direction is twice or more than the arrangement pitch of the circuit 16 in the same direction (four times in the illustrated example). Therefore, the power supply electrode 62 is divided into four electrode groups. Hereinafter, when the power supply electrodes 62 of the respective electrode groups are shown, they are referred to as "first power supply electrode 62", "second power supply electrode 62", and "third supply power". The electrode 62" or the "fourth power supply electrode 62". The sensor substrate 60 is replaced by the terminals 32 and 34 of the sensor substrate 2 shown in FIG. 3, each having the first, second, third, and third Two sets of terminals 64 and 64 of the four terminals. One set and the other set of terminals 64 and 64 are respectively formed at one end portion and the other end of the arrangement region of the terminal 3〇 in the first direction.
外區域Q 各組之第丨,第2,第3及第4端子,分別與第丨,第 2,第3及第4供電電極對應’且共通連接於第丨,第\第 18 1306157 3及第4供電電極62。又,供電電極62,係進—步區分成 與一組端子64對應之大電極群、以及與另一組端子64對 應之大電極群。 大電極群之第!,第2,第3及第4供電電極62, 分別藉&-組第丨’第2’第3及第4線路66共通連接於 所對應之-組第i,第2,第3及第4端子64。另—大電 極群之第1,m 3及第4供電電極62,則分別藉由 另一組第1,第2,第3及第4線路66共通連接於另一組 端子64。 不過’亦可取代如上述之將供電電極62區分成大電極 群來連接於兩組端子64之方式,設置一組第丨,第2 3及第4端子“,再將第^第2,第3及第4供電電極以 分別共通連接於該一組第!,第2,第3及第4端子“。 …在使用感測H基板6〇之檢查時,被檢查基板Η與感 測器基板6 0相對移動於電路16 j砂莉孓龟路16之長邊方向的期間中,檢 查訊號係每隔-定時間依序供應至第1,第2第3及第4 供電電極62。 弟 將檢查訊號供應至供電電極62之順序雖可為任意,但 例如亦可係從位於第!方向一端侧之電極至位於另一端側 的順序。藉此,可間歇地反覆 極以。 反覆將檢查椒應至各供電電 電路16之斷線、雷Λ , ^ 辦篆電路16之彼此短路、電路16, 18之 父又紐路、以及不良位置 , ^ 座标 Γ藉由與感測器基板20 中之該等構件相同的手㈣散或特定。 19 .1306157 [感測器基板之另* 實施例] 如圖9及圖1〇所示,感測器基板6〇,可包含對電路18 供應交流檢查訊號之至少一個供電電極68、以及連接於供 電電極68之端子70。 以下,將供電電極62及68分別稱為第}及第2供電 :極’將供應至第!及第2供電電極的檢查訊號分別稱為 第1及第2檢查訊號。用以供應至第2供電電極68之第2 檢查sfl號係交流之連續訊號。第!及第2檢查訊號可為相 同頻率或不同頻率。 在具備第2供電電極68之感測器基板6〇進行檢查時, 被檢查基板12與感測器基板6〇相對移動於電路16之長 邊方向的期間中,第1檢查訊號係每隔一定時間依序反覆 ’、應至第1供電電極’同時第2檢查訊號則連續供應至第 2供電電極68。 枳電路16之斷線、電路16之彼此短路、不良位置之座 杯可藉由與感測器基板20中之該等構件相同的手法來 罨路16, 18之彼此短路可藉由以下方式判定。 圖中以符號72所示之短路位置般,當電路bd is.至小 . 夕固電路184呈短路時,與該電路16d對向之受雷 電極 2 R Η 人 會以不應接收訊號之時序(亦即非受電時序)接收 第2檢查訊號。 上述之結果,當短路位置72位於供電電極62盥受 之間且供電電極62與受電電極28d對向之期間 中,與党電電極28d對應之感測器電路38係持續輸出表 20 1306157 不「有訊號」之訊號。藉此,即能判定「電路16d與18d 為路I 。 短路位置72,可從當感測器電路38輸出表示「有訊 號」之訊號時之感測器基板60與被檢查基板12之相對位 置來加以特定。 [檢查裝置之電路實施例] 參照圖11,檢查裝置1 〇係使用圖3所示之感測器基 板20。The second, third, and fourth terminals of each group of the outer region Q correspond to the third, third, and fourth power supply electrodes, respectively, and are commonly connected to the third, the first 18th 1816157 3 and The fourth power supply electrode 62. Further, the power supply electrode 62 is further divided into a large electrode group corresponding to one set of terminals 64 and a large electrode group corresponding to the other set of terminals 64. The largest electrode group! The second, third, and fourth power supply electrodes 62 are commonly connected to the corresponding group i, second, third, and third by the & group 丨 '2nd, third, and fourth lines 66, respectively. 4 terminals 64. Further, the first, m 3 and fourth power supply electrodes 62 of the large electrode group are commonly connected to the other set of terminals 64 by another set of the first, second, third and fourth lines 66, respectively. However, instead of dividing the power supply electrode 62 into a large electrode group and connecting it to the two sets of terminals 64 as described above, a set of the third, second, and fourth terminals ", and then the second, the second, The third and fourth power supply electrodes are commonly connected to the first, third, third, and fourth terminals of the group. When the inspection of the H substrate 6 is performed, the inspection substrate Η and the sensor substrate 60 are relatively moved in the longitudinal direction of the circuit 16 j. The predetermined time is sequentially supplied to the first, second, third, and fourth power supply electrodes 62. The order in which the inspection signal is supplied to the power supply electrode 62 may be arbitrary, but for example, it may be located at the first! The order from the electrode on one end side to the other end side. Thereby, the poles can be repeatedly reversed. Repeatedly, it will check the disconnection of the pepper to each power supply circuit 16, the Thunder, the short circuit of the circuit 16 of the circuit, the father and the circuit of the circuit 16, 18, and the bad position, ^ coordinates by means of sensing The same hand (four) of the components in the substrate 20 are scattered or specified. 19 .1306157 [Another embodiment of the sensor substrate] As shown in FIG. 9 and FIG. 1A, the sensor substrate 6A may include at least one power supply electrode 68 for supplying an AC check signal to the circuit 18, and connected to Terminal 70 of power supply electrode 68. Hereinafter, the power supply electrodes 62 and 68 will be referred to as the first and second power supply: the poles will be supplied to the first! The inspection signals of the second power supply electrodes are referred to as first and second inspection signals, respectively. The second inspection sfl for supplying to the second power supply electrode 68 is a continuous signal of the alternating current. The first! And the second check signal can be the same frequency or different frequencies. When the sensor substrate 6 having the second power supply electrode 68 is inspected, the first inspection signal is always constant during the period in which the inspection substrate 12 and the sensor substrate 6 are relatively moved in the longitudinal direction of the circuit 16. The time is sequentially repeated 'to the first power supply electrode' while the second inspection signal is continuously supplied to the second power supply electrode 68. The disconnection of the circuit 16 and the short circuit of the circuit 16 and the defective cup can be short-circuited to each other by the same method as the components in the sensor substrate 20, which can be determined by the following means . In the figure, as shown by the short-circuit position indicated by the symbol 72, when the circuit bd is. to the small circuit 184 is short-circuited, the lightning-receiving electrode 2 R opposite to the circuit 16d will not receive the signal. (ie, the non-powered timing) receives the second check signal. As a result of the above, when the short-circuit position 72 is located between the power supply electrode 62 and the power supply electrode 62 and the power receiving electrode 28d, the sensor circuit 38 corresponding to the party electrode 28d continues to output the table 20 1306157. There is a signal" signal. Thereby, it can be determined that "the circuits 16d and 18d are the path I. The short-circuit position 72 can be from the relative position of the sensor substrate 60 and the substrate 12 to be inspected when the signal indicating the "signal" is output from the sensor circuit 38. To be specific. [Circuit Embodiment of Inspection Apparatus] Referring to Fig. 11, the inspection apparatus 1 uses the sensor substrate 20 shown in Fig. 3.
檢查裝置10,進一步包含用以產生交流檢查訊號的檢 查讯號產生器電路74、用以切換應連接於檢查訊號產生器 電路74之供電電極24,26的切換電路76、用以控制各種 電路及機械裝置且處理訊號的控制裝置78、由控制裝置Μ 所控制而將各種資料顯示成可目視的顯示裝置8〇、用以驅 動後述之搬送裝置的驅動裝置82、用以儲存各種資料的記 憶體84、以及用以切換應連接於控制裝置78之感測器電 路3 8 (參照圖3 )的切換電路8 6。 檢查訊號’係具有較切換電路76及%之切換頻率短 之頻率的高頻率訊號。此種檢查訊號’係在被檢查基板Η 與感測器基板20相對移動之期間,藉由切換電路%交互 反覆供應至供電電極24, 26。 切換電路76,在檢查訊號供應至供電電極^之期間, 係依序切換連接於受電電極28(屬於與該供電電極Μ對應 之群組)之感挪器電路3 8來佶1# ’ 來使八連接於控制裝置78,在檢 查讯號供應至供電電極26之 期間係依序切換連接於供 21 • 1306157 電電極28之感測器電路38(屬於與該供電電極24對應之 群組)來使其連接於控制裝置7 8。 一切換電路86之切換頻率係較切換電路76之切換頻率 局。切換電路76及86之切換’係藉由控制裝置78所供 應之矩形波狀切換訊號來控制。 切換電路76及86之切換頻率,例如係在檢查訊號供 應至供電電極24之期間、可被控制裝置78依序讀取至少 Γ次所有感測器電4 38之輸出訊號的值,且係在檢查訊 號供應至供電電極26 > & M -r、1 电电牷26之期間、可被控制裝置78依序讀取 至少一次所有感測器電路38之輸出訊號的值。 控制裝置78,係-邊控制切換電路%來將檢查訊號 供應至供電電極24或26,一邊控制切換電路%來依序操 取感測器電路38之輸出訊號(亦即收訊訊號),將操取之收 訊訊號和基板與被檢查基板之相對座標一起暫存於記憶體 8 4 〇 儲存於記憶體84之收訊訊號,係在控制裝置78用於 疋電路16之斷線及有無短路(亦即電路之良莠),且用於 特疋不良位置’將該等f料依各電路及不良位置儲存於記 憶體84,並顯示於顯示裝置。 驅動裝置82,係驅動後述之搬送裝置。該搬送裝置, 係以感測器電路群22位於被檢查基板12之形成有電路16, 18之面側、且供電電極24, %與受電電極28在電路“之 長邊方向刀離的方式使被檢查基板12與感測器基板2〇彼 此對向,且使被檢查基板12與感測器基板2〇相對被檢查 22 * 1306157 基板12維持既定間隙G之狀態下,使被檢查基板η與感 測器基板20相對移動於電路丨6的長邊方向。 參照圖12說明上述檢查電路之電路良筹的判定法。圖 ^係顯示根據—個感測器電路38之輸出訊號的判定法流 程圖’而根據另-感測器電路38之輸出訊號的判定亦以 同樣順序進行。 …檢查之進行方式,係使被檢查基板12與感測器基板2〇 k電路16之待檢查區域一端相對連續移動至另一端,同 日守將檢查訊號交互供應至供電電極24及26。 在使被檢查基板12與感測器基板20相對移動前,係 進行特定出與電路16對向之收訊電極28、並決定與正規 電路對向之收訊電極28的處理。 上述作業之進行方式,係在使感測器基板2 〇位於電路 16之檢查區域一端的狀態下,將檢查訊號交互供應至供電 電極24及26,並確認此時接收檢查訊號的受電電極28。 該受電電極28至少在第!方向的座標值,係作為正規電 路之座標位置儲存於記憶體84。 其次’控制裝置78,係擷取一個感測器電路38之輸 出號’且確認此時在第1方向之感測器基板2〇及被檢 查基板12之相對位置(亦即座標值),再與已確認所擷取之 訊號的相對位置一起儲存於記憶體(步驟i〇〇)。 感測器基板20及被檢查基板12在第1方向之相對位 置’例如可係電路16或受電電極28在第1方向之位置(亦 即電路或受電電極的編號)、以及受電電極28及被檢查基 23 1306157 板1 2在第2方向之相對位置(亦即座標值)。 其次,控制裝置78,判定是否符合供電時序為a 電時序為A、或供電時序為B且受電時序為欠 形(步驟1 〇 1)。 種情 時序A及B ’係分別將檢查訊號供應至供 电电極24 及26的時序。其係因檢查訊號係交互供 电€極24 %。因此,可藉由步驟101來判定原時點之供電鱼成 時序的關係。 /、又電 當步驟HH中之判定結果為「是」(供電與受電時序— 致)時,㈣裝f 78,即#定該電路是否為正規電路(步驟 1〇2)。藉由此步驟102,來判定原時點是否為應判定連接 於受電電極28(與正規電路對向)之感測器電路38 訊號的時序。 别出 當步驟102中之判定纟士罢炎「β & 列疋。果為是」(為連接於受電電極 28(與正規電路對向)之感測器雷 a』窃电路38之輸出訊號的判定時 序,亦即正規電路之判定時序)眸 叮斤)吋,控制裝置78即判定是 否已輸入「有訊號」之訊號「牛现1λλ、 現(步驟1〇3)。藉由此步驟1〇3 來確認電路1有無斷線。 當步驟103中之判定結果^「Η 禾為疋」(已輸入「有訊號」 之訊號)時’控制裝置78,g卩划〜τ ia 即士]疋正規電路目前之位置為 正常,並返回步驟i 00,以蒋 ^ t 至·人—訊號之操取及座標值 之確認等處理。 當步驟103中之判定& 「 之釣疋、、、。果為「否」(未輸入「有訊號」 之訊號)時,控制裝置78,即划—「 即判定「正規電路已斷線」, 24 * 1306157 並將已斷線之要旨與該斷線位置之庙沪 m置您厓钚值一起寫入記憶體 84後,返回步驟ι〇〇(步驟1〇4)。 當步驟1〇2中之判定結果為「否」(並非正規電路之位 置)時’控制裝置78即判定是否已輸入「有訊號」之訊號(步 驟105)。藉由此步驟1〇5可確認電路16之彼此短路。The inspection device 10 further includes an inspection signal generator circuit 74 for generating an AC inspection signal, a switching circuit 76 for switching the power supply electrodes 24, 26 to be connected to the inspection signal generator circuit 74, and for controlling various circuits and The control device 78 for mechanically processing the signal, and the control device 控制 control the various materials to be displayed as a visual display device 8A, a driving device 82 for driving a transfer device to be described later, and a memory for storing various materials. 84. A switching circuit 86 for switching the sensor circuit 38 (refer to FIG. 3) to be connected to the control device 78. The check signal is a high frequency signal having a frequency shorter than the switching frequency of the switching circuit 76 and %. The inspection signal is supplied to the power supply electrodes 24, 26 alternately by the switching circuit % while the substrate under inspection Η and the sensor substrate 20 are relatively moved. The switching circuit 76 sequentially switches the sensor circuit 38 connected to the power receiving electrode 28 (the group corresponding to the power supply electrode 佶) 佶1# ' during the period in which the inspection signal is supplied to the power supply electrode ^. 8 is connected to the control device 78, and sequentially switches the sensor circuit 38 (which belongs to the group corresponding to the power supply electrode 24) for the 21/1306157 electric electrode 28 during the period when the inspection signal is supplied to the power supply electrode 26. It is connected to the control device 78. The switching frequency of a switching circuit 86 is lower than the switching frequency of the switching circuit 76. The switching of switching circuits 76 and 86 is controlled by a rectangular wave switching signal provided by control device 78. The switching frequency of the switching circuits 76 and 86 is, for example, the value of the output signal of all the sensor powers 4 38 that can be read by the control device 78 during the period when the inspection signal is supplied to the power supply electrode 24, and is tied to During the period when the check signal is supplied to the power supply electrodes 26 >& M - r and 1 , the output signal of all the sensor circuits 38 can be read by the control device 78 at least once. The control device 78 controls the switching circuit % to supply the inspection signal to the power supply electrode 24 or 26, and controls the switching circuit % to sequentially operate the output signal (ie, the reception signal) of the sensor circuit 38. The received signal and the substrate and the opposite coordinates of the substrate to be inspected are temporarily stored in the memory 84. The received signal stored in the memory 84 is used by the control device 78 for the disconnection of the circuit 16 and the presence or absence of a short circuit. (that is, the circuit is good), and it is used for the special defective position 'These materials are stored in the memory 84 according to the respective circuits and the defective position, and are displayed on the display device. The drive device 82 drives a transfer device to be described later. In the transfer device, the sensor circuit group 22 is placed on the surface of the substrate 12 to be inspected on which the circuits 16 and 18 are formed, and the power supply electrode 24, % and the power receiving electrode 28 are cut away in the longitudinal direction of the circuit. The inspected substrate 12 and the sensor substrate 2 are opposed to each other, and the inspected substrate 12 and the sensor substrate 2 are inspected relative to each other. 22 * 1306157 The substrate 12 is maintained at a predetermined gap G, so that the inspected substrate η and The sensor substrate 20 is relatively moved in the longitudinal direction of the circuit board 6. The circuit determination method of the above-described inspection circuit will be described with reference to Fig. 12. Fig. 2 shows the flow of the determination method based on the output signal of the sensor circuit 38. The decision of the output signal according to the other-sensor circuit 38 is also performed in the same order. The inspection is performed in such a manner that the substrate under inspection 12 and the end of the region to be inspected of the sensor substrate 2〇k circuit 16 are opposite. Continuously moving to the other end, the same day, the inspection signal is alternately supplied to the power supply electrodes 24 and 26. Before the substrate 12 to be inspected and the sensor substrate 20 are relatively moved, the receiving electrode 28 corresponding to the circuit 16 is specified. ,and The processing of the receiving electrode 28 opposite to the normal circuit is performed. The above operation is performed by alternately supplying the inspection signal to the power supply electrode 24 while the sensor substrate 2 is placed at one end of the inspection region of the circuit 16. 26, and confirming the power receiving electrode 28 that receives the inspection signal at this time. The coordinate value of the power receiving electrode 28 at least in the ! direction is stored in the memory 84 as a coordinate position of the regular circuit. Next, the control device 78 takes one The output number of the sensor circuit 38 is 'and the relative position (i.e., the coordinate value) of the sensor substrate 2〇 and the substrate 12 to be inspected in the first direction is confirmed, and the opposite of the signal that has been confirmed is confirmed. The positions are stored together in the memory (step i〇〇). The relative position of the sensor substrate 20 and the substrate 12 to be inspected in the first direction can be, for example, the position of the circuit 16 or the power receiving electrode 28 in the first direction (ie, the circuit) Or the number of the power receiving electrode), and the relative position (ie, the coordinate value) of the power receiving electrode 28 and the substrate 12 to be inspected in the second direction (ie, the coordinate value). Next, the control device 78 determines whether or not the power supply is met. The power timing is A, or the power supply timing is B and the power receiving timing is under-form (step 1 〇1). The timing series A and B' respectively supply the timing of the inspection signal to the power supply electrodes 24 and 26. Because the check signal is interactively powered by 24%. Therefore, the relationship between the power supply and the timing of the original time can be determined by step 101. /, and the result of the determination in step HH is "Yes" (power supply and power receiving timing) - (c), (4) Install f 78, that is, whether the circuit is a regular circuit (step 1〇2). By this step 102, it is determined whether or not the original time point is the timing at which the sensor circuit 38 signal connected to the power receiving electrode 28 (opposite the normal circuit) should be determined. Don't judge the gentleman's smear in the step 102. "β & 疋 疋. If yes" (the output of the sensor thief circuit 38 connected to the power receiving electrode 28 (opposite the regular circuit) The timing of the signal determination, that is, the timing of the determination of the normal circuit), the control device 78 determines whether the signal "with signal" has been input. "The cow is now 1λλ, now (step 1〇3). By this step 1〇3 to confirm the circuit 1 is disconnected. When the result of the determination in step 103 is “Η禾为疋” (the signal with “signal” has been input), the control device 78, g卩~τ ia is the judge]目前 The current position of the regular circuit is normal, and return to step i 00, and the processing is performed by the operation of Jiang to the human-signal and the confirmation of the coordinate value. When it is determined in step 103 that "the fishing rod, ", " is "No" (the signal with no signal is input), the control device 78, that is, "" determines that the "regular circuit has been disconnected" , 24 * 1306157 After writing the gist of the disconnection and the temple of the disconnection position to the memory 84 together with the value of the cliff, return to step ι〇〇 (step 1〇4). When the decision result in the step 1〇2 is "NO" (not the position of the regular circuit), the control means 78 determines whether or not the "signal" signal has been input (step 105). By this step 1〇5, it can be confirmed that the circuits 16 are short-circuited to each other.
當步驟1〇5中之判定結果為「是」(已輸入「有訊號」 之訊號)時,控制裝置78即判定為彼此短路,並將其要旨 與該彼此短路位置之座標值—起寫人記㈣84後返回 步驟⑽,以移至次-感測器電路38之輸出訊號之擷取、 座標值之確認等處理。 當步驟則之判定結果為「否」(未輸入「有訊號」 之訊號)時,控制裝置78即判定「目前之位置為正常」, 返回步驟100。 當步驟101中之判定結果為「否」(供電與受電時序不 一致)時,控制裝置78,即判定是否已輸入「有訊號」之 訊號(步驟107)。 藉由此步驟107,不論供電與受電時序是否不一致(不 是正規電路之位置),均會判定是否已輸入「有訊號」之訊 號’亦即判定電路1 6是否呈交又短路。 當步驟107中之判定結果為「是」(已輸入「有訊號」 之訊號)時,控制裝置78即將已交叉短路之要旨與該該交 叉短路位置之座標值一起儲存於記憶體84後,返回步驟 100,以移至次一訊號之擷取及座標值之確認等處理(步驟 108)。 25 1306157 當步驟107中之判定結果為「否」(未輸入「有訊號 之訊號)時’控制裝置78即判定「目前之位置為正常 返回步驟100。 電路16之異常位置有時會及於複數位置。因此,即使 在使被檢查基板12與感測器基板20相對移動之期間中發 現電路之異常位置,上述檢查亦在使被檢查基板與感 測器基板20從電路之被檢查區域一端移動至另一端的期 間反覆進行。 ’When the result of the determination in step 1〇5 is YES (the signal with the signal is input), the control device 78 determines that the short circuit is short-circuited with each other, and the key value of the short-circuited position of each other is the same as the coordinate value. After (4) 84, the process returns to step (10) to move to the output of the secondary-sensor circuit 38, the coordinate value confirmation, and the like. When the result of the determination is "NO" (the signal with the signal is not input), the control device 78 determines that "the current position is normal" and returns to step 100. When the decision result in the step 101 is "NO" (the power supply and the power receiving timing do not coincide), the control unit 78 determines whether or not the "signal" signal has been input (step 107). By this step 107, regardless of whether the power supply and the power receiving timing are inconsistent (not the position of the regular circuit), it is determined whether the "signal signal" signal has been input, that is, whether the decision circuit 16 is submitted and shorted. When the result of the determination in step 107 is YES (the signal with the signal is input), the control device 78 stores the gist of the cross short circuit together with the coordinate value of the cross short-circuit position in the memory 84, and returns. In step 100, the processing is performed by moving to the next signal and confirming the coordinate value (step 108). 25 1306157 When the result of the determination in step 107 is "NO" (when the signal with signal is not input), the control device 78 determines that "the current position is normal return step 100. The abnormal position of the circuit 16 may sometimes be plural. Therefore, even if an abnormal position of the circuit is found during the relative movement of the substrate 12 to be inspected and the sensor substrate 20, the above inspection moves the substrate to be inspected and the sensor substrate 20 from the end of the region to be inspected of the circuit. The period to the other end is repeated.'
[檢查裝置之構造實施例] 參照圖13至圖18,檢查裝置1〇,進一步包含發揮用 以支撐該檢查裝置10之各種機械裝置之支撐台作用的框 架13〇、用以將被檢查基板12搬送於左右方向的搬送裝置 132、用以檢測來自被檢查基板12之電氣訊號的檢測頭亦 即感測器基板20、用以進行被檢查基板12之交換的一對 交換裝置136、以及用以進行—交換裝置136所承接之被 檢查基板12之定心的定心裝置138。 框架"0’收納有:測試器部14〇’係根據來自感測器 :板加之電氣訊號,確認電路之斷線及短路、不良位置(座 才丁值)等並加以儲存;以及控制部142,係控制設於檢查裝 置10之各種機械裝置。 :达裝置132’包含在上下方向(z方向)相距間隔而往 向(X方向)平行延伸的一對第i搬 =方向相距間隔而往左右方向平行延伸:一對;:: 146第1及第2搬送構件144及146,分別形成 26 *1306157 m 第1及第2搬送部。 第1及第2搬送構件144及146,係藉由空氣之噴射 及吸引來將平板狀構件維持於既定高度位置、或在維持之 狀態下進行搬送的周知裝置。此種搬送構件,係以壓力真 空板(PV板)之類的商品名稱在市場上販賣。 第1搬送構件144,係配置於以搬送裝置132搬送被 檢查基板12之搬送方向中的上游侧,俾藉由將空氣喷射 向被檢查基板12且吸引被檢查基板12之搬送空間的空 氣,來將被檢查基板12維持於從感測器基板2〇往下方分 離之第1搬送位置並進行搬送。 第2搬送構件146,係配置於被檢查基板12之搬送方 向的下游側,俾藉由將空氣喷射向被檢查基板12且吸引 被檢查基板12之搬送空間的空氣,來將被檢查基板12維 持於從感測器基板20往下方略微分離之第2搬送位置並 進行搬送。 φ 第1搬送位置,係所搬送之被檢查基板12從感測器基 板20分離距離較大、被檢查基板12與感測器基板之 下面成平行搬送的位置。感測器基板2〇之下面與第1搬 送位置之間隔’係於感測器基板2〇至第2搬送位置之尺 寸 '或於說明於後之扁平纜線42厚度尺寸加上5〇"m之 值以上的尺寸,例如可設為100 " m以上。 第2搬送位置’係較第1搬送位置接近感測器基板2〇 之位置且係將被檢查基板12與感測器基板2〇之下面成平 5搬送的位置。感測器基板2〇之下面與第2搬送位置之 27 1306157 間隔,可設為被檢查基板12從感測器基板2〇分離5〇"m 左右之位置。 被檢查基板12從第1搬送位置搬送至第2搬送位置的 搬运路,係發揮使被檢查基板12本身彎曲之彎曲搬送路 的作用。 如上所述,欲將被檢查基板12維持於第丨或第2搬送[Configuration Example of Inspection Apparatus] Referring to FIGS. 13 to 18, the inspection apparatus 1A further includes a frame 13A that functions as a support table for supporting various mechanical devices of the inspection apparatus 10, and serves to inspect the substrate 12 to be inspected. a transport device 132 transported in the left-right direction, a sensor substrate 20 for detecting an electrical signal from the substrate 12 to be inspected, a pair of switching devices 136 for performing exchange of the substrate to be inspected, and A centering device 138 that is centered on the substrate 12 under inspection by the exchange device 136 is performed. The frame "0' contains: the tester unit 14〇' is based on the electrical signal from the sensor: board, confirms the disconnection and short circuit of the circuit, the bad position (seat value), etc.; and the control unit 142. Controls various mechanical devices provided in the inspection device 10. The reaching device 132' includes a pair of i-th moving directions extending in parallel in the vertical direction (z direction) and extending in the X direction (X direction), and extending in parallel in the left-right direction: a pair; :: 146 first and The second transport members 144 and 146 form 26*1306157 m first and second transport units, respectively. The first and second conveying members 144 and 146 are known devices that hold the flat member at a predetermined height position or carry it in a state of being maintained by air injection and suction. Such a conveying member is sold on the market under the trade name of a pressure vacuum plate (PV plate). The first conveying member 144 is disposed on the upstream side in the conveying direction in which the conveying device 132 conveys the inspection target substrate 12, and is configured to suck air into the inspection substrate 12 and suck the air in the conveyance space of the inspection substrate 12. The substrate 12 to be inspected is held at the first transport position separated from the sensor substrate 2 to the lower side and transported. The second transfer member 146 is disposed on the downstream side in the transport direction of the inspection target substrate 12, and the air to be inspected is maintained by ejecting air to the inspection substrate 12 and sucking the air in the transport space of the inspection substrate 12. The second transfer position that is slightly separated from the sensor substrate 20 is transported. φ The first transport position is a position at which the substrate 12 to be inspected is separated from the sensor substrate 20 by a large distance, and the substrate under test 12 and the lower surface of the sensor substrate are transported in parallel. The distance between the lower surface of the sensor substrate 2 and the first transfer position is 'the size of the sensor substrate 2 〇 to the second transfer position' or the thickness of the flat cable 42 described later is 5 〇" The size of m or more may be, for example, 100 " m or more. The second transport position is a position closer to the sensor substrate 2A than the first transport position and is a position where the underlying substrate 12 and the sensor substrate 2 are flattened. The lower surface of the sensor substrate 2 is spaced apart from the second transfer position by 27 1306157, and the inspection substrate 12 can be separated from the sensor substrate 2 by a position of about 5 〇 " m. The conveyance path of the inspection substrate 12 conveyed from the first conveyance position to the second conveyance position functions as a curved conveyance path for bending the inspection substrate 12 itself. As described above, the substrate 12 to be inspected is to be maintained at the second or second transport.
位置來進行搬送,例如只要將空氣之噴射量及吸引量在上 下搬送構件相異即可。 卜上侧之第1搬送構件144之下游端部下面,與下側之 第2搬送構件146之上游端部上面係對向。又,上側之第 及第2搬送構件144 & 146,係於左右方向具有間隔, 以使感測器基板20可位於兩者之間。 上述之結果,被檢查基板12,當從第i搬送構件⑷ 之基板搬送路移行至第2搬送構件146之基板搬送路時, 即會如圖16所示’從第1搬送位置彎曲至第2搬送位置、 亦即從大幅離開感測器基板 基板20的位置。 板2G之位置相至接近感測器 下側之第1及第2搬送椹彳生,,,„ 料構件144及146,以往被檢 土板12之搬送方向延伸之 〜 加μ、 方式女裝於底板148(安裝於: 相對於此’上側之第1及第2搬送構件144 146’係安裝於門型組裝裝置15〇(安裝於框架13〇上卜 組裝裝置150,具備於框年 夾於A系130女裝成將感測器基板: t 間隔而延伸於左右方向狀態 對支撐構件152、用以遠蛀 " 連、、、。兩支撐構件152之複數個 28 •1306157 構件1 5 4、以及個別結合於該等連結構件1 5 4之複數個 結合構件15 6。 圖示之例中’連結構件154設有五個,結合構件ι56 設有三個。上側之第丨及第2搬送構件144及146分別安 裝於結合構件156。於剩下之結合構件156安裝有感測器 基板20。The conveyance is performed at a position. For example, the amount of air to be injected and the amount of suction may be different between the upper and lower conveyance members. The lower end portion of the downstream end portion of the first conveying member 144 on the upper side is opposed to the upper surface of the upstream end portion of the lower second conveying member 146. Further, the upper and second transfer members 144 & 146 are spaced apart in the left-right direction so that the sensor substrate 20 can be positioned therebetween. As a result of the above, when the substrate to be inspected is transferred from the substrate transfer path of the i-th transfer member (4) to the substrate transfer path of the second transfer member 146, as shown in FIG. 16, it is bent from the first transfer position to the second. The transport position, that is, the position from the sensor substrate substrate 20 is largely removed. The position of the plate 2G is close to the first and second conveyances of the lower side of the sensor, and the material members 144 and 146 are extended in the direction in which the soil plate 12 is transported in the past. The bottom plate 148 (the first and second conveying members 144 146' attached to the upper side of the bottom plate 148 is attached to the door type assembling device 15A (attached to the frame 13A), and is attached to the frame assembly device 150. The A-series 130 is a sensor substrate: t is spaced apart from the left-right direction to the support member 152, and is used to look at a plurality of support members 152. 28 • 1306157 members 1 5 4 And a plurality of coupling members 156 that are individually coupled to the coupling members 154. In the illustrated example, there are five coupling members 154, and three coupling members ι56. The upper second and second conveying members 144. And 146 are respectively attached to the coupling member 156. The remaining coupling member 156 is mounted with the sensor substrate 20.
搬送裝置132,尚包含:一對保持具機構,係抵接於 被檢查基板12之側緣部來共同把持該被檢查基板12;以 及對保持具移動機構,係與此等保持具機構分別對應, 使所對應之保持具機構同步移動於左右方向。 分別由保持具機構及保持具移動機構構成之兩組機 構,係將被檢查基板12之搬送路夾於其間、在前後方向 相距間隔’且配置練帛13G ±。此等保持具機構及保持 具移動機構,係構成用以輔助第】及第2搬送構件"4及 146對被檢查基板12之搬送的輔助搬送裝置^8。 各保持具機構,包含:支撐盖 之搬送路外側延伸於左右;·:構:數=被檢查基板12 此抵接於被檢查基板12前後方向之_部< 右方向相距間隔支律於支揮構件16〇 4 係使支撐構…動於前後方向,俾使基板=二 可進出被檢查基板12側緣部之移動路。 Ί、 一保持具機構之各基板保持 持具機構之基板保持具162之— 與另一保持具機構之基板保持具 具I62,係形成與另一保 個在前後方向相對向、且 162之一個—起在前後方 29 1306157 向相對向之基板保持具的組或對β 各基板保持具162’係藉由使其可移動於上下方向之 上下移動機構166來安裝於支撐構件16()。圖示之例中, ^上下移動機構166係—線性馬達,其具備於支撐構件16〇 、4上下方向延伸之狀態的線性軌(亦即固定 件)心(參照圖18)、以及以可上下動之方式結合於線性軌 166a的可動體(亦即可動件)166b。 各基板保持具1 62係安裝於線性馬達之可動體1 66b。 各基板保持具1 62之最下端位置,被安裝於線性馬達之線 性導件166a的擋件168(參照圖18)限制。各基板保持具 162,具有隨著往前後方向之移動而承接被檢查基板Η側 緣部的橫v字形凹處170(參照圖18)。 致動器164,在圖示之例中,係伸縮於前後方向之氣 壓或油壓式汽缸機構。致動器i 64,其汽缸本體支撐於保 持具移動機構’且活塞桿結合於支撐構件16〇。 各保持具機構,尚包含複數個桿丨72,係從支撐構件丄6〇 往與被檢查基板側緣部相反之側延伸;以及襯套i74,係 供該桿172貫通成可移動於前後方向。各保持具機構,在 襯套174中支撐於保持具移動機構,且可藉由該保持具移 動機構移動於左右方向。 保持具移動機構,具備將被檢查基板12之搬送路夾於 其間之在前後方向相距間隔的一對致動器176。致動器^ % 在圖示之例t係一線性馬達,其具備於框架13〇安裝成往 左右方向延伸之狀態的線性軌(亦即固定件)176a、以及以 1306157 可移動於左右方向之方式結合於線性執l76a的線性軌(亦 即可動件m6b。致動器164及襯套174切於線性軌ma。 /輔助搬送裝置158,係在圖14中之左端部的待機位置 待機。在此待機位置中’基板保持具162,係從被檢查基 板12之搬送路離開。 上述待機位置中,輔助搬送裝置158,藉由致動器164 使支擇構件16G移動向被檢查基板12。藉此,基板保持具 162即被移動至被檢查基板12之搬送路,並把持交換裝置 136上之被檢查基板12,以承接該被檢查基板a。 當承接被檢查基板12時,輔助搬送裝置,即在以基板 保持八1 62把持被檢查基板J2之狀態下,藉由致動器丄% 從圖14中左方往右方移動,藉此將被檢查基板Μ搬送至 圖Η中之右端部。在此位置時,基板保持具162係被移 動至被檢查基& 12之搬送路夕卜,而放開被檢查基板12。 輔助搬送裝置158對基板之把持及其解除係使兩保 持”機構之對向基板保持具丨62之組往彼此靠近及離開之 方向移動’俾使其進出被檢查基板i 2側緣部的移動路, 藉此來進行。藉此,即可確實進行基板保持具162對被檢 查基板之把持及其解除。 被檢查基板12之搬送結束後,輔助搬送裝置158即返 回待機位置。 在被檢查基板12之搬送途中,各基板保持具ι62,在 從第1搬送構件i 44之基板搬送路移行至第2搬送構件146 之基板搬送路時,係對應從第1搬送位置往第2搬送位置 31 1306157 之被檢查基板12的彎曲,读 # 透過上下移動機構166而上升 藉此,被檢查基板12可確實地彎曲。 如圖16所示,各总巫嫩 扁+纜線42,其一端部固接於感測 器基板20下面之最上漉相,丨Α山& 桴側鈿°Ρ,且另一端部透過感測器 基板20與位於其上游側之拋 側之搬送構件144之間拉出至感測 器基板20上方。各爲平纖砼”, 合倆十纜線42之另一端部,係連接於圖 1 4所示之測試器部!4〇。The transport device 132 further includes a pair of holder mechanisms that abut against the side edge portion of the substrate 12 to be inspected to collectively hold the substrate 12 to be inspected, and a holder moving mechanism that corresponds to the holder mechanism , the corresponding holder mechanism is synchronously moved in the left and right direction. Each of the two sets of mechanisms, which are constituted by the holder mechanism and the holder moving mechanism, sandwiches the conveyance path of the substrate 12 to be inspected, and is spaced apart from each other in the front-rear direction and is placed at a level of 13G ±. The holder mechanism and the holder moving mechanism constitute an auxiliary conveying device 8 for assisting the conveyance of the substrate 12 to be inspected by the first and second conveying members <4 and 146. Each of the holder mechanisms includes: the outer side of the conveying path of the support cover extends to the right and left; ·: the number of the substrate = the substrate to be inspected 12 which is in contact with the front and rear direction of the substrate 12 to be inspected, and the right direction is spaced apart from the branch The swing member 16〇4 causes the support structure to move in the front-rear direction, so that the substrate=two movable paths that can enter and exit the side edge portion of the substrate 12 to be inspected.基板, the substrate holder 162 of each substrate holding holder of the holder mechanism and the substrate holder I62 of the other holder mechanism are formed to be opposite to each other in the front-rear direction, and one of 162 The group or the pair of substrate holders 162' that are opposed to the substrate holders at the front and rear sides 29 1306157 are attached to the support member 16 by moving them in the up and down direction up and down movement mechanism 166. In the illustrated example, the up-and-down moving mechanism 166 is a linear motor including a linear rail (that is, a fixing member) in a state in which the supporting members 16A and 4 extend in the vertical direction (see FIG. 18), and The movable mode is coupled to the movable body (i.e., movable member) 166b of the linear rail 166a. Each of the substrate holders 1 62 is attached to a movable body 1 66b of the linear motor. The lowermost position of each of the substrate holders 1 62 is limited by a stopper 168 (see Fig. 18) attached to the linear guide 166a of the linear motor. Each of the substrate holders 162 has a lateral V-shaped recess 170 (see Fig. 18) that receives the side edge portion of the substrate to be inspected in accordance with the movement in the front-rear direction. The actuator 164 is a pneumatic or hydraulic cylinder mechanism that expands and contracts in the front-rear direction in the illustrated example. The actuator i 64 has a cylinder body supported on the holder moving mechanism ' and a piston rod coupled to the support member 16'. Each of the holder mechanisms further includes a plurality of rods 72 extending from the support member 丄6 to the side opposite to the side edge portion of the substrate to be inspected, and a bushing i74 for allowing the rod 172 to pass through to move in the front-rear direction . Each of the holder mechanisms is supported by the holder moving mechanism in the bushing 174, and is movable in the left-right direction by the holder moving mechanism. The holder moving mechanism includes a pair of actuators 176 that are spaced apart from each other in the front-rear direction with the conveyance path of the substrate 12 to be inspected sandwiched therebetween. Actuator ^ % In the example shown in the figure, a linear motor is provided which is provided with a linear rail (i.e., a fixing member) 176a that is attached to the frame 13A so as to extend in the left-right direction, and is movable in the left-right direction by 1306157. The mode is combined with the linear rail of the linear actuator 16a (i.e., the movable member m6b. The actuator 164 and the bushing 174 are cut to the linear rail ma. / the auxiliary conveying device 158 is in standby at the left end of the drawing in Fig. 14. In the standby position, the substrate holder 162 is separated from the conveyance path of the substrate 12 to be inspected. In the standby position, the auxiliary conveyance device 158 moves the control member 16G toward the substrate 12 to be inspected by the actuator 164. Here, the substrate holder 162 is moved to the conveyance path of the substrate 12 to be inspected, and the substrate 12 to be inspected on the exchange device 136 is held to receive the substrate a to be inspected. When the substrate 12 to be inspected is received, the auxiliary conveyance device is In other words, in a state where the substrate to be inspected J2 is held by the substrate, the actuator 丄% is moved from the left to the right in FIG. 14 to transport the substrate to be inspected to the right end of the figure. In this position, base The plate holder 162 is moved to the conveyance path of the inspection base & 12, and the inspection substrate 12 is released. The auxiliary conveyance device 158 holds and lifts the substrate to hold the opposite substrates of the two holding mechanisms. The group of the crucibles 62 moves in the direction of approaching and leaving each other to move in and out of the side path of the side surface of the substrate to be inspected i 2 , thereby performing the substrate holder 162 on the substrate to be inspected. After the transfer of the substrate 12 to be inspected is completed, the auxiliary transfer device 158 returns to the standby position. During the transfer of the substrate 12 to be inspected, each substrate holder ι 62 is transported from the substrate of the first transfer member i 44. When the road is moved to the substrate conveyance path of the second conveyance member 146, the inspection of the substrate 12 to be inspected from the first conveyance position to the second conveyance position 31 1306157 is performed, and the reading # is transmitted through the vertical movement mechanism 166 to be inspected. The substrate 12 can be surely bent. As shown in Fig. 16, each of the total sapphire + cable 42 has one end fixed to the uppermost phase of the lower surface of the sensor substrate 20, and the 丨Α山& And the other end It is pulled out over the sensor substrate 20 through the sensor substrate 20 and the transfer member 144 on the upstream side of the upstream side. Each is a flat fiber, and the other end of the two cables 42 is connected. In the tester section shown in Figure 14.4〇.
-交換裝置136與定心|置138,係配置於搬送裝置132 之基板搬送路的最上游側’另一交換裝置136,則配置於 搬送裝置132之基板搬送路的最下游側。 各父換裝置136,係一使被檢查基板12升降的公知裝 置,其藉由升降機構(未圖示)使複數個升降銷180升降, 以進行搬送裝置132及搬送用機器人(未圖示)對被檢查基 板12的交換。 各交換裝置136,係以使升降銷18〇下降之狀態待機, 藉由使升降銷180上升,來從機器人、作業人員或搬送裝 置132承接被檢查基板12,並藉由使升降銷18〇下降來將 被檢查基板12移交至搬送裝置丨32、機器人或作業人員。 定〜裝置138,係藉由移動機構(未圖示)使複數個定心 銷182向一交換裝置136所承接之被檢查基板12的中心 移動,藉此來進行被檢查基板12之定心的公知裝置。料 由此定心裝置13 8來對被檢查基板12進行對準。 定心裝置138,當交換裝置136進行被檢查基板ι2之 交換時,係使定心銷182展開(待機),當進行被檢查基板 32 1306157 12之定心時,即使定心銷182往中心側移動。 檢查裝置1 0係以下述方式作動。 各基板保持具162,退離至不妨礙被檢查基板12之交 換及定心的位置。 在上述狀態下,被檢查基板12’藉由機器人或人手搬 送至配置於圖14中左端部之交換裝置136的上方。此狀 態下,該交換裝置136即使升降銷180上升,將基板12 承接於升降銷180。The switching device 136 and the centering device 138 are disposed on the most upstream side of the substrate transport path of the transport device 132. The other exchange device 136 is disposed on the most downstream side of the substrate transport path of the transport device 132. Each of the parent-changing devices 136 is a known device that raises and lowers the substrate 12 to be inspected, and the plurality of lift pins 180 are lifted and lowered by a lifting mechanism (not shown) to carry out the transport device 132 and the transport robot (not shown). Exchange of the substrate 12 to be inspected. Each of the exchange devices 136 stands by in a state where the lift pins 18 are lowered, and the lift pins 180 are raised to receive the substrate 12 to be inspected from the robot, the worker, or the transfer device 132, and the lift pins 18 are lowered. The inspected substrate 12 is handed over to the transport device 32, the robot, or the worker. The fixed device 138 moves the center of the substrate 12 to be inspected by a moving mechanism (not shown) to the center of the substrate 12 to be inspected by the switching device 136, thereby performing centering of the substrate 12 to be inspected. A known device. The centering device 13 8 is thereby aligned with the substrate 12 to be inspected. The centering device 138 expands (standby) the centering pin 182 when the switching device 136 performs the exchange of the substrate to be inspected 136. When the centering of the substrate 32 1306157 12 to be inspected is performed, even if the centering pin 182 is centered mobile. The inspection device 10 operates in the following manner. Each of the substrate holders 162 is retracted to a position that does not interfere with the exchange and centering of the substrate under inspection 12. In the above state, the substrate 12 to be inspected is transported by a robot or a human hand to the upper side of the switching device 136 disposed at the left end portion of Fig. 14 . In this state, the exchange device 136 receives the substrate 12 to the lift pin 180 even if the lift pin 180 is raised.
其次’定心裝置138,使定心銷182往彼此靠近之方 向移動來進行被檢查基板12的定心後,在使定心銷1 § 2 移動至彼此離開之方向的狀態下待機。 其次,搬送裝置132使輔助搬送裝置158往被檢查基 板12移動’以基板保持具162把持該被檢查基板I:。至 此時為止,基板保持具162即被移動至既定高度位置、例 如抵接於槽件1 6 8的位置。 其次,搬送裝置132,在上述狀態下藉由輔助搬送裝 置158將被檢查基板12從圖14令左方搬送至右方。 被檢查基板12,亦可從輔助搬送裝置158之搬送途中 藉由第1搬送構件144來搬送。藉此,被檢查基板η,可 在維持於從感測器基板20大幅分離之第1搬送位 其次:被檢查基板12之搬送,係從辅助搬送裝置158 及第1搬送構件144之搬送、錄品鮭 心微送鉍過輔助搬送裝置158與第 1及第2搬送構件144及 、 6之搬送、再移至輔助搬送裝 33 • 1306157 置158及第2搬送構件ία之搬送。 藉此,被檢查基板12,如前所述般,即可在彎曲搬送 路彎曲,且藉由輔助搬送裝置158及第2搬送構件146在 維持於接近感測H基板2G之第2搬送位置的㈣下進行 搬送。 上述彎曲搬送路,係形成於包含左右方向中與感測器 基板20配置位置對應之區域的至少一部分處,且形成於 鲁供電電極24及26與受電電極28之配置位置的上游側處。 因此,與扁平纜線42連接於感測器電路38配置位置上游 側之感測器基板20處這點相呼應,被檢查基板12,係在 接觸於扁平纜線42之狀態下在彎曲搬送路及其後之搬 送路進行搬送。 +各基板保持具162,當在上述彎曲搬送路移動時,係 藉由上下移動機構166上升以追隨被檢查基板12的彎曲 變形二藉此,被檢查基板12可在彎曲搬送路確實地彎曲。 • 第2搬送位置’係形成將被檢查基板12與感測器電路 38成平行搬送的平行搬送路。此平行搬送路,係從被檢查 基^ 12之電路16到達感測器基板20之供電電極24及26 ”又電電極28下方之位置的前方位置開始形成。 由於平仃搬送路形成於上述位置,因此被檢查基板12 命電路1 6在到達感測器基板2〇之供電電極及%與受 二電極28下方前,係與供電電極24及%與受電電極μ 。仃移位,以該狀態在供電電極24及%與受電 8 之下方移動。 34 1306157 上述之結果,當被檢查基板12 甘上 < 合電路1 6在感測器 基板20之供電電極24及26與受電雷搞π 又€電極28下方移動時, 即可和感測器基板20之供電電極2 Μ及26與受電電極28 正確地對向。 當被檢查基板12之各電路16在感測器基板2q之供電 電極24及26與受電電極28下方移動的期間,係反覆進 行使用檢查訊號之上述檢查。Then, the centering device 138 moves the centering pin 182 toward each other to center the substrate to be inspected, and then stands by while the centering pin 1 § 2 is moved in a direction away from each other. Next, the conveying device 132 moves the auxiliary conveying device 158 to the substrate 12 to be inspected, and holds the substrate to be inspected by the substrate holder 162. Up to this point, the substrate holder 162 is moved to a predetermined height position, for example, to a position of the groove member 168. Next, in the above-described state, the conveyance device 132 conveys the inspection target substrate 12 to the right from the left side of Fig. 14 by the auxiliary conveyance device 158. The substrate 12 to be inspected may be transported by the first transport member 144 during transport from the auxiliary transport device 158. In this way, the substrate η to be inspected can be transported from the auxiliary transport device 158 and the first transport member 144, and the first transport position that is largely separated from the sensor substrate 20 can be transported. The product is conveyed by the auxiliary conveyance device 158 and the first and second conveyance members 144 and 6 and transferred to the auxiliary conveyance device 33 • 1306157 and the second conveyance member ία. In this way, the substrate 12 to be inspected can be bent in the curved conveyance path as described above, and the auxiliary conveyance device 158 and the second conveyance member 146 are maintained at the second conveyance position of the proximity sensing H substrate 2G. (4) Carrying out the transfer. The curved conveyance path is formed at least in a portion including a region corresponding to the position at which the sensor substrate 20 is disposed in the left-right direction, and is formed at an upstream side of the arrangement position of the power supply electrodes 24 and 26 and the power receiving electrode 28. Therefore, in response to the fact that the flat cable 42 is connected to the sensor substrate 20 on the upstream side of the arrangement position of the sensor circuit 38, the substrate 12 to be inspected is in a state of being in contact with the flat cable 42 in the curved conveyance path. And then the transport path is carried out. Each of the substrate holders 162 is moved by the vertical movement mechanism 166 to follow the bending deformation of the substrate 12 to be inspected when the bending conveyance path moves, whereby the inspection substrate 12 can be surely bent in the curved conveyance path. The second transport position is a parallel transport path that transports the substrate 12 to be inspected in parallel with the sensor circuit 38. The parallel transport path is formed from the circuit 16 of the test substrate 12 to the power supply electrodes 24 and 26" of the sensor substrate 20 and the position of the position below the electric electrode 28. The flat transport path is formed at the above position. Therefore, the substrate 12 to be inspected is shifted to the power supply electrode 24 and % and the power receiving electrode μ before reaching the power supply electrode of the sensor substrate 2 and before and under the second and second electrodes 28. Moving under the power supply electrodes 24 and % and the power receiving 8. 34 1306157 As a result of the above, when the substrate 12 to be inspected is bonded, the power supply electrodes 24 and 26 of the sensor substrate 20 are electrically connected to the power receiving electrodes. When the electrode 28 is moved under the electrode 28, the power supply electrodes 2 and 26 of the sensor substrate 20 and the power receiving electrode 28 are correctly opposed. When the circuits 16 of the substrate 12 to be inspected are on the power supply electrode 24 of the sensor substrate 2q. While the movement of the lower portion 26 and the power receiving electrode 28 is repeated, the above inspection using the inspection signal is repeated.
其次’當被檢查基板12搬送至配置於圖14中右端部 =交換裝S 136上方時’搬送裝置132之搬送即停止,該 交換裝置136則使升_ 18G上升來承接所搬送之被檢查 基板12。 其後,搬送裝置132返回待機位置及待機狀態。交換 裝置136所承接之被檢查基板12,即在其後藉由機器人或 人手從該交換裝置136取走。 以搬送裝置132搬送被檢查基板12之期間,基板保持 /、16 2之各組係抵接於被檢查基板12之側緣部來共同把 持被檢查基板12。藉此,至少可在與感測器基板2〇配置 位置對應之處,防止被檢查基板12之移動位置變化或被 檢查基板12之侧緣部相對中央區域移位。 第1及第2搬送構件144及146係在將被檢查基板12 維持於既定高度位置之狀態下搬送該被檢查基板12,在前 後方向相對向之基板保持具162係在把持被檢查基板12 之狀態下搬送該被檢查基板12。 不過’第1及第2搬送構件144及M6,亦可僅具備 35 1306157 將被檢查基板12、维持於既定高度位置的功能,而不具備 對該被檢查基板12賦予搬送力的功能。此時,檢杳 基板12之搬送力,係由基板保持具162來賦予。 一 承上所述’取代使用第1及第2搬送構件144及146 與搬送《⑸的搬送裝置132,亦可係具有其他構造及 功能的搬送裝置,如使用第!及第2搬送構件144及146 與輔助搬送裝置158之任一方的搬送裝置。Next, when the substrate 12 to be inspected is transported to the right end portion of FIG. 14 and the upper portion of the exchange device S 136, the transfer of the transport device 132 is stopped, and the switch device 136 raises the rise -18G to receive the substrate to be inspected. 12. Thereafter, the transport device 132 returns to the standby position and the standby state. The substrate 12 to be inspected by the switching device 136 is thereafter removed from the switching device 136 by a robot or a human hand. While the transfer device 132 is transporting the substrate 12 to be inspected, the respective groups of the substrate holding/16 are brought into contact with the side edge portions of the substrate 12 to be inspected to collectively hold the substrate 12 to be inspected. Thereby, at least the position of the substrate to be inspected can be prevented from changing at a position corresponding to the position where the sensor substrate 2 is disposed, or the side edge portion of the substrate 12 to be inspected can be displaced from the central portion. The first and second transfer members 144 and 146 transport the test substrate 12 while maintaining the substrate 12 to be inspected at a predetermined height position, and the substrate holder 162 facing the front and rear direction is attached to the substrate 12 to be inspected. The substrate 12 to be inspected is transported in a state. However, the first and second transfer members 144 and M6 may have only a function of maintaining the substrate 12 to be inspected at a predetermined height position, and do not have a function of imparting a transport force to the substrate 12 to be inspected. At this time, the conveyance force of the inspection substrate 12 is given by the substrate holder 162. In addition to the use of the first and second transport members 144 and 146 and the transport device 132 for transporting (5), it is also possible to use a transport device having other structures and functions. And a conveying device of any one of the second conveying members 144 and 146 and the auxiliary conveying device 158.
例如’取代以第i及第2搬送構件144及146將被檢 查基板12維持於既定高度位置之方式,亦可藉由使用複 數個滾輪或-條以上之無端皮帶的維持機構或搬送機構來 將被檢查基板12維持於既定高度位置。 ,感測器基板20及60,並不一定要將供電電極24, %、 又電電極28、%子30,32,34、感測器電路38等設於一個 玻璃板36。例如,亦可如圖19所示,將供電電極Μ」。 叉電電極28、端子3〇, 32, 34、感測器電路38等分割設於 複數個玻璃板36,並支撐於該等之適當構件184。 本發明並不限定於上述實施例,在不脫離其主旨的範 圍内可進行各種變更。 【圖式簡單說明】 圖1係顯示本發明之感測器基板與被檢查基板之關係 的俯視圖。 圖2係圖1之右側視圖。 圖3係顯示感測器基板一實施例的底面圖。 圖4係顯示感測器電路一實施例的圖。 36 1306157 圖5係顯示電氣訊號之波形的圖。 圖6係用以說明斷線之檢測方法例的圖。 圖7係用以說明彼此短路之檢測方法例的圖。 圖8係用以說明交叉短路之檢測方法例的圖。 圖9係顯示感測器基板另一實施例的底面圖。 圖10係顯示使用圖9所示之基板時之交叉短路一實施 例的底面圖。 圖11係顯示本發明之檢查裝置之電路一實施例的圖。 圖12係用以說明圖丨i之電路對斷線及短路之檢測方 法一實施例的圖。 圖13係顯示本發明之檢查裝置機械構造一實施例的前 視圖。 圖1 4係圖13所示之檢查裝置的俯視圖,係省略感測 器基板及搬送裝置—部分與支推該等之構件—部分的俯視 圖。 圖15係圖13所示之檢查裝置的右側視圖。 圖16係顯示搬送裝置及感測器基板之關係的放大前視 圖。 圖1 7係放大顯示保持具機構及保持具搬送機構一實施 例的俯視圖。 圖18係沿圖17之18— 18線所得的截面圖。 圖19係顯示感測器基板另一實施例的配置圖。 【主要元件符號說明】 10 檢查裝置 37 1306157For example, instead of maintaining the substrate 12 to be inspected at a predetermined height position by the i-th and second conveying members 144 and 146, a plurality of rollers or a maintenance mechanism or a conveying mechanism of the endless belt or more may be used. The substrate 12 to be inspected is maintained at a predetermined height position. For the sensor substrates 20 and 60, it is not necessary to provide the power supply electrodes 24, %, the electric electrodes 28, the % sub- 30, 32, 34, the sensor circuit 38, and the like to one glass plate 36. For example, as shown in FIG. 19, the power supply electrode may be turned "on". The fork electrode 28, terminals 3, 32, 34, sensor circuit 38, etc. are divided into a plurality of glass plates 36 and supported by the appropriate members 184. The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing the relationship between a sensor substrate of the present invention and a substrate to be inspected. Figure 2 is a right side view of Figure 1. 3 is a bottom plan view showing an embodiment of a sensor substrate. 4 is a diagram showing an embodiment of a sensor circuit. 36 1306157 Figure 5 is a diagram showing the waveform of an electrical signal. Fig. 6 is a view for explaining an example of a method of detecting a disconnection. Fig. 7 is a view for explaining an example of a detection method of short-circuiting each other. Fig. 8 is a view for explaining an example of a method of detecting a cross short circuit. Figure 9 is a bottom plan view showing another embodiment of the sensor substrate. Fig. 10 is a bottom view showing an embodiment of a cross short circuit when the substrate shown in Fig. 9 is used. Fig. 11 is a view showing an embodiment of a circuit of the inspection apparatus of the present invention. Fig. 12 is a view for explaining an embodiment of a method for detecting disconnection and short circuit of the circuit of Fig. i. Figure 13 is a front elevational view showing an embodiment of the mechanical construction of the inspection apparatus of the present invention. Fig. 14 is a plan view of the inspection apparatus shown in Fig. 13, which is a plan view showing a portion where the sensor substrate and the conveying device are partially omitted and the members are pushed. Figure 15 is a right side view of the inspection apparatus shown in Figure 13. Fig. 16 is an enlarged front elevational view showing the relationship between the conveying device and the sensor substrate. Fig. 1 is a plan view showing an embodiment of the holder mechanism and the holder conveying mechanism in an enlarged manner. Figure 18 is a cross-sectional view taken along line 18-18 of Figure 17. Figure 19 is a configuration diagram showing another embodiment of the sensor substrate. [Main component symbol description] 10 Inspection device 37 1306157
12 被檢查基板 14, 36 玻璃板 16, 18 電路 20, 60 感測器基板 22 感測器電路群 24, 26, 62 供電電極 28 受電電極 30, 32, 34 端子 36 感測器電路 30, 40, 41, 44 線路 42 扁平纜線 54 斷線位置 56 短路圖案 58 交叉斷線位置 130 框架 132 搬送裝置 136 交換裝置 138 定心裝置 144, 146 第1及第2搬送構件 148 底板 150 組裝裝置 158 輔助搬送裝置 160 支撐構件 162 基板保持具 38 1306157 164, 176 致動器 166 上下移動機構 168 擋件 170 凹處 172 桿 174 襯套 178 感測器電路12 Inspected substrate 14, 36 Glass plate 16, 18 Circuit 20, 60 Sensor substrate 22 Sensor circuit group 24, 26, 62 Power supply electrode 28 Power receiving electrode 30, 32, 34 Terminal 36 Sensor circuit 30, 40 , 41, 44 Line 42 Flat cable 54 Broken position 56 Short-circuit pattern 58 Cross-break position 130 Frame 132 Transfer device 136 Exchange device 138 Centering device 144, 146 First and second transfer members 148 Base plate 150 Assembly device 158 Auxiliary Transfer device 160 support member 162 substrate holder 38 1306157 164, 176 actuator 166 up and down movement mechanism 168 stop 170 recess 172 rod 174 bushing 178 sensor circuit
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2005
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CN1975447A (en) | 2007-06-06 |
KR100863986B1 (en) | 2008-10-16 |
CN100538379C (en) | 2009-09-09 |
JP2007147474A (en) | 2007-06-14 |
JP5276774B2 (en) | 2013-08-28 |
TW200732677A (en) | 2007-09-01 |
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