JP2000252657A - Heat dissipation unit for control apparatus - Google Patents
Heat dissipation unit for control apparatusInfo
- Publication number
- JP2000252657A JP2000252657A JP11050064A JP5006499A JP2000252657A JP 2000252657 A JP2000252657 A JP 2000252657A JP 11050064 A JP11050064 A JP 11050064A JP 5006499 A JP5006499 A JP 5006499A JP 2000252657 A JP2000252657 A JP 2000252657A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- motherboard
- housing
- heat dissipation
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、複数の電子部品を
実装する基板をマザーボードに実装してなる電子制御機
器等の制御機器の放熱装置に関するもので、特に、パワ
ー素子からの熱を効率良く放熱できる制御機器の放熱装
置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating device for a control device such as an electronic control device in which a substrate on which a plurality of electronic components are mounted is mounted on a motherboard. The present invention relates to a heat radiating device of a control device capable of radiating heat.
【０００２】[0002]
【従来の技術】従来、制御機器の放熱装置に関連する先
行技術文献としては、特開平８−１１１５７５号公報に
て開示されたものが知られている。このものでは、金属
基板上に半導体チップそのものを直接実装する所謂、ベ
アチップ実装し、その基板に設けられた位置決めピンを
マザーボード上の穴に挿入して組付けると共に、パワー
素子からの熱を放熱するための技術が示されている。2. Description of the Related Art Conventionally, as a prior art document related to a heat radiating device for a control device, there is known a document disclosed in Japanese Patent Application Laid-Open No. HEI 8-111575. In this device, a semiconductor chip itself is directly mounted on a metal substrate, so-called bare chip mounting, and positioning pins provided on the substrate are inserted into holes on the motherboard and assembled, and heat from the power elements is radiated. The technique for is shown.
【０００３】[0003]
【発明が解決しようとする課題】ところで、前述のもの
では、複数の電子部品が実装された基板は金属基板であ
るため、基板自身が放熱フィン（ヒートシンク）の機能
を備えてはいるが、自ずと基板の大きさには限界があ
り、基板に実装されたパワー素子からの熱を効率良く吸
収・発散させるに十分な熱容量が得られないという不具
合があった。By the way, in the above-mentioned device, since the substrate on which a plurality of electronic components are mounted is a metal substrate, the substrate itself has a function of a heat radiating fin (heat sink). There is a limit in the size of the substrate, and there is a problem that a heat capacity sufficient to efficiently absorb and diffuse heat from the power element mounted on the substrate cannot be obtained.
【０００４】そこで、この発明はかかる不具合を解決す
るためになされたもので、複数の電子部品が実装された
基板をマザーボード上に実装し筐体に収容した制御機器
の放熱装置であって、複数の電子部品のうちのパワー素
子からの発熱を効率良く吸収・発散させると共に、組付
作業を簡素化することが可能な制御機器の放熱装置の提
供を課題としている。In view of the above, the present invention has been made to solve such a problem, and is a heat radiating device for a control device in which a board on which a plurality of electronic components are mounted is mounted on a motherboard and housed in a housing. It is an object of the present invention to provide a heat radiating device for a control device capable of efficiently absorbing and radiating heat generated from a power element of the electronic component and simplifying an assembling operation.
【０００５】[0005]
【課題を解決するための手段】請求項１の制御機器の放
熱装置によれば、マザーボードが放熱部材にねじ止め固
定されると共に、放熱部材を介在させ筐体の内壁部位に
ねじ止め固定されることで、放熱部材に接合された基板
の発熱性を有する電子部品からの熱を直接、筐体側に確
実に熱伝導させ効率良く吸収・発散させることが可能と
なり放熱性が向上される。また、ねじ止め固定による組
付作業が同一方向からのみと簡素化され作業性が著しく
向上される。According to the heat radiating device of the control device of the first aspect, the mother board is screwed and fixed to the heat radiating member, and is screwed and fixed to the inner wall portion of the housing with the heat radiating member interposed. Thus, heat from the heat-generating electronic component of the substrate bonded to the heat radiating member can be reliably conducted directly to the housing side to efficiently absorb and radiate heat, thereby improving heat radiation. Further, the assembling work by screwing and fixing is simplified to only from the same direction, and workability is remarkably improved.
【０００６】請求項２の制御機器の放熱装置によれば、
マザーボードが筐体の蓋部材を伴って外側から放熱部材
にねじ止め固定されると共に、筐体の蓋部材を伴って外
側から放熱部材を介在させ共に筐体の内壁部位にねじ止
め固定されることで、放熱部材に接合された基板の発熱
性を有する電子部品からの熱を直接、筐体側に確実に熱
伝導させ効率良く吸収・発散させることが可能となり放
熱性が向上される。また、マザーボードは筐体の蓋部材
に接触してねじ止め固定されており、放熱部材に接合さ
れた基板の発熱性を有する電子部品からの熱を筐体の蓋
部材側にも熱伝導させることが可能となり放熱性が更に
向上される。そして、ねじ止め固定による組付作業が同
一方向からのみと簡素化され作業性が著しく向上され
る。According to the heat radiating device of the control device of the second aspect,
The motherboard is screwed and fixed to the heat radiating member from the outside with the lid of the housing, and the heat radiating member is interposed from the outside with the lid of the housing and screwed and fixed to the inner wall portion of the housing together. Thus, the heat from the heat-generating electronic components of the board joined to the heat-dissipating member can be directly and reliably conducted to the housing side and efficiently absorbed and dissipated, thereby improving heat dissipation. In addition, the mother board is screwed and fixed in contact with the cover member of the housing, and the heat from the heat-generating electronic components of the board joined to the heat dissipation member is also conducted to the cover member side of the housing. And heat dissipation is further improved. Then, the assembling work by screwing and fixing is simplified to only from the same direction, and workability is remarkably improved.
【０００７】請求項３の制御機器の放熱装置では、放熱
部材がマザーボードに形成された放熱用パターンに接触
されるように構成されている。これにより、放熱部材か
らマザーボード側を介して熱を効率良く吸収・発散させ
ることが可能となり放熱性が向上される。According to a third aspect of the present invention, the heat radiating device is configured such that the heat radiating member is in contact with the heat radiating pattern formed on the motherboard. As a result, heat can be efficiently absorbed and dissipated from the heat dissipating member via the motherboard, and heat dissipating properties are improved.
【０００８】[0008]
【発明の実施の形態】以下、本発明の実施の形態を実施
例に基づいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below based on examples.
【０００９】〈実施例１〉図１は本発明の実施の形態の
第１実施例にかかる制御機器の放熱装置が適用された電
子制御機器の全体構成を示す斜視図であり、図２は図１
の電子制御機器のＡ−Ａ線に沿う要部構成を示す断面図
である。Embodiment 1 FIG. 1 is a perspective view showing an overall configuration of an electronic control apparatus to which a heat radiating device for a control apparatus according to a first embodiment of the present invention is applied, and FIG. 1
FIG. 2 is a cross-sectional view illustrating a main configuration of the electronic control device taken along line AA.
【００１０】図１において、本実施例の電子制御機器１
００では、厚膜用基板として放熱性が高い複数のセラミ
ック基板１０が用いられている。これら複数のセラミッ
ク基板１０には、発熱性を有するパワー素子としての駆
動トランジスタ（パワートランジスタ）２１やその他の
電子部品２２が実装されている。これら複数のセラミッ
ク基板１０は、更に駆動トランジスタ２１で発生する熱
を吸収・発散させるためアルミニウム材料等で形成され
た放熱フィン４０に熱伝導性が高い例えば、シリコン系
の接着剤を介して接合されている。Referring to FIG. 1, an electronic control unit 1 according to this embodiment
In 00, a plurality of ceramic substrates 10 having high heat dissipation are used as thick film substrates. A drive transistor (power transistor) 21 as a power element having heat generation properties and other electronic components 22 are mounted on the plurality of ceramic substrates 10. The plurality of ceramic substrates 10 are further bonded to a radiating fin 40 formed of an aluminum material or the like via a high-heat-conductivity adhesive, for example, a silicon-based adhesive in order to absorb and radiate heat generated by the driving transistor 21. ing.
【００１１】セラミック基板１０からのリード端子３１
は、マザーボード６０にはんだ付けされ電気的に接続さ
れている。また、マザーボード６０の１辺の周縁近傍に
は、コネクタ５０がねじ止め固定されており、コネクタ
５０やその他の電子部品のリード端子（図示略）もマザ
ーボード６０にはんだ付けされ電気的に接続されてい
る。このように構成されたマザーボード６０は、図１及
び図２に示すような、熱伝導性が高い例えば、アルミニ
ウム材料等で形成されたケース７０に収容される。な
お、図２では図１の放熱フィン４０に接合されたセラミ
ック基板１０等は省略されている。Lead terminal 31 from ceramic substrate 10
Are soldered and electrically connected to the motherboard 60. A connector 50 is fixed by screwing near the periphery of one side of the motherboard 60, and lead terminals (not shown) of the connector 50 and other electronic components are also soldered to the motherboard 60 and electrically connected thereto. I have. The motherboard 60 thus configured is housed in a case 70 made of, for example, an aluminum material or the like having high thermal conductivity, as shown in FIGS. 1 and 2. In FIG. 2, the ceramic substrate 10 and the like joined to the radiation fin 40 in FIG. 1 are omitted.
【００１２】このとき、放熱フィン４０の左右に形成さ
れた突起部４１がケース７０の内壁面に形成された突出
部７５に接触されることとなる。そして、図２に示すよ
うに、マザーボード６０の中央部分では複数のセラミッ
ク基板１０が接合された放熱フィン４０にビス６８を用
いてねじ止め固定される。また、マザーボード６０の左
右周縁部分では放熱フィン４０を介在させケース７０の
突出部７５に同一方向からビス６９を用いてねじ止め固
定される。こののち、図示しないアルミニウム材料等で
形成されたカバーが被せられ、ねじ止め固定されること
で電子制御機器１００が組付完了とされる。At this time, the projections 41 formed on the left and right sides of the radiation fins 40 come into contact with the projections 75 formed on the inner wall surface of the case 70. Then, as shown in FIG. 2, in the central portion of the motherboard 60, the heat radiation fins 40 to which the plurality of ceramic substrates 10 are joined are screwed and fixed using screws 68. Further, the left and right peripheral portions of the motherboard 60 are screwed and fixed to the protruding portion 75 of the case 70 from the same direction using the screws 69 with the radiation fins 40 interposed therebetween. Thereafter, a cover formed of an aluminum material or the like (not shown) is covered, and the electronic control device 100 is completed by being screwed and fixed.
【００１３】更に、図３に示すように、マザーボード６
０の放熱フィン４０との接触面にはねじ穴６６が穿たれ
た放熱用パターン６５が形成されている。この放熱用パ
ターン６５はマザーボード６０の表面を利用して形成さ
れているが、多層基板を用いれば内層を利用してより放
熱性を向上させることも可能である。また、マザーボー
ド６０の絶縁保護膜等で放熱用パターン６５に放熱フィ
ン４０を直接、全面接触させることができないときに
は、放熱用パターン６５のねじ穴６６の周りにパターン
剥出しのランド部分を形成すれば放熱性を助長すること
ができる。Further, as shown in FIG.
A heat radiation pattern 65 in which a screw hole 66 is formed is formed on a contact surface of the heat radiation fin 40 with the heat radiation fin 40. The heat radiation pattern 65 is formed using the surface of the motherboard 60. However, if a multi-layer substrate is used, the heat radiation can be further improved using the inner layer. Further, when the heat radiation fins 40 cannot directly contact the entire surface of the heat radiation pattern 65 with the insulating protection film of the motherboard 60 or the like, a pattern exposed land portion may be formed around the screw hole 66 of the heat radiation pattern 65. Heat dissipation can be promoted.
【００１４】上述の構成によれば、駆動トランジスタ２
１からの熱がセラミック基板１０、放熱フィン４０を介
し直接、熱容量の大きなケース７０側へ吸収・発散され
る。同時に、駆動トランジスタ２１からの熱がセラミッ
ク基板１０、放熱フィン４０を介しマザーボード６０に
形成された放熱用パターン６５に熱伝導され、更に、ケ
ース７０側へ吸収・発散されることとなる。According to the above configuration, the driving transistor 2
The heat from 1 is directly absorbed and radiated to the case 70 having a large heat capacity through the ceramic substrate 10 and the heat radiation fins 40. At the same time, heat from the driving transistor 21 is conducted to the heat radiation pattern 65 formed on the motherboard 60 via the ceramic substrate 10 and the heat radiation fins 40, and is further absorbed and dissipated to the case 70 side.
【００１５】このように、本実施例の制御機器の放熱装
置が適用された電子制御機器１００は、発熱性を有する
電子部品としての駆動トランジスタ２１を含む複数の電
子部品２１，２２を実装するセラミック基板１０と、セ
ラミック基板１０を略垂直方向に電気的に接続するマザ
ーボード６０と、マザーボード６０を収容する筐体とし
てのケース７０と、セラミック基板１０が接合され、駆
動トランジスタ２１等からの熱を吸収・発散する放熱部
材としての放熱フィン４０とを具備し、マザーボード６
０は放熱フィン４０にビス６８を用いてねじ止め固定す
ると共に、放熱フィン４０の突起部４１を介在させ一緒
にケース７０の内壁部位としての突出部７５に同一方向
からビス６９を用いてねじ止め固定するものである。ま
た、マザーボード６０が放熱フィン４０との接触面に放
熱用パターン６５を形成するものである。As described above, the electronic control apparatus 100 to which the heat radiating device of the control apparatus of the present embodiment is applied has a ceramic in which the plurality of electronic components 21 and 22 including the driving transistor 21 as the heat-generating electronic component are mounted. The substrate 10, the motherboard 60 for electrically connecting the ceramic substrate 10 in a substantially vertical direction, the case 70 as a housing for housing the motherboard 60, and the ceramic substrate 10 are joined to absorb heat from the drive transistor 21 and the like. A radiating fin 40 as a radiating member to radiate,
Numeral 0 is screw-fixed to the radiation fins 40 using screws 68, and screwed together with the projections 41 of the radiation fins 40 to the projections 75 as the inner wall portion of the case 70 using screws 69 from the same direction. It is fixed. Further, the mother board 60 forms a heat radiation pattern 65 on the contact surface with the heat radiation fin 40.
【００１６】つまり、マザーボード６０が放熱フィン４
０にビス６８を用いてねじ止め固定されると共に、放熱
フィン４０を介在させ一緒にケース７０の突出部７５に
ビス６９を用いてねじ止め固定されることで、放熱フィ
ン４０に接合されたセラミック基板１０の駆動トランジ
スタ２１等からの熱を直接、ケース７０側に確実に熱伝
導させ効率良く吸収・発散させることが可能となり放熱
性が向上される。また、ねじ止め固定による組付作業が
同一方向からのみと簡素化されることで作業性が著しく
向上される。そして、マザーボード６０に放熱用パター
ン６５が形成され放熱フィン４０が接触されるように構
成されているため、放熱フィン４０からマザーボード６
０を介して熱を効率良く吸収・発散させることが可能と
なり放熱性が更に向上される。That is, the mother board 60 is
0 is screwed and fixed to the radiating fins 40 using screws 68 and screwed to the projecting portions 75 of the case 70 with the radiating fins 40 interposed therebetween. The heat from the drive transistor 21 or the like of the substrate 10 can be reliably conducted directly to the case 70 side to efficiently absorb and radiate heat, thereby improving heat dissipation. In addition, workability is remarkably improved by simplifying the assembling work by screw fixing from only the same direction. Since the heat radiation pattern 65 is formed on the motherboard 60 and the heat radiation fins 40 are in contact with each other, the heat radiation fins 40 are
The heat can be efficiently absorbed and dissipated through 0, and the heat dissipation is further improved.
【００１７】〈実施例２〉図４は本発明の実施の形態の
第２実施例にかかる制御機器の放熱装置が適用された電
子制御機器２００の要部構成を示す断面図である。な
お、図中、上述の実施例における図２の断面図と同様の
構成または相当部分からなるものについては同一符号及
び同一記号を付し、その詳細な説明を省略する。また、
本実施例にかかる電子制御機器２００の全体構成は上述
の実施例における図１の斜視図と同様であるためその詳
細な説明を省略する。Embodiment 2 FIG. 4 is a cross-sectional view showing a main configuration of an electronic control apparatus 200 to which a heat radiating device for a control apparatus according to a second embodiment of the present invention is applied. In the drawings, the same reference numerals and symbols are given to components having the same configuration or corresponding portions as those in the cross-sectional view of FIG. 2 in the above-described embodiment, and detailed description thereof will be omitted. Also,
The overall configuration of the electronic control device 200 according to the present embodiment is the same as the perspective view of FIG. 1 in the above-described embodiment, and a detailed description thereof will be omitted.
【００１８】図４において、本実施例の電子制御機器２
００では、上述の電子制御機器１００の構成におけるセ
ラミック基板１０が接合された放熱フィン４０とセラミ
ック基板１０からのリード端子がはんだ付けされ電気的
に接続されたマザーボード６０とがケース７０に収容さ
れたのち、更に、ケース７０の下方向の開口部側に筐体
の蓋部材としてのカバー８０が被せられる。そして、カ
バー８０の外側から中央部分ではカバー８０を伴ってマ
ザーボード６０及び放熱フィン４０を介させビス８８を
用いてねじ止め固定される。更に、カバー８０の外側か
ら左右周縁部分ではカバー８０を伴ってマザーボード６
０及び放熱フィン４０を介在させケース７０の突出部７
５に同一方向からビス８９を用いてねじ止め固定され
る。なお、このねじ止め固定部分以外では、カバー８０
はマザーボード６０に実装されている電子部品のリード
端子等のはんだ付け部分から所定寸法を隔てた形状に形
成されている。In FIG. 4, the electronic control unit 2 of the present embodiment
In the case of 00, the radiating fins 40 to which the ceramic substrate 10 was joined in the configuration of the electronic control device 100 and the motherboard 60 to which lead terminals from the ceramic substrate 10 were soldered and electrically connected were housed in the case 70. Thereafter, a cover 80 as a cover member of the housing is further placed on the lower opening side of the case 70. Then, from the outside to the center of the cover 80, the cover 80 is screwed and fixed with the cover 80 via the mother board 60 and the radiation fins 40 using screws 88. Further, from the outside of the cover 80, the left and right peripheral portions of the motherboard 6 are attached with the cover 80.
0 and the projecting portion 7 of the case 70
5 is screwed and fixed using screws 89 from the same direction. Except for the screw fixing portion, the cover 80
Is formed at a predetermined distance from a soldered portion such as a lead terminal of an electronic component mounted on the motherboard 60.
【００１９】このように、本実施例の制御機器の放熱装
置が適用された電子制御機器２００は、発熱性を有する
電子部品としての駆動トランジスタ２１を含む複数の電
子部品２１，２２を実装するセラミック基板１０と、セ
ラミック基板１０を略垂直方向に電気的に接続するマザ
ーボード６０と、マザーボード６０を収容する筐体とし
てのケース７０と、セラミック基板１０が接合され、駆
動トランジスタ２１等からの熱を吸収・発散する放熱部
材としての放熱フィン４０とを具備し、マザーボード６
０は筐体の蓋部材としてのカバー８０を伴って外側から
放熱フィン４０にビス８８を用いてねじ止め固定すると
共に、カバー８０を伴って外側から放熱フィン４０の突
起部４１を介在させ一緒に筐体の内壁部位としての突出
部７５に同一方向からビス８９を用いてねじ止め固定す
るものである。As described above, the electronic control device 200 to which the heat radiating device of the control device of the present embodiment is applied has a ceramic in which the plurality of electronic components 21 and 22 including the driving transistor 21 as the heat-generating electronic component are mounted. The substrate 10, the motherboard 60 for electrically connecting the ceramic substrate 10 in a substantially vertical direction, the case 70 as a housing for housing the motherboard 60, and the ceramic substrate 10 are joined to absorb heat from the drive transistor 21 and the like. A radiating fin 40 as a radiating member to radiate,
0 is screwed and fixed to the radiating fins 40 from outside with a cover 80 as a cover member of the housing, and together with the projections 41 of the radiating fins 40 from outside with the cover 80 interposed therebetween. It is screwed and fixed to the protruding portion 75 as an inner wall portion of the housing from the same direction using screws 89.
【００２０】つまり、マザーボード６０がカバー８０を
伴って外側から放熱フィン４０にねじ止め固定されると
共に、カバー８０を伴って外側から放熱フィン４０の突
起部４１を介在させ一緒にケース７０の突出部７５に同
一方向からねじ止め固定されることで、放熱フィン４０
に接合されたセラミック基板１０の駆動トランジスタ２
１等からの熱を直接、ケース７０側に確実に熱伝導させ
効率良く吸収・発散させることが可能となり放熱性が向
上される。また、マザーボード６０はカバー８０に接触
してねじ止め固定されており、放熱フィン４０に接合さ
れたセラミック基板１０の駆動トランジスタ２１等から
の熱をカバー８０側にも熱伝導させることが可能となり
放熱性が更に向上される。そして、ねじ止め固定による
組付作業が同一方向からのみと簡素化され作業性が著し
く向上される。That is, the mother board 60 is screwed and fixed to the radiating fins 40 from the outside with the cover 80, and the projections 41 of the radiating fins 40 are interposed from the outside with the cover 80 together with the projecting portions of the case 70. 75 from the same direction.
Drive transistor 2 of ceramic substrate 10 joined to
The heat from the first and the like can be directly and reliably conducted to the case 70 side so that it can be efficiently absorbed and dissipated. Further, the motherboard 60 is fixed to the cover 80 by screwing in contact with the cover 80, so that heat from the drive transistors 21 and the like of the ceramic substrate 10 joined to the radiating fins 40 can be conducted to the cover 80 side. The performance is further improved. Then, the assembling work by screwing and fixing is simplified to only from the same direction, and workability is remarkably improved.
【図１】 図１は本発明の実施の形態の第１実施例及び
第２実施例にかかる制御機器の放熱装置が適用された電
子制御機器の全体構成を示す斜視図である。FIG. 1 is a perspective view showing an overall configuration of an electronic control device to which a heat radiating device of a control device according to a first example and a second example of an embodiment of the present invention is applied.
【図２】 図２は図１の電子制御機器の要部構成を示す
断面図である。FIG. 2 is a cross-sectional view showing a configuration of a main part of the electronic control device of FIG.
【図３】 図３は図１のマザーボードに形成された放熱
用パターンを示す部分平面図である。FIG. 3 is a partial plan view showing a heat dissipation pattern formed on the motherboard of FIG. 1;
【図４】 図４は本発明の実施の形態の第２実施例にか
かる制御機器の放熱装置が適用された電子制御機器の要
部構成を示す断面図である。FIG. 4 is a cross-sectional view illustrating a main configuration of an electronic control device to which a heat dissipation device for a control device according to a second example of the embodiment of the present invention is applied.
１０ セラミック基板 ４０ 放熱フィン（放熱部材） ６０ マザーボード ６５ 放熱用パターン ７０ ケース（筐体） ７５ 突出部（筐体の内壁部位） ８０ カバー（筐体） １００ 電子制御機器 DESCRIPTION OF SYMBOLS 10 Ceramic board 40 Heat radiation fin (heat radiation member) 60 Motherboard 65 Heat radiation pattern 70 Case (housing) 75 Projection part (inner wall part of housing) 80 Cover (housing) 100 Electronic control equipment
Claims (3)
子部品を実装する基板と、 前記基板を略垂直方向に電気的に接続するマザーボード
と、 前記マザーボードを収容する筐体と、 前記基板が接触または接合され、前記電子部品からの熱
を吸収・発散する放熱部材とを具備し、 前記マザーボードは前記放熱部材にねじ止め固定すると
共に、前記放熱部材を介在させ一緒に前記筐体の内壁部
位に同一方向からねじ止め固定することを特徴とする制
御機器の放熱装置。1. A board on which a plurality of electronic components including an electronic component having heat generation are mounted; a motherboard electrically connecting the boards in a substantially vertical direction; a housing for housing the motherboard; A heat dissipating member that is in contact with or joined thereto and absorbs and dissipates heat from the electronic component; and the motherboard is screwed and fixed to the heat dissipating member, and the heat dissipating member is interposed therebetween to form an inner wall portion of the housing. A heat radiating device for control equipment, wherein the heat radiating device is fixed by screws from the same direction.
子部品を実装する基板と、 前記基板を略垂直方向に電気的に接続するマザーボード
と、 前記マザーボードを収容する筐体と、 前記基板が接触または接合され、前記電子部品からの熱
を吸収・発散する放熱部材とを具備し、 前記マザーボードは、前記筐体の蓋部材を伴って外側か
ら前記放熱部材にねじ止め固定すると共に、前記筐体の
蓋部材を伴って外側から前記放熱部材を介在させ共に前
記筐体の内壁部位に同一方向からねじ止め固定すること
を特徴とする制御機器の放熱装置。2. A substrate on which a plurality of electronic components including electronic components having heat generation are mounted; a motherboard electrically connecting the substrates in a substantially vertical direction; a housing for accommodating the motherboard; A heat dissipating member that is in contact with or joined to absorb and dissipate heat from the electronic component, wherein the motherboard is screwed and fixed to the heat dissipating member from outside with a lid member of the housing, and A heat radiating device for a control device, wherein the heat radiating member is interposed from the outside with a cover member of a body, and is screwed and fixed to an inner wall portion of the housing from the same direction.
接触面に放熱用パターンを形成することを特徴とする請
求項１または請求項２に記載の制御機器の放熱装置。3. The heat radiating device for a control device according to claim 1, wherein the mother board forms a heat radiating pattern on a contact surface with the heat radiating member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11050064A JP2000252657A (en) | 1999-02-26 | 1999-02-26 | Heat dissipation unit for control apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11050064A JP2000252657A (en) | 1999-02-26 | 1999-02-26 | Heat dissipation unit for control apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000252657A true JP2000252657A (en) | 2000-09-14 |
Family
ID=12848577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11050064A Pending JP2000252657A (en) | 1999-02-26 | 1999-02-26 | Heat dissipation unit for control apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000252657A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6731001B2 (en) | 2000-08-10 | 2004-05-04 | Denso Corporation | Semiconductor device including bonded wire based to electronic part and method for manufacturing the same |
| JP2006334197A (en) * | 2005-06-03 | 2006-12-14 | Iura Co Ltd | Assembly structure of lifter for wheelchair |
| CN102307457A (en) * | 2011-08-31 | 2012-01-04 | 昆山锦泰电子器材有限公司 | Assembled radiating fin with electronic component |
| JP2013232654A (en) * | 2013-06-05 | 2013-11-14 | Denso Corp | Electronic control device |
| JP2016022543A (en) * | 2014-07-17 | 2016-02-08 | 株式会社マキタ | Power tool |
| JP2017135209A (en) * | 2016-01-26 | 2017-08-03 | 株式会社テクノ高槻 | Multilayer substrate and electronic circuit board |
-
1999
- 1999-02-26 JP JP11050064A patent/JP2000252657A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6731001B2 (en) | 2000-08-10 | 2004-05-04 | Denso Corporation | Semiconductor device including bonded wire based to electronic part and method for manufacturing the same |
| JP2006334197A (en) * | 2005-06-03 | 2006-12-14 | Iura Co Ltd | Assembly structure of lifter for wheelchair |
| JP4644867B2 (en) * | 2005-06-03 | 2011-03-09 | 株式会社いうら | Assembly structure of wheelchair elevator |
| CN102307457A (en) * | 2011-08-31 | 2012-01-04 | 昆山锦泰电子器材有限公司 | Assembled radiating fin with electronic component |
| JP2013232654A (en) * | 2013-06-05 | 2013-11-14 | Denso Corp | Electronic control device |
| JP2016022543A (en) * | 2014-07-17 | 2016-02-08 | 株式会社マキタ | Power tool |
| US10326337B2 (en) | 2014-07-17 | 2019-06-18 | Makita Corporation | Power tool having a heat radiation member for a controller |
| JP2017135209A (en) * | 2016-01-26 | 2017-08-03 | 株式会社テクノ高槻 | Multilayer substrate and electronic circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3677403B2 (en) | Heat dissipation structure | |
| JP3281220B2 (en) | Circuit module cooling system | |
| JP2004095586A (en) | Electric apparatus and wiring board | |
| JP2001168560A (en) | Electronic circuit unit | |
| JP2006086536A (en) | Electronic control device | |
| JP2000332171A (en) | Heat dissipation structure of heat generating element and module having that structure | |
| JP2000252657A (en) | Heat dissipation unit for control apparatus | |
| JP2001111237A (en) | Multilayer printed board and electronic apparatus | |
| JPH11266090A (en) | Semiconductor device | |
| JP3378174B2 (en) | Heat dissipation structure of high heating element | |
| JP4871676B2 (en) | Electronic circuit equipment | |
| JPH11186766A (en) | Semiconductor device | |
| JP2006245025A (en) | Heat dissipation structure of electronic apparatus | |
| JPH1098287A (en) | Cooler for circuit board module and portable electronic equipment having the cooler | |
| JP2000059003A (en) | Hybrid module | |
| JP2000252658A (en) | Heat dissipation unit for control apparatus | |
| TWI769874B (en) | Heat dissipation structure with shells formed by high thermal-resisting material and electronic apparatus having the same | |
| JP2004165251A (en) | Radiating device for electronic component | |
| JP2006041199A (en) | Electronic device | |
| JP3728836B2 (en) | LSI package cooling device and fixing method thereof | |
| JP2011066281A (en) | Heat generating device | |
| JP4825248B2 (en) | Electronic control unit | |
| JPH11186687A (en) | Semiconductor device and its manufacture | |
| JP4002632B2 (en) | IC chip heat dissipation mechanism | |
| JPH11220278A (en) | Heat dissipating structure of heat releasing part |