TWI275157B - Workpiece holder for processing apparatus, and processing apparatus using the same - Google Patents
Workpiece holder for processing apparatus, and processing apparatus using the same Download PDFInfo
- Publication number
- TWI275157B TWI275157B TW092107513A TW92107513A TWI275157B TW I275157 B TWI275157 B TW I275157B TW 092107513 A TW092107513 A TW 092107513A TW 92107513 A TW92107513 A TW 92107513A TW I275157 B TWI275157 B TW I275157B
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece holder
- sealing member
- component
- joint
- ceramic body
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002112523A JP3870824B2 (ja) | 2001-09-11 | 2002-04-15 | 被処理物保持体、半導体製造装置用サセプタおよび処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200307337A TW200307337A (en) | 2003-12-01 |
TWI275157B true TWI275157B (en) | 2007-03-01 |
Family
ID=29243319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092107513A TWI275157B (en) | 2002-04-15 | 2003-04-02 | Workpiece holder for processing apparatus, and processing apparatus using the same |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100934827B1 (ko) |
CN (1) | CN100346462C (ko) |
TW (1) | TWI275157B (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011009866B4 (de) * | 2011-01-31 | 2013-09-05 | Heraeus Precious Metals Gmbh & Co. Kg | Direkt aufbringbare elektrische Durchführung |
DE102011009858B8 (de) | 2011-01-31 | 2013-11-07 | Heraeus Precious Metals Gmbh & Co. Kg | Cermethaltige Durchführung für eine medizinisch inplantierbare Vorrichtung mit Verbindungsschicht |
DE102011009867B4 (de) | 2011-01-31 | 2013-09-05 | Heraeus Precious Metals Gmbh & Co. Kg | Keramikdurchführung für eine medizinisch implantierbare Vorrichtung |
DE102011009855B8 (de) | 2011-01-31 | 2013-01-03 | Heraeus Precious Metals Gmbh & Co. Kg | Keramikdurchführung mit induktivem Filter |
KR101345693B1 (ko) * | 2011-11-29 | 2013-12-30 | (주)티티에스 | 기판 지지 모듈 |
WO2018179891A1 (ja) * | 2017-03-28 | 2018-10-04 | 住友電気工業株式会社 | ウエハ保持体 |
KR102331072B1 (ko) * | 2018-04-27 | 2021-11-29 | 엔지케이 인슐레이터 엘티디 | 웨이퍼 지지대 |
JP6775099B1 (ja) * | 2018-12-20 | 2020-10-28 | 日本碍子株式会社 | セラミックヒータ |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5252807A (en) * | 1990-07-02 | 1993-10-12 | George Chizinsky | Heated plate rapid thermal processor |
US5460603A (en) * | 1993-04-08 | 1995-10-24 | Massachusetts Institute Of Technology | Method and apparatus for preventing back flow in gastroenterological feeding system |
JPH07169737A (ja) * | 1993-12-14 | 1995-07-04 | Tokyo Electron Ltd | 処理装置 |
US5886863A (en) * | 1995-05-09 | 1999-03-23 | Kyocera Corporation | Wafer support member |
JP3545866B2 (ja) * | 1996-01-31 | 2004-07-21 | 京セラ株式会社 | ウェハ保持装置 |
KR19980071011A (ko) * | 1997-01-24 | 1998-10-26 | 조셉 제이. 스위니 | 고온 및 고 흐름 속도의 화학적 기상 증착 장치 및 관련증착 방법 |
JP2001230059A (ja) * | 2000-02-10 | 2001-08-24 | Ibiden Co Ltd | 半導体製造・検査装置用セラミック基板 |
JP4637316B2 (ja) * | 2000-02-24 | 2011-02-23 | 京セラ株式会社 | 筒状体を有するセラミックヒーター及びこれを用いた加熱装置 |
-
2003
- 2003-03-20 CN CNB031074472A patent/CN100346462C/zh not_active Expired - Fee Related
- 2003-04-02 TW TW092107513A patent/TWI275157B/zh not_active IP Right Cessation
- 2003-04-14 KR KR1020030023262A patent/KR100934827B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200307337A (en) | 2003-12-01 |
CN1452232A (zh) | 2003-10-29 |
CN100346462C (zh) | 2007-10-31 |
KR100934827B1 (ko) | 2009-12-31 |
KR20030082400A (ko) | 2003-10-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |