TWI275157B - Workpiece holder for processing apparatus, and processing apparatus using the same - Google Patents

Workpiece holder for processing apparatus, and processing apparatus using the same Download PDF

Info

Publication number
TWI275157B
TWI275157B TW092107513A TW92107513A TWI275157B TW I275157 B TWI275157 B TW I275157B TW 092107513 A TW092107513 A TW 092107513A TW 92107513 A TW92107513 A TW 92107513A TW I275157 B TWI275157 B TW I275157B
Authority
TW
Taiwan
Prior art keywords
workpiece holder
sealing member
component
joint
ceramic body
Prior art date
Application number
TW092107513A
Other languages
English (en)
Chinese (zh)
Other versions
TW200307337A (en
Inventor
Masuhiro Natsuhara
Hirohiko Nakata
Akira Kuibira
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002112523A external-priority patent/JP3870824B2/ja
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW200307337A publication Critical patent/TW200307337A/zh
Application granted granted Critical
Publication of TWI275157B publication Critical patent/TWI275157B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW092107513A 2002-04-15 2003-04-02 Workpiece holder for processing apparatus, and processing apparatus using the same TWI275157B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002112523A JP3870824B2 (ja) 2001-09-11 2002-04-15 被処理物保持体、半導体製造装置用サセプタおよび処理装置

Publications (2)

Publication Number Publication Date
TW200307337A TW200307337A (en) 2003-12-01
TWI275157B true TWI275157B (en) 2007-03-01

Family

ID=29243319

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092107513A TWI275157B (en) 2002-04-15 2003-04-02 Workpiece holder for processing apparatus, and processing apparatus using the same

Country Status (3)

Country Link
KR (1) KR100934827B1 (ko)
CN (1) CN100346462C (ko)
TW (1) TWI275157B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011009866B4 (de) * 2011-01-31 2013-09-05 Heraeus Precious Metals Gmbh & Co. Kg Direkt aufbringbare elektrische Durchführung
DE102011009858B8 (de) 2011-01-31 2013-11-07 Heraeus Precious Metals Gmbh & Co. Kg Cermethaltige Durchführung für eine medizinisch inplantierbare Vorrichtung mit Verbindungsschicht
DE102011009867B4 (de) 2011-01-31 2013-09-05 Heraeus Precious Metals Gmbh & Co. Kg Keramikdurchführung für eine medizinisch implantierbare Vorrichtung
DE102011009855B8 (de) 2011-01-31 2013-01-03 Heraeus Precious Metals Gmbh & Co. Kg Keramikdurchführung mit induktivem Filter
KR101345693B1 (ko) * 2011-11-29 2013-12-30 (주)티티에스 기판 지지 모듈
WO2018179891A1 (ja) * 2017-03-28 2018-10-04 住友電気工業株式会社 ウエハ保持体
KR102331072B1 (ko) * 2018-04-27 2021-11-29 엔지케이 인슐레이터 엘티디 웨이퍼 지지대
JP6775099B1 (ja) * 2018-12-20 2020-10-28 日本碍子株式会社 セラミックヒータ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5252807A (en) * 1990-07-02 1993-10-12 George Chizinsky Heated plate rapid thermal processor
US5460603A (en) * 1993-04-08 1995-10-24 Massachusetts Institute Of Technology Method and apparatus for preventing back flow in gastroenterological feeding system
JPH07169737A (ja) * 1993-12-14 1995-07-04 Tokyo Electron Ltd 処理装置
US5886863A (en) * 1995-05-09 1999-03-23 Kyocera Corporation Wafer support member
JP3545866B2 (ja) * 1996-01-31 2004-07-21 京セラ株式会社 ウェハ保持装置
KR19980071011A (ko) * 1997-01-24 1998-10-26 조셉 제이. 스위니 고온 및 고 흐름 속도의 화학적 기상 증착 장치 및 관련증착 방법
JP2001230059A (ja) * 2000-02-10 2001-08-24 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
JP4637316B2 (ja) * 2000-02-24 2011-02-23 京セラ株式会社 筒状体を有するセラミックヒーター及びこれを用いた加熱装置

Also Published As

Publication number Publication date
TW200307337A (en) 2003-12-01
CN1452232A (zh) 2003-10-29
CN100346462C (zh) 2007-10-31
KR100934827B1 (ko) 2009-12-31
KR20030082400A (ko) 2003-10-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees