1273381 九、發明說明： 【發明所屬之技術領域】 尤指一種應用於電 本發明係關於一種散熱佈局結構 子裝置之介面卡之散熱佈局結構。 【先前技術】 現今電子工業發展迅速， 亦愈來愈多，如此，其功率需；:;=，供之_ 在-個系越來越大，因此往名 子恤型：=個發熱元件，如此，即造成在1 子衣置❹化趨勢下如何充分 進行散熱的問題。 〃㈣工間對發熱兀啊 現以筆記型或桌上型電 (Ce咖m〇cessing Umt CPU)|」二除了中央處理單元 工一从 ， u)早兀之外，還有顯示+笼帝 子兀件，另外在電腦或者工作站 颂下卡寻电 發熱元件屢見不鮮，若 θ /、、、、，兩個或者多個 咕， 右不將此熱I排除，則將可鈐士二 燒毀電子裝置之晶片内部電 而 損毀性的當機狀況，因此 二“-电子糸統發生 環境下能穩定地摔作運行=/、u'、70件在適宜的工作 發掉最多的敎量往往θ·如何利用最小的空間，散 與/丨、里彺在疋人們孜孜以求的一個目標。 而言，一 t太兮入μ 尘电細内之，丨面卡（如顯示卡） 叙在该介面卡上佈設有） 元件及如電容、電阻或+ 牛蛉肢日日片之主動 介面卡上之半=寺被動元件，而為有效逸散該 ^ 冷日日片於運作時所產生之埶量，诵當在/ 將切體”、、里通吊係在 面上後，再於該半導體晶錢端接置於介面卡之表 、 _作用面上透過一導熱膠而 】8369 5 1273381 接置一例如缺片丑 之熱量。再‘i，熱單元，藉以逸散該晶片運件所產生 電子元件之整體2為進—步提升該筆記型電腦内所設置 扇，藉此來排除1 =率，即於該筆記型電腦内裝置有風 時所產生之熱量Γ衣置於操作過程中各式電子元件運作 刑干然，對於現今追求輕薄短小之電子裝置要长下，m 型電腦亦朝向輕薄务扒尸 戒置要求下，筆§己 上安置具一定m择，展，如此若在介面卡之半導體晶片 加，而不符現:：:：二者：無疑將造成整體厚度之增 筆記型電腦内之八=筆记型電腦發展趨勢，且若安裝在 面卡等時，又需：夂士 ：、包含有顯示卡、音效卡及週邊介 導致費用之增力而σ。、“亥介面卡之半導體晶片上植設韓片， 有限在置追求輕薄短小之前提下，而在 實為目前亟待解供電子裝置内介面卡之散熱效率 【發明内容】 鑒於以上所述習知技術之 在提供-種介面卡散熱佈局結構:得要目的係 潯短小之前提下，而在有 包子1置追求輕 裝置内介面卡之散熱效率:工間情況’有效提升電子 本發明之另一目的在於提供— 構，俾可供介面卡有效修量，放熱佈局結 散熱裝置數目減少以節約空間:成；㈣於介面卡上之 為達上揭目的以及其他目的，本發明提供之介面卡散 18369 6 1273381 熱佈局結構，係可應用於電子梦 少包括：-接置於電子“:：;:，§亥散熱佈局結構至 熱裝置係由一散熱器及一風彳 w月丈 要办s 扇所組成，該散熱器設有一容 置工間以供收納該風扇； W 及透過連接裔而接置並電性 連，至置電路板之介面卡，其中該介 -表面設置有半導體元件，且該介面卡接置有半導體元二 ㈡面：以倒置方式而安置於該散熱裝置上方，以供該半 月豆兀件於運作時產峰之献0 哭月Π _ 之熱置侍以透過該散熱裝置之散埶 口口及風扇而逸散至外界。 … 上本舍明所揭露之介面卡散熱佈局結構之特點，主 於该散熱裝置之散埶哭传$且右 、、 4為具㈣料熱性之金屬材質所 組成，而該散熱器係在未影塑+ ' 形成有翼片藉以延伸佈局情況下， 置有丰導雕-杜Γ 下方’同時將該介面卡接 卜方日=之表面’以倒置方式設置於該散熱器翼片 …’且較U使接置於該介面卡上之 散熱器置片，笋以佶兮入品上 〜Μ姜觸4 產生^ 使騎面卡上之半導體元件於運作時所 ΐ=Γ:以快速透過該散熱器以及容置於該散熱器内 之風扇而傳遞至夫&卜 件上黏置嗜片等Ί…:^另在該介面卡之半導體元 短小之1 了早兀，措此得以在電子裝置追求輕薄 面而在有限容置空間之情況中，有效逸散介 【〜=兀件之熱量，同時節約使用空間及製程成本。 L貝轭方式】 ，外:係筹'由4寸定的具體貫施例說明本發明之實施方 > ’、、、白此技蟄之人士可由本說明書所揭示之内容輕易地 18369 7 1273381 :解本發明之其他優點與功效。本發明. 的具體實施例加以施行或應用，本”错由其他不同 可基於不同觀點與應用，在不释離本發二中:各項細節亦 種修飾與變更。 知神下進行各 請參閱第1圖，係為本發明之介 一實施例之示意圖。如圖所示，該介:心佈局結構第 要係可應用於例如筆記型電腦等電子 ^熱佈局結構主 有散熱裝置11及介面卡12。 衣罝中，且其係包括 该散熱裝置11係接置於電子裝 影響電子元件設置之位置，該散熱;路上未 器別及-風扇⑴所組成，該散 主=由—散熱 間以供收納該風扇U1。 U0 δ又有一容置空 «亥風扇111主要係由複數個葉 電力驅動其旋轉從而產生空氣、 成，用以通過 贫私办π 座生工矾對流，加速散熱。 μ月八先、态11 〇主係為一塊， 成有一容置空間用以安置該風ϋ4,於該塊體結構中形 向外延伸出有翼片112至介面卡 1自该塊體結構中< Ψ m 〇 下方未景> 響電子元件接 外，一般為有效逸散電子 作之熱量，該散熱器110具有兀件運 口 113,用以將風扇ln產生之對、f:置空間相通之出風 出去。ιφ，之對-空氣從此出風口逸散 易方m '〜散熱裝置11提供更好的散熱作用及更 表現形’於本實施例中，該散熱器110係為導熱性 表現優良及可塑性較佳之鋁合金材質。 該介面卡12係可例如為筆記型電腦中之顯示卡，該 18369 8 1273381 二 2主要係透過—連接器13而接置並電性連接至該 连：電路板1〇〇,其中該介面卡12之至少-表面設 蓄版兀件14 ’該半導體元件14可例如為半導體晶 動兀件及例如電阻元件、電容元件或電感元件之被 兀，且該介面卡12係將其接置有半導體元件14之 2倒置方式而安置於該散熱裝置u上方，較佳係使料 件14接觸至該散熱器110之延伸翼片112,以供該 112、n件^於運作時產生之熱量得以透過該延伸翼/ 月文尤、為110及風扇U1而逸散至外界。 另明麥閱第2圖所示，係為本發明 結構第-每# Θ足Μ面卡散熱佈局 弟—μ知例之示意圖。於本發明第二實施例之 實施：: 致相同，其主要差異係在於第二 、 中，於该散熱器21 〇周邊復可μ罟古+ 片25,用以拇,^ 门达奴了叹置有铍數個散熱鰭 用以增加散熱面積，加速散熱速度。 :此’本發明提供之介面卡散 括一接置於雷4壯班丄a 』口丨巧一要係包 係由^ 衣置％路板上之散熱裝置，該散埶裝置 係由一散熱器及一風扇所細 …、衣置 以供收納該風扇；以及—:#、熱器設有一容置空間 該電子裝置電路板之人過連接器而接置並電性連接至 衣1¾路板之介面卡，苴 入 設置有半導體元件:…1 +之至少—表面 係以倒置方式安m2 置有半導體元件之表面 散熱裝置上方，以供該半導 於運作時產生之埶量得 /牛蛤粗兀件 界。其中因該散熱器係為器及風扇而逸散至外 成，又佳導熱性之金屬村質所組 r 、在未影響電子裝置電路佈局情況下形成 18369 1273381 有異片，藉以延伸至介面卡之下方，同時將該介面卡接置 有半導體元件之表面，以倒置方式設置於該散熱器翼片上 且I乂么係使接置於遠介面卡上之半導體元件接觸該散 熱器翼片，藉以使該介面卡上之半導體元件於運作時所產 生之熱量得以快速透過該散熱器以及容置於該散熱器内之 風扇而傳遞至大氣中，而無需另在該介面卡之半導體元件 上黏置鰭片等散熱單元 藉此得以在電子裝置追求輕薄短 小之前提下，而在有限容置空間之情況中 卡上半導體元件之熱量，同時節約使用空 【圖式簡單說明】 ，有效逸散介面 間及製程成本。 第1圖係為本發明之介面卡散 之示意圖；以及 熱佈局結構第一實施例 圖係為本發明之介面 卡放熱佈局結構第二實施例 第2 之示意圖 【主要元件符號說明】 100 電路板 11 散熱裝置 110 散熱器 111 風扇 1110 葉片 112 翼片 113 出風口 12 介面卡 13 連接器 18369 10 1273381 14 半導體元件 210 散熱器 25 散熱鰭片1273381 IX. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a heat dissipation layout structure of an interface card of a heat dissipation layout structure sub-device. [Prior Art] Nowadays, the electronics industry is developing rapidly, and more and more, so, its power needs;:;=, for _ in the - system is getting bigger and bigger, so to the name of the shirt: = a heating element, In this way, it is a problem of how to sufficiently dissipate heat in the tendency of the first coat. 〃 (4) The workplace is hot, and now it is a notebook or desktop type (Ce coffee m〇cessing Umt CPU)|" Second, except for the central processing unit, u), as well as the display, +Cang Emperor In addition, in the computer or workstation, the card to find electric heating elements is not uncommon. If θ /,,,,, two or more 咕, right does not exclude this heat I, then the gentleman can burn the electronic device The internal internality of the chip is destructive, so the second "-electronic system can be stably smashed into operation =/, u', 70 pieces of the most smashed in the appropriate work often θ · how With the smallest space, the scattered and / 丨, 彺 彺 彺 一个 一个 一个 一个 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 There are components and such as capacitors, resistors or + 蛉 蛉 日 之 之 之 之 = = 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺After the / body is cut, the lining is attached to the surface, and then the semiconductor crystal money is terminated. Interface card in the table, _ a thermally conductive adhesive through the action face of the opposing] 836951273381 heat bonding a sheet e.g. lack the ugly. And 'i, the thermal unit, by means of dissipating the whole of the electronic components generated by the wafer transport, to further increase the fan set in the notebook computer, thereby eliminating the 1 = rate, that is, in the notebook computer The heat generated by the device when it is windy is placed in the operation process. All kinds of electronic components are in operation. For today's pursuit of thin and light electronic devices, the m-type computer is also facing the requirements of light and thin body. Pen § has been placed on a certain choice, exhibition, so if the semiconductor chip in the interface card is added, does not match:::: Both: will undoubtedly cause the overall thickness of the increase in the notebook computer eight = notebook computer development Trends, and if installed in a face card, etc., you need: Gentleman: Contains the display card, sound card and peripherals to increase the cost of σ. "The Korean film is implanted on the semiconductor chip of the Haiyue card. It is limited to the light and thin before the device is pursued. However, it is actually the heat dissipation efficiency of the interface card in the electronic device. [Inventive content] In view of the above The technology provides a kind of interface card heat dissipation layout structure: the purpose of the system is short before the lifting, and in the case of the buns 1 set to pursue the heat dissipation efficiency of the internal interface card of the light device: the situation of the work 'effectively enhance the electronic another The purpose is to provide an interface for the effective repair of the interface card, and the number of heat dissipation devices is reduced to save space: (4) on the interface card for the purpose of the purpose and other purposes, the interface provided by the present invention is scattered. 18369 6 1273381 The thermal layout structure can be applied to electronic dreams including: - placed in the electronic "::;:, § hai cooling layout structure to the thermal device system by a radiator and a wind 彳 月 要 要 s The fan is composed of a heat sink provided with a receiving room for accommodating the fan; W and an interface card connected to the circuit board through the connecting person, wherein the medium-surface is provided with a half a body element, and the interface card is connected with a semiconductor element (two) surface: disposed above the heat dissipating device in an inverted manner, so that the half moon bean cake is produced at the peak of the production of the peak 0 哭 _ 热It is dissipated to the outside through the diverging port and the fan of the heat sink. ... The characteristics of the thermal layout structure of the interface card disclosed by Shangbenming are mainly composed of the heat dissipation device and the right, and the fourth is a metal material with (4) heat material, and the heat sink is not Shadow plastic + 'The formation of a wing piece to extend the layout, with a guide carving - Du Fu below 'the interface card at the same time = the surface 'in the inverted way set to the radiator fins ... 'and The U is placed on the heat sink of the interface card, and the bamboo shoots are placed on the product. ΜGinger touch 4 generates ^ The semiconductor component on the riding card is operated when ΐ=Γ: to quickly pass the The heat sink and the fan housed in the heat sink are transferred to the husband & the adhesive piece is attached to the sputum... ^ 另 另 另 另 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体In the case of a privileged space, the device effectively pursues the heat of the [~= component, while saving space and process costs. L yoke method], outside: the system 'to explain the implementation of the present invention by a specific embodiment of 4 inches' ',,, white people can be easily disclosed by the contents of this specification 18369 7 1273381 : Solving other advantages and effects of the present invention. The specific embodiments of the present invention are implemented or applied, and the errors may be based on different viewpoints and applications, and are not released from the present invention: the details are also modified and changed. 1 is a schematic diagram of an embodiment of the present invention. As shown in the figure, the core layout structure can be applied to an electronic thermal layout structure such as a notebook computer, and a heat dissipation device 11 and an interface. The card 12 is included in the placket, and the heat dissipating device 11 is connected to the position where the electronic device affects the setting of the electronic component, and the heat dissipation; the device is composed of a fan and a fan (1). In order to accommodate the fan U1. U0 δ has a space to be empty «Hai Fan 111 is mainly driven by a plurality of leaf electric power to generate air, and is used to convect the π seat by the poor privilege to accelerate heat dissipation. The first month of the first month, the state of the first 11 〇 is a piece, and has a accommodating space for arranging the wind raft 4, and a fin 112 is extended outwardly from the block structure to the interface card 1 from the block structure. < Ψ m 〇Underlying below> The component is connected to the outside, generally for the heat of the effective escape electrons, and the heat sink 110 has a port opening 113 for separating the fan ln and the f: space to communicate with the air. ιφ, the pair-air Since the air outlet is easy to dissipate, the heat sink 11 provides a better heat dissipation function and a more expressive shape. In the embodiment, the heat sink 110 is an aluminum alloy material having excellent thermal conductivity and good plasticity. The card 12 can be, for example, a display card in a notebook computer. The 18369 8 1273381 2 is mainly connected through the connector 13 and electrically connected to the connection: the circuit board 1〇〇, wherein the interface card 12 The semiconductor element 14 can be, for example, a semiconductor crystal element and a bedding such as a resistive element, a capacitive element or an inductive element, and the interface card 12 is connected to the semiconductor element 14 2 is disposed above the heat dissipating device u in an inverted manner, preferably, the material member 14 is in contact with the extending fins 112 of the heat sink 110, so that the heat generated by the 112, n pieces during operation can be transmitted through the extension Wing / Moon Wenyu, 110 and wind U1 is dissipated to the outside world. It is also shown in Fig. 2, which is a schematic diagram of the structure of the structure of the present invention, which is the second embodiment of the present invention. :: To the same, the main difference is in the second and middle, in the vicinity of the radiator 21 复 μ罟古+片25, for the thumb, ^ Menda Nuo sighed with a number of cooling fins for Increasing the heat dissipation area and accelerating the heat dissipation rate: This 'the interface card provided by the present invention is arranged in the vicinity of the Lei 4 丄 丄 』 』 丨 丨 一 要 要 要 要 要 要 ^ ^ ^ ^ ^ ^ ^ The heat sink device is made up of a heat sink and a fan, and is placed for accommodating the fan; and::#, the heat device is provided with a receiving space, and the electronic device circuit board is connected by a connector and Electrically connected to the interface card of the 13⁄4 way board, the semiconductor element is placed in the middle: ... 1 + at least - the surface is placed in an inverted manner above the surface heat sink of the semiconductor component, for the semi-conductor to operate The amount produced is / calf rough. Among them, because the radiator is a device and a fan, it is dissipated to the outside, and the metal component of the thermal conductivity is formed, and the 18369 1273381 is formed without affecting the circuit layout of the electronic device, thereby extending to the interface card. The semiconductor card is placed on the surface of the semiconductor device in an inverted manner, and the semiconductor device attached to the remote interface card contacts the heat sink fin. The heat generated by the semiconductor component on the interface card is quickly transmitted to the atmosphere through the heat sink and the fan housed in the heat sink without separately attaching to the semiconductor component of the interface card. The heat dissipating unit such as the fin can be lifted before the electronic device pursues the thinness and the shortness, and the heat of the semiconductor component is stuck in the case of the limited accommodating space, and the use of the space is simplified [simple description], and the effective escape interface is And process costs. 1 is a schematic diagram of interface jamming of the present invention; and a first embodiment of the thermal layout structure is a second embodiment of the second embodiment of the interface card heat release layout structure of the present invention. [Main component symbol description] 100 circuit board 11 Heat sink 110 Heat sink 111 Fan 1110 Blade 112 Vane 113 Air outlet 12 Interface card 13 Connector 18369 10 1273381 14 Semiconductor component 210 Heat sink 25 Heat sink fin