595308 玖、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱裝置，特別是指一種能產生 立體熱傳模式，以縮短熱傳路徑，同時配合空氣擾流之應 用’而能提高散熱效率之堆疊式散熱裝置。 【先前技術】 10 如圖1，一般廣泛應用於電腦產品内之散熱器1，主要 疋具有一底座11及複數個平行並列並連接於底座11上而可 用以與空氣產生熱交換效應的散熱鰭片12,使散熱器丨之 底座11得以與一如中央處理器晶片等之發熱元件2接觸， 進而降低發熱元件2之溫度，而此種散熱器丨之製造方法 概可區分為一體成型及複合加工兩種。595308 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a heat dissipating device, and in particular, to a three-dimensional heat transfer mode capable of shortening the heat transfer path and cooperating with the application of air turbulence. Stacking heat sink for heat dissipation efficiency. [Previous technology] 10 As shown in FIG. 1, it is generally widely used in computer products. The heat sink 1 is mainly provided with a base 11 and a plurality of cooling fins connected in parallel to the base 11 and used to generate a heat exchange effect with the air. The sheet 12 enables the base 11 of the heat sink 丨 to contact a heating element 2 such as a central processing unit chip, thereby reducing the temperature of the heating element 2. The manufacturing method of this heat sink 丨 can be divided into integral molding and composite Processing two.
體成型的方式有使用鋁材料之鋁擠型製 15 20 之銅壓鑄製法、㈣程加卫，更有使用金屬粉末材料進 粉末冶金成型之製法，此種—體成型製作方法優點在於 用相同材料—次成型’使散熱器ι之底座u與散 間較無熱阻產生，使整體熱傳導係數相對較高，‘但此種 法之缺點在於受限於加工的方式，諸如模具的模穴空間=2成型之_ 12厚度不能太薄且各散熱‘ 片間的距離亦不能太近，造成散熱鰭 能太過密集而有其限制，所以 ：：度不 另外，複合加工法則是使用熱加 、銅焊或銀料，將各㈣-12分料座The methods of body molding include the aluminum die-casting method of 15 20 copper die-casting, the process of reinforcement, and the use of metal powder materials for powder metallurgy molding. The advantage of this method of body molding is that the same material is used. Molding 'makes no thermal resistance between the base u and the radiator of the radiator ι and makes the overall thermal conductivity relatively high.' However, the disadvantage of this method is that it is limited by the processing method, such as the cavity space of the mold = 2 Zhi_ 12 The thickness should not be too thin and the distance between the heat sinks should not be too close, which causes the heat sink fins to be too dense and has its limitations, so: The degree is not different. The compound processing rule is to use heat addition, brazing or Silver material
4 595308 也就是以焊接來說，因焊料之熱傳導係數一般皆低於底座 u及散熱鰭片12材料之熱傳導係數，且焊料、底座u及 散熱鰭片12間並非緊密接觸而有間隙存在，使得焊接處形- 成整體散熱器1在傳熱上主要之熱阻所在，將使得散熱器i 之導熱效果不甚理想。 又如圖2所示，為因應桌上型電腦内之高運作時脈的 中央處理器晶片等之高瓦數的發熱元件散熱之用，現今已 有採用銅鋁複合加工的方式製成的散熱器3,其主要具有一 中心導熱柱3 1，一般使用熱傳導係數較高之銅材料製成，籲 使中心導熱柱31先置於一擠型模具内，再隨紹材料一同通 過該擠型模具，使得中心導熱柱31外緣被以鋁擠型方式所 形成之複數片散熱鰭片32所包覆，此種製法之優點在於可 利用具有較咼之熱傳導係數之中心導熱柱3 1以接觸發熱元 件，以將發熱元件產生之熱量快速地進行傳導並擴散至各 散熱鰭片32 ,另外，利用鋁材料比重約為銅材料三分之一 的特性可降低整體散熱器3之重量。然而其缺點在於，由 於散熱鰭片32必須採用鋁擠型製法，因此將如前述受限於鲁 模具設計而同樣具有密度無法增加之難處，使得與空氣進 行熱交換的效能有一定之極限存在，若為求得更佳之熱傳 導性而使中心導熱柱31所佔之比例增加時，亦將因銅材料 比重較高而使得整體散熱器3之重量大幅提高。另，對於 筆記型電腦内部在上下厚度方向上嚴格受限的情況下，此 種必須直接接觸在發熱元件上方的散熱器3將有其安裝上 的困難。 5 因此’本發明之目的，即在提供一種藉由立體散熱鰭 片所產生之高效能擾流作用、配合因扇葉旋轉渦流而設計 之籍片角度及形式設計，及可使熱傳路徑縮短，散熱密度 提高’散熱效率佳之堆疊式散熱裝置。 於是，本發明堆疊式散熱裝置，包含有複數散熱鰭片 ，係彼此相互疊置，且各該散熱鰭片之一表面並凸設有一 個以上之凸出部，以使該等散熱鰭片疊置後，形成多數個 熱傳導之接觸點，且該等散熱鰭片彼此間存在一可供氣流 流動之流通空間。 本發月之功效在於藉由各散熱鰭片之凸出部的設置， 產生咼效能之立體導熱作用，不僅可使熱傳路徑縮短，同 時配合空氣擾流效應而能提高散熱密度’使散熱效率更佳 【實施方式】 15 有關本發明之前述及其他技術内容、特點與功效，在4 595308 In terms of soldering, the thermal conductivity of the solder is generally lower than the thermal conductivity of the material of the base u and the heat dissipation fins 12, and there is a gap between the solder, the base u and the heat dissipation fins 12. The welding place is formed to form the main thermal resistance of the overall heat sink 1 in terms of heat transfer, which will make the heat conduction effect of the heat sink i not ideal. As shown in Figure 2, it is used for heat dissipation of high-wattage heat-generating components such as central processing unit chips in desktop computers with high operating clocks. Nowadays, heat dissipation has been made by copper-aluminum composite processing Device 3, which mainly has a central thermally conductive post 31, is generally made of a copper material with a high thermal conductivity, and urges that the central thermally conductive post 31 be placed in an extrusion mold first, and then pass through the extrusion mold with the material So that the outer edge of the central thermal conductive pillar 31 is covered by a plurality of heat dissipation fins 32 formed by aluminum extrusion. The advantage of this method is that the central thermal conductive pillar 31 with a relatively high thermal conductivity coefficient can be used to generate heat by contact. Element to quickly conduct and diffuse the heat generated by the heating element to each of the radiating fins 32. In addition, the weight of the overall heat sink 3 can be reduced by using the characteristic that the aluminum material has a specific gravity of about one-third that of the copper material. However, its disadvantage is that because the heat dissipation fins 32 must be made by aluminum extrusion, it will have the same difficulty that the density cannot be increased as previously described due to the design of the Lu mold, so that the efficiency of heat exchange with air has a certain limit. If the proportion of the central thermally conductive pillar 31 is increased to obtain better thermal conductivity, the weight of the overall heat sink 3 will be greatly increased due to the higher specific gravity of the copper material. In addition, in the case where the interior of the notebook computer is strictly restricted in the thickness direction, such a heat sink 3 which must directly contact the heat generating element will have difficulty in mounting it. 5 Therefore, the purpose of the present invention is to provide a high-efficiency turbulence effect generated by the three-dimensional heat-dissipating fins, the angle and form design of the fins that are designed due to the rotating vortex of the fan blades, and the heat transfer path can be shortened The heat dissipation density is improved, and the stacked heat dissipation device has good heat dissipation efficiency. Therefore, the stacked heat dissipation device of the present invention includes a plurality of heat dissipation fins stacked on each other, and one surface of each of the heat dissipation fins is provided with more than one protruding portion, so that the heat dissipation fins are stacked. After the placement, a plurality of contact points for heat conduction are formed, and there is a circulation space for air flow between the heat dissipation fins. The effect of this month is that through the setting of the protruding parts of each heat sink fin, a three-dimensional heat conduction effect of 咼 efficiency can not only shorten the heat transfer path, but also improve the heat dissipation density in conjunction with the air turbulence effect. Better [Embodiment] 15 The foregoing and other technical contents, features, and effects of the present invention are described in
以下配合參考圖式之二較佳實施例的詳細說明中，將可清 楚的明白。 / 如圃 20 4、d所示，本發明堆疊式散熱裝置之第 較佳實施例’散熱襄置5包含有—上下方向直立之導熱 51，以及複數散熱鰭片52,導熱體51之下端 = 觸端部川，並藉由一固定座6將接觸端部5ιι定位在一 中央處理器晶片···等之發執元株7 μ .. 赞熱70件7上，使得接觸端部511 觸發熱元件7 〇另外，各散埶鳍 合狀熱鰭片52具有一可供導熱柱 貫穿之開孔521、一圍繞各開？丨 因％谷開孔521而朝散熱鰭片52 一 6 595308 面凸出之頸部522,以及複數以沖麼方式成型之散熱孔523 ，使得各散熱孔523周圍形成有凸出部524,凸出部524與 頸部522係朝同方向凸出延伸，藉此該等散熱韓片52可藉 5 開孔521而相互疊置，至於各散熱韓片52 與導熱柱51間之結合加卫可用-般物理性方式，諸如緊配 10 合加，結合法、冷熱加工結合法、摩擦結合法、壓鍛結合 法…等等。且組合疊置後之該等散熱㈣52彼此間並存在 一可供氣流流動之流通空間525。另外，該等散熱鰭片％ 垂直相疊置後，上、下散熱縛片52之各該散熱孔⑵並呈 部份重疊而部份錯開，以使後續裝設於散熱裝1 $ 了頁部之 風扇（圖未示）旋動時，扇葉旋動所產生之氣流可循流通空間 ^流動進而能形成渦旋風流’進而可使熱能迅速被風流帶 離0 15 20 在使用上，發熱元件7之熱量傳遞至各散熱W… 熱空氣如前述在各散熱鰭片52之流通空間⑵間形成立體 式之渴旋風流’而凸伸於流通空間⑵中各凸出部似將 對風流產生擾流作用，藉以提高散熱密度，並延長0氣 進行熱交換之時間，同時相對散_片52透過凸出部= 相互接合以縮短熱傳路徑，因此能有效提高散熱效率。 如圖6所示，本發明第二較佳實施例所示之散熱裝置8 與第-較佳實施例不同處，在於各散_片8ι上不再設置 散熱孔’而是以沖壓方式使得各散熱鰭片81由其項面^底 面方向凸出形成有複數個凸出部81卜不同散熱鰭片81之 該等凸出部811並相錯開，且各散熱鰭片於相對應之位 7The following detailed description with reference to the preferred embodiment of the second drawing will make it clear. / As shown in the garden 20 4 and d, the first preferred embodiment of the stacked heat dissipation device of the present invention, the heat dissipation device 5 includes a heat transfer 51 standing up and down, and a plurality of heat dissipation fins 52, and the lower end of the heat transfer body 51 = Touch the end part, and position the contact end part 5 ι on a central processing unit chip through a fixing seat 6 ... etc. 70 pieces of 7 are praised, so that the contact end part 511 is triggered Thermal element 7 〇 In addition, each of the scattered fin-shaped thermal fins 52 has an opening 521 through which a thermally conductive pillar can penetrate, and one opening around each?丨 Because of the% valley openings 521, the neck 522 protruding toward the heat dissipation fins 52 to 6 595308, and a plurality of heat dissipation holes 523 formed in a punching manner, so that each heat dissipation hole 523 is formed with a protruding portion 524, convex The exit portion 524 and the neck portion 522 project and extend in the same direction, so that the heat sinking fins 52 can be stacked on top of each other by 5 openings 521. As for the combination of the heat sinking fins 52 and the thermal conductive pillars 51, -General physical methods, such as tight fit 10 combined, combined method, cold and hot processing combined method, friction combined method, press forged combined method ... and so on. In addition, there is a circulation space 525 for the airflow to flow between the stacked heat sinks 52. In addition, after the heat radiation fins are stacked vertically, each of the heat radiation holes of the upper and lower heat radiation fins 52 is partially overlapped and partially staggered, so that the subsequent installation in the heat radiation device 1 $ 页 部When the fan (not shown) rotates, the airflow generated by the rotation of the fan blades can flow through the circulation space ^ to form a vortex airflow ', so that the thermal energy can be quickly taken away by the airflow. 0 15 20 In use, the heating element The heat of 7 is transmitted to each heat radiating W ... The hot air forms a three-dimensional thirsty cyclone flow between the circulation spaces ⑵ of each radiating fin 52 as described above, and the protrusions in the circulation space 似 appear to disturb the air flow. Flow to increase heat dissipation density and extend the time of 0 gas for heat exchange. At the same time, the relative diffuser sheet 52 penetrates through the protruding part = interconnects to shorten the heat transfer path, so it can effectively improve heat dissipation efficiency. As shown in FIG. 6, the heat dissipation device 8 shown in the second preferred embodiment of the present invention is different from the first preferred embodiment in that the heat dissipation holes are no longer provided on each of the scattered sheets 8 ′, but each of the heat dissipation devices 8 is stamped. A plurality of projections 81 are formed on the heat dissipation fin 81 from the direction of the front surface ^ bottom surface thereof, and the projections 811 of different heat dissipation fins 81 are staggered, and each heat dissipation fin is in a corresponding position 7