M3810.99 五、新型說明： 【新型所屬之技独ί領域】 [0001] 本創作涉及一種電路板組合，尤指一種具有散熱模組之 電路板組合。 【先前技術】 [0002] 隨著科學技術之進步，電腦會朝著體積小、厚度薄及主 機與顯示器一體化之方向發展。與此同時，電腦之功能 越來越多，CPU (Central Processing Unit，中央處 理器）不斷升級，CPU之功耗不斷加大，然安裝散熱器之 空間卻越來越小，加大了散熱之難度。 [0003] 傳統筆記本電腦之CPU散熱模組包括一貼於CPU晶片上之 散熱器及一散熱風扇。該散熱風扇裝設於該散熱器上， 該散熱風扇從上往下對該散熱器吹風，由於空間之局限 性，散熱效果不是很理想，CPU因有時溫度過高而不能正 常工作。 【新型内容】 [0004] 鑒於以上内容，有必要提供一種具有散熱模組之電路板 組合，該散熱模組能有效地對電路板上之發熱元件進行 散熱。 [0005] —種電路板組合，包括一電路板、一第一散熱模組及一 第二散熱模組，該電路板包括一第一發熱元件及一第二 發熱元件，該第一散熱模組裝設於該第一發熱元件上用 於對該第一發熱元件散熱，該第二散熱模組裝設於該第 二發熱元件上用於對該第二發熱元件散熱，該第一散熱 表單編號A0101 第3頁/共13頁 模組包括一散熱器及一第一熱管，該第一熱管包括一熱 管本體及一自該熱管本體延伸形成之延伸部，該熱管本 體固設於該散熱器，該延伸部固設於該第二散熱模組。 [0006] 優選地，該第一熱管呈L形。 [0007] 優選地，述散熱器包括一用於接觸該第一發熱元件之第 一基座及一裝設於該第一基座上之第一鰭片組，該第一 熱管接觸該第一基座並固設於該第一鰭片組。 [0008] 優選地，該第一散熱模組還包括一散熱風扇，該散熱風 扇裝設於該散熱器上，該散熱器位於該散熱風扇與該電 路板之間。 [0009] 優選地，該散熱風扇設有一安裝孔，該電路板設有一對 應之通孔，一固定件透過該安裝孔及該通孔將該散熱風 扇固定該散熱器上。 [0010] 優選地，該第二散熱模組包括一第二基座及一裝設於該 第二基座上之第二鰭片組，該延伸部固設於該第二基座 * 〇 [0011] 優選地，該第二散熱模組包括一第二基座、一裝設於該 第二基座上之第二鰭片組及一第二熱管，.該第二熱管固 設於該第二基座。 [0012] 優選地，該第二熱管呈U形。 [0013] 優選地，該第二散熱模組包括一第二基座及一裝設於該 第二基座上之第二鰭片組，該第二基座向外延伸形成一 固定部，該固定部設有一固定孔，該電路對應該固定孔 表單編號A0101 第4頁/共13頁 M381099 設有一開孔，一固定件透過該固定孔及該開孔將該第二 散熱模組固定於該電路板上。 [0014] 與習知技術相比，本創作電路板組合包括兩個散熱模組 ，其中一散熱模組藉由一熱管連接另一散熱模組，當一 散熱模組溫度過高時，可藉由熱管將熱量傳遞給另一散 熱模組。 【實施方式】 [0015] 請參閱圖1與圖2，本創作較佳實施例電路板組合包括一 散熱模組10、一第二散熱模組20及一電路板30。該電路 板30包括一第一發熱元件31及一第二發熱元件32，該第 一散熱模組10用於裝設於第一發熱元件31上對其進行散 熱，該第二散熱模組20用於裝設於該第二發熱元件32散 熱。於本實施例中，該第一發熱元件31為CPU，該第二發 熱元件32為北橋晶片。 [0016] 該第一散熱模組10包括一散熱風扇11及一散熱器12，該 散熱風扇11裝設於該散熱器12上，該散熱器12位於該散 熱風扇11與該電路板30之間。該散熱風扇11於一侧之兩 端設有兩個安裝孔111。該散熱器12包括一用於接觸該第 一發熱元件31之第一基座121、一裝設於該第一基座121 上之第一鰭片組122及一對第一熱管123，該第一熱管 123呈L形，該第一熱管123包括一熱管本體1231及一自 該熱管本體垂直延伸形成之延伸部1232，該熱管本體 1231固設於該第一鰭片組122。 [0017] 該第二散熱模組20包括一第二基座21、一第二鰭片組22 表單编號A0101 第5頁/共13頁 M381099 及一固設於該第二基座21中之第二熱管23。該第二熱管 23呈U形。該第二基座21呀端分別向外延伸形成四個固定 部211，每一固定部211設有一固定孔213。該第一熱管 123之延伸部1232固設於該第二基座21。 [0018] 該電路板30對應該第一散熱模組10之散熱風扇n之安裝 孔111設有對應之安裝凸體311，每一安裝凸體311設有 一通孔313 ’該電路板30對應該第二散熱模組2〇之固定孔 213設有對應之四個開孔321。 [0019] 請一起參閱圖1至圖3 ’組裝時，該第二散熱模組2〇之四 個固定孔213分別與該電路板3〇之開孔321對應，此時， 該第一散熱模組10之散熱器12之第一基座121接觸該第一 發熱元件31 ’該第二散熱模組2〇之第二基座21接觸該第 一發熱元件3 2，四個固定件215分別從上往下鎖入該安裝 孔111及該開孔321而將該第二散熱模組2〇及該第一散熱 模組10之散熱器12固定於該電路板30上。將該第一散熱 模組10之散熱風扇11放置於該散熱器12上並使該散熱風 扇11之安裝孔111與該電路板3〇之通孔313對應，兩個固 定件11 3從上往下分別鎖入該安裝孔hi與該通孔313而 將該散熱風扇11固定於該散熱器12上。 [0020] 當該第一發熱元件31及該第二發熱元件32工作產生熱量 時，由於第二發熱元件32發熱量比該第一發熱元件31少 ’該第一散熱模組10將部分熱量藉由該第一，熱管123之第 二延伸部1232傳遞給該第二散熱模組20，這樣就加快了 對該第一發熱元件31之散熱。 表單編號A0101 第6頁/共13頁 M381099 [0021] 綜上所述，本創作確已符合發明專利要求，爰依法提出 專利申請。惟，以上所述者僅為本創作之較佳實施方式 ，舉凡熟悉本創作技藝之人士，爰依本創作之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 【圖式簡單說明】 [0022] 圖1為本創作電路板組合較佳實施例之一立體分解圖。 [0023] 圖2為本創作電路板組合較佳實施例之另一立體組裝圖。 [0024] 圖3為本創作電路板組合較佳實施例之立體組裝圖。 【主要元件符號說明】 [0025] 散熱模組：10 [0026] 散熱風扇：11 [0027] 安裝孔：111 [0028] 固定件：11 3 [0029] 散熱器：12 [0030] 第一基座：121 [0031] 第一鰭片組：122 [0032] 第一熱管：123 [0033] 熱管本體：1231 [0034] 延伸部：1232 [0035] 第二散熱模組：20 表單編號A0101 第7頁/共13頁 M381099 [0036] 第二基座：21 [0037] 固定部：211 [0038] 固定孔：21 3 [0039] 固定件：215 [0040] 第二鰭片組：22 [0041] 第二熱管：23 [0042] 電路板：30 [0043] 第一發熱元件：31 [0044] 安裝凸體：311 [0045] 通孔：313 [0046] 第二發熱元件：32 [0047] 開孔：321 表單編號A0101 第8頁/共13頁M3810.99 V. New description: [New technology belongs to the field] [0001] This creation relates to a circuit board combination, especially a circuit board combination with a heat dissipation module. [Prior Art] [0002] With the advancement of science and technology, computers will develop in the direction of small size, thin thickness and integration of host and display. At the same time, the functions of the computer are more and more, the CPU (Central Processing Unit) is constantly upgraded, and the power consumption of the CPU is continuously increasing. However, the space for installing the heat sink is getting smaller and smaller, and the heat dissipation is increased. Difficulty. [0003] A CPU thermal module of a conventional notebook computer includes a heat sink attached to a CPU chip and a heat dissipation fan. The cooling fan is mounted on the heat sink. The cooling fan blows the heat sink from top to bottom. Due to space limitations, the heat dissipation effect is not ideal, and the CPU may not work properly due to sometimes too high temperature. [New Content] [0004] In view of the above, it is necessary to provide a circuit board combination having a heat dissipation module that can effectively dissipate heat from the heat generating components on the circuit board. [0005] A circuit board assembly includes a circuit board, a first heat dissipation module, and a second heat dissipation module, the circuit board includes a first heating element and a second heating element, and the first heat dissipation module And being disposed on the first heat-generating component for dissipating heat to the first heat-generating component, wherein the second heat-dissipating die is assembled on the second heat-generating component for dissipating heat to the second heat-generating component, the first heat-dissipation form number A0101 page 3 of 13 includes a heat sink and a first heat pipe. The first heat pipe includes a heat pipe body and an extension extending from the heat pipe body. The heat pipe body is fixed to the heat sink. The extension is fixed to the second heat dissipation module. [0006] Preferably, the first heat pipe is L-shaped. [0007] Preferably, the heat sink includes a first base for contacting the first heat generating component and a first fin set mounted on the first base, the first heat pipe contacting the first The pedestal is fixed to the first fin set. [0008] Preferably, the first heat dissipation module further includes a heat dissipation fan, and the heat dissipation fan is disposed on the heat dissipation device, and the heat dissipation device is located between the heat dissipation fan and the circuit board. [0009] Preferably, the heat dissipating fan is provided with a mounting hole, and the circuit board is provided with a pair of through holes, and a fixing member passes through the mounting hole and the through hole to fix the heat dissipating fan to the heat sink. [0010] Preferably, the second heat dissipation module includes a second base and a second fin set mounted on the second base, and the extension is fixed to the second base*[ Preferably, the second heat dissipation module includes a second base, a second fin set mounted on the second base, and a second heat pipe. The second heat pipe is fixed to the second heat pipe. Two pedestals. [0012] Preferably, the second heat pipe has a U shape. [0013] Preferably, the second heat dissipation module includes a second base and a second fin set mounted on the second base, and the second base extends outward to form a fixing portion. The fixing portion is provided with a fixing hole, and the circuit is provided with a hole corresponding to the fixing hole form No. A0101, page 4/13, M381099, and a fixing member is fixed to the second heat dissipating module through the fixing hole and the opening. On the board. [0014] Compared with the prior art, the circuit board assembly includes two heat dissipation modules, wherein one heat dissipation module is connected to another heat dissipation module by a heat pipe. When the temperature of a heat dissipation module is too high, Heat is transferred from the heat pipe to the other heat sink module. [0015] Referring to FIG. 1 and FIG. 2, the circuit board assembly of the preferred embodiment includes a heat dissipation module 10, a second heat dissipation module 20, and a circuit board 30. The circuit board 30 includes a first heat-generating component 31 and a second heat-generating component 32. The first heat-dissipation module 10 is disposed on the first heat-generating component 31 for heat dissipation, and the second heat-dissipation module 20 is used. The heat is disposed on the second heating element 32. In this embodiment, the first heating element 31 is a CPU, and the second heating element 32 is a north bridge wafer. [0016] The first heat dissipation module 10 includes a heat dissipation fan 11 and a heat sink 12, and the heat dissipation fan 11 is disposed on the heat sink 12, and the heat sink 12 is located between the heat dissipation fan 11 and the circuit board 30. . The heat radiating fan 11 is provided with two mounting holes 111 at both ends of one side. The heat sink 12 includes a first pedestal 121 for contacting the first heating element 31, a first fin set 122 mounted on the first pedestal 121, and a pair of first heat pipes 123. A heat pipe 123 is L-shaped. The first heat pipe 123 includes a heat pipe body 1231 and an extension portion 1232 extending from the heat pipe body. The heat pipe body 1231 is fixed to the first fin group 122. [0017] The second heat dissipation module 20 includes a second base 21, a second fin set 22, a form number A0101, a fifth page, a total of 13 pages, M381099, and a second base 21. The second heat pipe 23. The second heat pipe 23 has a U shape. The second base 21 extends outwardly to form four fixing portions 211, and each fixing portion 211 is provided with a fixing hole 213. The extension portion 1232 of the first heat pipe 123 is fixed to the second base 21. [0018] The mounting hole 111 of the heat dissipation fan n of the first heat dissipation module 10 is provided with a corresponding mounting protrusion 311, and each mounting protrusion 311 is provided with a through hole 313 ′. The fixing holes 213 of the second heat dissipation module 2 are provided with four corresponding openings 321 . [0019] Referring to FIG. 1 to FIG. 3 together, the four fixing holes 213 of the second heat dissipation module 2 are respectively corresponding to the openings 321 of the circuit board 3, and at this time, the first heat dissipation mode The first pedestal 121 of the heat sink 12 of the group 10 contacts the first heat generating component 31 ′. The second pedestal 21 of the second heat dissipation module 2 contacts the first heat generating component 3 2 , and the four fixing members 215 respectively The second heat dissipation module 2 and the heat sink 12 of the first heat dissipation module 10 are fixed to the circuit board 30 by locking the mounting hole 111 and the opening 321 upward and downward. The heat dissipation fan 11 of the first heat dissipation module 10 is placed on the heat sink 12, and the mounting hole 111 of the heat dissipation fan 11 is corresponding to the through hole 313 of the circuit board 3, and the two fixing members 11 3 are from the top to the bottom. The mounting hole hi and the through hole 313 are respectively locked to fix the heat dissipating fan 11 to the heat sink 12. [0020] When the first heating element 31 and the second heating element 32 work to generate heat, since the second heating element 32 generates less heat than the first heating element 31, the first heat dissipation module 10 will partially heat From the first, the second extension portion 1232 of the heat pipe 123 is transmitted to the second heat dissipation module 20, thereby accelerating the heat dissipation of the first heat generating component 31. Form No. A0101 Page 6 of 13 M381099 [0021] In summary, this creation has indeed met the requirements of the invention patent, and filed a patent application according to law. However, the above descriptions are only preferred embodiments of the present invention. Those who are familiar with the creative techniques, equivalent modifications or changes made in accordance with the spirit of this creation, shall be covered by the following patent applications. BRIEF DESCRIPTION OF THE DRAWINGS [0022] FIG. 1 is an exploded perspective view of a preferred embodiment of a circuit board assembly. 2 is another perspective assembled view of a preferred embodiment of the circuit board assembly of the present invention. [0024] FIG. 3 is a perspective assembled view of a preferred embodiment of the circuit board assembly. [Main component symbol description] [0025] Thermal module: 10 [0026] Cooling fan: 11 [0027] Mounting hole: 111 [0028] Fixing member: 11 3 [0029] Heat sink: 12 [0030] First base :121 [0031] First fin set: 122 [0032] First heat pipe: 123 [0033] Heat pipe body: 1231 [0034] Extension: 1232 [0035] Second heat dissipation module: 20 Form number A0101 Page 7 / Total 13 pages M381099 [0036] Second base: 21 [0037] Fixing part: 211 [0038] Fixing hole: 21 3 [0039] Fixing member: 215 [0040] Second fin set: 22 [0041] Two heat pipes: 23 [0042] Circuit board: 30 [0043] First heat generating component: 31 [0044] Mounting projection: 311 [0045] Through hole: 313 [0046] Second heating element: 32 [0047] Opening: 321 Form No. A0101 Page 8 of 13