TWI266264B - Packaging method for overlapped substrates - Google Patents

Packaging method for overlapped substrates

Info

Publication number
TWI266264B
TWI266264B TW093120525A TW93120525A TWI266264B TW I266264 B TWI266264 B TW I266264B TW 093120525 A TW093120525 A TW 093120525A TW 93120525 A TW93120525 A TW 93120525A TW I266264 B TWI266264 B TW I266264B
Authority
TW
Taiwan
Prior art keywords
electrostatic suction
substrate
upper substrate
enforcing
posture
Prior art date
Application number
TW093120525A
Other languages
English (en)
Chinese (zh)
Other versions
TW200517700A (en
Inventor
Noriyuki Takefushi
Yasuyuki Koga
Hideki Oshima
Ryoichi Inaba
Original Assignee
Shinetsu Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Eng Co Ltd filed Critical Shinetsu Eng Co Ltd
Publication of TW200517700A publication Critical patent/TW200517700A/zh
Application granted granted Critical
Publication of TWI266264B publication Critical patent/TWI266264B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/26—Sealing together parts of vessels
    • H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Liquid Crystal (AREA)
  • Wrapping Of Specific Fragile Articles (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW093120525A 2003-10-23 2004-07-08 Packaging method for overlapped substrates TWI266264B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/013536 WO2005041156A1 (ja) 2003-10-23 2003-10-23 基板重ね合せ封止方法

Publications (2)

Publication Number Publication Date
TW200517700A TW200517700A (en) 2005-06-01
TWI266264B true TWI266264B (en) 2006-11-11

Family

ID=34509566

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093120525A TWI266264B (en) 2003-10-23 2004-07-08 Packaging method for overlapped substrates

Country Status (6)

Country Link
JP (1) JP3721378B2 (ko)
KR (1) KR100938192B1 (ko)
CN (1) CN100426338C (ko)
AU (1) AU2003275604A1 (ko)
TW (1) TWI266264B (ko)
WO (1) WO2005041156A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008041293A1 (fr) * 2006-09-29 2008-04-10 Shin-Etsu Engineering Co., Ltd. Procédé de transfert de pièce, dispositif à mandrin électrostatique et procédé de jonction de carte
WO2008041294A1 (fr) * 2006-09-29 2008-04-10 Shin-Etsu Engineering Co., Ltd. Dispositif à mandrin pour machine de liaison de substrat et procédé de neutralisation de charges sur un substrat
JP2008134439A (ja) * 2006-11-28 2008-06-12 Matsushita Electric Ind Co Ltd フラットパネル供給方法及びフラットパネル組立装置
JP5308725B2 (ja) * 2008-06-17 2013-10-09 スタンレー電気株式会社 基板貼り合わせ方法
KR101182172B1 (ko) * 2010-10-18 2012-09-12 에이피시스템 주식회사 플렉서블 액정 디스플레이 제조장치
CN108602342B (zh) * 2016-10-17 2020-06-12 信越工程株式会社 贴合器件的真空贴合装置
CN108890680A (zh) * 2018-08-23 2018-11-27 苏州软体机器人科技有限公司 一种利用静电吸附效应进行抓取动作的执行器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06235896A (ja) * 1993-02-08 1994-08-23 Ropuko:Kk 非接触加圧貼り合わせ方法
JP2002090703A (ja) * 2000-09-13 2002-03-27 Sharp Corp 液晶用基板組立装置および方法
JP4690572B2 (ja) * 2000-11-30 2011-06-01 キヤノンアネルバ株式会社 基板重ね合わせ装置
JP3742000B2 (ja) * 2000-11-30 2006-02-01 富士通株式会社 プレス装置
JP3458145B2 (ja) * 2001-04-17 2003-10-20 株式会社 日立インダストリイズ 基板貼り合わせ方法及びその装置
US6991699B2 (en) * 2002-02-05 2006-01-31 Lg.Philips Lcd Co., Ltd. LCD bonding machine and method for fabricating LCD by using the same
TW583428B (en) * 2002-02-22 2004-04-11 Shibaura Mechatronics Corp Substrate laminating apparatus and method
JP3693972B2 (ja) * 2002-03-19 2005-09-14 富士通株式会社 貼合せ基板製造装置及び基板貼合せ方法

Also Published As

Publication number Publication date
AU2003275604A1 (en) 2005-05-11
JPWO2005041156A1 (ja) 2007-03-29
KR20060093357A (ko) 2006-08-25
WO2005041156A1 (ja) 2005-05-06
JP3721378B2 (ja) 2005-11-30
TW200517700A (en) 2005-06-01
CN100426338C (zh) 2008-10-15
KR100938192B1 (ko) 2010-01-21
CN1692388A (zh) 2005-11-02

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