TWI265727B - Image sensor inspection system - Google Patents

Image sensor inspection system

Info

Publication number
TWI265727B
TWI265727B TW094118901A TW94118901A TWI265727B TW I265727 B TWI265727 B TW I265727B TW 094118901 A TW094118901 A TW 094118901A TW 94118901 A TW94118901 A TW 94118901A TW I265727 B TWI265727 B TW I265727B
Authority
TW
Taiwan
Prior art keywords
image sensor
inspection
inspected
processing device
data
Prior art date
Application number
TW094118901A
Other languages
English (en)
Other versions
TW200618612A (en
Inventor
Akihiro Uchida
Norihide Fujiki
Masahiro Ishibashi
Original Assignee
Yokogawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Electric Corp filed Critical Yokogawa Electric Corp
Publication of TW200618612A publication Critical patent/TW200618612A/zh
Application granted granted Critical
Publication of TWI265727B publication Critical patent/TWI265727B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing, Inspecting, Measuring Of Stereoscopic Televisions And Televisions (AREA)
TW094118901A 2004-11-29 2005-06-08 Image sensor inspection system TWI265727B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004343872A JP4645174B2 (ja) 2004-11-29 2004-11-29 固体撮像素子検査システム

Publications (2)

Publication Number Publication Date
TW200618612A TW200618612A (en) 2006-06-01
TWI265727B true TWI265727B (en) 2006-11-01

Family

ID=36634546

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094118901A TWI265727B (en) 2004-11-29 2005-06-08 Image sensor inspection system

Country Status (3)

Country Link
JP (1) JP4645174B2 (zh)
KR (1) KR100675766B1 (zh)
TW (1) TWI265727B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI627854B (zh) * 2013-03-04 2018-06-21 Sony Corp Uneven spot inspection system, uneven spot inspection method and uneven spot inspection program

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4683267B2 (ja) * 2005-01-19 2011-05-18 横河電機株式会社 固体撮像素子検査システム
DE102008020772A1 (de) * 2008-04-21 2009-10-22 Carl Zeiss 3D Metrology Services Gmbh Darstellung von Ergebnissen einer Vermessung von Werkstücken

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001016622A (ja) * 1999-06-30 2001-01-19 Agilent Technologies Japan Ltd 撮像素子のデバッグ装置と試験方法
JP2001183406A (ja) * 1999-10-15 2001-07-06 Sony Corp 電子機器の評価装置、電子機器の評価方法及び電子機器の評価機能を有するプログラムを記録したコンピュータ読み取り可能な情報記録媒体
JP2001141601A (ja) * 1999-11-11 2001-05-25 Sony Corp 表示装置または撮像装置の評価選別方法及び装置
JP2002027506A (ja) * 2000-07-12 2002-01-25 Yokogawa Electric Corp 固体撮像素子検査装置
JP2002252161A (ja) * 2001-02-23 2002-09-06 Hitachi Ltd 半導体製造システム
JP2004045052A (ja) * 2002-07-08 2004-02-12 Sharp Corp 画像データ検査装置および画像データ検査方法
JP4243500B2 (ja) * 2003-03-12 2009-03-25 日本Ｃｍｏ株式会社 ディスプレイパネルの欠陥検査システム
JP2004294358A (ja) * 2003-03-28 2004-10-21 Hitachi High-Technologies Corp 欠陥検査方法および装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI627854B (zh) * 2013-03-04 2018-06-21 Sony Corp Uneven spot inspection system, uneven spot inspection method and uneven spot inspection program
US10089754B2 (en) 2013-03-04 2018-10-02 Saturn Licensing Llc Unevenness inspection system, unevenness inspection method, and unevenness inspection program

Also Published As

Publication number Publication date
KR100675766B1 (ko) 2007-01-30
JP2006156641A (ja) 2006-06-15
KR20060059788A (ko) 2006-06-02
JP4645174B2 (ja) 2011-03-09
TW200618612A (en) 2006-06-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees