TWI264271B - Heat sink - Google Patents

Heat sink

Info

Publication number
TWI264271B
TWI264271B TW094115552A TW94115552A TWI264271B TW I264271 B TWI264271 B TW I264271B TW 094115552 A TW094115552 A TW 094115552A TW 94115552 A TW94115552 A TW 94115552A TW I264271 B TWI264271 B TW I264271B
Authority
TW
Taiwan
Prior art keywords
fin
heat sink
baffle
central area
oblique vent
Prior art date
Application number
TW094115552A
Other languages
English (en)
Other versions
TW200640354A (en
Inventor
Alex Hsia
Yu-Hung Huang
Chin-Ming Chen
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW094115552A priority Critical patent/TWI264271B/zh
Priority to US11/287,393 priority patent/US20060260785A1/en
Application granted granted Critical
Publication of TWI264271B publication Critical patent/TWI264271B/zh
Publication of TW200640354A publication Critical patent/TW200640354A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
TW094115552A 2005-05-13 2005-05-13 Heat sink TWI264271B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094115552A TWI264271B (en) 2005-05-13 2005-05-13 Heat sink
US11/287,393 US20060260785A1 (en) 2005-05-13 2005-11-28 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094115552A TWI264271B (en) 2005-05-13 2005-05-13 Heat sink

Publications (2)

Publication Number Publication Date
TWI264271B true TWI264271B (en) 2006-10-11
TW200640354A TW200640354A (en) 2006-11-16

Family

ID=37447257

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094115552A TWI264271B (en) 2005-05-13 2005-05-13 Heat sink

Country Status (2)

Country Link
US (1) US20060260785A1 (zh)
TW (1) TWI264271B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI289648B (en) * 2005-07-07 2007-11-11 Ama Precision Inc Heat sink structure
US20070095508A1 (en) * 2005-11-02 2007-05-03 Foxconn Technology Co., Ltd. Heat dissipation device having louvered heat-dissipating fins
US20070119566A1 (en) * 2005-11-30 2007-05-31 Xue-Wen Peng Heat dissipation device
JP2008217189A (ja) * 2007-03-01 2008-09-18 Nec Corp 電子装置
TWM336475U (en) * 2008-03-03 2008-07-11 Tai Sol Electronics Co Ltd Heat dissipater with internal flow guiding function
CN101888765A (zh) * 2009-05-15 2010-11-17 鸿富锦精密工业（深圳）有限公司 散热装置
US10506719B2 (en) * 2013-01-15 2019-12-10 Blackberry Limited Thermal dissipater apparatus for use with electronic devices
TW201502459A (zh) * 2013-07-10 2015-01-16 Hon Hai Prec Ind Co Ltd 散熱器
JP6437481B2 (ja) * 2016-04-01 2018-12-12 ミネベアミツミ株式会社 照明装置

Family Cites Families (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0927331B1 (en) * 1996-08-08 2004-03-31 William Marsh Rice University Macroscopically manipulable nanoscale devices made from nanotube assemblies
US6057637A (en) * 1996-09-13 2000-05-02 The Regents Of The University Of California Field emission electron source
US6409567B1 (en) * 1997-12-15 2002-06-25 E.I. Du Pont De Nemours And Company Past-deposited carbon electron emitters
EP1089938A1 (en) * 1998-06-19 2001-04-11 The Research Foundation Of State University Of New York Free-standing and aligned carbon nanotubes and synthesis thereof
US6346189B1 (en) * 1998-08-14 2002-02-12 The Board Of Trustees Of The Leland Stanford Junior University Carbon nanotube structures made using catalyst islands
US6630772B1 (en) * 1998-09-21 2003-10-07 Agere Systems Inc. Device comprising carbon nanotube field emitter structure and process for forming device
US6331262B1 (en) * 1998-10-02 2001-12-18 University Of Kentucky Research Foundation Method of solubilizing shortened single-walled carbon nanotubes in organic solutions
US6641793B2 (en) * 1998-10-02 2003-11-04 University Of Kentucky Research Foundation Method of solubilizing single-walled carbon nanotubes in organic solutions
US6531513B2 (en) * 1998-10-02 2003-03-11 University Of Kentucky Research Foundation Method of solubilizing carbon nanotubes in organic solutions
US6187823B1 (en) * 1998-10-02 2001-02-13 University Of Kentucky Research Foundation Solubilizing single-walled carbon nanotubes by direct reaction with amines and alkylaryl amines
US6368569B1 (en) * 1998-10-02 2002-04-09 University Of Kentucky Research Foundation Method of solubilizing unshortened carbon nanotubes in organic solutions
AUPP976499A0 (en) * 1999-04-16 1999-05-06 Commonwealth Scientific And Industrial Research Organisation Multilayer carbon nanotube films
JP2003507304A (ja) * 1999-08-12 2003-02-25 ミッドウエスト リサーチ インスティチュート 高純度単一壁カーボンナノチューブ
US6277318B1 (en) * 1999-08-18 2001-08-21 Agere Systems Guardian Corp. Method for fabrication of patterned carbon nanotube films
KR20010055501A (ko) * 1999-12-10 2001-07-04 김순택 전계 방출 표시 소자의 음극 형성 방법
KR20010056153A (ko) * 1999-12-14 2001-07-04 구자홍 카본나노 튜브막을 갖는 전계방출형 디스플레이 소자 및그의 제조방법
US6495116B1 (en) * 2000-04-10 2002-12-17 Lockheed Martin Corporation Net shape manufacturing using carbon nanotubes
EP1170799A3 (de) * 2000-07-04 2009-04-01 Infineon Technologies AG Elektronisches Bauelement und Verfahren zum Herstellen eines elektronischen Bauelements
JP3859199B2 (ja) * 2000-07-18 2006-12-20 エルジー エレクトロニクス インコーポレイティド カーボンナノチューブの水平成長方法及びこれを利用した電界効果トランジスタ
KR100376768B1 (ko) * 2000-08-23 2003-03-19 한국과학기술연구원 전자, 스핀 및 광소자 응용을 위한 탄소나노튜브의 선택적 수평성장 방법
US6495258B1 (en) * 2000-09-20 2002-12-17 Auburn University Structures with high number density of carbon nanotubes and 3-dimensional distribution
US6423583B1 (en) * 2001-01-03 2002-07-23 International Business Machines Corporation Methodology for electrically induced selective breakdown of nanotubes
US6752977B2 (en) * 2001-02-12 2004-06-22 William Marsh Rice University Process for purifying single-wall carbon nanotubes and compositions thereof
CN1543399B (zh) * 2001-03-26 2011-02-23 艾考斯公司 含碳纳米管的涂层
US20020160111A1 (en) * 2001-04-25 2002-10-31 Yi Sun Method for fabrication of field emission devices using carbon nanotube film as a cathode
WO2002095097A1 (en) * 2001-05-21 2002-11-28 Trustees Of Boston College, The Varied morphology carbon nanotubes and methods for their manufacture
JP4207398B2 (ja) * 2001-05-21 2009-01-14 富士ゼロックス株式会社 カーボンナノチューブ構造体の配線の製造方法、並びに、カーボンナノチューブ構造体の配線およびそれを用いたカーボンナノチューブデバイス
US20040023253A1 (en) * 2001-06-11 2004-02-05 Sandeep Kunwar Device structure for closely spaced electrodes
US6896864B2 (en) * 2001-07-10 2005-05-24 Battelle Memorial Institute Spatial localization of dispersed single walled carbon nanotubes into useful structures
US6924538B2 (en) * 2001-07-25 2005-08-02 Nantero, Inc. Devices having vertically-disposed nanofabric articles and methods of making the same
US6919592B2 (en) * 2001-07-25 2005-07-19 Nantero, Inc. Electromechanical memory array using nanotube ribbons and method for making same
US6706402B2 (en) * 2001-07-25 2004-03-16 Nantero, Inc. Nanotube films and articles
US7259410B2 (en) * 2001-07-25 2007-08-21 Nantero, Inc. Devices having horizontally-disposed nanofabric articles and methods of making the same
EP1444701A4 (en) * 2001-07-27 2005-01-12 Eikos Inc CONFORMAL COATINGS CONTAINING CARBON NANOTUBES
EP1414744A1 (en) * 2001-07-27 2004-05-06 University Of Surrey Production of carbon nanotubes
US7671230B2 (en) * 2001-10-01 2010-03-02 Tda Research, Inc. Derivatization and solubilization of insoluble classes of fullerenes
US7812190B2 (en) * 2001-10-01 2010-10-12 Tda Research, Inc. Derivatization and solubilization of fullerenes for use in therapeutic and diagnostic applications
US6862183B2 (en) * 2001-10-29 2005-03-01 Intel Corporation Composite fins for heat sinks
US6645628B2 (en) * 2001-11-13 2003-11-11 The United States Of America As Represented By The Secretary Of The Air Force Carbon nanotube coated anode
US6894359B2 (en) * 2002-09-04 2005-05-17 Nanomix, Inc. Sensitivity control for nanotube sensors
WO2003063208A2 (en) * 2002-01-18 2003-07-31 California Institute Of Technology Array-based architecture for molecular electronics
US20030168208A1 (en) * 2002-03-11 2003-09-11 Kaoru Sato Electronic component cooling apparatus
US6889216B2 (en) * 2002-03-12 2005-05-03 Knowm Tech, Llc Physical neural network design incorporating nanotechnology
US6858197B1 (en) * 2002-03-13 2005-02-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Controlled patterning and growth of single wall and multi-wall carbon nanotubes
US6919730B2 (en) * 2002-03-18 2005-07-19 Honeywell International, Inc. Carbon nanotube sensor
US6899945B2 (en) * 2002-03-19 2005-05-31 William Marsh Rice University Entangled single-wall carbon nanotube solid material and methods for making same
US6872645B2 (en) * 2002-04-02 2005-03-29 Nanosys, Inc. Methods of positioning and/or orienting nanostructures
US6946410B2 (en) * 2002-04-05 2005-09-20 E. I. Du Pont De Nemours And Company Method for providing nano-structures of uniform length
US20040034177A1 (en) * 2002-05-02 2004-02-19 Jian Chen Polymer and method for using the polymer for solubilizing nanotubes
US6655448B1 (en) * 2002-05-16 2003-12-02 Hai-Ching Lin Radiator with heat dissipation pieces connected in series
CN100341629C (zh) * 2002-05-21 2007-10-10 艾考斯公司 使碳纳米管涂层形成图案的方法和碳纳米管布线
US20040007528A1 (en) * 2002-07-03 2004-01-15 The Regents Of The University Of California Intertwined, free-standing carbon nanotube mesh for use as separation, concentration, and/or filtration medium
TW527099U (en) * 2002-07-19 2003-04-01 Hai-Ching Lin Heat dissipation plate having gained heat dissipation efficiency
JP4338948B2 (ja) * 2002-08-01 2009-10-07 株式会社半導体エネルギー研究所 カーボンナノチューブ半導体素子の作製方法
JP4547852B2 (ja) * 2002-09-04 2010-09-22 富士ゼロックス株式会社 電気部品の製造方法
US7645400B2 (en) * 2002-11-01 2010-01-12 Mitsubishi Rayon Co., Ltd. Composition containing carbon nanotubes having a coating
WO2004051219A2 (en) * 2002-11-27 2004-06-17 Molecular Nanosystems, Inc. Nanotube chemical sensor based on work function of electrodes
WO2004052559A2 (en) * 2002-12-06 2004-06-24 Eikos, Inc. Optically transparent nanostructured electrical conductors
US7858185B2 (en) * 2003-09-08 2010-12-28 Nantero, Inc. High purity nanotube fabrics and films
US6919740B2 (en) * 2003-01-31 2005-07-19 Hewlett-Packard Development Company, Lp. Molecular-junction-nanowire-crossbar-based inverter, latch, and flip-flop circuits, and more complex circuits composed, in part, from molecular-junction-nanowire-crossbar-based inverter, latch, and flip-flop circuits
US6918284B2 (en) * 2003-03-24 2005-07-19 The United States Of America As Represented By The Secretary Of The Navy Interconnected networks of single-walled carbon nanotubes
WO2005019793A2 (en) * 2003-05-14 2005-03-03 Nantero, Inc. Sensor platform using a horizontally oriented nanotube element
TWM248226U (en) * 2003-10-17 2004-10-21 Hon Hai Prec Ind Co Ltd Heat dissipating device
US7354877B2 (en) * 2003-10-29 2008-04-08 Lockheed Martin Corporation Carbon nanotube fabrics
TW200528966A (en) * 2004-02-27 2005-09-01 Quanta Comp Inc Heat-dissipating module and structure thereof
US7658869B2 (en) * 2004-06-03 2010-02-09 Nantero, Inc. Applicator liquid containing ethyl lactate for preparation of nanotube films
WO2006065937A2 (en) * 2004-12-16 2006-06-22 Nantero, Inc. Aqueous carbon nanotube applicator liquids and methods for producing applicator liquids thereof
US7538040B2 (en) * 2005-06-30 2009-05-26 Nantero, Inc. Techniques for precision pattern transfer of carbon nanotubes from photo mask to wafers
US20070119566A1 (en) * 2005-11-30 2007-05-31 Xue-Wen Peng Heat dissipation device
US20070187082A1 (en) * 2006-02-14 2007-08-16 Li-Wei Fan Chiang Structural enhanced heat dissipating device

Also Published As

Publication number Publication date
US20060260785A1 (en) 2006-11-23
TW200640354A (en) 2006-11-16

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