1258871 ^ 案號 94100589 五、發明說明（1) 【發明所屬之技術領域】 本發明係有關-種發光二極體封裝結構，特別是關於 -種可f於安裝熱導管之發光二極體封装改良結構，使其 可具有咼散熱效率。 【先前技術】 發光一極體（L E D )係利用半導體材料中的電子電洞 結合時能量帶（Energy Gap )位階之改變’以發光顯示立 所釋放出的能量，具體積小、壽命長、驅動電壓低、耗電 量低、反應速率快、耐震性佳等優點，為曰常生活中各種 應用設備中常見的元件。 第一圖所示係為一般高功率發光二極體之封裝結 構，如圖所不，一 LED晶片1 〇係安裝至一導線架之晶墊i 2 上，且於晶墊12二側各設有一引腳14，使該LED晶片1〇利 用引線16電性連接至引腳14，最後再利用一封裝膠體18包 覆住LED晶片1〇、晶墊12、引線16及部份引腳14。然而， LED晶片10工作時，其產生的熱能極大，造成LED周圍的溫 度上升，尤其是尚功率LED，其在正常工作下所發出之熱 量更是比一般的LED高出許多，所以一定要考慮其散熱問 題，以防止溫度過高燒毀發光元件或破壞其特性。因此通 常會需要在晶墊12下表面設置一散熱片2〇，以便將該UD 晶片1 〇工作時所產生的熱能移出。 然而，習知的高功率LED封裝結構其所使用之散熱片 20對外暴露之部分為平板狀，若欲與一熱導管做接合，則1258871 ^ Doc No. 94100589 V. INSTRUCTION DESCRIPTION (1) Technical Field of the Invention The present invention relates to a light-emitting diode package structure, and more particularly to an improved light-emitting diode package for mounting a heat pipe. The structure makes it possible to have heat dissipation efficiency. [Prior Art] A light-emitting diode (LED) utilizes the change of the energy band (Energy Gap) when the electron holes in the semiconductor material are combined to display the energy released by the light, and the specific product is small, the life is long, and the drive is driven. The advantages of low voltage, low power consumption, fast reaction rate, and good shock resistance are common components in various applications in everyday life. The first figure shows a package structure of a general high-power light-emitting diode. As shown in the figure, an LED chip 1 is mounted on a pad i 2 of a lead frame, and is disposed on each side of the pad 12 There is a pin 14 for electrically connecting the LED chip 1 to the lead 14 by using the lead 16 and finally covering the LED chip 1 , the pad 12 , the lead 16 and the partial pin 14 with an encapsulant 18 . However, when the LED chip 10 is in operation, the heat energy generated by the LED chip 10 is extremely large, causing the temperature around the LED to rise, especially the power LED, which generates much higher heat than normal LEDs under normal operation, so it must be considered. Its heat dissipation problem prevents the temperature from being too high to burn the light-emitting elements or destroy their characteristics. Therefore, it is generally necessary to provide a heat sink 2 on the lower surface of the pad 12 to remove the thermal energy generated when the UD wafer 1 is operated. However, in the conventional high-power LED package structure, the portion of the heat sink 20 used for the external exposure is flat, and if it is intended to be bonded to a heat pipe,
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J要另外提供一導熱介質以使二者間得以緊密接觸達到埶 輸运’但此介質的存在使得整體熱阻的提升，尤其是二 功率的發光二極體而言，將使得LED晶片無法發揮、極致、。高 因此，本發明提出一種發光二極體封裝改良結構，使其〜 ，和熱導管直接做緊密配接，以有效克服LED的散熱問、件 【發明内容】 本發明之主要目的係在提供一種發光二極體封裂改 、、、σ構，以利於此發光'一極體封裝體與熱導管（η e a t Pipe )相互結合’藉由將承載發光二極體晶片之導熱 直接與熱導管結合旅達到固定效果，進而將發光二極體曰 片所產生的熱能遂過熱導管有效率地引導出。 曰曰 本發明之另/目的係在提供一種發光二極體封裝改 結構，其係利用〆導熱載體固定安裝熱導管，有效降低^ 阻，並可增加熱輸送路徑與熱傳面積。 為達上述目的，本發明之發光二極體封裝改良結構係 包含一導熱載體，其下^係形成與一熱導管相配合之容置 空間，以供安裝此熱導管，在此導熱承載板上設有一發光 二極體晶片，其/側或二側具有弓丨腳設計，並有至少二引 線將發光二極體晶片正負極與引腳形成電性連接；再利用 一封裝膠體包覆發光一極體晶片、引線及部份引腳；藉由 熱導管與導熱載體之緊密結合，可有效率地將LED發熱曰導 引開來。J has to provide a heat-conducting medium to make the two parts in close contact to achieve the transport of the crucible', but the presence of this medium makes the overall thermal resistance increase, especially for the two-power LED, which will make the LED chip unable to play. Extremely. Therefore, the present invention provides an improved structure for a light-emitting diode package, such that the heat pipe is directly mated with the heat pipe to effectively overcome the heat dissipation of the LED. SUMMARY OF THE INVENTION The main object of the present invention is to provide a The light-emitting diode is modified, and the σ structure is used to facilitate the illuminating 'the combination of the one-pole package and the heat pipe (n eat pipe)' by directly bonding the heat conduction of the light-emitting diode chip to the heat pipe The brigade achieves a fixed effect, and the thermal energy generated by the LED film is efficiently guided out of the heat pipe. Further, another object of the present invention is to provide a light-emitting diode package modification structure in which a heat pipe is fixedly mounted by a heat-conductive carrier, which effectively reduces the resistance and increases the heat transfer path and heat transfer area. In order to achieve the above object, the improved structure of the LED package of the present invention comprises a heat conducting carrier, and the lower portion forms an accommodating space for cooperating with a heat pipe for mounting the heat pipe on the heat conducting plate. The invention is provided with a light-emitting diode chip having a bow-and-pin design on one side or two sides, and at least two leads electrically connecting the positive and negative electrodes of the light-emitting diode chip to the lead; and then encapsulating the light-emitting one by using a package colloid The polar body chip, the lead wire and the partial lead; the LED heat generation can be efficiently guided by the tight combination of the heat pipe and the heat conductive carrier.
1258871 案號 94100589 五、發明說明（3) 底下藉由具 容易瞭解本發明之目的、技椒& ^ 3式。平加况明，當更 效。 特點及其所達成之功 【實施方式】 本發明係將發光二極體封努& 於與熱導管（Heat Pipe)相社人、力口—以改良’使其可易 引的設計，使發光二極體封|姓"以藉由將導熱載體外 接合以進行熱輸送，達到高散熱導管做緊密 第二圖至第四圖分別為本發明之一實施 示思圖、結構分解圖及結構剖視圖，如圖所示，一务:= 極體封裝改良結構30係包含一呈帽蓋狀的導熱載體^: 材質通常為銅、鋁等金屬材質或高導熱低溫共燒陶瓷等八 (Low Temperature Cofire Ceramic，LTCC)材質，在導熱 載體3 2下方係形成有一容置空間3 4，此容置空間3 4係可與 一熱導管36之形狀相配合，以供安裝此熱導管36 ;並有一 發光二極體晶片38，其係利用銀膠或軟焊（s〇idering)方 式裝設於導熱載體32上；在導熱載體3 2上且位於發光二極 體晶片38之二側則分別設有一引腳40，此二引腳40亦可位 於發光二極體晶片38之同一側；另有至少二引線42，可為 金線或鋁線，係利用習知封裝打線法將發光二極體晶片38 連接至該引腳40之焊點上，以形成電性相接；最後，利用 一封裝膠體44，其材質係為透明之環氧樹脂或矽膠等，將 此封裝膠體44包覆發光二極體晶片38、引線42及部份引腳1258871 Case No. 94100589 V. INSTRUCTIONS (3) Bottom, by the purpose of easy understanding of the present invention, the pepper & ^ 3 formula. It is more appropriate to be more effective. Characteristics and Achievements of the Invention [Embodiment] The present invention relates to a light-emitting diode package and a design that is compatible with a heat pipe (Heat Pipe) to improve its design. The light-emitting diode package|surname" is formed by externally joining the heat-conducting carrier for heat transfer, and the high heat-dissipating duct is made to be close to the second to fourth figures, respectively. The cross-sectional view of the structure, as shown in the figure, is: 1. The polar package encapsulation improved structure 30 includes a cap-shaped heat-conducting carrier ^: The material is usually made of metal such as copper or aluminum or high thermal conductivity low-temperature co-fired ceramics (Low) Temperature Cofire Ceramic (LTCC) material, under the heat-conducting carrier 3 2 is formed with an accommodating space 34, the accommodating space 34 can cooperate with the shape of a heat pipe 36 for mounting the heat pipe 36; There is a light-emitting diode chip 38 which is mounted on the heat-conducting carrier 32 by means of silver glue or soldering; on the heat-conducting carrier 32 and on the two sides of the LED chip 38, respectively There is a pin 40, and the two pins 40 can also be illuminated. The same side of the polar body chip 38; at least two leads 42 may be gold wires or aluminum wires, and the LED package 38 is connected to the solder joints of the pins 40 by a conventional package wire bonding method to form Electrically connected; finally, an encapsulant 44 is used, which is made of transparent epoxy or silicone, and the encapsulant 44 is coated with the LED chip 38, the lead 42 and a part of the lead.
40 ’以提供機械性的保護作用，避免發光二極體晶片38受 到外力（例如碰撞、灰塵或水氣等）侵害。 、 其中’上述呈帽蓋狀的導熱載體3 2係以鍛造或鑄造方 式成型’且其材質係金屬或高導熱陶瓷材料；此外，導熱 載體32除了如上所述之帽蓋狀之外，亦具有其他實施態 樣’只要其形狀可與熱導管3 6相配合即可；且導熱載體3 2 ‘貧3 6之間係可利用導熱（銀/銅）膠（c〇nduc t i ve， silver/copper，glue)、導熱膏（conductive paste) 或軟焊（so 1 der i ng )等方式作為彼此間的接合。如第五 圖所不’為本發明之另一實施例的結構分解圖，圖中所示 之$熱載體4 6係提供一特殊之凹穴結構以形成一容置空間 34供安裝該熱導管36，其連接方式與其他結構皆與上述實 施例相同L故於不再贅述。另外，具凹穴結構之導熱載體 46除了如，五圖所示可裝設於熱導管36頂端之外，亦可裝 設於熱導官36局部區域，此局部區域為熱導管局部壓扁後 呈現之平坦m以便於熱導管裝設於該導熱載體46之容 置空間3 4内。 除了上述之實施例之外 38先裝設在於一金屬芯基板 第六圖及第七圖所示，發光 芯基板48上的引腳40形成電 覆及保護發光二極體晶片3 8 則利用數個螺絲5 0作為鎖固 起’且於導熱載體52之容置 ’本發明更將發光二極體晶片 (metal core PCB)48上，如 二極體晶片利用引線42與金屬 性連接，並利用封裝膠體44包 、引線42 ;金屬芯基板48下方 元件而與導熱載體52組裝在一 空間内亦同樣安裝一熱導管The 40' provides a mechanical protection against the exposure of the LED chip 38 to external forces such as collisions, dust or moisture. Wherein the above-mentioned cap-shaped heat-conducting carrier 32 is formed by forging or casting, and the material thereof is metal or highly thermally conductive ceramic material; moreover, the heat-conducting carrier 32 has a cap shape as described above, Other embodiments can be used as long as the shape can be matched with the heat pipe 36; and the heat conducting carrier 3 2 'lean 3 6 can utilize the heat conduction (silver/copper) glue (c〇nduc ti ve, silver/copper , glue), thermal paste (conductive paste) or solder (so 1 der i ng), etc. as a joint between each other. 5 is a structural exploded view of another embodiment of the present invention, the heat carrier 46 shown in the figure provides a special recess structure to form an accommodating space 34 for mounting the heat pipe. 36, the connection manner and other structures are the same as those of the above embodiment, and therefore will not be described again. In addition, the heat-conducting carrier 46 having a recessed structure may be installed on the top of the heat pipe 36, as shown in FIG. 5, or may be installed in a partial area of the heat guide 36, which is partially crushed by the heat pipe. The flatness m is presented so that the heat pipe is installed in the accommodating space 34 of the heat conducting carrier 46. In addition to the above-described embodiments, 38 is first mounted on a metal core substrate as shown in the sixth and seventh figures, and the pins 40 on the light-emitting core substrate 48 are electrically covered and protected from the light-emitting diode chip. The screws 50 are locked and disposed in the heat-conducting carrier 52. The invention further includes a metal core PCB 48, such as a diode wafer, which is connected to the metal by a lead 42 and utilized. The package body 44 package, the lead wire 42; the lower part of the metal core substrate 48 and the heat conductive carrier 52 are assembled in a space, and a heat pipe is also installed.
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案號 9410058Q 五、發明說明（5) 36。當然， 板48上之外 本發明 熱輸送路徑 熱能藉由導 將發光二極 以延長發光 極體而言， 所產生的熱 破壞其特性 以上所 點，其目的 容並據以實 凡依本發明 蓋在本發明 η 曰 修正 金屬芯基 ，更可以 係利用一 ’降低熱 熱載體外 體晶片發 二極體的 本發明之 能引導出 〇 述之實施 在使熟習 施，當不 所揭示之 之專利範 板48除 焊接、 導熱載 阻。如 引而直 光所產 使用壽 結構設去，以 了以鎖 Ιέ接等 體固定 此，即 接與熱 生的熱 命，特 計可有 防止溫 固元件 其他方 安裝一 可將發 導管進 能有效 別是對 效將高 度過南 固定於金屬芯I 式組裝在一起° 熱導管，以增加 光二極體產生之 行熱輸送，進而 率地引導出去， 高功率之發光二 功率發光二極體 燒毀發光元件或 例僅係為說明 此項技藝之人 能以之限定本 精神所作之均 圍内。 本發明之技術思想及特 士能夠瞭解本發明之内 發明之專利範圍，即大 荨變化或伯^ | _ 一乂修飾，仍應涵Case No. 9410058Q V. Description of invention (5) 36. Of course, the thermal energy of the heat transport path of the present invention on the board 48 is further improved by the fact that the heat generated by the light-emitting diode is extended to extend the light-emitting body. Covering the η 曰 modified metal core of the present invention, it is also possible to use a method of reducing the heat carrier outer body of the hair styling diode to guide the implementation of the simplification, while not revealing Patent model 48 except for welding, thermal resistance and load resistance. For example, the life structure of the direct light is used to fix the structure, such as the lock and the body, that is, the heat life of the heat, the special meter can prevent the other components of the temperature and solid component from being installed. It can effectively be used to fix the height of the metal to the metal core I type assembled together. The heat pipe is used to increase the heat transfer generated by the photodiode, and then lead out. High-power light-emitting two-power LED The burning of the illuminating elements or examples is only intended to be within the scope of the spirit of the person skilled in the art. The technical idea of the present invention and the expert can understand the patent scope of the invention of the present invention, that is, the change of the big 或 or the ^ _ 乂 乂 ,
第9頁 1258871 __案號 94100589_年月日__ 圖式簡單說明 【圖式簡單說明】 第一圖為習知高功率發光二極體之封裝結構。 第二圖為本發明之一實施例的立體結構示意圖。 第三圖為第二圖之結構分解圖。 第四圖為第二圖之結構剖視圖。 第五圖為本發明之另一實施例的結構分解圖。 第六圖為本發明設置於金屬芯基板上的發光二極體封裝結 構。 第七圖為第六圖之結構剖視圖。 【主要元件符號說明】 10 LED晶片 12 晶 墊 14 引 腳 16 引 線 18 封 裝 膠 體 20 散 熱 片 30 發 光 二 極體封裝 改良結構 32 導 熱 載 體 34 容 置 空 間 36 熱 導 管 38 發 光 二 極體晶片 40 引 腳 42 引 線 44 封 裝 膠 體 46 導 熱 載 體 48 金 屬 芯 基板 50 螺 絲 52 導 熱 載 體Page 9 1258871 __ Case No. 94100589_年月日日__ Simple description of the drawing [Simple description of the diagram] The first picture shows the package structure of the conventional high-power LED. The second figure is a schematic perspective view of an embodiment of the present invention. The third figure is an exploded view of the structure of the second figure. The fourth figure is a cross-sectional view of the structure of the second figure. Figure 5 is a structural exploded view of another embodiment of the present invention. The sixth figure is a light emitting diode package structure provided on a metal core substrate of the present invention. The seventh figure is a cross-sectional view of the structure of the sixth figure. [Main component symbol description] 10 LED chip 12 crystal pad 14 pin 16 lead 18 package colloid 20 heat sink 30 LED package improved structure 32 thermal carrier 34 housing space 36 heat pipe 38 LED chip 40 pin 42 lead 44 encapsulant 46 thermal carrier 48 metal core substrate 50 screw 52 thermal carrier
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