TWI231052B

TWI231052B - LED chip module

Info

Publication number: TWI231052B
Application number: TW92133950A
Authority: TW
Inventors: Chi Shiung
Original assignee: Lin Wen Chin
Priority date: 2003-12-02
Filing date: 2003-12-02
Publication date: 2005-04-11
Also published as: TW200520251A

Abstract

A LED chip module comprises heat conductive holder, insulator, two conductive pins and LED chip. Wherein, the heat conductive holder has through hole. The insulator base part has also through hole, insulation column in bottom positioned in through hole. The insulation column has exposed through hole where the two pins are located. The LED chip located in through hole of insulator and fixed at heat conductive holder. The anode and cathode of the LED chip connect with two pins by wire. It greatly raises the radiation efficiency with easy assembling, small volume and low cost.

Description

1231052 五、發明說明（1) 【發明所屬之技術領域】一種發光二極體晶片模組，特別係關於一種亮度高且散熱佳之發光二極體晶片模組。【先前技術】如所周知，發光二極體晶片隨著光電產業的迅速發展，使其亮度大為提昇，廣泛運用於顯示面板上。如以廣告看板而言，可藉由點矩陣排列的發光二極體來達到圖案和文字的動態顯示，使廣告效果更為清晰醒目。而發光二極體晶片高亮度的特性伴隨著高溫，必須有效加以散熱，才能維持長時間的正常使用。習知的發光二極體晶片模組，請參閱第一圖所示，包括發光二極體晶片70、第一接腳7 1 、第二接腳72和外罩73 ，該第一接腳71 —端設有凹陷部74 ，該發光二極體晶片7 0設置於該凹陷部7 4内，發光二極體晶片 7 0的正極和負極分別藉由導線7 5電性連接該第一接腳 7 1和第二接腳7 2，並以透光性膠體7 6封裝於發光二極體晶片7 0與導線7 5上，再蓋覆該外罩7 3於發光二極體晶片7 0外。上述習知的發光二極體晶片模組，缺乏散熱的結構，因此，無法滿足高亮度發光二極體晶片所衍生而來的散熱問題。為解決發光二極體晶片的散熱問題，另一種發光二極體晶片模組（圖略）係將其發光二極體晶片的正極或負極連接於兼具導熱性與導電性的基板上，以提昇其散熱效能1231052 V. Description of the invention (1) [Technical field to which the invention belongs] A light emitting diode chip module, in particular, relates to a light emitting diode chip module with high brightness and good heat dissipation. [Previous Technology] As is well known, with the rapid development of the optoelectronic industry, the brightness of light-emitting diode wafers has been greatly improved, and they are widely used in display panels. For example, in the case of advertising kanbans, the dynamic display of patterns and text can be achieved by light-emitting diodes arranged in a dot matrix, making the advertising effect more clear and eye-catching. The high-brightness characteristics of light-emitting diode chips are accompanied by high temperatures, which must be effectively dissipated to maintain normal use for a long time. The conventional light emitting diode chip module, as shown in the first figure, includes a light emitting diode chip 70, a first pin 7 1, a second pin 72 and a cover 73. The first pin 71 — A recess 74 is provided at the end, and the light-emitting diode wafer 70 is disposed in the recess 74. The positive electrode and the negative electrode of the light-emitting diode wafer 70 are electrically connected to the first pin 7 through a lead 7 5 respectively. The first and second pins 7 2 are packaged on the light-emitting diode chip 70 and the lead wire 75 with a light-transmitting colloid 76, and then the cover 7 3 is covered outside the light-emitting diode chip 70. The conventional light emitting diode chip module described above lacks a heat dissipation structure, and therefore cannot meet the heat dissipation problem derived from a high-brightness light emitting diode chip. In order to solve the heat dissipation problem of the light-emitting diode chip, another light-emitting diode chip module (not shown) connects the positive electrode or the negative electrode of the light-emitting diode chip to a substrate having both thermal conductivity and electrical conductivity. Improve its cooling performance

1231052 五、發明說明（2) 。然則，該基板不但影響了發光二極體的發光穩定性，在實際應用時，受限於其結構的設計，散熱效果仍然有限。且以廣告看板來說，需組裝許多發光二極體晶片模組，而其產生的高熱，仍需另作處理，使組裝複雜，體積龐大，成本增加。是以，由上可知，上述習知的發光二極體晶片模組，在實際使用上，顯然具有不便與缺失存在，而有待加以改善。緣是，本發明人有感上述缺失之可改善，乃特潛心研究並配合學理之運用，終於提出一種設計合理且有效改善上述缺失之本發明。【發明内容】〔發明目的〕本發明之主要目的，在於提供一種發光二極體晶片模組，使其散熱效果提昇，以發揮發光二極體晶片的高亮度特性，避免因過熱而損毁。本發明之次一目的，在於提供一種發光二極體晶片模組，使其組裝使用容易，體積縮小，生產成本降低。〔發明特徵〕為了達成上述目的，本發明主要係在提供一種發光二極體晶片模組，包括導熱座、絕緣件、二導電接腳以及發光二極體晶片，其中：該導熱座設有穿孔；該絕緣件具有基部，基部設有通孔，基部底面凸設絕緣柱，絕緣柱定位於上述導熱座之穿孔中，絕緣柱設有外露之透孔；該二導1231052 V. Description of Invention (2). However, this substrate not only affects the light emitting stability of the light emitting diode. In practical applications, due to the structure design, the heat dissipation effect is still limited. In terms of advertising sign boards, many light-emitting diode chip modules need to be assembled, and the high heat generated by them still needs to be treated separately, which complicates the assembly, is bulky, and increases the cost. Therefore, it can be seen from the above that the conventional light-emitting diode chip module mentioned above obviously has inconvenience and deficiency in practical use, and needs to be improved. The reason is that the present inventor felt that the above-mentioned deficiency could be improved, and made intensive research and combined with the application of theories to finally propose a present invention with a reasonable design and effective improvement of the above-mentioned deficiency. [Summary of the Invention] [Objective of the Invention] The main object of the present invention is to provide a light emitting diode wafer module to improve the heat dissipation effect, to exert the high brightness characteristics of the light emitting diode wafer, and to avoid damage due to overheating. A secondary object of the present invention is to provide a light-emitting diode wafer module, which makes it easy to assemble and use, reduces the volume, and reduces the production cost. [Features of the Invention] In order to achieve the above object, the present invention is mainly to provide a light emitting diode chip module, which includes a heat conducting seat, an insulating member, two conductive pins, and a light emitting diode wafer, wherein the heat conducting seat is provided with a perforation. ; The insulation member has a base portion, the base portion is provided with a through hole, an insulation pillar is protruded on the bottom surface of the base portion, the insulation pillar is positioned in the perforation of the heat conduction seat, and the insulation pillar is provided with an exposed through hole;

之透孔；以及該發光二極體且固設於上述導熱座，發光設有導線電性連接二導電接導熱座上，發光二極體晶片導電接腳，使散熱效率大幅光二極體模組的模組化生產板上，且組裝使用時，導熱生產成本降低。達成預定目的所採取之技術本發明之詳細說明與附圖’ 點’當可由此得^一深入且具供參考與說明用，並非用來示，本發明係一種發光二極絕緣件2、二導電接腳3以 1 0 ，該座體部1 〇頂面凸頂端凹設承接槽1 2 °該座部1 3，該凸環部1 3和承，該凹環部1 4設有二穿孔 1231052 五、發明說明（3) 電接腳分別穿設於上述絕緣柱晶片位於上述絕緣件之通孔中二極體晶片之正極和負極分別腳。該發光二極體晶片固設於的正極和負極分別電性連接二提昇，且確保發光穩定性。發各易’可直接連接於現有電路座的裝配容易，使體積縮小，【實施方式】為更進一步闡述本發明為手段及功效，請參閱以下有關相信本發明之目的、特徵與特體之瞭解，然而所附圖式僅提對本發明加以限制。〔詳細說明〕請參閱第二圖至第五圖所體晶片模組’包括導熱座1 、及發光二極體晶片4 ，其中：導熱座1 ，其具有座體部設承接部1 1，該承接部1 1 體部1 0頂面的周緣凸設凸環接部1 1之間形成凹環部1在Through hole; and the light-emitting diode is fixed on the heat-conducting base, and a light-emitting wire is electrically connected to the two-conducting heat-conducting base, and the light-emitting diode chip has conductive pins, which greatly reduces heat dissipation efficiency of the light-emitting diode module. Modular production board, and when assembled and used, the production cost of heat conduction is reduced. Techniques adopted to achieve the intended purpose The detailed description of the present invention and the accompanying drawings 'points' can be obtained in depth and for reference and explanation, not for illustration. The present invention is a light-emitting diode insulator 2, The conductive pin 3 is 10, and the top surface of the base body part 10 is concavely received on the receiving groove 12 ° The seat part 13, the convex ring part 13 and the bearing, and the concave ring part 14 is provided with two perforations 1231052 V. Description of the invention (3) The electrical pins are respectively provided on the positive and negative pins of the diode chip in the above-mentioned insulating pillar wafer and located in the through hole of the insulating member. The positive electrode and the negative electrode fixed on the light-emitting diode chip are electrically connected to each other for improvement, and ensure the light-emitting stability. Fageyi 'can be directly connected to the existing circuit base, which is easy to assemble and reduce the volume. [Embodiment] To further explain the present invention as a means and effect, please refer to the following understanding of the purpose, characteristics and characteristics of the present invention However, the attached drawings only limit the present invention. [Detailed description] Please refer to the second to fifth figures. The chip module includes a heat conducting base 1 and a light emitting diode wafer 4. Among them, the heat conducting base 1 has a base body and a receiving portion 11. Receiving part 1 1 Body part 10 The peripheral edge of the top surface is convexly provided with a convex ring connection part 1 to form a concave ring part 1 between

1231052 五、發明說明（4) 絕緣件2，其具有基部2 0，該基部2 〇設有通孔2 1。基部2 0底面凸設二絕緣柱2 2。該基部2 0容置於上述導熱座1之凹環部1 4 ’該絕緣件2之通孔2 1套設於上述導熱座1之承接部1 1 ，該二絕緣柱2 2分別定位於上述導熱座1之二穿孔1 5中。絕緣柱2 2設有外露之透孔2 3。該絕緣件2之基部2 0頂面的周緣凸設外擋部 2 4。二導電接腳3，其分別穿設於上述二絕緣柱2 2之透孔2 3。發光二極體晶片4，其位於上述絕緣件2之通孔2 1 中且固設於上述導熱座1之承接槽1 2内，該承接槽1 2 可增進發光二極體晶片4的反射聚光效果。該發光二極體晶片4與導熱座1之間設有導熱膠體4 0相膠合。該發光二極體晶片4之正極和負極分別設有導線4 1電性連接二導電接腳3 —端。藉此，使發光二極體晶片4所產生的高熱，直接由大面積的導熱座1導出，大幅提昇散熱效率，避免過熱燒毁，從而發揮發光二極體晶片4的高亮度特性，延長使用時間，且發光二極體4的正極和負極與導熱座 1分開連接’可確保其發光穩定性。該發光二極體晶片4 、導線41和連接導線41之導電接腳3—端上封裝透光性膠體4 2 ’以確保結構的可靠度，該透光性膠體4 2位於該絕緣件2之外擋部2 4中。藉由絕緣件2之外擋部2 4的設置使導線4 1連接於導電接腳3後，多一層外部保護避免封裝前的製程中，導線4 1因碰撞而斷開。1231052 V. Description of the invention (4) The insulating member 2 has a base portion 20, and the base portion 20 is provided with a through hole 21. Two insulating posts 22 are protruded from the bottom surface of the base 20. The base portion 20 is accommodated in the concave ring portion 1 4 of the heat conducting base 1, and the through hole 21 of the insulating member 2 is sleeved on the receiving portion 1 1 of the heat conducting base 1, and the two insulating posts 22 are respectively positioned at the above. The heat conducting seat 1 bis is perforated 15. The insulating post 2 2 is provided with exposed through holes 2 3. An outer stopper 24 is protruded from a peripheral edge of the top surface of the base portion 20 of the insulating member 2. The two conductive pins 3 pass through the through holes 23 of the two insulating posts 22 respectively. The light emitting diode wafer 4 is located in the through hole 2 1 of the insulating member 2 and is fixed in the receiving groove 12 of the heat conducting seat 1. The receiving groove 1 2 can improve the reflection and concentration of the light emitting diode wafer 4. Light effect. The light-emitting diode wafer 4 and the heat-conducting base 1 are provided with a heat-conducting colloid 40. The positive electrode and the negative electrode of the light-emitting diode chip 4 are respectively provided with a lead 41, which is electrically connected to two conductive pins 3-terminals. Thereby, the high heat generated by the light-emitting diode wafer 4 is directly led out by the large-area heat-conducting base 1, which greatly improves the heat dissipation efficiency and avoids overheating and burnout, thereby exerting the high-brightness characteristics of the light-emitting diode wafer 4 and extending the use Time, and the positive and negative electrodes of the light-emitting diode 4 are separately connected to the heat-conducting base 1 to ensure the light-emitting stability. The light-emitting diode chip 4, the lead 41 and the conductive pins 3 of the connecting lead 41 are packaged with a light-transmitting gel 4 2 ′ to ensure the reliability of the structure. The light-transmitting gel 4 2 is located on the insulating member 2. Outer stop 2 4 in. After the wire 4 1 is connected to the conductive pin 3 by the arrangement of the outer blocking portion 2 4 of the insulating member 2, an extra layer of external protection is provided to prevent the wire 41 from being broken due to collision during the manufacturing process before packaging.

第8頁 1231052 五、發明說明（5) ^-- 另在封裝時，可藉由外擋部2 4來避免透光性膠體4 2 溢雜開’有效節省透光性膠體4 2用量和提昇封翁品質。本發明發光二極體模組的模組化生產容易，可直^ 接於現有電路板上。當組裝使用時，導熱座丄的裝配容。以廣告看板為例，絕緣件2可設有複數通孔2 1並t幻設置複數發光二極體晶片4於進一步延伸的導熱座丄二，1 提供整體性的散熱效率，使體積縮小，生產成本降低。請參閱第六圖所示，該絕緣件2之外擋部2 4進一 + 設有固定孔2 5 ，該發光二極體晶片模組進一步包括外= 5 ’該外罩5底端設有凸柱5〇定位於上述固定孔。外罩頂端設有鏡片5 1對應於該發光二極體晶片4 ，以匯聚光線。如第六圖所示，該透光性膠體4 〇可選擇性2 進行封裝。 & 請參閱第七圖所示，該發光二極體晶片模組進_步包括外罩6 ’該外罩6底端之内表面固設於上述絕緣件2之Page 81231052 V. Description of the invention (5) ^-In addition, the outer blocking portion 2 4 can be used to avoid the translucent colloid 4 2 when it is encapsulated, which effectively saves the translucent colloid 4 2 dosage and improvement Feng Weng quality. The modular production of the light-emitting diode module of the present invention is easy and can be directly connected to an existing circuit board. When used in assembly, the assembly capacity of the heat conducting seat 丄. Taking an advertisement board as an example, the insulating member 2 may be provided with a plurality of through holes 21, and a plurality of light emitting diode wafers 4 may be arranged on the further extended heat conducting seat 2. The 1 provides overall heat dissipation efficiency, reduces the volume, and produces Reduce costs. Please refer to the sixth figure, the insulating member 2 is provided with an outer stopper 2 4 into a + with a fixing hole 2 5, and the light emitting diode chip module further includes an outer = 5 'the bottom end of the outer cover 5 is provided with a convex post 50 is positioned in the fixing hole. A lens 51 is provided at the top of the outer cover corresponding to the light-emitting diode chip 4 to collect light. As shown in the sixth figure, the translucent colloid 40 can be selectively packaged. & Please refer to the seventh figure, the light-emitting diode chip module further includes an outer cover 6 ′ The inner surface of the bottom end of the outer cover 6 is fixed on the insulating member 2

外擔部2 4的外表面。外罩6頂端設有鏡片6 1對應於該發光二極體晶片4 ，以匯聚光線。 X 〔發明特點及優點〕疋以’透過本發明之發光二極體晶片模組，具有如下述之特點： 1、該發光二極體晶片固設於導熱座上，發光二極體晶片的正極和負極分別電性連接二導電接腳，使散熱效率大幅提昇，而能避免過熱燒毀，從而發揮發光二極體晶片的高亮度特性，延長使用時間，且讀保發光穩定性。The outer surface of the outer support portion 2 4. A lens 61 is provided at the top of the outer cover 6 corresponding to the light emitting diode wafer 4 to collect light. X [Features and advantages of the invention] (1) Through the light-emitting diode chip module of the present invention, it has the following characteristics: 1. The light-emitting diode chip is fixed on a heat-conducting base, and the anode of the light-emitting diode chip is positive. The two conductive pins are electrically connected to the negative electrode, so that the heat dissipation efficiency is greatly improved, and overheating and burn-out can be avoided, thereby exerting the high brightness characteristics of the light emitting diode chip, prolonging the use time, and maintaining the light emitting stability.

第9頁 1231052 、發明說明（6I ' ' " " -- 2、該發光二極體模組的模組化生產容易，可直組裝使用•，導熱座的裝配容易， &供整體性的政熱效率，使體積縮小， 3、該絕緣件頂面的周緣凸設外擒一中得以受到保護，不會因碰# @ #使導線在製程裝不會外溢攤開。斷開’且透光性膠體的封综上所述’本發明完全符合發明專 J依專利法提出申請，請詳查並請早曰二，要：，故 ::保障發明者之權益一局之貴審隹感德稽疑，請不吝來函指示。 —安貝有任何 :：上所述，僅為本發明之具體實該=，並非用以限制本發明及本發明之 :、，、田說明，藝者，沿依本發明之精神所做的^二凡熟悉白應包含於本發明之專利範圍中。放修飾或變化， 1231052 圖式簡單說明【圖式簡單說明】第一圖係習知發光二極體晶片模組之平面示意圖。第二圖係本發明發光二極體晶片模組之立體分解圖。第三圖係本發明發光二極體晶片模組另一角度之立體分解圖。第四圖係本發明發光二極體晶片模組之立體組合圖。第五圖係本發明發光二極體晶片模組封裝後之剖面側視圖。第六圖係本發明發光二極體晶片模組組設外罩之剖面側視圖。第七圖係本發明發光二極體晶片模組另一組設外罩之剖面側視圖。【元件代表符號】〔習知〕發光二極體晶片 7 0 第一接腳 7 1 第二接腳 7 2 外罩 7 3 凹陷部 7 4 導線 7 5 透光性膠體 7 6 〔本發明〕導熱座 1 座體部 10 承接部 11 承接槽 12 凸環部 13 凹環部 14 穿孔 15 絕緣件 2Page 91231052, description of the invention (6I '' " "-2, the modular production of the light-emitting diode module is easy, can be directly assembled and used •, the assembly of the heat conduction seat is easy, & for integrity The thermal efficiency of the product reduces the volume. 3. The peripheral edge of the top surface of the insulator is protected by the outer trap. It will not cause the wire to spread out during the process by touching # @ #. According to the above summary of the photocolloid seal, the present invention is fully in line with the patent application of the invention patent, please check it in detail and ask as early as possible, to :, therefore :: protect the rights of the inventor I am suspicious, please do n’t hesitate to write the instructions.-Amber has any of the above: It is only the specific implementation of the present invention. It is not intended to limit the present invention and the description of the present invention: ^ Every familiarity made in accordance with the spirit of the present invention should be included in the patent scope of the present invention. Modifications or changes, 1231052 Schematic description of the schematic [Schematic description of the schematic] The first diagram is a conventional light-emitting diode A schematic plan view of a chip module. The second figure is a light emitting diode of the present invention. A three-dimensional exploded view of the light-emitting diode chip module of the present invention. The third figure is a three-dimensional exploded view of the light-emitting diode chip module of the present invention. The fourth figure is a three-dimensional combined view of the light-emitting diode chip module of the present invention. Fifth The figure is a cross-sectional side view of the light-emitting diode chip module of the present invention after being packaged. The sixth figure is a cross-sectional side view of the light-emitting diode chip module of the present invention with an outer cover. The seventh figure is a light-emitting diode chip of the present invention. The other side of the module is a cross-sectional side view of the cover. [Representative Symbols of Components] [Knowledge] Light-emitting diode chip 7 0 First pin 7 1 Second pin 7 2 Cover 7 3 Recessed part 7 4 Lead wire 7 5 Light-transmitting colloid 7 6 [Invention] Heat-conducting base 1 Base body portion 10 Receiving portion 11 Receiving groove 12 Convex ring portion 13 Concave ring portion 14 Perforation 15 Insulator 2

12310521231052

第12頁圖式簡單說明基部 2 0 通孔 2 1 絕緣柱 2 2 透孔 2 3 外擔部 2 4 固定孔 2 5 導電接腳 3 發光二極體晶片 4 導熱膠體 4 0 導線 4 1 透光性膠體4 2 外罩 5 凸柱 5 0 鏡片 5 1 外罩 6 鏡片 6 1The diagram on page 12 is a brief description of the base 2 0 through-hole 2 1 insulating post 2 2 through-hole 2 3 outer support 2 4 fixing hole 2 5 conductive pin 3 light-emitting diode wafer 4 thermally conductive gel 4 0 wire 4 1 light transmission Colloid 4 2 Cover 5 Post 5 5 Lens 5 1 Cover 6 Lens 6 1

Claims

1231052 案號92133950 年月日修正年丨H 修正本六、申請專利範圍 1 、一種發光二極體晶片模組，包括：導熱座，其設有穿孔；絕緣件，其具有基部，基部設有通孔，基部底面凸設絕緣柱，絕緣柱定位於上述導熱座之穿孔中，絕緣柱設有外露之透孔；二導電接腳，其分別穿設於上述絕緣柱之透孔；以及發光二極體晶片，其位於上述絕緣件之通孔中且固設於上述導熱座，發光二極體晶片之正極和負極分別設有導線電性連接二導電接腳。 2、如申請專利範圍第1項所述之發光二極體晶片模組，其中該導熱座具有座體部，該座體部頂面凸設承接部，該絕緣件之通孔套設於該承接部，承接部頂端凹設承接槽，該發光二極體晶片固設於該承接槽内。 3、如申請專利範圍第2項所述之發光二極體晶片模組，其中該導熱座之座體部頂面的周緣凸設凸環部，該凸環部和承接部之間形成凹環部，該凹環部設有上述導熱座之穿孔，該絕緣件之基部容置於該凹環部。 4、如申請專利範圍第1項所述之發光二極體晶片模組，其中該發光二極體晶片與導熱座之間設有導熱膠體相膠合。 5、如申請專利範圍第1項所述之發光二極體晶片模組，其中該絕緣件之基部頂面的周緣凸設外擋部。 6、如申請專利範圍第5項所述之發光二極體晶片模組’其中該發光二極體晶片、導線和連接導線之導電接腳1231052 Case No. 92133950 Amendment Year 丨 H Amendment VI. Patent Application Scope 1. A light-emitting diode chip module, including: a thermally conductive base with a perforation; an insulating member with a base, and a base with a through Hole, the bottom of the base is protruded with an insulating post, the insulating post is positioned in the perforation of the heat conducting seat, and the insulating post is provided with an exposed through hole; two conductive pins are respectively passed through the through holes of the insulating post; and a light emitting diode The body chip is located in the through hole of the insulating member and is fixed on the heat conducting seat. The positive electrode and the negative electrode of the light-emitting diode chip are respectively provided with wires to electrically connect the two conductive pins. 2. The light-emitting diode chip module according to item 1 of the scope of the patent application, wherein the heat-conducting seat has a seat body portion, a receiving portion is convexly arranged on the top surface of the seat body, and a through hole of the insulating member is sleeved on the A receiving portion, a receiving groove is recessed on the top end of the receiving portion, and the light emitting diode chip is fixed in the receiving groove. 3. The light-emitting diode chip module according to item 2 of the scope of the patent application, wherein a convex ring portion is convexly formed on the periphery of the top surface of the seat body portion of the heat conductive seat, and a concave ring is formed between the convex ring portion and the receiving portion. The concave ring portion is provided with a perforation of the heat conducting seat, and a base portion of the insulating member is accommodated in the concave ring portion. 4. The light-emitting diode wafer module according to item 1 of the scope of the patent application, wherein a heat-conductive colloid phase is bonded between the light-emitting diode wafer and the heat-conducting base. 5. The light-emitting diode wafer module according to item 1 of the scope of the patent application, wherein an outer stopper is protruded from the periphery of the top surface of the base of the insulating member. 6. The light-emitting diode chip module as described in item 5 of the scope of the patent application, wherein the light-emitting diode chip, the conductive pins and the conductive pins of the connecting wires

第13頁 1231052 、 _案號92133950_年月曰修正__ 六、申請專利範圍一端上封裝透光性膠體，該透光性膠體位於該外擋部中。 7、如申請專利範圍第5項所述之發光二極體晶片模組，其中該絕緣件之外擋部設有固定孔，該發光二極體晶片模組進一步包括外罩，該外罩底端設有凸柱定位於上述固定孔，外罩頂端設有鏡片對應於該發光二極體晶片。 8、如申請專利範圍第5項所述之發光二極體晶片模組，其進一步包括外罩，該外罩底端之内表面固設於上述絕緣件之外擋部的外表面，外罩頂端設有鏡片對應於該發光二極體晶片。Page 13 1231052, _Case No. 92133950, Year of the month Amendment __ VI. Patent application scope One end is packaged with a translucent colloid, which is located in the outer stop. 7. The light-emitting diode chip module according to item 5 in the scope of the patent application, wherein the insulating member is provided with a fixing hole outside the stopper, and the light-emitting diode chip module further includes a cover, and the bottom end of the cover is provided with A convex post is positioned at the fixing hole, and a lens is provided at the top of the outer cover corresponding to the light emitting diode chip. 8. The light-emitting diode chip module according to item 5 of the scope of patent application, further comprising an outer cover, the inner surface of the bottom end of the outer cover is fixed to the outer surface of the outer stopper of the insulation member, and the top end of the outer cover is provided with The lens corresponds to the light-emitting diode wafer.

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