TWI255432B - Active matrix organic electroluminescent display device and fabricating method thereof - Google Patents
Active matrix organic electroluminescent display device and fabricating method thereof Download PDFInfo
- Publication number
- TWI255432B TWI255432B TW092110050A TW92110050A TWI255432B TW I255432 B TWI255432 B TW I255432B TW 092110050 A TW092110050 A TW 092110050A TW 92110050 A TW92110050 A TW 92110050A TW I255432 B TWI255432 B TW I255432B
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- insulator
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Links
- 238000000034 method Methods 0.000 title claims abstract description 66
- 239000011159 matrix material Substances 0.000 title claims abstract description 26
- 230000008569 process Effects 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000010410 layer Substances 0.000 claims description 370
- 239000003990 capacitor Substances 0.000 claims description 71
- 239000012212 insulator Substances 0.000 claims description 61
- 239000000872 buffer Substances 0.000 claims description 41
- 238000002161 passivation Methods 0.000 claims description 38
- 239000004020 conductor Substances 0.000 claims description 35
- 239000004065 semiconductor Substances 0.000 claims description 31
- 239000011229 interlayer Substances 0.000 claims description 23
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 17
- 238000003860 storage Methods 0.000 claims description 17
- 229910052732 germanium Inorganic materials 0.000 claims description 16
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 16
- 229920005591 polysilicon Polymers 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 6
- 238000000746 purification Methods 0.000 claims description 6
- 230000006870 function Effects 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims description 3
- 238000004020 luminiscence type Methods 0.000 claims description 3
- 239000011368 organic material Substances 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 230000003139 buffering effect Effects 0.000 claims 1
- 239000002305 electric material Substances 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- -1 indium epoxide Chemical class 0.000 claims 1
- 229910003437 indium oxide Inorganic materials 0.000 claims 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims 1
- 229910001887 tin oxide Inorganic materials 0.000 claims 1
- 239000002023 wood Substances 0.000 claims 1
- 239000009530 yishen Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 230000009467 reduction Effects 0.000 abstract description 7
- 230000003685 thermal hair damage Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 239000010409 thin film Substances 0.000 description 30
- 238000005401 electroluminescence Methods 0.000 description 19
- 238000010586 diagram Methods 0.000 description 12
- 239000002019 doping agent Substances 0.000 description 12
- 239000013078 crystal Substances 0.000 description 9
- 230000003746 surface roughness Effects 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 230000000873 masking effect Effects 0.000 description 7
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- 230000005611 electricity Effects 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 3
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- 230000005684 electric field Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 235000009470 Theobroma cacao Nutrition 0.000 description 1
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- 102000004586 YY1 Transcription Factor Human genes 0.000 description 1
- 108010042669 YY1 Transcription Factor Proteins 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- 244000240602 cacao Species 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- KMWHNPPKABDZMJ-UHFFFAOYSA-N cyclobuten-1-ylbenzene Chemical compound C1CC(C=2C=CC=CC=2)=C1 KMWHNPPKABDZMJ-UHFFFAOYSA-N 0.000 description 1
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Thin Film Transistor (AREA)
- Led Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2002-0031045A KR100484591B1 (ko) | 2001-12-29 | 2002-06-03 | 능동행렬 유기전기발광소자 및 그의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200307893A TW200307893A (en) | 2003-12-16 |
TWI255432B true TWI255432B (en) | 2006-05-21 |
Family
ID=31713066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092110050A TWI255432B (en) | 2002-06-03 | 2003-04-29 | Active matrix organic electroluminescent display device and fabricating method thereof |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4091481B2 (ja) |
CN (1) | CN100470842C (ja) |
TW (1) | TWI255432B (ja) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW521226B (en) | 2000-03-27 | 2003-02-21 | Semiconductor Energy Lab | Electro-optical device |
JP4507611B2 (ja) * | 2004-01-29 | 2010-07-21 | セイコーエプソン株式会社 | 有機エレクトロルミネッセンス装置、及び電子機器 |
KR100646297B1 (ko) * | 2004-03-05 | 2006-11-23 | 도시바 마쯔시따 디스플레이 테크놀로지 컴퍼니, 리미티드 | 표시 장치의 제조 방법 |
JP2005340802A (ja) * | 2004-04-28 | 2005-12-08 | Semiconductor Energy Lab Co Ltd | 半導体装置及び表示装置の作製方法 |
JP4549889B2 (ja) | 2004-05-24 | 2010-09-22 | 三星モバイルディスプレイ株式會社 | キャパシタ及びこれを利用する発光表示装置 |
KR100589375B1 (ko) * | 2004-05-24 | 2006-06-14 | 삼성에스디아이 주식회사 | 커패시터 및 이를 이용하는 발광 표시 장치 |
KR100689316B1 (ko) * | 2004-10-29 | 2007-03-08 | 엘지.필립스 엘시디 주식회사 | 유기전계발광다이오드소자 및 그 제조방법 |
US7948171B2 (en) * | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
US7652291B2 (en) | 2005-05-28 | 2010-01-26 | Samsung Mobile Display Co., Ltd. | Flat panel display |
KR100712295B1 (ko) | 2005-06-22 | 2007-04-27 | 삼성에스디아이 주식회사 | 유기 전계 발광 소자 및 그 제조 방법 |
KR100665943B1 (ko) | 2005-06-30 | 2007-01-09 | 엘지.필립스 엘시디 주식회사 | 유기전계 발광 디스플레이 장치 및 구동방법 |
US7898623B2 (en) * | 2005-07-04 | 2011-03-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device, electronic device and method of driving display device |
JP4939045B2 (ja) | 2005-11-30 | 2012-05-23 | セイコーエプソン株式会社 | 発光装置および電子機器 |
JP4661557B2 (ja) | 2005-11-30 | 2011-03-30 | セイコーエプソン株式会社 | 発光装置および電子機器 |
KR20070063300A (ko) * | 2005-12-14 | 2007-06-19 | 삼성전자주식회사 | 유기 박막 트랜지스터 표시판 및 그 제조 방법 |
JP5250960B2 (ja) * | 2006-01-24 | 2013-07-31 | セイコーエプソン株式会社 | 発光装置および電子機器 |
US8193591B2 (en) | 2006-04-13 | 2012-06-05 | Freescale Semiconductor, Inc. | Transistor and method with dual layer passivation |
JP2010055070A (ja) * | 2008-07-30 | 2010-03-11 | Sumitomo Chemical Co Ltd | 表示装置および表示装置の製造方法 |
KR101015850B1 (ko) * | 2009-02-09 | 2011-02-24 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 제조 방법 |
KR102216028B1 (ko) * | 2009-07-10 | 2021-02-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
KR101889918B1 (ko) * | 2010-12-14 | 2018-09-21 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치 및 이의 제조 방법 |
KR20130025717A (ko) | 2011-09-02 | 2013-03-12 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
RU2626996C2 (ru) * | 2012-02-03 | 2017-08-02 | Конинклейке Филипс Н.В. | Устройство на органических светодиодах и его изготовление |
KR101942515B1 (ko) * | 2012-05-03 | 2019-01-28 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
JP6169005B2 (ja) * | 2014-01-17 | 2017-07-26 | 株式会社ジャパンディスプレイ | 発光素子表示装置 |
JP6098017B2 (ja) * | 2014-02-17 | 2017-03-22 | エバーディスプレイ オプトロニクス(シャンハイ) リミテッド | 薄膜トランジスタアレイ基板及びその製造方法 |
CN104022142B (zh) * | 2014-06-12 | 2017-10-17 | 四川虹视显示技术有限公司 | 高开口率的顶发射amoled器件与制成方法 |
CN104022141A (zh) * | 2014-06-12 | 2014-09-03 | 四川虹视显示技术有限公司 | 基于nmos晶体管的倒置顶发射amoled器件及生产方法 |
KR102174998B1 (ko) * | 2014-07-10 | 2020-11-06 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
CN104393017B (zh) | 2014-10-31 | 2017-12-15 | 京东方科技集团股份有限公司 | 阵列基板的制作方法、阵列基板及显示装置 |
CN107871757B (zh) * | 2016-09-23 | 2020-04-14 | 京东方科技集团股份有限公司 | 有机发光二极管阵列基板及其制备方法、显示装置 |
US11283021B2 (en) | 2016-10-24 | 2022-03-22 | Mitsubishi Electric Corporation | Compound semiconductor device including MOTT insulator for preventing device damage due to high-energy particles |
CN113658868B (zh) * | 2016-12-15 | 2023-08-08 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
JP6873476B2 (ja) * | 2017-08-08 | 2021-05-19 | 株式会社Joled | アクティブマトリクス表示装置 |
CN107910347A (zh) * | 2017-10-18 | 2018-04-13 | 深圳市华星光电半导体显示技术有限公司 | 一种显示器件及oled显示面板 |
CN108447885B (zh) * | 2018-01-17 | 2021-03-09 | 上海天马微电子有限公司 | 有机发光显示面板和显示装置 |
WO2019186805A1 (ja) | 2018-03-28 | 2019-10-03 | 堺ディスプレイプロダクト株式会社 | 有機el表示装置及びその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3457819B2 (ja) * | 1996-11-28 | 2003-10-20 | カシオ計算機株式会社 | 表示装置 |
JP4549475B2 (ja) * | 1999-02-12 | 2010-09-22 | 株式会社半導体エネルギー研究所 | 半導体装置、電子機器、および半導体装置の作製方法 |
TWI282697B (en) * | 2000-02-25 | 2007-06-11 | Seiko Epson Corp | Organic electroluminescence device |
JP4360015B2 (ja) * | 2000-03-17 | 2009-11-11 | セイコーエプソン株式会社 | 有機el表示体の製造方法、半導体素子の配置方法、半導体装置の製造方法 |
JP2002124678A (ja) * | 2000-10-13 | 2002-04-26 | Sony Corp | 薄膜トランジスタの製造方法 |
JP3931547B2 (ja) * | 2000-10-18 | 2007-06-20 | セイコーエプソン株式会社 | 電気光学装置及びその製造方法 |
-
2003
- 2003-04-29 TW TW092110050A patent/TWI255432B/zh not_active IP Right Cessation
- 2003-04-30 CN CNB031241344A patent/CN100470842C/zh not_active Expired - Lifetime
- 2003-06-03 JP JP2003157754A patent/JP4091481B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP4091481B2 (ja) | 2008-05-28 |
CN100470842C (zh) | 2009-03-18 |
CN1457220A (zh) | 2003-11-19 |
JP2004046154A (ja) | 2004-02-12 |
TW200307893A (en) | 2003-12-16 |
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