TWI253189B

TWI253189B - Light emitting device and illumination instrument using the same

Info

Publication number: TWI253189B
Application number: TW93137343A
Authority: TW
Inventors: Takuo Murai; Hideki Fukuda; Takeyuki Maegawa; Yoshiyuki Gotoh; Kenichi Ishii
Original assignee: Mitsubishi Electric Corp; Mitsubishi Elec Lighting Corp
Priority date: 2003-12-05
Filing date: 2004-12-03
Publication date: 2006-04-11
Also published as: HK1089291A1; TW200524186A; KR100731454B1; WO2005055328A1; JP4088932B2; JPWO2005055328A1; CN1762061A; CN101363578B; CN101363578A; KR20060036039A; CN100492685C

Abstract

A light emitting device includes: a plurality of LED-mounted substrates (4), each having an LED element (12) emitting light of a short wavelength; a case (2) having a concave portion having a reflection surface (2a) on which a wavelength conversion unit (3) is arranged for emitting the converted light by the short-wavelength light of the LED element (12); and a thermo-conductive substrate support plate (5) standing at the center portion of the bottom of the concave portion of the case (2). The reflection surface (2a) is a parabolic plane formed along the both sides of the LED substrate support plate (5). The LED mounted substrates (4) are arranged on both sides of the LED substrate support plate (5) in such a manner that the light-emitting surfaces of the LED elements (12) face the reflection surface (2a).

Description

1253189 九、發明說明：【發明所屬之技術領域】本發明係有關於使用務亦-搞雕 > 七义用心尤一極體之光源之咼效率之發光裝置及使用該裝置之照明器具。【先前技術】關於以往之使用發光二極體（led : Light Emittmg 叫㈣之發光裝置及照明裝置之發明报多。其中，例如提議幾種實現將來自LED之發射光變換成第二光後想反射性的取出之高效率照明裝置之方法。其中在將短波長㈣和螢光物組合後實現發光裝置的例子上有如下所示的。在以往之發光二極體’來自發光二極體元件之發射之發射光束之一部分往該發光二極體元件之發光面側之和該發光二極體元件相向之反射面，又一部分直接透射透光性構件後往射出φ。在反射面，利㈣著接受來自該發光二極體元件之發射光束發射可見光之f光物，主要進行可見光域之發光。X，在直接往透光性構件 :膜面之發射光束之中400nm以下之紫外光域之成分被干二反射後’再回到透明樹脂材料内，碰到黏接層16 ^光物，被變換成可見光，直接或向反射面反射後自射出面自干涉膜射出（例如參照專利文獻1)。 [專利文獻1]特開2001_345483號 0020〜0026、圖 υ。 I Η又洛1253189 IX. Description of the Invention: [Technical Field to Be Invented by the Invention] The present invention relates to a lighting device and a lighting fixture using the same, which are related to the use of the light source of the light source. [Prior Art] There have been many reports on the use of a light-emitting diode (LED: Light Emittmg (4)), and it has been proposed, for example, that several implementations are required to convert the emitted light from the LED into the second light. A reflective high-efficiency illumination device method in which an example of a light-emitting device is realized by combining a short-wavelength (four) and a phosphor. The conventional light-emitting diode 'from a light-emitting diode element One part of the emitted emission light beam is directed to the light-emitting surface side of the light-emitting diode element and the reflective surface facing the light-emitting diode element, and a part of the light-emitting surface is directly transmitted through the light-transmitting member to emit φ. On the reflective surface, the profit (4) The light-emitting material that receives the visible light from the emitted light beam of the light-emitting diode element mainly emits light in the visible light region. X is in the ultraviolet light region of 400 nm or less directly in the light-transmitting member: the emitted light beam of the film surface. After the component is reflected by the dry two, it returns to the transparent resin material and hits the adhesive layer 16^ light object, which is converted into visible light, and is directly reflected on the reflective surface and then emitted from the exit surface. Interference film is emitted (e.g. refer to Patent Document 1). [Patent Document 1] Laid-Open No. 2001_345483 0020~0026, FIG υ. I Η and Luo

2148-6713-PF 5 1253189 L發明内容】發明要解決之課題以往之發光二極體因可有效的活用來自發光二件之發射光束之紫外光域，使用發光二極體之元 \ :性能及省能源化。又，因可防止來自陽光之紫外線起之光透射性構件之劣化及變黃’可提高在室外使 :極體之情況之壽命，尤其报適合作為室外用影像顯：可是，在本構造效率降低之缺點。此利用複數LED之情況效率下提高發光量。電極構件構造成為障礙，具有光取出外，在為了提高裝置本體之發光量而，其電極面積增加，難在保持高取出又’係在透光性構件之上面直接設置干涉膜之方法，因而，透光性構件4要固豸。因而，無法將例如導熱性佳之液體或果醬狀之材料用作透明材料。又，尤其在使發光面朝下的使用之情況，因係將LED元件埋在透明構件: 構造，在元件接面部產生之熱之散熱效率變差，結果有LED 發光效率降低或元件壽命變短之問題。本發明之目的在於得到高效率、壽命長以及費用更低之發光裝置及使用該裝置之照明器具，改善在使用複數使用如LED元件之短波長光源之發光裝置之情況之效率降低或散熱性。解決課題之手段 2148-6713-PF 6 1253189 本發明之發光裝置，包括··複數LED組裝基板，組裝發射短波長光之LED元件；筐體，具有在凹部設置了利用 LED兀件之短波長光發射變換光之波長變換部之反射面；以及$熱性之LED基板支撐板，立設於該筐體之凹部底面之中央部，该反射面由在該基板支撐板之該立設部之兩侧所形成之拋物面構成；在LED基板支撐板之兩面使該LED 凡件之發光面各自朝向該反射面的安裝該LED組裝基板。【實施方式】實施例1 圖1係表示本發明之實施例丨之發光裝置之剖面圖（圖 2之B剖面圖），圖2係發光裝置之上視圖，圖3係發光裝置之LED組裝基板之上視圖，圖4係發光裝置之led組裝基板之剖面圖（圖3之B剖面圖），圖5係發光裝置之波長變換材料之說明圖。在圖1、圖2,本發光裝置由以下之構件構成，lED組裝基板4,組裝了在近紫外線區域具有尖峰值之短波長lED tl件12 ;筐體2，在内側具有表面成為反射面2a之凹部；波長變換部3，設於筐體2内侧之反射面2a，以自LED元件12發出之光為激發光，變換波長，發出係變換光之第一光；基板支撐板5，立設於凹部之反射面2a之底部之中央，在兩面支撐LED組裝基板4，具有導熱性；透光性板工，褒在筐體2之開口部；以及高導熱性構件4〇，設置於重雕 2之背面中央部。而，2片LED組裝基板4裝在基板支^ 2148-6713-PF 7 1253189 口〜之兩側面，使得各自之LED元件1 2之發光中心軸朝 2匡體凹部之反射面2a之側面方向，透光性板1成為使自 =體内部發出之光向外部發光之發光面，例如用玻璃或樹脂等透光性板構成。凹部之反射面2a由在底部之中央所形成之稜線部 2al、由沿著該稜線部2al之兩側具有谷部之2個在上視圖為長方形之拋物面構成之反射面2a2以及該拋物面之兩端之側面2a4構成。基板支撐板5和在稜線部丨所設置之才曰瓜。而立設，基板支撐板5之單侧端面和高導熱性構件 40部分接觸。此外，盧體2考慮加工性而用耐熱性佳之樹脂構成，但是考慮散熱性而用金屬等高導熱性構件構成也可。其次，圖3、圖4表示LED組裝基板4之構造，但是在本實施例為了提高和LED元件12之壽命或發光效率有關之LED元件12之散熱性，在LED基板1〇使用金屬基板。為了保持金屬基板之電氣絕緣性，在基板上設置絕緣層 B，在其上設置導電圖案u，在其上組裝LED元件12。癱此外，成為在導電圖案U上之LED元件12之組裝部分除外之部分設置絕緣層1 5之構造。此外，採用經由黏接層丨6將以位於LED組裝基板4 之前面方向之配光特性取出自LED元件12向侧面方向發射之該短波長光之led組裝基板上板13和LED基板1〇接合之構造。在LED組裝基板上板13配合led元件12 之配設位置設置反射孔：U，將反射孔14之侧面設為擴散 2148-6713-PF 8 1253189 :鏡面狀之高反射率面，使得高效2148-6713-PF 5 1253189 L SUMMARY OF THE INVENTION Problems to be Solved by the Invention In the past, the light-emitting diodes can effectively utilize the ultraviolet light field of the emitted light beams from the two light-emitting diodes, using the elements of the light-emitting diodes: performance and Energy saving. In addition, since it is possible to prevent deterioration and yellowing of the light-transmitting member from the ultraviolet rays of the sunlight, it is possible to improve the life of the polar body in the outdoor state, and it is particularly suitable for use as an outdoor image display. However, the structure is reduced in efficiency. The shortcomings. In the case of using a plurality of LEDs, the amount of luminescence is increased by efficiency. The electrode member structure is an obstacle, and in addition to light extraction, the electrode area is increased in order to increase the amount of light emitted from the device body, and it is difficult to maintain the high extraction and the method of directly providing the interference film on the light-transmitting member. The light transmissive member 4 is to be solidified. Therefore, it is not possible to use, for example, a liquid having a good thermal conductivity or a jam-like material as a transparent material. Further, particularly in the case where the light-emitting surface is used downward, since the LED element is buried in the transparent member: the structure, the heat dissipation efficiency of the heat generated on the surface of the element is deteriorated, and as a result, the LED light-emitting efficiency is lowered or the element life is shortened. The problem. SUMMARY OF THE INVENTION An object of the present invention is to provide a light-emitting device having high efficiency, long life, and low cost, and a lighting fixture using the same, which can improve efficiency or heat dissipation in the case of using a light-emitting device using a plurality of short-wavelength light sources such as LED elements. Means for Solving the Problem 2148-6713-PF 6 1253189 The light-emitting device of the present invention comprises: a plurality of LED assembly substrates, and an LED element for emitting short-wavelength light; and a housing having short-wavelength light using LED elements in the concave portion a reflective surface of the wavelength conversion portion that emits the converted light; and a thermal LED substrate support plate erected on a central portion of the bottom surface of the recess of the housing, the reflective surface being on both sides of the erect portion of the substrate support plate The paraboloid formed is formed; and the LED assembly substrate is mounted on each of the LED substrate support plates so that the light-emitting surfaces of the LEDs face the reflective surface. [Embodiment] FIG. 1 is a cross-sectional view showing a light-emitting device according to an embodiment of the present invention (a cross-sectional view taken along line B of FIG. 2), FIG. 2 is a top view of the light-emitting device, and FIG. 3 is an LED assembly substrate of the light-emitting device. In the top view, FIG. 4 is a cross-sectional view of a led assembly substrate of the light-emitting device (cross-sectional view of FIG. 3B), and FIG. 5 is an explanatory diagram of a wavelength conversion material of the light-emitting device. In Fig. 1 and Fig. 2, the light-emitting device is composed of the following members, and the substrate 4 is assembled by lED, and a short-wavelength lED DT 12 having a sharp peak in the near-ultraviolet region is assembled; the casing 2 has a surface as a reflecting surface 2a on the inner side. The wavelength conversion unit 3 is provided on the reflection surface 2a inside the casing 2, and the light emitted from the LED element 12 is used as excitation light to convert the wavelength to emit the first light of the converted light. The substrate support plate 5 is erected. In the center of the bottom of the reflecting surface 2a of the concave portion, the LED assembly substrate 4 is supported on both sides, and has thermal conductivity; the translucent plate is placed on the opening of the casing 2; and the highly thermally conductive member 4 is set in the re-engraving 2 at the center of the back. On the other hand, the two LED assembly substrates 4 are mounted on the sides of the substrate support 2148-6713-PF 7 1253189, such that the central axes of the respective LED elements 12 are directed toward the side of the reflection surface 2a of the second body recess. The translucent plate 1 is a light-emitting surface that emits light emitted from the inside of the body to the outside, and is made of, for example, a translucent plate such as glass or resin. The reflecting surface 2a of the concave portion is composed of a ridge portion 2a1 formed at the center of the bottom portion, two reflecting surfaces 2a2 having a paraboloid having a rectangular shape in a top view along both sides of the ridge portion 2al, and two paraboloids. The side 2a4 of the end is formed. The substrate support plate 5 and the ridge line portion are provided. On the other hand, the one-side end surface of the substrate supporting plate 5 is partially in contact with the highly thermally conductive member 40. Further, the Lu 2 is made of a resin having good heat resistance in consideration of workability, but may be formed of a highly thermally conductive member such as metal in consideration of heat dissipation. 3 and 4 show the structure of the LED assembly board 4. However, in the present embodiment, in order to improve the heat dissipation of the LED element 12 relating to the life or luminous efficiency of the LED element 12, a metal substrate is used for the LED substrate 1. In order to maintain electrical insulation of the metal substrate, an insulating layer B is provided on the substrate, a conductive pattern u is placed thereon, and the LED element 12 is assembled thereon. Further, a structure in which the insulating layer 15 is provided except for the assembled portion of the LED element 12 on the conductive pattern U is provided. Further, the LED assembly substrate upper board 13 and the LED substrate 1 are bonded to the short-wavelength light emitted from the LED element 12 in the side direction by the bonding layer 丨6 through the bonding layer 丨6. Construction. On the LED assembly substrate, the plate 13 is provided with a reflection hole in the arrangement position of the LED element 12: U, and the side surface of the reflection hole 14 is made to diffuse 2148-6713-PF 8 1253189: a mirror-like high reflectivity surface, which is highly efficient

元件12發出之氺 r Γ?ΤΛ 、向月,j面發射自LEDAfter the component 12 is issued, r Γ?ΤΛ, to the moon, j-plane is emitted from the LED

:以出之先。LED组裝基板上板 LED 脂等構成，反射孔1 4以外列如金屬或樹〈表面也為了组高反射率塗料塗抹，哎在円照明效率，用木次在表面進行蒸鍍高反此外，為了蔣古ό r 材料荨處理。匕卜马了美间自LED元件ί2之光: Take the lead. On the LED assembly board, the board is made of LED grease, etc., and the reflection holes are arranged in a column such as a metal or a tree. The surface is also coated with a high-reflectivity paint, and the enamel is used for the illuminating efficiency, and the surface is vapor-deposited on the surface. For the treatment of Jiang Guό r material.匕布马美美自LED component ί2光

组裝基板上板13之反射子丨如先取出效率，在LED 射孔1 4杈製透明性模得覆蓋LED元件12。在+ π 、衣材# 17，使卞在此，因LED元件12在立-、士，透明性模製材# 17用例糸紐波長光，材料構成。LED元件12係裰霞之m 料玻璃寻The reflectors of the board 13 on the assembled substrate are first removed, and the LEDs 12 are covered with transparency to cover the LED elements 12. In the case of + π, clothing material #17, 卞卞, because the LED element 12 is in the form of Li-shi, transparent mold material #17, 糸 New wavelength light, material. LED component 12 is the source of the glass

樽造可提咼光取出效率。 LED基板10係玻璃環氧樹脂基板也置之功能，但是如上述所示，為了提高咖元件之熱之散熱性：採用金屬基板。在其他之散熱性基板上，也可使用將问$熱性之薄膜基板黏在金屬板的或者陶曼材料0 一在匕LED元件12未特定正裝型式或倒裝片型式之發光型之種類。此外，為了提高反射孔14内之整體之反射率’用高反射率之塗料等塗抹係金屬基板之led基板10 上之表面絕緣層。此外，在類似本實施例之LED組裝基板4之構造上，有LED基板和LED基板上板一體化之以陶瓷或高導熱性樹脂為主材料之市面上之LeD封裝件。本發光裝置在發光部使用這種市面上之LED封裝件之情況，也可不失其本質功月匕的付到和本實施例一樣之效果。 2148-6713-PF 9 1253189 在此，本實施例之反射孔H及市面上之料件之反射孔猎者用對於LED發射之短波長光係高反射率且基板上板U表面及市面上之封裝件表面對於利用波長變換部變換後之變換波長光係高反射率之構件構成，可得到在那些部位之光損失少之發光效率高之發光裝置。波長變換部3例如如圖5所示，以各自具有以激發短波長led發射光譜S1之光譜發光之藍色發射光譜、綠色發射光譜S3以及紅色發射光譜以之3種混合螢光物構成。利肖本構造實現白色發光，但是f光物混合時，按昭提高發光效率而且提高分色性（㈤们endenng)之比例實現' 3種螢光物之混合比。藉著這種構造波長變換部3,和以往使用之藍色發光 LED兀件和被其波長激發而發出黃光4 _⑺wumManufacturing can improve the efficiency of light extraction. The LED substrate 10 is also a function of the glass epoxy substrate. However, as described above, in order to improve the heat dissipation of the coffee element, a metal substrate is used. On the other heat-dissipating substrate, it is also possible to use a type in which the heat-sensitive film substrate is adhered to the metal plate or the Tauman material 0 is used in the LED element 12 without the specific mounting type or the flip-chip type. Further, in order to increase the overall reflectance in the reflection hole 14, the surface insulating layer on the LED substrate 10 of the metal substrate is applied with a high reflectance paint or the like. Further, in a configuration similar to the LED assembly substrate 4 of the present embodiment, there is a commercially available LeD package in which a ceramic substrate or a high thermal conductivity resin is integrated with an LED substrate and an LED substrate upper plate. In the case where the light-emitting device uses such a commercially available LED package in the light-emitting portion, the same effect as that of the present embodiment can be obtained without losing its essential power. 2148-6713-PF 9 1253189 Here, the reflection hole H of the present embodiment and the reflection hole hunter of the material on the market have high reflectivity for the short-wavelength light emitted by the LED and the U-surface of the substrate and the surface of the substrate The surface of the package is composed of a member having a high reflectance of a converted wavelength light converted by the wavelength conversion unit, and a light-emitting device having high light-emitting efficiency with little loss of light at those portions can be obtained. For example, as shown in Fig. 5, the wavelength converting portion 3 is composed of three kinds of mixed phosphors each having a blue emission spectrum, a green emission spectrum S3, and a red emission spectrum which emit light in a spectrum for exciting a short-wavelength LED emission spectrum S1. The Lishawe structure realizes white light emission, but when the f-light material is mixed, the mixing ratio of the three kinds of phosphors is realized in accordance with the ratio of improving the luminous efficiency and improving the color separation ((end). By constructing the wavelength conversion unit 3 in this way, and the blue light-emitting LED element used in the past and being excited by the wavelength thereof, yellow light is emitted 4 _(7)wum

AlUminum Garnet)系螢光物實現白色發光之方法相比，因發射光譜之分光成分在變換光域連續，可得到分色性高之發光裝置。 Θ 可是，構成本發光裝置之短波長LED係發出紫外線、近紫外線或紫色、藍色光的，上述之内容不是限制利用藍色發光LED元件# YAG系螢光物之實現的。此外，短波 =LED光使用紫外光、或具有紫色或藍紫色之近紫外光之情況，被其激發之螢光物種類有具有以藍、綠、紅為主之夕種發光色的。因此，藉著利用其選定、組合得到白色以 :卜之任意之光色或例如圖5之S2、S3、S4選定具有狹域光瑨的，例如也可得到也可應用於液晶顯示裝置之照明之色 2148-6713-PF 10 1253189 重現域寬之發光裝置。又，用係具有紫或藍紫色之發光波長（約360〜43〇nm) 之近紫外線發光的構成短波長LED發光波長時，和紫外發光的相比，一般雖然在該波長區域之螢光物激發效率低，部具有LED元件12本身之光吸收少、發光效率高之特徵。因而’错者使用近紫外LED，可得到在保持高發光效率下，如使用紫外線之情況之構件劣化少、對生物面之不良影塑也少之發光裝置。此外，如上述所示’因在本波長區域具有激电γ之京光物很多，具有可任意的設計發光色之優點。又LED凡件1 2 —般元件内部溫度或周圍溫度升高時引起發光效率降低，但是在將本發光裝置用作照明裝置之 f月况，使本發光裝置之發光面朝下的使用之情況多，在此AlUminum Garnet) is a light-emitting device having a high color separation property because the spectral component of the emission spectrum is continuous in the converted optical domain as compared with the method in which the fluorescent material realizes white light emission. However, the short-wavelength LEDs constituting the present light-emitting device emit ultraviolet light, near-ultraviolet light, or purple or blue light, and the above-described contents are not limited to the realization by the blue light-emitting LED element #YAG-based phosphor. In addition, short-wave = LED light uses ultraviolet light, or has a purple or blue-violet near-ultraviolet light, and the type of phosphor that is excited by it has an illuminating color mainly composed of blue, green, and red. Therefore, by using the selected and combined colors to obtain a white color: or any of the light colors of S2, S3, and S4 of FIG. 5, for example, it is also possible to obtain illumination applicable to a liquid crystal display device. Color 2148-6713-PF 10 1253189 Reproduces the field width illuminator. Further, when a short-wavelength LED light-emitting wavelength is formed by a near-ultraviolet light having a violet or blue-violet light-emitting wavelength (about 360 to 43 Å), compared with ultraviolet light, generally, a phosphor in the wavelength region is used. The excitation efficiency is low, and the LED element 12 itself has a feature of less light absorption and high luminous efficiency. Therefore, when the near-ultraviolet LED is used, it is possible to obtain a light-emitting device which has less deterioration of the member when the ultraviolet ray is used, and which has less damage to the biological surface. Further, as described above, "there is a large amount of light-emitting gamma having a pseudo-electricity γ in the present wavelength region, and it has an advantage that the luminescent color can be arbitrarily designed. In addition, when the internal temperature of the component or the ambient temperature rises, the luminous efficiency is lowered, but in the case where the light-emitting device is used as a lighting device, the light-emitting surface of the light-emitting device is used downward. More, here

情況’考慮到散熱性之本發明之構造對於L 元件壽命有效的發揮功能。文羊次尤其’令和用金屬等導熱性材料構成基板支擇板$而且採用在簋體2之背面所設置之單面位於空氣中之構造之高導熱性構件40接觸，藉著確保自led元件以生之埶之散熱路徑’可提高散熱性。在導熱性材料，例如使用導熱係數高之銘、鋼、金屬陶莞等。此夕卜’如圖2戶斤+ ^ 所不，稭著在構造上使基板支撐板5之短邊側之至少一端和箧雕不匡肢2之内側之凹部之側面2a4接觸 (圖2虛線上A點）’在使接觸端位於上侧而作為側面發光裝置使用之情況’因可確保沿著基板支禮板 m㈣MMm。之政熱路Case 'The structure of the present invention in consideration of heat dissipation is effective for the life of the L element. In particular, Wenyang Times uses a thermally conductive material such as a metal to form a substrate-retaining plate, and is in contact with a highly thermally conductive member 40 having a structure in which a single side of the body 2 is disposed in the air, by ensuring self-leading. The component's heat dissipation path is used to improve heat dissipation. In the case of a thermally conductive material, for example, a high thermal conductivity, steel, metal ceramics, or the like is used. In this case, as shown in Fig. 2, the at least one end of the short side of the substrate supporting plate 5 is in contact with the side 2a4 of the concave portion on the inner side of the squatting arm 2 (Fig. 2 The upper point A) 'in the case where the contact end is located on the upper side and used as the side light-emitting device' is ensured to be MMm along the substrate board m (four). Political hot road

2148-6713-PF 11 1253189 牡不構造自在立設於筐體2之凹部中央之基板支撐兩面所女裝之LED組裝基板4之le 作為激於朵夕y 4 匕什i Z知射二:先之短波長光，用在董體2之凹部之反射面2a所二散：長變換部3變換波長後發光之變換光經由透光性2148-6713-PF 11 1253189 The oyster is not constructed on the substrate which is erected in the center of the recess of the casing 2, and the LED assembly board 4 of the women's wear on both sides is used as a singular y y 4 匕 i i Z 知射二: first The short-wavelength light is used for the reflection surface 2a of the concave portion of the Dong body 2, and the converted light of the light converted by the long conversion portion 3 is transmitted through the light transmission.

- 述所示’包括筐體2,在凹部具有設置了利用LED 几件12之短波長光發射變換光之波長變換部3之反射面 &及導熱性之基板支撐板5’立設於本笪體2之凹部底面之中央部，·因在基板支撐板5之兩面安裝組裝了元件12之LED组裝基板4，可提高⑽組裝基板4之散敎性’在使用由複數LEDit件構成之大輪出㈣组裝基板之情況’也可抑制LED元件溫度上升’結果可得到壽命長之大光束發光裝置。此外’本發明之效果在咖元件為一個之^況也有效。 4外，在LED元件上有近年來加速開發之大電流驅動、大光輸出型，可使得與其相關的也可裝入發熱量大之 LED元件（高功率元件）。此外，在本實施例，在筐體2之背面將高導熱性構件 4〇裝成和基板支撐板5接觸，但是不安裝高導熱性構件 40，而使得用高導熱性構件構成至少安裝基板支撐板$之匡體2之凹部底面中央部也可。又，如圖6所示，藉著設置散熱片24等散熱性構件，替代和基板支撐板5之端部接觸之高導熱性構件4〇，可更提高散熱效果。又，係用金屬板形成筐體2之例子，但是 2148-6713-PF 12 1253189 I販支撐板 --V J <恐，V……、"心《Τ野恐，固丄戶厅示之望體2之構成材料係如樹脂或塑膠之非金屬性材料也可。又在放熱片24以外之提供高散熱效果之構件上，使用熱管或泊耳帖(P啊元件，和散熱片24 一樣的和基板支撐板5之端部接觸之構造也可。又’如圖31戶斤示，對於基板支稽板5之基板安製部分 5a使LED組4基板4位於反射面2a之斜上方也可。藉著本構造’可使得自透光性板1之表侧無法直接看到LED元件12 t光源之影像。又，如圖32所示，將基板支撐板5 :基板女I部分5a設成倒三角形也可’ [ED組裝基板4之月面具有厚度’可改善散熱效果。在本構造基板安裝部分之“—角形之表面係高反射率反射面較好，X，和透光性板1接觸也可。又，：是如圖b圖6所示之厚度厚之值體2,而如圖不溥的金屬板構成也可。 ^ 在圖7,不僅筐體2,設置贫文換口戶3之反射部29冰用描 > 人碎也用—樣之金屬板構成。又，用 LED支撐板壓件41去声士古 ^ 牙南V熱性材料構成之基板支撐板5’猎者t在金屬之筐， & "2可提高散熱效果。又，藉著在匡肢2之背面安裝散敎η μ丄 …、寻尚散熱性構件，可使散献特性更良好。冉什」使戚… 此外，提高了 LED 特有之波長挪移抑制在光物之情況也可使其各文疋之發光色。元件1 2之散熱性之結果，可將LED 报】、之範圍，結果，在使用複數螢自發射光譜變動變成極小，可得到- As shown in the above description, the housing 2 including the reflecting surface of the wavelength converting portion 3 in which the short-wavelength light is converted by the short-wavelength light of the LED 12 is provided in the concave portion, and the substrate supporting plate 5' having the thermal conductivity is set up in the present embodiment. In the central portion of the bottom surface of the concave portion of the body 2, the LED assembly substrate 4 in which the component 12 is assembled is mounted on both surfaces of the substrate supporting plate 5, thereby improving (10) the bulkiness of the assembled substrate 4, which is composed of a plurality of LEDs. In the case of a large wheel (4) assembly of a substrate, it is also possible to suppress an increase in the temperature of the LED element. As a result, a large beam light-emitting device having a long life can be obtained. Further, the effect of the present invention is also effective in the case where the coffee element is one. In addition, in the LED element, there is a large current drive and a large light output type that have been developed in recent years, and it is also possible to incorporate an LED element (high power component) having a large amount of heat. Further, in the present embodiment, the high thermal conductive member 4 is mounted on the back surface of the casing 2 so as to be in contact with the substrate supporting plate 5, but the high thermal conductive member 40 is not attached, so that at least the mounting substrate is supported by the highly thermally conductive member. The central portion of the bottom surface of the recess of the body 2 of the plate can also be used. Further, as shown in Fig. 6, by providing a heat dissipating member such as the heat sink 24, the heat dissipating effect can be further improved instead of the high thermal conductive member 4b which is in contact with the end portion of the substrate supporting plate 5. Moreover, the case of forming the casing 2 with a metal plate is used, but the 2148-6713-PF 12 1253189 I-selling support plate--VJ < fear, V..., "heart "the wilderness fear, the solid households show The constituent material of the body 2 is also a non-metallic material such as a resin or a plastic. Further, on the member which provides a high heat-dissipating effect other than the heat radiation sheet 24, a heat pipe or a Pole plate (P ah element, the same structure as the heat sink 24 and the end portion of the substrate support plate 5 may be used. 31. The substrate mounting portion 5a of the substrate supporting board 5 is such that the LED group 4 substrate 4 is located obliquely above the reflecting surface 2a. By this structure, the front side of the self-transmissive board 1 cannot be made. The image of the LED element 12 t light source is directly seen. Further, as shown in FIG. 32, the substrate support plate 5: the substrate female portion 5a is set to an inverted triangle, and the thickness of the moon surface of the ED assembly substrate 4 can be improved. Heat dissipation effect. The surface of the structure substrate is “the surface of the angled surface is preferably a high reflectance reflecting surface, and X is in contact with the light transmitting plate 1. Further, it is thick as shown in Fig. 6 and Fig. 6. The value of the body 2 can be made up of a metal plate as shown in Fig. 7. In Fig. 7, not only the casing 2 but also the reflection portion 29 of the poor text changer 3 is used for ice drawing. The metal plate is formed. In addition, the LED support plate pressing member 41 is used to go to the sound of the ancient ^ 牙 South V material to support the substrate support plate 5' hunting t In the metal basket, &"2 can improve the heat dissipation effect. Moreover, by installing the 敎μ丄丄 on the back of the shin limb 2, and looking for the heat-dissipating member, the dispersion characteristics can be made better.戚此外此外此外此外此外此外特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特特In the use of complex firefly self-emission spectrum changes become extremely small, available

2148-6713-PP 1253189 又，除了在筐體2之凹部之反射面 & 換邱^、， W Za直接e又置波長變、°以外’在圖7所示之附加軟性波長變換材料用片μ 上預先塗抹波長變換部3等，令其黏在反射部29之方法也可。藉著這種構造’因在直接塗抹波長變換部3之产況 :广反射部29之形狀係複雜，可消除塗抹膜：之均度變差等現象。又’製造方法簡單，可提高發光效率。此時，波長變換部3如圖33所示，在構造上在令固化劑61含有係構成主材料之單-或多種榮光物6〇。 =劑主材料例如係樹脂或水，但是以在和榮光物之間 ^生化學變化或無礙光功能為前提選定。在本實施例，」用加工性、耐候性、透光性逐尤广生良好且可適應彎曲之凹部之、a之开v狀之具有柔軟性之例如矽材料形成。又，用對於至少LED元件12發射之短波長光係高反射率之鏡面或擴散性之好料错士、 ^ 片25之声而:之材抖構成附加軟性波長變換材料用料用片25之表用本附加軟性波長變換材合劑再射入（UV12)，可再裎极冰曰）白々占 _ 冉提波長變換機會之結杲，W裎冋波長變換效率◦此時， Μ之表面反射率對於波二加軟性波長變換材料用片 „ 了於波長變換後之光也具有高反射率之材料，因可使在黏合劑内沽具科“ 。汉射羊之材的反射，可得到發光效率更高 ^ “率軟性波長變換材料用片25 μ 4衣置。此外，在附加之多層構造片。 5上，例如可使用咖、紹、銀等攻在匡體2之凹部之反射 π 1接5又置波長變換部32148-6713-PP 1253189 In addition to the reflection surface of the concave portion of the casing 2, the W Za is directly set to the wavelength of the wavelength change, and the additional soft wavelength conversion material sheet shown in Fig. 7 is added. The method of applying the wavelength conversion unit 3 or the like to the reflection portion 29 in advance may be applied to the μ. By such a configuration, the condition of the wide reflection portion 29 is complicated by the direct application of the wavelength conversion portion 3, and the phenomenon that the uniformity of the application film is deteriorated can be eliminated. Further, the manufacturing method is simple, and the luminous efficiency can be improved. At this time, as shown in Fig. 33, the wavelength converting portion 3 is structured such that the curing agent 61 contains a single-or multiple luminescent materials 6 constituting the main material. = The main material of the agent is, for example, a resin or water, but is selected on the premise that there is a chemical change or a function of hindering light between the glory and the glare. In the present embodiment, it is preferable to use a material such as a crucible material which is excellent in workability, weather resistance, and light transmissivity, and which is suitable for a flexible concave portion of a curved concave portion. Further, with the short-wavelength light emitted from the LED element 12, the specular or diffusing property of the high-reflectance, the sound of the film, and the sound of the sheet 25 are used to form the sheet 25 for the additional soft wavelength-converting material. The table is further injected with this additional soft wavelength conversion material mixture (UV12), which can be further bucked by hail.) 杲冉波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长波长For the wave two-plus soft wavelength conversion material sheet, the material after the wavelength conversion also has a high reflectance material, because it can be used in the adhesive. The reflection of the Hanyang sheep material can achieve higher luminous efficiency. ^ "The rate of soft wavelength conversion material is 25 μ 4 sets. In addition, in the additional multilayer construction sheet. 5, for example, coffee, Shao, silver, etc. can be used. The reflection of the concave portion of the body 2 is π 1 and 5 is set to the wavelength conversion portion 3

2148-6713-PF 14 1253189 時’用高反射部材料形成也得到一樣之效果。又，p 波長變換部3之部分， ^ 本尚反射率^f輕/么+ 材料也可，或者在筐體2上、和筐體-樣之屬電鍍也可形成。 9 或'艮等之金屬蒸鍍或金又，發光裝置之波長變換部設部直接塗抹混入了螢〃在波長變換部3之配高反射率材料形成至少波長，述-樣，藉著用有高發光效率之發光裝置。之配設部，可得到具此外如® 7所示，藉著在置反射LED元件12之^欢1之内侧背面設區域之光透射…分而使除此以外之波長 [戍之W射之濾光^蒸鐘料咖 = LED元件12之發射光向外部直接發光，二 =有助於來自波長變換部3之發光之構件，可提高發用透二和LED發射光反射部26之有無無關，藉著利 ==板1完全塞住如表面，再在這體2内部封人或者设成真空狀態等，採用提高氣密性之構造也可。本透光性板1具有提高對裝置内部之零件之接觸保護或耐候性之功能’但是依據使用條件，藉著本發光裝置之基本功能之實現，也可未必安裝。又，藉著在構造上在筐體2之開口部使用透鏡系27，可任意的改變配光。透鏡用耐光性佳之光學破璃或石夕材料構成’按照目的將透鏡形狀改成凸型或凹型而成（圖係使得 2148-6713-PF 15 1253189 光某種程度的集中於裝置前面中央的）。又，在基板支撐板5上，例如藉著設置高反射率之擴放反射性遮罩2 8，可消除自發光面侧看時LED元件丨2之光源之影像，而且也可減弱擴散反射性遮罩28本身之影像。此外’在圖1、圖6、圖7，將筐體2之凹部之形狀設為彎曲形，但是例如係凹部底面變成平面之形狀也可，本兔光裝置之功能不會因凹部之形狀而消失。例如，在圖34 表不將凹部底面及側面設為平面之情況，在圖3 5表示將凹 _ 口P之σ卩分底面设為平面、將侧面設成彎曲形之情況之構造圖。反射面2a係拋物面較好，但是將拋物面之至少部分之抛物面改成和该拋物面大致近似之平面也可，可提高加工性。又，在上述以單獨之構件說明了基板支撐板，但是也可採用基板支撐板和導熱性之筐體2 一體之構造，或者和圖7之在反射面下所設置之金屬板等一體之構造，和單獨❿ 零件構造時一樣的保持散熱性功能。實施例2 圖8係表不本發明之實施例2之發光裝置之剖面圖（圖 9之B剖面），圖9係發光裝置之上視圖。在圖8、圖9 ’對於和實施例1之圖1相同或相當之部分賦與相同之符號，省略說明。在產體2之開口部邊緣部之相向之兩邊將高導熱性構 2148-6713-PF 16 1253189 件40安裝成使侧面朝向凹部之底部之反射面2a2並傾斜成向内側突出。底部之反射面2a2係平面，形成安裝高導熱性構件40之相向之側面2a3，使得自底部之反射面2a2向開口部朝外侧擴大，形成其他之相向之側面2a4，使得和底部之反射面2a2垂直。而，在高導熱性構件40之内面側安裝LED組裝基板 4，使LED元件之發光面朝向凹部底面之反射面2a2。在本構造，以自LED組裝基板4之LED元件12發出之光為激發光，用設於筐體2内側之反射面2a之波長變換部3變換波長後發光之第二光經由透光性板1發射。此時，自LED元件12產生之熱經由LED組裝基板4、基板支撐板5、咼導熱性構件4 0以及散熱片2 4散熱。如上述所示，在筐體2開口邊緣部内側使内側面朝向凹部底面之反射面2a2所安裝之高導熱性構件4〇，因使 LED元件12之發光面朝向底部之反射面2a2的安裝LED 組裝基板4，可使得自透光性板1之表側無法直接看到led 元件12之光源之影像，又，波長變換部3採用和實施例工一樣之構造，可得到白色發光。又’可k 1¾ L E D組裝基板4之散熱性，可防止l e D 元件1 2本身之發光效率降低、壽命變短。此外，在本實施例，LED組裝基板4位於筐體2之開口部之邊緣部之相向之兩邊，但是如圖1 〇所示，使得設於四邊也可。又，將筐體2之凹部底面形狀設為平面，但是例如設為彎曲狀也可，因而不影響發光功能。在圖36表示 2148-6713-PF 17 1253189 本情況之側視圖。又，筐體2之凹部設為在上視圖四邊形，但是設為圓形也可。又，如圖11(圖12之剖面圖B)、圖ι2所示，在高導熱性構件40之背面設置高導熱性構件40 ’使得還得到散熱效果也可。又，在本實施例，在筐體2之開口邊緣部安裝支撐組裝基板4之高導熱性構件40,但是替代安裝高導熱性構件40之部分，用高導熱性構件構成至少本部分也可。又’採用該基板支撐板和導熱性之筐體—體之構造也可，在此情況，和單獨零件構造時一樣的保持散熱性功ζ。實施例3 圖1 3係表示本發明之實以疋灰置之剖面圖 (圖14之Β剖面），圖14係發光裝置之上視圖。在圖圖14’對於和實施合"之目"目同或相當之”賦；相同之符號’省略說明。蓳體2之凹部之反射面2&由中央部芏士技地如 I緣部2al和沿者本棱線邛2al在兩側具有谷部之管狀 ^ ^ ^ 個拋物面狀之反射面2a2構成，在和稜線部2al平 ^ 订的向之兩側面2a3 女衣ED、、且衣基板4，使LED元件12之|止反射面2a2。毛先面各自朝向散熱性構件。又，在光取出側之筐體片4夸散反射性遮…置成向内侧突=邊緣部將您传無法直接看2148-6713-PF 14 1253189 When the material is formed with a highly reflective portion, the same effect is obtained. Further, the portion of the p-wavelength converting portion 3 may be formed by plating or plating on the casing 2 or the casing-like material. 9 or 'metal vapor deposition or gold, the wavelength conversion portion of the light-emitting device directly applies the high-reflectivity material mixed with the fluoranthene in the wavelength conversion unit 3 to form at least a wavelength, which is described by A light-emitting device with high luminous efficiency. The arrangement portion can be obtained by the light transmission of the region on the inner side of the inner surface of the reflector 1 of the reflective LED element 12, and the wavelength is further divided. The filter light/steaming material = the light emitted from the LED element 12 directly emits light to the outside, and the second component which contributes to the light emission from the wavelength converting portion 3 can improve the presence or absence of the light transmitting and reflecting portion 26 of the LED. By the use of the profit == plate 1 to completely plug the surface, and then to seal the inside of the body 2 or to set a vacuum state, etc., it is also possible to adopt a structure that improves airtightness. The light-transmitting sheet 1 has a function of improving the contact protection or weather resistance of the components inside the apparatus. However, depending on the conditions of use, the basic functions of the light-emitting device may not be installed. Further, by using the lens system 27 in the opening portion of the casing 2 in the structure, the light distribution can be arbitrarily changed. The lens is made of optical glass or stone material with good light resistance. 'The lens shape is changed to a convex shape or a concave shape according to the purpose. (The figure makes 2148-6713-PF 15 1253189 light concentrate to the center of the front of the device to some extent) . Further, on the substrate supporting plate 5, for example, by providing a highly reflective diffusing reflective mask 2 8, the image of the light source of the LED element 丨2 when viewed from the side of the light emitting surface can be eliminated, and the diffuse reflection property can be weakened. The image of the mask 28 itself. In addition, in FIGS. 1, 6, and 7, the shape of the concave portion of the casing 2 is curved, but for example, the bottom surface of the concave portion may be a flat shape, and the function of the rabbit optical device is not due to the shape of the concave portion. disappear. For example, in Fig. 34, the bottom surface and the side surface of the concave portion are not shown as a flat surface, and Fig. 35 shows a structural view in which the bottom surface of the concave portion P is divided into a flat surface and the side surface is curved. The reflecting surface 2a is preferably a paraboloid, but it is also possible to change at least a portion of the paraboloid of the paraboloid to a plane substantially similar to the paraboloid, and the workability can be improved. Further, although the substrate supporting plate has been described as a separate member, the substrate supporting plate and the thermally conductive casing 2 may be integrally formed or integrated with the metal plate provided under the reflecting surface of Fig. 7 or the like. The same heat dissipation function as when the part is constructed separately. Embodiment 2 Fig. 8 is a cross-sectional view showing a light-emitting device according to Embodiment 2 of the present invention (B-section in Fig. 9), and Figure 9 is a top view of the light-emitting device. The same or equivalent portions as those in Fig. 1 of Fig. 1 are denoted by the same reference numerals, and their description is omitted. The highly thermally conductive member 2148-6713-PF 16 1253189 member 40 is attached to the opposite sides of the opening portion edge portion of the product body 2 so that the side surface faces the reflection surface 2a2 at the bottom of the concave portion and is inclined to protrude inward. The bottom reflecting surface 2a2 is a flat surface, and the opposite side surface 2a3 of the high thermal conductive member 40 is formed so that the reflecting surface 2a2 from the bottom is expanded outward toward the opening to form other opposite side faces 2a4 so that the reflecting surface 2a2 at the bottom and the bottom vertical. On the inner surface side of the high thermal conductive member 40, the LED assembly substrate 4 is mounted so that the light emitting surface of the LED element faces the reflecting surface 2a2 of the bottom surface of the concave portion. In the present configuration, the light emitted from the LED element 12 of the LED assembly substrate 4 is the excitation light, and the second light that has been converted into a wavelength by the wavelength conversion unit 3 provided on the reflection surface 2a inside the casing 2 passes through the translucent plate. 1 launch. At this time, the heat generated from the LED element 12 is radiated through the LED assembly substrate 4, the substrate supporting plate 5, the thermal conductive member 40, and the heat sink 24. As described above, the high thermal conductive member 4A having the inner side surface facing the reflecting surface 2a2 of the bottom surface of the concave portion inside the opening edge portion of the casing 2 is mounted with the LED having the light emitting surface of the LED element 12 facing the bottom reflecting surface 2a2 When the substrate 4 is assembled, the image of the light source of the LED element 12 cannot be directly seen from the front side of the light-transmitting plate 1, and the wavelength conversion portion 3 has the same structure as that of the embodiment, and white light emission can be obtained. Further, the heat dissipation property of the substrate 4 can be prevented, and the luminous efficiency of the l e D element 1 itself can be prevented from being lowered and the lifetime can be shortened. Further, in the present embodiment, the LED assembly substrate 4 is located on the opposite sides of the edge portion of the opening portion of the casing 2, but it may be provided on four sides as shown in Fig. 1A. Further, the shape of the bottom surface of the recessed portion of the casing 2 is a flat surface. However, for example, it may be curved, and thus the light-emitting function is not affected. Fig. 36 shows a side view of the case 2148-6713-PF 17 1253189. Further, the concave portion of the casing 2 is formed in a quadrangular shape in a top view, but may be a circular shape. Further, as shown in Fig. 11 (cross-sectional view B of Fig. 12) and Fig. 2, the highly thermally conductive member 40' is provided on the back surface of the high heat conductive member 40 so that a heat dissipation effect can be obtained. Further, in the present embodiment, the highly thermally conductive member 40 for supporting the assembled substrate 4 is attached to the opening edge portion of the casing 2. However, instead of the portion to which the highly thermally conductive member 40 is attached, at least the portion may be formed of a highly thermally conductive member. Further, the structure of the substrate supporting plate and the heat-conductive casing may be employed, and in this case, the heat dissipation function is maintained as in the case of the separate component construction. Embodiment 3 Fig. 1 shows a cross-sectional view of the present invention (a cross section of Fig. 14), and Fig. 14 is a top view of the light-emitting device. In the figure of FIG. 14', the same thing as or equivalent to the "the same thing" is used; the same symbol 'omits the description. The reflective surface 2& of the concave part of the body 2 is made by the central part of the gentleman's skill The portion 2al and the edge ridge 2a are formed by a tubular reflecting surface 2a2 having a valley portion on both sides, and the two sides 2a3 of the ridge portion 2al are aligned, and The cover substrate 4 is such that the anti-reflection surface 2a2 of the LED element 12 faces each other toward the heat dissipating member. Further, the housing sheet 4 on the light extraction side is exaggerated and reflectively placed. You can't see it directly

2148-6713-PF 18 !2531892148-6713-PF 18 !253189

Led元件12之光源之影像。在本構造，以自LED組裝基板4之LED元件12發出之光為激發光，用設於筐體2内側之反射面2a2之波長變換部3變換波長後發光之第二光（白色光）經由透光性板^ 發射。此時，自LED元件12產生之熱經由；lED組裝基板 4、筐體2之側面2a3以及散熱片24散熱。如上述所示，筐體2之凹部之反射面2a由中央部之稜線部2al和沿著本稜線部2al在兩側具有谷部之管狀之2An image of the light source of the Led element 12. In the present configuration, the light emitted from the LED element 12 of the LED assembly substrate 4 is the excitation light, and the second light (white light) that has been converted by the wavelength conversion unit 3 provided on the reflection surface 2a2 inside the casing 2 Translucent plate ^ emits. At this time, heat generated from the LED element 12 is radiated through the lED assembly substrate 4, the side surface 2a3 of the casing 2, and the heat sink 24. As described above, the reflecting surface 2a of the concave portion of the casing 2 is formed by the ridge portion 2a1 at the center portion and the tubular portion having the valley portion on both sides along the ridge portion 2al.

個拋物面狀之反射面2a2構成，在和稜線部2以平行的向之兩側面2a3安裝LED組裝基板4，使LED元件12之發光面各自朝向反射面2a2,因在兩側面2a3安裝散熱片24X，自LED元件12產生之熱經由筐體2之側面之散熱片μ向空氣中散熱’可使LED元件12保持高的發光效率，而且可延長LED元件12之壽命。，因在開口面之邊緣部設置擴散反射性遮罩28，，消除自發光面侧看日夺LED元件12之光源之影像。The parabolic reflecting surface 2a2 is configured such that the LED assembly substrate 4 is mounted on both side faces 2a3 parallel to the ridge portion 2 such that the light emitting surfaces of the LED elements 12 face the reflecting surface 2a2, and the heat sink 24X is mounted on both side faces 2a3. The heat generated from the LED element 12 is dissipated into the air via the fins μ on the side of the casing 2, so that the LED element 12 can maintain high luminous efficiency, and the life of the LED element 12 can be extended. By providing the diffuse reflective mask 28 at the edge of the opening surface, the image of the light source of the LED element 12 is removed from the side of the light-emitting surface.

此外’不安裝散熱片24,用高導熱性構 !:ED組裝基板4之僅體2之凹部之兩側面2a3也可，，女I散熱片24，更可提高散熱效果也可。又，如圖15(圖16B剖面） J圖6所不，在筐體2之凹口P之兩側面2a3之安裝LED組 r , ^ ^ L 衣基板4之部分設置大小和、、’且衣基板4相同之開口部，生部不會漏光而且LEDpAi “上使仔自該筐體凹們μ妓牡板4經由開口部和空氣直接接觸，使散熱特性良好也可。安 ^ 猎者在LED組裝基板4Further, the heat sinks 24 are not mounted, and the two side faces 2a3 of the recesses of the body 2 of the substrate 4 can be assembled by the ED assembly: ED, and the female I heat sink 24 can further improve the heat dissipation effect. Further, as shown in Fig. 15 (Fig. 16B), Fig. 6 does not, the LED group r is mounted on both side faces 2a3 of the recess P of the casing 2, and the size of the casing substrate 4 is set to be In the same opening portion of the substrate 4, the green portion does not leak light, and the LEDpAi "directly allows the baby to be directly contacted with the air through the opening portion of the housing, so that the heat dissipation characteristics are good." Assembling the substrate 4

2148-6713-PF 19 1253189 之背面設置散熱片24，可更提高散熱特性。又藉著在構&上使圖1 3之設置波長變換部3之筐體凹部之稜線部2al位於LED元件]2夕古紅山，㈤,。士广The heat sink 24 is provided on the back side of 2148-6713-PF 19 1253189 to improve heat dissipation characteristics. Further, the ridge line portion 2a1 of the housing concave portion of the wavelength conversion unit 3 of Fig. 13 is placed on the LED element 2, 古古红山, (5). Shi Guang

匕1干丄2之光轴中心（圖1 3中C 線）之上方向，可向波县變、施都古 J政抗又換4呵效率的照射自led元件 12發出之光’可得到高的波長變換效率。此外，在圖13 作為棱線部構成之反射面如圖37所示，係在該反射面具有平面部之構造，也可保持波長變換功能。又，如圖17、® 18所示，係筐體2之凹部為圓形，在中央口P置凸彳2a5和沿著本凸部2心之外周所形成之由圓形之拋物面構成之反射面2a2也可。藉著本構造可令提高波長變換效率及光取出效率。χ，^2之凹部之圓形係接近圓形之多角形也可。又，LED組裝基板4用散熱性之高之金屬基板或n 基板構成也可，但是考慮對筐體2之易組裝性，例如用财熱性高之如聚酿亞胺之軟性基板構成也可。此外，如圖Μ M m筐體2之背面安裝散熱片24’可提高散熱效果° 實施例4 圖19係表示本發明之實施例4之發光裝置之剖面圖 (圖20之B剖面），圖2〇係發光裝置之上視圖，圖2丨係發光裝置之剖面圖（圖2〇之a剖面）。在园9至圖21，對於和實施例^之圖1相同或相當之部分賦與相同之符號，省略說明。匡體2之凹部之反射面2a由兩侧之稜線部2al和在本匕1 The direction of the optical axis center of the dry 2 (C line in Figure 1 3) can be obtained from the wave of the county, the Shidugu J Zheng, and the 4 efficiencies of the light emitted from the LED element 12 High wavelength conversion efficiency. Further, as shown in Fig. 37, the reflecting surface formed as a ridge portion in Fig. 13 has a structure in which the reflecting surface has a flat portion, and the wavelength conversion function can be maintained. Further, as shown in Figs. 17 and 18, the recessed portion of the casing 2 is circular, and the central opening P is provided with a projection 2a5 and a reflection formed by a circular paraboloid formed along the outer periphery of the convex portion 2. Face 2a2 is also available. With this configuration, the wavelength conversion efficiency and the light extraction efficiency can be improved.圆形, the circle of the concave part of ^2 is also close to the polygonal shape of the circle. In addition, the LED assembly board 4 may be formed of a metal substrate or an n-substrate having a high heat dissipation property. However, in consideration of ease of assembly of the casing 2, for example, a flexible substrate such as polyacrylonitrile may be used. In addition, the heat sink 24' can be mounted on the back surface of the housing 2 to improve the heat dissipation effect. Embodiment 4 FIG. 19 is a cross-sectional view (cross section B of FIG. 20) of the light-emitting device according to Embodiment 4 of the present invention. 2 is a top view of the illuminating device, and Fig. 2 is a cross-sectional view of the illuminating device (Fig. 2A). The same or equivalent portions as those in Fig. 1 of the embodiment are denoted by the same reference numerals, and the description thereof will be omitted. The reflecting surface 2a of the concave portion of the body 2 is composed of the ridge portions 2al on both sides and

2148-6713-PF 20 1253189 稜線部2 a 1之間具有谷部之在上視圖長方形之管狀之抛物面構成之反射面2a2在複數稜線部2a 1接觸排列而成，用筐體2之側面2a3支撐各反射面2a2之稜線部2al方向之兩端部。在相向之筐體之側面2a3安裝LED組裝基板*，使得在LED組裝基板4所組裝之LED元件12之光軸通過由各抛物面構成之反射面2a2之間。在本構造，以自LED組裝基板4之LED元件12發出之光為激發光，用設於筐體2内側之各自之反射面之波長變換部3變換波長後發光之第二光經由透光性板丨發此時’自LED元件12產生之熱經由LED組|基板/、望體2之側面2a3以及散熱片24散熱。如上述所不，反射面2a由複數稜線部2a丨和沿著本稜線部2al在兩側具有谷部之管狀之複數拋物面構成之反射面W構成，因在各反射φ 2a2之各兩端之望體之侧面如使led組裝基板4之發光面各自朝向反射面W的安壯咖嶋板4’可將自咖元件12發出之光在沿著光： ::二定之！圍變換波長，因在無大的光損失之狀態在波長 U 3變換波長’可提高波長變換效率及自本發光裝之光取出效率。 &夏實施例5 面圖 22〜圖25係表示本發明之實施例$之發光^置之剖圖實施例 22、圖23以及圖24係各自重晝實施例1之圖6、 2之圖8以及實施例3之圖13之圖，圖25係表示 214 8 - 6713 -pp 1253189 圖6之波長變換部3之大小的。在圖22〜圖24，調整實施例：[之圖4所示之Led組穿基板上板13之反射孔14之反射部角度或透明性模製材^ 17之模製形狀，如圖22〜圖24所示，在構造上使自咖組裝基板4之LED元件12發出之光之配光進入自咖元件12看到之筐體2之凹部内（使圖中之與LED元件。之光軸之角度δ以内）。籍著這種構造’可向波長變換部3高效率的照射來自 LED元件12之發射光’可實現效率佳之發光裝置。此外，如圖25所不，在構造上使在筐體2之凹部之反射面2a所設置之波長變換部3之佔有部分位於㈣元件 12之發射光照射之範圍（照射角度μ。、藉著本構造，可使波長變換部3之面積變小，可減少波長變換部之費用，可使裝置變得便宜。、此日守，藉著將無波長變換部材料之反射面2a設為高反射性之狀態，可保持高發光效率。用銘等鏡面反射材料構成反射面2a也可，但是若用擴散反射性高之白色材料構成自^光面侧看難識別波長變換部3和反射面2a之邊界’可得到美觀之發光裝置。貫施例6 一 #圖26、圖28〜圖30係表示本發明之實施例6之使用發光衣置之照明器具之剖面圖⑽剖面圖），圖係圖 26、圖28〜圖30之上視圖。本貫施例係各自使用4台在實施例1〜3所示之發光裝2148-6713-PF 20 1253189 The reflecting surface 2a2 which is formed by a paraboloid of a rectangular shape having a rectangular shape in a top view between the ridge portions 2a1 is formed by being in contact with the plurality of ridge portions 2a1 and supported by the side 2a3 of the casing 2. Both ends of the ridge line portion 2al direction of each of the reflecting surfaces 2a2. The LED assembly substrate * is mounted on the side surface 2a3 of the opposing casing so that the optical axis of the LED element 12 assembled in the LED assembly substrate 4 passes between the reflecting surfaces 2a2 composed of the respective paraboloids. In the present configuration, the light emitted from the LED element 12 of the LED assembly substrate 4 is the excitation light, and the second light that emits light after the wavelength conversion unit 3 provided on each of the reflection surfaces of the inside of the casing 2 is transmitted through the light transmission. At this time, the heat generated from the LED element 12 is dissipated through the LED group|substrate/, the side surface 2a3 of the desired body 2, and the heat sink 24. As described above, the reflecting surface 2a is composed of a plurality of ridge portions 2a and a reflecting surface W composed of a plurality of tubular paraboloids having valley portions on both sides of the ridge portion 2al, and is formed at each end of each of the reflections φ 2a2. The side of the body can be such that the light-emitting surface of the LED assembly substrate 4 faces the reflective surface W, and the light emitted from the coffee element 12 can be along the light: :: two! By changing the wavelength, the wavelength conversion efficiency at the wavelength U 3 in the state of no large light loss can improve the wavelength conversion efficiency and the light extraction efficiency from the present illumination device. & Summer Example 5 FIG. 22 to FIG. 25 are cross-sectional views showing an embodiment of the present invention. FIG. 22, FIG. 23, and FIG. 24 are diagrams of FIGS. 6 and 2 of Example 1, respectively. 8 and FIG. 13 of the third embodiment, FIG. 25 shows the size of the wavelength conversion unit 3 of FIG. 6 of 214 8 - 6713 - pp 1253189. In Fig. 22 to Fig. 24, the embodiment is adjusted: [the angle of the reflection portion of the reflection hole 14 of the Led group through the substrate upper plate 13 shown in Fig. 4 or the molded shape of the transparent molding material ^ 17, as shown in Fig. 22 to Fig. As shown in Fig. 24, the light distribution of the light emitted from the LED element 12 of the coffee-packing substrate 4 is structurally entered into the concave portion of the casing 2 as seen from the coffee element 12 (the optical axis of the LED element is shown in the figure). Within the angle δ). With such a configuration, "the emitted light from the LED element 12 can be efficiently irradiated to the wavelength converting portion 3", and an efficient light-emitting device can be realized. Further, as shown in Fig. 25, the occupied portion of the wavelength converting portion 3 provided on the reflecting surface 2a of the concave portion of the casing 2 is structurally located in the range of the emitted light of the (4) element 12 (irradiation angle μ. According to this configuration, the area of the wavelength conversion unit 3 can be made small, the cost of the wavelength conversion unit can be reduced, and the apparatus can be made inexpensive. In this case, the reflection surface 2a of the material having no wavelength conversion portion is made highly reflective. In the state of the nature, it is possible to maintain the high luminous efficiency. The reflecting surface 2a may be formed of a specularly reflective material such as the name, but the wavelength conversion portion 3 and the reflecting surface 2a are difficult to recognize when viewed from the side of the light surface by the white material having high diffuse reflectivity. Fig. 26, Fig. 28 to Fig. 30 are sectional views (10) showing the lighting fixture using the illuminating garment according to the sixth embodiment of the present invention, and showing the same. Fig. 26, Fig. 28 to Fig. 30 are top views. In this embodiment, four sets of light-emitting devices shown in Embodiments 1 to 3 are used.

2148-6713-PF 22 1253189 置，作為構造最簡單之下面開放照明器具的。在圖26-圖30，在構造上在照明器具之上部包括用以將發光裝置5 1點燈之點燈裝置52，經由照明器具之電源輸入部5 3可供給點燈裝置5 2商用電源，又，經由點燈裝置52供給在發光裝置51所設置之電源輸入部[ED元件12 之點燈用電力。自中心部在四方向配置4台發光裝置5工。2148-6713-PF 22 1253189 Set, as the simplest construction of the following open lighting fixtures. In FIGS. 26-30, the lighting device 52 for lighting the lighting device 51 is electrically connected to the upper portion of the lighting fixture, and the lighting device 52 can be supplied with the lighting device 52 by the power input portion 53 of the lighting device. Moreover, the power supply input unit [the power for lighting of the ED element 12) provided in the light-emitting device 51 is supplied via the lighting device 52. Four light-emitting devices are arranged in four directions from the center.

圖26係使用實施例丨之發光裝置5丨的，在照明器具之知明為具筐體5 0直接或經由高導熱性密封等設置發光衣置5 1之用金屬等構成之高導熱性構件4〇。Fig. 26 is a view showing a high thermal conductive member 4 in which a light-emitting device 5 of the embodiment is used, and a luminaire is known to have a casing 50 directly or a metal for illuminating the garment 5 such as a high thermal seal. Hey.

在這種構造，自發光裝置51之LED產生之熱經由lED 組衣基板4、基板支撐板5以及高導熱性構件4q向照明器具筐體5 0散熱。圖28係將安裝了散熱片24之實施例i之發光裝置 I用於如、明态具的。在照明器具之發光裝置5 1之安裝部如I光4置5 1之散熱片24和空氣直接接觸般構成。In this configuration, heat generated by the LED of the self-luminous device 51 is radiated to the illuminator housing 50 via the lED assembly substrate 4, the substrate supporting plate 5, and the highly thermally conductive member 4q. Fig. 28 is a view showing a light-emitting device 1 of the embodiment i in which the heat sink 24 is mounted. In the mounting portion of the light-emitting device 51 of the lighting fixture, the heat sink 24 such as the I-light 4 is placed in direct contact with the air.

藉著這種構造，也可利用照明器具上部之對流冷卻可更提高散熱效果。圖29係在實施例2使用奘Ύ ^ 壯用衣了鬲導熱性構件40之發；衣置51的，在照明器具之昭 ^ ^ ^ 具匡體5〇直接或經由ί V ,、、、性始、封等設置發光裝置$ 1 丄之鬲導熱性構件4 0。在這種構造，自發光裝置S1 # I t /1 之LED產生之熱經由le 、、且衣基板4及高導熱性構件円W在—— 〇向照明器具筐體50散熱。圖3 0係在實施例3，替代曰代政熱片24，使用 $ 熱性構件4〇之發光裝置51的，女衣了冋、在照明器具之照明器具怎With this configuration, the convection cooling of the upper portion of the lighting fixture can also be utilized to further improve the heat dissipation effect. Figure 29 is a view showing the use of the thermal conductive member 40 in the second embodiment; the clothing 51 is provided in the lighting fixture directly or via ί V , , , , The illuminating device $1 丄鬲鬲 thermal conductivity member 40 is set. In this configuration, the heat generated by the LEDs of the self-luminous device S1 # I t /1 is dissipated to the luminaire housing 50 via the hood, the substrate 4 and the highly thermally conductive member 円W. Figure 3 is a third embodiment, in place of the 曰代政热片24, using the illuminating device 51 of the thermal component 4, the cloak of the cloak, the lighting fixture of the lighting fixture

2148-6713-PF l253l89 體50直接或經由高導·…、性送、封等言交置 2之安裝LED組#其4 予叹置么光衣置Η之筐體、、、且衣基板4之部分。在這種構造，自發光紐裝基板4及筐體2 _ 之LED產生之熱經由led 50散熱。之回導熱性構件40向照明器具筐體如上述所示，可 u J抑制LED元件12之、、西择u 1 到發光效率佳、妄a E /皿度上升，可得可〒長之照明裝置。2148-6713-PF l253l89 Body 50 directly or via high-conductivity, ..., sexual delivery, sealing, etc., the installation of LED group #4 予置么光光光光筐筐筐筐筐筐筐筐筐筐Part of it. In this configuration, the heat generated by the LEDs of the self-illuminating base substrate 4 and the housing 2_ is dissipated via the LEDs 50. As described above, the heat-conducting member 40 can suppress the LED element 12 from the west, and the light-emitting efficiency is good, and the 妄a E / the degree of the dish can be increased to obtain a long illumination. Device.

又’部分來自發本壯P Λ ^ 6 先衣置51之發射光，又其他的_邱八為用反射板56反射之杏^ 的部分先，利用其混合光可得到照明光。此¥，在提高照明效率較好，W a s 羊反射板56係高反射性材料子乂野，配合目的之昭昍 η …、途使得採用擴散面或鏡面精加工實施例7 圖38係表示本發明之實施例7之發光裝置之剖面圖 (圖39之Β剖面），圖39係發光裝置之上視圖。在圖38、圖37,對於和實施例！之圖}相同或相當之部分賦與相同之符號’省略說明。包括LED組裝基板4, '組裝和實施例 1等一樣發射短波長光之LED元件12;及筐體，在凹部具有利用LED元件之短波長光發出變換光之波長變換部3之反射面2a。在此’反射面2a由和LED組裝基板4相向的形成之抛物面構成’ LED組t基板4在構造上在筐體凹部内之— 侧面各自朝向反射面2 a的安裝L E D組震基板4之發光面。在這種筐體2内之一邊没置了 LED組裝基板4之發光掌And part of it comes from the hair of the strong P Λ ^ 6 first clothes set 51 emission light, and other _ Qiu eight is the part of the apricot ^ reflected by the reflection plate 56 First, the mixed light can be used to obtain illumination light. This ¥, in improving the lighting efficiency, W as sheep reflector 56 series highly reflective material sub-field, with the purpose of the 昍 ..., the way to use diffusion surface or mirror finishing Example 7 Figure 38 shows this A cross-sectional view of the illuminating device of the seventh embodiment of the invention (a cross section taken along line 39), and Fig. 39 is a top view of the illuminating device. In Figures 38 and 37, for and examples! The same or equivalent parts are denoted by the same reference numerals, and the description is omitted. The LED assembly board 4 is included, and the LED element 12 that emits short-wavelength light is assembled as in the first embodiment, and the housing has a reflection surface 2a of the wavelength conversion unit 3 that emits converted light by short-wavelength light of the LED element. Here, the 'reflecting surface 2a is formed by a paraboloid formed in a direction opposite to the LED assembly substrate 4'. The LED group t substrate 4 is structurally formed in the housing recess. The side surface of each of the side facing the reflecting surface 2a is illuminated by the LED group substrate 4. surface. The illuminating palm of the LED assembly substrate 4 is not disposed on one side of the casing 2.

2148-6713-PF 24 1253189 置’除了使其透光性板^朝向下側的使用以外，在如led 二：基，(散熱片24侧)變成上側般使透光性板"月向 ;:之：用方法’LED元件12產生之熱可沿著僮體向上方匕士可侍到散熱性佳、發光效率高之發光裝置。此時，藉著在反射面2a内將LED發射光之最大配光 2制❹38之最大配^之角度δ，可向波長變換部3高厂< 的h射成為波長變換部之_次激發光之LED發射光，可實現發光效率高之發光裝置。又’如圖40所示，和實施類似之表面使用鏡面或在擴散性高反射率之光反射遮罩62,也可使直接射入透光性板工之㈣發射光之比例降 :置：是可實得到發光效率佳之發光裝置。此外，光反射 k罩係、和筐體成—體之構造也可。又，凹部之反射面 2a例如如圖41所示，由和拋物面大致近似之平面構成也可’又，如圖42所示，由撤物面和平面部構成長變換功能。見/皮又’在圖43(圖44之B剖面)波長變換部3由和咖組裝基板4相向的形成之撤物面構成，在構造上在係在筐體凹部之開π邊緣部所設置之—個傾斜構件之高導熱性^ 件40朝向反射面2a的安裝LED組裝基可。…、…樣，除了使透光性板"二= 使用以外’在如LED組裝基板4變成上側般使透光性板工朝向橫向之使用方法，也可得到散熱性佳、發光效率發光裝置。 Θ 圖45係用具有厚度之高導熱性構件54構成咖組裝 2148-6713-PF 25 1253189 基板4背面之例子，可得到高散熱效果。在此，如圖45所不在構造上在光源設置侧面也配設波長變換部3也可。此外，在圖43、圖45表示反射面2a為拋物面之情況，但是將拋物面之至少部分之抱物面改成和該抛物面大致近似之平面也可，依據led組裝基板4之安裝位置，底部為平面也可，又由抱物面和平面部構成，可提高加工性。又，如圖46所示，在篋體2内部之底面之一部分設置凹部’在該凹部内配今、古具、 1門配°又波長換部3，藉著至少自lED光2148-6713-PF 24 1253189 'In addition to the use of the light-transmissive plate ^ toward the lower side, the light-transmissive plate is changed to the upper side such as the LED 2: base (the side of the heat sink 24); : The method: 'The heat generated by the LED element 12 can be used to provide a light-emitting device with good heat dissipation and high luminous efficiency along the child's body. At this time, by the maximum light distribution 2 of the LED emitted light in the reflecting surface 2a, the maximum angle δ of the ❹38 can be made to the wavelength conversion unit 3, and the h-light of the wavelength conversion unit 3 becomes the wavelength conversion unit. The light LED emits light, and a light-emitting device with high luminous efficiency can be realized. Moreover, as shown in FIG. 40, the surface of the similarly used mirror or the diffuse high reflectivity light reflecting mask 62 can also directly reduce the proportion of the emitted light of the translucent panel (4): It is a light-emitting device that can achieve good luminous efficiency. Further, the light reflection k cover and the structure in which the casing is formed may be used. Further, as shown in Fig. 41, the reflecting surface 2a of the concave portion may be formed of a plane substantially similar to the paraboloid surface. Further, as shown in Fig. 42, the object is formed by the object-removing surface and the flat surface. See Fig. 43 (B section of Fig. 44) The wavelength conversion unit 3 is formed of a relief surface formed to face the coffee assembly substrate 4, and is structurally provided at the opening π edge portion of the housing recess. The high thermal conductivity of the slanting member 40 can be mounted toward the mounting surface of the reflecting surface 2a. In addition to the use of a light-transmissive plate, the light-transmissive plate can be used to make the light-transmissive sheeter face the horizontal direction, and the light-emitting efficiency can be obtained. . Θ Fig. 45 shows an example in which the thermally conductive member 54 having a high thickness is used to constitute the back surface of the substrate 4 of the coffee maker 2148-6713-PF 25 1253189, and a high heat dissipation effect can be obtained. Here, as shown in Fig. 45, the wavelength conversion unit 3 may be disposed on the side where the light source is disposed. Although FIG. 43 and FIG. 45 show a case where the reflecting surface 2a is a paraboloid, it is also possible to change at least a part of the paraboloid of the paraboloid to a plane substantially similar to the paraboloid, depending on the mounting position of the LED assembly substrate 4, the bottom is The plane is also available, and it is composed of a hug surface and a flat surface to improve the workability. Further, as shown in Fig. 46, a recessed portion is provided in a portion of the bottom surface of the inside of the body 2, and the inside, the ancient, the 1 gate, and the wavelength changing portion 3 are provided in the recess, by at least the light from the lED.

軸透光性板1側之LED元件12之畀I 仵12之取大配光之角度s位於㈣域内之構造，也可得到發光效率高之發光裝置。此外，使配光角變窄，藉著使波長變換部區域變小，可得用上便宜之發光裝置。、又，本貫施例所示構造之發光裝置51，例如如圖47(表示器具剖面圖）所示，裝入提高本發光裝置之散㈣器具筐體50，可用作發井# f 一心…、乃、用作毛先效率-之大光束照明器具。在面方向排列複數本發光裝置衣置之長方形之照明器具之情況，也如圖所示’在構造上使裝置側面或值體背面接觸用兩導熱性材料所形成之照明器具筐體50,確保散熱性。此時，因發光裝置5 ；[自苴寬 ί…、 "的波長受換部可擴散的取出白色光，可得到減少不舒服之強光之照明器具。又’如圖48(表不器具剖面圖)所示，可用作熱性之構造配置複數發光裝置5 以 <ΛΙ σ口具，藉者在祕而縱深方向也排列複數’可得到大光束面之照明器且。圖48 係在用導熱性材料所形成之，昭、。、、月口口具匡脰50設置開口部The light-emitting device having a high luminous efficiency can also be obtained by the structure in which the angle s of the large light distribution s of the LED element 12 on the side of the shaft-transmissive plate 1 is in the (four) domain. Further, by making the light distribution angle narrow, by making the wavelength conversion portion region small, an inexpensive light-emitting device can be obtained. Further, as shown in Fig. 47 (indicated by the cross-sectional view of the device), the light-emitting device 51 having the structure shown in the present embodiment is incorporated in the device housing 50 for improving the light-emitting device, and can be used as a hair shaft #f. ..., is used as a large beam lighting fixture for the efficiency of the hair. In the case where a plurality of rectangular lighting fixtures in which the light-emitting device is placed are arranged in the plane direction, as shown in the figure, the lighting fixture housing 50 formed by contacting the side surface of the device or the back surface of the value body with the two thermally conductive materials is ensured. Heat dissipation. At this time, the light-emitting device 5; the wavelength of [self-width], " is diffused by the changing portion, and white light is removed, and a lighting device that reduces uncomfortable light can be obtained. Further, as shown in Fig. 48 (not shown in the sectional view of the apparatus), the plurality of light-emitting devices 5 can be arranged as a thermal structure, and the large-beam surface can be obtained by arranging plural numbers in the depth direction. Illuminator and. Figure 48 is formed using a thermally conductive material, Illustrated. , month mouth mouth with 匡脰 50 set opening

2148-6713-PF 1253189 5〇c後，配合的設置發光裝置之發光面（透光性板i)之例子。照明器具筐體50在前面具有前面開口部50a(照明器具之發光面表面），在底部50b具有插接發光裝置51之筐體2之發光面侧之開口部50c，形成箱形，用高反射率材料覆蓋底部5Ob之内側表面，用擴散透射板63覆蓋前面開口部 50a 。此外，自前面開口部50a在背側設置立設部50d，使照明器具筐體5〇和發光裝置5 1易導熱而且易固定。又，使照明器具筐體50之底部50b和發光裝置之透光性板1之各自之面無段差較好。在本構造’自發光裝置51發射之光透射擴散透射板 63後發射，又，擴散透射板63所反射之光被照明器具筐體50之底部50b之高反射率材料反射，透射擴散透射板 63後發射。又，自發光裝置5 1產生之熱自筐體2經由照明器具筐體50之立設部50d向照明器具筐體5〇散熱。 1 2之溫度上升，可得到發光 5 1之發射光，又其他的一部透射擴散透射板63後發射照可得到高發光效率、均句之於是，可抑制LED元件效率佳、壽命長之照明裝置。又，因部分來自發光裝置为為用反射板56反射之光，明光，可變成均勻的照明光，照明光之照明器具。在夕’藉著控制各個發光裝置之驅動電力，發光面之分割點燈。又，本禮 1工制本構k之照明器具例如也可用作2148-6713-PF 1253189 After 5〇c, an example of the light-emitting surface (translucent plate i) of the light-emitting device is provided. The luminaire casing 50 has a front opening 50a (a surface of the illuminating surface of the illuminating device) on the front surface, and an opening 50c on the side of the illuminating surface of the casing 2 in which the illuminating device 51 is inserted, and has a box shape and is highly reflective. The rate material covers the inner side surface of the bottom portion 5Ob, and the front opening portion 50a is covered with the diffusion transmission plate 63. Further, the front opening portion 50a is provided with the standing portion 50d on the back side, so that the lighting fixture housing 5 and the light-emitting device 51 are easily thermally conductive and easily fixed. Further, it is preferable that the bottom surface 50b of the luminaire casing 50 and the light-transmissive plate 1 of the illuminating device have no difference. In the present configuration, the light emitted from the self-luminous device 51 is transmitted through the diffusing transmission plate 63, and the light reflected by the diffusing transmission plate 63 is reflected by the high reflectivity material of the bottom portion 50b of the fixture housing 50, and transmitted through the diffusing transmission plate 63. After the launch. Further, the heat generated from the light-emitting device 51 is radiated from the casing 2 to the lighting fixture casing 5 via the standing portion 50d of the lighting fixture casing 50. When the temperature of 1 2 rises, the emitted light of the light-emitting 5 1 can be obtained, and the other one of the transmitted diffused transmission plates 63 can emit high illumination efficiency, and the sentence can be suppressed, thereby suppressing the illumination of the LED element with high efficiency and long life. Device. Further, a part of the light-emitting device is a lighting fixture that is a light that is reflected by the reflecting plate 56 and that is bright, and that can be converted into uniform illumination light and illumination light. In the evening, by controlling the driving power of each of the light-emitting devices, the division of the light-emitting surface is turned on. Also, this ceremony 1 work system constitutive k lighting fixtures, for example, can also be used

2148-6713-PF 27 1253189 液晶顯示裝置等之照明光源。以下，使用圖49、圖5〇以及波長變換邻]少^ 况明本發光裝置之 W圖5。之平面圖。衣置之剖面圖’圖圖49之波長變換部3以高反射率面將波長變換邱3夕主毒成/、配设部分，且古甘面形狀形成凹凸形。藉著這種構造在之^〜匡肢相對於平坦的構成波長變換部3 之^况，可確保其表面之LED照明面積寬，效率之菸氺壯罢貝見、、、口果可仔到局之表面心衣。如圖5G所示，用將波長變換部3 :面構成凹凸形，而且配合其形狀形成反…a之構 2也口在增加LED照明面積下可使勞光變換部之厚度固定’和圖49 一樣，可得到高發光效率且便宜之發光裳置。匕卜波長芰換部3之凹凸形狀例如如圖5丨（a)所示，也可設為角錐形，如圖51(b)所示，也可設為直線之三角波形。又，如圖51(c)所示，也可設為曲線之三角波形。都使反射面以之傾斜部分之間距比平面部小。圖51(c)所示的，2148-6713-PF 27 1253189 Illumination source for liquid crystal display devices, etc. Hereinafter, Fig. 49, Fig. 5A, and the wavelength conversion adjacent to each other will be described. Floor plan. Cross-sectional view of the clothing unit The wavelength conversion unit 3 of Fig. 49 multiplexes the wavelength into a high-reflectivity surface, and forms a concave portion. With this configuration, it is possible to ensure that the LED illumination area of the surface is wide with respect to the flat configuration of the wavelength conversion section 3, and the efficiency of the smoke is strong, and the mouth can be seen. The surface of the bureau. As shown in FIG. 5G, the wavelength conversion portion 3 is formed into a concavo-convex shape, and the shape of the surface is formed to be reversed, and the thickness of the light-converting portion can be fixed by increasing the LED illumination area. In the same way, a high luminous efficiency and an inexpensive luminous skirt can be obtained. The uneven shape of the wavelength changing portion 3 may be, for example, a pyramid shape as shown in Fig. 5(a), and may be a triangular wave shape as shown in Fig. 51(b). Further, as shown in FIG. 51(c), a triangular waveform of a curve may be used. The distance between the inclined portions of the reflecting surface is smaller than that of the flat portion. Figure 51 (c),

在元件12之個數少之情況，可使凹凸形狀部和LED 元件1 2之距離相等，效果好。又’本波長變換部之構造未限定為本實施例，在構造如上述實施例之波長變換部也可實施。例如’用於實施例7之圖46所示之波長變換部3等時，效果好。以上’本實施例表示發光裝置5 1和使用該裝置之照明器具’但是在實施例6所示之照明器具使用本實施例所示 2148-6713-PF 28 1253189 之發光裝置5 1也可得到一樣之結果。發明之效果本發明包括筐體’具有在凹部設置了利用咖短波長光發射變換光之波長變換部之反射面；丨導埶 LED基板支撐板，立設於本M體之凹部底面之中央部、在該基板支撐板之兩面安裝組裝了 LED元件之咖:二When the number of the elements 12 is small, the distance between the uneven portion and the LED element 12 can be made equal, and the effect is good. Further, the configuration of the present wavelength converting portion is not limited to the present embodiment, and the configuration may be carried out as in the wavelength converting portion of the above-described embodiment. For example, when used in the wavelength conversion unit 3 shown in Fig. 46 of the seventh embodiment, the effect is good. The above embodiment shows the light-emitting device 51 and the lighting fixture using the same. However, the lighting fixture shown in the embodiment 6 can also be obtained by using the light-emitting device 5 1 of 2148-6713-PF 28 1253189 shown in this embodiment. The result. Advantageous Effects of Invention The present invention includes a housing having a reflecting surface having a wavelength converting portion that emits light by a short-wavelength light emission in a concave portion, and an LED substrate supporting plate that is erected at a central portion of a bottom surface of the concave portion of the M body. Installing the LED component on both sides of the substrate support plate:

板，使用複數I^ED元件I 、、、衣I 兀仵毛先效率也不會降低，又，散熱優異’自發光面之光取屮对遂古 y曰 …、出效率冋’可仔到壽命長之發光裝置及照明器具。【圖式簡單說明】圖1係表示本發明之實施例1之發光裝置之剖面圖。圖2係圖1之上視圖。圖3係表不本發明之實施例1之發光裝置之LED組裝基板之上視圖。圖4係表示本發明之實施例丨之發光裝置之組裝基板之剖面圖。圖5係表示本發明之實施例丨之發光裝置之波長變換材料之構造說明圖。 1之發光裝置之剖面圖。 1之發光裝置之剖面圖。 2之發光裝置之剖面圖。圖6係表示本發明之實施例圖7係表示本發明之實施例圖8係表示本發明之實施例圖9係圖8之上視圖。 2148-6713-pp 29 1253189 圖1 0係表示本發明之實施例2之發光裝置之上視圖。圖n係表示本發明之實施例2之發光裝置之剖面圖。圖12係圖11之上視圖。圖1 3係表示本發明之實施例3之發光裝置之剖面圖。圖丨4係圖13之上視圖。圖丨5係表示本發明之實施例3之發光裝置之剖面圖。圖16係圖15之上視圖。Plate, the use of complex I ^ ED components I,, clothing I 兀仵先 first efficiency will not be reduced, but also excellent heat dissipation 'self-luminous surface light 屮屮遂曰、、、、、、、、、、、、、、、、可Long-life lighting devices and lighting fixtures. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a light-emitting device according to a first embodiment of the present invention. Figure 2 is a top view of Figure 1. Fig. 3 is a top view showing the LED assembly substrate of the light-emitting device of the first embodiment of the present invention. Fig. 4 is a cross-sectional view showing an assembled substrate of a light-emitting device according to an embodiment of the present invention. Fig. 5 is a structural explanatory view showing a wavelength conversion material of a light-emitting device of an embodiment of the present invention. A cross-sectional view of a light-emitting device of 1. A cross-sectional view of a light-emitting device of 1. 2 is a cross-sectional view of the illuminating device. Fig. 6 is a view showing an embodiment of the present invention. Fig. 8 is a view showing an embodiment of the present invention. Fig. 8 is a view showing an embodiment of the present invention. Fig. 9 is a top view of Fig. 8. 2148-6713-pp 29 1253189 Fig. 10 is a top view showing a light-emitting device of Embodiment 2 of the present invention. Figure n is a cross-sectional view showing a light-emitting device according to a second embodiment of the present invention. Figure 12 is a top view of Figure 11. Fig. 1 is a cross-sectional view showing a light-emitting device of a third embodiment of the present invention. Figure 4 is a top view of Figure 13. Figure 5 is a cross-sectional view showing a light-emitting device of Example 3 of the present invention. Figure 16 is a top view of Figure 15.

圖17係表示本發明之實施例3之發光裝置之剖面圖。圖1 8係圖17之上視圖。圖丨9係表示本發明之實施例4之發光裝置之剖面圖。圖2〇係圖19之上視圖。 4之發光裝置之剖面圖 5之發光裝置之剖面圖 5之發光裝置之剖面圖 5之發光裝置之剖面圖 5之發光裝置之剖面圖 6之照明器具之剖面圖 6之照明器具之剖面圖 6之知、明器具之剖面圖 6之照明器具之剖面圖 1之發光裝置之基板支:Figure 17 is a cross-sectional view showing a light-emitting device according to a third embodiment of the present invention. Figure 18 is a top view of Figure 17. Figure 9 is a cross-sectional view showing a light-emitting device of Example 4 of the present invention. Figure 2 is a top view of Figure 19. 4 is a cross-section of the illuminating device, a cross-sectional view of the illuminating device, a cross-sectional view of the illuminating device, a cross-sectional view of the illuminating device, a cross-sectional view of the illuminating device, a cross-sectional view of the illuminating device, a cross-sectional view of the lighting device, and a cross-sectional view of the lighting device. Section of the illuminating device of Fig. 1 of the section of the illuminating device of Fig. 1

圖21係表示本發明之實施例圖22係表示本發明之實施例圖23係表示本發明之實施例圖24係表示本發明之實施例圖25係表示本發明之實施例圖26係表示本發明之實施例圖2?係圖26之上視圖。圖2 8係表示本發明之實施例圖29係表示本發明之實施例圖3 0係表示本發明之實施例圖3 1係表示本發明之實施例板之一構造例之剖面圖。圖32係表示本發明之實施例}之發光裝置之基板支撐 2148-6713-PF 30 1253189 板之一構造例之剖面圖。圖3 3係表示本發明之實施例1之波長變換部之一構造例之圖。圖34係表示本發明之實施例1之發光裝置之剖面圖。圖35係表示本發明之實施例1之發光裝置之剖面圖。圖36係表示本發明之實施例2之發光裝置之剖面圖。圖37係表示本發明之實施例3之發光裝置之剖面圖。圖3 8係表示本發明之實施例7之發光裝置之剖面圖。圖39係表示本發明之實施例7之發光裝置之上視圖。圖40係表示本發明之實施例7之發光裝置之剖面圖。圖4 1係表示本發明之實施例7之發光裝置之剖面圖。圖42係表示本發明之實施例7之發光裝置之剖面圖。圖43係表示本發明之實施例7之發光裝置之剖面圖。圖44係表示本發明之實施例7之發光裝置之上視圖。圖45係表示本發明之實施例7之發光裝置之剖面圖。圖46係表示本發明之實施例7之發光裝置之剖面圖。圖47係使用本發明之實施例7之發光裝置之照明器具之剖面圖。圖48係使用本發明之實施例7之發光裝置之照明器具之剖面圖。圖49係表示本發明之實施例7之發光裝置之剖面圖。圖50係表示本發明之實施例7之發光裝置之剖面圖。圖51(a)〜（c)係圖49、圖50之平面圖。 2148-6713-PF 31 1253189 【主要元件符號說明】 1 透光性板、 2 筐體、 2a、 > 2a2 反射面、 2al 稜線部、 2a3 、2a4 側面、 3 波長變換部、 4 LED 組裝基板、 5 基板支撐板、 12 LED元件、 24 散熱片、 40 高導熱性構件 50 照明器具筐體 51 發光裝置、 60 螢光物、 61 黏合劑、 62 光反射遮罩、 63 擴散透射板。Fig. 21 is a view showing an embodiment of the present invention. Fig. 22 is a view showing an embodiment of the present invention. Fig. 23 is a view showing an embodiment of the present invention. Fig. 25 is a view showing an embodiment of the present invention. Fig. 26 is a view showing an embodiment of the present invention. Embodiments of the Invention Figure 2 is a top view of Figure 26. Fig. 2 is a view showing an embodiment of the present invention. Fig. 29 is a view showing an embodiment of the present invention. Fig. 3 is a cross-sectional view showing a structural example of an embodiment of the present invention. Figure 32 is a cross-sectional view showing a structural example of a substrate supporting 2148-6713-PF 30 1253189 plate of a light-emitting device according to an embodiment of the present invention. Fig. 3 is a view showing an example of the structure of a wavelength conversion unit according to the first embodiment of the present invention. Figure 34 is a cross-sectional view showing a light-emitting device according to Embodiment 1 of the present invention. Figure 35 is a cross-sectional view showing a light-emitting device according to Embodiment 1 of the present invention. Figure 36 is a cross-sectional view showing a light-emitting device according to a second embodiment of the present invention. Figure 37 is a cross-sectional view showing a light-emitting device according to a third embodiment of the present invention. Figure 3 is a cross-sectional view showing a light-emitting device of Embodiment 7 of the present invention. Figure 39 is a top plan view showing a light-emitting device of Embodiment 7 of the present invention. Figure 40 is a cross-sectional view showing a light-emitting device of Embodiment 7 of the present invention. Figure 4 is a cross-sectional view showing a light-emitting device of Embodiment 7 of the present invention. Figure 42 is a cross-sectional view showing a light-emitting device of Embodiment 7 of the present invention. Figure 43 is a cross-sectional view showing a light-emitting device of Embodiment 7 of the present invention. Figure 44 is a top view showing a light-emitting device of Embodiment 7 of the present invention. Figure 45 is a cross-sectional view showing a light-emitting device of Embodiment 7 of the present invention. Figure 46 is a cross-sectional view showing a light-emitting device of Embodiment 7 of the present invention. Figure 47 is a cross-sectional view showing a lighting fixture using the light-emitting device of Embodiment 7 of the present invention. Figure 48 is a cross-sectional view showing a lighting fixture using the light-emitting device of Embodiment 7 of the present invention. Figure 49 is a cross-sectional view showing a light-emitting device of Embodiment 7 of the present invention. Figure 50 is a cross-sectional view showing a light-emitting device of Embodiment 7 of the present invention. 51(a) to (c) are plan views of Figs. 49 and 50. 2148-6713-PF 31 1253189 [Description of main components] 1 Translucent plate, 2 housings, 2a, > 2a2 reflecting surface, 2al ridge line, 2a3, 2a4 side, 3 wavelength conversion unit, 4 LED assembly board, 5 substrate support plate, 12 LED components, 24 heat sinks, 40 high thermal conductivity members 50 luminaire housing 51 illuminator, 60 phosphors, 61 adhesive, 62 light reflective mask, 63 diffuse transmission plate.

2148-6713-PF2148-6713-PF

Claims

1253189 十、申請專利範圍： 1 · 一種發光裝置，包括：複數LED組裝基板，組裝發射短波長光之LED元件；筐體，具有在凹部設置了利用LED元件之短波長光發射變換光之波長變換部之反射面；以及導熱性之LED基板支撐板，立設於該筐體之凹部底面之中央部；其特徵在於：該反射面由在該LED基板支撐板之該立設部之兩侧所形成之拋物面構成；在LED基板支撐板之兩面使該LED元件之發光面各自朝向該反射面的安裝該LED組裝基板。 2.—種發光裝置，包括：複數LED組裝基板，組裝發射短波長光之LED元件；筐體’具有在凹部設置了利用LED元件之短波長光發射變換光之波長變換部之反射面；以及 L E D基板支撐板，在該筐體之開口邊緣部内側使内侧面朝向該凹部底面的設置；其特徵在於：在該LED基板支撐板使該LED元件之發光面朝向該反射面之該凹部底面的安裝該LED組裝基板。 3 · —種發光裝置，包括：複數LED組裝基板，組裝發射短波長光之LED元件；及 2148-6713-PF 33 1253189 匡月丑，具有在凹部設置了利用led元件之短波長光發射變換光之波長變換部之反射面. 其特徵在於：、該反射面由中央部之稜線部和沿著本稜線部在兩側具有谷部之管形之拋物面構成；在和該稜線部相向之筐體之兩側面使該LED元件之發光面各自朝向該反射面的安裳該LED組裝基板。 4.一種發光裝置，包括：複數㈣組裝基板，組裝發射短波長光之LED元件；及匡體，具有反射面，在凹部設置利用該LED元件之該短波長光叙射.交換光之波長變換部，由中央部之凸部及沿著該凸部之外周所形成之大致圓形之拋物面構成；〇其特徵在於：在包圍該凸部之筐體之側面使該LED元件之發光面各自朝向该反射面的安裝該LED組裝基板。 5·如申請專利範圍第3項之發光裝置，其中，該反射面之k線邛或凸部之頂點位於比該元件之光轴靠近該筐體之開口面侧。 6·如申請專利範圍第4項之發光裝置，其中，該反射面之稜線部或凸部之頂點位於比該LED元件之光軸靠近該筐體之開口面側。 7.一種發光裝置，包括：複數LED組裝基板，組裝發射短波長光之led元件； 2148-6713-PF 34 1253189 及 &貧體具有在凹部設置了利用LED元件之短波長光發射變換光之波長變換部之反射面· 其特徵在於： /反射面由複數稜線部和沿著本稜線部在兩側具有谷部之管形之複數拋物面構成； /在忒各拋物面之各兩端之筐體之側面使該led元件之 ^光面各自朝向该反射面的安裝該LED組裝基板。 8·一種發光裝置，包括：複數LED組裝基板，組裝發射短波長光之_元件，· 及 ▲筐體’具有在凹部設置了利用LED元件之短波長光發射’k換光之波長變換部之反射面；其特徵在於：該反射面由和該LED組裝基板相向的形成之拋物面構成，在5又置於該筐體凹部内之一側面或該筐體凹部之開口邊緣部之一邊之傾斜構件使該L E D元件之發光面朝向該反射面的安裝該LED組裝基板。 9.如申請專利範圍第丨、3至7項中任一項之發光裝置，其中，將構成該反射面之拋物面之至少部分之拋物面替換成和該抛物面近似之平面。 1 0 ·如申凊專利範圍第丨至8項中任一項之發光裝置，其中，將至少安裝該LED組裝基板之該筐體之部分設為導熱性材料。 2148-6713-PF 1253189 11 ·如申請專利範圍第1至8項中任一項之發光裝置，其中’在安裝該LED組裝基板之該筐體之背面安裝散熱片。 1 2.如申請專利範圍第1至8項中任一項之發光裝置，其中’來自該LED元件之發射光之配光角度係如該發射光進入相向之反射面内般照射之角度。 1 3.如申請專利範圍第1至8項中任一項之發光裝置，其中’只在來自LED元件之發射光照射之反射面之部分設置波長變換材料，在該發射光不照射之反射面之部分設置反射性材料。 14.如申睛專利範圍第1至8項中任一項之發光裝置，其中，包括LED發光光反射部，在該透光性板之至少一面反射該短波長光之一部分或全部之波長之光，透射的取出利用該波長變換部變換之變換光之中包含部分或全部之波長之光。 15·如申請專利範圍第1至8項中任一項之發光裝置， /、中D亥反射面之至少配設該波長變換部之表面用對於該 LED元件發射之短波長光及波長變換後之光高反射率之材料形成。 1 6·如申請專利範圍第1至8項中任一項之發光裝置，其中，在該反射面之至少配設該波長變換部之表面配設至少對於該LED元件發射之短波長光及波長變換後之光高反射率之反射片。 1 7·如申請專利範圍第1至8項中任一項之發光裝置，其中，該波長變換部構成材料係在透光性且具有形狀柔軟 2148-6713-PF 36 1253189 性之樹脂混入了螢光物之片狀材料。申明專利1&圍第1至8項中任一項之發光裝置，其中，該波長變換部之表面形成凹凸形。 19·如申請專利範圍第…項中任一項之發光裝置，具中，該LED组梦其知；+士、土板之表面用對於該LED元件發射之短二：光及利用波長變換部波長變換後之光高反射率之材料形成。 ▲ _明專利乾圍第1至8項中任一項之發光裝置，、。亥LED組裝基板利用高導熱性材料構成。 2丨如申請專利範圍第丨至8項中任一項之發光裝置，其中，該短波長光係紫色或藍紫色。 ^::㈣具，其特徵在於:在照明器具使… '專利耗圍弟1至8項中任-項之發光裝置。 23_如申印專利範圍第22項之照明器具，复听器具之僮體由導熱性材料構成，使該發光裝置：:：熱性構件之至少一部分和該照明器具之該望體_之導 24.如申請專利範圍帛23項之照明器具 =，之匡體形成在前面具有前面開口部、在底部插接ς 叙光裝置之該筐體之發光面側之開口部之箱形，/ζ 表面由高反射率材料構成，用擴散透射板覆蓋該前面二之部。 ⑴囬開D 2148-6713-ΡΡ 371253189 X. Patent application scope: 1 · A light-emitting device comprising: a plurality of LED assembly substrates, assembling LED elements emitting short-wavelength light; and a housing having wavelength conversion of short-wavelength light-emitting conversion light using LED elements in the concave portion a reflective surface of the portion; and a thermally conductive LED substrate support plate erected at a central portion of the bottom surface of the recess of the housing; wherein the reflective surface is provided on both sides of the erect portion of the LED substrate support plate The paraboloid formed is formed; and the LED assembly substrate is mounted on each of the light-emitting surfaces of the LED elements on the both sides of the LED substrate support plate toward the reflective surface. 2. A light-emitting device comprising: a plurality of LED assembly substrates for assembling an LED element that emits short-wavelength light; and a housing having a reflection surface having a wavelength conversion portion that converts light by short-wavelength light emission using an LED element; The LED substrate supporting plate has an inner side surface facing the bottom surface of the concave portion on the inner side of the opening edge portion of the casing; wherein the LED substrate supporting plate faces the light emitting surface of the LED element toward the bottom surface of the concave portion of the reflecting surface Install the LED assembly substrate. 3 · A kind of illuminating device, comprising: a plurality of LED assembly substrates, assembling LED elements emitting short-wavelength light; and 2148-6713-PF 33 1253189 匡月 ugly, having short-wavelength light-emitting conversion light using a led element in a concave portion The reflecting surface of the wavelength converting portion is characterized in that: the reflecting surface is composed of a ridge line portion at the center portion and a tubular parabola having a valley portion on both sides along the ridge line portion; and a housing facing the ridge portion The two sides of the LED element respectively face the light-emitting surface of the LED element toward the reflective surface of the LED assembly substrate. A light-emitting device comprising: a plurality (four) assembled substrate, an LED component that emits short-wavelength light; and a body having a reflecting surface, wherein the short-wavelength light of the LED element is used in the concave portion to convert the wavelength of the exchanged light a portion formed by a convex portion of the central portion and a substantially circular paraboloid formed along the outer periphery of the convex portion; wherein the light emitting surface of the LED element is oriented on a side surface of the casing surrounding the convex portion The LED assembly substrate is mounted on the reflective surface. 5. The illuminating device of claim 3, wherein the apex of the k-line or convex portion of the reflecting surface is located closer to the opening surface side of the housing than the optical axis of the element. 6. The light-emitting device of claim 4, wherein an apex of the ridge portion or the convex portion of the reflecting surface is located closer to an opening surface side of the housing than an optical axis of the LED element. A light-emitting device comprising: a plurality of LED assembly substrates, which assembles a led element that emits short-wavelength light; 2148-6713-PF 34 1253189 and a poor body having a short-wavelength light-emitting conversion light using an LED element in a recess The reflecting surface of the wavelength converting portion is characterized in that: / the reflecting surface is composed of a plurality of ridge lines and a plurality of paraboloids having a tubular shape having valley portions on both sides along the ridge portion; / a housing at each end of each of the paraboloids The LED assembly substrate is mounted on the side of the light-emitting surface of the LED element facing the reflective surface. 8. A light-emitting device comprising: a plurality of LED assembly substrates, an assembly unit for emitting short-wavelength light, and a housing ′ having a wavelength conversion portion in which a short-wavelength light emission of the LED element is used to transmit light at the recess a reflecting surface; the reflecting surface is formed by a paraboloid formed opposite to the LED assembly substrate, and the inclined member is placed on one side of the recess of the housing or one of the opening edge portions of the recess of the housing The LED assembly substrate is mounted on the light-emitting surface of the LED element facing the reflective surface. 9. The illuminating device of any of claims 3 to 7, wherein the paraboloid of at least a portion of the paraboloid constituting the reflecting surface is replaced by a plane similar to the paraboloid. The light-emitting device according to any one of the items of the present invention, wherein at least the portion of the casing to which the LED assembly substrate is mounted is made of a heat-conductive material. The light-emitting device according to any one of claims 1 to 8, wherein the heat sink is mounted on the back surface of the casing on which the LED assembly substrate is mounted. The illuminating device of any one of claims 1 to 8, wherein the light distribution angle of the emitted light from the LED element is an angle of illumination as the emitted light enters the opposite reflecting surface. 1. The light-emitting device according to any one of claims 1 to 8, wherein the wavelength conversion material is disposed only in a portion of the reflection surface from which the emitted light is emitted from the LED element, and the reflection surface on which the emitted light is not irradiated Some of them are provided with a reflective material. The illuminating device according to any one of claims 1 to 8, wherein the LED illuminating light reflecting portion reflects a part or all of the wavelength of the short-wavelength light on at least one side of the translucent plate Light, transmission, and extraction of light having a part or all of the converted light converted by the wavelength conversion unit. The light-emitting device according to any one of claims 1 to 8, wherein at least the surface of the wavelength conversion portion is disposed on the surface of the wavelength-converting portion, and the short-wavelength light emitted by the LED element and the wavelength are converted. The light is highly reflective material formed. The illuminating device according to any one of claims 1 to 8, wherein at least a surface of the wavelength conversion portion is disposed on the surface of the reflecting surface, and at least a short-wavelength light and a wavelength emitted by the LED element are disposed. A reflective sheet of high reflectivity after conversion. The light-emitting device according to any one of claims 1 to 8, wherein the wavelength conversion portion is made of a resin having a light-transmissive property and having a soft shape of 2148-6713-PF 36 1253189. a sheet of light material. The light-emitting device according to any one of the items 1 to 8, wherein the surface of the wavelength conversion portion has a concavo-convex shape. 19. The illuminating device according to any one of the claims of the invention, wherein the LED group is dreamed; the surface of the slate and the earth plate is used for the short emission of the LED element: the light and the wavelength conversion unit are utilized. A material with high light reflectivity after wavelength conversion is formed. ▲ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The LED assembly substrate is made of a highly thermally conductive material. 2. The illuminating device of any one of the preceding claims, wherein the short-wavelength light is purple or blue-violet. ^:: (4), which is characterized by: in the lighting apparatus to make ... 'patent consumption of the brothers 1 to 8 of the item - the light-emitting device. 23_ illuminating device according to item 22 of the patent application scope, the child body of the hearing aid device is composed of a heat conductive material, so that the illuminating device::: at least a part of the thermal component and the guiding body of the lighting device _ The luminaire of claim 23, wherein the body is formed in a box shape having a front opening portion and an opening portion of the light-emitting surface side of the housing in which the illuminating device is inserted at the bottom, It is composed of a high reflectivity material, and the front two portions are covered with a diffusing transmission plate. (1) Open D 2148-6713-ΡΡ 37