JP4683013B2 - Light emitting device - Google Patents

Light emitting device Download PDF

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JP4683013B2
JP4683013B2 JP2007160408A JP2007160408A JP4683013B2 JP 4683013 B2 JP4683013 B2 JP 4683013B2 JP 2007160408 A JP2007160408 A JP 2007160408A JP 2007160408 A JP2007160408 A JP 2007160408A JP 4683013 B2 JP4683013 B2 JP 4683013B2
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light
emitting diode
color conversion
conversion member
substrate
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JP2008311190A (en
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拓磨 橋本
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Panasonic Corp
Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Description

本発明は、発光ダイオード素子を利用した発光装置に関するものである。   The present invention relates to a light emitting device using a light emitting diode element.

従来から、青色光あるいは紫外光を放射するＧａＮ系のＬＥＤチップ（発光ダイオード素子）とＬＥＤチップから放射された光によって励起されてＬＥＤチップとは異なる発光色の光を放射する波長変換材料としての蛍光体（蛍光顔料や蛍光染料など）とを組み合わせることにより、白色を含め、ＬＥＤチップの発光色とは異なる色合いの光を出す発光装置の研究開発が各所で行われている。なお、この種の発光装置は、小型、軽量、省電力といった長所を有し、例えば、小型電球（白熱電球、ハロゲン電球など）の代替の光源、携帯電話機の液晶パネル用光源（液晶パネル用バックライト）などとして広く用いられている。   Conventionally, a GaN-based LED chip (light emitting diode element) that emits blue light or ultraviolet light and a wavelength conversion material that emits light of an emission color different from that of the LED chip when excited by light emitted from the LED chip. Research and development of light emitting devices that emit light having a color different from the light emission color of the LED chip, including white, by combining with phosphors (fluorescent pigments, fluorescent dyes, etc.) are being carried out in various places. Note that this type of light emitting device has advantages such as small size, light weight, and power saving. For example, a light source that is an alternative to a small light bulb (incandescent light bulb, halogen light bulb, etc.) Light).

また、近年、この種の発光装置の一種である白色ＬＥＤの高出力化に伴い、白色ＬＥＤを照明用途に展開する研究開発が盛んになってきているが、白色ＬＥＤを一般照明用途などのように比較的大きな光出力を必要とする用途に用いる場合、１個の白色ＬＥＤでは所望の光出力を得ることができないので、複数個の白色ＬＥＤを１枚の配線基板（例えば、金属ベース基板やガラス布・エポキシ樹脂銅張積層板などを用いて形成した回路基板）上に実装したＬＥＤユニットを構成するとともに、個々の白色ＬＥＤに供給する電力を増加させ、ＬＥＤユニット全体で所望の光出力を確保するようにしているのが一般的である。   In recent years, with the increase in the output of white LEDs, which are a kind of this type of light-emitting device, research and development for expanding white LEDs into lighting applications has become active. For example, when a single white LED cannot be used to obtain a desired light output, a plurality of white LEDs are connected to a single wiring board (for example, a metal base board or LED unit mounted on a glass cloth / epoxy resin copper-clad laminate, etc.) and the power supplied to each white LED is increased so that the entire LED unit has a desired light output. Generally, it is ensured.

ところで、上述のようにＬＥＤチップと蛍光体とを組み合わせた発光装置においては、投入電力を大きくすると、ＬＥＤチップから放射される青色光あるいは紫外光の放射エネルギが大きくなって、蛍光体でのストークスシフトによるエネルギ損失に起因した発熱量の総量が大きくなり、温度消光による蛍光体の発光効率が低下したり、ＬＥＤチップから放射される光と蛍光体から放射される光とのバランスが崩れて色度がずれてしまうことがあった。   By the way, in the light emitting device in which the LED chip and the phosphor are combined as described above, when the input power is increased, the radiant energy of the blue light or the ultraviolet light emitted from the LED chip is increased, and the Stokes in the phosphor is increased. The total amount of heat generated due to the energy loss due to the shift increases, the luminous efficiency of the phosphor due to temperature quenching decreases, and the balance between the light emitted from the LED chip and the light emitted from the phosphor is lost. There was a case where the degree was shifted.

これに対して、図２や図３に示すように、ＬＥＤチップ２’と、ＬＥＤチップ２’を収納する収納凹所１０ａ’が形成され収納凹所１０ａ’の内底面にＬＥＤチップ２’が実装されたセラミック基板からなる実装基板１０’と、実装基板１０’の収納凹所１０ａ’に収納されたＬＥＤチップ２’を封止した封止部３０’とを備え、封止部３０’が、透明樹脂により形成されＬＥＤチップ２’を覆った透明樹脂層３１’と、ＬＥＤチップ２’から放射される光によって励起されてＬＥＤチップ２’の発光色とは異なる色の光を放射する蛍光体を含有した透明樹脂により形成され透明樹脂層３１’に積層された色変換層３２’とで構成され、実装基板１０’と熱結合する放熱用部材５０’を色変換層３２’に埋設してなる発光装置が提案されている（特許文献１参照）。   On the other hand, as shown in FIGS. 2 and 3, an LED chip 2 ′ and a housing recess 10a ′ for housing the LED chip 2 ′ are formed, and the LED chip 2 ′ is formed on the inner bottom surface of the housing recess 10a ′. A mounting substrate 10 ′ made of a mounted ceramic substrate, and a sealing portion 30 ′ that seals the LED chip 2 ′ housed in the housing recess 10a ′ of the mounting substrate 10 ′. The transparent resin layer 31 ′ formed of a transparent resin and covering the LED chip 2 ′, and the fluorescence that is excited by the light emitted from the LED chip 2 ′ and emits light of a color different from the emission color of the LED chip 2 ′ A color conversion layer 32 ′ formed of a transparent resin containing a body and laminated on the transparent resin layer 31 ′, and a heat radiating member 50 ′ thermally coupled to the mounting substrate 10 ′ is embedded in the color conversion layer 32 ′. A light-emitting device is proposed. (See Patent Document 1).

ここで、図２に示した構成の発光装置は、放熱用部材５０’として、金属材料からなる放熱用線材が色変換層３２’に埋設され、図３に示した構成の発光装置は、放熱用部材５０’として、金属材料からなる放熱用メッシュが色変換層３２’に埋設されている。
特開２００５−３１１１７０号公報 Here, in the light emitting device having the configuration shown in FIG. 2, a heat radiating wire made of a metal material is embedded in the color conversion layer 32 ′ as the heat radiating member 50 ′, and the light emitting device having the configuration shown in FIG. As the member 50 ′, a heat radiating mesh made of a metal material is embedded in the color conversion layer 32 ′.
Japanese Patent Laying-Open No. 2005-311170

ところで、図２や図３に示した構成の発光装置では、色変換層３２’で発生した熱の一部が放熱用部材５０’を通して実装基板１０’へ放熱されるので、蛍光体の発光効率の低下を抑制することができるが、放熱用部材５０’の端部が実装基板１０’と接しているだけなので、色変換層３２’で発生した熱を均一に放熱させることができず、色変換層３２’の周部に比べて中央部の温度が高くなってしまうという問題があった。また、図２や図３に示した構成の発光装置では、ＬＥＤチップ２’から放射される光の一部や蛍光体から放射される光の一部が放熱用部材５０’により遮られて光出力が低下してしまうという問題もあった。   By the way, in the light emitting device having the configuration shown in FIGS. 2 and 3, a part of the heat generated in the color conversion layer 32 ′ is radiated to the mounting substrate 10 ′ through the heat radiating member 50 ′. However, since the end of the heat radiating member 50 ′ is only in contact with the mounting substrate 10 ′, the heat generated in the color conversion layer 32 ′ cannot be dissipated uniformly, and the color There was a problem that the temperature of the central portion was higher than that of the peripheral portion of the conversion layer 32 ′. Further, in the light emitting device having the configuration shown in FIGS. 2 and 3, a part of the light emitted from the LED chip 2 ′ and a part of the light emitted from the phosphor are blocked by the heat radiating member 50 ′. There was also a problem that the output decreased.

本発明は上記事由に鑑みて為されたものであり、その目的は、蛍光体の温度上昇に起因した蛍光体の発光効率の低下や色度ずれが起こるのを抑制できる発光装置を提供することにある。   The present invention has been made in view of the above-mentioned reasons, and an object thereof is to provide a light emitting device that can suppress a decrease in luminous efficiency and chromaticity deviation of a phosphor due to a temperature rise of the phosphor. It is in.

請求項１の発明は、フレキシブル基板と、前記フレキシブル基板の一表面側に実装された発光ダイオード素子と、前記フレキシブル基板の前記一表面上において前記発光ダイオード素子と離間して設けられ前記発光ダイオード素子から放射される光によって励起されて前記発光ダイオード素子の発光色とは異なる色の光を放射する蛍光体を含有したシート状の色変換部材と、前記フレキシブル基板の他表面側に設けられ前記フレキシブル基板を支持する支持部材を兼ねる放熱部材とを備え、前記フレキシブル基板は、前記発光ダイオード素子が電気的に接続される配線パターンが前記一表面側に形成されるとともに、前記発光ダイオード素子からの光および前記色変換部材からの光を反射する反射機能と前記色変換部材で発生した熱を前記放熱部材側へ伝熱させる伝熱機能とを有し前記色変換部材が固着される導体パターンが、前記一表面側の中央部に形成されてなり、前記発光ダイオード素子から放射される光が前記色変換部材の表面に斜め方向から入射するように折り曲げられ、前記発光ダイオード素子および前記色変換部材それぞれに重複する領域が前記放熱部材と接合されてなることを特徴とする。 The invention according to claim 1, the flexible substrate, the off a light emitting diode element mounted on one surface side of the Rekishiburu substrate, et al provided the one surface on the smell of the full Rekishiburu substrate Te apart from the light - emitting diode element is a color conversion member sheet containing a phosphor which emits light of a different color from the emission color of the light - emitting diode element is excited by light emitted from the light - emitting diode element, of the full Rekishiburu substrate and a heat radiating member serving also as a support member for supporting the providing et Re the full Rekishiburu substrate to another surface, the full Rekishiburu substrate, forming a wiring pattern in which the light emitting diode element is electrically connected to said one surface In addition, the function of reflecting the light from the light emitting diode element and the light from the color conversion member and the heat generated by the color conversion member are released. Conductor pattern wherein the color converting member and a heat transfer function for transferring heat to the member side is fixed is made is formed in a central portion of said one surface, wherein the light emitted from the light - emitting diode element bent so as to obliquely incident on the surface of the color conversion member, a region overlapping each of the light emitting diode element and the color conversion member is characterized by comprising joined to the heat-member release said.

この発明によれば、シート状の色変換部材で発生した熱がフレキシブル基板および放熱部材を介して効率良く放熱されるので、色変換部材の温度上昇および温度の面内ばらつきを抑制することができ、蛍光体の温度上昇に起因した蛍光体の発光効率の低下や色度ずれが起こるのを抑制できる。また、この発明によれば、発光ダイオード素子で発生した熱もフレキシブル基板および放熱部材を介して効率良く放熱され、発光ダイオード素子のジャンクション温度の温度上昇を抑制できるから、入力電力を大きくでき、光出力のより一層の高出力化を図れる。 According to the present invention, the heat generated in the sheet-like color conversion member is efficiently radiated through the flexible substrate and the heat radiating member, so that the temperature increase and temperature variation in the color conversion member can be suppressed. Thus, it is possible to suppress a decrease in luminous efficiency and chromaticity shift caused by the phosphor temperature increase . Further, according to the present invention, the heat generated in the light emitting diode element is also efficiently dissipated through the flexible substrate and the heat radiating member, and the temperature rise of the junction temperature of the light emitting diode element can be suppressed. The output can be further increased.

請求項１の発明では、蛍光体の温度上昇に起因した蛍光体の発光効率の低下や色度ずれが起こるのを抑制できるという効果がある。   According to the first aspect of the present invention, there is an effect that it is possible to suppress a decrease in luminous efficiency of the phosphor and a chromaticity shift caused by the temperature rise of the phosphor.

本実施形態の発光装置は、図１に示すように、フレキシブル基板１と、フレキシブル基板１の一表面側に実装された複数個のＬＥＤチップ２と、フレキシブル基板１の上記一表面側で各ＬＥＤチップ２それぞれを封止した封止材（例えば、シリコーン樹脂など）からなる複数の封止部３と、フレキシブル基板１の上記一表面上においてＬＥＤチップ２と離間して設けられＬＥＤチップ２から放射される光によって励起されてＬＥＤチップ２の発光色とは異なる色の光を放射する蛍光体を含有したシート状の透光性部材からなる色変換部材４と、フレキシブル基板１の他表面側に設けられフレキシブル基板１を支持する支持部材を兼ねる放熱部材５とを備えている。なお、本実施形態では、ＬＥＤチップ２が発光ダイオード素子を構成している。   As shown in FIG. 1, the light emitting device of the present embodiment includes a flexible substrate 1, a plurality of LED chips 2 mounted on one surface side of the flexible substrate 1, and each LED on the one surface side of the flexible substrate 1. A plurality of sealing portions 3 made of a sealing material (for example, silicone resin) that seals each of the chips 2 and the LED chip 2 that is provided on the one surface of the flexible substrate 1 so as to be radiated from the LED chips 2. On the other surface side of the flexible substrate 1 and a color conversion member 4 made of a sheet-like translucent member containing a phosphor that emits light of a color different from the emission color of the LED chip 2 when excited by the light emitted And a heat dissipating member 5 that also serves as a supporting member that supports the flexible substrate 1. In the present embodiment, the LED chip 2 constitutes a light emitting diode element.

ＬＥＤチップ２は、青色の波長域の光を放射するＧａＮ系青色ＬＥＤチップであり、フレキシブル基板１に搭載され、フレキシブル基板１の上記一表面側に形成されている配線パターン（図示せず）と電気的に接続されている。   The LED chip 2 is a GaN-based blue LED chip that emits light in a blue wavelength range, and is mounted on the flexible substrate 1 and has a wiring pattern (not shown) formed on the one surface side of the flexible substrate 1. Electrically connected.

封止部３は、シリコーン樹脂により半球状に形成されており、ＬＥＤチップ２から放射された光の指向性を強くする凸レンズ（つまり、配光を制御する凸レンズ）としての機能を有している。   The sealing portion 3 is formed in a hemispherical shape from a silicone resin, and has a function as a convex lens that enhances the directivity of light emitted from the LED chip 2 (that is, a convex lens that controls light distribution). .

色変換部材４は、シリコーン樹脂のような透光性材料にＬＥＤチップ２から放射される青色光を吸収することで励起されて青色光よりも低エネルギの黄色光を放射する粒子状の黄色蛍光体を含有するシート状の透光性部材により構成されており、フレキシブル基板１の上記一表面側の中央部に形成されている導体パターン（図示せず）に対して、接着剤（例えば、シリコーン樹脂、エポキシ樹脂など）を用いて固着されている。ここにおいて、上記導体パターンと上記配線パターンとは、同じ材料により形成されており、同時に形成されている。また、上記導体パターンの平面視形状は、色変換部材４と同じ矩形状であり、上記導体パターンは、色変換部材４で発生した熱を放熱部材５側へ伝熱させる伝熱機能と、ＬＥＤチップ２から放射され色変換部材４を透過した青色光や色変換部材４の黄色蛍光体からフレキシブル基板１側へ放射された黄色光を色変換部材４の表面側へ反射する反射機能とを有するものであり、上記導体パターンの平面サイズは、色変換部材４と同じか或いは大きければよい。なお、本実施形態では、色変換部材４の厚みを０．３ｍｍに設定してあるが、この厚みは特に限定するものではない。   The color conversion member 4 is excited by absorbing blue light emitted from the LED chip 2 in a translucent material such as silicone resin, and emits yellow light having a lower energy than the blue light. An adhesive (e.g., silicone) is formed on a conductive pattern (not shown) formed on the central portion on the one surface side of the flexible substrate 1. Resin, epoxy resin, etc.). Here, the conductor pattern and the wiring pattern are formed of the same material and are formed at the same time. Moreover, the planar view shape of the said conductor pattern is the same rectangular shape as the color conversion member 4, and the said conductor pattern is a heat-transfer function which transfers the heat which generate | occur | produced in the color conversion member 4 to the heat radiating member 5 side, and LED. The blue light emitted from the chip 2 and transmitted through the color conversion member 4 and the yellow light emitted from the yellow phosphor of the color conversion member 4 to the flexible substrate 1 side are reflected to the surface side of the color conversion member 4. The plane size of the conductor pattern may be the same as or larger than that of the color conversion member 4. In the present embodiment, the thickness of the color conversion member 4 is set to 0.3 mm, but this thickness is not particularly limited.

フレキシブル基板１は、ＬＥＤチップ２から放射される光が色変換部材４の表面に斜め方向から入射するように折り曲げられており（具体的には、色変換部材４の鉛直方向への投影領域にＬＥＤチップ２が存在せず、ＬＥＤチップ２の光軸と色変換部材４の表面とのなす角度が鋭角となるように折り曲げられており）、上記他表面全体が放熱部材５と接合されている。ここにおいて、フレキシブル基板１は、上記他表面側に銅めっき膜が形成されており、熱伝導性材料（本実施形態では、Ｃｕ）により形成された上述の放熱部材５と半田によって接合されている。ここで、フレキシブル基板１は、電気絶縁性および柔軟性を有するベースフィルム（例えば、ポリイミドフィルム、ポリエステルフィルムなど）の一表面側に上記配線パターンが形成され、他表面側に上記銅めっき膜が形成されている。なお、上記熱伝導性材料は、熱伝導率の高い材料であれば、Ｃｕに限らず、例えば、Ａｌ、Ａｕなどでもよい。   The flexible substrate 1 is bent so that light emitted from the LED chip 2 is incident on the surface of the color conversion member 4 from an oblique direction (specifically, in the projection region of the color conversion member 4 in the vertical direction). LED chip 2 does not exist and is bent so that the angle formed by the optical axis of LED chip 2 and the surface of color conversion member 4 is an acute angle), and the entire other surface is joined to heat dissipation member 5. . Here, the flexible substrate 1 has a copper plating film formed on the other surface side, and is joined by solder to the heat dissipation member 5 formed of a heat conductive material (Cu in this embodiment). . Here, in the flexible substrate 1, the wiring pattern is formed on one surface side of a base film (for example, polyimide film, polyester film, etc.) having electrical insulation and flexibility, and the copper plating film is formed on the other surface side. Has been. In addition, if the said heat conductive material is a material with high heat conductivity, it will not be restricted to Cu, For example, Al, Au etc. may be sufficient.

上述のフレキシブル基板１は、矩形状の主片１ａの各側縁それぞれの中央部から短冊状の突出片１ｂが延設されており、各突出片１ｂの先端部にＬＥＤチップ２が搭載されている。ここにおいて、フレキシブル基板１は、主片１ａと各突出片１ｂそれぞれとの境界部で折り曲げられており、当該境界部から離れるにつれて主片１ａの表面からの距離が大きくなっている。ここで、上述のＬＥＤチップ２の光軸と色変換部材４の表面とのなす角度をθ１、主片１ａと突出片１ｂとのなす角度をθ２とすると、θ２＝９０°−θ１となっている。   The above-mentioned flexible substrate 1 has strip-shaped protruding pieces 1b extending from the center of each side edge of the rectangular main piece 1a, and the LED chip 2 is mounted on the tip of each protruding piece 1b. Yes. Here, the flexible substrate 1 is bent at the boundary between the main piece 1a and each protruding piece 1b, and the distance from the surface of the main piece 1a increases with distance from the boundary. Here, if the angle between the optical axis of the LED chip 2 and the surface of the color conversion member 4 is θ1, and the angle between the main piece 1a and the protruding piece 1b is θ2, θ2 = 90 ° −θ1. Yes.

また、放熱部材５は、フレキシブル基板１の主片１ａが接合される矩形板状のベース部５ａと、ベース部５ａの各側縁それぞれの中央部からフレキシブル基板１の各突出片１ｂそれぞれを保持するように立設され各突出片１ｂが接合される４つの短冊状のアーム部５ｂとが連続一体に形成されている。   Further, the heat dissipation member 5 holds the rectangular plate-like base portion 5a to which the main piece 1a of the flexible substrate 1 is joined, and the protruding pieces 1b of the flexible substrate 1 from the central portions of the side edges of the base portion 5a. Thus, four strip-shaped arm portions 5b that are erected so that the protruding pieces 1b are joined to each other are formed continuously and integrally.

以上説明した本実施形態の発光装置では、ＬＥＤチップ２から放射された青色光と黄色蛍光体から放射された黄色光とが色変換部材４の表面を通して放射されることとなり、白色光を得ることができ、フレキシブル基板１が、ＬＥＤチップ２から放射される光が色変換部材４の表面に斜め方向から入射するように折り曲げられ、放熱部材５と接合されているので、点灯時にシート状の色変換部材４で発生した熱がフレキシブル基板１および放熱部材５を介して効率良く放熱されるから、色変換部材４の温度上昇および温度の面内ばらつきを抑制することができ、蛍光体の温度上昇に起因した蛍光体の発光効率の低下や色度ずれが起こるのを抑制できる。また、本実施形態の発光装置では、色変換部材４の鉛直方向への投影領域に放熱部材５のアーム部５ｂが存在せず、ＬＥＤチップ２から放射されて色変換部材４を透過してフレキシブル基板１の上記導体パターンで反射された光が反対側のＬＥＤチップ２および当該反対側のＬＥＤチップ２が搭載されている突出片１ｂに入射しないように、色変換部材４の平面サイズ、上記各角度θ１，θ２、封止部３の表面の曲率などを設定してあるので、ＬＥＤチップ２から放射される光の一部や蛍光体から放射される光の一部が放熱部材５により遮られて光出力が低下するのを防止することができる。   In the light emitting device of the present embodiment described above, the blue light emitted from the LED chip 2 and the yellow light emitted from the yellow phosphor are emitted through the surface of the color conversion member 4 to obtain white light. The flexible substrate 1 is bent so that the light emitted from the LED chip 2 is incident on the surface of the color conversion member 4 from an oblique direction, and is joined to the heat radiating member 5. Since the heat generated in the conversion member 4 is efficiently radiated through the flexible substrate 1 and the heat radiating member 5, the temperature increase of the color conversion member 4 and the in-plane variation in temperature can be suppressed, and the temperature of the phosphor increases. It is possible to suppress a decrease in luminous efficiency and chromaticity shift caused by the phosphor. Further, in the light emitting device of this embodiment, the arm portion 5b of the heat radiating member 5 does not exist in the vertical projection region of the color conversion member 4, and is radiated from the LED chip 2 and transmitted through the color conversion member 4 to be flexible. The planar size of the color conversion member 4 and each of the above-mentioned values are set so that the light reflected by the conductor pattern of the substrate 1 does not enter the opposite LED chip 2 and the protruding piece 1b on which the opposite LED chip 2 is mounted. Since the angles θ1 and θ2 and the curvature of the surface of the sealing portion 3 are set, a part of the light emitted from the LED chip 2 and a part of the light emitted from the phosphor are blocked by the heat radiating member 5. Therefore, it is possible to prevent the light output from decreasing.

ところで、色変換部材４の温度上昇を抑制するにはフレキシブル基板１において少なくとも色変換部材４に重複する領域が放熱部材５と接合されていればよいが、本実施形態の発光装置では、フレキシブル基板１の全体が放熱部材５と接合されているので、ＬＥＤチップ２で発生した熱もフレキシブル基板１および放熱部材５を介して効率良く放熱され、ＬＥＤチップ２のジャンクション温度の温度上昇を抑制できるから、入力電力を大きくでき、光出力のより一層の高出力化を図れる。   By the way, in order to suppress the temperature rise of the color conversion member 4, at least a region overlapping with the color conversion member 4 may be joined to the heat dissipation member 5 in the flexible substrate 1. 1 is joined to the heat dissipation member 5, the heat generated in the LED chip 2 is also efficiently dissipated through the flexible substrate 1 and the heat dissipation member 5, and the temperature rise of the junction temperature of the LED chip 2 can be suppressed. The input power can be increased, and the optical output can be further increased.

なお、上述の実施形態では、ＬＥＤチップ２として、青色光を放射する青色ＬＥＤチップを採用しているが、ＬＥＤチップ２は青色光を放射するものに限らず、例えば、紫外光を放射するものでもよい。また、上述の実施形態では、ＬＥＤチップ２が発光ダイオード素子を構成しているが、発光ダイオード素子は、ＬＥＤチップに限らず、例えば、レンズ付きの表面実装型パッケージにＬＥＤチップを収納したＳＭＤ型ＬＥＤでもよく、この場合には上述の半球状の封止部３を別途に設ける必要はない。   In the above-described embodiment, a blue LED chip that emits blue light is used as the LED chip 2. However, the LED chip 2 is not limited to one that emits blue light, for example, one that emits ultraviolet light. But you can. In the above-described embodiment, the LED chip 2 constitutes a light-emitting diode element. However, the light-emitting diode element is not limited to the LED chip, but, for example, an SMD type in which the LED chip is housed in a surface-mounted package with a lens. An LED may be used, and in this case, it is not necessary to separately provide the above-described hemispherical sealing portion 3.

また、色変換部材４の材料として用いる透光性材料は、シリコーン樹脂に限らず、例えば、エポキシ樹脂、ガラスなどを採用してもよい。また、色変換部材４の材料として用いる透光性材料に含有させる蛍光体も黄色蛍光体に限らず、色調整や演色性を高めるなどの目的で複数種類の蛍光体を用いてもよく、例えば、赤色蛍光体と緑色蛍光体とを用いることで演色性の高い白色光を得ることができる。ここで、複数種類の蛍光体を用いる場合には必ずしも発光色の異なる蛍光体の組み合わせに限らず、例えば、発光色はいずれも黄色で発光スペクトルの異なる複数種類の蛍光体を組み合わせてもよい。   Moreover, the translucent material used as the material of the color conversion member 4 is not limited to the silicone resin, and for example, an epoxy resin, glass, or the like may be employed. Further, the phosphor to be contained in the translucent material used as the material of the color conversion member 4 is not limited to the yellow phosphor, and a plurality of types of phosphors may be used for the purpose of improving color adjustment and color rendering. White light with high color rendering properties can be obtained by using a red phosphor and a green phosphor. Here, when a plurality of types of phosphors are used, the phosphor is not necessarily a combination of phosphors having different emission colors, and for example, a plurality of types of phosphors having an emission color of yellow and different emission spectra may be combined.

実施形態の発光装置を示し、（ａ）は概略斜視図、（ｂ）は要部概略断面図である。The light-emitting device of embodiment is shown, (a) is a schematic perspective view, (b) is principal part schematic sectional drawing. 従来例を示す発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device which shows a prior art example. 他の従来例を示す発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device which shows another prior art example.

符号の説明Explanation of symbols

１ フレキシブル基板
２ ＬＥＤチップ（発光ダイオード素子）
３ 封止部
４ 色変換部材
５ 放熱部材 1 Flexible substrate 2 LED chip (light emitting diode element)
3 Sealing part 4 Color conversion member 5 Heat dissipation member

Claims (1)

フレキシブル基板と、前記フレキシブル基板の一表面側に実装された発光ダイオード素子と、前記フレキシブル基板の前記一表面上において前記発光ダイオード素子と離間して設けられ前記発光ダイオード素子から放射される光によって励起されて前記発光ダイオード素子の発光色とは異なる色の光を放射する蛍光体を含有したシート状の色変換部材と、前記フレキシブル基板の他表面側に設けられ前記フレキシブル基板を支持する支持部材を兼ねる放熱部材とを備え、前記フレキシブル基板は、前記発光ダイオード素子が電気的に接続される配線パターンが前記一表面側に形成されるとともに、前記発光ダイオード素子からの光および前記色変換部材からの光を反射する反射機能と前記色変換部材で発生した熱を前記放熱部材側へ伝熱させる伝熱機能とを有し前記色変換部材が固着される導体パターンが、前記一表面側の中央部に形成されてなり、前記発光ダイオード素子から放射される光が前記色変換部材の表面に斜め方向から入射するように折り曲げられ、前記発光ダイオード素子および前記色変換部材それぞれに重複する領域が前記放熱部材と接合されてなることを特徴とする発光装置。 A flexible substrate, a light emitting diode element mounted on one surface side of the full Rekishiburu substrate, the full Rekishiburu Re said al one surface on odor Te installed apart from the light - emitting diode element of the substrate from the light - emitting diode element a color conversion member sheet containing a phosphor which emits light of a different color than the being excited by light emission color of the light - emitting diode emitted, Re et provided on the other surface side of the full Rekishiburu substrate and a heat radiating member serving also as a supporting member for supporting the full Rekishiburu substrate, the full Rekishiburu substrate, together with the wiring pattern the light-emitting diode elements are electrically connected is formed on the one surface side, the light emitting diode Reflecting the light from the element and the light from the color conversion member and transferring the heat generated by the color conversion member to the heat radiating member side Conductor pattern wherein the color converting member and a heat transfer function is fixed is made is formed in a central portion of said one surface, the light emitted from the light - emitting diode element surface of the color conversion member bent so as to obliquely incident, the light emitting device area overlapping to each of the light emitting diode element and the color conversion member is characterized by comprising joined to the heat-member release said.
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