TWI251460B - Compound heat sink with multi-directional fins - Google Patents
Compound heat sink with multi-directional fins Download PDFInfo
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- TWI251460B TWI251460B TW093100494A TW93100494A TWI251460B TW I251460 B TWI251460 B TW I251460B TW 093100494 A TW093100494 A TW 093100494A TW 93100494 A TW93100494 A TW 93100494A TW I251460 B TWI251460 B TW I251460B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
!251460 五、發明說明（1) 【發明所屬之技術領域】 本發明係揭露一種散埶 維度之流道的散熱單體 έ、、、，尤指一種由複數個具不同 M a ^成之複合式多流向散熱器。 【先前技術】 隨著電子裝置效能的 已成為現行電子裝置中 ^斷^ ^，散熱裝置或散熱系統 置所產生之熱能若不加缺的配備之一，因為電子裝 差，重則會導致電子裝w =虽地散逸，輕則造成效能變 件（例如積體電路）而言# a 1觥。散熱裝置對於微電子元 以及封裝技術的進步：傕：f要，因為隨著集積度的增加 同時每單位面積所累積電路的面積不斷地縮小， 效能的散熱裝置-直是電；：=相對地會更高，故高散熱 一 疋寬子產業界所積極研發的對象。 & # A U、，A 4 β"、、展置係置於一欲散熱裝置（例如CPU) ^ ^ ^ a ^ ^ ^ 厅產生的熱月匕。請參考第1A圖。第1A圖 ，一 S知政熱裝置10之結構示意圖。如第u圖所示，散数 凌，ίο包含有一軸流式風扇（axial_fl〇w fan)2〇w及一散 熱，30。軸，式風扇2〇具有一扇框22、一輪轂（hub)24# 及複數片扇葉26形成於輪轂24周圍。散熱器3〇係由一導熱 底座3 2以及複數片散熱鰭片3 4所組成。 組裝散熱裝置1 〇時，係將風扇2 〇鎖固於散熱器3 〇之散 熱鰭片34上’之後，再將一欲散熱裝置（未顯示，例如一 中央處理器）貼附於散熱器3 〇之導熱底座3 2的底部中央。 風扇2 0的輪轂2 4係對位於散熱器3 0的中央區域上，而複數[251] V. Technical Description of the Invention [1] The present invention discloses a heat dissipating unit έ, ,, and, in particular, a composite of a plurality of different M Multi-flow to the radiator. [Prior Art] As the performance of electronic devices has become one of the devices in the current electronic devices, the thermal energy generated by the heat dissipating device or the heat dissipating system is not added, because the electronic device is poorly loaded, the electronic device is loaded. w = Although the ground is dissipated, the lightness causes the performance variable (such as the integrated circuit) to be # a 1觥. Heat sinks for microelectronics and packaging technology advancement: 傕: f, because as the degree of accumulation increases while the area of the circuit accumulated per unit area continues to shrink, the efficiency of the heat sink - straight is electricity;: = relative It will be higher, so the high heat dissipation will be the object of active research and development by the Kuanzi industry. &# A U,, A 4 β",, and the placement is placed in a heat sink (for example, CPU) ^ ^ ^ a ^ ^ Hall. Please refer to Figure 1A. Fig. 1A is a schematic view showing the structure of a heat treatment device 10. As shown in Fig. u, the scatter number, ίο includes an axial flow fan (axial_fl〇w fan) 2〇w and a heat dissipation, 30. The shaft, the fan 2 has a frame 22, a hub 24# and a plurality of blades 26 formed around the hub 24. The heat sink 3 is composed of a heat conducting base 32 and a plurality of heat radiating fins 34. When the heat sink 1 is assembled, the fan 2 〇 is fixed on the heat sink fin 34 of the heat sink 3, and then a heat sink (not shown, such as a central processing unit) is attached to the heat sink 3中央The center of the bottom of the thermal base 3 2 . The hub 24 of the fan 20 is located on the central area of the heat sink 30, and plural
第6頁 1251460 五、發明說明（2) 片扇葉2 6則對 >[立提^士方士 當該欲二Γΐ:產:央區域之外圍的週邊區域上。 旎會由導熱底座32的底部中 ：=〇時，熱 基 赴錄丄η 、1寻等主各月文熱鱗片3 4， Ϊ速：？？的吹拂而將該欲散熱裝置所產生丄 =中=可知’當該欲散熱裝置產生熱㈣，ί:; 逐漸遞減。然❿，對於習知：執：=…人，朝週邊區域 =針；=區域係位於風扇2°之輪較24的下方,:、ΐ :乂4於風扇20形成冷卻氣流以帶走熱能是毫無助益 :。此外：習知散熱器3〇之散熱韓片34係朝單一方向（如 2fi路^斤不^Υ軸，向）排列，當風扇2〇運轉時，每一扇葉 生之氣流係延扇葉26周緣之切線方向流出，故，散 ^器30之氣體流道僅會在γ軸方向形成，也就是說，風扇 $所產生之冷卻氣流主要係由散熱鰭片34之間的縫隙兩側 =出。再者，扇葉2 6延X軸方向所產生之氣流必先正面衝 乂散熱鰭片34後才被迫轉向至散熱鰭片34之間的縫隙兩側 流出，因此，由風扇20產生之冷卻氣流在散熱鰭片34之間 的流場很不順暢，並且其流速會受到阻礙及遲滯，故，其 對政熱器3 0之中央區域的冷卻效果不佳是可以理解的。 一 請參考第1B圖。第1B圖係另一習知散熱裝置50之結構 =意圖。如第1 B圖所示，為解決散熱器3 〇之流道不足的問 靖放熱器70之政熱續片74亦延圖示之γ轴方向平行配置 於導熱底座72上且留有一預定間隔，使得散熱器7〇在X軸Page 6 1251460 V. Description of the invention (2) Blades of the blade 2 6 pairs of > [Li Ti Shi Shi Fangshi When the desire is two: production: the peripheral area of the periphery of the central area.旎 will be from the bottom of the heat-conducting base 32: = 〇, hot base to record 丄 、, 1 search and other main monthly hot scales 3 4, Idle:? ? The blowing of the heat sink is generated by 丄 = medium = knowing that when the heat sink generates heat (four), ί:; gradually decreases. Then, for the custom: hold: = ... person, towards the surrounding area = needle; = area is located below the fan 2 ° wheel 24, :, ΐ: 乂 4 in the fan 20 to form a cooling airflow to take away heat is Not helpful: In addition: the conventional radiator 3 〇 散热 韩 韩 韩 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 34 The tangential direction of the 26th circumference flows out. Therefore, the gas flow path of the diffuser 30 is formed only in the γ-axis direction, that is, the cooling airflow generated by the fan $ is mainly caused by the gap between the fins 34. Out. Furthermore, the airflow generated by the fan blades 26 in the X-axis direction must be frontally flushed by the heat dissipation fins 34 before being forced to steer to the sides of the gap between the heat dissipation fins 34, so that the cooling by the fan 20 is generated. The flow field between the heat radiating fins 34 is not smooth, and the flow velocity thereof is hindered and retarded, so that it is understandable that the cooling effect on the central portion of the heat exchanger 30 is poor. Please refer to Figure 1B. Figure 1B is a block diagram of another conventional heat sink 50. As shown in FIG. 1B, in order to solve the problem that the flow path of the radiator 3 is insufficient, the continuation 74 of the heat release device 70 is also arranged in parallel with the γ-axis direction on the heat-conducting base 72 with a predetermined interval. So that the heat sink 7 is on the X axis
1251460 五、發明說明（3) - 及Y軸方向白形成有複數之氣體流道。然而，雖然散熱琴 70之設計可增加其中央區域之流道，使得風扇2〇所產、、生^之 冷卻氣流可經由不同之維度（X軸及γ軸方向）流經散熱器7〇 之中央區域，但是，此設計會使得散熱器7〇之散熱鰭片以 的整體表面積降低（大約30%)，因此 ‘ 整體的對流效果，如此亦無法有效地/欲散熱裝、/所置產50生· 之熱能散逸。此外，風扇20所產生之冷卻氣流在散熱器7〇 之X軸及Υ軸方向流道上會互相撞擊，而導致冷卻氣流的流 阻增加，使得流出散熱鰭片7 4之冷卻氣流的流速及流量均 大大降低，如此，亦無法解決該欲散熱裝置的散熱問題。籲 【發明内容】 因此，本發明之目的在提供一種由複數個具不同維度 之流道的散熱單體所組成之複合式多流向散熱器，以有效 · 解決習知散熱器中心區域散熱效果不佳的情形，進而增加 散熱器整體的散熱效果。 本發明之散熱器係由複數個散熱單體所組成，每一散 熱單體包含一導熱底座以及複數片散熱鰭片，彼此相互平 行地配置於該導熱底座上，且相鄰二散熱單體之複數片散 ‘ 熱ϋ片係分別地朝相異之方向排列。 胃- 依據本發明所揭露之複合式多流向散熱器，散熱單體 可設計成具不同形狀的多邊形導熱底座或以更多的等腰三 角形導熱底座或扇形導熱底座而組合成具更多流道的散熱 - 器，其不僅能改善散熱器中心區域流道不足的問題，更能1251460 V. INSTRUCTIONS (3) - A plurality of gas flow paths are formed in white in the Y-axis direction. However, although the design of the heat sink 70 can increase the flow path in the central region, the cooling airflow produced by the fan 2 can flow through the heat sink 7 through different dimensions (X-axis and γ-axis directions). The central area, however, this design will reduce the overall surface area of the heat sink fins of the heat sink 7 (about 30%), so the overall convection effect, so can not effectively / want to heat, / 50 The heat of life is dissipated. In addition, the cooling airflow generated by the fan 20 collides with each other on the X-axis and the x-axis flow path of the radiator 7, and the flow resistance of the cooling airflow is increased, so that the flow rate and flow rate of the cooling airflow flowing out of the fins 74 are increased. Both are greatly reduced, and thus, the heat dissipation problem of the heat sink is not solved. SUMMARY OF THE INVENTION Accordingly, the object of the present invention is to provide a composite multi-flow radiator composed of a plurality of heat radiating cells having different sizes of flow channels, so as to effectively solve the heat dissipation effect of the conventional heat sink central region. The good situation, in turn, increases the overall heat dissipation of the heat sink. The heat sink of the present invention is composed of a plurality of heat dissipating cells, each heat dissipating unit comprises a heat conducting base and a plurality of heat dissipating fins, which are arranged parallel to each other on the heat conducting base, and adjacent to the heat dissipating unit The multiple pieces of heat are arranged in different directions. Stomach - According to the composite multi-flow radiator disclosed in the present invention, the heat dissipating unit can be designed as a polygonal heat-conducting base with different shapes or combined with more isosceles triangular heat-conducting base or fan-shaped heat-conducting base to form more flow paths Heat sink, which not only improves the problem of insufficient flow path in the center of the radiator, but also
第8頁 1251460Page 8 1251460
力的 熱縛片之間的接觸面積’進而增加散熱器 【實施方式] 曰為了詳述本發明複合式多流向散熱器的特色，以下僅 提供本發明散熱器之較佳實施例及相關圖示之闡述，當 然’本發明之複合式多流向散熱器亦與一散熱風扇互S搭 配組合而對一欲散熱裝置提供最佳的散熱效果，以下即不 再對散熱風扇及欲散熱裝置加以詳述。 一 請參考第2Α圖與第2Β圖。第2Α圖與第2Β圖為本發明複 夕k向政熱器1 〇 〇之第一較佳實施例的結構示意圖。 如第2A圖與第2B圖所示，散熱器1〇〇係由四個散熱單體 102、1〇4、1〇6及1〇8所構成，每一散熱單體、1〇4、 106及1〇8分別包含有一導熱底座112、114、116、118以及 複數片散熱鰭片122、124、126、1 28相互平行地配置於所 對應之導熱底座112、Π4、ιΐ6、118上。散熱單體102、 108的導熱底座112、118係三邊形底座，而散熱單體1〇4、 1 0 6的導熱底座11 4、11 β係五邊形底座，此外，散熱單體 1〇4、106之二側分別具有兩個承接柱丨3〇，承接柱^0之頂 端為一倒勾132，故將散熱單體1〇2、1〇4、1〇6及1〇8組合 成散熱器1〇〇後，四個承接柱130之倒勾132即可與一散熱 風扇之扣合裝置（未顯示）搭配，使得散熱器丨〇 〇與該散熱 風扇組裝成一散熱裝置。 於本實施例中，散熱單體102、104、106及108係分別The contact area between the heat-bonding sheets of the force is further increased by the heat sink. [Embodiment] In order to describe the characteristics of the composite multi-flow radiator of the present invention, only the preferred embodiment of the heat sink of the present invention and related illustrations are provided below. Therefore, the composite multi-flow radiator of the present invention is also combined with a cooling fan S to provide an optimal heat dissipation effect for a heat sink, and the following is no longer detailed for the heat sink fan and the heat sink. . Please refer to the 2nd and 2nd drawings. 2D and 2D are schematic views showing the structure of the first preferred embodiment of the present invention. As shown in FIGS. 2A and 2B, the heat sink 1 is composed of four heat dissipating units 102, 1〇4, 1〇6, and 1〇8, each of which radiates a single unit, 1〇4, 106. And a plurality of heat-dissipating bases 112, 114, 116, and 118 and a plurality of heat-dissipating fins 122, 124, 126, and 1 28 are disposed in parallel with each other on the corresponding heat-conductive bases 112, Π4, ΐ6, and 118, respectively. The heat-conducting bases 112 and 118 of the heat-dissipating units 102 and 108 are a triangular-shaped base, and the heat-dissipating bases of the heat-dissipating unit 1〇4 and 106 are a pentagon-shaped base. Further, the heat-dissipating unit 1〇 4, 106 of the two sides have two receiving columns 丨 3 〇, the top of the receiving column ^ 0 is a barb 132, so the heat sink monomers 1 〇 2, 1 〇 4, 1 〇 6 and 1 〇 8 are combined into After the heat sink is turned on, the barbs 132 of the four receiving posts 130 can be matched with a fastening device (not shown) of the cooling fan, so that the heat sink and the heat dissipating fan are assembled into a heat dissipating device. In this embodiment, the heat dissipation units 102, 104, 106, and 108 are respectively
1251460 五、發明說明（5) 由導熱底座112、114、116、118與其對應之複數散熱鰭片 122、124、126、128以銅、銅合金、鋁或鋁合金等金屬材 質以一體成形的方式製成。此外，每一散熱單體、 104、106及108分別具有二面位於其導熱底座112、114、 116、118之周緣的焊接面115，藉由焊接散熱單體1〇2、 1 04、1 06及1 08的焊接面1 1 5，即形成本發明之複合式多流 向散熱器1 0 0。 就流體在散熱器1 〇 〇的流動方向即流道而言，本發明 苐一貫施例散熱器1〇〇之每一散熱單體1〇2、104、106、 108上的散熱縛片122、124、126、128係分別朝不同的維 度方向排列，如第2A圖所示，散熱鰭片122係朝+χ軸方向 排列、散熱韓片128係朝-X軸方向排列、散熱鰭片124係 朝-Υ軸方向排列、散熱鰭片126係朝+γ軸方向排列，故， 散熱單體102上的散熱鰭片122會分別與相鄰散熱單體 104、106上的散熱鰭片124、126相互接合並呈九十度之[ 狀夾角組合，同樣地，散熱單體1〇4、1〇6及1〇8上的散熱 鰭片124、126及128亦會與相鄰的散熱鰭片呈L狀接合。 故當散熱風扇與本發明之散熱器丨〇 〇組裝後，風扇所 產生之冷部氣流會由散熱單體1〇2、1〇4、1〇6及1〇8所形成 的流體流道延散熱器1〇〇中心處往外流出。風扇所產生之 冷卻氣流即可將散熱器丨〇〇中心部分的熱（欲散熱裝置所產 生之熱）延不同的流道散逸，如此一來，不僅1251460 V. INSTRUCTIONS (5) The heat-dissipating bases 112, 114, 116, 118 and their corresponding plurality of heat-dissipating fins 122, 124, 126, and 128 are integrally formed of a metal material such as copper, copper alloy, aluminum or aluminum alloy. production. In addition, each of the heat dissipating cells, 104, 106, and 108 respectively have a soldering surface 115 on both sides of the heat conducting bases 112, 114, 116, 118 thereof, by soldering the heat sinking unit 1〇2, 1 04, 106 And the welded surface 1 1 5 of 1 08, that is, the composite multi-flow radiator 100 of the present invention is formed. In terms of the flow direction of the fluid in the heat sink 1 , that is, the flow path of the heat sink 1 , the heat dissipation tabs 122 on each of the heat sinks 1 , 2 , 104 , 106 , 108 of the heat sink 1 , The 124, 126, and 128 series are arranged in different dimension directions. As shown in FIG. 2A, the heat dissipation fins 122 are arranged in the +χ axis direction, and the heat dissipation film 128 is arranged in the -X axis direction, and the heat dissipation fins 124 are arranged. Arranged in the direction of the Υ-axis, the heat dissipation fins 126 are arranged in the +γ axis direction, so the heat dissipation fins 122 on the heat dissipation unit 102 and the heat dissipation fins 124 and 126 on the adjacent heat dissipation units 104 and 106, respectively. They are joined to each other and are at a 90-degree angle. Similarly, the heat-dissipating fins 124, 126 and 128 on the heat-dissipating cells 1〇4, 1〇6 and 1〇8 are also adjacent to the heat-dissipating fins. L-shaped joint. Therefore, when the cooling fan is assembled with the heat sink of the present invention, the cold airflow generated by the fan is extended by the fluid flow path formed by the heat radiating cells 1〇2, 1〇4, 1〇6, and 1〇8. The radiator 1 circulates out of the center. The cooling airflow generated by the fan can dissipate the heat of the central part of the heat sink (the heat generated by the heat sink) to different flow paths, thus not only
散熱鰭片122、124、12R、0 A 4 1 ^ b 1 2 8的接觸面積，且冷卻氣流在 散熱器100之散熱單體102、104、106及108所形成的四維The contact area of the heat dissipation fins 122, 124, 12R, 0 A 4 1 ^ b 1 2 8 , and the four-dimensional formed by the cooling airflow at the heat dissipation cells 102, 104, 106, and 108 of the heat sink 100
12514601251460
散熱單體202亦且右伽& & -倒勾232，：： 接柱230，承接柱230之頂端為 倒勺232，故將散熱單體2〇2、2〇4及2〇8組合成 2 0 0後，四個承垃& 9 Q Λ * ,， 耿…、為 人f置（未_ I 勾232即可與一散熱風扇之扣 口表置（未顯不）搭配，使得散熱器200與該散熱風扇組裝 °另外，散熱單體20 2、204及208亦分別由 214、218與其對應之複數散熱鰭片222、 、銅合金、鋁或鋁合金等金屬材質以一體成 3再者，每一散熱單體20 2、204及208亦分 別具有位於其導熱底座212、214、218之周緣的焊接面 成一散熱裝置 導熱底座212 224、228 以銅 形的方式製成 以5、，藉由焊接散熱單體2〇2、204及208的焊接面215，即 形成本發明之複合式多流向散熱器2 〇 〇。 就流體在散熱器2 〇 〇的流動方向而言，與第一實施例 之散熱器1〇〇大致相同，不同之處在於散熱單體2〇2於散埶 器200中心部分的流體流道係相接通的，如此，更解決習、、 知散熱器之中心部分熱散逸不佳的缺失。 、 請參考第3C圖。第3C圖係本發明複合式多流向散熱器 2 5 0之第四較佳實施例的結構示意圖。於本實施例中，散 熱器2 5 0與散熱器2 0 0的不同之處如同第一與第二實施例之 月欠熱器100與150之差異’即散熱器250之底部另包含有_ 導熱底板240 ’其亦由銅或銅合金所製成，藉由錫膏或導 熱膠245等低熱阻黏著劑塗佈於其與散熱器25 0之接合面 215而與每一散熱單體之導熱底座膠合，其原理及功效如 同上述實施例所述，於此即不再多加贅述。 請參考第4圖。第4圖為本發明複合式多流向散熱器The heat dissipating unit 202 is also a right gamma && - barb 232, ::: the post 230, the top of the receiving post 230 is a pouring spoon 232, so the heat sink unit 2 〇 2, 2 〇 4 and 2 〇 8 combination After becoming 200, four bearers & 9 Q Λ * , , 耿 ..., for the person f (not _ I hook 232 can be matched with a cooling fan buckle table (not shown), so that The heat sink 200 is assembled with the heat dissipating fan. In addition, the heat dissipating units 20 2, 204 and 208 are also integrally formed by 214, 218 and corresponding plurality of heat dissipating fins 222, copper alloy, aluminum or aluminum alloy. Furthermore, each of the heat dissipating cells 20, 204 and 208 also has a soldering surface on the periphery of the heat conducting bases 212, 214, 218, respectively, to form a heat dissipating device, the heat conducting bases 212 224, 228 are formed in a copper shape. By welding the soldering surfaces 215 of the heat dissipating cells 2, 2, 204 and 208, the composite multi-flow radiator 2 of the present invention is formed. In terms of the flow direction of the fluid in the heat sink 2, The heat sink 1〇〇 of an embodiment is substantially the same except that the heat sink unit 2〇2 flows in the central portion of the diffuser 200. The flow channel is connected, so that it is more difficult to solve the problem of poor heat dissipation in the central part of the heat sink. Please refer to Figure 3C. Figure 3C is a composite multi-flow radiator of the present invention. A schematic view of the structure of the fourth preferred embodiment. In the present embodiment, the difference between the heat sink 250 and the heat sink 200 is the same as the difference between the first and second embodiments of the monthly heat exchangers 100 and 150. 'The bottom of the heat sink 250 further includes a heat-conducting bottom plate 240' which is also made of copper or a copper alloy, and is coated with a low thermal resistance adhesive such as solder paste or thermal conductive adhesive 245 to be bonded to the heat sink 25 0 . The surface 215 is glued to the heat-conducting base of each heat-dissipating unit, and the principle and function thereof are as described in the above embodiments, and thus will not be further described herein. Please refer to FIG. 4. FIG. 4 is a composite multi-flow heat dissipation of the present invention. Device
第12頁 1251460Page 12 1251460
3 0 0之第五較佳實施例的結構示意圖。如第4圖所示，散熱 器300係由四個散熱單體302、3 04、30 6及308所構成，每' 一散熱單體302、304、306及308分別包含有一導熱底座 312、314、316、318以及複數片散熱鰭片322、324、 3 26、328相互平行地配置於所對應之導熱底座312、314、 3 1 6、3 1 8上。於本實施例中，導熱底座3 ! 2、3 u、3 J 6、 318係四邊形底座，且散熱單體302、304、306及308亦分 別由導熱底座312、314、316、318與其對應之複數散熱鰭 片322、324、326、328以銅、銅合金、銘或銘合金等金屬 材質以一體成形的方式製成。此外，每一散熱單體3 〇 2、 304、306及308亦分別具有二面位於其導熱底座312、 314、316、318之周緣的焊接面（未顯示），藉由焊接散熱 單體302、304、3 06及308的焊接面，即形成本發明之複合 式多流向散熱器3 0 0。 就流體在散熱器3 0 0的流動方向即流道而言，本實施 例散熱器300之每一散熱單體30 2、304、30 6、308上的散 熱鰭片3 2 2、3 2 4、3 2 6、3 2 8係分別朝不同的維度方向排 列，如第4圖所示，散熱鰭片3 2 2係朝-Y軸方向排列、散熱 鰭片324係朝-X軸方向排列、散熱鰭片326係朝+X軸方向排 列、散熱鰭片328係朝+Y軸方向排列，此外，散熱單體302 上的散熱鰭片322會分別與相鄰散熱單體304、3 0 6上的散 熱鰭片324、326相互接合並呈九十度爽角組合，同樣地， 散熱單體304、306及308上的散熱鰭片324、326及328亦會 與相鄰的散熱鰭片呈九十度夾角組合。A schematic structural view of a fifth preferred embodiment of the present invention. As shown in FIG. 4, the heat sink 300 is composed of four heat dissipating units 302, 304, 306 and 308, and each of the heat dissipating units 302, 304, 306 and 308 respectively includes a heat conducting base 312, 314. 316, 318 and a plurality of heat dissipation fins 322, 324, 3 26, 328 are disposed in parallel with each other on the corresponding heat conduction bases 312, 314, 3 16 and 31. In this embodiment, the heat-conducting bases 3, 2, 3u, 3, J, and 318 are quadrangular bases, and the heat-dissipating units 302, 304, 306, and 308 are also respectively corresponding to the heat-conducting bases 312, 314, 316, and 318. The plurality of heat radiating fins 322, 324, 326, and 328 are integrally formed by a metal material such as copper, copper alloy, or inscription alloy. In addition, each of the heat dissipating cells 3 〇 2, 304, 306, and 308 also have soldering surfaces (not shown) on the periphery of the heat conducting bases 312, 314, 316, and 318, respectively, by soldering the heat sinking unit 302, The welded faces of 304, 3 06 and 308 form the composite multi-flow radiator 300 of the present invention. For the flow direction of the fluid in the heat sink 300, that is, the flow path, the heat sink fins 30 2, 2 2, 3 2 4 on each of the heat sinks 30 2, 304, 30 6 and 308 of the heat sink 300 of the present embodiment. The 3 2 6 and 3 2 8 systems are respectively arranged in different dimensional directions. As shown in FIG. 4, the heat dissipation fins 32 2 are arranged in the -Y axis direction, and the heat dissipation fins 324 are arranged in the -X axis direction. The heat dissipating fins 326 are arranged in the +X axis direction, and the heat dissipating fins 328 are arranged in the +Y axis direction. Further, the heat dissipating fins 322 on the heat dissipating unit 302 are respectively disposed on the adjacent heat dissipating units 304 and 306. The heat dissipation fins 324, 326 are joined to each other and are combined at a 90 degree angle. Similarly, the heat dissipation fins 324, 326 and 328 on the heat dissipation units 304, 306 and 308 are also adjacent to the adjacent heat dissipation fins. Ten degree angle combination.
第13頁 1251460 五、發明說明（9) 特予說明的是，本實施例之散熱器3 〇 〇亦如同散熱器 1〇〇_、200可於散熱器300之底部以錫膏或導熱膠等低熱阻 黏著劑膠合一由銅或銅合金所製成的導熱底板，其原理及 功效如同上述實施例所述，於此即不再多加贅述。 請參考第5圖。第5圖為本發明複合式多流向散熱器 4 0 0之第六較佳實施例的結構示意圖。如第5圖所示，散熱 器400係由六個散熱單體402、404、406、408、410及412 所構成，每一散熱單體4〇2、404、40 6、408、410及41 2分 別包含有一導熱底座422、424、426、428、430及432以及 複數片散熱鰭片442、444、446、448、450及452相互平行 地配置於所對應之導熱底座422、424、426、428、430及 432上。於本實施例中，導熱底座422、424、426、428、 430及4 32皆為三邊形底座，且散熱單體4〇2、4〇4、4〇6、 408、410及412亦分別由導熱底座422、424、426、428、 430及432與其對應之複數散熱鰭片442、444、446、448、 450及4 52以銅、銅合金、鋁或鋁合金等金屬材質以一體成 形的方式製成。此外，每一散熱單體4〇2、404、406、 408、410及412亦分別具有二面位於其導熱底座422、 424、426、428、430及432之周緣的焊接面（未顯示），藉 由焊接散熱單體402、404、406、408、410及412的焊接 面，即形成本發明之複合式多流向散熱器4 〇 〇。 就流體在散熱器4 0 0的流動方向即流道而言，本實施 例散熱器500之每一散熱單體402、404、406、408、410及 412上的散熱鰭片442、444、446、448、450及452係分別Page 13 1251460 V. Description of the Invention (9) It is specifically noted that the heat sink 3 of the present embodiment is also like a heat sink 1〇〇, 200, which can be solder paste or thermal conductive glue at the bottom of the heat sink 300. The low thermal resistance adhesive is bonded to a thermally conductive bottom plate made of copper or a copper alloy, and the principle and effect thereof are as described in the above embodiments, and thus no further details are provided herein. Please refer to Figure 5. Figure 5 is a schematic view showing the structure of a sixth preferred embodiment of the composite multi-flow radiator 410 of the present invention. As shown in FIG. 5, the heat sink 400 is composed of six heat dissipating units 402, 404, 406, 408, 410, and 412, and each of the heat dissipating units 4〇2, 404, 406, 408, 410, and 41 2 respectively, a heat-conducting base 422, 424, 426, 428, 430 and 432 and a plurality of heat-dissipating fins 442, 444, 446, 448, 450 and 452 are arranged parallel to each other in the corresponding heat-conducting bases 422, 424, 426, On 428, 430 and 432. In this embodiment, the heat-conducting bases 422, 424, 426, 428, 430, and 4 32 are all triangular-shaped bases, and the heat-dissipating units 4〇2, 4〇4, 4〇6, 408, 410, and 412 are also respectively The heat dissipation bases 422, 424, 426, 428, 430 and 432 and the corresponding plurality of heat dissipation fins 442, 444, 446, 448, 450 and 4 52 are integrally formed of a metal material such as copper, copper alloy, aluminum or aluminum alloy. Made in a way. In addition, each of the heat dissipating cells 4, 2, 404, 406, 408, 410, and 412 also have soldering faces (not shown) on the periphery of the thermally conductive bases 422, 424, 426, 428, 430, and 432, respectively. The composite multi-flow radiator 4 of the present invention is formed by welding the soldering faces of the heat-dissipating cells 402, 404, 406, 408, 410, and 412. The heat dissipation fins 442, 444, 446 on each of the heat dissipation units 402, 404, 406, 408, 410, and 412 of the heat sink 500 of the present embodiment are in terms of the flow direction of the fluid in the heat sink 400, that is, the flow path. , 448, 450 and 452 are respectively
第14頁 1251460 五、發明說明（10) 朝/、個的維度方向排列，如第5圖所示，此外，散熱單體 402上的散熱鰭片442會分別與相鄰散熱單體404、412上的 散熱縛片444、452相互接合並呈六十度夾角組合，同樣 地，散熱單體404、406、408、410及412上的散熱鰭片 444、44 6、448、45 0及4 52亦會與相鄰的散熱鰭片呈六十 度夾角組合。 特予說明的是，本實施例之散熱器4〇〇亦如同散熱器 100、20 0及300可於散熱器4〇〇之底部以錫膏或導熱膠等低 熱阻黏著劑膠合一由銅或銅合金所製成的導熱底板，其原 理及功效如同上述實施例所述，於此即不再多加贅述。 請參考第6圖。第6圖為本發明複合式多流向散熱器 5 0 0之第七較佳實施例的結構示意圖。如第6圖所示，散熱 器500係由三個散熱單體5〇2、5〇4及5〇6所構成，每一散熱 單體M2、504及5 0 6分別包含有一導熱底座512、514及51、6 以及複數片散熱鰭片5 2 2、5 2 4及5 2 6相互平行地配置於所 對應之導熱底座512、51 4及516上。於本實施例中，導熱 底座512略成正方形底座，而導熱底座514、516則呈長方 形底座，且散熱單體5 02、5〇4及5〇6亦分別由導熱底座 512、514及516與其對應之複數散熱鰭片522、524及526以 銅、銅合金、鋁或鋁合金等金屬材質以一體成形的方式製 成。此外，每一散熱單體50 2、5〇4及5〇6亦分別具有位於 其導熱底座512、514及516之周緣的焊接面（未顯示），藉 由焊接散熱單體5 02、504及506的焊接面，即形成本發明 之複合式多流向散熱器5 0 0。Page 14 1251460 V. Description of the Invention (10) Arranged in the dimension direction of the /, one, as shown in FIG. 5, in addition, the heat dissipation fins 442 on the heat dissipation unit 402 are respectively associated with the adjacent heat dissipation units 404, 412 The upper heat dissipation tabs 444, 452 are joined to each other and combined at an angle of sixty degrees. Similarly, the heat dissipation fins 444, 44 6 , 448 , 45 0 , and 4 52 on the heat dissipation units 404 , 406 , 408 , 410 , and 412 . It will also be combined with adjacent fins at an angle of sixty degrees. It is to be noted that the heat sink 4 of the present embodiment is also like the heat sinks 100, 20 0 and 300. The bottom of the heat sink 4 can be glued with a low thermal resistance adhesive such as solder paste or thermal conductive adhesive. The principle and function of the heat-conducting bottom plate made of copper alloy are as described in the above embodiments, and thus will not be further described herein. Please refer to Figure 6. Figure 6 is a schematic view showing the structure of a seventh preferred embodiment of the composite multi-flow radiator 500 of the present invention. As shown in FIG. 6, the heat sink 500 is composed of three heat dissipating units 5〇2, 5〇4, and 5〇6, and each of the heat dissipating units M2, 504, and 506 includes a heat conducting base 512, 514 and 51, 6 and a plurality of fins 5 2 2, 5 2 4 and 5 2 6 are arranged in parallel with each other on the corresponding heat conducting bases 512, 51 4 and 516. In this embodiment, the heat-conducting base 512 is slightly squared, and the heat-conducting bases 514, 516 are rectangular bases, and the heat-dissipating units 052, 5〇4, and 5〇6 are also respectively covered by the heat-conducting bases 512, 514, and 516. The corresponding plurality of heat radiating fins 522, 524, and 526 are integrally formed by a metal material such as copper, copper alloy, aluminum, or aluminum alloy. In addition, each of the heat dissipating units 50 2, 5 〇 4, and 5 〇 6 also have soldering surfaces (not shown) on the periphery of the heat conducting bases 512, 514, and 516, respectively, by soldering the heat radiating units 5 02, 504 and The welded surface of 506 forms the composite multi-flow radiator 500 of the present invention.
1251460 五、發明說明（π) 就流體在散熱器5 0 0的流動方向即流道而言，本實施 例散熱器500之散熱單體5〇2上的散熱鰭片522係朝+χ與—χ 方向排列’且散熱單體504及5〇6係分別朝—γ及+ γ的維度方 ^排列，如第6圖所示。此外，散熱單體5〇2上最外兩側的 散熱鰭片522會分別與散熱單體5〇4、5〇6上的每一散熱鱗 片524、526相互接合並呈九十度夾角組合。此外，本實施 例之散熱器50 0亦如同散熱器1〇〇、2〇〇、3〇〇及4〇〇可於貝散也 熱器5 00之底部以錫膏或導熱膠等低熱阻黏著劑膠合一 1 銅或銅合金所製成的導熱底板，其原理及功效如同上 施例所述，於此即不再多加贅述。 貝 特予說明的是，本發明上述各實施例之複合式 散熱器100、150、200、250、300、40 0 及500 之每一^埶 單體的導熱底座與散熱鰭片的組合方式不僅可以」體、、1251460 V. Description of Invention (π) In terms of the flow direction of the fluid in the heat sink 500, that is, the heat sink fins 522 on the heat sink unit 5〇2 of the heat sink 500 of the present embodiment are oriented toward +χ and - χ Alignment ' and the heat-dissipating cells 504 and 5 〇 6 are arranged in the dimensions of -γ and + γ, respectively, as shown in Fig. 6. In addition, the heat dissipating fins 522 on the outermost sides of the heat dissipating unit 5〇2 are respectively joined to each of the heat dissipating fins 524 and 526 on the heat dissipating units 5〇4 and 5〇6 and are combined at an angle of ninety degrees. In addition, the heat sink 50 0 of the embodiment is also like the heat sinks 1 〇〇, 2 〇〇, 3 〇〇 and 4 〇〇 can be adhered to the bottom of the shell heater 5 00 with low thermal resistance such as solder paste or thermal conductive glue. The glue and the heat-conducting base plate made of copper or copper alloy have the principle and effect as described in the above embodiment, and thus will not be further described herein. The combination of the heat-conducting base of each of the composite heat sinks 100, 150, 200, 250, 300, 40 0 and 500 of the above embodiments of the present invention and the heat sink fins is not only described in detail. Can be "body,
成丄也可以採焊接等加工方式將導熱底座U =緊=方匕導熱底座上形成複數條溝槽再將散-ί ^以緊配的方式安插於對應之溝槽中。此外，ϋ 早體上的散熱鰭片也可以以焊接等加工方式彼此人1… 相較於習知技術，本發明提供一種 : 度之流道的散熱單體所組成之複合式多产:=不同維 加散熱器整體的散熱效果。此^文^佳的情形，進而增 計成”同形狀的多邊形導熱底座或二月也：設 以上所述僅為舉例性散熱器。 而非為限制性者。任何未脫離 1251460 五、發明說明（12) 本發明之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。Chengyu can also use welding and other processing methods to form a plurality of grooves on the heat-conducting base U = tight = square heat-conducting base and then insert the dispersion into the corresponding groove in a tight fit manner. In addition, the heat dissipating fins on the aging body can also be processed by welding or the like to each other. Compared with the prior art, the present invention provides a composite prolific consisting of: heat dissipating cells of the flow channel:= The overall heat dissipation effect of different Vega radiators. This case is better, and is added to the same shape of the polygonal heat-conducting base or February: the above description is only an exemplary heat sink. It is not a limitation. Anything is not separated from 1251460. (12) The spirit and scope of the present invention, and equivalent modifications or alterations thereof are intended to be included in the scope of the appended claims.
第17頁 1251460 圖式簡單說明 第1 A圖係一習知散熱裝置之結構示意圖。 第1 B圖係另一習知散熱裝置之結構示意圖。 第2A圖與第2B圖為本發明複合式多流向散熱器之第一 較佳實施例的結構示意圖。 第2C圖係本發明複合式多流向散熱器之第二較佳實施 例的結構示意圖。 第3A圖與第3B圖為本發明複合式多流向散熱器之第三 較佳實施例的結構示意圖。 第3C圖係本發明複合式多流向散熱器之第四較佳實施 例的結構示意圖。 第4圖為本發明複合式多流向散熱器之第五較佳實施 例的結構示意圖。 第5圖為本發明複合式多流向散熱器之第六較佳實施 例的結構不意圖。 第6圖為本發明複合式多流向散熱器之第七較佳實施 例的結構不意圖。Page 17 1251460 Brief Description of the Drawings Figure 1A is a schematic view of the structure of a conventional heat sink. Figure 1B is a schematic view showing the structure of another conventional heat sink. 2A and 2B are schematic views showing the structure of a first preferred embodiment of the composite multi-flow radiator of the present invention. Fig. 2C is a schematic view showing the structure of a second preferred embodiment of the composite multi-flow radiator of the present invention. 3A and 3B are schematic views showing the structure of a third preferred embodiment of the composite multi-flow radiator of the present invention. Fig. 3C is a schematic view showing the structure of a fourth preferred embodiment of the composite multi-flow radiator of the present invention. Fig. 4 is a structural schematic view showing a fifth preferred embodiment of the composite multi-flow radiator of the present invention. Fig. 5 is a schematic view showing the structure of a sixth preferred embodiment of the composite multi-flow radiator of the present invention. Fig. 6 is a schematic view showing the structure of a seventh preferred embodiment of the composite multi-flow radiator of the present invention.
元件符號說明 1 0、5 0 散熱裝置 2 2 扇框 26 扇葉 32、72 導熱底座 100^150^200^ 250 熱器Component symbol description 1 0, 5 0 Heat sink 2 2 Fan frame 26 Fan blade 32, 72 Thermal base 100^150^200^ 250 Heater
20 24 30 ^ 70 34 ^ 74 >300 、 400 、 500 軸流式風扇 輪轂 散熱器 散熱鰭片 複合式多流向散20 24 30 ^ 70 34 ^ 74 >300, 400, 500 Axial Fans Hubs Radiators Radiator Fins Composite Multi-Flow Dispersion
第18頁 1251460 圖式簡單說明 102 、 104 206 506 112 216 516 122 226 526 115 140 132 208 114 218 124 228 215 240 232 106 406 116 426 126 446 108 408 118 428 128 448 焊接面 導熱底板 倒勾 306 、 308 、 402 、 404 、 202 、 204 410 、 412 、 302 、 304 、 502 、 504 散熱單體 316 、 318 、 422 、 424 、 212 、 214 430、 432、 312、 314、 512、 514 導熱底座 326 、 328 、 442 > 444 、 111 、 224 450 、 452 > 322 > 324 〜522 > 524 散熱鰭片 145、245 導熱膠 1 3 0、2 3 0 承接柱Page 18 1251460 Schematic description 102, 104 206 506 112 216 516 122 226 526 115 140 132 208 114 218 124 228 215 240 232 106 406 116 426 126 446 108 408 118 428 128 448 Soldering surface thermal floor back bar 306 308, 402, 404, 202, 204 410, 412, 302, 304, 502, 504 heat sinking units 316, 318, 422, 424, 212, 214 430, 432, 312, 314, 512, 514 thermally conductive bases 326, 328 , 442 > 444 , 111 , 224 450 , 452 > 322 > 324 ~ 522 > 524 Heat sink fins 145 , 245 Thermal paste 1 3 0 , 2 3 0 Support column
第19頁Page 19
Claims (1)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW093100494A TWI251460B (en) | 2004-01-09 | 2004-01-09 | Compound heat sink with multi-directional fins |
| JP2004082027A JP2005197625A (en) | 2004-01-09 | 2004-03-22 | Compound multiflow heat dispersion device |
| DE102004023819A DE102004023819A1 (en) | 2004-01-09 | 2004-05-13 | Heat sinks and passages thereof with multiple directions |
| US10/849,160 US20050150637A1 (en) | 2004-01-09 | 2004-05-20 | Heat sink and multi-directional passages thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW093100494A TWI251460B (en) | 2004-01-09 | 2004-01-09 | Compound heat sink with multi-directional fins |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200524514A TW200524514A (en) | 2005-07-16 |
| TWI251460B true TWI251460B (en) | 2006-03-11 |
Family
ID=34738166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093100494A TWI251460B (en) | 2004-01-09 | 2004-01-09 | Compound heat sink with multi-directional fins |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20050150637A1 (en) |
| JP (1) | JP2005197625A (en) |
| DE (1) | DE102004023819A1 (en) |
| TW (1) | TWI251460B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM339033U (en) * | 2008-04-16 | 2008-08-21 | Asia Vital Components Co Ltd | Heat sink |
| CN101641001B (en) * | 2008-07-28 | 2011-11-09 | 富准精密工业(深圳)有限公司 | Radiating device |
| US9051943B2 (en) | 2010-11-04 | 2015-06-09 | Hamilton Sundstrand Corporation | Gas turbine engine heat exchanger fins with periodic gaps |
| JP2017098274A (en) * | 2014-03-27 | 2017-06-01 | 三菱電機株式会社 | Heat sink device |
| CN105022461B (en) * | 2014-04-21 | 2019-05-21 | 昆山新力精密五金有限公司 | Structure improved heat sinking mould group |
| AT515828B1 (en) | 2014-05-23 | 2022-02-15 | Fronius Int Gmbh | Cooling device and inverter housing with such a cooling device |
| JP7326953B2 (en) * | 2019-07-17 | 2023-08-16 | 富士電機株式会社 | Cooling system |
| WO2021148140A1 (en) * | 2020-01-24 | 2021-07-29 | Huawei Technologies Co., Ltd. | A heatsink with increased air flow |
| EP4068927B1 (en) * | 2021-04-01 | 2024-07-03 | Ovh | Immersion cooling system with dual dielectric cooling liquid circulation |
| US11924998B2 (en) | 2021-04-01 | 2024-03-05 | Ovh | Hybrid immersion cooling system for rack-mounted electronic assemblies |
| US11729950B2 (en) | 2021-04-01 | 2023-08-15 | Ovh | Immersion cooling system with dual dielectric cooling liquid circulation |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2554980B1 (en) * | 1983-11-10 | 1986-01-17 | Socapex | CONNECTOR WITH ZERO INSERTION FORCE FOR RECTANGULAR CIRCUIT SUPPORT AND CLOSING CLIP FOR SUCH CONNECTOR |
| US4733293A (en) * | 1987-02-13 | 1988-03-22 | Unisys Corporation | Heat sink device assembly for encumbered IC package |
| US5375655A (en) * | 1993-03-31 | 1994-12-27 | Lee; Yong N. | Heat sink apparatus |
| US5370178A (en) * | 1993-08-25 | 1994-12-06 | International Business Machines Corporation | Convertible cooling module for air or water cooling of electronic circuit components |
| TW265430B (en) * | 1994-06-30 | 1995-12-11 | Intel Corp | Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system |
| US5582240A (en) * | 1994-09-19 | 1996-12-10 | Motorola, Inc. | Pneumatically coupled heat sink assembly |
| US5927385A (en) * | 1998-01-21 | 1999-07-27 | Yeh; Ming Hsin | Cooling device for the CPU of computer |
| JP3552559B2 (en) * | 1998-03-11 | 2004-08-11 | 株式会社デンソー | Heating element cooling device |
| TW376171U (en) * | 1998-11-24 | 1999-12-01 | Foxconn Prec Components Co Ltd | Radiating device |
| US6199624B1 (en) * | 1999-04-30 | 2001-03-13 | Molex Incorporated | Folded fin heat sink and a heat exchanger employing the heat sink |
| US20020018338A1 (en) * | 2000-01-11 | 2002-02-14 | Mccullough Kevin A. | Insert molded heat sink assembly |
| US20020109970A1 (en) * | 2000-12-18 | 2002-08-15 | Samsung Electro-Mechanics Co., Ltd. | Heat sink for cooling electronic chip |
| US6415852B1 (en) * | 2001-01-11 | 2002-07-09 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
| JP3529358B2 (en) * | 2001-02-07 | 2004-05-24 | 古河電気工業株式会社 | Finned heat sink |
| US6418020B1 (en) * | 2001-03-30 | 2002-07-09 | Advanced Thermal Technologies | Heat dissipation device with ribbed fin plates |
| US6972950B1 (en) * | 2002-06-06 | 2005-12-06 | Raytheon Company | Method and apparatus for cooling a portable computer |
-
2004
- 2004-01-09 TW TW093100494A patent/TWI251460B/en not_active IP Right Cessation
- 2004-03-22 JP JP2004082027A patent/JP2005197625A/en active Pending
- 2004-05-13 DE DE102004023819A patent/DE102004023819A1/en not_active Withdrawn
- 2004-05-20 US US10/849,160 patent/US20050150637A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| TW200524514A (en) | 2005-07-16 |
| US20050150637A1 (en) | 2005-07-14 |
| DE102004023819A1 (en) | 2005-08-04 |
| JP2005197625A (en) | 2005-07-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |