TW200524514A - Compound heat sink with multi-directional fins - Google Patents
Compound heat sink with multi-directional fins Download PDFInfo
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- TW200524514A TW200524514A TW093100494A TW93100494A TW200524514A TW 200524514 A TW200524514 A TW 200524514A TW 093100494 A TW093100494 A TW 093100494A TW 93100494 A TW93100494 A TW 93100494A TW 200524514 A TW200524514 A TW 200524514A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
200524514 五、發明說明（1) 【發明所屬之技術領域j 本發明係揭露一籍％勒盟 維洚少、*沾邶舶 種政…器，尤指一種由複數個具不同 ，准度之&道的政熱單體所組成之複合式多流向散熱器。 【先前技術】 隨著電子裝置效能沾τ i & 已成為現行電子褒置散熱裝置或散熱系統 置所產生之熱能若不加以；=配備之- ’因為電子裝 差，重則會導致電：：： 散逸，輕則造成效能變 件（例如積體電路）❿n “ m : : f對於斂電子70 L7 » 44 ai ^ ^ ^ 。更疋重要’因為隨著集積度的增加 門時每ΐ位彳面穑张步，使得積體電路的面積不斷地縮小， = = 積的熱能亦相對地會更高，故高散熱 效此j ^ ”、、j置一直是電子產業界所積極研發的對象。 瓜而:政熱裝置係置於一欲散熱裝置（例如CPU) A米勒壯、斤產生的熱月匕。清參考第1 A圖。第1A圖 係一 S知散熱裝置10之結構示意圖。如第1A圖所示，散孰 裝置10包含有—軸流式風扇(axial-flow fan)20以及一散 熱器3 0。軸流式風启？ η呈古 Φ 〇〇 θ 扇 有一扇 一輪轂（hub)24以 數片扇葉26形成於輪轂24周圍。散熱器30係由一導熱 底座3 2以及複數片散熱鰭片3 4所組成。 、且裝政…、裝置1 〇時，係將風扇2 0鎖固於散熱器3 〇之散 熱鰭片34上’之後，#將一欲散熱裝置（未顯示，例如一 中央處理器）貼附於散熱器30之導熱底座32的底部中央。 風扇20的輪轂24係對位於散熱器3〇的中央區域上，而複數200524514 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention discloses a device that has a high percentage of Lexicon, and has a unique policy, especially a type of & The composite multi-flow radiator composed of the political and thermal monomer. [Previous technology] With the effectiveness of electronic devices, τ i & has become the current electronic heat sink or heat sink, if the heat generated is not added; = Equipped with-'Because of poor electronic equipment, heavy electricity will cause electricity :: ： Divergence, then it will cause performance variation (eg integrated circuit) ❿n “m:: f is for the convergence electron 70 L7» 44 ai ^ ^ ^. It is more important because every gate position is increased as the degree of integration increases. With each step, the area of the integrated circuit is continuously reduced, and the thermal energy of the product will be relatively higher. Therefore, the high heat dissipation efficiency, j, and j, have been actively researched and developed by the electronics industry. Guar: The political heat device is placed in a heat-dissipating device (such as a CPU). Refer to Figure 1A. FIG. 1A is a schematic structural diagram of a heat sink 10. As shown in Fig. 1A, the cooling device 10 includes an axial-flow fan 20 and a heat sink 30. Axial flow wind start? η is an ancient Φ 〇〇 θ fan There is a fan and a hub 24 formed around the hub 24 with several blades 26. The heat sink 30 is composed of a heat conducting base 32 and a plurality of heat radiating fins 34. And installation ... When device 10 is installed, the fan 20 is locked to the heat sink fin 34 of the heat sink 30, and then a device (not shown, such as a central processing unit) to which a heat sink is to be attached is attached. The center of the bottom of the heat-conducting base 32 of the heat sink 30. The hub 24 of the fan 20 is located on the central area of the radiator 30, and a plurality of
第6頁 200524514 五、發明說明（2)Page 6 200524514 V. Description of the invention (2)
片扇葉2 6則對位於環繞該中央區域之外圍的週邊區域上。 當該欲散熱裝置所產生之熱能傳導至散熱器3 〇時，熱 能會由導熱底座32的底部中央傳導至各散熱鰭片34，接 著’再藉由風扇20的吹拂而將該欲散熱裝置所產生之熱能 散逸。由上述可知，當該欲散熱裝置產生熱能時，散熱器 30之中央區域為熱能主要集中之區域，其次，朝週邊區域 逐漸遞減。然而，對於習知散熱裝置丨〇而言，散熱器3〇之 中央區域的散熱效果卻是最差的，而其週邊區域的散熱效 果較好’因其中央區域係位於風扇2〇之輪轂24的下方，而 輪轂24對於風扇20形成冷卻氣流以帶走熱能是毫無助益 的。此外，習知散熱器30之散熱鰭片34係朝單一方向（如The fan blades 26 are located on the peripheral area surrounding the periphery of the central area. When the thermal energy generated by the device to be dissipated is transmitted to the heat sink 30, the thermal energy will be conducted from the center of the bottom of the thermally conductive base 32 to each of the heat dissipation fins 34, and then the device to be dissipated by the fan 20 will be blown. The heat generated is dissipated. It can be known from the above that when the heat-dissipating device generates thermal energy, the central region of the heat sink 30 is a region where the thermal energy is mainly concentrated, and secondly, it gradually decreases toward the peripheral region. However, for the conventional heat sink device, the heat dissipation effect in the central region of the radiator 30 is the worst, and the heat dissipation effect in the peripheral region is better because the central region is located at the hub 24 of the fan 20. And the hub 24 is not helpful for the fan 20 to form a cooling airflow to take away the heat energy. In addition, the radiating fins 34 of the conventional heat sink 30 are oriented in a single direction (such as
第1 A圖 2 6所產 熱器3 0 20所產 流出。 擊散熱 流出， 的流場 對散熱 所示之Y轴方向）排列，當風扇2 〇運轉時， 生之氣流係延扇葉2 6周緣之切線方向流出，故，黄 之氣體流道僅會在γ軸方向形成，也就是說，風扇 生之冷卻氣流主要係由散熱鰭片3 4之間的縫隙兩你 再者’扇葉2 6延X軸方向所產生之氣流必先正面衝 *鰭片3 4後才被迫轉向至散熱鰭片3 4之間的縫隙兩相 因此，由風扇20產生之冷卻氣流在散熱鰭片34之段 很不順暢’並且其流速會受到阻礙及遲滯，故，多 器30之中央區域的冷卻效果不佳是可以理解的。Fig. 1 A Fig. 2 Heater 3 0 20 produced Outflow. The flow field is aligned with the direction of the Y axis shown by the heat radiation). When the fan 200 is running, the raw air current flows out along the tangential direction of the periphery of the fan blade 26. Therefore, the yellow gas flow channel will only γ axis formation, that is to say, the cooling airflow generated by the fan is mainly caused by the gap between the heat sink fins 3 and 4. The airflow generated by the fan blade 2 6 in the X axis direction must first be punched forward * fins After 34, it was forced to turn to the two phases of the gap between the cooling fins 34. Therefore, the cooling airflow generated by the fan 20 is not smooth in the section of the cooling fins 34 ', and its flow rate will be obstructed and delayed, so, The poor cooling effect in the central region of the multi-device 30 is understandable.
5月參考第1 B圖。第1 B圖係另一習知散熱裝置5 〇之結構 示意圖。如第1B圖所示，為解決散熱器30之流道不足的問 題，散熱器70之散熱鰭片74亦延圖示之Y軸方向平行配置 於導熱底座72上且留有一預定間隔，使得散熱器7Q在X軸Refer to Figure 1B for May. Fig. 1B is a schematic structural diagram of another conventional heat sink 50. As shown in FIG. 1B, in order to solve the problem of insufficient flow channels of the heat sink 30, the heat dissipation fins 74 of the heat sink 70 are also arranged parallel to the Y-axis direction on the heat conduction base 72 with a predetermined interval, so that heat is dissipated. 7Q on the X axis
200524514 五、發明說明（3)200524514 V. Description of Invention (3)
及Y軸方向皆形成有衩數之氣體流道。然而，雖然散熱器 7 0之設計可增加其中央區域之流道，使得風扇2 0所產生之 冷卻氣流可經由不同之維度（X軸及Y軸方向）流經散熱器70 之中央區域，但是，此設計會使得散熱器70之散熱鰭片74 的整體表面積降低（大約30%)，因此，降低了散熱裝置5〇 整體的對流效果，如此亦無法有效地將欲散熱裝置所產生 之熱能散逸。此外’風扇2 0所產生之冷卻氣流在散熱器7 〇 之X軸及Y軸方向流遂上會互相撞擊，而導致冷卻氣流的流 阻增加，使得流出散熱鰭片7 4之冷卻氣流的流速及流量均 大大降低，如此，亦無法解決該欲散熱裝置的散熱問題。 【發明内容 因此， 之流道的散 解決習知散 散熱器整體 本發明 熱單體包含 行地配置於 熱縛片係分 依據本 可設計成具 角形導熱底 器，其不僅 本發明之目 熱單體所組 熱器中心區 的散熱效果 之散熱器係 一導熱底座 該導熱底座 別地朝相異 發明所揭露 不同形狀的 座或扇形導 能改善散熱 的在提供一種由複數個具不同維度 成之複合式多流向散熱器，以有效 域散熱效果不佳的情形，進而增加 〇 由複數個散熱單體所組成，每一散 以及複數片散熱鰭片，彼此相互平 上’且相鄰二散熱單體之複數片散 之方向排列。 之複合式多流向散熱器，散熱單體 多邊形導熱底座或以更多的等腰三 熱底座而組合成具更多流道的散轨 器中心區域流道不足的問題，更能Gas flow channels are formed in the Y-axis direction. However, although the design of the radiator 70 can increase the flow path in the central area, the cooling airflow generated by the fan 20 can flow through the central area of the radiator 70 through different dimensions (X-axis and Y-axis directions), but This design will reduce the overall surface area of the radiating fins 74 of the heat sink 70 (about 30%). Therefore, the overall convection effect of the heat sink 50 will be reduced, and it will not be possible to effectively dissipate the heat generated by the heat sink. . In addition, the cooling airflow generated by the fan 20 will collide with each other in the X-axis and Y-axis directions of the radiator 70, resulting in an increase in the flow resistance of the cooling airflow, which will cause the flow rate of the cooling airflow flowing out of the cooling fins 74. And the flow rate is greatly reduced. In this way, the heat dissipation problem of the heat dissipation device cannot be solved. [Summary of the Invention] Therefore, the cooling solution of the flow channel is known as a conventional radiator. The thermal monomer of the present invention includes a row of heat-dissipating fins, which can be designed as an angular thermal conductive base, which is not only the purpose of the present invention. The heat dissipation effect of the central area of the heat unit of a single unit is a heat conducting base. The heat conducting base is facing differently. The differently shaped seats or fan-shaped guides disclosed in the invention can improve heat dissipation. The composite multi-directional heat sink is used to reduce the effective cooling effect in the effective region, and it is further increased. It is composed of a plurality of heat sinks, each of which and a plurality of heat sink fins are flat on each other 'and adjacent two heat sinks. The plural pieces of a single body are arranged in a scattered direction. The compound multi-flow direction radiator, heat dissipation monomer, the polygonal heat conduction base or the combination of more isosceles and three heat bases to form a diffuser with more flow channels. The problem of insufficient flow channels in the central area of the diffuser is more effective.
200524514 五、發明說明（4) 增加流體與散熱鰭片之間的接觸面積，進而增加散熱器整 體的散熱效果。 【實施方式】 為了詳述本發明複合式多流向散熱器的特色，以下僅 提供本發明散熱器之較佳實施例及相關圖示之闡述，當 然’本發明之複合式多流向散熱器亦與一散熱風扇互相搭 配組合而對一欲散熱裝置提供最佳的散熱效果，以下即不 再對散熱風扇及欲散熱裝置加以詳述。 請參考第2A圖與第2B圖。第2A圖與第2B圖為本發明複修 合式多流向散熱器1 0 0之第一較佳實施例的結構示意圖。 如第2A圖與第2B圖所示，散熱器1〇〇係由四個散熱單體 102、1〇4、1〇6及108所構成，每一散熱單體i〇2、1〇4、 工〇6及1〇8分別包含有一導熱底座112、ιΐ4、116、118以及 複數片散熱鰭片1 2 2、1 2 4、1 2 6、1 2 8相互平行地配置於所 對應之導熱底座112、114、116、118上。散熱單體1〇2、 108的導熱底座112、118係三邊形底座，而散熱單體1〇4、 106的導熱底座114、116係五邊形底座，此外，散熱單體 1〇4、1〇6之二側分別具有兩個承接柱13〇，承接柱13〇之頂雌 端為一倒勾132，故將散熱單體102、1〇4、1〇6及1〇8組合籲 成政熱器1 0 0後，四個承接柱1 3 〇之倒勾丨3 2即可與一散熱 ，，之扣合裝置（未顯不）搭配，使得散熱器丨〇 〇與該散熱 風扇組裝成一散熱裝置。 於本實施例中，散熱單體102、1〇4、1〇6及1〇8係分別200524514 V. Description of the invention (4) Increase the contact area between the fluid and the heat dissipation fins, thereby increasing the heat dissipation effect of the heat sink as a whole. [Embodiment] In order to detail the features of the composite multi-flow direction radiator of the present invention, only the preferred embodiments of the radiator of the present invention and the related illustrations are provided below. Of course, the 'composite multi-flow direction radiator of the present invention is also related to A cooling fan is matched and combined with each other to provide the best cooling effect for a device to be cooled. The cooling fan and the device to be cooled are not described in detail below. Please refer to Figures 2A and 2B. FIG. 2A and FIG. 2B are schematic structural diagrams of the first preferred embodiment of the repaired multi-flow direction radiator 100 of the present invention. As shown in FIG. 2A and FIG. 2B, the heat sink 100 is composed of four heat radiation units 102, 104, 106, and 108, and each heat radiation unit 102, 104, Workers 06 and 108 respectively include a thermally conductive base 112, ι4, 116, 118, and a plurality of cooling fins 1 2 2, 1 2 4, 1, 2 6, and 1 2 8 arranged parallel to each other on the corresponding thermally conductive base. 112, 114, 116, 118. The heat-conducting bases 112 and 118 of the heat-dissipating monomers 108 and 108 are triangular bases, while the heat-conducting bases 114 and 116 of the heat-dissipating monomers 104 and 106 are pentagonal bases. In addition, the heat-dissipating monomers 104 and 116 are pentagonal bases. There are two receiving posts 13o on the two sides of 106. The top female end of the receiving post 13 is an inverted hook 132. Therefore, the heat sink 102, 104, 106, and 108 are combined into one. After the government heater 100, the four hooks of the four receiving posts 1330 can be combined with a heat sink, and the fastening device (not shown) can be matched, so that the heat sink 丨 〇〇 is assembled with the cooling fan Into a heat sink. In this embodiment, the heat sinks 102, 104, 106, and 108 are respectively
200524514 五、發明說明（5) 由導熱底座112、Π4、116、118與其對應之複數散熱·鰭片 122、、124、126、128以銅、銅合金、鋁或鋁合金等金屬材 λ以一體成形的方式製成。此外，每一散熱單體、 104、106及108分別具有二面位於其導熱底座112、ιΐ4、 1 1 6、1 1 8之周緣的焊接面丨丨5，藉由焊接散熱單體丨〇 2、 104、106及108的焊接面115，即形成本發明之 向散熱器100。 口式夕w 就流體在散熱器1〇〇的流動方向即流道而言，本發明 第一實施例散熱器100之每一散熱單體1〇2、1〇4、1〇6、 1^8上的散熱鰭片122、124、126、128係分別朝不同的維 ^方向排列，如第2Α圖所示，散熱鰭片122係朝+χ軸方向 #列、散熱鰭片1 28係朝-X軸方向排列、散熱鰭片j 24係 朝一Υ，方向排列、散熱鰭片126係朝+Υ軸方向排列，故’、， =熱單體102上的散熱鰭片122會分別與相鄰散熱單體 〇4、1〇6上的散熱鰭片124、126相互接合並呈九十度之[ 角組合，同樣地，散熱單體、106及108上的"散埶 ·、、曰片124/ 126及128亦會與相鄰的散熱鰭片呈^狀接合。…、 故當散熱風扇與本發明之散熱器丨〇 〇組裴後，風扇所 ft之冷卻氣流會由散熱單體102、104、1〇6及1〇8所%占 ^體流道延散熱器100中心處往外流出。風扇所產生:成 :P :流即可將散熱器10"心部分的熱（欲散熱裝置所產 之熱）延不同的流道散逸，如此一來， 散埶铐Η 1 9 9 1 〇 , ρ丨罜〜加机體與 散妖= 4、126、128的接觸面積，且冷卻氣流在 ‘、、、器1〇〇之散熱單體102、104、106及108所形成的四維200524514 V. Description of the invention (5) The heat-conducting base 112, Π4, 116, 118 and its corresponding plural heat dissipation. The fins 122, 124, 126, 128 are integrated with metal materials such as copper, copper alloy, aluminum or aluminum alloy. Made by forming. In addition, each of the heat sinks 104, 106, and 108 has a welding surface with two sides located on the periphery of its thermally conductive base 112, ι4, 1, 16 and 1 18, respectively. 5 The welding surfaces 115 of, 104, 106 and 108 form the directional heat sink 100 of the present invention. In terms of the flow direction of the fluid in the radiator 100, that is, the flow path, each of the heat dissipation cells 102, 104, 106, and 1 ^ of the radiator 100 in the first embodiment of the present invention The radiating fins 122, 124, 126, and 128 on 8 are arranged in different dimensions, respectively. As shown in FIG. 2A, the radiating fins 122 are oriented in the + χ axis direction # column, and the radiating fins 1 and 28 are oriented -The X-axis direction, the heat dissipation fins j 24 are aligned, and the heat dissipation fins 126 are aligned toward the + Υ axis. Therefore, the heat dissipation fins 122 on the thermal unit 102 are adjacent to each other. The radiating fins 124 and 126 on the heat radiating monomers 04 and 106 are bonded to each other and form a 90-degree angle combination. Similarly, the " San 埶, 、, and fins on the heat radiating monomers 106 and 108 are similar. 124/126 and 128 will also join with the adjacent heat sink fins. ... Therefore, when the cooling fan and the radiator of the present invention are combined, the cooling airflow ft of the fan will be accounted for by the cooling channel 102, 104, 106, and 108. The center of the device 100 flows out. The fan produces: Cheng: P: The heat can dissipate the heat of the radiator 10 " (the heat generated by the heat sink) along different channels to dissipate. In this way, the dispersal is 1 9 9 1 〇, ρ 丨 罜 ~ Add the four-dimensional area formed by the contact area between the body and the demon monster = 4, 126, 128, and the cooling airflow in the heat sinks 102, 104, 106, and 108
200524514200524514
五、發明說明（6) 流道上也不會互相撞擊，使得流出散熱鰭片丨2 2、1 2 4、 1 26、1 28之冷卻氣流的流速及流量均大大提昇，如此，亦 增加散熱器1 0 0整體的散熱效能。 ' 請參考第2C圖。第2C圖係本發明複合式多流向散熱器 1 50之第二較佳實施例的結構示意圖。於本實施例中，^ 熱器150與散熱器1〇〇的不同之處在於：散熱器15〇之底部 另包含有一導熱底板140，其係由銅或銅合金所製成，由 於銅的熱傳導性較其它金屬佳，故，一欲散熱裝置（例 如：CPU)可貼附於導熱底板丨40之外表面中央處，如此， 可藉由導熱底板140將該欲散熱裝置所產生的熱迅速地傳 導至每一散熱單體上。此外，於本實施例中，導熱底板 1 4 0係以錫貧或導熱膠1 4 5等低熱阻黏著劑塗佈於其與散熱 器150之接合面而與每一散熱單體之導熱底座膠合，因、 此，也降低了散熱器150與該欲散熱裝置之間的熱阻，使 得本發明之散熱器150具有更佳之散熱效果。 請參考第3A圖與第3B圖。第3A圖與第3B圖為本發明複 合式多流向散熱器20 0之第三較佳實施例的結構示意圖。 如第3A圖與第3B圖所示，散熱器2〇〇與第一實施例散熱器 100的不同之處在於：散熱器2〇〇係由三個散熱單體、 204及108所構成，每一散熱單體2〇2、2〇4及1〇8分別包含 有一導熱底座212、214、218以及複數片散熱鰭片222、 224 228相互平行地配置於所對應之導熱底座212、214、 218上。政熱單體2〇4、2〇8的導熱底座214、218係三邊形 底座，而散熱單體2 02的導熱底座212係呈沙漏狀。此外， 200524514 五、發明說明（7) 散熱單體202亦具有四個承接柱23〇，承接柱23〇之 一倒勾232，故將散熱單體2〇2、2〇4及2〇8組合成散熱’、、、 20 0後，四個承接柱230之倒勾232即可與一散熱風扇之^ 合裝置（未顯示）搭配，使得散熱器200與該散熱風扇組^ 成一散熱裝置。另外，散熱單體20 2、204及208亦分別^ 導熱底座212、214、218與其對應之複數散熱鰭片222、 2 24、2 28以銅、銅合金、鋁或鋁合金等金屬材質以一體 形的方式製成。再者，每一散熱單體202、204及208亦分 別具有位於其導熱底座212、214、218之周緣的焊接面 215，藉由焊接散熱單體202、2〇4及2〇8的焊接面215， 形成本發明之複合式多流向散熱器2 〇 〇。 就流體在散熱器2 0 0的流動方向而言，與第一實施例 之散熱器1 00大致相同，不同之處在於散熱單體2〇2於散熱 器200中心部分的流體流道係相接通的，如此，更解決習… 知散熱器之中心部分熱散逸不佳的缺失。 請參考第3C圖。第3C圖係本發明複合式多流向散熱器 250之第四較佳實施例的結構示意圖。於本實施例中/'黄/ 熱器250與散熱器200的不同之處如同第一與第二實施例之 散熱器100與150之差異，即散熱器250之底部另包含有_ 導熱底板240 ’其亦由銅或銅合金所製成，藉由錫膏或導 熱膠245等低熱阻黏著劑塗佈於其與散熱器25〇之接合面 215而與每一散熱單體之導熱底座膠合，其原理及功效如 同上述實施例所述，於此即不再多加贅述。 請參考第4圖。第4圖為本發明複合式多流向散熱器V. Explanation of the invention (6) The flow channels will not collide with each other, so that the cooling airflow velocity and flow rate of the cooling fins flowing out of the cooling fins 2 2, 1 2 4, 1, 26, 1 28 are greatly increased. 1 0 0 overall cooling performance. 'Please refer to Figure 2C. FIG. 2C is a schematic structural diagram of a second preferred embodiment of the composite multi-directional heat sink 150 according to the present invention. In this embodiment, the difference between the heat sink 150 and the heat sink 100 is that the bottom of the heat sink 150 further includes a thermally conductive bottom plate 140, which is made of copper or a copper alloy. Due to the heat conduction of copper The performance is better than other metals. Therefore, a heat dissipation device (such as a CPU) can be attached to the center of the outer surface of the heat conduction base plate 40. In this way, the heat generated by the heat dissipation device 140 can be quickly passed through the heat conduction base plate 140. Conducted to each heat sink. In addition, in this embodiment, the thermal conductive bottom plate 140 is coated with a low thermal resistance adhesive such as tin lean or thermal conductive adhesive 145 on the joint surface with the heat sink 150 to be bonded to the thermal conductive base of each heat sink. Therefore, the thermal resistance between the heat sink 150 and the device to be dissipated is also reduced, so that the heat sink 150 of the present invention has a better heat dissipation effect. Please refer to Figures 3A and 3B. 3A and 3B are schematic structural diagrams of a third preferred embodiment of the combined multi-flow direction radiator 200 of the present invention. As shown in FIG. 3A and FIG. 3B, the heat sink 200 is different from the heat sink 100 of the first embodiment in that the heat sink 200 is composed of three heat radiation units, 204 and 108. A heat dissipation unit 202, 204, and 108 respectively includes a heat conducting base 212, 214, and 218, and a plurality of heat sinking fins 222, 224, and 228 are arranged in parallel to the corresponding heat conducting bases 212, 214, and 218, respectively. on. The thermally conductive bases 214 and 218 of the government thermal unit 204 and 208 are triangular bases, and the thermally conductive base 212 of the heat dissipation unit 202 are hourglass-shaped. In addition, 200524514 V. Description of the invention (7) The heat dissipation unit 202 also has four receiving posts 23o, and one of the receiving posts 23o has an inverted hook 232. Therefore, the heat sinks 202, 204, and 2008 are combined. After cooling, the two hooks 232 of the four receiving posts 230 can be matched with a cooling fan assembly (not shown), so that the radiator 200 and the cooling fan assembly can be combined into a cooling device. In addition, the heat-dissipating monomers 20, 204, and 208 are also respectively heat-conducting bases 212, 214, and 218 and their corresponding plural heat-dissipating fins 222, 2 24, and 2 28 made of copper, copper alloy, aluminum, or aluminum alloy and other metal materials. Made in the way of figure. In addition, each of the heat sinks 202, 204, and 208 also has a welding surface 215 on the periphery of its thermally conductive bases 212, 214, and 218, respectively, and the welding faces of the heat sinks 202, 204, and 208 are welded. 215. Form the composite multi-flow direction radiator 200 of the present invention. The flow direction of the fluid in the radiator 200 is substantially the same as that of the radiator 100 in the first embodiment, except that the heat dissipation unit 202 is connected to the fluid flow channel at the center of the radiator 200. Commonly, in this way, to solve the problem ... Know the lack of poor heat dissipation in the central part of the radiator. Please refer to Figure 3C. FIG. 3C is a schematic structural diagram of a fourth preferred embodiment of the composite multi-directional heat sink 250 according to the present invention. In this embodiment, the difference between the heat sink 250 and the heat sink 200 is the same as that of the heat sinks 100 and 150 of the first and second embodiments, that is, the bottom of the heat sink 250 further includes a thermal conductive bottom plate 240 'It is also made of copper or copper alloy, and is coated with a low thermal resistance adhesive such as solder paste or thermally conductive adhesive 245 on its joint surface 215 with the heat sink 25 and glued to the thermally conductive base of each heat sink, The principle and effect are the same as those described in the above embodiment, and will not be repeated here. Please refer to Figure 4. FIG. 4 is a composite multi-directional heat sink of the present invention
第12頁 200524514 五、發明說明（8) 3 0 0之苐五較佳實施例的結構示意圖。如第4圖所示，散熱 器300係由四個散熱單體302、304、306及308所構成，每 一散熱單體302、304、306及308分別包含有一導熱底座 312、314、316、318以及複數片散熱鰭片322、324、 32 6、328相互平行地配置於所對應之導熱底座312、314、Page 12 200524514 V. Description of the invention (8) The structural schematic diagram of the fifth preferred embodiment of 3 0 0. As shown in Figure 4, the heat sink 300 is composed of four heat dissipation units 302, 304, 306, and 308, and each heat dissipation unit 302, 304, 306, and 308 includes a thermally conductive base 312, 314, 316, 318 and a plurality of heat-dissipating fins 322, 324, 32 6, 328 are arranged parallel to each other on the corresponding heat-conducting bases 312, 314,
316、318上。於本實施例中，導熱底座312、314、316、 318係四邊形底座，且散熱單體3〇2、304、3 0 6及308亦分 別由導熱底座312、314、316、318與其對應之複數散熱鰭 片322、324、326、328以銅、銅合金、鋁或鋁合金等金屬 材質以一體成形的方式製成。此外，每一散熱單體、 304、306及308亦分別具有二面位於其導熱底座312、 314、316、318之周緣的焊接面（未顯示），藉由焊接散熱 單體302、304、306及308的焊接面，即形成本發明之複合 式多流向散熱器3 0 0。 σ316, 318. In this embodiment, the heat-conducting bases 312, 314, 316, and 318 are quadrangular bases, and the heat-dissipating monomers 302, 304, 306, and 308 are respectively composed of the heat-conducting bases 312, 314, 316, and 318 and their corresponding plurals. The radiating fins 322, 324, 326, and 328 are made of metal materials such as copper, copper alloy, aluminum, or aluminum alloy in an integrated manner. In addition, each heat sink, 304, 306, and 308 also has a welding surface (not shown) on both sides of its heat conductive bases 312, 314, 316, and 318, respectively. And the welding surface of 308 forms the composite multi-directional heat sink 300 of the present invention. σ
就流體在散熱器3 0 0的流動方向即流道而言，本實施 例散熱器300之每一散熱單體302、304、306、308上的散 熱鰭片3 2 2、3 2 4、3 2 6、3 2 8係分別朝不同的維度方向排 列，如第4圖所示，散熱鰭片322係朝—γ軸方向排列、散熱 鱗片324係朝-X轴方向排列、散熱鰭片326係朝+χ軸方向排 列、散熱鰭片328係朝+Υ軸方向排列，此外，散熱單體3〇2 上的散熱鰭片322會分別與相鄰散熱單體304、306上的散 熱II片324、326相互接合並呈九十度夾角組合，同樣地， 散熱單體304、306及308上的散熱鰭片324、326及328亦會 與相鄰的散熱鰭片呈九十度夾角組合。As far as the fluid flows in the direction of the radiator 300, that is, the flow channel, the heat dissipation fins 3, 2, 3, 2, 4, 3 on each of the heat dissipation units 302, 304, 306, and 308 of the heat sink 300 in this embodiment. The 2 6 and 3 2 8 series are arranged in different dimensions. As shown in FIG. 4, the heat dissipation fins 322 are arranged in the -γ axis direction, the heat dissipation scales 324 are arranged in the -X axis direction, and the heat dissipation fins 326 are The heat radiation fins 328 are arranged in the + χ-axis direction, and the heat radiation fins 328 are arranged in the + Υ-axis direction. In addition, the heat radiation fins 322 on the heat radiation unit 302 and the heat radiation fins 324 on adjacent heat radiation units 304 and 306, respectively. , 326 are joined to each other and form a 90-degree angle combination. Similarly, the heat-dissipating fins 324, 326, and 328 on the heat-dissipating monomers 304, 306, and 308 also form a 90-degree angle combination with the adjacent heat-dissipating fins.
200524514 五、發明說明（9) 特予說明的是，本實施例之散熱器3 0 0亦如同散熱器 100、200可於散熱器300之底部以錫膏或導熱膠等低熱阻 黏著劑膠合一由銅或銅合金所製成的導熱底板，其原理及 功效如同上述實施例所述，於此即不再多加贅述。 426 404， 426 ^ 446 428 406 ’ 428 、448 請參考第5圖。第5圖為本發明複合式多流向散熱器 4 0 0之第六較佳實施例的結構示意圖。如第5圖所示，散熱 器400係由六個散熱單體402、404、406、408、410及412 所構成，每一散熱單體402、404、40 6、408、410及412分 別包含有一導熱底座422、424、426、428、430及4 32以及 複數片散熱鰭片442、444、446、448、450及452相互平行 地配置於所對應之導熱底座422、424、426、428、430及 432上。於本實施例中，導熱底座422、424 430及4 32皆為三邊形底座，且散熱單體4〇2， 408、410及412亦分別由導熱底座422、424 430及432與其對應之複數散熱鰭片442、444 450及452以銅、銅合金、銘或銘合金等金屬材質以一體成 形的方式製成。此外，每一散熱單體4〇2、404、406、 408、410及412亦分別具有二面位於其導熱底座422、 424、426、428、430及432之周緣的焊接面（未顯示），藉 由焊接散熱單體402、404、406、408、410及412的焊接 面，即形成本發明之複合式多流向散熱器4〇〇。 就流體在散熱器4 0 0的流動方向即流道而言，本實施 例散熱器500之每一散熱單體402、404、406、408、410及 412上的散熱縛片442、444、446、448、450及452係分別200524514 V. Description of the invention (9) It is specifically stated that the radiator 3 0 0 of this embodiment can also be glued together with a low thermal resistance adhesive such as a solder paste or a thermal conductive adhesive at the bottom of the radiator 300 like the radiators 100 and 200. The principle and effect of the heat conductive base plate made of copper or copper alloy are as described in the above embodiment, and will not be repeated here. 426 404, 426 ^ 446 428 406 ’428, 448 Please refer to Figure 5. FIG. 5 is a schematic structural diagram of a sixth preferred embodiment of the composite multi-directional heat sink 400 according to the present invention. As shown in Figure 5, the heat sink 400 is composed of six heat sinks 402, 404, 406, 408, 410, and 412. Each heat sink 402, 404, 40 6, 408, 410, and 412 includes A thermally conductive base 422, 424, 426, 428, 430, and 4 32 and a plurality of heat dissipation fins 442, 444, 446, 448, 450, and 452 are arranged parallel to each other on the corresponding thermally conductive base 422, 424, 426, 428, 430 and 432. In this embodiment, the thermally conductive bases 422, 424, 430, and 4 32 are all triangular bases, and the heat sinks 402, 408, 410, and 412 are respectively composed of the thermally conductive bases 422, 424, 430, and 432 and their corresponding plurals. The heat dissipation fins 442, 444, 450, and 452 are made of metal materials such as copper, copper alloy, inscription, or inscription alloy in an integrated manner. In addition, each of the heat sinks 402, 404, 406, 408, 410, and 412 also has a welding surface (not shown) on both sides of its thermal conductive base 422, 424, 426, 428, 430, and 432, By welding the welding surfaces of the heat-dissipating monomers 402, 404, 406, 408, 410, and 412, the composite multi-directional heat sink 400 of the present invention is formed. In terms of the flow direction of the fluid in the radiator 400, that is, the flow path, the heat dissipation fins 442, 444, and 446 on each of the heat dissipation units 402, 404, 406, 408, 410, and 412 of the radiator 500 in this embodiment. , 448, 450 and 452 are respectively
第14頁 200524514Page 14 200524514
五、發明說明（10) 朝六個的維度方向排列，如第5圖所示，此外，散熱單體 402上的散熱鰭片442會分別與相鄰散熱單體4〇4、412上的 散熱籍片444、452相互接合並呈六十度夾角組合，同樣 地，散熱單體404、406、408、410及412上的散熱鱗片’ 444、446、448、450及4 52亦會與相鄰的散熱鰭片^六十 度爽角組合。V. Description of the invention (10) Arranged in six dimensions, as shown in FIG. 5. In addition, the heat sink fins 442 on the heat sink 402 and the heat sinks on the neighboring heat sinks 404 and 412, respectively. The pieces 444 and 452 are joined to each other and form a sixty degree angle combination. Similarly, the heat sink scales 444, 446, 448, 450, and 4 52 on the heat sinks 404, 406, 408, 410, and 412 will also be adjacent to each other. Cooling fins ^ Sixty degrees cool angle combination.
特予說明的是，本實施例之散熱器4〇〇亦如同散熱器 100、200及300可於散熱器4〇〇之底部以錫膏或導熱膠等低 熱阻黏著劑膠合一由銅或銅合金所製成的導熱底板，其原 理及功效如同上述實施例所述，於此即不再多加贅述。 請參考第6圖。第6圖為本發明複合式多流向散熱器 ^00之第七較佳實施例的結構示意圖。如第6圖所示Γ散熱 器500係由三個散熱單體5〇2、504及506所構成，每一散熱 單體502、504及506分別包含有一導熱底座512、514及516It is specifically noted that the radiator 400 in this embodiment is also like the radiators 100, 200, and 300. The bottom of the radiator 400 can be glued with a low thermal resistance adhesive such as solder paste or thermal conductive adhesive. The principle and effect of the heat conductive base plate made of the alloy are as described in the above embodiment, and will not be described in detail here. Please refer to Figure 6. FIG. 6 is a schematic structural diagram of a seventh preferred embodiment of the composite multi-directional heat sink ^ 00 of the present invention. As shown in Figure 6, the Γ heat sink 500 is composed of three heat sinks 502, 504, and 506. Each heat sink 502, 504, and 506 includes a thermally conductive base 512, 514, and 516, respectively.
以及複數片散熱鰭片522、524及526相互平行地配置於所 對應之導熱底座512、514及516上。於本實施例中，導熱 底座512略成正方形底座，而導熱底座514、516則呈長方 形底座，且散熱單體5〇2、5〇4及5〇6亦分別由導熱底座 512、514及516與其對應之複數散熱鰭片522、524及526以 銅、銅合金、鋁或鋁合金等金屬材質以一體成形的方式製 成、。此外，每一散熱單體5〇2、504及5 06亦分別具有位於 其^熱底座512、514及516之周緣的焊接面（未顯示），藉 由焊接散熱單體502、504及506的焊接面，即形成本發明 之複合式多流向散熱器5 0 0。And a plurality of heat-dissipating fins 522, 524 and 526 are arranged on the corresponding heat-conducting bases 512, 514 and 516 in parallel with each other. In this embodiment, the heat-conducting base 512 is a slightly square base, and the heat-conducting bases 514 and 516 are rectangular bases, and the heat-dissipating monomers 502, 504, and 506 are also respectively composed of the heat-conducting bases 512, 514, and 516. Corresponding plurality of radiating fins 522, 524, and 526 are made of a metal material such as copper, copper alloy, aluminum, or aluminum alloy in an integrated manner. In addition, each of the heat sinks 502, 504, and 506 also has a welding surface (not shown) located on the periphery of its thermal base 512, 514, and 516, respectively. The welding surface forms the composite multi-directional heat sink 500 according to the present invention.
200524514 五、發明說明（11) 就流體在散熱器5 〇 〇的流動方向即流道而言，本實施 例散熱器50 0之散熱單體5〇2上的散熱鰭片522係朝+χ與―χ 方向排列’且散熱單體504及5〇6係分別朝-γ及+ γ的維度方 向排列，如第6圖所示。此外，散熱單體5〇2上最外兩側的 散熱籍片522會分別與散熱單體5〇4、5〇6上的每一散熱鰭 片5 24、5 26相互接合並呈九十度夾角組合。此外，本實施 例之散熱器5 0 0亦如同散熱器1 〇 〇、2 〇 〇、3 〇 〇及4 〇 〇可於散 熱器5 0 0之底部以錫膏或導熱膠等低熱阻黏著劑膠合一由 銅或銅合金所製成的導熱底板，其原理及功效如同上述 施例所述，於此即不再多加贅述。 特予說明的是，本發明上述各實施例之複合式多流 散熱器100、150、20 0、250、300、400 及 500 之每一散埶 單體的導熱底座與散熱鰭片的組合方式不僅可以以一體、、' 以採焊接等加工方式將導熱底座與散 方熱底座上形成複數條溝槽再將散熱，讀 〜之溝槽中。此外，相鄰兩散熱 早體上的政熱鰭片也可以以焊接等加工方式彼此接合。 相較於習知技術，本發明提供一種由複數個具^ ^ 熱單體所組成之複合式多流向散熱：不= 加散熱器整體的散熱效果。此二進而增 =不同形狀的多邊形導熱底座=也= 底座或扇形底座而組合成具更多流道的散埶 一角/ 以上所述僅為舉例性，而非為限制性=任何未脫離 第16頁 200524514200524514 V. Description of the invention (11) As far as the flow direction of the fluid in the radiator 500 is the flow path, the heat dissipation fins 522 on the heat dissipation unit 500 of the radiator 500 in this embodiment are oriented toward + χ and “Aligned in the χ direction” and the heat sinks 504 and 506 are arranged in the direction of −γ and + γ dimensions, respectively, as shown in FIG. 6. In addition, the outermost heat dissipation fins 522 on the heat dissipation unit 502 will be joined to each of the heat dissipation fins 5 24 and 5 26 on the heat dissipation unit 504 and 506 at a ninety degree, respectively. Angled combination. In addition, the heat sink 5000 of this embodiment is also similar to the heat sinks 1000, 2000, 300, and 400. Low heat resistance adhesives such as solder paste or thermal conductive adhesive can be used on the bottom of the heat sink 5000. The principle and effect of gluing a thermally conductive base plate made of copper or copper alloy is as described in the above embodiment, so it will not be described in detail here. It is specifically explained that the combination method of the heat conduction base and the heat dissipation fin of each of the scattered single cells of the composite multi-flow radiators 100, 150, 200, 250, 300, 400, and 500 of the foregoing embodiments of the present invention It is not only possible to form a plurality of grooves on the heat conducting base and the scattered heat base in a one-piece, or by welding or other processing methods, and then dissipate the heat into the grooves. In addition, the political heat fins on two adjacent heat sinks can also be joined to each other by processing methods such as welding. Compared with the conventional technology, the present invention provides a composite multi-flow heat dissipation system composed of a plurality of thermal monomers: not equal to the heat dissipation effect of the overall radiator. The two further increase = different shapes of the polygonal heat conducting base = also = the base or the fan-shaped base combined to form a divergent corner with more flow channels / the above is for illustration only, not restrictive = anything that does not depart from the 16th Page 200524514
200524514 圖式簡單說明 第1 A圖係一習知散熱裝置之結構示意圖。 第1 B圖係另一習知散熱裝置之結構示意圖。 第Μ圖與第Μ圖為本發明複合式多流向散熱器 較佳實施例的結構不意圖。 第2C圖得、本發明複合式多流向散熱器之第 例的結構示意圖。 干又住貫 第3Α圖與第3Β圖為本發明複合式客 較佳實施例的結構示意圖。 式夕流向散熱器之第 第3C圖係本發明複合式多流向散熱器之 例的結構示意圖。 佳貫 第4圖為本發明複合式多流向散埶 例的結構示意圖。 .，、、器之第五較佳實 第5圖為本發明複合式多流向散敎 例的結構*意圖。 政熱器之第六較佳實 第6圖為本發明複合式多流向散载 例的結構示意圖。 …裔之第七較佳實 施 施 施 施 施 元件斿號說明 1〇、50 散熱裝置 2〇 2 2 扇框 2 4 26 扇葉 3〇、70 32、72 導熱底座 以、74 100 、 150 、 200 、 250 、 300 、 400 、 5〇〇 熱器 軸流式風扇 輪轂 散熱器 散熱鰭片 複合式多流向散200524514 Brief Description of Drawings Figure 1A is a schematic structural diagram of a conventional heat sink. FIG. 1B is a schematic structural diagram of another conventional heat sink. Figures M and M are the structures of the preferred embodiment of the composite multi-flow heat sink of the present invention. Fig. 2C is a schematic structural view of a first example of the composite multi-flow direction radiator of the present invention. Figures 3A and 3B are schematic diagrams of the structure of the preferred embodiment of the composite guest of the present invention. Fig. 3C of the flow direction radiator is a schematic structural diagram of an example of the composite multi-flow direction radiator of the present invention. Fig. 4 is a schematic structural diagram of a composite multi-flow divergence example of the present invention. Fifth Best Practice of .., Figure 5 shows the structure of the composite multi-flow divergence example of the present invention. The sixth preferred embodiment of the thermal heater Figure 6 is a schematic structural diagram of an example of a composite multi-flow direction bulk load according to the present invention. … The seventh preferred implementation of Shi Shi Shi Shi element description # 10, 50 heat dissipation device 202, fan frame 2 4 26 fan blade 30, 70 32, 72 heat conductive base, 74 100, 150, 200 , 250, 300, 400, 500 heaters axial flow fan hub radiator radiator fins composite multi-flow divergent
200524514 圖式簡單說明 102 、1〇4 > 106 ^ 108 、 306 、 308 、 402 、 404 、 202 、 204 、 206 、 208 、406 、 408 、410 、412 、 302 、 304 、 502 、 504 、 5〇6 散熱單體 112 、114 、116 > 118 、316 > 318 、422 、424 、212 > 214 、 216 、218 、426 、 428 、 430 、 432 、312 、314 、512 、514 、 516 導熱底座 122 、 124 、 126 >128 、 326 、 328 、 442 、 444 '222 、 224 、 226 、 228 ' 446 、 448 、 450 、 452 、 322 、 324 、 522 、 524 、 526 115 >215 焊接面 140、240 導熱底板 132 、 232 倒勾 散熱鰭片 145、245 導熱膠 1 3 0、2 3 0 承接桎200524514 Schematic description 102, 104 > 106 ^ 108, 306, 308, 402, 404, 202, 204, 206, 208, 406, 408, 410, 412, 302, 304, 502, 504, 50. 6 Thermal radiation unit 112, 114, 116 > 118, 316 > 318, 422, 424, 212 > 214, 216, 218, 426, 428, 430, 432, 312, 314, 512, 514, 516 Thermally conductive base 122, 124, 126 > 128, 326, 328, 442, 444 '222, 224, 226, 228' 446, 448, 450, 452, 322, 324, 522, 524, 526 115 > 215 Welding surface 140, 240 Thermally conductive base plate 132, 232 Inverted hook cooling fins 145, 245 Thermally conductive adhesive 1 3 0, 2 3 0
第19頁Page 19
Claims (1)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW093100494A TWI251460B (en) | 2004-01-09 | 2004-01-09 | Compound heat sink with multi-directional fins |
| JP2004082027A JP2005197625A (en) | 2004-01-09 | 2004-03-22 | Compound multiflow heat dispersion device |
| DE102004023819A DE102004023819A1 (en) | 2004-01-09 | 2004-05-13 | Heat sinks and passages thereof with multiple directions |
| US10/849,160 US20050150637A1 (en) | 2004-01-09 | 2004-05-20 | Heat sink and multi-directional passages thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW093100494A TWI251460B (en) | 2004-01-09 | 2004-01-09 | Compound heat sink with multi-directional fins |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200524514A true TW200524514A (en) | 2005-07-16 |
| TWI251460B TWI251460B (en) | 2006-03-11 |
Family
ID=34738166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093100494A TWI251460B (en) | 2004-01-09 | 2004-01-09 | Compound heat sink with multi-directional fins |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20050150637A1 (en) |
| JP (1) | JP2005197625A (en) |
| DE (1) | DE102004023819A1 (en) |
| TW (1) | TWI251460B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM339033U (en) * | 2008-04-16 | 2008-08-21 | Asia Vital Components Co Ltd | Heat sink |
| CN101641001B (en) * | 2008-07-28 | 2011-11-09 | 富准精密工业(深圳)有限公司 | Radiating device |
| US9051943B2 (en) | 2010-11-04 | 2015-06-09 | Hamilton Sundstrand Corporation | Gas turbine engine heat exchanger fins with periodic gaps |
| JP2017098274A (en) * | 2014-03-27 | 2017-06-01 | 三菱電機株式会社 | Heat sink device |
| CN105022461B (en) * | 2014-04-21 | 2019-05-21 | 昆山新力精密五金有限公司 | Structure improved heat sinking mould group |
| AT515828B1 (en) | 2014-05-23 | 2022-02-15 | Fronius Int Gmbh | Cooling device and inverter housing with such a cooling device |
| JP7326953B2 (en) * | 2019-07-17 | 2023-08-16 | 富士電機株式会社 | Cooling system |
| WO2021148140A1 (en) * | 2020-01-24 | 2021-07-29 | Huawei Technologies Co., Ltd. | A heatsink with increased air flow |
| EP4068927B1 (en) * | 2021-04-01 | 2024-07-03 | Ovh | Immersion cooling system with dual dielectric cooling liquid circulation |
| US11924998B2 (en) | 2021-04-01 | 2024-03-05 | Ovh | Hybrid immersion cooling system for rack-mounted electronic assemblies |
| US11729950B2 (en) | 2021-04-01 | 2023-08-15 | Ovh | Immersion cooling system with dual dielectric cooling liquid circulation |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2554980B1 (en) * | 1983-11-10 | 1986-01-17 | Socapex | CONNECTOR WITH ZERO INSERTION FORCE FOR RECTANGULAR CIRCUIT SUPPORT AND CLOSING CLIP FOR SUCH CONNECTOR |
| US4733293A (en) * | 1987-02-13 | 1988-03-22 | Unisys Corporation | Heat sink device assembly for encumbered IC package |
| US5375655A (en) * | 1993-03-31 | 1994-12-27 | Lee; Yong N. | Heat sink apparatus |
| US5370178A (en) * | 1993-08-25 | 1994-12-06 | International Business Machines Corporation | Convertible cooling module for air or water cooling of electronic circuit components |
| TW265430B (en) * | 1994-06-30 | 1995-12-11 | Intel Corp | Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system |
| US5582240A (en) * | 1994-09-19 | 1996-12-10 | Motorola, Inc. | Pneumatically coupled heat sink assembly |
| US5927385A (en) * | 1998-01-21 | 1999-07-27 | Yeh; Ming Hsin | Cooling device for the CPU of computer |
| JP3552559B2 (en) * | 1998-03-11 | 2004-08-11 | 株式会社デンソー | Heating element cooling device |
| TW376171U (en) * | 1998-11-24 | 1999-12-01 | Foxconn Prec Components Co Ltd | Radiating device |
| US6199624B1 (en) * | 1999-04-30 | 2001-03-13 | Molex Incorporated | Folded fin heat sink and a heat exchanger employing the heat sink |
| US20020018338A1 (en) * | 2000-01-11 | 2002-02-14 | Mccullough Kevin A. | Insert molded heat sink assembly |
| US20020109970A1 (en) * | 2000-12-18 | 2002-08-15 | Samsung Electro-Mechanics Co., Ltd. | Heat sink for cooling electronic chip |
| US6415852B1 (en) * | 2001-01-11 | 2002-07-09 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
| JP3529358B2 (en) * | 2001-02-07 | 2004-05-24 | 古河電気工業株式会社 | Finned heat sink |
| US6418020B1 (en) * | 2001-03-30 | 2002-07-09 | Advanced Thermal Technologies | Heat dissipation device with ribbed fin plates |
| US6972950B1 (en) * | 2002-06-06 | 2005-12-06 | Raytheon Company | Method and apparatus for cooling a portable computer |
-
2004
- 2004-01-09 TW TW093100494A patent/TWI251460B/en not_active IP Right Cessation
- 2004-03-22 JP JP2004082027A patent/JP2005197625A/en active Pending
- 2004-05-13 DE DE102004023819A patent/DE102004023819A1/en not_active Withdrawn
- 2004-05-20 US US10/849,160 patent/US20050150637A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20050150637A1 (en) | 2005-07-14 |
| TWI251460B (en) | 2006-03-11 |
| DE102004023819A1 (en) | 2005-08-04 |
| JP2005197625A (en) | 2005-07-21 |
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