TWI228264B

TWI228264B - Photocurable paste composition and method forming inorganic calcinated round pattern therefrom

Info

Publication number: TWI228264B
Application number: TW90107538A
Authority: TW
Inventors: Nobuyuki Yanagida; Hideaki Kojima
Original assignee: Taiyo Ink Mfg Co Ltd
Priority date: 2000-03-31
Filing date: 2001-03-29
Publication date: 2005-02-21
Also published as: JP4719332B2; JP2001278906A; WO2001073511A1

Abstract

A photocurable paste composition includes (A) fine inorganic particles, (B) a binder polymer having no ethylenically unsaturated double bonds, (C) one or more photocurable compounds, and (D) a photopolymerization initiator. The composition (B) is preferably dissolved in at least one of the compounds (C). The compounds (C) preferably include a liquid monofunctional photocurable compound having one ethylenically unsaturated double bond per molecule and a polyfunctional photocurable compound having two or more ethylenically unsaturated double bonds per molecule. The composition is advantageously applicable to a method which a trench (recess) part is formed by the application of a specific pattern and an inorganic calcinated pattern, such as a partition wall pattern, an electrode (conductor circuit) pattern, or dielectric (resistor) pattern, to be used in PDPs, FEDs, LCDs, and the like is formed.

Description

A7 1228264 _ B7 五、發明説明（彳) 明所屬之枝術領域本發明爲關於形成等離子體顯示器面板（P D P )、場致發射顯示器（F E D )、液晶顯示裝置（L C D )、螢光顯示裝置、混成集成電路等中之間隔壁圖型、電極（導體電路）圖型、介電體（電阻體）圖型、黑色矩陣圖型等之形成中所適用之光硬化性糊料組成物。更且，本發明爲關於此類無機質煅燒圖型之形成方法及依其所得之形成無機質煅燒圖型之基板。先前之技術先前，於P D P之間隔壁等之厚膜形成上，一般爲進行使用溶劑型玻璃糊料之網板印刷法形成圖型。但是，以網板印刷法形成圖型，於一回印刷中可形成之厚度爲1 〇〜2 0 // m左右，故爲了形成必須以約1 〇〇〜2 0 0 // m左右高度之間隔壁等則必須重覆進行印刷、乾燥。又 ’此類糊料爲含有許多溶劑，於印刷時揮發溶劑故難進行粘度管理，且具有擦過和滲出之問題，令產率不佳，且難以符合等離子體顯示器之大畫面化及高精細化。另一方面，形成間隔壁等厚膜圖型之其他方法有光學平版印刷法。但是，此光學平版印刷法因爲所用之光硬化性糊料的光穿透率低，故無法取得充分的硬化深度，易發生顯像所造成之圖型缺損，且於形成厚膜圖型上乃重覆進行塗佈、曝光。 (請先閲讀背面之注意事項再填寫本頁)A7 1228264 _ B7 V. Description of the Invention (彳) Field of the Invention The present invention relates to forming a plasma display panel (PDP), a field emission display (FED), a liquid crystal display device (LCD), a fluorescent display device, Photocurable paste composition suitable for the formation of partition wall patterns, electrode (conductor circuit) patterns, dielectric (resistor) patterns, black matrix patterns, etc. in hybrid integrated circuits. Furthermore, the present invention relates to a method for forming such an inorganic calcined pattern and a substrate for forming an inorganic calcined pattern based on the method. Prior art In the past, in the formation of thick films such as partition walls of P D P, a screen printing method using a solvent-based glass paste was generally used to form a pattern. However, the pattern is formed by screen printing, and the thickness that can be formed in one printing is about 100 ~ 2 0 // m, so in order to form it, it must be about 100 ~ 2 0 0 // m. Partition walls and the like must be printed and dried repeatedly. Also, this type of paste contains many solvents, so it is difficult to manage the viscosity of the solvent during printing, and it has the problems of rubbing and bleeding, which makes the yield poor, and it is difficult to meet the large screen and high definition of the plasma display. . On the other hand, another method for forming a thick film pattern such as a partition wall is an optical lithography method. However, this optical lithography method cannot obtain a sufficient depth of hardening because the light-hardening paste used has a low light transmittance, and pattern defects caused by development are easy to occur. Coating and exposure were repeated. (Please read the notes on the back before filling this page)

、1T 經濟部智慧財產局員工消費合作社印製代替上述方法之圖型形成方法已提案埋入法和轉印法、 1T Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy

_ 4 - 1228264 A7 B7 五、發明説明（2 ) 等之於圖型溝中充塡糊料並且對被轉印體形成圖型之方法 (參照特開平9 — 1 3 4 6 7 6號、特開平9 一 147754號，特開平10—1252 19號、特開平 1〇一200239號公報）。發明所欲解決之課顆此類方法所用之玻璃糊料組成物一般爲被熱硬化，或者乾燥固化。因此，於此方法中，爲了降低糊料之粘度並提高埋入性，必須令糊劑中含有溶劑成分，且於熱硬化前進行令溶劑成分揮發爲目的之乾燥工程。並且，必須進行以硬化爲目的之加熱、和以煅燒爲目的之局溫加熱等g午多之加熱工程。特別於乾燥工程，因爲溶劑成分揮發令玻璃糊料下沈，故必須重覆2回以上之埋入和乾燥工程。如此，熱硬化型之糊料組成物易導致工程的複雜化。另一方面，使用光硬化性玻璃糊料之上述埋入法爲缺乏埋入性，且光硬化反應所造成之硬化不夠充分，並且硬化塗膜於埋入溝中密合而無法脫模並產生缺損，又，因脫粘合劑造成收縮，故具有無法取得與被轉印體之密合等問題。又，爲了減少收縮而含有大量之玻璃微粒子時，具有難以糊狀化之難點。本發明爲鑑於如上述之情事，其主要目的爲在於提供即使於無溶劑或不多之溶劑含量亦可形成良好之糊料，並且對於凹部之充塡性良好，且光硬化性優良，又，锻燒時不會發生圖型剝落和裂縫，椴燒物殘渣（發生氣泡），且本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂經濟部智慧財產局員工消費合作社印製 -5- 1228264 A7 B7 五、發明説明（4) 圖型之溝（凹）部，形成圖型之方法。 (請先閱讀背面之注意事項再填寫本頁) 若根據本發明之其他態樣，則爲提供包含準備具有指定圖型之溝或凹部之轉印型，且於該轉印型之上述溝或凹部內將前述光硬化性糊料組成物完全充塡之工程’將轉印型以接觸該糊料組成物般地重疊被轉印材料之工程’對上述光硬化性糊料組成物照射活性能量線令其硬化之工程’ 及剝離轉印型，且將被轉印材料上所轉印之硬化糊料組成物煅燒作成無機質煅燒圖型之各工程爲其特徵之無機質煅燒圖型之形成方法。根據此類方法，則可在生產性良好且較低費用下，提供由前述光硬化性糊料組成物之煅燒物所構成之無機質煅燒圖型所形成之無機質煅燒圖型形成基板。圖面之簡單說明圖1爲示出使用本發明之光硬化性玻璃糊料組成物形成P D P間隔壁之方法的槪略工程說明圖。圖2爲示出使用本發明之光硬化性糊料組成物形成導體電路圖型（或黑色矩陣圖型）之方法的槪略工程說明圖。經濟部智慧財產局員工消費合作社印製發明之實施形熊本發明之光硬化性糊料組成物爲對粘合劑（B、C成分）之成分組成下功夫，使其即使於無溶劑或不多之溶劑含量亦可糊狀化，並且可提高對於溝或凹部之糊料充塡性此點爲其特徵。具體而言組合使用不具有光硬化性之高分子量之粘合劑聚合物及低分子量之光硬化性化合物，並且以指定比例配合此點爲其特徵。較佳爲使用令前述粘合劑本紙張尺度適用中.國國家標準（CNS )八4規格（210X297公釐） " " -7- 1228264 A7 B7 五、發明説明（5) 聚合物（B)溶解於前述液狀單官能光硬化性化合物（C-1)之至少一種中，令組成物之糊狀化和糊料充塡性更加提高，並且藉由光硬化性化合物（C)之光硬化而使得其所溶解之粘合劑聚合物（B)可輕易固型化，取得無褶縫狀態之充塡物，故具有可提高光硬化後之轉印性之優點。更佳，組合使用溶解性良好且於1分子中具有1個乙烯性不飽和雙鍵之液狀單官能光硬化性化合物（C-1)，與光硬化性優良之於1分子中具有二個以上乙烯性不飽和雙鍵之多官能光硬化性化合物（C-2)做爲前述光硬化性化合物（C)，則可經由其相乘效果，成爲良好之糊狀，並且對於溝或凹部之糊料充塡性和光硬化後之轉印性等更加提高，可輕易取得由轉印型等中脫模之狀態，故結果可取得充分的光硬化深度。藉此，本發明之光硬化性糊料組成物爲於無機質煅燒圖型之形成中，適合使用於利用指定圖型所形成之溝或凹部成形出圖型之方法，例如，使用具有指定圖型溝或凹部之母型，經由印刷、轉印及加壓等，在被轉印體上形成圖型。以下，具體說明本發明之光硬化性糊料組成物。首先，無機微粒子（A )爲根據所欲用途，將做爲主成分之玻璃微粒子（A - 1)、金屬微粒子（A - 2)、黑色導電性微粒子（A - 3 )、陶瓷微粒子（A - 4 )等單獨或組合使用，但爲了令使用任一無機微粒子之情況均可爲煅燒性良子，其較佳爲添加玻璃微粒子。玻璃微粒子（A - 1 )爲使用於6 0 0 °C以下之溫度進行煅燒之軟化點爲3 0 0〜6 0 0 t之低熔點玻璃料，本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐）衣— (請先閱讀背面之注意事項再填寫本頁) 、?τ 經濟部智慧財產局員工消費合作社印製 -8 - 1228264 A7 B7 五、發明説明（g ) 且較佳使用氧化錯、氧化鉍、氧化鋅、氧化鋰、或鹼性硼砂酸鹽做爲主成分之物質。又，低熔點玻璃料較佳使用玻璃態化溫度爲3 0 0〜5 5 0 t：、熱膨脹係數α 3。◦= 7_ 4-1228264 A7 B7 V. Description of the invention (2) Equal to the method of filling paste in the pattern groove and forming a pattern on the object to be transferred (refer to JP-A-9-9 1 3 4 6 7 6 and special (Kaiping No. 9-147754, JP-A No. 10-1252, JP-A No. 10-200239). Lessons to be Solved by the Invention The glass paste composition used in such methods is generally heat-hardened, or dried and cured. Therefore, in this method, in order to reduce the viscosity of the paste and improve the embedding property, it is necessary to make the paste contain a solvent component and perform a drying process for the purpose of volatilizing the solvent component before heat curing. In addition, a heating process such as heating for the purpose of hardening and local temperature heating for the purpose of calcination must be performed. Especially in the drying process, the glass paste will sink due to the volatilization of the solvent components, so it is necessary to repeat the embedding and drying process more than 2 times. In this way, the heat-curable paste composition is likely to complicate the process. On the other hand, the above-mentioned embedding method using a photo-curable glass paste is lacking in embedding property, and the hardening caused by the photo-hardening reaction is insufficient, and the hardened coating film is tightly embedded in the embedding groove and cannot be demolded and generated. Defects and shrinkage caused by de-adhesion have problems such as failure to obtain close contact with the transfer target. When a large amount of glass fine particles are contained in order to reduce shrinkage, it is difficult to make the paste difficult. In view of the circumstances as described above, the present invention aims to provide a good paste that can form a good paste even without a solvent or a small amount of solvent, and has good filling properties for recesses and excellent light-hardening properties. Pattern peeling and cracks will not occur during calcination, burnt residue (bubbles occur), and this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling in this Page) Order printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy -5- 1228264 A7 B7 V. Description of the invention (4) The groove (concave) part of the pattern, which forms the pattern. (Please read the precautions on the back before filling out this page.) According to other aspects of the present invention, a transfer type containing grooves or recesses with a specified pattern is prepared, and The process of fully filling the photo-curable paste composition in the recessed portion, the process of “overlaying the transfer type to overlap the material to be transferred in contact with the paste composition”, irradiates the photo-curable paste composition with active energy It is a method of forming an inorganic calcined pattern which is characterized in that each process of curing the hardened paste composition transferred on the transfer material into an inorganic calcined pattern is characterized by a process of 'curing the hardening process' and a peeling transfer type. According to such a method, an inorganic calcined pattern formed of an inorganic calcined pattern composed of a calcined product of the photocurable paste composition described above can be provided at a low productivity and at a low cost. Brief Description of the Drawings Fig. 1 is a schematic engineering diagram showing a method of forming a P D P partition wall using the photocurable glass paste composition of the present invention. Fig. 2 is a schematic engineering diagram showing a method for forming a circuit pattern (or a black matrix pattern) of a conductor using the photocurable paste composition of the present invention. The implementation of the invention printed by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs. The photocurable paste composition of the present invention is based on the composition of the adhesive (components B and C). The solvent content can also be pasty, and it can improve the filling properties of the grooves or recesses. Specifically, a combination of a high molecular weight binder polymer having no photo-hardening property and a low-molecular-weight photo-hardening compound is used, and it is characterized by blending this at a specified ratio. It is better to use the aforementioned adhesive to make the paper size applicable. National National Standard (CNS) 8 4 specifications (210X297 mm) " " -7- 1228264 A7 B7 V. Description of the invention (5) Polymer (B ) Is dissolved in at least one of the liquid monofunctional photocurable compounds (C-1), which improves the pastyness and filling properties of the composition, and is further improved by the light of the photocurable compound (C) The hardened adhesive polymer (B) can be easily cured to obtain a filling material without creases, so it has the advantage of improving the transferability after light curing. More preferably, a liquid monofunctional photocurable compound (C-1) having good solubility and having one ethylenically unsaturated double bond in one molecule is used in combination, and two in one molecule are excellent in photocurability. As the photo-curable compound (C), the above ethylenically unsaturated double-bond multifunctional photo-curable compound (C-2) can be made into a good paste through its multiplicative effect, and is suitable for grooves or recesses. The filling property of the paste and the transferability after photo-hardening are further improved, and the state of being released from the transfer type can be easily obtained, so that a sufficient depth of photo-hardening can be obtained as a result. Therefore, the photocurable paste composition of the present invention is suitable for forming a pattern by using grooves or recesses formed by a specified pattern in the formation of an inorganic calcined pattern. For example, using a pattern having a specified pattern The mother pattern of the grooves or recesses forms a pattern on the object to be transferred through printing, transfer, and pressure. Hereinafter, the photocurable paste composition of the present invention will be specifically described. First, the inorganic fine particles (A) are glass fine particles (A-1), metal fine particles (A-2), black conductive fine particles (A-3), and ceramic fine particles (A- 4) etc. are used singly or in combination, but in order to use any inorganic fine particles as calcinable good particles, it is preferable to add glass fine particles. Glass microparticles (A-1) are low-melting glass frits with a softening point of 3 0 0 ~ 6 0 t for calcination at a temperature below 600 ° C. This paper size applies to China National Standard (CNS) A4 specifications (210 × 297 mm) Clothing — (Please read the precautions on the back before filling out this page),? Τ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -8-1228264 A7 B7 V. Invention Description (g) and better use Substances containing oxidized oxide, bismuth oxide, zinc oxide, lithium oxide, or alkaline boraxate as main ingredients. The low-melting glass frit is preferably a glass transition temperature of 300 to 550 t: and a thermal expansion coefficient α 3. ◦ = 7

0〜9 Ο X 1 0 7/ C之玻璃料，又，由解像度方面而S ，則以使用平均粒徑1 0 // m以下，較佳爲2 · 5 // m以下爲佳。將本發明之光硬化性糊料組成物配方做爲導電性糊料時所用的無機微粒子（A )，可列舉有金屬微粒子（A -2 )和/或黑色導電性微粒子（A - 3 )、及此些導電性微粒子與玻璃微粒子（A - 1 )之混合物。具體而言，金屬微粒子（A - 2)可使用金、銀、銅、釕、鈀、鉑、鋁、鎳等和其合金。上述金屬微粒子可單獨或組合使用二種以上，由解像度方面而言，其平均粒徑以1 0 //m以下，較佳爲5 //m以下之粒徑爲適當。又，此些金屬微粒子可將球狀、塊狀、片狀、樹枝晶狀之物質單獨或組合使用二種以上。又，爲了防止此些金屬微粒子之氧化、提高於組成物內之分散性、令顯像性安定化，較佳特別將A g、N i、A 1以脂肪酸進行處理。脂肪酸可列舉油酸、亞油酸、亞麻酸、硬脂酸等。又，黑色導電性微粒子（A - 3 )於P D P用電極作成工程中，伴隨以5 0 0〜6 0 0 °C之高溫煅燒，故必須爲於高溫下之色調和導電性具有安定性之物質，例如以釕氧化物和釕化合物、銅-鉻系黑色複合氧化物、銅-鐵系黑色複合氧化物等爲適於使用。特別以釕氧化物或釕化合本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁)For glass frit of 0 ~ 9 〇 X 1 0 7 / C, and from the aspect of resolution, S, it is better to use the average particle size of 1 0 // m or less, preferably 2 · 5 // m or less. The inorganic fine particles (A) used when the photocurable paste composition formulation of the present invention is used as a conductive paste include metal fine particles (A-2) and / or black conductive fine particles (A-3), And a mixture of these conductive fine particles and glass fine particles (A-1). Specifically, as the metal fine particles (A-2), gold, silver, copper, ruthenium, palladium, platinum, aluminum, nickel, and the like, and alloys thereof can be used. The above-mentioned metal fine particles may be used alone or in combination of two or more kinds. In terms of resolution, the average particle diameter is preferably 10 / m or less, and preferably 5 / m or less. In addition, these metal fine particles can be used singly, massively, flakely, or dendritic, alone or in combination. In addition, in order to prevent oxidation of these metal fine particles, improve dispersibility in the composition, and stabilize development properties, it is particularly preferable to treat Ag, Ni, and A1 with fatty acids. Examples of the fatty acid include oleic acid, linoleic acid, linolenic acid, and stearic acid. In addition, the black conductive fine particles (A-3) are produced in the electrode for PDP, and are calcined at a high temperature of 500 to 600 ° C. Therefore, it is necessary to have a stable color tone and conductivity at high temperatures. For example, a ruthenium oxide and a ruthenium compound, a copper-chromium-based black composite oxide, a copper-iron-based black composite oxide, and the like are suitable for use. Especially with ruthenium oxide or ruthenium compound. The paper size is applicable to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling this page)

、1T 線表經濟部智慧財產局員工消費合作社印製 -9 - 1228264 Δ7 Α7 Β7 五、發明説明（7 ) 物於高溫下之色調和導電性之安定性極爲優良，故爲最適〇配合如前述之金屬微粒子（A - 2 )和/或黑色導電性微粒子（A - 3 )做爲主成分並且配方成光硬化性導電性糊料時，爲了提高煅燒後之被膜強度，對於基板之密合性，亦可將如前述之玻璃微粒子（A - 1 )以金屬微粒子 (A - 2 )和/或黑色導電性微粒子（A - 3 )每1 0 0 質量份添加1〜3 0質量份之範圍爲佳。又，亦可添加後述之陶瓷微粒子和其他之無機充塡劑。陶瓷微粒子（A — 4 )以使用氧化鋁、Cogente、二氧化锆中之一種或二種以上。又，由解像度方面而言，以使用平均粒徑1 0 // m以下，較佳爲2 · 5 // m以下者爲佳。可僅將此類陶瓷微粒子與燒結輔助劑共同使用做爲無機微粒子，但在提高間隔壁等煅燒物圖型內部之緻密性和增大煅燒物之機械強度之目的下，亦可於玻璃糊料和導電性糊料中配合陶瓷微粒子。即，玻璃成分雖於煅燒時收縮，但經由前述玻璃微粒子每1 0 0質量份配合0 · 1〜 5 0質量份之陶瓷微粒子，則可取得緻密且收縮率小之間隔壁等之煅燒物圖型。此時，陶瓷微粒子之配合量若多於上述範圍，則對於基板之接合性變差，故爲不佳。又，於要求煅燒物圖型爲黑色之情形中，可添加F e 、Co、Cu、Cr、Μη、A1等一種或二種以上之金屬氧化物所構成之黑色顏料，例如C 〇 - C r 一 F e、本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ' (請先閲讀背面之注意事項再填寫本頁) 、1Τ 經濟部智慧財產局員工消費合作社印製 10- 1228264 Α7 Β7 五、發明説明（g )Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of the 1T line watch. When metal fine particles (A-2) and / or black conductive fine particles (A-3) are used as a main component and formulated as a photocurable conductive paste, in order to improve the film strength after firing, the adhesion to the substrate The glass fine particles (A-1), metal fine particles (A-2), and / or black conductive fine particles (A-3) as described above may be added in a range of 1 to 30 parts by mass per 100 parts by mass. good. Further, the ceramic fine particles and other inorganic fillers described later may be added. As the ceramic fine particles (A-4), one or two or more of alumina, Cogente, and zirconia are used. In terms of resolution, it is preferable to use an average particle diameter of 1 0 // m or less, preferably 2 · 5 // m or less. Such ceramic fine particles and sintering aids can only be used together as inorganic fine particles, but it can also be used in glass pastes for the purpose of increasing the density inside the pattern of calcined materials such as partitions and increasing the mechanical strength of calcined materials. Ceramic fine particles are mixed with the conductive paste. That is, although the glass component shrinks during firing, by mixing the glass fine particles with 0.1 to 50 parts by mass of ceramic fine particles per 100 parts by mass of the glass fine particles, it is possible to obtain a calcined material diagram of a partition wall having a small density and a small shrinkage rate. type. In this case, if the compounding amount of the ceramic fine particles is more than the above range, the adhesion to the substrate is deteriorated, which is not preferable. In addition, in the case where the pattern of the calcined product is required to be black, a black pigment composed of one or two or more metal oxides such as F e, Co, Cu, Cr, Mn, A1 can be added, such as C 0-C r A F e. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) '(Please read the precautions on the back before filling out this page), 1T Printed by the Intellectual Property Bureau Employee Consumer Cooperatives of the Ministry of Economic Affairs 10- 1228264 Α7 Β7 5. Description of the invention (g)

Co— Μη — Fe、Co — Fe - Μη— Al、Co — Ni— Cr-Fe、Co-Ni — A1 — Cr-Fe、 Co— Μη— Al— Cr— Fe — Si、三氧化鈷等。此類黑色顏料由黑色度之觀點而言，以平均粒徑1 · 〇 # m以下，較佳爲0 · 6 // m以下之顏料爲適當。另一方面，於要求煅燒物圖型爲白色之情形中，可添加氧化鈦、氧化鋁、矽石、碳酸鈣等之白色顏料。此類無色顏料之添加量可根據必要之黑色度和白色度而調節。本發明所用之無機微粒子（A )以1 〇微米以下之粒徑爲適於使用，於防止二次凝集，提高分散性之目的下，在不損害無機微粒子性質之範圍中，可使用有機酸、無機酸、矽烷偶合劑、鈦酸酯系偶合劑、鋁系偶合劑等予以預先表面處理之物質，且於將組成物糊狀化時可添加上述處理齊ί 。又’爲了提高組成物之保存安定性，可將金屬或與氧化物粉末之錯合物化或具有形成鹽效果之某些化合物添加做爲安定劑。安定劑可適當使用無機酸、有機酸、磷酸化合物（無機磷酸、有機磷酸）等酸。此類安定劑之添加量爲無機微粒子（Α)每1 〇〇質量份以5質量份以下爲適當。不具有乙烯性不飽和雙鍵之粘合劑聚合物（Β )可列舉丙烯酸系多元醇、聚乙烯醇、聚乙烯基縮醛、苯乙烯烯丙醇、苯酚樹脂、共聚（甲基）丙烯酸酯樹脂、聚碳酸丙烯酯樹脂、含烯烴系羥基之聚合物，於此些含羥基聚合物本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 、11 經濟部智慧財產局員工消費合作社印製 -11 - 1228264 A7 B7 五、發明説明之羥基和胺基樹脂之胺基加成內酯 1分子中合倂具有羥基或胺基和不，具有內酯改質單體與其他不飽和基纖維素、乙基纖維素、羥乙基纖等，但由煅燒適性而言，則期望以丙烯酸共聚物、碳酸丙烯酯樹脂。前述粘合劑聚合物（B )中，烯酸系聚合物爲合適，可列舉例如 (甲基）丙烯酸乙酯、（甲基）丙丙烯酸異丙酯、（甲基）丙烯酸正異丁酯、（甲基）丙烯酸第三丁酯之內酯改質飽和基之單基之單體的維素等之纖乙基纖維素聚合物，於體的單聚物共聚物、甲維素衍生物、（甲基）由煅燒特性 (甲基）丙烯酸正丙酯丁酯、（甲基）丙烯酸、（甲基）丙烯酸2 — 而言則以丙烯酸甲酯、 (甲基） (請先閲讀背面之注意事項再填寫本頁) 羥乙酯、甲基）丙烯酸2 —羥丙酯、甲基 )丙烯酸2 乙基己酯等之（甲基）丙烯酸酯類之一種或二種以上所Co—Mn—Fe, Co—Fe—Mn—Al, Co—Ni—Cr—Fe, Co—Ni—A1—Cr—Fe, Co—Mη—Al—Cr—Fe—Si, cobalt trioxide, and the like. From the viewpoint of blackness, such black pigments are preferably pigments having an average particle diameter of 1 · 〇 # m or less, and preferably 0 · 6 // m or less. On the other hand, when the pattern of the calcined product is required to be white, white pigments such as titanium oxide, aluminum oxide, silica, and calcium carbonate may be added. The amount of such colorless pigments can be adjusted according to the necessary blackness and whiteness. The inorganic fine particles (A) used in the present invention are suitable for use with a particle size of 10 micrometers or less. For the purpose of preventing secondary aggregation and improving dispersibility, organic acids, Inorganic acids, silane coupling agents, titanate-based coupling agents, aluminum-based coupling agents, etc. are surface-treated in advance, and the above treatments can be added when the composition is pasted. In addition, in order to improve the storage stability of the composition, a metal or a compound compound with an oxide powder or a compound having a salt-forming effect may be added as a stabilizer. As the stabilizer, acids such as inorganic acids, organic acids, and phosphoric acid compounds (inorganic phosphoric acid and organic phosphoric acid) can be appropriately used. The addition amount of such stabilizers is suitably 5 parts by mass or less per 100 parts by mass of the inorganic fine particles (A). Examples of the binder polymer (B) having no ethylenically unsaturated double bonds include acrylic polyols, polyvinyl alcohols, polyvinyl acetals, styrene allyl alcohols, phenol resins, and copolymerized (meth) acrylates. Resins, polypropylene carbonate resins, polymers containing olefinic hydroxyl groups. These hydroxyl-containing polymers are sized to the Chinese National Standard (CNS) A4 (210X 297 mm) (please read the precautions on the back first) (Fill in this page) 11 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -11-1228264 A7 B7 V. Hydroxyl and amine-based lactones of amine resins described in the invention No, there are lactone-modified monomers and other unsaturated cellulose, ethyl cellulose, hydroxyethyl cellulose, etc., but from the viewpoint of calcination suitability, acrylic copolymers and propylene carbonate resins are desirable. Among the aforementioned binder polymers (B), enoic polymers are suitable, and examples thereof include ethyl (meth) acrylate, isopropyl (meth) acrylate, n-isobutyl (meth) acrylate, Cellulose cellulose polymers such as vitamins such as tributyl (meth) acrylate lactone modified with single monomers of saturated groups, monomeric copolymers, vitamins and derivatives of vitamins, (Methyl) n-propyl butyl (meth) acrylate, (meth) acrylic acid, and (meth) acrylic acid 2 are calcined. For methyl acrylate and (meth) (please read the note on the back first) Please fill in this page again) One or two or more kinds of (meth) acrylates such as hydroxyethyl, 2-hydroxypropyl methacrylate, 2-ethylhexyl methacrylate, etc.

、1T 經濟部智慧財產局員工消費合作社印製得之共聚物或再與其他單體成分之共聚物等。如前述之粘合劑聚合物（B )爲經由煅燒成分，而無機微粒子（A )之粘合劑爲被含有等之目的’較佳爲顯不熱塑性。使用顯示熱塑聚合物時，即使糊料本身之粘度變高，亦可經化或熔融，並且可塗佈或充塡至溝部。又，粘爲在具有糊料安定性之範圍中含有羥基和羧基與玻璃微粒子之分散性，亦可取得對糊料賦與防止沈降之效果。前述粘合劑聚合物（B )爲使用於後述之合物（C )之至少一種中溶解者爲佳。藉此，而被除去之提高轉印性性之粘合劑由加熱而軟合劑聚合物時，可提高搖變性並且光硬化性化可更加提高1. Copolymers printed by the cooperatives of employees of the Intellectual Property Bureau of the Ministry of Economic Affairs, or copolymers with other monomer components. As described above, the binder polymer (B) is a component which is calcined, and the binder of the inorganic fine particles (A) is contained for the purpose of 'is preferably thermoplastic. When a thermoplastic polymer is used, even if the viscosity of the paste itself becomes high, it can be cured or melted, and can be applied or filled to the groove. In addition, the paste has a dispersibility of a hydroxyl group and a carboxyl group and glass fine particles in a range having stability of the paste, and can also provide the paste with an effect of preventing sedimentation. The binder polymer (B) is preferably one that is used in dissolving in at least one of the compounds (C) described later. This removes the adhesive that improves the transferability. When the polymer is softened by heating, it can improve the shake resistance and the photohardenability.

-12- 1228264 A7 A7 B7 經濟部智慧財產局員工消費合作社印製五 '發明説明k ) 組成物之糊狀化和糊料充塡性，並且經由光硬化性化合物 (C )之光硬化而令其所溶解之粘合劑聚合物（B )輕易地固定型化，並且取得無皺摺狀態之充塡物，故取得可提高光硬化後之轉印性之優點。又，粘合劑聚合物（B )之重量平均分子量通常必須爲3， 000以上，較佳爲10， 000〜 3 0 0, 〇〇0，更佳爲100， 00〇〜 300，000之範圍。粘合劑聚合物（B)之重量平均分子量未滿3 0 0 0則糊狀化困難，另一方面，若分子量過大，則粘合劑聚合物（B )對於光硬化性化合物（C ) 之溶解變難，並且令糊料之粘性變得過高，且充塡性變差〇更且，粘合劑聚合物（B )之熱分解溫度必須低於前述玻璃微粒子（A - 1 )之玻璃態化溫度。粘合劑聚合物 (B )之熱分解溫度若高於玻璃微粒子之玻璃態化溫度，則在煅燒初期無法充分除去，且於玻璃中以煅燒殘渣（粘合劑聚合物爲熱分解並生成氣泡）型式殘留，故爲不佳。又，粘合劑聚合物（B )之熱分解溫度若高於玻璃微粒子之玻璃態化溫度，則糊狀化亦變得困難。粘合劑聚合物（B )之配合比例爲前述無機微粒子（ A)每1 00質量份以1〜50質量份，較佳爲1〜20 質量份爲適當。粘合劑聚合物（B )之配合比例若少於上述範圍，則對於溝部之埋入性和光硬化後之轉印性等方面爲不佳，另一方面，若多於上述範圍，則煅燒時之收縮變 (請先閲讀背面之注意事項再填寫本頁)-12- 1228264 A7 A7 B7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of the People ’s Republic of China 5) Description of the invention k) Paste-forming and paste-filling of the composition, and the light-curing of the photo-curable compound (C) The dissolved adhesive polymer (B) can be easily fixed, and a filling material in a wrinkle-free state can be obtained, so that it has the advantage of improving the transferability after light curing. In addition, the weight average molecular weight of the binder polymer (B) must generally be 3,000 or more, preferably 10,000 to 30,000, and more preferably 100,000 to 300,000. . If the weight average molecular weight of the binder polymer (B) is less than 3,000, it will be difficult to paste. On the other hand, if the molecular weight is too large, the binder polymer (B) will be It becomes difficult to dissolve, and the viscosity of the paste becomes too high, and the filling property becomes worse. Moreover, the thermal decomposition temperature of the binder polymer (B) must be lower than that of the glass particles (A-1). State temperature. If the thermal decomposition temperature of the binder polymer (B) is higher than the glass transition temperature of the glass particles, it cannot be sufficiently removed at the initial stage of calcination, and the calcined residue (the binder polymer is thermally decomposed and bubbles are generated in the glass). ) Residual type, so it is not good. In addition, if the thermal decomposition temperature of the binder polymer (B) is higher than the glass transition temperature of the glass fine particles, it will become difficult to make a paste. The blending ratio of the binder polymer (B) is preferably 1 to 50 parts by mass, preferably 1 to 20 parts by mass, per 100 parts by mass of the inorganic fine particles (A). If the blending ratio of the binder polymer (B) is less than the above range, the embedding property of the groove portion and the transferability after light hardening are not good. On the other hand, if it is more than the above range, it is calcined. Shrinkage (please read the precautions on the back before filling this page)

、1T 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公楚） 13- 1228264 A7 B7 五、發明説明L ) 佳且1分子中具有一個乙烯性不飽和雙鍵之液狀單官能光硬化性化合物（C - 1 )，與光硬化性優良且1分子中具有二個以上，較佳爲3個以上之乙烯性不飽和雙鍵之多官能光硬化性化合物（c - 2 )爲佳。藉由組合使用’因爲其相乘效果而可成爲良好之糊狀，且對於凹部之糊料充塡性和光硬化後之轉印性等更加提高，並且可輕易取得可由輳印型等中脫模之狀態，故結果可取得充分的光硬化深度。液狀單官能光硬化性化合物（C - 1 )與多官能光硬化性化合物（C - 2 )之比率雖亦根據前述粘合劑聚合物（ B )之分子量和溶解性而異，但以（C 一 1 ) : ( C 一 2 )=1 : 0 · 1〜1 0，較佳爲1 : 0 · 1〜2之比例爲佳。前述光聚合引發劑（D )之具體例可列舉苯偶姻、苯偶姻甲醚、苯偶姻***、苯偶姻異丙醚等之苯偶姻與苯偶姻烷醚類；乙醯苯、2 ，2 -二甲氧基一 2 —苯基乙醯苯、2，2 —二乙氧基—2 —苯基乙醯苯、1 ，1—二氯基乙醯苯等之乙醯苯類；2 —甲基一 1 一〔4 一（甲硫基）苯基〕一2—嗎啉基丙烷一1一酮、2—苄基一2—二甲胺基一 1 一（4 一嗎啉苯基）一丁烷一 1 一酮等之胺基乙醯苯類；2 —甲基蒽醌、2 -乙基蒽醌、2 —第三丁基蒽醌、1 一氯基蒽醌、2 -戊基蒽醌等之蒽醌類；2 ，4 一二甲基噻吨酮、2，4 —二乙基噻吨酮、2 —氯基噻吨酮、2 ，4 一二異丙基噻吨酮等之噻吨酮類；乙醯苯二甲基縮醛、苄基二甲基縮醛等之縮醛類；二苯酮等之二苯酮類本紙張尺度適用中國國家標準（CNS ) A4規格（210X撕公羡） (請先閲讀背面之注意事項再填寫本頁) 、τ. 經濟部智慧財產局員工消費合作社印製 -15- 1228264 A7 B7 五、發明説明) (請先閱讀背面之注意事項再填寫本頁) ，咕吨醒類，（2 ’ 6 —二甲氧基苯甲釀）—2 ，4 ，4 一戊基氧化膦、雙（2 ，4，6 —三甲基苯甲醯）一苯基氧化膦、乙基一 2 ，4 ’ 6 —三甲基苯甲醯苯基次膦酸酯等之氧化膦類；各種過氧化物類；1 ，7 -雙（9 一 d丫陡基）庚烷等，且此些公知慣用的光聚合引發劑可單獨或組合使用二種以上。此些光聚合引發劑（D )之配合比例爲前述粘合劑聚合物（B )每1 〇〇質量份以1〜2 〇質量份之比例爲佳。又，如上述之光聚合引發劑（D)可將N，N -二曱胺基苯甲酸乙酯、N，N —二甲胺基苯甲酸異戊酯、戊基一 4 -二甲胺基苯甲酸酯、三乙胺、三乙醇胺等之三級胺類般之公知慣用的光增感劑之一種或二種以上組合使用。更且，於要求更深之光硬化深度時，視需要，可將可見區域中引發自由基聚合之Ciba Specialty Chemicals公司製（G I 7 8 4等之鈦素體系光聚合引發劑、3 -取代香豆素色素、無色染料等做爲硬化助劑組合使用。經濟部智慧財產局員工消費合作社印製於本發明之光硬化性糊料組成物中，再視需要，爲了作成安定之糊料可添加適於無機微粒子之分散劑，又，做爲粘度調整用之稀釋溶劑、和流動性賦與劑、可塑劑、安定劑、消泡劑、塗平劑、防粘劑、矽烷偶合劑等之各種添加劑亦可少量添加。分散劑可使用具有羧基、羥基、酸酯等之與玻璃微粒子具有親和性之極性基之化合物和高分子化合物，例如磷酸酯類等之合酸化合物、和含氧基之共聚物、含羥基之聚本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 16- 1228264 Δ7 Α7 Β7 經濟部智慧財產局員工消費合作社印製五、發明説明L ) 羧酸酯、聚矽氧烷、長鏈聚胺基醯胺與酸酯之鹽等。特別適於使用之市售分散劑可列舉Disperbyk (註冊商標） —101、— 103、—110、— 111、一 160 及 —3 0 0 (均爲Beak Chemy公司製）。此類分散劑之配合量爲前述無機微粒子（A)每1 0 0質量份以0 · 0 1〜 5質量份爲適當。稀釋溶劑可列舉甲苯、二甲苯、四甲基苯、和Exon化學（株）製 Sorbiso #100、 Sorbiso #150、 Sorbiso #200、 Exon Aromatic Naphtha No.2 . Shell (株）製 LAWS、 HAWS、 VLAWS、 Shellsol D40、 D70、 D100、 70、 71 、72、 A、 AB、 R、 D〇SB、 DOSB-8等之芳香族系溶劑 ;Exon 化學（株）製 Exon Naphtha No. 5、No. 6 . No.7 . Exon Orderless Solvent 、 Exon Labor Solvent 等之月旨族系溶劑；甲醇、乙醇、丙醇、異丙醇、丁醇、己醇、溶纖劑、丁基溶纖劑、卡必醇、丁基卡必醇等之醇系溶劑；醋酸乙酯、醋酸丁酯、溶纖劑醋酸酯、卡必醇醋酸酯、乳酸甲酯、乳酸乙酯、乳酸丁酯等之酯系溶劑。以下，一邊參照所附圖面，一邊以P D P背面板之間隔壁形成法爲例，說明使用本發明之光硬化性糊料組成物之圖型狀無機質煅燒被膜之製造方法的一適當例。首先，如圖1 ( A )所示般，準備於模型基板2上，形成具有指定圖型溝4之樹脂被膜層3的轉印型1。或者，亦可於轉印型1之基板本身以激光加工等形成圖型溝4 〇本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) 、1Τ -17- 151228264 A7 B7 五、發明説明（換型基板2之材料可列舉金屬、陶瓷、玻璃、高分子材料等之薄膜或薄片、或其複合薄片等。尙，由模型基板 2側照射活性能量線、例如紫外線時，模型基板2可使用光穿透性材料，例如透明玻璃基板。另一方面，僅由重疊轉印型之基板側照射紫外線時，較佳使用光反射性基板做爲模型基板2，藉此，所照射之紫外線即使透過糊料組成物中，亦可經由光反射性基板而反射，且再度被糊料組成物所吸收，故可有效率活用所照射的紫外線。此類光反射性基板可列舉例如於透明玻璃基板裏面、表面、或於基板中形成白色玻璃層和白色樹脂層、鋁箔等之銀白金屬層等〇於如上述之模型基板2上，形成具有圖型溝4之樹脂被膜層3的方法，可應用印刷法、照像法、描畫法、噴砂法等。於印刷法之情形中，將凹版和輥筒凹版中充塡含有如前述之熱硬化性樹脂、感光性樹脂、熱乾燥性樹脂等之樹脂淸漆後’於模型基板上轉印，且經由加熱處理或活性能量線之照射，則可形成具有硬化指定圖型溝之樹脂被膜層。於照像法之情形中，根據網板印刷法、輥塗法、幕塗法等適當方法，於模型基板上形成含有如前述光硬化性成分之樹脂組成物塗膜，或將感光性乾燥薄膜疊層，並透過具有指定曝光圖型之光罩物予以曝光，並顯像形成具有指定圖型溝之樹脂被膜層。另一方面，於描畫法之情形中，於模型基板上形成樹脂塗膜層，並經由加熱處理或活性能量本紙張尺度適用中關家標準（CNS ) A4規格（21G X：297公釐) 一' (請先閱讀背面之注意事項再填寫本頁) 訂經濟部智慧財產局員工消費合作社印製 -18- 1228264 A7 B7 五、發明説明（16 ) 線之照射硬化後，例如以激光加工形成如指定圖型之溝部 ◦於噴砂法之情形中，將上述硬化塗膜層或半硬化塗膜層形成指定圖型孔之光阻薄膜予以重疊，並進行噴射處理形成溝部。此外，亦可於模型基板上將熱塑性樹脂薄膜疊層，並以加熱軟化之狀態予以浮雕花樣加工形成指定之圖型溝。如前述形成具有指定圖型溝4之樹脂被膜層3的模型基板2，較佳爲塗層以無機質被膜5。此無機質被膜5爲對樹脂被膜層3賦與充分的強度、硬度，並對圖型溝4內充塡糊料組成物，並且改善硬化後之脫模性所形成之被膜。又，樹脂覆被層3爲由感光性乾燥薄膜所形成之情形中，將光硬化性玻璃糊料組成物埋入圖型溝4內之後，經由光照射亦具有防止感光性乾燥薄膜與糊料組成物之感光性成分彼此反應之效果。無機質被膜5適當爲以鎳、金、鋁、鐵等，或此些合金等之各種金屬、及金屬氧化物等之各種陶瓷等。無機質被膜之塗層法可採用無電解鍍層法或再以電鍍法、真空g 積法、濺鍍法、離子電鍍等各種方法。尙，模型基板2爲如透明玻璃基板般之光穿透性基板之情形中，例如以塗層氧化錫、I T〇等之透明金屬氧化物爲佳。尙，爲了令脫膜性良好，亦可於轉印型1之無機質被膜5之表面再形成鱲類、氟系樹脂、蜜胺系樹脂、砂油或聚矽氧樹脂等脫模劑之被膜。圖型溝4之深度及寬度可根據目的而適當設定，但_ 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公羞) " ' ' - (請先閱讀背面之注意事項再填寫本頁)、 1T This paper size applies Chinese National Standard (CNS) A4 specification (210X297). 13- 1228264 A7 B7 5. Description of the invention L) Good and 1-molecule liquid monofunctional light hardening with an ethylenically unsaturated double bond The polyfunctional photocurable compound (C-1) is preferably a polyfunctional photocurable compound (c-2) having excellent photocurability and having two or more, preferably three or more ethylenically unsaturated double bonds in one molecule. By using 'in combination,' it can become a good paste because of its multiplicative effect, and the paste filling property of the recessed part and the transferability after light curing are further improved, and it can be easily obtained from the imprint type. As a result, sufficient light hardening depth can be obtained as a result. Although the ratio of the liquid monofunctional photocurable compound (C-1) to the polyfunctional photocurable compound (C-2) also varies depending on the molecular weight and solubility of the aforementioned binder polymer (B), the ratio ( C -1): (C 1-2) = 1: 0 · 1 ~ 1 0, preferably 1: 0 · 1 ~ 2. Specific examples of the photopolymerization initiator (D) include benzoin and benzoin alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; acetophenone , 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, etc. Class; 2-methyl-1, 1- [4- (methylthio) phenyl], 2-morpholinylpropane, 1-one, 2-benzyl, 2-dimethylamino, 1-1 (4-1? Phenylphenyl) amine acetophenones such as butane-1 monoketone; 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone, Anthraquinones such as 2-pentylanthraquinone; 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropyl Thioxanthones such as thioxanthone; acetals such as acetophenone acetal and benzyl dimethyl acetal; benzophenones such as benzophenone This paper applies Chinese national standards (CNS) ) A4 specification (210X tear public envy) (Please read the precautions on the back before filling this page), τ. Printed by the Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -15-1228264 A7 B7 V. Description of the invention) (Please read the precautions on the back before filling this page), Gu Ting Xing class, (2' 6 —dimethoxybenzene (Methyl alcohol) —2,4,4 monopentylphosphine oxide, bis (2,4,6-trimethylbenzidine) monophenylphosphine oxide, ethyl-2,4′6-trimethylbenzyl Phosphine oxides such as phenylphenylphosphinate; various peroxides; 1,7-bis (9-d-apryloyl) heptane, etc., and these well-known and commonly used photopolymerization initiators can be used alone or in combination Use two or more. The blending ratio of these photopolymerization initiators (D) is preferably 1 to 20 parts by mass per 1,000 parts by mass of the aforementioned binder polymer (B). In addition, as the photopolymerization initiator (D) described above, N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, and pentyl-4-dimethylamino group One or two or more types of known and commonly used photosensitizers such as tertiary amines such as benzoate, triethylamine, and triethanolamine are used in combination. Furthermore, when a deeper light-hardening depth is required, if necessary, a titanium system photopolymerization initiator (GI 7 8 4 etc., manufactured by Ciba Specialty Chemicals, Inc., which initiates radical polymerization in the visible region, can be used. Pigment pigments, leuco dyes, etc. are used as a combination of hardening auxiliaries. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is printed on the light-curable paste composition of the present invention, and if necessary, in order to make a stable paste, suitable Dispersant for inorganic fine particles, as well as various additives for viscosity adjustment, and various additives such as fluidity modifiers, plasticizers, stabilizers, defoamers, leveling agents, release agents, silane coupling agents, etc. It can also be added in a small amount. The dispersant can be a compound having a carboxyl group, a hydroxyl group, an acid ester, and a polar group having affinity with glass fine particles, and a polymer compound, such as an acid compound such as a phosphate ester, and an oxygen-containing copolymer. Material, hydroxyl-containing poly-paper This paper applies Chinese National Standard (CNS) A4 specification (210X297 mm) 16-1228264 Δ7 Α7 Β7 Employees of Intellectual Property Bureau, Ministry of Economic Affairs Five cooperative printing fee, the invention described L) acid esters, polyoxyethylene alkyl silicon oxide, long chain amine salts of poly Amides and esters of the like. Particularly suitable commercially available dispersants include Disperbyk (registered trademark) —101, —103, —110, —111, —160, and —3 0 0 (all made by Beak Chemy). The compounding amount of such a dispersant is preferably 0. 0 to 1 to 5 parts by mass per 100 parts by mass of the inorganic fine particles (A). Examples of the diluting solvent include toluene, xylene, tetramethylbenzene, and Sorbiso # 100, Sorbiso # 150, Sorbiso # 200, Exon Aromatic Naphtha No. 2 manufactured by Exon Chemical Co., Ltd., LAWS, HAWS, VLAWS manufactured by Shell Co., Ltd. , Shellsol D40, D70, D100, 70, 71, 72, A, AB, R, DOSB, DOSB-8 and other aromatic solvents; Exon Chemical Co., Ltd. Exon Naphtha No. 5, No. 6. No.7. Exon Orderless Solvent, Exon Labor Solvent and other monthly family solvents; methanol, ethanol, propanol, isopropanol, butanol, hexanol, cellosolve, butyl cellosolve, carbitol, butyl Alcohol solvents such as carbitol; Ester solvents such as ethyl acetate, butyl acetate, cellosolve acetate, carbitol acetate, methyl lactate, ethyl lactate, butyl lactate, and the like. Hereinafter, a suitable example of a method for producing a patterned inorganic calcined film using the photocurable paste composition of the present invention will be described with reference to the accompanying drawings, taking the method of forming a partition wall between the P D P back plates as an example. First, as shown in FIG. 1 (A), a transfer pattern 1 is prepared on a mold substrate 2 to form a resin coating layer 3 having a predetermined pattern groove 4. As shown in FIG. Alternatively, pattern grooves can also be formed on the substrate of transfer type 1 by laser processing, etc. 〇 This paper size applies Chinese National Standard (CNS) A4 specifications (210X297 mm) (Please read the precautions on the back before filling in this Page), 1T -17- 151228264 A7 B7 V. Description of the invention (Material for the substrate 2 can be exemplified by a film or sheet of metal, ceramic, glass, polymer material, etc., or a composite sheet thereof. 尙, by the model substrate 2 When the side is irradiated with active energy rays, such as ultraviolet rays, a light transmissive material, such as a transparent glass substrate, can be used for the model substrate 2. On the other hand, when the ultraviolet rays are irradiated only from the substrate side of the overlap transfer type, a light reflective substrate is preferably used. As the model substrate 2, the irradiated ultraviolet rays can be reflected by the light-reflective substrate even if they pass through the paste composition, and are absorbed again by the paste composition, so the irradiated ultraviolet rays can be effectively used Examples of such light-reflective substrates include silver-white metals such as a white glass layer, a white resin layer, and aluminum foil formed on or on the surface of a transparent glass substrate or on the substrate. The method of forming the resin coating layer 3 having the pattern groove 4 on the model substrate 2 as described above may be a printing method, a photographing method, a drawing method, a sandblasting method, etc. In the case of the printing method, the gravure And the roller gravure are filled with a resin varnish containing the aforementioned thermosetting resin, photosensitive resin, heat-drying resin, etc., and then 'transferred on a model substrate and subjected to heat treatment or irradiation with active energy rays, then It can form a resin coating layer with a groove with a specified pattern. In the case of the photographic method, a photo-curable component such as that described above is formed on a model substrate by a suitable method such as a screen printing method, a roll coating method, or a curtain coating method. Coating of a resin composition, or laminating a photosensitive dry film, exposing it through a mask having a specified exposure pattern, and developing a resin coating layer having a specified pattern groove. On the other hand, drawing In the case of the method, a resin coating film layer is formed on the model substrate, and heat treatment or active energy is applied. The paper size applies the Zhongguanjia Standard (CNS) A4 specification (21G X: 297 mm). One '(Please Read the notes on the back and fill in this page.) Order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperatives-18- 1228264 A7 B7 V. Description of the invention (16) After the irradiation of the wire is hardened, for example, laser processing is used to form the specified pattern. Groove section: In the case of sandblasting, the photoresist film with the specified pattern holes formed on the above-mentioned hardened coating layer or semi-hardened coating film layer is superimposed and sprayed to form the groove section. In addition, a thermoplastic resin film can also be formed on the model substrate. Laminate, and heat-soften the relief pattern to form the designated pattern grooves. As described above, the model substrate 2 with the resin coating layer 3 having the designated pattern grooves 4 is formed, preferably the inorganic coating 5 is used for the coating. The inorganic coating film 5 is a film formed by giving the resin coating layer 3 sufficient strength and hardness, filling the pattern groove 4 with a paste composition, and improving the mold release property after hardening. In the case where the resin coating layer 3 is formed of a photosensitive drying film, the photocurable glass paste composition is buried in the pattern groove 4 and the photosensitive drying film and the paste are prevented by light irradiation. The effect of the photosensitive components of the composition reacting with each other. The inorganic coating 5 is suitably made of various metals such as nickel, gold, aluminum, iron, or the like, and various ceramics such as metal oxides. The inorganic coating can be applied by various methods such as electroless plating or electroplating, vacuum deposition, sputtering, and ion plating. In other words, in the case where the model substrate 2 is a light-transmitting substrate such as a transparent glass substrate, it is preferable to use a transparent metal oxide such as tin oxide or ITO. In other words, in order to improve the release property, a film of a release agent such as a fluorene type, a fluorine resin, a melamine resin, a sand oil, or a silicone resin may be formed on the surface of the inorganic coating film 5 of the transfer type 1. The depth and width of the pattern groove 4 can be set appropriately according to the purpose, but _ This paper size applies the Chinese National Standard (CNS) A4 specification (210X297), " ''-(Please read the precautions on the back before filling in this page)

、1T 經濟部智慧財產局員工消費合作社印製 -19- A7 1228264 __B7 五、發明説明（17 ) 般於形成電極圖型之情形中爲5〜1 0 0 // m左右，於形成間隔壁圖型之情形中以5 0〜2 0 0 // m左右爲適當。其次，如圖1 ( A )所示般，於轉印型1之圖型溝4 內，經由刮墨輥、輥塗器、刮刀等適當手段，以光硬化性玻璃糊料組成物1 0將樹脂被膜層3充塡至完全無法察見爲止。其係用於令基板1 1於其後之工程中可直接接觸糊料組成物1 0。於樹脂被膜層3之上方所露出之光硬化性玻璃糊料組成物1 0部分之厚度，可考慮脫泡時之收縮程度而適當設定即可，但一般必須爲約1 // m以上，較佳爲約5 // m以上。但，若考慮曝光時之光硬化性玻璃糊料組成物的光硬化深度，則期望不要過厚，且一般期望以約 5 0 //m以下，較佳爲約2 0 //m以下左右。其次，較佳於減壓下脫泡。又，含有溶劑之糊料組成物之情況，亦可於6 0〜1 2 0 °C左右之溫度下加熱乾燥並且部分或大約完全地令溶劑蒸發。如上述，於轉印型1之圖型溝4中將光硬化性玻璃糊料組成物1 0完全充塡後，如圖1 ( B )所示般，將玻璃基板等之透明基板1 1予以貼合。此時，令透明基板1 1 爲緊密密合糊料組成物1 〇地，於加壓下貼合亦可。又，於對向之一對押壓輥間，將圖型溝4內充塡光硬化性玻璃糊料組成物1 〇之轉印型1與透明基板1 1 一邊送給一邊壓粘即可。其後，如圖1 ( C )所示般，由透明基板1 1側照射活性能量線，令光硬化性玻璃糊料組成物光硬化。尙，如本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂經濟部智慧財產局員工消費合作社印製 -20 - 1228264 A7 B7 經濟部智慧財產局員工消費合作社印製五、發明説明（18 ) 前述，於模型基板2爲光穿透性基板之情形中，亦可由模型基板2側照射活性能量線。照射光源可使用低壓水銀燈、中壓水銀燈、超高壓水銀燈、氙燈、碳弧燈、金屬鹵素燈、螢光燈、鹵素燈、氬離子激光、氨鎘激光、氮氖激光、氪離子激光、各種半導體激光、Y A G激光、發光二極管等。其後，如圖1 ( D )所示般，將透明基板1 1與轉印型1上顛倒反轉後，如圖1 ( E )所示般，將透明基板 i 1與其所接合之硬化玻璃糊料組成物1 〇 a由轉印型1 剝離。此時，硬化性玻璃糊料組成物1 0 a爲經由前述光硬化而有若干收縮，故比較容易進行脫型。又，於預先以脫模劑處理轉印型之情形中，可更加順利地進行脫型。其次，將如此處理所得之透明基板1 1及其所接合之硬化玻璃糊料組成物1 0 a予以煅燒，則可取得於透明基板上一體形成出指定圖型間隔壁之P D P背面板。煅燒工程例如於空氣中或氮氛圍氣下以約3 8 0 °C〜 6 0 0 °C左右之溫度進行爲佳。又，此時，煅燒工程之前階段爲於約3 0 0〜5 0 0 t中加熱並於此溫度保持指定時間，且進入除去有機成分之工程爲佳。其次，對於使用如前述所製作之轉印型1並形成導體電路圖型和黑色矩陣圖型之方法，一邊參照圖2 —邊予以說明。導體電路和電阻體之情況因在各圖型線連繫之狀態中出現問題，故必須考慮作成將各圖型線予以分離之狀態〇本紙張尺度適用中國國家標準（CNS ) A4規格(YlO'〆297公釐） " (請先閲讀背面之注意事項再填寫本頁) -21 - 1228264 A7 B7 經濟部智慧財產局員工消費合作社印製五、發明説明（19 ) 首先，如圖2 ( A )所示般，於轉印型1之圖型溝4 內，經由刮墨輥、輥塗器、刮刀等適當手段，光硬化性導電性糊料組成物（或黑色矩陣用糊料組成物）1 0 /將樹月旨被膜層3充塡至完全無法察見爲止。其次，較佳於減壓下脫泡。又，於含有溶劑之糊料組成物之情況，亦可於 6 0〜1 2 0 t左右之溫度下加熱乾燥且部分或大約完全地令溶劑蒸發。其後，將轉印型1上面殘留之糊料組成物經由刮刀等適當手段刮取，令光硬化性導電性糊料組成物 (或黑色矩陣用糊料組成物）1 0 >之上面爲與轉印型1 之上面（無機質被膜5之上面）爲同一面。如此，僅令轉印型1之圖型溝4以光硬化性導電性糊料組成物（或黑色矩陣用糊料組成物）1 0 >完全充塡後，如圖2 ( B )所示般，將玻璃基板等之透明基板1 1貼合。此時，較佳令透明基板1 1爲緊密密合光硬化性導電性糊料組成物（或黑色矩陣用糊料組成物）1 0 >地，如前述於加壓下貼合。其後，如圖2 ( C )所示般，由透明基板1 1側照射活性能量線，令光硬化性糊料組成物光硬化。尙，如前述，於模型基板2爲光穿透性基板之情形中，亦可由模型基板2側照射活性能量線。其後，如圖2 ( D )所示般，將透明基板1 1與轉印型1上下顛倒反轉後，如圖2 ( E )所示般，將透明基板 1 1與其所接合之硬化玻璃糊料組成物1 〇 a >由轉印型 1剝離。 (請先閲讀背面之注意事項再填寫本頁) 、?τ 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） -22- 1228264 A7 B7 五、發明説明k ) 其次，將如此處理所得之透明基板1 1及其所接合之硬化糊料組成物1 0 a /如前述煅燒，則可取得於透明基板上一體形成出指定導體電路圖型（或黑色矩陣圖型）之基板。尙，於P D P之總線電極之形成中，除了可將導電性糊料，例如將銀糊料之白層僅以一層印刷椴燒之情況以外，亦可爲了賦與對比性而將添加黑色顏料之銀糊料的黑層予以印刷、乾燥後，爲了令添加顏料所上升之阻力降低，可於其上將銀糊料之白層印刷後，進行煅燒工程即可，當然此類層合被膜之锻燒亦可應用於本發明。此類情形中，於轉印型之圖型溝中首先將黑銀糊料部分充塡，其次以充塡白銀糊料之順序進行即可。以同樣之方法亦可形成三層以上的煅燒物圖型。尙，本發明之光硬化性糊料組成物並非僅限定於前述方法，所有利用形成指定圖型溝（凹）部並且成形出無機質煅燒圖型之方法均可適用。以下示出使用本發明之光硬化性玻璃糊料組成物，形成P D P用間隔壁圖型之實施例。光硬化性玻璃糊料組成物之調製：實施例1〜9 配合下述表1所示之各成分，令其攪拌分散並且調製光硬化性玻璃糊料組成物。尙，玻璃微粒子爲使用具有Pb〇 6 0 % ^ B 2 0 3 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) 訂線表經濟部智慧財產局員工消費合作社印製 -23- 1228264 A7 B7 五、發明説明b ) 20%、 S i Ο 2 15%、 A 1 2 Ο 3 5% 之組成，且玻璃態化溫度4 4 5 °C、平均粒徑1 · 6 // m之物質，並且配合氧化鈦白色顏料（平均粒徑約〇 · 2 5 // m )及做爲無機充塡劑之氧化鋁（平均粒徑約2 // m )。另一方面’將不具有乙烯性不飽和雙鍵之高分子量之丙烯酸樹脂聚合物（三菱麗昂公司製、BR — 1 〇 1、分子量：160，000)溶解於單官能丙烯酸系單體（共榮社公司製、Light Acrylate E(A)，並再添加三官能丙烯酸系單體（東亞合成公司製，Μ - 3 5 0 )做爲交聯劑則可調製粘合劑成分。又，不具有乙烯性不飽和雙鍵之粘合劑成分除了上述之丙烯酸樹脂聚合物以外，可使用丙烯酸樹脂聚合物（三菱麗昂公司製，BR - 105、分子量：5 5，000)或乙基纖維素（ H e r c u 1 e s I n c .公司製，Ν -1 4 )則可同樣調製。比較例1〜6 配合下述表2所示之各成分，並與前述實施例1〜9 同樣攪拌分散，調製光硬化性玻璃糊料組成物。但，粘合劑成分爲使用雙酚Α型環氧樹脂（Japan Epoxy Resin公司製、Epicoat 1001 )或具有不飽和雙鍵之共聚低丙烯酸酯 (大阪有機化學工業公司製，Ruler M101、甲基丙烯酸酯共聚物之丙烯酸加成物）。玻璃糊料硬化物之形成：本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂經濟部智慧財產局員工消費合作社印製 24- 1228264 A7 B7 五、發明説明<22 ) 於玻璃基板上將感光性乾燥薄膜張貼，並對依據光學平版印刷法形成指定圖型之具有高度1 7 0 // m、寬5 5 // m圖型溝之樹脂被膜層，以濺鍍將I T〇（氧化錫銦）覆被成3 // m膜厚，製作轉印型。其次，對此轉印型之溝部將上述各實施例及各比較例光硬化性玻璃糊料組成物，經由刮刀法埋入充塡後，將玻璃基板重疊密合，並由玻璃基板側以高壓水銀燈U V輸送帶予以曝光，令玻璃糊料硬化。其次，將轉印型由玻璃基板中脫模，取得玻璃基板上玻璃糊料硬化物爲接石狀態之轉印物。所得之轉印物使用電爐於空氣中煅燒。觀察上述過程之充塡性、U V硬化後之轉印性、煅燒後之剝離、及煅燒後之發泡狀態，並如下評價。其結果合倂示於下述表1及表2。充塡性：觀察光硬化性玻璃糊料組成物之轉印型溝部之充塡狀態，並依下述基準評價。 ◎:溝部全體爲輕易充塡糊料組成物。〇：溝部全部爲充塡糊料組成物。 △:於溝部有少許無法充塡之部分。 X :於溝部發生許多無法充塡之部分。 U V硬化後之轉印性： U V硬化後，將玻璃基板由轉印型上脫模’並觀察轉本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁)Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of the 1T-19-19 A7 1228264 __B7 V. Description of the invention (17) Generally in the case of forming an electrode pattern, it is about 5 ~ 1 0 0 // m. In the case of type, about 50 to 2 0 0 // m is appropriate. Next, as shown in FIG. 1 (A), in the pattern groove 4 of the transfer type 1, the photocurable glass paste composition 10 is transferred to the photocurable glass paste composition 10 through an appropriate means such as an ink scraping roller, a roll coater, and a doctor blade. The resin coating layer 3 was filled until it was completely invisible. It is used to make the substrate 11 directly contact the paste composition 10 in subsequent processes. The thickness of the part 10 of the photocurable glass paste composition exposed above the resin coating layer 3 can be appropriately set in consideration of the degree of shrinkage during defoaming, but generally must be about 1 // m or more, and It is preferably about 5 // m or more. However, if the light-hardening depth of the light-hardenable glass paste composition at the time of exposure is considered, it is desirable not to be too thick, and it is generally desirable to be about 50 / m or less, preferably about 20 / m or less. Secondly, it is preferable to defoam under reduced pressure. In the case of a paste composition containing a solvent, the solvent may be heated and dried at a temperature of about 60 to 120 ° C and the solvent may be partially or approximately completely evaporated. As described above, after the photocurable glass paste composition 10 is completely filled in the pattern groove 4 of the transfer type 1, as shown in FIG. 1 (B), a transparent substrate 11 such as a glass substrate is applied. fit. At this time, the transparent substrate 1 1 may be made to closely adhere to the paste composition 10, and may be bonded under pressure. In addition, between the pair of pressing rollers facing each other, the pattern groove 4 is filled with the transfer type 1 of the photo-curable glass paste composition 1 0 and the transparent substrate 1 1 while being fed and pressed. Thereafter, as shown in FIG. 1 (C), the active energy rays are irradiated from the transparent substrate 11 side to photo-harden the photo-curable glass paste composition.尙, if this paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the precautions on the back before filling this page) Order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives -20-1228264 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (18) As mentioned above, in the case where the model substrate 2 is a light-transmitting substrate, the active energy rays can also be irradiated from the model substrate 2 side. Irradiation light source can use low-pressure mercury lamp, medium-pressure mercury lamp, ultra-high pressure mercury lamp, xenon lamp, carbon arc lamp, metal halide lamp, fluorescent lamp, halogen lamp, argon ion laser, ammonia cadmium laser, nitrogen neon laser, krypton ion laser, various semiconductors Laser, YAG laser, light emitting diode, etc. Thereafter, as shown in FIG. 1 (D), after the transparent substrate 11 and the transfer type 1 are turned upside down, as shown in FIG. 1 (E), the transparent substrate i1 and the hardened glass to which it is bonded are bonded. The paste composition 10a is peeled from the transfer type 1. At this time, since the hardening glass paste composition 10 a has some shrinkage due to the aforementioned light curing, it is relatively easy to release. When the transfer type is treated with a release agent in advance, the release can be performed more smoothly. Secondly, the transparent substrate 11 thus obtained and the bonded glass paste composition 10 a to which it is processed are calcined, so that a P D P back plate on which a predetermined pattern partition wall is integrally formed on the transparent substrate can be obtained. The calcination process is preferably performed in the air or under a nitrogen atmosphere at a temperature of about 380 ° C to 600 ° C. At this time, it is preferable that the stage before the calcination process is heating in about 300 to 500 t and maintained at this temperature for a specified time, and the process of removing organic components is preferred. Next, a method for forming a conductive circuit pattern and a black matrix pattern using the transfer pattern 1 prepared as described above will be described with reference to FIG. 2. The situation of the conductor circuit and the resistor is problematic in the state where the pattern lines are connected. Therefore, it must be considered to separate the pattern lines. This paper size applies the Chinese National Standard (CNS) A4 specification (YlO ' (〆297mm) " (Please read the precautions on the back before filling this page) -21-1228264 A7 B7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (19) First, as shown in Figure 2 (A As shown in the figure, in the pattern groove 4 of the transfer type 1, a photocurable conductive paste composition (or a black matrix paste composition) is passed through appropriate means such as a doctor roller, a roll coater, and a doctor blade. 1 0 / Fill Shuyuezhi Capsule Layer 3 until completely invisible. Secondly, it is preferable to defoam under reduced pressure. In the case of a paste composition containing a solvent, the solvent may be heated and dried at a temperature of about 60 to 120 t and the solvent may be partially or approximately completely evaporated. Thereafter, the paste composition remaining on the top of the transfer type 1 is scraped off by an appropriate means such as a doctor blade to make the photocurable conductive paste composition (or the paste composition for the black matrix) 1 0 > It is the same surface as the upper surface of the transfer type 1 (the upper surface of the inorganic film 5). In this way, only the pattern groove 4 of the transfer type 1 is completely filled with the photocurable conductive paste composition (or the paste composition for the black matrix) 1 > as shown in FIG. 2 (B) Generally, a transparent substrate 11 such as a glass substrate is bonded. At this time, it is preferable that the transparent substrate 11 be closely adhered to the photocurable conductive paste composition (or the paste composition for the black matrix) 1 > and bonded under pressure as described above. Thereafter, as shown in FIG. 2 (C), the active energy rays are irradiated from the transparent substrate 11 side to photo-harden the photo-curable paste composition. Alas, as mentioned above, in the case where the model substrate 2 is a light-transmitting substrate, the active energy rays can also be irradiated from the model substrate 2 side. Thereafter, as shown in FIG. 2 (D), after the transparent substrate 11 and the transfer type 1 are turned upside down, as shown in FIG. 2 (E), the transparent substrate 11 and the hardened glass to which it is bonded are bonded. The paste composition 10a > was peeled off from the transfer type 1. (Please read the precautions on the back before filling out this page),? Τ This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) -22-1228264 A7 B7 V. Description of the invention k) Second, it will be The obtained transparent substrate 11 and the hardened paste composition 10a bonded thereto can be obtained as described above, and a substrate on which the specified conductor circuit pattern (or black matrix pattern) is integrally formed on the transparent substrate can be obtained. Alas, in the formation of the bus electrode of PDP, in addition to the case where the conductive paste, such as the white layer of silver paste, is printed with only one layer, the black pigment can also be added for the sake of contrast. After the black layer of silver paste is printed and dried, in order to reduce the resistance of adding pigment, the white layer of silver paste can be printed on it and then calcined. Of course, the forging of such laminated films Sintering is also applicable to the present invention. In such cases, in the transfer pattern groove, the black and silver paste is first filled, and then the silver paste is filled in the order. In the same way, a pattern of three or more layers of the calcined product can be formed. Alas, the photocurable paste composition of the present invention is not limited to the aforementioned method, and any method for forming a predetermined pattern groove (concave) and forming an inorganic calcined pattern can be applied. An example of forming a partition wall pattern for P D P using the photocurable glass paste composition of the present invention is shown below. Preparation of photocurable glass paste composition: Examples 1 to 9 The components shown in Table 1 below were blended and dispersed while stirring to prepare a photocurable glass paste composition. Alas, the glass particles are Pb0 60% ^ B 2 0 3 This paper size is applicable to China National Standard (CNS) A4 specifications (210X297 mm) (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs -23- 1228264 A7 B7 V. Description of Invention b) 20%, S i Ο 2 15%, A 1 2 Ο 3 5%, and glass transition temperature 4 4 5 ° C, a substance with an average particle size of 1 · 6 // m, combined with a titanium dioxide white pigment (average particle size of about 0.25 // m) and alumina as an inorganic filler (average particle size of about 2 // m). On the other hand, a high-molecular-weight acrylic resin polymer (manufactured by Mitsubishi Leon Corporation, BR — 101, molecular weight: 160,000) having no ethylenically unsaturated double bonds was dissolved in a monofunctional acrylic monomer (copolymer Manufactured by Sakae Corporation, Light Acrylate E (A), and added with a trifunctional acrylic monomer (manufactured by Toa Kosei Co., Ltd., M-350) as a cross-linking agent to prepare an adhesive component. Also, it does not have As the binder component of the ethylenically unsaturated double bond, in addition to the acrylic resin polymer described above, an acrylic resin polymer (manufactured by Mitsubishi Leon Corporation, BR-105, molecular weight: 5,000) or ethyl cellulose ( Hercu 1 es I nc., Manufactured by the company, N -1 4) can be prepared in the same manner. Comparative Examples 1 to 6 The components shown in Table 2 below are blended, and they are stirred and dispersed in the same manner as in Examples 1 to 9 above to modulate light. A hardening glass paste composition. However, the binder component is a bisphenol A type epoxy resin (Epicoat 1001 manufactured by Japan Epoxy Resin Co., Ltd.) or a copolymerized low acrylate (Osaka Organic Chemical Industry Co., Ltd.) having an unsaturated double bond. System, Ruler M101, Acrylic adduct of acrylic acrylate copolymer). Formation of hardened glass paste: This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling this page) Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 24-1228264 A7 B7 V. Description of the invention < 22) Post the photosensitive dry film on the glass substrate and have a height of 1 to form the specified pattern according to optical lithography 7 0 // m, width 5 5 // m pattern groove of the resin coating layer, IT 0 (indium tin oxide) was sputtered to a thickness of 3 // m to make a transfer type. Next, in the transfer-type groove portion, the photocurable glass paste composition of each of the above Examples and Comparative Examples was embedded and charged by a doctor blade method, and then the glass substrates were overlapped and adhered, and the glass substrate side was pressurized at a high pressure. The mercury lamp UV conveyor belt is exposed to harden the glass paste. Next, the transfer type was released from the glass substrate to obtain a transfer material in which the cured glass paste on the glass substrate was in a stone-bonded state. The obtained transfer material was calcined in the air using an electric furnace. The filling properties of the above process, transferability after UV curing, peeling after firing, and foaming state after firing were observed and evaluated as follows. The results are shown in Tables 1 and 2 below. Filling property: The filling state of the transfer type groove portion of the photocurable glass paste composition was observed and evaluated in accordance with the following criteria. :: The entire groove portion is a composition for easily filling the paste. 〇: The grooves are all filled with a paste composition. △: There is a part that cannot be filled in the groove part. X: Many unfilled parts occur in the ditch. Transferability after UV curing: After UV curing, release the glass substrate from the transfer type and observe the paper size. Applicable to China National Standard (CNS) A4 (210X297 mm) (Fill in this page again)

、1T 經濟部智慧財產局員工消費合作社印製 -25- 1228264 A7 B7 五、發明説明（23 ) 印物於玻璃基板上轉印之狀態，且依下述基準評價。 ◎:轉印物爲輕易且確實地轉印。〇：轉印物確實被轉印。 △:轉印物察見少許缺損。 X :轉印物察見許多缺損。煅燒後之剝離：觀察煅燒後之玻璃基板，並依下述基準評價所形成煅燒物之狀態。〇：煅燒物完全未發生剝離。 △:煅燒物發生少許剝離。 X :煅燒物發生剝離。煅燒後之發泡：觀察煅燒後所得煅燒物之截面，並且評價有無發泡。 (請先閲讀背面之注意事項再填寫本頁) 訂經濟部智慧財產局員工消費合作社印製本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -26- 1228264 at B7 五、發明説明（24 ) 表1 組成(質量份)及特性實施例 1 2 3 4 5 6 7 8 9 10 11 玻璃微粒子 100 100 100 100 100 100 100 100 100 100 100 氧化鋁 15 15 15 15 15 15 15 15 15 15 15 氧化鈦 5 5 5 5 5 5 5 5 5 5 5 粘合劑聚合物 BR-ΙΟΓ) 10 10 2 5 - - - - 10 10 10 BR-105*2) - - - - 10 20 - - - - - N-14*3) - - - - - - 2 2 - - - 單官能單體Μ 10 6 10 10 10 20 20 10 2 - 12 多官能單體+5) 2 6 10 2 2 4 5 5 10 12 - 光聚合引發®r 3 3 3 3 3 6 3 3 3 3 3 分散劑*7) - 0.5 - - - - - - - - - 稀釋溶劑*8) - - - - - - - 1 - - - 充塡性 ◎ ◎ ◎ ◎ ◎ ◎ 〇〇〇〇 ◎ UV硬化後轉印性 ◎ ◎ ◎ ◎ ◎ ◎ 〇〇〇 ◎ 〇煅燒後剝離〇〇〇〇〇〇〇〇〇〇〇煅燒後發泡 Μ j \\\ Μ J \ Μ j \\\ 並並姐並 j\w Μ j\\\ Μ 並 j\\\ *1):丙烯酸棚旨聚合物(三菱麗昂公司製，分子量16,000) *2):丙烯酸樹脂聚合物(三菱麗昂公司製，分子量55,000) 備 *3):乙基纖維素(Hercules Inc.社製） *4):單官能丙烯酸系單體(共榮公司製，Light Acrylate ECA) 考 *5): 3官能丙烯酸系單體凍亞合成公司製，M-350) *6): 2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉胺基丙酮-l(Ciba Specialty, Chemicals公司製， IRUGACURE-907) *7): Beak Chemy 公司製，Disperbyk-111 *8):卡必醇醋酸酯 _ (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） -27- 1228264 A7 B7 五、發明説明（25 ) (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製表2 組成(質量份)及特性比較例 1 2 3 4 5 6 玻璃微粒子 100 100 100 100 100 100 氧化鋁 15 15 15 15 15 15 氧化鈦 5 5 5 5 5 5 粘合劑聚合物 Epicoat 100Γ1) 10 5 2 Ruler-MlOl12) 10 5 2 單官能單體+4) 10 - 6 10 - 6 多官能單體+5) 2 12 6 2 12 6 光聚合引發劑+6) 3 3 3 3 3 3 分散劑17) - - 0.5- - - 0.5 稀釋溶劑， - 2 - - 2 - 充塡性 Δ X Δ X Δ Δ UV硬化後轉印性 X Δ Δ △ X Δ 煅燒後剝離 Δ X X X X X 煅燒後發泡有有有有有有備*1):雙酚A型環氧樹脂(Japan Epoxy Resin公司製）考*2):甲基丙烯酸酯共聚物之丙烯酸加成物(大阪有機化學工業公司製) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -28- 1 4)〜18):同表1之14)〜18) 1228264 A7 B7 經濟部智慧財產局員工消費合作社印製五、發明説明（26 ) 由上述表1及表2所示之結果可知’經由使用本發明之光硬化性玻璃糊料組成物，則可令對於溝部之埋入性良好，於煅燒時不會產生圖型剝離和裂縫、氣泡發生，且可形成緻密的煅燒物。發明之效果如以上所說明般，本發明之光硬化性糊料組成物即使於無溶劑或不多溶劑含量，亦可形成良好的糊料，並且對於凹部之充塡性良好，且光硬化性優良，又，於煅燒時不會產生圖型剝離和裂縫、氣泡發生，且圖型形成性優良。又，使用將前述粘合劑聚合物（B )溶解於前述光硬化性化合物（C )之至少一種中，更且，將液狀單官能光硬化性化合物和多官能光硬化性化合物組合使用做爲該光硬化性化合物（C )，則可今對於凹部之糊料充塡性和光硬化後之轉印性等更加提高。其結果，本發明之光硬化性糊料組成物對於凹部之充塡性良好，且光硬化性優良，又，於煅燒時不會產生圖型剝離和裂縫、氣泡發生，且圖型形成性優良，故適合使用於利用形成指定圖型溝（凹）部並且形成無機質煅燒圖型之方法中，且有利適用於PDP、 FED、 LCD、螢光顯示裝置、混合集成電路等中之間隔壁圖型、電極（導體電路）圖型、介電體（電阻體）圖型、黑色矩陣圖型等之形成。即’若根據本發明之方法，則爲提供生產性良好且較 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS )八4規格（21〇Χ297公釐） -29- 1228264 Λ7 B7 五、發明説明（^ ) 低費用之前述光硬化性糊料組成物之煅燒物所構成之間隔壁圖型、電極（導體電路）圖型、介電體（電阻體）圖型燒煅質機無的成形所型圖燒煅質機無之等型。圖板陣基矩成色形黑型 ' 圖 (請先閲讀背面之注意事項再填寫本頁) 訂線< 經濟部智慧財產局員工消費合作社印製本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -30-Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of 1T -25- 1228264 A7 B7 V. Description of the invention (23) The state of the printed matter on the glass substrate and evaluated according to the following criteria. :: The transfer material is easily and surely transferred. ○: The transfer material is surely transferred. (Triangle | delta): A little defect was recognized in the transfer material. X: Many defects were observed on the transfer material. Peeling after firing: The glass substrate after firing was observed, and the state of the fired product formed was evaluated according to the following criteria. ○: No peeling of the calcined product occurred. (Triangle | delta): The calcined thing peeled a little. X: The calcined product was peeled. Foaming after calcination: The cross section of the calcined product obtained after calcination was observed, and the presence or absence of foaming was evaluated. (Please read the notes on the back before filling this page) Order the paper printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, and apply the Chinese National Standard (CNS) A4 specification (210X297 mm) -26- 1228264 at B7 V. Invention Explanation (24) Table 1 Composition (parts by mass) and characteristics Example 1 2 3 4 5 6 7 8 9 10 11 Glass fine particles 100 100 100 100 100 100 100 100 100 100 Alumina 15 15 15 15 15 15 15 15 15 15 15 Titanium oxide 5 5 5 5 5 5 5 5 5 5 5 Binder polymer BR-ΙΟΓ) 10 10 2 5----10 10 10 BR-105 * 2)----10 20--- --N-14 * 3)------2 2---Monofunctional monomer M 10 6 10 10 10 20 20 10 2-12 Multifunctional monomer +5) 2 6 10 2 2 4 5 5 10 12-Photopolymerization Initiator® 3 3 3 3 3 6 3 3 3 3 3 Dispersant * 7)-0.5---------Diluted solvent * 8)-------1-- -Filling properties ◎ ◎ ◎ ◎ ◎ ◎ 〇〇〇〇〇 ◎ UV curing transfer ◎ ◎ ◎ ◎ ◎ ◎ 〇〇〇 ◎ 〇 peeling after calcination 0.00000 10000 foaming after calcination Μ j \\\ Μ J \ Μ j \\\ Bound sister j \ w Μ j \\\ Μ bj \\\ * 1): Acrylic polymer (manufactured by Mitsubishi Leon Corporation, molecular weight 16,000) * 2): Acrylic resin polymer (Mitsubishi Leon Corporation) (Molecular weight, 55,000) Preparation * 3): Ethylcellulose (manufactured by Hercules Inc.) * 4): Monofunctional acrylic monomer (manufactured by Kyoei Corporation, Light Acrylate ECA) * 5): 3-functional acrylic Monomer Corporation (M-350) * 6): 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinaminoacetone-1 (Ciba Specialty, Chemicals Corporation) (IRUGACURE-907) * 7): Beak Chemy, Disperbyk-111 * 8): Carbitol acetate_ (Please read the precautions on the back before filling this page) The paper size of the paper is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) -27- 1228264 A7 B7 V. Description of the invention (25) (Please read the notes on the back before filling this page) Intellectual Property of the Ministry of Economic Affairs Table 2 printed by Bureau employee consumer cooperatives Composition (parts by mass) and comparative characteristics 1 2 3 4 5 6 Glass particles 100 100 100 100 100 100 Alumina 15 15 15 15 15 15 Titanium oxide 5 5 5 5 5 5 Binder polymer Epicoat 100Γ1) 10 5 2 Ruler-MlOl12) 10 5 2 Monofunctional monomer + 4) 10-6 10-6 Multifunctional monomer + 5) 2 12 6 2 12 6 Photopolymerization initiator +6) 3 3 3 3 3 3 Dispersant 17)--0.5---0.5 Diluted solvent,-2--2-Filling property Δ X Δ X Δ Δ Transfer after UV curing X Δ Δ △ X Δ peeling after calcination Δ XXXXX foaming after calcination Yes Yes Yes Yes * 1): Bisphenol A epoxy resin (manufactured by Japan Epoxy Resin) * 2): methacrylate copolymerization Acrylic acid adducts (made by Osaka Organic Chemical Industry Co., Ltd.) This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -28- 1 4) ~ 18): same as Table 1-14) ~ 18) 1228264 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (26) From the results shown in Tables 1 and 2 above, it is known that 'the use of the light-hardening glass paste composition of the present invention can make It has a good embedding property for the groove part, and does not cause pattern peeling, cracks, or bubble generation during calcination, and can form a dense calcined product. Effects of the Invention As explained above, the photocurable paste composition of the present invention can form a good paste even without a solvent or a small amount of solvent, and has good filling properties for the recesses and photocurability. Excellent, pattern peeling, cracks, and bubbles do not occur during firing, and pattern formation is excellent. The binder polymer (B) is dissolved in at least one of the photocurable compounds (C), and a liquid monofunctional photocurable compound and a polyfunctional photocurable compound are used in combination. For this photocurable compound (C), it is possible to further improve the filling properties of the paste with respect to the recessed portions and the transferability after photocuring. As a result, the photocurable paste composition of the present invention has good filling properties for recessed portions, and has excellent photocurability, and does not cause pattern peeling, cracks, or bubble generation during firing, and has excellent pattern formation properties. Therefore, it is suitable to be used in the method of forming a designated pattern groove (concave) portion and forming an inorganic calcined pattern, and is suitable for partition wall patterns in PDP, FED, LCD, fluorescent display devices, hybrid integrated circuits, etc. Formation of electrode (conductor circuit) pattern, dielectric (resistor) pattern, black matrix pattern, etc. That is, 'If according to the method of the present invention, in order to provide good productivity and better (please read the precautions on the back before filling in this page) This paper size applies the Chinese National Standard (CNS) 8 4 specifications (21〇 × 297 mm) -29- 1228264 Λ7 B7 V. Description of the invention (^) Low-cost partition wall pattern, electrode (conductor circuit) pattern, dielectric body (resistor body) composed of the calcined product of the aforementioned photocurable paste composition The shape of the pattern calcining machine is not the same as the pattern calcining machine. Figure Array Basic Moment Color Shape Black Type (please read the notes on the back before filling out this page) Alignment < Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper applies Chinese National Standard (CNS) A4 specifications (210X297 mm) -30-

Claims

1228264 A8 B8 C8 D8 六、申請專利範圍第901 07538號申請專利案中文申請專利範圍修正本 (請先閱讀背面之注意事項再填寫本頁) 民國此年8月夂，切修正 .'，.......Ί 、 …' .’匕： * -. - -·.…_....二::上::': 1 . 一種光硬化性糊料組成物，其係爲利用指定圖型所形成之溝或凹部以形成圖型之方法中所使用的糊料組成物，其特徵爲食有（A )無機微粒子、（B )不具有乙烯性不飽和雙鍵之粘合劑聚合物、（C )光硬化性化合物，及（D )光聚合引發劑，該（C )光硬化性化合物係由1 分子中具有1個乙烯性不飽和雙鍵之液狀單官能光硬化性化合物（C 一 1 )、和1分子中具有2個以上乙烯性不飽和雙鍵之多官能光硬化性化合物（C - 2 )所成者。 2 .如申請專利範圍第1項之組成物，其係使用可溶解於至少1種該液狀單官能光硬化性化合物（C - 1 )之粘合劑聚合物（B )。經濟部智慧財產局員工消費合作社印製 3 .如申請專利範圍第1項之組·成物，其中該粘合劑聚合物（B )與該光硬化性化合物（C )之摻合比例以賓量比爲1:〇·5〜2〇。 4 .如申請專利範圍第1至3項中任一項之組成物，其中該液狀單官能光硬化性化合物（C - 1 )與多官能光硬化性化合物（C — 2 )之比率爲1 : 0 . 1〜1 0。 5 .如申請專利範圍第1至3項中任一項之組成物，其中該粘合劑聚合物（Β )係顯示熱塑性。 6 .如申請專利範圍第1至3項中任一項之組成物，本^張尺度適用中國國家襟準（CNS ) Α4規格（210Χ297公釐）~~ ABCD 1228264 六、申請專利範圍其中該粘合劑聚合物（B )係具有3，〇〇〇〜 30， 000之重量平均分子量。 7 ·如申請專利範圍第丨至3項中任一項之組成物，其中該粘合劑聚合物（B )爲由丙烯酸系多元醇、聚乙緒醇、聚乙烯縮醛、苯乙烯一烯丙醇、苯酚樹脂、共聚（甲基）丙烯酸酯樹脂、聚丙烯碳酸酯、烯烴系含羥基聚合物、含經基聚合物之經基經加成內酯之內酯改質聚合物、胺基樹脂之胺基經加成內酯之內酯改質聚合物、1分子中合倂有羥基或胺基與不飽和基之單體的均聚物、具有經內酯改質單體與含其他不飽和基之單體的共聚物、及纖維素衍生物所成群中選出之至少一種。 8 ·如申請專利範圍第1至3項中任一項之組成物，其中相對於每1 〇〇質量份之無機微粒子（A )，係含有 1〜5 0質量份之該粘合劑聚合物（B )。 9 ·如申請專利範圍第1至3項中任一項之組成物，其中該無機微粒子（A )係含有玻璃微粒子（A — 1 )、金屬微粒子（A - 2 )、黑色導電性微粒子（A — 3 ) ·、. 及陶瓷微粒子（A - 4 )所成群中選出之至少一種微粒子〇 1 0 .如申請專利範圍第1至3項中任一項之組成物，其中該無機微粒子（A )係至少含有玻璃微粒子（A -1 ) ° 1 1 .如申請專利範圍第1 0項之組成物，其中該粘合劑聚合物（B )係具有較該玻璃微粒子（A - 1 )之玻本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ^-- (請先閲讀背面之注意事項再填寫本頁) -訂· 經濟部智慧財產局員工消費合作社印製 1228264 A8 B8 C8 D8 夂、申請專利範圍璃轉移溫度爲低之熱分解溫度。 (請先閲讀背面之注意事項再填寫本頁) 1 2 .如申請專利範圍第1至3項中任一項之組成物，其尙含有無機顏料。 1 3 ·如申請專利範圍第1至3項中任一項之組成物，其尙含有無機酸、有機酸、無機磷酸、及有機磷酸所成群中選出之至少一種安定化劑。 1 4 ·如申請專利範圍第1至3項中任一項之組成物，其尙含有分散劑。 1 5 · —種無機質煅燒圖型之形成方法，其特徵爲包含準備具有指定圖型之溝或凹部之轉印型，且於該轉印型之上述溝或凹部內將如申請專利範圍第1項之光硬化性糊料組成物完全充塡之步驟；將轉印型接觸該糊料組成物以重疊被轉印材料之步驟；對該光硬化性糊料組成物照射活性能量線令其硬化之步驟；及剝離轉印型，且將被轉印材料上所轉印之硬化糊料組成物煅燒作成無機質煅燒圖型之各步驟。經濟部智慧財產局員工消費合作社印製 1 6 .如申請專利範圍第1 5項之方法，其中該轉.印型係具有於包含指定圖型溝或凹部內表面之表面經塗覆的無機質被膜。 1 7 .如申請專利範圍第1 6項之方法，其中該轉印型爲再具有於該無機質被膜上經塗覆之脫模劑被膜。 1 8 ·如申請專利範圍第1 5至1 7項中任一項之方法，其中該轉印型爲由模型基板、與該模型基板上所形成之具有指定圖型溝或凹部之樹脂被膜層所構成。本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -3- 1228264 A8 B8 C8 D8 六、申請專利範圍 1 9 ·如申請專利範圍第1 8項之方法，其中該模型基板爲透明基板。 2 〇 ·如申請專利範圍第丨5至1 7項中任一項之方法，其中該被轉印材料爲透明基板。 2 1 · —種無機質煅燒圖型形成基板，其係形成有由如申請專利範圍第1項之光硬化性糊料組成物之煅燒物所構成的無機質锻燒圖型。 2 2 ·如申請專利範圍第2 1項之無機質煅燒圖型形成基板，其中該無機質锻燒圖型爲玻璃質間隔壁圖型、導體電路圖型、或介電體圖型。 (請先閱讀背面之注意事項再填寫本頁) -裝· 、1T1228264 A8 B8 C8 D8 VI. Application for Patent Scope No. 901 07538 Application for Amendment of Chinese Patent Application Scope (please read the precautions on the back before filling this page) The Republic of China this August, please amend it. ', .. ..... Ί,… '.' Dagger: *-.--· ...._.... Two :: Up :: ': 1. A light-hardening paste composition, which is designated for use The paste composition used in the method of forming grooves or recesses in the pattern to form the pattern is characterized by the polymerization of a binder that contains (A) inorganic fine particles and (B) that does not have ethylenically unsaturated double bonds. (C) photocurable compound, and (D) photopolymerization initiator. The (C) photocurable compound is a liquid monofunctional photocurable compound having one ethylenically unsaturated double bond in one molecule. (C-1) and a polyfunctional photocurable compound (C-2) having two or more ethylenically unsaturated double bonds in one molecule. 2. The composition according to item 1 of the scope of patent application, which uses a binder polymer (B) which is soluble in at least one of the liquid monofunctional photocurable compounds (C-1). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 3. If the group of the patent application item 1 is a product, the blend ratio of the binder polymer (B) and the photocurable compound (C) is The amount ratio is from 1: 0.5 to 20. 4. The composition according to any one of claims 1 to 3, wherein the ratio of the liquid monofunctional photocurable compound (C-1) to the polyfunctional photocurable compound (C-2) is 1 : 0. 1 ~ 1 0. 5. The composition according to any one of claims 1 to 3, wherein the adhesive polymer (B) is thermoplastic. 6. For the composition of any one of items 1 to 3 of the scope of patent application, this standard is applicable to China National Standard (CNS) A4 specification (210 × 297 mm) ~~ ABCD 1228264 6. The scope of patent application where the adhesive The mixture polymer (B) has a weight average molecular weight of 3,000 to 30,000. 7. The composition according to any one of claims 1-3, wherein the adhesive polymer (B) is made of acrylic polyol, polyvinyl alcohol, polyvinyl acetal, styrene-allyl Alcohols, phenol resins, copolymerized (meth) acrylate resins, polypropylene carbonates, olefin-based hydroxyl-containing polymers, base-based polymers with base-based addition lactone modified lactones, amine-based resins Lactone-modified lactone-modified lactone polymers, homopolymers of monomers containing hydroxyl groups or amine groups and unsaturated groups combined in one molecule, lactone-modified monomers containing Copolymers of saturated monomers and at least one selected from the group consisting of cellulose derivatives. 8. The composition according to any one of claims 1 to 3, wherein the binder polymer contains 1 to 50 parts by mass of the binder polymer per 1,000 parts by mass of the inorganic fine particles (A). (B). 9. The composition according to any one of claims 1 to 3, wherein the inorganic fine particles (A) contain glass fine particles (A-1), metal fine particles (A-2), and black conductive fine particles (A — 3) ·, and at least one kind of microparticles selected from the group consisting of ceramic microparticles (A-4), such as the composition of any one of claims 1 to 3, wherein the inorganic microparticles (A ) Is a composition containing at least glass fine particles (A -1) ° 1 1. The composition according to item 10 of the patent application range, wherein the binder polymer (B) has a higher glass content than the glass fine particles (A-1). This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) ^-(Please read the precautions on the back before filling out this page)-Order · Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 1228264 A8 B8 C8 D8 夂 The scope of patent application is that the glass transition temperature is low thermal decomposition temperature. (Please read the precautions on the reverse side before filling out this page) 1 2. If the composition of any of the items 1 to 3 of the scope of patent application, its tincture contains inorganic pigments. 1 3. The composition according to any one of claims 1 to 3 of the scope of patent application, wherein the composition contains at least one stabilizer selected from the group consisting of inorganic acid, organic acid, inorganic phosphoric acid, and organic phosphoric acid. 1 4 · If the composition according to any one of claims 1 to 3 of the patent application scope, the fluorene contains a dispersant. 1 5 · A method for forming an inorganic calcined pattern, which is characterized by including a transfer pattern having grooves or recesses having a specified pattern, and the above-mentioned grooves or recesses of the transfer pattern will be the first in the scope of patent application The step of fully filling the photocurable paste composition; the step of contacting the transfer type with the paste composition to overlap the material being transferred; the photocurable paste composition is irradiated with active energy rays to harden it And the steps of peeling the transfer type and calcining the hardened paste composition transferred on the transfer material into an inorganic calcination pattern. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 16. If the method of the scope of application for patent No. 15 is used, the transfer printing pattern has an inorganic coating coated on the surface containing the designated pattern groove or the inner surface of the recess. . 17. The method according to item 16 of the scope of patent application, wherein the transfer type is further provided with a release agent coating film coated on the inorganic coating film. 1 8 · The method according to any one of items 15 to 17 in the scope of patent application, wherein the transfer type is a resin film layer with a designated pattern groove or recess formed on the model substrate and the model substrate Made up. This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) -3- 1228264 A8 B8 C8 D8 VI. Application for patent scope 1 9 · If the method for the scope of patent application No. 18, the model substrate is transparent Substrate. 2 〇 The method according to any one of claims 5 to 17, wherein the material to be transferred is a transparent substrate. 2 1 · An inorganic calcined pattern-forming substrate, which is formed with an inorganic calcined pattern composed of a calcined product of a photocurable paste composition such as the item 1 in the scope of patent application. 2 2 • If the inorganic calcined pattern is used to form a substrate, the inorganic calcined pattern is a glassy partition wall pattern, a conductor circuit pattern, or a dielectric pattern. (Please read the precautions on the back before filling out this page)-Install · 1T

經濟部智慧財產局員工消費合作社印製本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） -4 -Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized to the Chinese National Standard (CNS) Α4 (210X 297 mm) -4-