TW594355B - Liquid crystal display device having improved TFTs and a fabrication method thereof - Google Patents
Liquid crystal display device having improved TFTs and a fabrication method thereof Download PDFInfo
- Publication number
- TW594355B TW594355B TW089124193A TW89124193A TW594355B TW 594355 B TW594355 B TW 594355B TW 089124193 A TW089124193 A TW 089124193A TW 89124193 A TW89124193 A TW 89124193A TW 594355 B TW594355 B TW 594355B
- Authority
- TW
- Taiwan
- Prior art keywords
- polycrystalline silicon
- silicon semiconductor
- semiconductor layer
- film
- substrate
- Prior art date
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 83
- 238000000034 method Methods 0.000 title claims description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 239000004065 semiconductor Substances 0.000 claims abstract description 411
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 406
- 239000010408 film Substances 0.000 claims abstract description 342
- 239000000758 substrate Substances 0.000 claims abstract description 172
- 239000010409 thin film Substances 0.000 claims abstract description 127
- 239000012535 impurity Substances 0.000 claims description 79
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 46
- 238000011049 filling Methods 0.000 claims description 43
- 238000009826 distribution Methods 0.000 claims description 38
- 238000005224 laser annealing Methods 0.000 claims description 29
- 230000000875 corresponding effect Effects 0.000 claims description 28
- 230000002079 cooperative effect Effects 0.000 claims description 26
- 238000009413 insulation Methods 0.000 claims description 20
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 17
- 239000007772 electrode material Substances 0.000 claims description 15
- 239000013078 crystal Substances 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 12
- 239000001301 oxygen Substances 0.000 claims description 12
- 229910052760 oxygen Inorganic materials 0.000 claims description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 7
- 238000000059 patterning Methods 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 238000000137 annealing Methods 0.000 claims description 3
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 278
- 102100036464 Activated RNA polymerase II transcriptional coactivator p15 Human genes 0.000 description 35
- 101000713904 Homo sapiens Activated RNA polymerase II transcriptional coactivator p15 Proteins 0.000 description 35
- 229910004444 SUB1 Inorganic materials 0.000 description 35
- 239000011159 matrix material Substances 0.000 description 30
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 15
- 229910052698 phosphorus Inorganic materials 0.000 description 14
- 239000011574 phosphorus Substances 0.000 description 14
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 11
- 229910052796 boron Inorganic materials 0.000 description 11
- 239000011521 glass Substances 0.000 description 9
- 238000007796 conventional method Methods 0.000 description 8
- 239000000470 constituent Substances 0.000 description 7
- 230000005684 electric field Effects 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910004438 SUB2 Inorganic materials 0.000 description 5
- 101100311330 Schizosaccharomyces pombe (strain 972 / ATCC 24843) uap56 gene Proteins 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 5
- 230000003071 parasitic effect Effects 0.000 description 5
- 150000003377 silicon compounds Chemical class 0.000 description 5
- 101150018444 sub2 gene Proteins 0.000 description 5
- 229910052785 arsenic Inorganic materials 0.000 description 4
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 229910052770 Uranium Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 101100222207 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) TIS11 gene Proteins 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- -1 Sand Compound Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- OSDXSOSJRPQCHJ-XVNBXDOJSA-N methyl 3-(3,4-dihydroxyphenyl)-3-[(E)-3-(3,4-dihydroxyphenyl)prop-2-enoyl]oxypropanoate Chemical compound C=1C=C(O)C(O)=CC=1C(CC(=O)OC)OC(=O)\C=C\C1=CC=C(O)C(O)=C1 OSDXSOSJRPQCHJ-XVNBXDOJSA-N 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78609—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing leakage current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78636—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with supplementary region or layer for improving the flatness of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78675—Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32972599A JP2001147446A (ja) | 1999-11-19 | 1999-11-19 | 液晶表示装置とその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW594355B true TW594355B (en) | 2004-06-21 |
Family
ID=18224587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW089124193A TW594355B (en) | 1999-11-19 | 2000-11-15 | Liquid crystal display device having improved TFTs and a fabrication method thereof |
Country Status (5)
Country | Link |
---|---|
US (2) | US6636280B1 (fr) |
EP (1) | EP1102111B1 (fr) |
JP (1) | JP2001147446A (fr) |
KR (1) | KR100336684B1 (fr) |
TW (1) | TW594355B (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI588578B (zh) * | 2010-07-01 | 2017-06-21 | 半導體能源研究所股份有限公司 | 液晶顯示裝置的驅動方法 |
CN113608385A (zh) * | 2006-05-16 | 2021-11-05 | 株式会社半导体能源研究所 | 液晶显示装置及半导体装置 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3608614B2 (ja) * | 2001-03-28 | 2005-01-12 | 株式会社日立製作所 | 表示装置 |
JP4939699B2 (ja) * | 2001-05-31 | 2012-05-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US7749818B2 (en) * | 2002-01-28 | 2010-07-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
TWI261358B (en) * | 2002-01-28 | 2006-09-01 | Semiconductor Energy Lab | Semiconductor device and method of manufacturing the same |
TWI272666B (en) * | 2002-01-28 | 2007-02-01 | Semiconductor Energy Lab | Semiconductor device and method of manufacturing the same |
CN101217150B (zh) * | 2002-03-05 | 2011-04-06 | 株式会社半导体能源研究所 | 半导体元件和使用半导体元件的半导体装置 |
US6885146B2 (en) | 2002-03-14 | 2005-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Display device comprising substrates, contrast medium and barrier layers between contrast medium and each of substrates |
KR100916656B1 (ko) | 2002-10-22 | 2009-09-08 | 삼성전자주식회사 | 레이저 조사 장치 및 이를 이용한 다결정 규소 박막트랜지스터의 제조 방법 |
GB2403595B (en) * | 2003-06-25 | 2005-10-05 | Lg Philips Lcd Co Ltd | Liquid crystal display device having polycrystalline silicon thin film transistor and method of fabricating the same |
KR100585873B1 (ko) * | 2003-11-03 | 2006-06-07 | 엘지.필립스 엘시디 주식회사 | 폴리실리콘 액정표시소자 및 그 제조방법 |
JP2005228819A (ja) * | 2004-02-10 | 2005-08-25 | Mitsubishi Electric Corp | 半導体装置 |
JP4711042B2 (ja) * | 2004-03-17 | 2011-06-29 | セイコーエプソン株式会社 | 半導体膜の製造方法、および半導体装置の製造方法 |
JP2005276944A (ja) * | 2004-03-23 | 2005-10-06 | Sharp Corp | 半導体デバイス、その製造方法および製造装置 |
JP4315074B2 (ja) | 2004-07-15 | 2009-08-19 | セイコーエプソン株式会社 | 半導体装置用基板及びその製造方法、電気光学装置用基板、電気光学装置並びに電子機器 |
CN100515153C (zh) * | 2004-10-12 | 2009-07-15 | 乐金显示有限公司 | 有机电致发光器件及其制造方法 |
US20080237593A1 (en) * | 2005-01-07 | 2008-10-02 | Junichiro Nakayama | Semiconductor Device, Method of Fabricating the Same, and Apparatus for Fabricating the Same |
JP2006190897A (ja) * | 2005-01-07 | 2006-07-20 | Sharp Corp | 半導体デバイス、その製造方法および製造装置 |
KR100752381B1 (ko) * | 2005-12-23 | 2007-08-27 | 삼성에스디아이 주식회사 | 결정화방법 및 이를 이용한 박막 트랜지스터의 제조방법 |
US8927898B2 (en) * | 2006-05-01 | 2015-01-06 | Tcz, Llc | Systems and method for optimization of laser beam spatial intensity profile |
US8497494B2 (en) * | 2006-11-24 | 2013-07-30 | Lg Display Co., Ltd. | Thin film transistor and array substrate for liquid crystal display device comprising organic insulating material |
JP5205012B2 (ja) * | 2007-08-29 | 2013-06-05 | 株式会社半導体エネルギー研究所 | 表示装置及び当該表示装置を具備する電子機器 |
US20120154704A1 (en) * | 2009-08-25 | 2012-06-21 | Sharp Kabushiki Kaisha | Photosensor, semiconductor device, and liquid crystal panel |
KR102180554B1 (ko) * | 2013-12-04 | 2020-11-19 | 삼성디스플레이 주식회사 | 박막 트랜지스터 및 이의 제조 방법 |
TWI570899B (zh) * | 2014-09-10 | 2017-02-11 | 群創光電股份有限公司 | 薄膜電晶體基板 |
JP6579086B2 (ja) * | 2016-11-15 | 2019-09-25 | 信越半導体株式会社 | デバイス形成方法 |
KR102596210B1 (ko) * | 2018-05-25 | 2023-10-30 | 엘지디스플레이 주식회사 | Tft 기판 및 이를 포함한 표시장치 |
KR20220033596A (ko) * | 2020-09-08 | 2022-03-17 | 삼성디스플레이 주식회사 | 다결정 실리콘층의 제조 방법, 표시 장치 및 이의 제조 방법 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4742020A (en) * | 1985-02-01 | 1988-05-03 | American Telephone And Telegraph Company, At&T Bell Laboratories | Multilayering process for stress accommodation in deposited polysilicon |
US4597160A (en) * | 1985-08-09 | 1986-07-01 | Rca Corporation | Method of fabricating a polysilicon transistor with a high carrier mobility |
JPH02208293A (ja) * | 1989-02-08 | 1990-08-17 | Kanazawa Univ | 多結晶シリコン膜の製造方法 |
JP3210313B2 (ja) * | 1989-08-11 | 2001-09-17 | ソニー株式会社 | 多結晶シリコン薄膜の特性改善方法 |
IT1238387B (it) * | 1990-01-10 | 1993-07-16 | Himont Inc | Componenti e catalizzatori per la polimerizzazione di olefine |
JP2794499B2 (ja) * | 1991-03-26 | 1998-09-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
KR970009976B1 (ko) * | 1991-08-26 | 1997-06-19 | 아메리칸 텔리폰 앤드 텔레그라프 캄파니 | 증착된 반도체상에 형성된 개선된 유전체 |
TW215967B (en) * | 1992-01-17 | 1993-11-11 | Seiko Electron Co Ltd | MOS Poly-Si thin film transistor with a flattened channel interface and method of producing same |
TW222345B (en) * | 1992-02-25 | 1994-04-11 | Semicondustor Energy Res Co Ltd | Semiconductor and its manufacturing method |
US5332689A (en) * | 1993-02-17 | 1994-07-26 | Micron Technology, Inc. | Method for depositing low bulk resistivity doped films |
US5672530A (en) * | 1993-03-22 | 1997-09-30 | Sharp Microelectronics Technology, Inc. | Method of making MOS transistor with controlled shallow source/drain junction |
JPH0799321A (ja) | 1993-05-27 | 1995-04-11 | Sony Corp | 薄膜半導体素子の製造方法および製造装置 |
KR100327086B1 (ko) * | 1994-06-15 | 2002-03-06 | 구사마 사부로 | 박막 반도체 장치의 제조방법, 박막 반도체 장치,액정표시장치 및 전자기기 |
JP4026191B2 (ja) | 1996-05-22 | 2007-12-26 | ソニー株式会社 | シリコン単結晶粒子群の形成方法及びフラッシュメモリセルの製造方法 |
JPH10200120A (ja) | 1997-01-10 | 1998-07-31 | Sharp Corp | 半導体装置の製造方法 |
JPH1140501A (ja) * | 1997-05-20 | 1999-02-12 | Fujitsu Ltd | 半導体装置の製造方法及び半導体装置 |
US5920772A (en) | 1997-06-27 | 1999-07-06 | Industrial Technology Research Institute | Method of fabricating a hybrid polysilicon/amorphous silicon TFT |
JPH11121785A (ja) | 1997-10-16 | 1999-04-30 | Toshiba Electronic Engineering Corp | 化合物半導体素子およびその製造方法 |
JP4376979B2 (ja) | 1998-01-12 | 2009-12-02 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP3331999B2 (ja) * | 1999-02-09 | 2002-10-07 | 日本電気株式会社 | 半導体薄膜の製造方法 |
-
1999
- 1999-11-19 JP JP32972599A patent/JP2001147446A/ja active Pending
-
2000
- 2000-11-15 TW TW089124193A patent/TW594355B/zh not_active IP Right Cessation
- 2000-11-16 KR KR1020000067983A patent/KR100336684B1/ko not_active IP Right Cessation
- 2000-11-17 EP EP00124340A patent/EP1102111B1/fr not_active Expired - Lifetime
- 2000-11-20 US US09/715,105 patent/US6636280B1/en not_active Expired - Lifetime
-
2003
- 2003-08-19 US US10/642,654 patent/US7315335B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113608385A (zh) * | 2006-05-16 | 2021-11-05 | 株式会社半导体能源研究所 | 液晶显示装置及半导体装置 |
TWI588578B (zh) * | 2010-07-01 | 2017-06-21 | 半導體能源研究所股份有限公司 | 液晶顯示裝置的驅動方法 |
US9734780B2 (en) | 2010-07-01 | 2017-08-15 | Semiconductor Energy Laboratory Co., Ltd. | Driving method of liquid crystal display device |
US10008169B2 (en) | 2010-07-01 | 2018-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Driving method of liquid crystal display device |
Also Published As
Publication number | Publication date |
---|---|
EP1102111A3 (fr) | 2003-10-01 |
EP1102111A2 (fr) | 2001-05-23 |
JP2001147446A (ja) | 2001-05-29 |
EP1102111B1 (fr) | 2012-05-30 |
KR100336684B1 (ko) | 2002-05-13 |
US7315335B2 (en) | 2008-01-01 |
KR20010051728A (ko) | 2001-06-25 |
US6636280B1 (en) | 2003-10-21 |
US20040038600A1 (en) | 2004-02-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW594355B (en) | Liquid crystal display device having improved TFTs and a fabrication method thereof | |
TW316993B (fr) | ||
CN1165962C (zh) | 半导体薄膜及其制造方法以及半导体器件及其制造方法 | |
KR100447311B1 (ko) | 반도체박막,반도체장치및이의제조방법 | |
US7919392B2 (en) | Semiconductor device and method of manufacturing the same | |
TW406210B (en) | Active matrix display device | |
CN101393859B (zh) | 设置有半导体膜的衬底及其制造方法 | |
US20050133866A1 (en) | Novel field effect transistor and method of fabrication | |
US20110266543A1 (en) | Circuit board and display device | |
CN101266982A (zh) | 半导体器件、半导体显示器件及半导体器件的制造方法 | |
CN102593153A (zh) | 半导体衬底、半导体装置、以及其制造方法 | |
US6331473B1 (en) | SOI substrate, method for making the same, semiconductive device and liquid crystal panel using the same | |
TWI283069B (en) | Thin film transistor and method for manufacturing of the same | |
CN100550394C (zh) | 半导体器件及其制造方法 | |
TW508829B (en) | Thin-film transistor | |
JPH05142571A (ja) | 液晶表示装置 | |
JP2002359376A (ja) | 半導体装置及びその作製方法 | |
JP2007123297A (ja) | 半導体装置及びその製造方法 | |
JP3318439B2 (ja) | 半導体集積回路およびその作製方法、並びに半導体装置およびその作製方法 | |
JPH07111331A (ja) | 薄膜半導体装置の製造方法 | |
US20220045192A1 (en) | METAL OXIDE INTERLAYER STRUCTURE FOR nFET AND pFET | |
JP4027449B2 (ja) | 半導体薄膜及び半導体装置の作製方法 | |
JPH09289165A (ja) | 半導体薄膜およびその作製方法ならびに半導体装置およびその作製方法 | |
CN100502053C (zh) | 半导体器件 | |
KR20070056285A (ko) | 버퍼절연막과 이를 구비한 반도체소자 및 반도체소자의제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |