五、發明說明（1) 《發明背景》 請參閱圖 術，多以金屬 針B 1之尖端 能是否正常時 上之排線A 4 人員參考之用 習用之測試技 容易受到電路 ’造成高頻元 測試人員欲測 頻元件A 1另 相當不易，該 該高頻元件A件 A 2、A 3 一所示 探針B 1連 進行測試； ’則以該金 ，俾可測試 ;惟，俾當 術直接進行 板A上其他 件A 1訊號 試到較準確 外進行測試 排線A 4相 1損壞，倘 之接腳過多 前一般習 接一測試 俾當欲測 屬探針B 到元件之 該元件為 測試，該 數位元件 之電壓或 之數據或 ，而該高 當細密， 若該高頻 時（例： 接則相當 上之元件太多時，亦造成測試人員 拆解及組裝時更可能造成大量時間 件），若要一隻一隻腳焊 用之電路板元 裝置B，利用 試之電路板A 1之尖端抵觸 數據或資料， 高頻元件A 1 高頻元件A 1 A 2、A 3 之 阻抗等數據不 資料時，則須 頻元件A 1拆 拆解及組裝時 元件A 1或其1 2 8 b i η 不易，如果該 測試或維修之 之浪費。 件測試技 該金屬探 上元件功 電路板A 以供測試 時，若以 之訊號， 訊號干擾 準確；若 拆解該南 解及組裝 容易造成 他數位元 之I C元 電路板A 不便，而 《發明目的》 有鑑於此，本案發明人乃装 經驗、及不斷的田、；t研#，本身從事相關行業多年 夕曰沾二： 終使本發明得以誕t，其首要 種電路板疋件快速測試之方半 甘 主要係於電路板印刷蝕刻時，將 /」，其 时冤路板上之排線（金手护 577999 五、發明說明（2) 、匯流排等）中間刻設一切槽’使該排線呈斷路狀態，並 於該切槽之兩側各設一白色隔離線，該白色隔離線可防止 銲錫過量而影響到高頻元件；俾當電路元件置入該電路板 時，只須以銲錫覆蓋排線上之切槽，俾可使該排線呈連接 狀態；而當測試人員欲測試元件時，亦僅須將切槽上之鲜 錫’以吸錫器去除即可’使該排線呈斷路狀態，而該高頻 元件與其他元件亦呈斷路狀態’測試到之該高頻元件訊號 ，不會受到其他元件干擾’提高測試數據之準確性，俾供 測試人員方便測試；並於測試完成後，只須以烙鐵快速馬虫 固該排線上殘留之銲錫’或以少量銲錫覆蓋過排線上之切 槽，即可使該切槽呈連接狀態’而無須拆解組裝高頻元件 ’而不會造成元件之損壞，俾達大量減少測試之時間，進 可達測試便利性及準確性之目的者。 《技術内容、特點及功效》 為使貴審查員方便簡捷瞭解本發明之其他特徵内容 與優點及其所達成之功效能夠更為顯現，茲將本發明配合 附圖，詳細說明如下： δ月參閱圖二及二之一所示’本創作係提供一種「電路 板元件快速測試之方法」，其中，電路板χ於印刷蝕刻時 ’將電路板1上之排線1 3 (金手指、匯流排等）中間刻 设一切槽1 4，使該排線1 3呈斷路狀態，並於該排線1 3之兩側各置設一白色隔離線1 5 ; 該白色隔離線1 5可防止銲錫過量而影響到高頻元件V. Description of the Invention (1) "Background of the Invention" Please refer to the drawings. It is usually used to check whether the tip of the metal pin B 1 is normal. It is quite difficult to measure the frequency component A 1, and the high-frequency component A piece A 2 and A 3 are shown as a probe B 1 for testing; 'the gold can be used for testing; The other A1 signals on board A are tested more accurately and the test is carried out. The phase 4 A of phase A is damaged. If there are too many pins, it is usually used to test. When the component from probe B to component is tested, The voltage or data of the digital component or the high and fine, if the high frequency (for example: when there are too many components connected, it also causes testers to disassemble and assemble more likely to cause a lot of time pieces) If you want one-to-one circuit board element device B for soldering, use the tip of the test circuit board A 1 to resist data or data, high-frequency element A 1 high-frequency element A 1 A 2, impedance of A 3, etc. When the data is not available, the frequency component A 1 must be disassembled. When disassembling and assembling component A 1 or 1 2 8 b i η is not easy, if the test or repair is wasted. When the metal probes the component circuit board A for testing, if the signal is used, the signal interference is accurate; if the disassembly and assembly are easy to cause the digital IC circuit board A to be inconvenient, and the invention Purpose "In view of this, the inventor of this case is equipped with experience and continuous field research; he has been engaged in the related industry for many years. It has finally enabled the invention to be born, and its first kind of circuit board components is fast tested. Fang Bangan is mainly when the circuit board is printed and etched, "/". At that time, all the grooves on the circuit board (Gold Hand Guard 577999 V. Invention Description (2), busbars, etc.) were engraved with all slots. The cable is in an open state, and a white isolation line is provided on each side of the slot. The white isolation line can prevent excessive solder from affecting high-frequency components. 俾 When a circuit component is placed in the circuit board, only Covering the slot on the cable with solder can make the cable in a connected state; and when the tester wants to test the component, he only needs to 'remove the fresh tin on the slot with a solder sucker' to make the cable Line is open, and the high The components and other components are also in a disconnected state. The signal of the high-frequency component tested will not be interfered by other components. This improves the accuracy of the test data and is convenient for the tester to test. After the test is completed, it is only necessary to quickly use a soldering iron. Ma Zonggu's remaining solder on the wiring line or covering a slot on the wiring line with a small amount of solder can make the cutting slot in a connected state 'without disassembling and assembly of high-frequency components' without causing component damage, 俾It can reduce the test time greatly, and can achieve the purpose of testing convenience and accuracy. "Technical Content, Features and Effects" In order to make it easy for your examiner to understand the other features, content and advantages of the present invention and the effect achieved, the present invention will be described in detail with the accompanying drawings as follows: As shown in Figures 2 and 2, "This creation provides a" method for rapid testing of circuit board components ", in which the circuit board χ is printed and etched" to route the wires 1 3 (gold fingers, bus bars) on the circuit board 1 Etc.) All grooves 14 are engraved in the middle to make the line 13 open, and a white isolation line 15 is placed on each side of the line 13; the white isolation line 15 can prevent excessive soldering. Affecting high-frequency components
第6頁 五、發明說明（3) 1 1或其他元件1 2 請參閱圖三所示 以烙鐵2 1將銲錫2 14上之銲錫2吸起 呈斷路狀態，再以測 )’俾可避免該高頻 擾，而發生電壓或阻 修或測試人員在無須 最正確之訊號，俾達 請參閲圖三之二 用殘留在排線1 3上 錫2，或以少量銲錫 排線1 3呈導電狀態 連結及運作，俾達快 之測試； ’當测試人 錄1化，再以 ’使該高頻 試探針3進 元件1 1之 抗下降等訊 拆解元件之 測試之方便 所示，俾當 之銲錫2， 2覆蓋過排 ’使該高頻 速及便利性 負欲進 吸錫器 元件1 行測試 訊號受 號不正 狀態下 性及訊 測試人 以烙鐵 線1 3 元件1 者0 行元件測 2 2將覆 1與其他 (如圖三 到其他元 確之狀況 ’俾可快 號準確之 員測試完 2 1直接 上之切槽 1與其他 f時，則 著於切槽 元件1 2 之—所示 件1 2干 ，而使維 速測試到 目的； 成後，利 融固該銲 2，使該 元件1 9 為使本發明更‘顯現出其進步性與實用性，兹將复 舉如下： 、/、優 1、 快速便利。 2、 各電路元件可個別測試。 3、 測试之訊號不會受其他元件影響。 4、 無須拆解元件。 5、 白色隔離線可防止銲錫過量。 6、 具實用性。 7、 具進步性。 577999 五、發明說明（4) 8、具工商界及產業界上利用價值。 綜上所述，本發明誠已符合發明專利之申請要件，爰 依法提出申請，祈請 鈞局審查委員明鑑，並賜予本發明 專利權，實感德便。Page 6 V. Description of the invention (3) 1 1 or other components 1 2 Please refer to Figure 3 for a soldering iron 2 1 to pick up the solder 2 on the solder 2 14 to be in an open circuit state, and then measure) '俾 can avoid this High-frequency disturbances, and voltage or resistance repair or test personnel do not need the most correct signal, please refer to Figure 3bis. Residue on the wire 1 3 with tin 2 or with a small amount of solder wire 13 is conductive State connection and operation, the test of 俾 达 快; 'When the test record is changed to 1', the test of disassembling the components such as the resistance of the high-frequency test probe 3 into the component 1 1 is shown conveniently, When the solder 2, 2 covers the row, make the high-frequency speed and convenience into the suction device components 1 line test signal received under the state of the signal and the test person with a soldering iron wire 1 3 components 1 line 0 The component test 2 2 will cover 1 and other (as shown in Figure 3 to the other exact conditions. 俾 can quickly test the accurate person 2 2 directly on the slot 1 and other f, then focus on the slot component 1 2 -The pieces shown are dry, so that the speed test reaches the purpose; after the completion, the welding 2 is solidified, so that the component 1 9 In order to make the present invention more show its progress and practicability, we will repeat as follows:, /, excellent 1, fast and convenient. 2, each circuit component can be tested individually. 3. The test signal will not be affected by other components Impact. 4. No need to disassemble components. 5. White isolated line can prevent excessive soldering. 6. Practical. 7. Progressive. 577999 5. Invention Description (4) 8. It has value in industrial and commercial circles and industry. In summary, the present invention has already met the requirements for applying for an invention patent, and submitted an application in accordance with the law. I hope that the examiner of the Bureau of the Bureau of the People's Republic of China will make a clear reference and grant the patent right of the invention.
第8頁 圖式簡單說明 圖號說明 A · A 1 A 2 A3 A 4 B · 577999 •電路板 •高頻元件 •數位元件 •數位元件 •排線 •測試裝置 •測試探針 •電路板 •高頻元件 •其他元件 •排線 •切槽 •白色隔離線 •鮮錫 •烙鐵 •吸錫器 •測試探針 圖不說明 第一圖係習用之元件測試示意圖。 第二圖係本發明之結構示意圖。 第二之一圖係本發明之結構剖視圖。 第三圖係本發明之元件斷路示意圖。Schematic description on page 8 Description of drawing number Description A · A 1 A 2 A3 A 4 B · 577999 • Circuit board • High-frequency component • Digital component • Digital component • Cable • Test device • Test probe • Circuit board • High Frequency components • Other components • Cables • Slots • White isolated wires • Fresh tin • Soldering irons • Snubbers • Test probe diagrams do not explain the first diagram is a schematic diagram of conventional component testing. The second figure is a schematic diagram of the structure of the present invention. The second figure is a sectional view of the structure of the present invention. The third figure is a schematic diagram of the circuit breaker of the present invention.
第9頁Page 9
577999 圖式簡單說明 第三之一圖係本發明之測試示意圖。 第三之二圖係本發明之元件連結示意圖。 第10頁577999 Brief description of diagrams The third diagram is a test diagram of the present invention. The third bis diagram is a schematic diagram of component connection of the present invention. Page 10