TW569375B

TW569375B - Method to separate article and adhesive film

Info

Publication number: TW569375B
Application number: TW91132540A
Authority: TW
Inventors: Guo-Shing Huang; Jia-Bin Shiu; Jiun-Shian Liou; Jia-Hung Hung
Original assignee: Ind Tech Res Inst
Priority date: 2002-11-05
Filing date: 2002-11-05
Publication date: 2004-01-01
Also published as: TW200408035A

Abstract

The present invention provides a method to separate an article and an adhesive film, which is characterized in: pre-applying an external force like a peeling force to separate the adhesive film and the article, so as to reduce the adhesiveness between the article and the adhesive film, and sucking the article by the picking/disposition head. To achieve the purpose, the bottom portion of the adhesive film has a vacuum sucking hole and a moveable vacuum sucking stand. The sucking force of the vacuum sucking stand generates an external force like the peeling force to the adhesive film. The article is sucked by the picking/disposition head. A linking rod can also be installed, which can move upward/downward with the picking/disposition head simultaneously. Before the picking/deposition head descends and contacts with the article, it can pull the linking rod together to press the adhesive film for generating the external force like the peeling force onto the adhesive film, and the picking/disposition head sucks the article. Since the external force does not act on the article, the deformation of the article is controlled to a minimum amount, so as to prevent the damage of the article, and the article will not shift. The production speed is increased and the picking time is shortened since plural chips can be peeled off at one time directly.

Description

五、發明說明（1) 發明概述：本發明係提供 — 種物件與膠膜分離之方法，盆於：預先施予膠膜-能與物件適度分離之如撕離：二，低，件與膠膜間之黏合性，…放頭吸取：件卜力由於外力未作用於物件上，因此可使物件變形量控制至極小之程度，避免物件破損，且物件不致移位，並可一次剝離多個晶片，增加生產速度，縮短拾取時間者。發明背景·· 傳統之物件製程，其中之一步驟係必須將物件與貼合物件之膠膜分離’再拾取物件以進行後續製程步驟；例如進行半導體之黏晶製程時，必須先將一片片之晶片由膠膜上取出，再翻轉晶片與基板焊接，該拾取晶片之方法請參蘭圖一 A至圖一 D : a ·如圖一 A所示，具有真空吸力之取放頭1 〇設置於一座體 11内，取放頭1 〇頂部設有一彈性元件1 2，於取放頭1 0相對應之下方設有一頂針2 0，晶片3 0貼附於紫外光固化膠膜40上，藉由輸送裝置（圖中未示出）將貼有晶片30之膠膜4 0送至取放頭1 0與頂針2 0之間以進行取晶步驟； b. 如圖一 B所示，當晶片3 0就定位後，取放頭1 0下降至晶片3 0表面並吸附於晶片3 0表面； c. 如圖一 C所示，當取放頭10確實吸附晶片30後，頂針20 向上頂抵晶片3 0使上升一適當距離，同時壓縮設置於取放頭10頂部之彈性元件12’頂針2〇與晶片30之接觸點21 569375 五、發明說明（2) 周圍之膠膜40因受制於其周圍之拉力而與晶片30分離； d ·如圖一 D所示，晶片3 0與膠膜4 0分離之同時，取放頭1 0 上升’將晶片3 0吸離膠膜4 0。前述藉由頂針使晶片與膠膜分離之方法，其主要缺失在於··以5公厘（mm)長寬之晶片而言，利用頂針頂取需400 公克（g )才能克服膠膜黏力之束缚，當晶片薄化到一界限時’相對晶片所承受之應力增大，使晶片之變形量加大，甚而造成破裂，可見頂針頂取之方式有其極限限制，尤對於薄形晶片。再知參閱圖二A至圖二C，美國專利4, 990, 05 1號「PRE-PEEL DIE EJECTOR APPARATUS」，該案揭露一種將物件由膠膜取下之方式及其裝置，如圖所示，該案具有一真空盤裝置1 ’於真空盤裝置1内部設有頂針2，於頂針2外部套設有一筒狀結構3，相對應於該頂針2與筒狀結構3之設置1之下方设有一具有真空吸力之取放頭4，物件挪附於黏膠層6底部，黏膠層6則設一 ' 件5可為半導體晶片等物件，其拾取物件心底面’.该物 a. 如圖二A所示，將物件5輸送至空盤裝置丨下驟為取頭4上方，並藉由直处船壯万之忒取放 b. 如圖二B所示，物ίΓ就^Λ1吸附於彈性膜7頂部；距離，同時頂抵彈性膜7後3’筒狀結構3下降-適當黏膠層6與物件5之間層且7物件5可作第一階段之分離， c. 如圖二C所示，I,勝V、6!:t離部8; 胗層6與物件5第一階段分離後，真空 569375 五、發明說明（3) 盤裝置1上升而頂钻9f1 0士办真*般梦番1淑十2冋時下降並凸出筒狀結構3外，藉二i段^離/此針2反向作用，使黏膠層6與物件5作第觸，而後再押2 Ξ ΐ黏膠層6與物件5僅於頂針2處有接離。再控制取放頭4下降使物件5與黏膠層6完全分刖述該美國案之持白壬 + 脫離膠膜之方式，Ϊ 在傳統以頂針頂取物件極易造成物件^极頂針之外徑小於物件及取放頭，因此蕤斜而無法被取放頭準確吸取之情況，誃奎 4^較大之筒狀結構3先行下壓物件5至取放頭4 /可、之：侔扒於物件5上’避免物件歪斜，然而，該案所採行 :物牛：：方式與圖一A所示之頂針頂取方式其實並= 屏目-異&處僅在於該美國案藉由筒狀結構3、頂針2將黏曰刀一階段分離，該筒狀結構3雖然分擔了頂針2必須之^膠層6之束缚力，卻使得整體結構極為複雜，再，筒狀結構3與頂針2對物件5造成雙重衝擊力，當物件 7化到一界限時，相對物件所承受之應力亦增大，之變形量加大，甚而造成破裂。吏物件另見種「細晶片拾取方法及細晶片拾取設備」（中 =民國^發明專利案，公告第46 9562號），請參閱圖三a至圖一 c ’该案揭露之方法包含下列步驟： (a)°又置一機台8’，該機台8,具有一表面，該表面接觸於該黏附片1，之下表面；、該細晶片3，係附著於該黏附片1，之上表面；該機台8’具有一抽吸孔7a’、7b’，下拉該黏附片V. Description of the invention (1) Summary of the invention: The present invention provides a method for separating an object from a film, which is provided in advance: the film is applied in advance-it can be separated from the object at a moderate level, such as tearing off: two, low, the part and the film Adhesion between membranes,… put on the head and suck: Since the external force does not act on the object, the amount of deformation of the object can be controlled to a minimum, to avoid damage to the object, and the object does not shift, and can be peeled off multiple Wafers that increase production speed and shorten picking time. Background of the Invention ... One of the steps in the traditional object manufacturing process is to separate the object from the adhesive film of the laminated parts, and then pick up the object for subsequent processing steps. For example, when performing the semiconductor die-bonding process, one piece must be The wafer is taken out from the adhesive film, and then the wafer and the substrate are welded. For the method of picking the wafer, please refer to Figure 1A to Figure 1D: a · As shown in Figure 1A, the pick-and-place head with vacuum suction 1 is set at Within the base 11, an elastic element 12 is provided on the top of the pick-and-place head 10, and a thimble 20 is provided below the corresponding pick-and-place head 10, and the wafer 30 is attached to the ultraviolet curing adhesive film 40. The conveying device (not shown in the figure) sends the adhesive film 40 attached to the wafer 30 between the pick-and-place head 10 and the ejector pin 20 to perform the crystal extraction step; b. As shown in FIG. 1B, when the wafer 3 After positioning at 0, the pick-and-place head 10 is lowered to the surface of the wafer 30 and adsorbed on the surface of the wafer 30; c. As shown in FIG. 1C, when the pick-and-place head 10 does adsorb the wafer 30, the ejector pin 20 pushes upward against the wafer. 3 0 Raise an appropriate distance while compressing the elastic element 12 provided on the top of the pick-and-place head 10 'The contact point between the thimble 20 and the wafer 30 21 569375 V. Description of the invention (2) The surrounding adhesive film 40 is separated from the wafer 30 due to the pulling force on the periphery; d. As shown in FIG. 1D, the wafer 30 and While the film 40 is separated, the pick-and-place head 10 rises to suck the wafer 30 away from the film 40. The main lack of the aforementioned method of separating the wafer from the adhesive film by a thimble is that for a 5 mm (mm) length and width wafer, it takes 400 grams (g) to take out the adhesive with the thimble. Bound, when the wafer is thinned to a limit, the relative stress on the wafer will increase, which will increase the deformation of the wafer, and even cause cracks. It can be seen that the method of ejecting the ejector pin has its limit, especially for thin wafers. Please refer to Fig. 2A to Fig. 2C, US Patent No. 4,990, 05 "PRE-PEEL DIE EJECTOR APPARATUS". This case discloses a method and a device for removing an object from a film, as shown in the figure. In this case, a vacuum disk device 1 is provided with a thimble 2 inside the vacuum disk device 1, and a cylindrical structure 3 is sleeved on the outside of the thimble 2, corresponding to the arrangement 1 below the installation of the thimble 2 and the cylindrical structure 3. There is a pick-and-place head 4 with a vacuum suction, and the object is attached to the bottom of the adhesive layer 6, and the adhesive layer 6 is provided with a 'piece 5 can be an object such as a semiconductor wafer, which picks up the bottom surface of the object'. The object a. As shown in Fig. 2A, the object 5 is conveyed to the empty tray device. The lower part is above the picking head 4, and it is picked up and placed by the ship directly. As shown in Fig. 2B, the object ΓΓ is adsorbed on ^ Λ1. The top of the elastic film 7; the distance, at the same time, the 3 'cylindrical structure 3 descends against the elastic film 7-appropriate layer between the adhesive layer 6 and the object 5 and the 7 object 5 can be separated in the first stage, c. As shown in C, I, wins V, 6 !: t from the part 8; after the first stage 6 and the object 5 are separated, the vacuum 569375 V. Description of the invention (3) The disk device 1 rises to the top 9f1 0 Shibanzhen * like dream fan 1 Shu 10 2 descent and protrude outside the cylindrical structure 3, by the second i segment ^ away / this needle 2 acts in reverse, so that the adhesive layer 6 and the object 5 make contact , And then press 2 Ξ ΐ The adhesive layer 6 and the object 5 are only separated at the thimble 2. Then control the pick-and-place head 4 to drop so that the object 5 and the adhesive layer 6 completely describe the method of holding white Ren + detachment from the film in the U.S. case. The diameter is smaller than the object and the pick-and-place head, so it is oblique and cannot be accurately sucked by the pick-and-place head. 誃 Kui 4 ^ The larger cylindrical structure 3 first presses the object 5 to the pick-and-place head 4 / Yes, On object 5 'to avoid object skew, however, the case adopted: the material cattle :: method and the ejection pin extraction method shown in Figure 1A is actually not = screen-different & is only in the US case by The cylindrical structure 3 and the thimble 2 separate the sticky knife at one stage. Although the cylindrical structure 3 shares the binding force of the adhesive layer 6 necessary for the thimble 2, it makes the overall structure extremely complicated. Furthermore, the cylindrical structure 3 and the thimble 2 causes a double impact force on the object 5. When the object 7 reaches a limit, the stress on the object also increases, the amount of deformation increases, and even breakage is caused. For details, please refer to the "fine wafer picking method and fine wafer picking equipment" (Middle = Republic of China ^ Invention Patent Case, Publication No. 46 9562), please refer to Figure 3a to Figure 1c 'The method disclosed in the case includes the following steps : (A) ° Another machine 8 'is provided, and the machine 8 has a surface which is in contact with the adhesive sheet 1, the lower surface; and the thin wafer 3, which is attached to the adhesive sheet 1, Upper surface; the machine 8 'has a suction hole 7a', 7b ', and the adhesive sheet is pulled down

569375 五、發明說明（4) Γ ；該抽吸孔7a’、7b’具有一將接觸於該黏附片Γ之抽吸端，該黏附片1 ’位於該機台8 ’之該表面上；該機台8’可在一水平面上相對於特定的參考位置而移動（能平移與旋轉）： (b )設置一筒夾4 ’，用以藉由一抽吸力固持該細晶片3 ’ ；該筒夾4’具有一將接觸於該細晶片3’之抽吸端；該筒夾4 ’能藉由該抽吸力固持該細晶片3 ’於該抽吸端： (c )置該黏附片Γ於該機台8 ’之該表面上，使得該黏附片 1 ’上的該細晶片3 ’位於該參考位置； (d) 藉由該抽吸力固持該細晶片3’於該筒夾4’之該抽吸端： (e) 固持該黏附片1’於該機台8’之該抽吸孔洞7a’、7b’之該抽吸端； (f )於該水平面上相對於該參考位置移動該機台8 ’，藉以從該細晶片3 ’取下該黏附片Γ ;以及 (g)藉由該筒夾4 ’拾取因而從該黏附片Γ取下的該細晶片 3、簡言之，該習知案係先將筒夾4 ’吸附於細晶片3 ’上，再由抽吸孔7a’、7b’下拉黏附片Γ，再由筒夾4’將細晶片 3 ’吸離黏附片Γ ;該法雖可避免傳統頂針拾取法所具有之缺失，惟仍具有以下缺失·· 一、細晶片3 ’移位：細晶片3 ’黏附於黏附片1 ’，當機台 8 ’往左移時，細晶片3 ’仍黏附於黏附片1 ’上，因摩擦569375 V. Description of the invention (4) Γ; The suction holes 7a ', 7b' have a suction end which will contact the adhesive sheet Γ, and the adhesive sheet 1 'is located on the surface of the machine 8'; The machine 8 'can be moved on a horizontal plane relative to a specific reference position (can be translated and rotated): (b) a collet 4' is provided to hold the thin wafer 3 'by a suction force; the The collet 4 'has a suction end that will contact the thin wafer 3'; the collet 4 'can hold the thin wafer 3' at the suction end by the suction force: (c) placing the adhesive sheet Γ on the surface of the machine 8 ′, so that the thin wafer 3 ′ on the adhesive sheet 1 ′ is located at the reference position; (d) holding the thin wafer 3 ′ on the collet 4 by the suction force The suction end of ': (e) the suction end of the suction hole 7a', 7b 'holding the adhesive sheet 1' in the machine 8 '; (f) relative to the reference position on the horizontal plane Move the machine 8 'to remove the adhesive sheet Γ from the fine wafer 3'; and (g) pick up the fine wafer 3 by the collet 4 'and thus remove the adhesive wafer Γ, In other words, in the conventional case, the collet 4 'is first adsorbed on the thin wafer 3', and then the adhesive sheet Γ is pulled down by the suction holes 7a ', 7b', and then the thin wafer 3 'is sucked away by the collet 4'. Adhesive sheet Γ; Although this method can avoid the shortcomings of the traditional thimble picking method, it still has the following shortcomings: 1. Thin wafer 3 'shift: The thin wafer 3' is adhered to the adhesive sheet 1 ', and the machine 8' When moving to the left, the thin chip 3 'still adheres to the adhesive sheet 1' due to friction

569375 五、發明說明（5) 力存在間接帶動黏附片1’作些微移動，甚至黏附片 1 ’變形，使細晶片3 ’微傾斜，而筒夾4 ’只靠真空吸力並無法將細晶片3 ’定位，造成細晶片3 ’取放之精度降低，對半導體設備精度要求以77 m為單位之影響極大；二、破壞細晶片3 · 通常細晶片3表面設有凸塊（Bump) 或空橋（Air bridge)等特定結構，筒夾4’吸取細晶片 3 ’時必須避開該特定結構，然，前述細晶片3 ’微位移卻會導致筒夾4’碰觸特定結構，對於未來高密度細晶片之發展更是不利；三、抽吸力導致黏附片Γ變型：黏附片Γ貼放於機台8 ’之抽吸孔7a’、7b’表面，抽吸孔7a’、7b’必須提供高於黏附片Γ表面張力之強抽吸力，否則無法將黏附片 Γ下拉，而該強抽吸力導致黏附片Γ變型，位於機台 8 ’右側之黏附片1 ’因受拉而變長，位於機台8 ’左側之黏附片Γ因受壓而變短，不僅對造成已被筒夾4 ’吸附之細晶片3 ’移位，其周圍未被筒夾4 ’吸附之細晶片 3 ’役有可能移位，造成細晶片取放之精度降低；四、費時：一次僅吸取一個細晶片3 ’，在拾取過程中需等待吸取時間及筒夾4 ’左右移動時間，造成細晶片拾取生產速度低落；五、不適用於更小尺寸細晶片；抽吸孔7a’、7b’必須依細晶片3 ’尺寸不同而改變，當細晶片3 ’尺寸小於 0 . 5 X 0 . 5 m m時，因抽吸孔7 a ’、7 b ’小而無法產生足夠569375 V. Description of the invention (5) The presence of force indirectly drives the adhesive sheet 1 'to move slightly, and even the adhesive sheet 1' deforms, causing the thin wafer 3 'to slightly tilt, while the collet 4' cannot rely on the vacuum suction only to make the thin wafer 3 'Positioning, causing the thin wafer 3' The accuracy of picking and placing is reduced, which has a great impact on the precision requirements of semiconductor equipment in units of 77 m. 2. Destruction of the thin wafer 3 · Usually the surface of the thin wafer 3 is provided with bumps or empty bridges. (Air bridge) and other specific structures, the collet 4 'must avoid the specific structure when sucking the thin wafer 3'. However, the micro-displacement of the aforementioned thin wafer 3 'will cause the collet 4' to touch the specific structure. For the future high density The development of thin wafers is even more unfavourable; 3. The suction force causes the adhesive sheet Γ deformation: The adhesive sheet Γ is placed on the surface of the suction holes 7a 'and 7b' of the machine 8 ', and the suction holes 7a' and 7b 'must be provided Strong suction force higher than the surface tension of the adhesive sheet Γ, otherwise the adhesive sheet Γ cannot be pulled down, and this strong suction force causes the adhesive sheet Γ to deform, and the adhesive sheet 1 'located on the right side of the machine 8 becomes longer due to tension , Adhesive sheet on the left side of the machine 8 ' Shortened due to pressure, not only will the fine wafer 3 'which has been attracted by the collet 4' be displaced, but the surrounding wafers 3 'which are not attracted by the collet 4' may be displaced, resulting in the picking and placing of the fine wafer. The accuracy is reduced; 4. Time-consuming: Only one thin wafer is sucked 3 'at a time. During the picking process, it is necessary to wait for the suction time and the collet 4' left and right movement time, resulting in low production speed of fine wafer picking. 5. Not suitable for smaller sizes Thin wafers; suction holes 7a ', 7b' must be changed according to the size of the thin wafer 3 '. When the size of the thin wafer 3' is less than 0.5 X 0.5 mm, the suction holes 7a ', 7b' Small enough to produce enough

569375569375

之真空吸力使細晶片3,與黏附片1，脫離，而現今m v f半導體絕大部分都小於5公厘（mm)長寬，顯現該習知結構之不足。發明目的：爰是，於提供一種予膠膜一能與膠膜間之承受之外力破損，可縮本發明法，可一次本發明法，取放晶速度者。本發明法，可製作點，增加生本發明法，可避免帶變形使晶本發明法，可避免有鑑於習物件與膠與物件適黏合性，，使物件短拾取時之次要目直接剝離之另一目片與撕離用方式膜分離度分離再以取變形量間且物的在於多個晶的在於膠膜之之缺失之方法之如撕放頭吸控制至件不致提供一片，增提供一動作可，本發明之主，其特徵在於離之外力，使取物件，其可極小之程度，移位者。種物件與膠膜加生產速度者種物件與膠膜同時進行，可The vacuum suction force separates the thin wafer 3 from the adhesive sheet 1. Nowadays, most of the mv f semiconductors are less than 5 mm (mm) in length and width, showing the shortcomings of the conventional structure. Purpose of the invention: Firstly, to provide a film that can withstand the external force between the film and the film, and can be shrunk and shrinkable. The method of the present invention can make points, increase the method of the present invention, avoid the deformation of the method of the present invention, avoid the adhesiveness of the object and the glue and the object, and directly peel the secondary object when the object is picked short. The other method is to separate the film separation degree with the tearing method, and then take the amount of deformation. The thing that lies in the multiple crystals is the lack of the adhesive film. The method such as tearing the head away from the piece will not provide a piece. One action is possible, the master of the present invention is characterized in that the force can be taken away from the external force to move the object to a minimum degree. Seeds and films can be produced at the same time.

之又因產速度者之再一目摩擦力存片成微傾之再一目取放頭微的在於提供一種物件與膠膜頭’一個循環可吸取多個晶〇的在於提供一種物件與膠膜在間接帶動膠帶做些微的移斜’可增加取放精度者。的在於提供一種物件與膠膜位移而碰觸晶片正面之特定要目的在 :預先施降低物件降低物件避免物件分離之方〇分離之方增加生產分離之方片至定分離之方動甚至膠Another reason is that the frictional force of the speed-producing person saves the film into a slight tilt, and the pick-and-place head is to provide an object and a film head. 'One cycle can absorb multiple crystals. 0 is to provide an object and a film. Indirectly driving the tape to do a slight tilt can increase the accuracy of picking and placing. The purpose is to provide a specific object that touches the front side of the wafer with the displacement of the film.The main purpose is: to apply in advance to lower the object, lower the object, to avoid the separation method of the object, the separation method, to increase the production, the separation method, to the separation method, and even the glue.

分離之方結構者。Separation Party Structure.

第11頁 569375 五、發明說明（7) 具體實施例：本發明之其他目的與詳細之構造，將藉由以下詳細說明而使之更為明確，當然，本發明在某些另件上，或另件之安排上容許有所不同，但所選用之實施例，則於本說明書中，予以詳細說明，並於附圖中展示其構造，俾使本發明之技術内容更進一步的揭示明瞭。請參閱圖四A至圖四C，並同時對應圖五A至圖五C，揭示本發明之一較佳實施例之具體配置，以晶片拾取為說明例，晶片3 0黏貼於紫外光固化膠膜4 0上，黏貼有晶片3 0之膠膜4 0設置於一固定不動之機台（圖中未示出）上，機台上方設有可移動之取放頭1〇，於膠膜4 0底部設有一可移動之真空吸取座50，該真空吸取座5 0具有一可產生一向下吸力之真空吸附孔5 1，該真空吸附孔5 1之大小係能涵蓋至少一個晶片3 0 ° 綜上所述，本實施例其撕離膠膜之步驟如下： a設置一用以承載底部黏貼有膠臈4 0之晶片3 0之固定不動之機台，於機台上方設有一可移動之取放頭1〇; b.設置〆具有真空吸附孔51且可針對晶片30位置位移之真空吸取座5 〇 ; c移動真空吸取座5 〇於晶片3 0底部，藉由真空吸取座5 0之真空吸附孔5 1所產生之吸力以對膠膜4 0產生如撕離之外力，使晶片30與膠膜40分離’降低晶片30與膠膜40間之黏合性；Page 11 569375 V. Description of the invention (7) Specific embodiments: The other objects and detailed structures of the present invention will be made clearer by the following detailed description. Of course, the present invention is on some other parts, or The arrangement of the other pieces is allowed to be different, but the selected embodiment is described in detail in this specification and its structure is shown in the drawings, so that the technical content of the present invention is further disclosed. Please refer to FIG. 4A to FIG. 4C, and correspondingly to FIG. 5A to FIG. 5C, to disclose the specific configuration of a preferred embodiment of the present invention. Taking wafer picking as an example, the wafer 30 is adhered to the ultraviolet curing adhesive. On the film 40, the adhesive film 40 attached with the wafer 30 is set on a stationary machine (not shown). A movable pick-and-place head 10 is provided above the machine, and the film 4 There is a movable vacuum suction base 50 at the bottom. The vacuum suction base 50 has a vacuum suction hole 51 which can generate a downward suction force. The size of the vacuum suction hole 51 can cover at least one wafer 30 °. As mentioned above, the steps of tearing off the adhesive film in this embodiment are as follows: a. A fixed machine for carrying a wafer 30 with a wafer 40 adhered to the bottom is provided, and a movable picker is provided above the machine. Put the head 10; b. Set up a vacuum suction seat 5 with a vacuum suction hole 51 and can be displaced to the position of the wafer 30; c Move the vacuum suction seat 5 〇 at the bottom of the wafer 30, and vacuum the vacuum of the seat 50 The suction force generated by the suction hole 51 produces an external force such as tearing on the adhesive film 40, so that the wafer 30 Separating from the adhesive film 40 'reduces the adhesion between the wafer 30 and the adhesive film 40;

569375 五、發明說明（8) d ·移動取放頭1 〇至晶片3 0上方就定位，取放頭1 0下降與晶片3 0接觸，並吸附於晶片3 0表面；以及 e ·取放頭1 〇確實吸附晶片3 0後，取放頭1 〇升起將晶片3 0吸取而起。本實施例係驅動真空吸取座5 0重覆動作使複數晶片3 0 與膠膜4 0適度分離，真空吸取座5 0作用於膠膜4 0之吸力係能降低晶片3 0與膠膜4 0之黏合度，而晶片3 0與膠膜4 0之間並未完全分離，以5公厘（mm)長寬之晶片3 0黏附於膠膜40 之情況而言，由於膠膜4 0存在一定之表面張力，故當真空吸附孔5 1對膠膜4 0下吸之吸力消除使膠膜4 0上彈歸位後，膠膜4 0與晶片3 0間之黏合力已被大部分破壞，然膠膜4 0原有之黏性並未消除，藉由該剩餘之黏合力，仍足夠使晶片 3 0定位於膠膜4 0上，圖示係為說明真空吸附孔5 1之作動而刻思強调膠膜4 0與晶片3 0之分離狀態，因此，本發明訴求之重點即在於，先由真空吸附孔5 1作用於膠膜4 〇，使複數之曰曰片3 0與膠膜4 0適度分離，而後再由取放頭1 〇將晶片3 〇吸取而起，可利用一視覺定位，確定取放頭1 〇取放晶片30之位置，如此，可大幅減少拾取時間，而取放頭丨〇將晶片3 0吸起之過程不再有其他外力作用，因此晶片3 〇不致移位，可確保取放之精度；另值得注意的是，$取放頭1〇取放晶片30之過程中，真空吸附孔51仍持續作用於膠膜 40，換言之，取放晶片30與撕離膠膜40之動作可同時進行，因此可提高生產效率。請參閱圖六，可將複數取放頭1 〇設置於一可循環轉動569375 V. Description of the invention (8) d · Move the pick-and-place head 10 to the top of the wafer 30 to position it, and the pick-and-place head 10 descends to contact the wafer 30 and adhere to the surface of the wafer 30; and e · pick-and-place head After 10 has indeed adsorbed the wafer 30, the pick-and-place head 10 is raised and the wafer 30 is sucked up. In this embodiment, the vacuum suction seat 50 is driven to repeat the action to properly separate the plurality of wafers 30 from the film 40, and the suction force of the vacuum suction seat 50 on the film 40 can reduce the wafer 30 and the film 40. The adhesiveness of the wafer 30 is not completely separated from the adhesive film 40. For a case where the adhesive film 40 is adhered to the adhesive film 40 with a length of 5 mm (mm), the adhesive film 40 has a certain degree. Surface tension, so when the suction of the vacuum suction hole 51 on the adhesive film 40 is removed and the adhesive film 40 is rebound and returned, the adhesive force between the adhesive film 40 and the wafer 30 has been mostly destroyed. However, the original viscosity of the adhesive film 40 has not been eliminated. With the remaining adhesive force, it is still sufficient to position the wafer 30 on the adhesive film 40. The illustration is engraved to illustrate the operation of the vacuum adsorption hole 51. Si emphasizes the separation state between the adhesive film 40 and the wafer 30. Therefore, the key point of the present invention is that the vacuum adsorption hole 51 acts on the adhesive film 40 first, so that the plural films 30 and the adhesive film The 40 is separated moderately, and then the pick-up head 10 is sucked up from the wafer 30, and a visual positioning can be used to determine the position of the pick-up head 10 and the position of the wafer 30. In this way, the pick-up time can be greatly reduced, and the process of picking up and placing the head 30 does not have other external forces, so the wafer 30 does not shift, which can ensure the accuracy of picking and placing; it is also worth noting that During the process of taking and placing the wafer 30, the vacuum suction hole 51 continues to act on the adhesive film 40. In other words, the operations of taking and placing the wafer 30 and tearing off the adhesive film 40 can be performed simultaneously, so that the production efficiency can be improved. Please refer to Figure 6, the plural pick-and-place heads 10 can be set in a revolvable rotation

569375 五、發明說明（9) 之轉盤1 4上，一個循環可吸取多個晶片至定點，以增加生產速度。再請參閱圖七A至圖七C，揭示本發明另一較佳實施例之具體配置，仍以晶片拾取為說明例’晶片3 0黏貼於紫外光固化膠膜4 0上，黏貼有晶片3 0之膠膜4 0设置於一固定不動之機台（圖中未示出）上，機台上方設有可移動之取放頭 1 〇，該取放頭1 〇設置於一座體11底部’取放頭1 〇頂部與座體11之間設有一彈性元件12，該座體11具有一連桿13。綜上所述，本實施例其撕離膠膜之步驟如下：569375 V. Invention description (9) On the turntable 14, multiple wafers can be sucked to a fixed point in one cycle to increase the production speed. Please refer to FIG. 7A to FIG. 7C again to disclose the specific configuration of another preferred embodiment of the present invention. The wafer picking is still used as an example. The wafer 3 0 is adhered to the ultraviolet curing film 40 and the wafer 3 is adhered. The adhesive film 0 of 0 is set on a stationary machine (not shown), and a movable pick-and-place head 10 is provided above the machine, and the pick-and-place head 10 is set at the bottom of a body 11 ' An elastic element 12 is provided between the top of the pick-and-place head 10 and the base 11, and the base 11 has a connecting rod 13. In summary, the steps of peeling off the adhesive film in this embodiment are as follows:

a. 設置一用以承載底部黏貼有膠膜40之晶片30之機台，於機台上方設有一可移動之取放頭10;; b. 設置一連桿1 3連設於取放頭1 0旁’且該連桿1 3與取放頭 1 0可同步升降； c. 移動取放頭1 〇至晶片3 0上方就定位’取放頭1 〇下降與晶片3 0接觸並吸附於晶片3 0表面之前，可先帶動連桿1 3下壓於膠膜4 0面上，藉連桿1 3對膠膜4 0產生一能與晶片3 0 分離之撕離力；以及 d. 取放頭10確實吸附晶片30後，取放頭10升起將晶片30吸取而起，連桿13同時釋放膠膜40。a. Set a machine for carrying the wafer 30 with the adhesive film 40 on the bottom, a movable pick and place head 10 is arranged above the machine; b. a link 1 3 is connected to the pick and place head 1 Next to 0, and the link 13 and the pick-and-place head 10 can be raised and lowered synchronously; c. Move the pick-and-place head 10 to the top of the wafer 30 to position the 'pick-and-place head 1 0' to come into contact with the wafer 30 and stick to the wafer Before the 30 surface, the connecting rod 13 can be driven down on the surface of the adhesive film 40. The connecting rod 13 generates a tearing force on the adhesive film 40 that can be separated from the wafer 3 0; and d. After the head 10 does adsorb the wafer 30, the pick-up head 10 is lifted to suck up the wafer 30, and the connecting rod 13 releases the adhesive film 40 at the same time.

本實施例係驅動連桿1 3下壓膠膜4 0與晶片3 0適度分離，連桿1 3設置於取放頭1 0之侧且連桿1 3與晶片3 0具有一適當距離D1，該距離D1係可供連桿1 3向下作動時能壓制於膠膜4 0而不致碰觸晶片30，連桿13之長度略長於該取放頭 1 0，使得取放頭1 0下降而未與晶片3 0接觸時，該連桿1 3已In this embodiment, the driving link 13 presses down the adhesive film 40 and the wafer 30 moderately. The link 13 is disposed on the side of the pick-and-place head 10 and the link 13 and the wafer 30 have an appropriate distance D1. The distance D1 can be used for the rod 13 to be pressed to the film 40 without touching the wafer 30 when the rod 13 moves downward. The length of the rod 13 is slightly longer than the pick-and-place head 10, which makes the pick-and-place head 10 lower and When not in contact with the wafer 30, the connecting rod 1 3 has been

第14頁 569375Page 14 569375

五、發明說明（ίο) 與膠膜4 0接觸而下壓膠膜40，且該連桿13作用於膠膜40之下壓力係能降低晶片3 0與膠膜4 0之黏合度，而晶片3 〇與膠膜40之間並未完全分離，圖示係為說明連桿1 3之作動而刻意強調膠膜40與晶片30之分離狀態，以5公厘（mm)長寬之晶片3 0黏附於膠膜4 0之情況而言，由於膠膜4 0存在一定之表面張力，故連桿13施予膠膜40之下壓力足夠破壞膠膜40 與晶片3 0間之黏合力即可，藉由膠膜4 0剩餘之黏合力使晶片3 0仍能定位於膠膜4 0上，因此’本發明訴求之重點即在於，先由連桿1 3下壓膠膜4 0，使複數之晶片3 0與膠膜4 0適度分離，而後再由取放頭1 〇將晶片3 0吸取而起，若並聯複數取放頭1 0與連桿1 3，則可同步拾取複數晶片3 0，如此可大幅減少拾取時間，而取放頭1 0將晶片3 0吸起之過程不再有其他外力作用，因此晶片3 0不致移位，可確保後續製程之精確度。另強調方式，可適 mm)長寬之片尺寸愈小吸力強度，連桿作用方綜觀前件與膠膜分物件適度分合性，再以說明一點，圖七種尺寸晶以圖四、吸附孔亦用於各晶片 ’ ，真空因此，式係為述兩種離之方離之如取放頭基於晶片一較適當藉由晶片法，其特撕離之外吸取物件片，尤適於尺寸小五之真空吸附方式必須隨之縮小，繼尺寸日益縮小之發之選擇。拾取為實施例說明徵在於··預先施予力，使降低物件與，由於外力未作用膠膜之實施於5公厘而言，當晶而影響真空展趨勢，該本發明使物膠膜一能與膠膜間之黏於物件上，V. Description of the invention (ίο) The adhesive film 40 is pressed in contact with the adhesive film 40, and the pressure of the connecting rod 13 under the adhesive film 40 can reduce the adhesion between the wafer 30 and the adhesive film 40, and the wafer 3 〇 It is not completely separated from the adhesive film 40. The illustration shows the separation state of the adhesive film 40 and the wafer 30 intentionally to explain the action of the connecting rod 13. The wafer 3 with a width of 5 mm (mm) In the case of adhesion to the adhesive film 40, since the adhesive film 40 has a certain surface tension, the pressure applied by the connecting rod 13 to the adhesive film 40 is sufficient to destroy the adhesive force between the adhesive film 40 and the wafer 30. With the remaining adhesive force of the adhesive film 40, the wafer 30 can still be positioned on the adhesive film 40. Therefore, the main point of the present invention is that the adhesive film 40 is first pressed down by the connecting rod 13 to make the plural The wafer 30 is separated from the adhesive film 40 moderately, and then the wafer 30 is picked up by the pick-and-place head 10, and if the multiple pick-and-place head 10 and the connecting rod 13 are connected in parallel, a plurality of wafers 30 can be picked up simultaneously. This can greatly reduce the pick-up time, and the process of picking up and holding the head 10 to pick up the wafer 30 will not have any other external force, so the wafer 30 will not be shifted, which can ensure the later The accuracy of the process. Another emphasis is on the way, the smaller the size of the sheet is, the smaller the suction strength is. The connecting rod acting side looks at the moderate coupling between the front part and the film film object. To illustrate, the seven sizes of crystals are shown in Figure 4. The hole is also used for each wafer ', so the vacuum is described as the two kinds of separation. The pick-and-place head is based on the wafer. A more appropriate method is the wafer method. The vacuum adsorption method of Xiaowu must be reduced accordingly, and it is the choice following the ever-decreasing size. Picking up is an example. The feature is to apply a force in advance to reduce the object and, because the external force does not act on the film, the implementation of the film is 5 mm. When the crystal is affected, the vacuum spreading trend is affected. Adhesion between the films,

五、發明說明（11) _ 因此可使物件變形量控制至極且物件不致移位，並可一次直，程度，速度’縮短拾取時間，經發明人：離多個 i(mm)長寬之晶片而言，利用前述離所需之應力僅為丨克（g)，不僅:離方式式可能對物件構成之傷害，尤適取’其產業利用性及進步性顯應具明與圖示，僅為本發明之較佳實施例，當 |發明之實際實施範圍，凡依以上說明及二 1所載之構造特徵及功能上所作之各種變換更或等效元件之置換仍應隸屬本發明之範丨此外’本發明於申請前並未曾見於任物上，因此本發明案深具「產業利用性、 |性」之發明專利要件，爰依法提出發明專貴審查委員允撥時間惠允審查並早賜與專避免物件破損’ 晶片，增加生產，對於5公厘使膠膜與物件分傳統頂針拾取方件如薄晶片之拾以上所揭露之說不能用以限定本下申請專利範圍，舉凡數值之變疇。何公開場合或刊新穎性及進步利申請。祁請利為禱。V. Description of the invention (11) _ Therefore, the amount of deformation of the object can be controlled to the extreme and the object will not be displaced, and it can be straight, degree, and speed at one time to shorten the picking time. According to the inventor: away from multiple i (mm) length and width of the wafer In terms of the above, the stress required to use the above-mentioned separation is only gram (g), not only: the damage that the separation method may pose to the object, it is particularly appropriate that its industrial availability and progress should be clearly shown and illustrated, only This is a preferred embodiment of the present invention. When the actual implementation scope of the invention, any changes made according to the above description and the structural features and functions contained in No. 1 or the replacement of equivalent elements should still belong to the scope of the present invention.丨 In addition, 'The invention was not seen on anything before the application. Therefore, the invention has the "industrial availability, |" nature of the invention patent elements. Giving special attention to avoiding damage to objects' wafers and increasing production. For 5mm, the traditional film ejection of square film and objects to pick up square pieces such as thin wafers can not be used to limit the scope of the patent application. Where the value changes. Any public occasions or publications novelty and progress applications. Qi please benefit.

第16頁 569375 圖式簡單說明圖式簡單說明：圖一 A至圖一 D係習知一種以頂針頂取物件與膠膜分離之方式之動作示意圖。圖二A至圖二C係習知另一種以頂針頂取物件與膠膜分離之方式之動作示意圖。圖三A至圖三C係習知「細晶片拾取方法及細晶片拾取設備」之動作示意圖。圖四A至圖四C係本發明之由物件撕離膠膜之方式之一較佳實施例動作示意圖。Page 16 569375 Brief description of the drawings Brief description of the drawings: Figure 1 A to Figure 1 D is a schematic diagram of the conventional method of using an ejector to take out objects and separate the film from the film. Figures 2A to 2C are schematic diagrams of another known method of using an ejector to eject objects and separate the film from the film. Figures 3A to 3C are schematic diagrams of the conventional "fine wafer picking method and fine wafer picking equipment". Figures 4A to 4C are schematic diagrams of one preferred embodiment of the present invention for tearing off the film from an object.

圖五A至圖五C係相對應於圖四A至圖四C之實施例之側視圖。圖六係本發明之取放頭之另一較佳實施例示意圖。圖七A至圖七C係本發明之由物件撕離膠膜之方式之一較佳實施例動作示意圖。圖號說明： 1 -真空盤裝置 Γ -黏附片 2 -頂針5A to 5C are side views corresponding to the embodiment of FIGS. 4A to 4C. FIG. 6 is a schematic diagram of another preferred embodiment of the pick-and-place head of the present invention. Figures 7A to 7C are schematic diagrams of the action of the preferred embodiment of the method for tearing the adhesive film from an object according to the present invention. Drawing number description: 1-Vacuum tray device Γ-Adhesive sheet 2-Thimble

3 -筒狀結構 3 ’ -細晶片 4 -取放頭 4’ -筒夾 5 -物件3 -Cylinder structure 3 ′ -Fine wafer 4 -Pick-and-place head 4 ’-Collet 5 -Object

第17頁 569375 圖式簡單說明 6 -黏膠層 7 -彈性膜 7 a ’、7 b ’ -抽吸孔 8 -分離部 8,-機台 1 0、1 0 A -取放頭 1 1-座體 1 2 -彈性元件 13- 連桿 14- 轉盤 2 0 -頂針 2 1 -接觸點 3 0 -晶片 3 Ο A -晶片 4 0 _膠膜 5 0 -真空吸取座 5 1 -真空吸附孔 D 1 -距離Page 17 569375 Brief description of the drawing 6-Adhesive layer 7-Elastic film 7 a ', 7 b'-Suction hole 8-Separation section 8,-Machine 1 0, 1 0 A-Pick-and-place head 1 1- Base body 1 2-Elastic element 13-Connecting rod 14-Turntable 2 0-Ejector 2 1-Contact point 3 0-Wafer 3 〇 A-Wafer 4 0 _ Adhesive film 5 0-Vacuum suction seat 5 1-Vacuum suction hole D 1-distance

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Claims

569375 六、申請專利範圍 1 · 一種物件與膠膜分離之方法，其包含下列步驟： a ·設置一用以承載底部黏貼有膠膜之物件之固定不動之機台，於機台上方設有一可移動之取放頭； b·設置一具有真空吸附孔之可移動之真空吸取座； c·移動真空吸取座於物件底部，藉由真空吸取座之真空吸附孔所產生之吸力以對膠膜產生如撕離之外力’使物件與膠膜分離，降低物件與膠膜間之黏合性； d ·移動取放頭至物件上方就定位，取放頭下降與物件接觸，並吸附於物件表面；以及 e ·取放頭確實吸附物件後，取放頭升起將物件吸取而起。 2 ·如申請專利範圍第1項所述之物件與膠膜分離之方法，其中，該真空吸取座係重覆動作使複數物件與膠膜適度分離，再由取放頭將已與膠膜適度分離之物件--吸取而起者。 3 ·如申請專利範圍第1項所述之物件與膠膜分離之方法，其中，該真空吸取座作用於膠膜之吸力係能降低物件與膠臈之黏合度，而物件與膠膜之間未完全分離者。 4 ·如申請專利範圍第1項所述之物件與膠膜分離之方法，其中，該真空吸取座之真空吸附孔大小係能涵蓋至少一物件者。 5 ·如申請專利範圍第1項所述之物件與膠臈分離之方法，其中，係將複數之取放頭設置於一可循環轉動之轉盤，一個循環可吸取複數晶片者。569375 VI. Scope of patent application1. A method for separating an object from an adhesive film, which includes the following steps: a. A fixed machine for carrying an object with an adhesive film attached at the bottom is provided, and a movable device is provided above the machine. Move the pick-and-place head; b. Set a movable vacuum suction base with a vacuum suction hole; c. Move the vacuum suction base at the bottom of the object, and use the suction force generated by the vacuum suction hole of the vacuum suction base to generate the adhesive film Such as the force of tearing apart the object from the adhesive film and reduce the adhesion between the object and the adhesive film; d · Move the pick-and-place head above the object to locate it, the pick-and-place head descends into contact with the object and adheres to the surface of the object; and e · After the pick-up head has indeed attracted the object, the pick-up head is raised to suck up the object. 2 · The method for separating the object from the film as described in item 1 of the scope of the patent application, wherein the vacuum suction seat is a repeated action to properly separate a plurality of objects from the film, and then the pick-and-place head will moderately separate the film from the film. Separated objects-those that are sucked up. 3 · The method for separating the object from the film as described in item 1 of the scope of the patent application, wherein the suction force of the vacuum suction seat on the film can reduce the adhesion between the object and the film, and between the object and the film Not completely separated. 4. The method for separating an object from a film as described in item 1 of the scope of patent application, wherein the vacuum suction hole size of the vacuum suction base can cover at least one object. 5. The method of separating objects from capsules as described in item 1 of the scope of patent application, wherein a plurality of pick-and-place heads are set on a turntable that can rotate, and a plurality of wafers can be sucked in one cycle.

569375 六、申請專利範圍 6 /種物件與膠膜分離之方法，其包含了列步驟： • a.設置一用以承載底部黏貼有膠膜之物件之固定不動之機台，於機台上方設有一可移動之取放頭； b. 設置一連桿連設於取放頭旁，且該連桿與取放頭可同步升降； c. 移動取放頭至物件上方就定位，取放頭下降與物件接觸並吸附於物件表面之前，可先帶動連桿下壓於膠膜面上，藉連桿對膠膜產生一能與物件分離之撕離力；以及 d ·取放頭確實吸附物件後，取放頭升起將物件吸取而起，連桿同時釋放膠膜。 7 ·如申請專利範圍第6項所述之物件與膠膜分離之方法，其中，該連桿之長度略長於該取放頭，使得取放頭下降而未與物件接觸時，該連桿已與膠膜接觸而下壓膠膜者。 8 ·如申請專利範圍第6項所述之物件與膠膜分離之方法，其中’該連桿作用於膠膜之下壓力係能降低物件與膠膜之黏合度，而物件與膠膜之間未完全分離者。 9 ·如申請專利範圍第6項所述之物件與膠膜分離之方法，其中，依物件之間距設置有複數並聯之取放頭及連桿，該複數取放頭同步下降之同時，可帶動連桿下壓膠膜，以同步吸取複數物件者。569375 6. Scope of patent application 6 / A method for separating objects from the film, which includes the following steps: • a. Set a fixed machine for carrying objects with adhesive film on the bottom, and set it above the machine There is a movable pick-and-place head; b. A link is arranged next to the pick-and-place head, and the link and the pick-and-place head can be raised and lowered synchronously; c. Move the pick-and-place head above the object to position it, and the pick-and-place head descends Before contacting with the object and adsorbing on the surface of the object, the link can be driven to press down on the surface of the film, and the link can generate a tearing force on the film that can be separated from the object; and d. After the pick-up head has indeed adsorbed the object The pick-up head is raised to suck up the object, and the connecting rod releases the film at the same time. 7 · The method for separating an object from a film as described in item 6 of the scope of patent application, wherein the length of the connecting rod is slightly longer than the pick-and-place head, so that when the pick-and-place head is lowered without contacting the object, the link has Those who come into contact with the adhesive film and press down the adhesive film. 8 · The method for separating the object from the film as described in item 6 of the scope of the patent application, wherein the pressure of the connecting rod under the film can reduce the adhesion between the object and the film, and the distance between the object and the film Not completely separated. 9 · A method for separating an object from a film as described in item 6 of the scope of the patent application, wherein a plurality of parallel pick-and-place heads and connecting rods are provided according to the distance between the objects. The adhesive film is pressed down by the connecting rod to suck multiple objects simultaneously.