TWI420995B - Mounting method for electric components - Google Patents

Mounting method for electric components Download PDF

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Publication number
TWI420995B
TWI420995B TW095127416A TW95127416A TWI420995B TW I420995 B TWI420995 B TW I420995B TW 095127416 A TW095127416 A TW 095127416A TW 95127416 A TW95127416 A TW 95127416A TW I420995 B TWI420995 B TW I420995B
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Taiwan
Prior art keywords
adhesive
electrical component
thermocompression bonding
present
anisotropic conductive
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TW095127416A
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Chinese (zh)
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TW200733834A (en
Inventor
Takashi Matsumura
Hisashi Ando
Shiyuki Kanisawa
Yasuhiro Suga
Kazuaki Suzuki
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Dexerials Corp
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Priority claimed from JP2006024586A external-priority patent/JP2006245554A/en
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of TW200733834A publication Critical patent/TW200733834A/en
Application granted granted Critical
Publication of TWI420995B publication Critical patent/TWI420995B/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H01L2224/75316—Elastomer inlay with retaining mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

電氣元件之構裝方法Method of assembling electrical components

本發明係關於一種例如將半導體晶片或軟性印刷配線板等電氣元件構裝在配線基板上之技術，尤其係關於使用黏著劑來構裝電氣元件之技術。The present invention relates to a technique of, for example, mounting an electric component such as a semiconductor wafer or a flexible printed wiring board on a wiring board, and more particularly to a technique of constructing an electric component using an adhesive.

以往，作為將IC晶片(裸晶片)或軟性印刷配線板直接構裝在LCD基板等基板上的方法，已知有使用使結合劑中之導電粒子加以分散之異向導電性黏著膜的方法。Conventionally, as a method of directly mounting an IC wafer (bare wafer) or a flexible printed wiring board on a substrate such as an LCD substrate, a method of using an anisotropic conductive adhesive film in which conductive particles in a binder are dispersed has been known.

此等COG(玻璃上有晶片：CHIP ON GLASS)、COF(軟膜上有晶片：CHIP ON FLEX)方式的構裝，例如圖6(a)、(b)所示，係在設置有LCD面板102之玻璃基板101的既定構裝區域上配置異向導電性黏著膜104，在其上裝載IC晶片105或軟性印刷配線板106後，使用平坦的壓接頭(未圖示)來對IC晶片105等進行加壓、加熱，以使異向導電性黏著膜104硬化而進行熱壓接構裝。Such COG (wafer on glass: CHIP ON GLASS), COF (chip on CHAP ON FLEX), for example, as shown in FIGS. 6(a) and (b), is provided with an LCD panel 102. The anisotropic conductive adhesive film 104 is placed on a predetermined mounting region of the glass substrate 101, and after the IC wafer 105 or the flexible printed wiring board 106 is mounted thereon, the IC wafer 105 is used by using a flat crimping joint (not shown). Pressurization and heating are performed to cure the anisotropic conductive adhesive film 104 to perform thermocompression bonding.

再者，在構裝後之IC晶片105以及軟性印刷配線板106之周圍區域，為了防止玻璃基板101上之ITO(導電)電極的腐蝕，使用密封樹脂以進行密封。Further, in order to prevent corrosion of the ITO (conductive) electrode on the glass substrate 101 in the region around the IC chip 105 and the flexible printed wiring board 106 after the assembly, a sealing resin is used for sealing.

然而，此等習知構裝方法必須要有COG構裝、FOG(玻璃上有軟膜：FLEX ON GLASS)構裝、密封步驟等3個個別獨立的步驟，故構裝效率不佳而期盼能有進一步的改善。However, these conventional methods must have three separate steps: COG construction, FOG (soft film on glass: FLEX ON GLASS), sealing step, etc., so the assembly efficiency is not good and expects There are further improvements.

本發明係為了解決上述習知技術的問題而構成，其目的在於提供一種構裝方法，其使用黏著劑來高效率將不同構裝方式之電氣元件進行構裝。The present invention has been made to solve the above problems of the prior art, and an object thereof is to provide a mounting method for efficiently assembling electrical components of different mounting methods using an adhesive.

為了達到上述目的，本發明之構裝方法，係使用熱壓接頭(在頭部本體具有既定彈性體所構成之壓接構件)將電氣元件構裝在配線基板上，其具有下述步驟：在該配線基板上之構裝區域整面配置黏著劑後，將不同構裝方式之電氣元件配置在該構裝區域，使用具有壓接構件(其尺寸對應於該黏著劑)之熱壓接頭將該電氣元件一起進行熱壓接。In order to achieve the above object, the mounting method of the present invention uses a thermocompression bonding joint (a crimping member having a predetermined elastic body in a head body) to mount an electrical component on a wiring substrate, which has the following steps: After the adhesive is disposed on the entire surface of the mounting substrate on the wiring substrate, electrical components of different mounting configurations are disposed in the mounting region, and the electrical component is crimped using a crimping member (the size of which corresponds to the adhesive). The components are thermocompression bonded together.

本發明中，該電氣元件，可以使用COG方式之電氣元件。In the present invention, the electrical component of the COG type can be used as the electrical component.

本發明中，該電氣元件，可以使用FOG方式之電氣元件。In the present invention, the electrical component of the FOG type can be used for the electrical component.

本發明中，該黏著劑，係使用異向導電性黏著劑。In the present invention, the adhesive is an anisotropic conductive adhesive.

本發明中，亦可使該配線基板作為液晶顯示裝置用之玻璃基板。In the present invention, the wiring board can also be used as a glass substrate for a liquid crystal display device.

本發明中，亦可在該配線基板上之構裝區域整面配置複數個黏著劑以進行構裝。In the present invention, a plurality of adhesives may be disposed on the entire surface of the wiring substrate on the wiring substrate to be mounted.

本發明中，該黏著劑，可以使用帶狀黏著劑。In the present invention, a band-shaped adhesive can be used as the adhesive.

本發明係以既定彈性體所構成之彈性壓接構件來進行熱壓接者，例如，可將複數個高度不同的電氣元件一起進行可靠性高的熱壓接構裝，故在配線基板上的構裝區域整面配置黏著劑後，將不同構裝方式(例如，COG方式、FOG方式)之電氣元件配置在該構裝區域，使用尺寸與該黏著劑對應之熱壓接頭將該等電氣元件一起進行熱壓接，藉此，可一次進行對習知各構裝方式之電氣元件個別進行之各構裝步驟(黏著劑的配置、預壓接、正式壓接)。In the present invention, the elastic crimping member composed of a predetermined elastic body is used for thermocompression bonding. For example, a plurality of electrical components having different heights can be thermally crimped together with high reliability, so that they are mounted on the wiring substrate. After the adhesive is disposed on the entire surface of the mounting region, electrical components of different mounting methods (for example, COG mode and FOG mode) are disposed in the mounting region, and the electrical components are combined with the thermocompression joints corresponding to the adhesive. By thermocompression bonding, each of the assembly steps (adhesive arrangement, pre-compression bonding, and final pressure bonding) for the electrical components of the conventional mounting methods can be performed at one time.

此外，本發明藉由熱壓接使配置在配線基板上之構裝區域整面的黏著劑硬化，可具有例如將ITO電極加以密封之功能，其結果，可以省略習知密封步驟。Further, in the present invention, the adhesive disposed on the entire surface of the mounting region on the wiring board is cured by thermocompression bonding, and for example, the ITO electrode can be sealed. As a result, the conventional sealing step can be omitted.

如上述，依據本發明，可大幅削減步驟數量，故可以大幅提升例如當製造液晶顯示裝置時，使用異向導電性黏著劑加以構裝之效率。As described above, according to the present invention, the number of steps can be drastically reduced, so that the efficiency of using an anisotropic conductive adhesive can be greatly improved, for example, when manufacturing a liquid crystal display device.

再者，本發明中，例如若在配線基板上之構裝區域整面配置複數個帶狀黏著劑來進行構裝，則可依構裝之電氣元件使用最佳條件之黏著劑來進行構裝，故可進一步提升連接可靠性。Further, in the present invention, for example, when a plurality of strip-shaped adhesives are disposed on the entire surface of the mounting region on the wiring board, the electrical components can be assembled using the optimum conditions of the adhesive. Therefore, the connection reliability can be further improved.

依據本發明，可使用黏著劑將不同構裝方式之電氣元件高效率進行構裝。According to the present invention, an adhesive can be used to efficiently assemble electrical components of different configurations.

以下，參照圖式詳細說明本發明之電氣元件之構裝方法之實施形態。Hereinafter, embodiments of the method of assembling an electric component according to the present invention will be described in detail with reference to the drawings.

圖1(a)~(d)係表示本實施形態之步驟的部分截面說明圖，圖2係表示圖1所示之實施形態的局部之立體圖。1(a) to 1(d) are partial cross-sectional explanatory views showing the steps of the embodiment, and Fig. 2 is a partial perspective view showing the embodiment shown in Fig. 1.

如圖1(a)所示，本實施形態中，首先，準備設置有LCD面板2(形成有未圖示之配線圖案)之玻璃基板1(配線基板)。As shown in Fig. 1 (a), in the present embodiment, first, a glass substrate 1 (wiring substrate) on which an LCD panel 2 (a wiring pattern (not shown) is formed) is prepared.

在此，將玻璃基板1裝載至未圖示之基台上，於該基台內設置有加熱器。Here, the glass substrate 1 is mounted on a base (not shown), and a heater is provided in the base.

接著，在該玻璃基板1之構裝區域3整面貼合異向導電性黏著膜4(異向導電性黏著劑)。Next, the anisotropic conductive adhesive film 4 (isotropic conductive adhesive) is bonded to the entire surface of the mounting region 3 of the glass substrate 1.

該異向導電性黏著膜4，係於黏合劑樹脂中分散有導電粒子者(詳細未圖示)。又，分散於黏合劑樹脂中的導電粒子的數量若為少量，則本發明中黏著劑之熔融黏度並不會因為導電粒子有無分散而受到影響。The anisotropic conductive adhesive film 4 is a dispersion of conductive particles in a binder resin (not shown in detail). Further, if the amount of the conductive particles dispersed in the binder resin is small, the melt viscosity of the adhesive in the present invention is not affected by the presence or absence of dispersion of the conductive particles.

接著，如圖1(b)所示，在該異向導電性黏著膜4之既定位置上裝載例如COG方式之電氣元件的IC晶片5，並進行預壓接。Next, as shown in FIG. 1(b), an IC chip 5 of, for example, a COG type electrical component is placed at a predetermined position of the anisotropic conductive adhesive film 4, and pre-compression bonding is performed.

接著，如圖1(c)所示，在異向導電性黏著膜4一端之邊緣上裝載定位例如FOG方式之電氣元件的軟性印刷配線板6邊緣，並進行預壓接。Next, as shown in Fig. 1(c), the edge of the flexible printed wiring board 6 on which an electric component such as an FOG type is placed is placed on the edge of one end of the anisotropic conductive adhesive film 4, and pre-compression bonding is performed.

接著，如圖1(d)及圖2所示，使用熱壓接頭7一起進行IC晶片5以及軟性印刷配線板6之正式壓接。Next, as shown in FIG. 1(d) and FIG. 2, the IC wafer 5 and the flexible printed wiring board 6 are collectively pressure-bonded together using the thermocompression bonding joint 7.

在此，熱壓接頭7具有由既定金屬構成之頭部本體8，其內部設置有未圖示的加熱用加熱器。Here, the thermocompression joint 7 has a head main body 8 made of a predetermined metal, and a heating heater (not shown) is provided inside.

又，在頭部本體8之與玻璃基板1相對向的部位上設置有凹部8a，在該凹部8a中以密合於各凹部8a內璧之方式來安裝板狀彈性體所構成的壓接構件9。Further, a recessed portion 8a is provided in a portion of the head main body 8 facing the glass substrate 1, and a crimping member composed of a plate-like elastic body is attached to the recessed portion 8a so as to be in close contact with the inner recess of each recessed portion 8a. 9.

本實施形態的壓接構件9，係以平面狀的壓接面9a成為水平之方式來配置。此外，壓接構件9之壓接面9a之構成，係對應於玻璃基板1之構裝區域3上的異向導電性黏著膜4的尺寸，例如，較異向導電性黏著膜4之尺寸大一些。The pressure-bonding member 9 of the present embodiment is disposed such that the planar pressure-bonding surface 9a is horizontal. Further, the crimping surface 9a of the crimping member 9 is configured to correspond to the size of the anisotropic conductive adhesive film 4 on the mounting region 3 of the glass substrate 1, for example, the size of the isotropic conductive adhesive film 4 is large. some.

又，壓接構件9的厚度，從對各電氣元件之頂部以及當進行熱壓接時之黏著劑的邊緣部分施加最適當的壓力之觀點來看，較佳為設定成與電氣元件中具有最大厚度者相同、或較其厚的厚度。Further, the thickness of the crimping member 9 is preferably set to be the largest among the electric components from the viewpoint of applying the most appropriate pressure to the top of each electric component and the edge portion of the adhesive when the thermocompression bonding is performed. The thickness is the same, or a thicker thickness.

另一方面，本發明中壓接構件9的彈性體之種類並沒有特別的限定，但由提升連接可靠性之觀點來考量，較佳為使用橡膠硬度40至80者。On the other hand, the type of the elastic body of the crimping member 9 in the present invention is not particularly limited, but it is preferably from the viewpoint of improving the connection reliability, and it is preferable to use a rubber hardness of 40 to 80.

橡膠硬度未達40之彈性體，對各電氣元件所施的壓力會不足夠而產生初期電阻以及連接可靠性不佳的缺陷，橡膠硬度大於80以上之彈性體，對邊緣部分之壓力會不足夠而導致黏著劑的黏合劑樹脂產生孔洞，使連接可靠性不佳之缺陷。For elastomers with a rubber hardness of less than 40, the pressure applied to each electrical component may not be sufficient to cause initial resistance and poor connection reliability. For elastomers with a rubber hardness greater than 80, the pressure on the edge portion may not be sufficient. The adhesive resin of the adhesive causes voids, which makes the connection reliability poor.

又，本說明書中，橡膠硬度係適用於以JIS S 6050為依據之規格(溫度條件為室溫：5~35℃)。Further, in the present specification, the rubber hardness is applied to a specification based on JIS S 6050 (temperature conditions are room temperature: 5 to 35 ° C).

在此，在JIS S 6050中，針對橡膠硬度之測定方法記載如下。Here, in JIS S 6050, the method of measuring the rubber hardness is described below.

亦即，使用壓針形狀為直徑5.08±0.02mm之半球狀的彈簧硬度試驗機，對保持水平之試片表面，使試驗機之壓針成為鉛垂而接觸加壓面，立即以正數讀取刻度。That is, a hemispherical spring hardness tester having a needle shape of 5.08±0.02 mm in diameter is used, and the surface of the test piece is kept horizontal, so that the press needle of the test machine becomes vertical and contacts the pressurizing surface, and is immediately read in a positive number. Scale.

此外，試片之測定部位係將表面整體3等分，對每一等分的中央部分逐一進行測定，以其中央值做為試片之硬度。Further, the measurement portion of the test piece was divided into three equal parts of the entire surface, and the central portion of each of the equal parts was measured one by one, and the central value thereof was used as the hardness of the test piece.

備註1：壓針之高度，當刻度為0時係2.54±0.02mm，當刻度為100時係0mm。Remark 1: The height of the needle is 2.54±0.02mm when the scale is 0, and 0mm when the scale is 100.

備註2：刻度與彈簧力(N)之關係，當刻度為0時係0.54，當刻度為10時係1.32，當刻度為20時係2.11，當刻度為25時係2.50，當刻度為30時係2.89，當刻度為40時係3.68，當刻度為50時係4.46，當刻度為60時係5.25，當刻度為70時係6.03，當刻度為75時係6.42，當刻度為80時係6.82，當刻度為90時係7.60，當刻度為100時係8.39。Remark 2: The relationship between the scale and the spring force (N) is 0.54 when the scale is 0, 1.32 when the scale is 10, 2.11 when the scale is 20, 2.50 when the scale is 20, and 2.50 when the scale is 25, when the scale is 30. It is 2.89, 3.68 when the scale is 40, 4.46 when the scale is 50, 5.25 when the scale is 60, 6.03 when the scale is 70, 6.42 when the scale is 70, 6.42 when the scale is 75, and 6.82 when the scale is 80. When the scale is 90, it is 7.60, and when the scale is 100, it is 8.39.

此外，依據本發明人等之實驗，已確認壓接構件9自室溫加熱至240℃之情形，其彈性體之橡膠硬度幾乎不產生變化(±2左右)。Further, according to experiments by the inventors of the present invention, it has been confirmed that the pressure member 9 is heated from room temperature to 240 ° C, and the rubber hardness of the elastomer hardly changes (about ± 2).

做為上述彈性體，可使用天然橡膠、合成橡膠中任一種，但從耐熱性、耐壓性之觀點來考量，最好使用矽氧橡膠。As the above-mentioned elastomer, any of natural rubber and synthetic rubber can be used, but from the viewpoint of heat resistance and pressure resistance, it is preferable to use a silicone rubber.

使用上述熱壓接頭7，透過未圖示的保護膜將熱壓接頭7之壓接面9a緊壓於IC晶片5以及軟性印刷配線板6之頂部，以下述條件進行正式壓接。The crimping surface 9a of the thermocompression bonding joint 7 is pressed against the top of the IC wafer 5 and the flexible printed wiring board 6 by a protective film (not shown) by the above-described thermocompression bonding material 7, and the final pressure bonding is performed under the following conditions.

本發明中，由對各電氣元件周圍的邊緣部充分進行加熱以防止孔洞產生之觀點來考量，當進行正式壓接時，較佳為，將各電氣元件側以既定溫度加熱，且將玻璃基板1側以較上述既定溫度高的溫度進行加熱。In the present invention, it is considered that the edge portion around each of the electric components is sufficiently heated to prevent the occurrence of voids. When the final pressure bonding is performed, it is preferable to heat each of the electrical component sides at a predetermined temperature and to apply the glass substrate. The 1 side is heated at a temperature higher than the above predetermined temperature.

具體而言，以壓接構件9之溫度成為100℃左右之方式控制熱壓接頭7的加熱器，以異向導電性黏著膜之黏合劑樹脂之溫度成為200℃左右之方式控制基台之加熱器。Specifically, the heater of the thermocompression bonding joint 7 is controlled such that the temperature of the pressure-bonding member 9 is about 100 ° C, and the heating of the base is controlled such that the temperature of the adhesive resin of the anisotropic conductive adhesive film is about 200 ° C. Device.

據此，當進行該熱壓接時，可將黏著劑之異向導電性黏著膜4加熱至其熔融黏度為1.0×102 mPa．s至1.0×105 mPa．s。Accordingly, when the thermocompression bonding is performed, the anisotropic conductive adhesive film 4 of the adhesive can be heated to a melt viscosity of 1.0×10 2 mPa. s to 1.0 × 10 5 mPa. s.

在此，當進行熱壓接時，異向導電性黏著膜4之熔融黏度未滿1.0×102 mPa．s之情形，當進行熱壓接時的黏合劑樹脂的流動性較大，會產生孔洞導致初期電阻與連接可靠性不佳之缺陷，熔融黏度較1.0×105 mPa．s大之情形，當進行熱壓接時於連接部份無法完全排除黏合劑樹脂，會產生孔洞導致初期電阻與連接可靠性不佳之缺陷。Here, when the thermocompression bonding is performed, the melt viscosity of the anisotropic conductive adhesive film 4 is less than 1.0 × 10 2 mPa. In the case of s, when the adhesive resin is subjected to thermocompression bonding, the fluidity of the adhesive resin is large, and pores are caused to cause defects in initial resistance and poor connection reliability, and the melt viscosity is 1.0×10 5 mPa. In the case of s large, when the thermocompression bonding is performed, the adhesive resin cannot be completely excluded at the joint portion, and the hole may be caused to cause defects in initial resistance and poor connection reliability.

又，當進行正式壓接時，對每一個電氣元件施加100N左右的壓力15秒左右。Further, when the final pressure bonding is performed, a pressure of about 100 N is applied to each of the electric components for about 15 seconds.

本實施形態中，藉由上述由彈性體構成之壓接構件9進行加壓，以既定壓力將IC晶片5以及軟性印刷配線板6之頂部緊壓於玻璃基板1，另一方面，以較上述加壓頂部之壓力小的壓力將IC晶片5以及軟性印刷配線板6之側部的黏著劑邊緣部緊壓，據此，可對IC晶片5以及軟性印刷配線板6與玻璃基板1的連接部分施加充分的壓力，另一方面，亦可對IC晶片5以及軟性印刷配線板6周圍的邊緣部進行不產生孔洞的加壓。In the present embodiment, the pressure is applied to the pressure-bonding member 9 made of an elastic material, and the tops of the IC wafer 5 and the flexible printed wiring board 6 are pressed against the glass substrate 1 at a predetermined pressure. The pressure at the pressure of the top of the pressurization is pressed against the edge portion of the adhesive between the IC chip 5 and the side of the flexible printed wiring board 6, whereby the IC chip 5 and the connection portion of the flexible printed wiring board 6 and the glass substrate 1 can be connected. A sufficient pressure is applied, and on the other hand, the edge portions around the IC wafer 5 and the flexible printed wiring board 6 can be pressurized without generating holes.

其結果，依據本實施形態，可對不同構裝方式的IC晶片5以及軟性印刷配線板6使用異向導電性黏著膜4來進行高可靠性的連接。As a result, according to the present embodiment, the isotropic conductive adhesive film 4 can be used for the highly reliable connection of the IC wafer 5 and the flexible printed wiring board 6 of different mounting methods.

又，依據本實施形態，可一次進行對習知IC晶片5以及軟性印刷配線板6個別進行的各構裝步驟(黏著劑的配置、預壓接、正式壓接)。Further, according to the present embodiment, each of the constituent steps (adhesive arrangement, pre-compression bonding, and final pressure bonding) performed on the conventional IC chip 5 and the flexible printed wiring board 6 can be performed at one time.

此外，本實施形態中，藉由熱壓接使配置在玻璃基板1上之構裝區域3整面的異向導電性黏著膜4之黏合劑樹脂硬化，可具有將ITO電極加以密封之功能，其結果，可以省略習知密封步驟。Further, in the present embodiment, the adhesive resin of the anisotropic conductive adhesive film 4 disposed on the entire surface of the mounting region 3 disposed on the glass substrate 1 is cured by thermocompression bonding, and has a function of sealing the ITO electrode. As a result, the conventional sealing step can be omitted.

如上述，依據本實施形態，可大幅削減步驟數量，故可以大幅提升當製造液晶顯示裝置時，使用異向導電性黏著劑加以構裝之效率。As described above, according to the present embodiment, the number of steps can be greatly reduced, so that the efficiency of assembling the liquid crystal display device using an anisotropic conductive adhesive can be greatly improved.

又，本發明並不限定於上述實施形態，亦可以進行各種改變。Further, the present invention is not limited to the above embodiment, and various modifications can be made.

例如，上述實施形態中，以將IC晶片5以及軟性印刷配線板6等兩個電氣元件加以構裝之情形為例來說明，但本發明並不限定於此，亦可以適用於將三個以上的電氣元件加以構裝之情形。For example, in the above-described embodiment, a case where two electrical components such as the IC chip 5 and the flexible printed wiring board 6 are configured is described as an example. However, the present invention is not limited thereto, and may be applied to three or more. The case where the electrical components are constructed.

又，例如，如圖3所示，除了IC晶片5以及軟性印刷配線板6之外，亦可以將例如COG方式之電阻器或電容器等其他的電氣元件10一起進行熱壓接。Further, for example, as shown in FIG. 3, in addition to the IC chip 5 and the flexible printed wiring board 6, other electrical components 10 such as a COG resistor or a capacitor may be thermocompression bonded together.

此情形，與IC晶片5以及軟性印刷配線板6同樣，對其他的電氣元件10亦進行預壓接，再以與上述實施形態同樣的條件將其等一起進行正式壓接。In this case, similarly to the IC chip 5 and the flexible printed wiring board 6, the other electrical components 10 are also pre-compressed, and they are collectively pressure-bonded together under the same conditions as those of the above-described embodiment.

圖4(a)、(b)係表示本發明另一實施形態之局部之說明圖，圖5係表示圖4所示之實施形態之局部之立體圖，以下，與上述實施形態相同的部分附加相同的符號以省略其詳細說明。4(a) and 4(b) are partially explanatory views showing a part of another embodiment of the present invention, and Fig. 5 is a perspective view showing a part of the embodiment shown in Fig. 4, and the same portions as those of the above embodiment are attached with the same The symbols are omitted to omit their detailed description.

如圖4(a)、(b)及圖5所示，本實施形態中，作為異向導電性黏著劑，係使用複數個(本實施例為三個)帶狀異向導電性黏著膜4a、4b、4c，將該等帶狀異向導電性黏著膜4a~4c貼合在玻璃基板1之構裝區域3整面上。As shown in Fig. 4 (a), (b) and Fig. 5, in the present embodiment, a plurality of (three in the present embodiment) strip-shaped anisotropic conductive adhesive films 4a are used as the anisotropic conductive adhesive. 4b and 4c, the strip-shaped anisotropic conductive adhesive films 4a to 4c are bonded to the entire surface of the structural region 3 of the glass substrate 1.

本發明並沒有特別的限定，但由提升將ITO電極加以密封之功能的觀點來考量，較佳為以各異向導電性黏著膜4a~4c儘量接近之方式來將該等排列。The present invention is not particularly limited. However, from the viewpoint of improving the function of sealing the ITO electrode, it is preferable to arrange the anisotropic conductive adhesive films 4a to 4c as close as possible.

又，各異向導電性黏著膜4a、4b、4c並沒有特別限定，但由提升連接可靠性之觀點來考量，較佳為依構裝之電氣元件選擇具有最適合之條件(黏合劑材料、導電粒子的種類、膜的尺寸、厚度等)者。Further, the anisotropic conductive adhesive films 4a, 4b, and 4c are not particularly limited. However, from the viewpoint of improving the connection reliability, it is preferable to select the most suitable conditions for the electrical component selection (adhesive material, The type of conductive particles, the size of the film, the thickness, etc.).

此外，本實施形態中，熱壓接頭7的壓接面9a，為了對應於玻璃基板1之構裝區域3上的異向導電性黏著膜4a~4c整體之尺寸，例如形成較異向導電性黏著膜4a~4c之整體的貼合區域尺寸大一些。Further, in the present embodiment, the pressure contact surface 9a of the thermocompression bonding joint 7 is formed to have an anisotropic conductivity, for example, in accordance with the overall size of the anisotropic conductive adhesive films 4a to 4c on the mounting region 3 of the glass substrate 1. The bonding areas of the entire adhesive films 4a to 4c are larger in size.

本實施形態中，在異向導電性黏著膜4a、4b上排列裝載有複數個IC晶片5及其他電氣元件10，並個別進行預壓接，再者，在異向導電性黏著膜4c之邊緣部裝載軟性印刷配線板6之邊緣部並進行預壓接。In the present embodiment, a plurality of IC wafers 5 and other electrical components 10 are mounted on the anisotropic conductive adhesive films 4a and 4b, and are separately pre-compressed, and further, at the edge of the anisotropic conductive adhesive film 4c. The edge portion of the flexible printed wiring board 6 is loaded and pre-compressed.

接著，與上述實施形態同樣，使用熱壓接頭7將IC晶片5、其他電氣元件10、及軟性印刷配線板6一起進行正式壓接。Next, similarly to the above-described embodiment, the IC wafer 5, the other electric component 10, and the flexible printed wiring board 6 are collectively pressure-bonded together using the thermocompression bonding joint 7.

依據上述本實施形態，可以與上述實施形態同樣大幅提升構裝效率，此外，亦可以依構裝的電氣元件使用具有最適合條件的異向導電性黏著膜4a~4c來進行構裝，故可以進一步提升連接可靠性。其他的結構以及作用效果與上述實施形態相同，故省略其詳細說明。According to the above-described embodiment, the assembly efficiency can be greatly improved as in the above-described embodiment, and the electrically conductive elements 4a to 4c having the most suitable conditions can be used for the electrical components to be mounted. Further improve connection reliability. Other configurations and operational effects are the same as those of the above embodiment, and thus detailed description thereof will be omitted.

又，本實施形態中，以使用複數個帶狀異向導電性黏著膜之情形為例說明，但本發明並不限定於此，亦可以使用正方形、長方形、或其他各種形狀之複數個異向導電性黏著膜。Further, in the present embodiment, a case where a plurality of strip-shaped anisotropic conductive adhesive films are used will be described as an example. However, the present invention is not limited thereto, and a plurality of squares, rectangles, or various other shapes may be used. Conductive adhesive film.

然而，在每一個構裝於配線基板上之電氣元件上分別設置對準標記之情形，較佳為使用本實施形態的帶狀異向導電性黏著膜。However, in the case where an alignment mark is provided on each of the electric components mounted on the wiring board, it is preferable to use the strip-shaped anisotropic conductive adhesive film of the present embodiment.

亦即，藉由使用帶狀異向導電性黏著膜，能以避開各對準標記之方式在配線基板上配置複數個異向導電性黏著膜，故可以進行更高精度的構裝。In other words, by using the strip-shaped anisotropic conductive adhesive film, a plurality of anisotropic conductive adhesive films can be disposed on the wiring substrate so as to avoid the alignment marks, so that a more precise assembly can be performed.

又，上述實施形態中，以使用異向導電性黏著膜來構裝電氣元件之情形為例說明，但亦可以使用糊狀的異向導電性黏著劑，再者，亦可以使用未含有導電粒子的黏著劑。Further, in the above embodiment, the case where the electrical component is configured by using the anisotropic conductive adhesive film will be described as an example. However, a paste-shaped anisotropic conductive adhesive may be used, and further, conductive particles may not be used. Adhesive.

再者，上述實施形態中，熱壓接頭的壓接構件亦不限定於上述實施形態，可以使用各種形態者。Further, in the above embodiment, the pressure-bonding member of the thermocompression bonding joint is not limited to the above embodiment, and various forms can be used.

例如，可以使用對應於構裝之電氣元件而設置有複數個壓接構件者。For example, a plurality of crimp members may be provided corresponding to the electrical components of the package.

又，為了調整對電氣元件之緊壓力，在頭部本體上可設置有框體或突起狀部分、或在壓接構件上設有缺口部。再者，亦能以複數個塊體構成壓接構件以形成間隙，藉此調整緊壓力。Further, in order to adjust the pressing force to the electric component, a frame body or a protruding portion may be provided on the head body, or a notch portion may be provided in the pressure bonding member. Further, it is also possible to form the crimping member in a plurality of blocks to form a gap, thereby adjusting the pressing force.

此外，本發明不僅適用於在液晶顯示裝置用之玻璃基板上構裝電氣元件之情形，亦適用在各種配線基板上構裝電氣元件之情形。Further, the present invention is applicable not only to the case where an electrical component is mounted on a glass substrate for a liquid crystal display device but also to the case where an electrical component is mounted on various wiring substrates.

然而，本發明在液晶顯示裝置用之玻璃基板上構裝電氣元件時，尤其可以削減步驟數量而提升構裝效率。However, in the case where the electric component is mounted on the glass substrate for a liquid crystal display device, the number of steps can be reduced to improve the assembly efficiency.

1．．．玻璃基板(配線基板)1. . . Glass substrate (wiring substrate)

2．．．LCD面板2. . . LCD panel

3．．．構裝區域3. . . Construction area

4．．．異向導電性黏著膜(異向導電性黏著劑)4. . . Anisotropic conductive adhesive film (isotropic conductive adhesive)

4a、4b、4c．．．帶狀異向導電性黏著膜4a, 4b, 4c. . . Banded anisotropic conductive film

5．．．IC晶片(電氣元件)5. . . IC chip (electrical component)

6．．．軟性印刷配線板(電氣元件)6. . . Flexible printed wiring board (electrical components)

7．．．熱壓接頭7. . . Hot press fitting

8．．．頭部本體8. . . Head body

8a．．．凹部8a. . . Concave

9．．．壓接構件9. . . Crimp member

9a．．．壓接面9a. . . Crimp joint

10．．．電氣元件10. . . Electrical components

101．．．玻璃基板101. . . glass substrate

102．．．LCD面板102. . . LCD panel

104．．．異向導電性黏著膜104. . . Anisotropic conductive adhesive film

105．．．IC晶片105. . . IC chip

106．．．軟性印刷配線板106. . . Flexible printed wiring board

圖1(a)~(d)係表示本發明之實施形態之步驟之部分截面說明圖。Fig. 1 (a) to (d) are partial cross-sectional explanatory views showing the steps of the embodiment of the present invention.

圖2係表示本實施形態之局部之立體圖。Fig. 2 is a perspective view showing a part of the embodiment.

圖3係表示本發明另一實施形態之局部之部分截面說明圖。Fig. 3 is a partial cross-sectional explanatory view showing a part of another embodiment of the present invention.

圖4(a)、(b)係表示本發明另一實施形態之局部之部分截面說明圖。4(a) and 4(b) are partial cross-sectional explanatory views showing a part of another embodiment of the present invention.

圖5係表示圖4所示之實施形態之局部之立體圖。Fig. 5 is a perspective view showing a part of the embodiment shown in Fig. 4.

圖6(a)、(b)係表示習知構裝方法之例之立體圖。6(a) and 6(b) are perspective views showing an example of a conventional construction method.

1．．．玻璃基板(配線基板)1. . . Glass substrate (wiring substrate)

2．．．LCD面板2. . . LCD panel

4．．．異向導電性黏著膜(異向導電性黏著劑)4. . . Anisotropic conductive adhesive film (isotropic conductive adhesive)

5．．．IC晶片(電氣元件)5. . . IC chip (electrical component)

6．．．軟性印刷配線板(電氣元件)6. . . Flexible printed wiring board (electrical components)

7．．．熱壓接頭7. . . Hot press fitting

8．．．頭部本體8. . . Head body

8a．．．凹部8a. . . Concave

9．．．壓接構件9. . . Crimp member

9a．．．壓接面9a. . . Crimp joint

Claims (4)

一種構裝方法，係使用熱壓接頭(在頭部本體具有既定彈性體所構成之壓接構件)將電氣元件構裝在配線基板上，其特徵在於：該配線基板為具有ITO電極之液晶顯示裝置用之玻璃基板，且該配線基板之構裝區域包含供配置COG方式之電氣元件與FOG方式之電氣元件之區域；具有：在該配線基板之構裝區域整面配置單一熱硬化性之黏著劑後，將該COG方式之電氣元件與FOG方式之電氣元件配置在該黏著劑上之步驟；以及使用具有對應於該黏著劑之尺寸之壓接構件之熱壓接頭將該電氣元件一起進行熱壓接之步驟；在該熱壓接步驟兼具密封步驟，該密封步驟，藉由使用該熱壓接頭將整面配置在該構裝區域之該黏著劑之黏合劑樹脂熱壓接並使其熱硬化，將該ITO電極加以密封。 A mounting method is to mount an electrical component on a wiring substrate by using a thermocompression bonding joint (a crimping member having a predetermined elastic body in a head body), wherein the wiring substrate is a liquid crystal display having an ITO electrode. a glass substrate for a device, wherein the mounting region of the wiring substrate includes a region in which an electrical component of the COG method and an electrical component of the FOG method are disposed; and a single thermosetting adhesive is disposed on the entire surface of the wiring substrate a step of disposing the COG-type electrical component and the FOG-type electrical component on the adhesive; and heat-treating the electrical component together using a thermocompression bonding member having a crimping member corresponding to the size of the adhesive a step of crimping; in the thermocompression bonding step, a sealing step of thermocompression bonding and heat-bonding the adhesive resin of the adhesive disposed on the entire surface by using the thermocompression bonding joint Hardened, the ITO electrode was sealed. 如申請專利範圍第1項之構裝方法，其中，該黏著劑，係使用異向導電性黏著劑。 The method of claim 1, wherein the adhesive is an anisotropic conductive adhesive. 如申請專利範圍第1項之構裝方法，其中，在該配線基板上之構裝區域整面配置複數個黏著劑以進行構裝。 The method of assembling the first aspect of the invention, wherein a plurality of adhesives are disposed on the entire surface of the mounting region of the wiring substrate for mounting. 如申請專利範圍第3項之構裝方法，其中，該黏著劑，係使用帶狀黏著劑。 The method of claim 3, wherein the adhesive is a tape adhesive.
TW095127416A 2006-02-01 2006-07-27 Mounting method for electric components TWI420995B (en)

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