TW546360B - Thermosetting adhesives and adhesive sheets thereof - Google Patents

Thermosetting adhesives and adhesive sheets thereof Download PDF

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Publication number
TW546360B
TW546360B TW89108366A TW89108366A TW546360B TW 546360 B TW546360 B TW 546360B TW 89108366 A TW89108366 A TW 89108366A TW 89108366 A TW89108366 A TW 89108366A TW 546360 B TW546360 B TW 546360B
Authority
TW
Taiwan
Prior art keywords
parts
group
weight
resin
epoxy resin
Prior art date
Application number
TW89108366A
Other languages
English (en)
Chinese (zh)
Inventor
Kazuto Hosokawa
Yoichiro Goto
Masahiro Oura
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of TW546360B publication Critical patent/TW546360B/zh

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  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW89108366A 1999-05-14 2000-05-03 Thermosetting adhesives and adhesive sheets thereof TW546360B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13445699A JP4321911B2 (ja) 1999-05-14 1999-05-14 熱硬化型接着剤とその接着シ―ト類

Publications (1)

Publication Number Publication Date
TW546360B true TW546360B (en) 2003-08-11

Family

ID=15128773

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89108366A TW546360B (en) 1999-05-14 2000-05-03 Thermosetting adhesives and adhesive sheets thereof

Country Status (2)

Country Link
JP (1) JP4321911B2 (ja)
TW (1) TW546360B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5414256B2 (ja) * 2008-12-05 2014-02-12 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法

Also Published As

Publication number Publication date
JP4321911B2 (ja) 2009-08-26
JP2000319612A (ja) 2000-11-21

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MM4A Annulment or lapse of patent due to non-payment of fees