TW538143B - Electrochemical treatment device and method for goods - Google Patents
Electrochemical treatment device and method for goods Download PDFInfo
- Publication number
- TW538143B TW538143B TW90133191A TW90133191A TW538143B TW 538143 B TW538143 B TW 538143B TW 90133191 A TW90133191 A TW 90133191A TW 90133191 A TW90133191 A TW 90133191A TW 538143 B TW538143 B TW 538143B
- Authority
- TW
- Taiwan
- Prior art keywords
- contact
- goods
- cargo
- electrolyte
- patent application
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/005—Apparatus specially adapted for electrolytic conversion coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2000143817 DE10043817C2 (de) | 2000-09-06 | 2000-09-06 | Anordnung und Verfahren für elektrochemisch zu behandelndes Gut |
Publications (1)
Publication Number | Publication Date |
---|---|
TW538143B true TW538143B (en) | 2003-06-21 |
Family
ID=7655125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW90133191A TW538143B (en) | 2000-09-06 | 2001-12-31 | Electrochemical treatment device and method for goods |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10043817C2 (de) |
TW (1) | TW538143B (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10065643C2 (de) * | 2000-12-29 | 2003-03-20 | Egon Huebel | Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut |
WO2003060201A1 (de) * | 2001-12-28 | 2003-07-24 | Huebel Egon | Anordnung und verfahren für elektrochemisch zu behandelndes gut |
DE10202431C1 (de) * | 2002-01-22 | 2003-05-28 | Egon Huebel | Vorrichtung und Verfahren zum elektrochemischen Behandeln von Gut mit Pulsstrom |
DE10207941A1 (de) * | 2002-02-17 | 2003-09-04 | Egon Huebel | Verfahren und Vorrichtung zur elektrischen Kontaktierung von flachem Gut in elektrolytischen Anlagen |
DE10241619B4 (de) * | 2002-09-04 | 2004-07-22 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum elektrolytischen Behandeln von zumindest oberflächlich elektrisch leitfähigem Behandlungsgut |
DE102004041812A1 (de) * | 2004-08-26 | 2006-03-09 | Siemens Ag | Reaktor zum Erzeugen von Oberflächenreaktionen und dessen Verwendung |
TW200829726A (en) * | 2006-11-28 | 2008-07-16 | Basf Ag | Method and device for electrolytic coating |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63297588A (ja) * | 1987-05-29 | 1988-12-05 | Sagami Shokai:Kk | 孤立した導電体の電解メッキ法 |
US5114558A (en) * | 1989-02-15 | 1992-05-19 | Kadija Igor V | Method and apparatus for manufacturing interconnects with fine lines and spacing |
DE4337988A1 (de) * | 1993-11-06 | 1995-05-11 | Hoellmueller Maschbau H | Verfahren zur Herstellung von Multilayern sowie Vorrichtung zur Durchführung dieses Verfahrens |
DE19612555C2 (de) * | 1996-03-29 | 1998-03-19 | Atotech Deutschland Gmbh | Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens |
-
2000
- 2000-09-06 DE DE2000143817 patent/DE10043817C2/de not_active Expired - Fee Related
-
2001
- 2001-12-31 TW TW90133191A patent/TW538143B/zh active
Also Published As
Publication number | Publication date |
---|---|
DE10043817C2 (de) | 2002-07-18 |
DE10043817A1 (de) | 2002-04-04 |
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