TW538143B - Electrochemical treatment device and method for goods - Google Patents

Electrochemical treatment device and method for goods Download PDF

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Publication number
TW538143B
TW538143B TW90133191A TW90133191A TW538143B TW 538143 B TW538143 B TW 538143B TW 90133191 A TW90133191 A TW 90133191A TW 90133191 A TW90133191 A TW 90133191A TW 538143 B TW538143 B TW 538143B
Authority
TW
Taiwan
Prior art keywords
contact
goods
cargo
electrolyte
patent application
Prior art date
Application number
TW90133191A
Other languages
English (en)
Chinese (zh)
Inventor
Egon Huebel
Original Assignee
Egon Huebel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Egon Huebel filed Critical Egon Huebel
Application granted granted Critical
Publication of TW538143B publication Critical patent/TW538143B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
TW90133191A 2000-09-06 2001-12-31 Electrochemical treatment device and method for goods TW538143B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2000143817 DE10043817C2 (de) 2000-09-06 2000-09-06 Anordnung und Verfahren für elektrochemisch zu behandelndes Gut

Publications (1)

Publication Number Publication Date
TW538143B true TW538143B (en) 2003-06-21

Family

ID=7655125

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90133191A TW538143B (en) 2000-09-06 2001-12-31 Electrochemical treatment device and method for goods

Country Status (2)

Country Link
DE (1) DE10043817C2 (de)
TW (1) TW538143B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10065643C2 (de) * 2000-12-29 2003-03-20 Egon Huebel Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut
WO2003060201A1 (de) * 2001-12-28 2003-07-24 Huebel Egon Anordnung und verfahren für elektrochemisch zu behandelndes gut
DE10202431C1 (de) * 2002-01-22 2003-05-28 Egon Huebel Vorrichtung und Verfahren zum elektrochemischen Behandeln von Gut mit Pulsstrom
DE10207941A1 (de) * 2002-02-17 2003-09-04 Egon Huebel Verfahren und Vorrichtung zur elektrischen Kontaktierung von flachem Gut in elektrolytischen Anlagen
DE10241619B4 (de) * 2002-09-04 2004-07-22 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von zumindest oberflächlich elektrisch leitfähigem Behandlungsgut
DE102004041812A1 (de) * 2004-08-26 2006-03-09 Siemens Ag Reaktor zum Erzeugen von Oberflächenreaktionen und dessen Verwendung
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63297588A (ja) * 1987-05-29 1988-12-05 Sagami Shokai:Kk 孤立した導電体の電解メッキ法
US5114558A (en) * 1989-02-15 1992-05-19 Kadija Igor V Method and apparatus for manufacturing interconnects with fine lines and spacing
DE4337988A1 (de) * 1993-11-06 1995-05-11 Hoellmueller Maschbau H Verfahren zur Herstellung von Multilayern sowie Vorrichtung zur Durchführung dieses Verfahrens
DE19612555C2 (de) * 1996-03-29 1998-03-19 Atotech Deutschland Gmbh Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens

Also Published As

Publication number Publication date
DE10043817C2 (de) 2002-07-18
DE10043817A1 (de) 2002-04-04

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