TW531631B - Adhesive removing furnace for electronic parts - Google Patents

Abstract

This invention provides an adhesive removing furnace for an electronic part such as a ceramic chip condenser, capable of shortening adhesive removing processing time, without producing crack in the electronic part such as a ceramic chip condenser. In this adhesive removing furnace, a setter 1 mounting the ceramic chip condenser 3 is arranged in a plane, and the ceramic condenser 3 is continuously transported while being heated, thereby eliminating adhesive component contained in the ceramic chip condenser 3. A far-infrared heater 5 is placed on a ceiling portion in the furnace as a heating source.

Description

531631 五、發明說明（1) 發明領域 — _ 本發明關於一種脫黏合劑爐，係用於把含在陶曼片狀 電容器等電子零件中的黏合劑成分除去。 發明背景 器（下面簡稱為，電容 之前、進行脫黏合劑 分除去。以前這種脫 將電氣加熱器或燃氣 引外面氣體並加熱到 劑爐内，爐中收容著 在***上的電容器 或氣化，然後將這液 表面除去。 容器除去的黏合劑成 接排出爐外（稱為單 ’大部分都使用使熱 風中的黏合劑含有量 超過某一定量而吸引 風排出。 處理溫度越高，就越 提高。但是，有些電 在電子零件内、在陶瓷片狀電容 器’）的製造過程中，必需在燒成工序 的工序，將含在電容器中的黏合劑成 黏合劑工序是這樣進行的，即、借助 燃燒爐作為加熱源的熱風發生器、吸 規定的溫度’而且將其導入到脫黏合 作為處理物件的電容器。 被吸引到爐内的熱風將並排地放 加熱，使含在其中的黏合劑成分液化 化或氣化了的黏合劑成分從電容器的 也有這種場合，即、把含有從電 分的熱風，在與電容器接觸之後，直 流式）。從降低能量損失的觀點出發 風在爐内迴圈的那種工藝。 在使熱風迴圈的場合下，由於熱 逐漸地增高，因而使黏合劑含有量不 少量的外面氣體，並把與其相當的熱 一般’電容器的脫黏合劑處理是 能縮短處理的時間，就能使生產效率531631 V. Description of the invention (1) Field of the invention — The present invention relates to a de-binder furnace, which is used to remove the binder component contained in electronic parts such as Taumann chip capacitors. Background of the invention (hereinafter referred to as, before the capacitor, the de-binder is separated and removed. In the past, this type of electric heater or gas introduced the outside gas and heated it into the agent furnace, which contained a capacitor on the positioner or Gasification, and then the surface of this liquid is removed. The adhesive removed from the container is discharged out of the furnace (called "Single '. Most of them are used to make the content of the adhesive in the hot air exceed a certain amount and attract the wind to discharge. The higher the processing temperature , The higher it is. However, in the manufacturing process of some electric components in electronic parts and ceramic chip capacitors'), it is necessary to perform the firing process. The process of forming the binder contained in the capacitor into an adhesive is performed in this way. That is, the hot air generator that uses the combustion furnace as a heating source, sucks a predetermined temperature, and introduces it into a capacitor that is debonded and treated as a processing object. The hot air drawn into the furnace is heated side by side, so that the There are also occasions when the adhesive component is liquefied or vaporized from the capacitor, that is, the hot air containing electricity from After contact, direct flow). From the viewpoint of reducing energy loss, a process in which the wind loops in the furnace. In the case where the hot air is looped, the heat gradually increases, so that the adhesive contains a small amount of outside gas, and the equivalent heat treatment of the capacitor's de-adhesive agent can shorten the processing time. Make production efficient

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為在向溫時、會使管内的電極氧化，在將這些電容器 高，脫黏合劑處理的場合下，為了防止氧化、就必需 内氛圍氣體處理成低氧濃度 /通令，低氧濃度的氛圍氣體是借助把氮氣導入到爐内 ^形^。但是’現有的狀態是用熱風發生裝置吸引外面的 氣=產生熱風、並將其導入爐内的那種以前的脫黏 口 d爐L足種脫黏合劑爐不能保持低氧濃度的氛圍氣體。 而且’還有這樣的問題，即、在爐内必需設置使熱風迴圈 的風扇，其在高溫下不能充分地耐用。 、姓為瞭f決這樣的問題，已形成不使外面氣體侵入爐體 的結構，還開發出一種把作為加熱源的電氣加熱器直接設 ΐ，爐内的電容器用脫黏合劑爐，但是在低氧濃度的氛圍 乳$中’由加熱作用而從電容器放出的含于氣化的黏合劑 =二（黏合劑氣體）·中的C (碳）不會變成C I，它就以碳的單 體形式析出在爐内，一旦其附著在加熱器表面上，就會引 起加熱線的短路或對地絕緣的降低。 曰In order to oxidize the electrodes in the tube at high temperature, when these capacitors are treated with high temperature and de-binder, in order to prevent oxidation, the internal atmosphere must be processed into a low oxygen concentration / passive, low oxygen concentration atmosphere. This is done by introducing nitrogen into the furnace ^. However, in the existing state, a hot air generator is used to attract outside air = the former debonding port that generates hot air and introduces it into the furnace. The d furnace L full-type debonding furnace cannot maintain a low oxygen concentration atmosphere. Furthermore, there is a problem that a fan for circulating hot air must be installed in the furnace, and the fan cannot be sufficiently durable at high temperatures. In order to solve such a problem, the family name has formed a structure that does not allow outside gas to invade the furnace body, and has also developed an electric heater as a heating source, and a de-binder furnace for capacitors in the furnace. Atmospheric milk with low oxygen concentration “medium” C (carbon) contained in the gasified adhesive = two (adhesive gas) · released from the capacitor by heating will not become CI, it is a monomer of carbon The form precipitates in the furnace, and once it is attached to the surface of the heater, it will cause a short circuit of the heating wire or a reduction in the insulation to the ground. Say

、因此’要將加熱線與爐内氛圍氣體隔絕，在不銹鋼製 成的馬弗爐裏將包覆了的加熱器用作加熱源，這樣，即使 在高溫下、在低氧濃度的氛圍氣體中，也能不會引起加熱 線的短路等問題地進行脫黏合劑處理，但是在這種場人 下’有脫黏合劑處理的時間較長、難達到高生產率的問 題。為了縮短處理時間，在將溫度形成更高的處理溫度的 場合下，由於脫黏合劑處理激烈地進行，在電容器内就發 生熱應力，就容易由此而產生龜裂。 XTherefore, 'the heating wire should be isolated from the atmosphere in the furnace, and the covered heater is used as the heating source in a muffle furnace made of stainless steel. In this way, even at high temperatures and in low oxygen concentrations, Debinding treatment can also be performed without causing problems such as short circuit of the heating wire. However, in such a field, there is a problem that the debinding processing takes a long time and it is difficult to achieve high productivity. In order to shorten the processing time, when the temperature is set to a higher processing temperature, since the debinding treatment is performed violently, thermal stress occurs in the capacitor, and cracks are likely to occur. X

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五、發明說明（3) 發明概要 〜 本發明是為解決上述現有技術存在的問題而做出的， 其目的是提供一種陶瓷片狀電容器等電子零件用的脫勘合 劑爐，它不會使陶瓷片狀電容器等電子零件上發生龜裂: 而且能使脫黏合劑處理的時間比以前縮短。 根據本發明的電子零件用的脫黏合劑爐，它是將放置 著電子零件的***配設成平面狀的，一邊連續地輸送、 —邊進行加熱，由此將含在上述電子零件中的黏合劑成分 除去’其特徵在於：在爐内頂棚部上設置著作為加熱源的 遠紅外線加熱器。 發明詳細說明 如上所述，本發明的脫黏合劑爐的主要特徵是把作為 加熱源的遠紅外線加熱器設置在爐内頂棚部。這裏，所謂 返紅外線’’是指波長為3〜1 〇 〇 0 // m的電磁波。而所謂π遠 紅外線加熱器”是指那種表示最大放射率的波長區域在上 述區域裏的加熱器。這種加熱器是把金屬加熱器埋設在陶 曼内而製成，用金屬加熱器加熱上述陶瓷，由它的放射特 性進行遠紅外線放射。由於如以前的脫黏合劑爐那樣地、 在用熱風或通常的加熱器進行對流加熱的場合下，電容器 等電子零件的表面先乾燥，内部的黏合劑成分難向表面部 移動，容易形成所謂的"心子（了y工)π狀態，因而脫黏 合劑處理就會花費較長的時間，而且容易由内部的熱應力V. Description of the invention (3) Summary of the invention ~ The present invention is made to solve the problems existing in the above-mentioned prior art, and its purpose is to provide a descaling furnace for electronic parts such as ceramic chip capacitors, which does not make ceramics Cracks occur in electronic parts such as chip capacitors: Moreover, the time required for debinding treatment can be shortened compared to before. According to the debonding furnace for electronic parts of the present invention, the positioner on which the electronic parts are placed is arranged in a flat shape, and while being continuously conveyed and heated, the electronic parts contained in the electronic parts are contained. The binder component removal method is characterized in that a far-infrared heater that is a heating source is provided on the ceiling portion of the furnace. Detailed description of the invention As described above, the main characteristic of the de-binder furnace of the present invention is that a far-infrared heater as a heating source is provided in the ceiling portion of the furnace. Here, the "back infrared" is an electromagnetic wave having a wavelength of 3 to 100 m // m. The so-called π far-infrared heater "refers to a heater in which the wavelength region showing the maximum emissivity is in the above-mentioned region. This heater is made by burying a metal heater in Taunman and heating it with a metal heater The above-mentioned ceramics emit far-infrared rays due to their radiation characteristics. As in the case of conventional de-binder furnaces, when hot air or ordinary heaters are used for convection heating, the surfaces of electronic components such as capacitors are first dried, and the internal It is difficult for the adhesive component to move to the surface, and it is easy to form a so-called "heart" state. Therefore, it takes a long time to remove the adhesive, and it is easy to be subjected to internal thermal stress.

第6頁 531631 五、發明說明（4) 而發生龜裂 與此相 為加熱源、 遠紅外線浸 深度為幾十 心子π狀態 理，而且能 圖1是； 圖。在這個 黏合劑處理 成平面狀， 用作爐 在爐内頂棚 是將金屬加 直接附著在 不會由於碳 最好在 上述加熱器! 這個腔室裏 通過鄰接的 勻地供到爐 電壓導入部 最好把 機構。把多 對，如本發明那樣地、在把遠紅外線加熱器作 從電子零件上面進行輕射加熱的場合下，由於 透到電容器等電子零件的内部（從表面開始的 μ m )，從浸透點進行傳導加熱，因而難形成” ，用較短的時間就能高效率地進行脫黏合劑處 防止龜裂的發生。 良示本發明的脫黏合劑爐的一個實施方式概略 脫黏合劑爐中、***1上放置著多個構成脫 物件的電容器3，把這樣狀態下的***1排列 將其在爐内連續地輸送。 子加熱源的多個遠紅外線加熱器5接近地設置 部亡。如上所述、由於這個遠紅外線加熱源5 熱器埋設在陶瓷内的，因而爐内析出在碳很難 加熱，上，即使在低濃度氧的氛圍氣體中，也 的附著而引起短路等故障。 遠紅外線加熱器5的上方設置腔室9，用於收容 〕的端子部7。將調製成規定組成的氣體導入到 而且借助設置在腔室下部的氣體供給孔1 1、 加熱器5之間的間隙、就能將上述氛圍氣體均 内，這樣就能防止碳等黏合劑成分附著在作為 的加熱器5的端子部7上，能避免電氣的故障。 滾筒1 3用作在爐内連續輸送***1用的輸送 個用作爐内輸送機構的滾筒1 3平行地配置成使 531631 五、發明說明（5) 其軸向與製品的輸送方向垂直，使滾筒1 3上的***1執 爐子的出口方向依次地移動。這樣，當把滾筒用作輸送機 構時、爐内就難發生粉塵，能有效地防止由粉塵形成的製 品污染。 下面，基於實施例而對本發明進行詳細地說明。本發 明並不侷限於這實施例。 Φ 分別使用將通常的金屬加熱器作為加熱源的脫黏合劑 爐、和將金屬加熱器埋設在陶瓷内的遠紅外線加熱器作為 加熱源的脫黏合劑爐，在相同的條件下、進行電容器的脫 黏合劑處理。處—理條件如下表所示。 (表1) 電容器的尺寸 1.5 Xl. 5 Xl. Omm 電容器的重量 0. 15kg 每1個***放置電容的個數2 6 0 0個 ***重量 0.75kg 爐内的***配置 寬度方向4列X長度方向1 2列 爐内氛圍氣體 N2 9 3 %、H2 7% 處理時間 3小時Page 6 531631 V. Description of the invention (4) A crack occurs. This phase is a heating source, and the far-infrared immersion depth is several tens of states. It can also be shown in Figure 1; The adhesive is processed into a flat shape and used as a furnace ceiling in the furnace. Metal is directly attached to the heater because of carbon. It is best to be in the above heater! This chamber is supplied to the furnace voltage introduction part by adjoining uniformly. Well put institutions. When a plurality of pairs are used, as in the present invention, when a far-infrared heater is used to lightly heat the electronic component, it penetrates into the interior of the electronic component such as a capacitor (μm from the surface), from the penetration point. Conductive heating makes it difficult to form ", and the debinding agent can be efficiently removed in a relatively short time to prevent cracks. The embodiment of the debinding agent furnace of the present invention is a schematic view of a debinding agent furnace. On the positioner 1, a plurality of capacitors 3 constituting a disconnected object are placed, and the positioner 1 in this state is arranged and continuously transported in the furnace. A plurality of far-infrared heaters 5 of the sub heating source are disposed close to each other. As described above, the far-infrared heating source 5 heater is buried in the ceramic, so the carbon precipitated in the furnace is difficult to heat, and even in a low-concentration oxygen atmosphere, it adheres to cause short circuits and other problems. A chamber 9 is provided above the far-infrared heater 5 for receiving] a terminal portion 7. A gas prepared into a predetermined composition is introduced into and supplied by a gas provided in a lower portion of the chamber. 1 1. The gap between the heaters 5 can all contain the above atmosphere, so that adhesive components such as carbon can be prevented from adhering to the terminal portion 7 of the heater 5 and electrical failure can be avoided. Drum 1 3 It is used as a conveyer for continuous conveying of the positioner 1 in the furnace. A roller 1 is used as the conveying mechanism in the furnace. The positioner 1 on the top 1 moves the exit direction of the furnace one by one. In this way, when the drum is used as the conveying mechanism, dust is hard to occur in the furnace, which can effectively prevent product pollution caused by the dust. The following is based on the embodiment The present invention will be described in detail. The present invention is not limited to this embodiment. Φ A de-binder furnace using a general metal heater as a heating source, and a far-infrared heater in which the metal heater is embedded in a ceramic are used, respectively. As the heating source of the de-binder furnace, under the same conditions, the capacitor is de-binder treated. The processing conditions are shown in the following table. (Table 1) The size of the capacitor 1.5 Xl. 5 Xl. O mm Capacitor weight 0.15kg Number of capacitors placed per positioner 2 6 0 0 Positioner weight 0.75kg Positioner configuration in the furnace 4 columns in the width direction X length direction 1 2 atmospheres in the furnace N2 9 3 %, H2 7% Processing time 3 hours

處理溫度 5 0 0 °C 這個脫黏合劑處理的結果是：在把通常的金屬加熱器 作為加熱源的脫黏合劑爐内，在電容器的一部分上發生龜Processing temperature 5 0 0 ° C The result of this de-adhesive treatment is that in a de-adhesive furnace using a normal metal heater as a heating source, turtles occur on a part of the capacitor.

531631 五、發明說明（6) 裂，而且在處理後的電容器殘留碳量中也看到離散的情二. 況。與此相對、在本發明的把遠紅外線加熱器作為加熱源 的脫黏合劑爐内，在電容器上不發生龜裂，而且在處理後 的電容器殘留碳量中幾乎看不到離散的情況。 雖然上面例舉了將陶瓷片狀電容器作為電子零件這一 個實施例而進行說明，但是這點很清楚，即、本發明並不 侷限於這個實施例，它還能適用於其他電子零件、鐵氧體 等。 如上所述，如果採用本發明的脫黏合劑爐，與使用以 前的脫黏合劑爐的場合相比、則能提高脫黏合劑的效率、 在電容器等電子零件上不會發生龜裂、能縮短脫黏合劑的 處理時間。531631 V. Description of the invention (6) It is also cracked, and discrete cases are also seen in the residual carbon content of the capacitor after processing. On the other hand, in the de-binder furnace using the far-infrared heater as a heating source of the present invention, cracks do not occur in the capacitor, and there is almost no dispersion in the amount of carbon remaining in the capacitor after the treatment. Although the above description has been made by taking an example in which a ceramic chip capacitor is used as an electronic part, it is clear that the present invention is not limited to this embodiment, and it can also be applied to other electronic parts and ferrites.体 等。 Body and so on. As described above, if the de-binder furnace of the present invention is used, the efficiency of the de-binder can be improved compared with the case where a conventional de-binder furnace is used, and cracks do not occur in electronic parts such as capacitors, which can shorten Debinder processing time.

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Claims (1)

531631 六、申請專利範圍 ，其係將放置著電子零件 連續地輸送、一邊進行加 黏合劑成分除去，其特徵 為力C7熱源的返紅外線加熱 電孑零件用脫黏合劑爐， 器的上方設置著收容加熱 氣體組成的氛圍氣體導入 下部的氣體供給孔、通過 將該氛圍氣體均勻地供到 1 ·—種電子零件用脫黏合劑爐 的***配設成平面狀的，—邊 熱’由此將含在該電子零件中的 在於··在爐内頂棚部上設置著作 器。 2 ·如申請專利範圍第1項所述的 其特徵在於：在該遠紅外線加熱 器端子部的腔室，將調製成規定 到該腔室裏，借助設置在該腔室 鄰接的加熱器之間的間隙、就能 爐内。 3 ·如申請專利範圍第1項或第2項所述+的電子零件用脫黏 合劑爐，其特徵在於：將滾筒用作速鏔地輸送***的輸 送機構。 4 .如申請專利範圍第1項或第2項所述的電子零件用脫黏 合劑爐，其特徵在於：，玄電子零件是狀電容器。 5 ·如申請專利範圍第3項所述的電孑|哭脫黏合劑爐， 其特徵在於：該電子零件是陶瓷片狀· °°531631 6. The scope of patent application is to continuously transport the electronic parts while removing the adhesive components. It is characterized by a de-binder furnace for electric infrared parts heated by the C7 heat source. The atmosphere gas containing the heated gas is introduced into the lower gas supply hole, and the atmosphere gas is uniformly supplied to a positioner of a de-binder furnace for electronic parts. What is included in the electronic component is that a writing instrument is provided on the ceiling portion of the furnace. 2 · The method according to item 1 of the scope of patent application, characterized in that the cavity in the terminal part of the far-infrared heater is prepared into the cavity, and is arranged between heaters adjacent to the cavity. Can be inside the furnace. 3. The debonding furnace for electronic parts as described in item 1 or 2 of the scope of patent application, characterized in that the roller is used as the conveying mechanism of the speedy positioner. 4. The debinder furnace for electronic parts according to item 1 or 2 of the scope of patent application, characterized in that the mysterious electronic parts are capacitors. 5 · The electric furnace as described in item 3 of the scope of application for a patent | cry-off adhesive furnace, characterized in that the electronic part is a ceramic sheet · °