TW513751B - Electro-chemical deposition system - Google Patents

Electro-chemical deposition system Download PDF

Info

Publication number: TW513751B
Authority: TW; Taiwan
Prior art keywords: electrolyte; patent application; scope; item; wafer
Prior art date: 1998-11-30

Application number

TW88120799A

Other languages

English (en)

Chinese (zh)

Inventor

Yezdi Dordi

Donald J Olgado

Ratson Morad

Peter Hey

Mark Denome

Original Assignee

Applied Materials Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-11-30

Filing date

2000-02-25

Publication date

2002-12-11

1999-03-05 Priority claimed from US09/263,649 external-priority patent/US6254760B1/en

1999-04-08 Priority claimed from US09/289,074 external-priority patent/US6258220B1/en

1999-07-09 Priority claimed from US09/350,210 external-priority patent/US6267853B1/en

2000-02-25 Application filed by Applied Materials Inc filed Critical Applied Materials Inc

2002-12-11 Application granted granted Critical

2002-12-11 Publication of TW513751B publication Critical patent/TW513751B/zh

Links

238000004070 electrodeposition Methods 0.000 title claims abstract description 32
239000003792 electrolyte Substances 0.000 claims abstract description 230
238000012545 processing Methods 0.000 claims abstract description 127
239000000126 substance Substances 0.000 claims abstract description 90
238000000034 method Methods 0.000 claims abstract description 77
238000012546 transfer Methods 0.000 claims abstract description 57
230000008569 process Effects 0.000 claims abstract description 55
238000011068 loading method Methods 0.000 claims abstract description 48
238000000151 deposition Methods 0.000 claims abstract description 43
230000008021 deposition Effects 0.000 claims abstract description 39
239000011324 bead Substances 0.000 claims abstract description 17
230000008439 repair process Effects 0.000 claims abstract description 8
235000012431 wafers Nutrition 0.000 claims description 275
239000000758 substrate Substances 0.000 claims description 228
239000007788 liquid Substances 0.000 claims description 143
238000011049 filling Methods 0.000 claims description 68
239000012528 membrane Substances 0.000 claims description 49
238000004151 rapid thermal annealing Methods 0.000 claims description 43
238000011282 treatment Methods 0.000 claims description 39
239000000463 material Substances 0.000 claims description 34
230000005540 biological transmission Effects 0.000 claims description 32
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239000002184 metal Substances 0.000 claims description 32
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239000012530 fluid Substances 0.000 claims description 22
238000004458 analytical method Methods 0.000 claims description 17
238000001035 drying Methods 0.000 claims description 15
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TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
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WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 2
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235000019260 propionic acid Nutrition 0.000 description 1
239000011241 protective layer Substances 0.000 description 1
IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
229910052704 radon Inorganic materials 0.000 description 1
SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 1
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Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Life Sciences & Earth Sciences (AREA)
Sustainable Development (AREA)
Electroplating Methods And Accessories (AREA)
Weting (AREA)
Electrodes Of Semiconductors (AREA)

TW88120799A 1998-11-30 2000-02-25 Electro-chemical deposition system TW513751B (en)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
US11020998P	1998-11-30	1998-11-30
US09/263,649 US6254760B1 (en)	1999-03-05	1999-03-05	Electro-chemical deposition system and method
US09/289,074 US6258220B1 (en)	1998-11-30	1999-04-08	Electro-chemical deposition system
US09/350,210 US6267853B1 (en)	1999-07-09	1999-07-09	Electro-chemical deposition system

Publications (1)

Publication Number	Publication Date
TW513751B true TW513751B (en)	2002-12-11

Family

ID=27493736

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW88120799A TW513751B (en)	1998-11-30	2000-02-25	Electro-chemical deposition system

Country Status (3)

Country	Link
JP (2)	JP4766579B2 (ja)
TW (1)	TW513751B (ja)
WO (1)	WO2000032835A2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI483333B (zh) *	2010-09-13	2015-05-01	Tokyo Electron Ltd	液體處理裝置、液體處理方法及記憶媒體
TWI681078B (zh) *	2017-06-30	2020-01-01	日商昭和電工股份有限公司	氟電解槽陽極安裝部、氟電解槽，及氟氣之製造方法

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* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0901153B1 (en)	1997-09-02	2009-07-15	Ebara Corporation	Method and apparatus for plating a substrate
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WO2000032835A2 (en)	2000-06-08
JP4766579B2 (ja)	2011-09-07
JP2003528214A (ja)	2003-09-24
WO2000032835A8 (en)	2000-08-17
JP2009293134A (ja)	2009-12-17

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