WO2016127579A1 - Heat radiation shielding device and terminal - Google Patents

Heat radiation shielding device and terminal Download PDF

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Publication number
WO2016127579A1
WO2016127579A1 PCT/CN2015/084520 CN2015084520W WO2016127579A1 WO 2016127579 A1 WO2016127579 A1 WO 2016127579A1 CN 2015084520 W CN2015084520 W CN 2015084520W WO 2016127579 A1 WO2016127579 A1 WO 2016127579A1
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Prior art keywords
heat
shielding device
heat dissipation
base
terminal
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PCT/CN2015/084520
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French (fr)
Chinese (zh)
Inventor
任新颖
年蕴豪
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中兴通讯股份有限公司
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Publication of WO2016127579A1 publication Critical patent/WO2016127579A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the utility model relates to a heat shielding device for a terminal such as a mobile phone, a tablet computer or the like, belonging to the hardware field of the terminal. It is a heat sink in the terminal.
  • the utility model also relates to a terminal comprising the heat dissipation shielding device.
  • Air-cooling method The heat of a chip (for example, a CPU) is guided to a heat dissipation plate by a patch, and a fan is used to blow air, thereby enhancing air flow on the surface of the heat dissipation plate. Through this air flow, heat is taken away and the temperature is lowered. However, there is not enough space in the mobile communication terminal to accommodate the fan.
  • a chip for example, a CPU
  • Water cooling method Because water has a large specific heat capacity, it is suitable for absorbing heat. The tube is attached to a patch and the patch is placed over a heat source, and then a pressure pump is used to allow the water to flow and remove the heat from the heat source. However, like air cooling, the pressure pump does not have enough installation space in the mobile terminal.
  • Liquid cooling method This principle is similar to the water cooling method, except that the water is replaced by a thermal silicone oil. It is not afraid of leaking "water.” However, again, the necessary pressure pump does not have sufficient installation space in the mobile terminal.
  • Graphite heat dissipation method suitable for heat dissipation of mobile communication terminals. Since the graphite material itself is malleable, it can be placed into a mobile phone by making it into a layered patch. And because the structural characteristics of graphite molecules have bidirectional uniform thermal conductivity, most smart phones now have built-in graphite heat sinks.
  • Frequency reduction heat dissipation method In view of the CPU heat generation principle, a large amount of work of processing data will make the CPU become a very high temperature heat source, and down frequency can ensure that the CPU works normally. At present, the processor equipped with the smart phone can automatically convert the frequency, which is why the mobile phone will be hot and usually not used when running a large program. However, the current mobile phone system is temporarily unable to artificially control the frequency.
  • the semiconductor refrigeration film is also called a thermoelectric refrigeration sheet and is a heat pump. It has the advantage of no sliding parts and is used in applications where space is limited, reliability is high, and there is no refrigerant contamination.
  • the Peltier effect of the semiconductor material when the direct current is passed through a galvanic couple of two different semiconductor materials in series, heat can be absorbed and heat can be released at both ends of the galvanic couple, and the purpose of cooling can be achieved. It is a refrigeration technology that produces negative thermal resistance, which is characterized by no moving parts and high reliability.
  • working on a semiconductor refrigerating sheet requires a large amount of electric energy and a high voltage, which cannot be carried by the mobile terminal of the mobile phone.
  • An object of the present invention is to solve the above problems in the prior art.
  • Embodiments of the present invention provide a heat dissipation shielding device including a shielding cover over a shielded element and a base supporting the shielding cover, wherein the base includes one or more surrounding shielded components
  • the annular frame is composed of a hollow tube having a cavity sealed with respect to the outside, the inner cavity being filled with a heat conductive medium.
  • the base may further comprise a heat pipe in fluid communication with the hollow tube, the heat pipe comprising a heat pipe distal section remote from the annular frame.
  • the hollow tube may include a porous portion disposed in the inner cavity.
  • the porous portion may be composed of a multiple metal mesh liner.
  • the porous portion may also be a porous structure formed by surface-treating the inner wall of the hollow tube.
  • the heat dissipation shielding device may further include an additional heat conductive material disposed between the shielding cover and the shielded member, the additional heat conductive material being in surface contact with the shield cover, and the shielded member Face contact.
  • the additional thermally conductive material may be a silicone grease or a silicone sheet.
  • the thermally conductive medium may be petroleum ether.
  • the base may be made of metal.
  • the embodiment of the present invention further provides a terminal, wherein the terminal includes the heat dissipation shielding device described above.
  • the terminal can be, for example, a mobile phone or a tablet.
  • heat generated by the shielding member can be effectively and quickly removed, and the heat-dissipating shielding device and the terminal can maintain a relatively compact volume. .
  • Figure 1a is a schematic partial view of a prior art shielding device and a shielded component
  • Figure 1b is a schematic partial view of a shielding device and a shielded element in accordance with a first embodiment of the present invention
  • Fig. 2 schematically shows a base of a shielding device according to a second embodiment of the present invention
  • FIG. 3a-3d schematically illustrate a base of a shielding device in accordance with a third embodiment of the present invention
  • Fig. 4 schematically shows a base of a shielding device according to a fourth embodiment of the present invention.
  • the original function of the shielding device is to surround the interference component of the component, the circuit, the assembly, the cable or the whole system with the shielding body to prevent the interference electromagnetic field from spreading outward;
  • the receiving circuit, device or system is surrounded by a shield to prevent them from being affected by external electromagnetic fields.
  • the shielding device is structurally divided into two parts: a shielding cover and a base supporting the shielding cover.
  • the material of the shielding cover is usually made of 0.2 mm thick stainless steel and a copper alloy such as zinc-copper alloy, nickel-copper alloy, nickel-zinc-copper alloy, which is a metal shielding material which is easy to be tinned.
  • the shielding function of the shielding device is in fact completely provided by the cover of the shielding cover, and the base merely functions as a simple fixed shielding cover.
  • Figure 1a is a schematic partial view of a prior art shielding device and shielded component.
  • the shielding means in the mobile terminal includes a shield cover 10' disposed above the shielded member 20' and a base (not shown) supporting the shield cover. As shown, a gap S is left between the shield cover 10' and the underlying shielded member 20'.
  • the shielded component 20' is typically an element that generates heat, such as a chip, which becomes a source of heat within the mobile terminal during use. Since the air filled in the gap S is a poor conductor of heat, it severely hinders the emission and transfer of heat from the shield member 20' to the outside. In this case, the shield cover 10' does not function effectively for the heat dissipation of the shielded member 20'.
  • the shielded member 20' as a heat source is now cooled by heat radiation.
  • Figure 1b is a schematic partial view of a shielding device and a shielded element in accordance with a first embodiment of the present invention.
  • the shielding device includes, in addition to the shield cover 10 disposed above the shielded member 20 and the base (not shown) that supports the shield cover, the shield cover 10 and the shield cover 10 are included. Additional thermally conductive material 30 between the shielding elements 20.
  • the additional thermally conductive material 30 herein is in sufficient face-to-face contact with the shield cover 10 and the shielded component 20, respectively.
  • the additional thermally conductive material 30 is sufficiently performed on the underside with the shielded component 20 Face-to-face contact, and full face-to-face contact with the shield cover 10 on the upper side. Since the additional thermally conductive material 30 is a good conductor of heat, a temperature difference as small as possible between the upper and lower contact faces of the additional thermally conductive material 30 can be achieved.
  • the heat emitted by the shield member 20 as a heat source is transmitted to the shield cover 10 through the additional heat conductive material 30 and is further radiated. Therefore, the shield cover 10 plays an effective role in heat dissipation by the shield member 20.
  • the shielded component 20 is now dissipated by more efficient heat transfer.
  • the additional thermally conductive material 30 may be, for example, a thermal grease or a thermally conductive silicone sheet.
  • the heat-dissipating silicone grease is a high-thermal-conductivity insulating silicone material that hardly cures forever. It can maintain the grease state for a long time at a temperature of -50 ° C to +230 ° C.
  • the heat-dissipating silicone grease has excellent electrical insulation and excellent thermal conductivity, and also has low oil dispersion (which tends to zero).
  • Thermal grease is resistant to high and low temperatures, water, ozone and weathering. It can be widely applied to the contact surfaces between heating elements (power tubes, thyristors, electrothermal stacks, etc.) and heat dissipation devices (heat sinks, heat sinks, housings, etc.) in various electronic products and electrical equipment.
  • the heat-dissipating silicone grease is suitable for surface coating or integral potting of various microwave devices such as microwave communication, microwave transmission equipment, microwave dedicated power supply, and regulated power supply.
  • microwave communication such as microwave communication, microwave transmission equipment, microwave dedicated power supply, and regulated power supply.
  • the thermal conductive silica gel sheet is a heat conductive medium material which is synthesized by a special process by using silica gel as a base material and adding various auxiliary materials such as metal oxide.
  • thermal silica gel sheets also known as thermal silica gel pads, thermal conductive silicone films, flexible thermal pads, thermal silicone gaskets, etc., are designed to transfer heat through the gap.
  • the thermal conductive silica gel sheet can fill the gap and complete the heat transfer between the heat generating portion and the heat radiating portion, and also functions as insulation, shock absorption and sealing.
  • the thermal conductive silicone sheet can meet the design requirements of miniaturization and ultra-thinness of the device, has great processability and usability, and has a wide application range of thickness, and is an excellent thermal conductive filling material.
  • FIG. 2 shows an illustration of a base 200 of a shielding device in accordance with a second embodiment of the present invention. Italian top view, front view and side view.
  • the base 200 for supporting a shield cover includes an annular frame 210 and eight snaps 220 for connecting and fixing to the shield cover.
  • the annular frame 210 may enclose the shielded element (not shown) and is, for example, in the shape of a ring of rectangular shape (as shown in Figure 2a), circular, polygonal, irregular, or the like.
  • the annular frame 210 may be in the shape of a ring that matches the shape of the element being shielded.
  • the annular frame 210 is composed of a hollow tube having a lumen sealed from the outside.
  • the inner cavity can be filled with a heat-conducting medium which is preferably liquid at normal temperature.
  • the base 200 may have other suitable shapes in addition to the annular shape.
  • annular frames 210 and an appropriate number of one or more snaps 220 may be selected.
  • the base 300 includes an annular frame 310 and an additional heat pipe 330.
  • the annular frame 310 is constructed of a hollow tube having a lumen 311 that is sealed relative to the outside.
  • the inner cavity 311 is filled with a heat conductive medium.
  • a porous portion 312 is provided in the inner cavity 311 of the hollow tube.
  • the porous portion 312 may be formed by surface-treating the inner wall of the inner cavity 311 to have a porous structure, or may be provided by providing a separate porous member in the inner cavity 311.
  • the porous portion 312 can attract liquid by capillary action.
  • a single layer of wick can be provided as the porous portion 312 in the inner chamber 311.
  • the wick may be an inner liner of a multi-metal mesh that is flocculated and conforms to the wall of the lumen 311 of the hollow tube.
  • the inner liner of the multiple metal mesh is, for example, an inner liner of a multilayer metal mesh.
  • the base 300 further includes a heat pipe 330 as shown in Figures 3a and 3c.
  • a heat pipe 330 as shown in Figures 3a and 3c.
  • FIGs 3a and 3c there is shown an annular frame 310 and associated partial heat pipes 330 that are cut away.
  • the heat pipe 330 is also constructed of a hollow tube and is in fluid communication with the hollow tube of the annular frame 310 to together form a lumen that is sealed relative to the outside.
  • the heat pipe 330 includes a heat pipe proximal section 331 adjacent to and connected to the annular frame 310, a heat pipe distal section 333 remote from the annular frame 310, and a heat pipe intermediate section between the heat pipe proximal section 331 and the heat pipe distal section 333. 332.
  • a heat dissipation principle of the base 300 of the shielding device according to the third embodiment of the present invention is schematically illustrated.
  • the annular frame 310 surrounds the shielded element as a heat source.
  • the hollow tube of the annular frame 310 becomes the evaporation end (or the heating chamber), and the heat pipe distal end portion 333, which is relatively low in temperature away from the heat source, becomes the condensation end (or cooling chamber).
  • the heat transfer medium in the hollow tube of the annular frame 310 rapidly vaporizes and simultaneously absorbs heat.
  • the resulting steam flows sequentially through the heat pipe proximal section 331 and the heat pipe intermediate section 332 to the relatively large heat pipe distal section 333 (condensing end) under a slight pressure differential, as indicated by the dashed arrow in Fig. 3d.
  • the steam condenses into a liquid and releases heat.
  • the liquid flows back to the hollow tube (evaporation end) of the annular frame 310 via the heat pipe intermediate portion 332 and the heat pipe proximal portion 331 in turn, as shown in FIG. 3d.
  • the solid line with an arrow is shown.
  • the liquid heat transfer medium re-evaporates and begins the next cycle.
  • the heat transfer medium carries heat from one end of the annular frame 310 to one end of the condensation chamber and is dissipated in the condensation chamber. This cycle is fast, so heat can be continuously transmitted.
  • the hollow tube of the annular frame 310 and the hollow tube of the heat pipe 330 have a rectangular cross section, it will be understood that the hollow tube may also have a cross section of any suitable shape, such as a triangle or a circle. Shapes, polygons, irregular shapes, etc.
  • the hollow tube is evacuated to a negative pressure state and filled with a suitable heat transfer medium.
  • the thermally conductive medium can be, for example, a petroleum ether having a low boiling point and being volatile. Petroleum ether (electrode type non-conducting) has a boiling point of 60 to 80 °C. Moreover, the boiling point of petroleum ether will decrease slightly under vacuum conditions, and gas-liquid two-phase will start at about 40 °C, which is in accordance with the needs of the embodiments of the present invention.
  • the base according to an embodiment of the present invention may be made of metal.
  • the annular frame 310 and/or the heat pipe 330 may be made of a copper tube. Copper tubes can be bent and deformed, and they can often be made into elbows and joints. The copper tube can be bent at almost any angle. In addition, copper does not leak, does not support combustion, does not produce toxic gases and is resistant to corrosion, so it is a safe material. Thus, even if the applied mobile terminal (for example, a mobile phone) is dropped, the structure of the heat shielding device is not easily damaged.
  • the annular frame and the hollow tube of the heat pipe may have a similar structure.
  • the base 400 includes a plurality of annular frames 410 and a heat pipe 430.
  • a plurality of annular frames 410 surround respective shielded elements, one or more of which are heated during operation, i.e., become a source of heat.
  • the annular frame 410 is constructed of hollow tubes that are in fluid communication with one another.
  • the heat pipe 430 is also constructed of a hollow tube and is in fluid communication with the hollow tube of the annular frame 410 to together form a lumen that is sealed relative to the outside.
  • the inner cavity of the hollow tube of the annular frame 410 surrounding the heat source becomes the evaporation end (or the heating chamber), and the inner cavity of the distal end section 433 of the heat pipe which is relatively low away from the heat source becomes the condensation end (or cooling) room).
  • the heat pipe distal sections 333, 433 and the shield cover 10 there is a relatively large area on the outer sides of the heat pipe distal sections 333, 433 and the shield cover 10, and these parts can also be fully utilized.
  • the graphite fins may be covered on the outer end of the heat pipe and the outer surface of the shield cover. Superimposed with the heat dissipation of the graphite sheet, the heat shielding device can obtain better heat dissipation effect.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat radiation shielding device. The heat radiation shielding device comprises a shielding cover (10) located above a shielded element (20) and a base (200, 300, 400) supporting the shielding cover. The base comprises one or more annular frames (210, 310, 410) surrounding the shielded element. The annular frames consist of hollow tubes. The hollow tubes comprise inner cavities (311) enclosed relative to the outside. A heat-conducting medium is filled in the inner cavities. Also provided is a terminal comprising the heat radiation shielding device.

Description

散热屏蔽装置及终端Thermal shielding device and terminal 技术领域Technical field
本实用新型涉及一种用于例如为手机、平板电脑等的终端的散热屏蔽装置，属于终端的硬件领域。是一种终端中的散热部件。本实用新型还涉及一种包括该散热屏蔽装置的终端。The utility model relates to a heat shielding device for a terminal such as a mobile phone, a tablet computer or the like, belonging to the hardware field of the terminal. It is a heat sink in the terminal. The utility model also relates to a terminal comprising the heat dissipation shielding device.
背景技术Background technique
随着智能手机，平板电脑等移动终端的发展，其中的芯片的主频越来越高，功率越来越大，这样会产生大量的热量。如果热量不能够被及时的导出，会造成频率降低，同时热源部位热感强烈。移动终端的发热不仅影响使用者的舒适度，还会影响移动终端的性能。在消费电子向超薄化、智能化和多功能化的趋势下发展的今天，随着电子器件以及产品向高集成度、高运算领域的发展，耗散功率随之倍增，散热日益成为一个亟待解决的难题。With the development of mobile terminals such as smart phones and tablets, the frequency of the chips is getting higher and higher, and the power is getting larger and larger, which will generate a lot of heat. If the heat cannot be exported in time, the frequency will be reduced and the heat source will have a strong thermal sensation. The heat of the mobile terminal not only affects the comfort of the user, but also affects the performance of the mobile terminal. With the development of consumer electronics towards ultra-thin, intelligent and multi-functionality, with the development of electronic devices and products in the field of high integration and high computing, the power dissipation has doubled, and heat dissipation has become an urgent need. Solve the problem.
目前现有的散热技术列举如下：The current cooling technologies are listed below:
1.风冷法：通过贴片将芯片(例如为CPU)的热量引导到散热板上，并且使用风扇吹动空气，由此加强散热板表面的空气流动。通过该空气流动，热量被带走，温度被降低。然而，移动通信终端内没有足够的空间来容纳风扇。1. Air-cooling method: The heat of a chip (for example, a CPU) is guided to a heat dissipation plate by a patch, and a fan is used to blow air, thereby enhancing air flow on the surface of the heat dissipation plate. Through this air flow, heat is taken away and the temperature is lowered. However, there is not enough space in the mobile communication terminal to accommodate the fan.
2.水冷法：由于水的比热容很大，适合用来吸收热量。将管子连接在一个贴片上，并且将该贴片覆盖到热源上，然后使用压力泵让水流动起来以及时带走热源发出的热量。然而，与风冷一样，压力泵在移动终端内没有足够的安装空间。2. Water cooling method: Because water has a large specific heat capacity, it is suitable for absorbing heat. The tube is attached to a patch and the patch is placed over a heat source, and then a pressure pump is used to allow the water to flow and remove the heat from the heat source. However, like air cooling, the pressure pump does not have enough installation space in the mobile terminal.
3.液冷法：此原理与水冷法相似，只是将水换成导热硅油，这样的好 处就是不怕漏“水”。然而，同样，所必需的压力泵在移动终端内没有足够的安装空间。3. Liquid cooling method: This principle is similar to the water cooling method, except that the water is replaced by a thermal silicone oil. It is not afraid of leaking "water." However, again, the necessary pressure pump does not have sufficient installation space in the mobile terminal.
4.石墨散热法：适合移动通信终端散热的方法。由于石墨材料本身具备可塑性，因此将其制成层状贴片，就可以放进手机里。并且由于石墨分子的结构特点具备双向均匀导热性，所以现在大部分智能手机都内置了石墨散热片。4. Graphite heat dissipation method: suitable for heat dissipation of mobile communication terminals. Since the graphite material itself is malleable, it can be placed into a mobile phone by making it into a layered patch. And because the structural characteristics of graphite molecules have bidirectional uniform thermal conductivity, most smart phones now have built-in graphite heat sinks.
5.降频散热法：鉴于CPU发热原理，大量的处理数据的工作会让CPU成为温度极高的热源，降频则可确保CPU正常工作。目前智能手机配备的处理器都能够自动变频，这也就是为什么运行较大程序时手机会发烫而平时使用却不明显的原因。然而，目前的手机***暂时无法人为控制频率。5. Frequency reduction heat dissipation method: In view of the CPU heat generation principle, a large amount of work of processing data will make the CPU become a very high temperature heat source, and down frequency can ensure that the CPU works normally. At present, the processor equipped with the smart phone can automatically convert the frequency, which is why the mobile phone will be hot and usually not used when running a large program. However, the current mobile phone system is temporarily unable to artificially control the frequency.
6.半导体制冷片散热法：半导体制冷片也叫热电制冷片，是一种热泵。它的优点是没有滑动部件，应用在一些空间受到限制，可靠性要求高，无制冷剂污染的场合。利用半导体材料的珀尔贴(Peltier)效应，当直流电通过两种不同半导体材料串联成的电偶时，在电偶的两端可分别吸收热量和放出热量，可以实现制冷的目的。它是一种产生负热阻的制冷技术，其特点是无运动部件，可靠性也比较高。然而，在半导体制冷片上工作需要大量的电能和较高的电压，这是手机移动终端无法负载的。6. Semiconductor cooling film heat dissipation method: The semiconductor refrigeration film is also called a thermoelectric refrigeration sheet and is a heat pump. It has the advantage of no sliding parts and is used in applications where space is limited, reliability is high, and there is no refrigerant contamination. By using the Peltier effect of the semiconductor material, when the direct current is passed through a galvanic couple of two different semiconductor materials in series, heat can be absorbed and heat can be released at both ends of the galvanic couple, and the purpose of cooling can be achieved. It is a refrigeration technology that produces negative thermal resistance, which is characterized by no moving parts and high reliability. However, working on a semiconductor refrigerating sheet requires a large amount of electric energy and a high voltage, which cannot be carried by the mobile terminal of the mobile phone.
实用新型内容Utility model content
本实用新型的一个目的是解决现有技术中的以上所述的问题。An object of the present invention is to solve the above problems in the prior art.
本实用新型实施例提出了一种散热屏蔽装置，所述散热屏蔽装置包括位于被屏蔽元件上方的屏蔽盖以及支撑所述屏蔽盖的底座，其中，所述底座包括一个或多个包围被屏蔽元件的环形框架，所述环形框架由中空管构成，所述中空管具有相对于外界密闭的内腔，所述内腔中填充有导热介质。Embodiments of the present invention provide a heat dissipation shielding device including a shielding cover over a shielded element and a base supporting the shielding cover, wherein the base includes one or more surrounding shielded components The annular frame is composed of a hollow tube having a cavity sealed with respect to the outside, the inner cavity being filled with a heat conductive medium.
优选地，所述底座还可以包括热管，所述热管与所述中空管流体连通，所述热管包括远离所述环形框架的热管远端段。 Preferably, the base may further comprise a heat pipe in fluid communication with the hollow tube, the heat pipe comprising a heat pipe distal section remote from the annular frame.
优选地，所述中空管可以包括设置在所述内腔中的多孔部。Preferably, the hollow tube may include a porous portion disposed in the inner cavity.
优选地，所述多孔部可以由多重金属网孔衬垫构成。替代地，所述多孔部也可以是通过对所述中空管的内壁进行表面处理而形成的多孔结构。Preferably, the porous portion may be composed of a multiple metal mesh liner. Alternatively, the porous portion may also be a porous structure formed by surface-treating the inner wall of the hollow tube.
优选地，所述散热屏蔽装置还可以包括设置在所述屏蔽盖与所述被屏蔽元件之间的附加导热材料，所述附加导热材料与所述屏蔽盖面接触，并且与所述被屏蔽元件面接触。Preferably, the heat dissipation shielding device may further include an additional heat conductive material disposed between the shielding cover and the shielded member, the additional heat conductive material being in surface contact with the shield cover, and the shielded member Face contact.
优选地，所述附加导热材料可以是硅脂或硅胶片。Preferably, the additional thermally conductive material may be a silicone grease or a silicone sheet.
优选地，所述导热介质可以是石油醚。Preferably, the thermally conductive medium may be petroleum ether.
优选地，所述底座可以由金属制成。Preferably, the base may be made of metal.
本实用新型实施例还提出了一种终端，其中，所述终端包括以上所述的散热屏蔽装置。所述终端例如可以是手机或平板电脑。The embodiment of the present invention further provides a terminal, wherein the terminal includes the heat dissipation shielding device described above. The terminal can be, for example, a mobile phone or a tablet.
利用根据本实用新型实施例所提出的散热屏蔽装置和包括该散热屏蔽装置的终端，被屏蔽元件所产生的热量能够被有效且迅速地移除，同时散热屏蔽装置和终端能够保持相对紧凑的体积。With the heat-dissipating shielding device and the terminal including the heat-dissipating shielding device according to the embodiment of the present invention, heat generated by the shielding member can be effectively and quickly removed, and the heat-dissipating shielding device and the terminal can maintain a relatively compact volume. .
附图说明DRAWINGS
下面将参照附图描述本实用新型的优选实施例，其中：Preferred embodiments of the present invention will now be described with reference to the accompanying drawings, in which:
图1a为现有技术中屏蔽装置与被屏蔽元件的示意性局部视图；Figure 1a is a schematic partial view of a prior art shielding device and a shielded component;
图1b为根据本实用新型的第一实施例的屏蔽装置与被屏蔽元件的示意性局部视图；Figure 1b is a schematic partial view of a shielding device and a shielded element in accordance with a first embodiment of the present invention;
图2示意性地示出了根据本实用新型的第二实施例的屏蔽装置的底座；Fig. 2 schematically shows a base of a shielding device according to a second embodiment of the present invention;
图3a-图3d示意性地示出了根据本实用新型的第三实施例的屏蔽装置的底座；以及3a-3d schematically illustrate a base of a shielding device in accordance with a third embodiment of the present invention;
图4示意性地示出了根据本实用新型的第四实施例的屏蔽装置的底座。 Fig. 4 schematically shows a base of a shielding device according to a fourth embodiment of the present invention.
具体实施方式detailed description
在终端、尤其是移动终端中，屏蔽装置的原有作用是：一方面用屏蔽体将元部件、电路、组合件、电缆或整个***的干扰源包围起来，防止干扰电磁场向外扩散；另一方面用屏蔽体将接收电路、设备或***包围起来，防止它们受到外界电磁场的影响。In the terminal, especially the mobile terminal, the original function of the shielding device is to surround the interference component of the component, the circuit, the assembly, the cable or the whole system with the shielding body to prevent the interference electromagnetic field from spreading outward; In terms of shielding, the receiving circuit, device or system is surrounded by a shield to prevent them from being affected by external electromagnetic fields.
屏蔽装置在结构上分为两个部分：屏蔽盖与支撑屏蔽盖的底座。屏蔽盖的材料通常采用0.2mm厚的不锈钢和例如为锌铜合金、镍铜合金、镍锌铜合金的铜合金为材料，其中所述铜合金是一种容易上锡的金属屏蔽材料。在现有技术中，屏蔽装置的屏蔽功能事实上完全由屏蔽罩的盖子提供，底座只是起到单纯的固定屏蔽盖作用。The shielding device is structurally divided into two parts: a shielding cover and a base supporting the shielding cover. The material of the shielding cover is usually made of 0.2 mm thick stainless steel and a copper alloy such as zinc-copper alloy, nickel-copper alloy, nickel-zinc-copper alloy, which is a metal shielding material which is easy to be tinned. In the prior art, the shielding function of the shielding device is in fact completely provided by the cover of the shielding cover, and the base merely functions as a simple fixed shielding cover.
图1a是现有技术中屏蔽装置与被屏蔽元件的示意性局部视图。在现有技术中，移动终端中的屏蔽装置包括设置在被屏蔽元件20’上方的屏蔽盖10’和支撑屏蔽盖的底座(图中未示出)。如图所示，屏蔽盖10’与下方的被屏蔽元件20’之间留有间隙S。Figure 1a is a schematic partial view of a prior art shielding device and shielded component. In the prior art, the shielding means in the mobile terminal includes a shield cover 10' disposed above the shielded member 20' and a base (not shown) supporting the shield cover. As shown, a gap S is left between the shield cover 10' and the underlying shielded member 20'.
被屏蔽元件20’通常是例如为芯片等会发热的元件，这样的元件在使用过程中成为移动终端内的热源。由于填充在间隙S中的空气是热的不良导体，因此其严重阻碍被屏蔽元件20’的热量向外部的散发和传递。在这种情况下，对于被屏蔽元件20’的散热来说，屏蔽盖10’无法起到有效作用。作为发热源的被屏蔽元件20’此时通过热辐射来散热。The shielded component 20' is typically an element that generates heat, such as a chip, which becomes a source of heat within the mobile terminal during use. Since the air filled in the gap S is a poor conductor of heat, it severely hinders the emission and transfer of heat from the shield member 20' to the outside. In this case, the shield cover 10' does not function effectively for the heat dissipation of the shielded member 20'. The shielded member 20' as a heat source is now cooled by heat radiation.
图1b是根据本实用新型的第一实施例的屏蔽装置与被屏蔽元件的示意性局部视图。根据本实用新型的第一实施例，屏蔽装置除了包括设置在被屏蔽元件20上方的屏蔽盖10和支撑屏蔽盖的底座(图中未示出)之外，还包括设置在屏蔽盖10与被屏蔽元件20之间的附加导热材料30。Figure 1b is a schematic partial view of a shielding device and a shielded element in accordance with a first embodiment of the present invention. According to the first embodiment of the present invention, the shielding device includes, in addition to the shield cover 10 disposed above the shielded member 20 and the base (not shown) that supports the shield cover, the shield cover 10 and the shield cover 10 are included. Additional thermally conductive material 30 between the shielding elements 20.
此处的附加导热材料30分别与屏蔽盖10和被屏蔽元件20进行充分的面对面接触。例如，附加导热材料30在下侧与被屏蔽元件20进行充分的 面对面接触，并且在上侧与屏蔽盖10进行充分的面对面接触。由于附加导热材料30是热的良好导体，因此在附加导热材料30的上下接触面之间，可以实现尽量小的温差。在这种情况下，作为发热源的被屏蔽元件20发出的热量通过附加导热材料30传递到屏蔽盖10并且进一步被散发。因此，对于被屏蔽元件20的散热来说，屏蔽盖10起到了有效作用。被屏蔽元件20此时通过更有效的热传导来散热。The additional thermally conductive material 30 herein is in sufficient face-to-face contact with the shield cover 10 and the shielded component 20, respectively. For example, the additional thermally conductive material 30 is sufficiently performed on the underside with the shielded component 20 Face-to-face contact, and full face-to-face contact with the shield cover 10 on the upper side. Since the additional thermally conductive material 30 is a good conductor of heat, a temperature difference as small as possible between the upper and lower contact faces of the additional thermally conductive material 30 can be achieved. In this case, the heat emitted by the shield member 20 as a heat source is transmitted to the shield cover 10 through the additional heat conductive material 30 and is further radiated. Therefore, the shield cover 10 plays an effective role in heat dissipation by the shield member 20. The shielded component 20 is now dissipated by more efficient heat transfer.
根据本实用新型实施例，附加导热材料30例如可以是散热硅脂或导热硅胶片。According to an embodiment of the present invention, the additional thermally conductive material 30 may be, for example, a thermal grease or a thermally conductive silicone sheet.
散热硅脂是一种高导热绝缘有机硅材料，几乎永远不固化，可在-50℃～+230℃的温度下长期保持使用时的脂膏状态。散热硅脂既具有优异的电绝缘性，又具有优异的导热性，同时还具有低油离度(趋向于零)。散热硅脂耐高低温、耐水、臭氧并且耐气候老化。它可广泛涂覆于各种电子产品、电器设备中的发热体(功率管、可控硅、电热堆等)与散热设施(散热片、散热条、壳体等)之间的接触面，起传热媒介作用和防潮、防尘、防腐蚀、防震等性能。散热硅脂适用于微波通讯、微波传输设备、微波专用电源、稳压电源等各种微波器件的表面涂覆或整体灌封，此类硅材料对产生热的电子元件，提供了极佳的导热效果。The heat-dissipating silicone grease is a high-thermal-conductivity insulating silicone material that hardly cures forever. It can maintain the grease state for a long time at a temperature of -50 ° C to +230 ° C. The heat-dissipating silicone grease has excellent electrical insulation and excellent thermal conductivity, and also has low oil dispersion (which tends to zero). Thermal grease is resistant to high and low temperatures, water, ozone and weathering. It can be widely applied to the contact surfaces between heating elements (power tubes, thyristors, electrothermal stacks, etc.) and heat dissipation devices (heat sinks, heat sinks, housings, etc.) in various electronic products and electrical equipment. Heat transfer media and moisture, dust, corrosion, shock and other properties. The heat-dissipating silicone grease is suitable for surface coating or integral potting of various microwave devices such as microwave communication, microwave transmission equipment, microwave dedicated power supply, and regulated power supply. Such silicon material provides excellent heat conduction for generating hot electronic components. effect.
导热硅胶片是以硅胶为基材，添加金属氧化物等各种辅材，通过特殊工艺合成的一种导热介质材料。在行业内，导热硅胶片又称为导热硅胶垫、导热矽胶片、软性导热垫、导热硅胶垫片等等，是专门为利用缝隙传递热量的设计方案。导热硅胶片能够填充缝隙，完成发热部位与散热部位间的热传递，同时还起到绝缘、减震、密封等作用。导热硅胶片能够满足设备小型化及超薄化的设计要求，极具工艺性和使用性，且厚度适用范围广，是一种极佳的导热填充材料。The thermal conductive silica gel sheet is a heat conductive medium material which is synthesized by a special process by using silica gel as a base material and adding various auxiliary materials such as metal oxide. In the industry, thermal silica gel sheets, also known as thermal silica gel pads, thermal conductive silicone films, flexible thermal pads, thermal silicone gaskets, etc., are designed to transfer heat through the gap. The thermal conductive silica gel sheet can fill the gap and complete the heat transfer between the heat generating portion and the heat radiating portion, and also functions as insulation, shock absorption and sealing. The thermal conductive silicone sheet can meet the design requirements of miniaturization and ultra-thinness of the device, has great processability and usability, and has a wide application range of thickness, and is an excellent thermal conductive filling material.
图2示出了根据本实用新型的第二实施例的屏蔽装置的底座200的示 意性的俯视图、正视图和侧视图。2 shows an illustration of a base 200 of a shielding device in accordance with a second embodiment of the present invention. Italian top view, front view and side view.
在本实施例的屏蔽装置中，用于支撑屏蔽盖(图中未示出)的底座200包括一个环形框架210和八个用于与屏蔽盖连接和固定的卡扣220。In the shielding device of the present embodiment, the base 200 for supporting a shield cover (not shown) includes an annular frame 210 and eight snaps 220 for connecting and fixing to the shield cover.
环形框架210可以包围被屏蔽元件(图中未示出)，并且例如呈矩形(如图2a所示)、圆形、多边形、不规则形等的环的形状。优选地，环形框架210可以呈与被屏蔽元件的形状匹配的环的形状。根据本实用新型实施例，环形框架210由中空管构成，所述中空管具有相对于外界密封的内腔。在内腔中可以填充有导热介质，该导热介质优选地在常温下呈液态。另外，除了环形的形状之外，底座200也可以呈其它适当的形状。The annular frame 210 may enclose the shielded element (not shown) and is, for example, in the shape of a ring of rectangular shape (as shown in Figure 2a), circular, polygonal, irregular, or the like. Preferably, the annular frame 210 may be in the shape of a ring that matches the shape of the element being shielded. According to an embodiment of the present invention, the annular frame 210 is composed of a hollow tube having a lumen sealed from the outside. The inner cavity can be filled with a heat-conducting medium which is preferably liquid at normal temperature. In addition, the base 200 may have other suitable shapes in addition to the annular shape.
可以理解的是，在一个屏蔽装置中，可以选择设置适当数量的一个或多个环形框架210以及适当数量的一个或多个卡扣220。It will be appreciated that in a shielding device, an appropriate number of one or more annular frames 210 and an appropriate number of one or more snaps 220 may be selected.
参见图3a，其中示意性地示出了根据本实用新型的第三实施例的屏蔽装置的底座300。底座300包括环形框架310和附加的热管330。Referring to Figure 3a, a base 300 of a shielding apparatus in accordance with a third embodiment of the present invention is schematically illustrated. The base 300 includes an annular frame 310 and an additional heat pipe 330.
参见图3b，环形框架310由中空管构成，所述中空管具有相对于外界密封的内腔311。在内腔311中填充有导热介质。Referring to Figure 3b, the annular frame 310 is constructed of a hollow tube having a lumen 311 that is sealed relative to the outside. The inner cavity 311 is filled with a heat conductive medium.
中空管的内腔311中设有多孔部312。多孔部312可以通过对内腔311的内壁进行表面处理以使其具有多孔结构来形成，也可以通过在内腔311内设置独立的多孔部件来提供。多孔部312可以通过毛细作用来吸引液体。A porous portion 312 is provided in the inner cavity 311 of the hollow tube. The porous portion 312 may be formed by surface-treating the inner wall of the inner cavity 311 to have a porous structure, or may be provided by providing a separate porous member in the inner cavity 311. The porous portion 312 can attract liquid by capillary action.
可以设置单层的吸液芯来作为内腔311中的多孔部312。例如，吸液芯可以是多重金属网孔的内衬垫，内衬垫呈絮状并且贴合在中空管的内腔311的管壁上。所述多重金属网孔的内衬垫例如是多层金属网孔的内衬垫。A single layer of wick can be provided as the porous portion 312 in the inner chamber 311. For example, the wick may be an inner liner of a multi-metal mesh that is flocculated and conforms to the wall of the lumen 311 of the hollow tube. The inner liner of the multiple metal mesh is, for example, an inner liner of a multilayer metal mesh.
在本实施例中，底座300还包括热管330，如图3a和3c所示。参见图3c，其中示出了环形框架310以及相连接的被剖开的部分热管330。热管330同样由中空管构成，并且与环形框架310的中空管流体连通，从而一起构成相对于外界密闭的内腔。 In the present embodiment, the base 300 further includes a heat pipe 330 as shown in Figures 3a and 3c. Referring to Figure 3c, there is shown an annular frame 310 and associated partial heat pipes 330 that are cut away. The heat pipe 330 is also constructed of a hollow tube and is in fluid communication with the hollow tube of the annular frame 310 to together form a lumen that is sealed relative to the outside.
参见图3a，热管330包括与环形框架310靠近并连接的热管近端段331、远离环形框架310的热管远端段333，以及热管近端段331与热管远端段333之间的热管中间段332。参见图3d，其中示意性地示出了根据本实用新型的第三实施例的屏蔽装置的底座300的散热原理。Referring to Fig. 3a, the heat pipe 330 includes a heat pipe proximal section 331 adjacent to and connected to the annular frame 310, a heat pipe distal section 333 remote from the annular frame 310, and a heat pipe intermediate section between the heat pipe proximal section 331 and the heat pipe distal section 333. 332. Referring to Fig. 3d, a heat dissipation principle of the base 300 of the shielding device according to the third embodiment of the present invention is schematically illustrated.
在本实施例中，环形框架310围绕作为热源的被屏蔽元件。在工作中，环形框架310的中空管成为蒸发端(或发热室)，而远离热源的温度相对较低的热管远端段333则成为冷凝端(或冷却室)。In the present embodiment, the annular frame 310 surrounds the shielded element as a heat source. In operation, the hollow tube of the annular frame 310 becomes the evaporation end (or the heating chamber), and the heat pipe distal end portion 333, which is relatively low in temperature away from the heat source, becomes the condensation end (or cooling chamber).
当被屏蔽元件发热时，环形框架310的中空管内的导热介质迅速汽化并且同时吸收热量。由此产生的蒸汽在微小的压力差下依次经由热管近端段331和热管中间段332流向空间相对较大的热管远端段333(冷凝端)，如图3d中带箭头的虚线所示。在冷凝端中，蒸汽凝结成液体并且释放出热量。然后，由于环形框架310的中空管内多孔部312的毛细作用的吸引，液体依次经由热管中间段332和热管近端段331流回到环形框架310的中空管(蒸发端)，如图3d中带箭头的实线所示。在蒸发端中，液态的导热介质重新蒸发并开始下一次循环。When the shielded member heats up, the heat transfer medium in the hollow tube of the annular frame 310 rapidly vaporizes and simultaneously absorbs heat. The resulting steam flows sequentially through the heat pipe proximal section 331 and the heat pipe intermediate section 332 to the relatively large heat pipe distal section 333 (condensing end) under a slight pressure differential, as indicated by the dashed arrow in Fig. 3d. In the condensing end, the steam condenses into a liquid and releases heat. Then, due to the capillary action of the hollow portion 312 of the hollow frame of the annular frame 310, the liquid flows back to the hollow tube (evaporation end) of the annular frame 310 via the heat pipe intermediate portion 332 and the heat pipe proximal portion 331 in turn, as shown in FIG. 3d. The solid line with an arrow is shown. In the evaporation end, the liquid heat transfer medium re-evaporates and begins the next cycle.
通过上述循环，导热介质携带热量从环形框架310一端传递至冷凝室一端，并且在冷凝室散发。这种循环是快速进行的，由此热量可以被源源不断地传导开来。Through the above cycle, the heat transfer medium carries heat from one end of the annular frame 310 to one end of the condensation chamber and is dissipated in the condensation chamber. This cycle is fast, so heat can be continuously transmitted.
尽管在本实施例中，环形框架310的中空管以及热管330的中空管具有矩形的横截面，但可以理解的是，中空管也可以具有任何适当形状的横截面，例如三角形、圆形、多边形、不规则形状等。优选地，中空管被抽成负压状态，并充入适当的导热介质。导热介质例如可以是沸点低且易挥发的石油醚。石油醚(无极型不导电)的沸点在60～80℃。并且石油醚在负压真空条件下沸点还会稍微下降，在40℃左右会开始气液两相化，符合本实用新型实施例的需要。 Although in the present embodiment, the hollow tube of the annular frame 310 and the hollow tube of the heat pipe 330 have a rectangular cross section, it will be understood that the hollow tube may also have a cross section of any suitable shape, such as a triangle or a circle. Shapes, polygons, irregular shapes, etc. Preferably, the hollow tube is evacuated to a negative pressure state and filled with a suitable heat transfer medium. The thermally conductive medium can be, for example, a petroleum ether having a low boiling point and being volatile. Petroleum ether (electrode type non-conducting) has a boiling point of 60 to 80 °C. Moreover, the boiling point of petroleum ether will decrease slightly under vacuum conditions, and gas-liquid two-phase will start at about 40 °C, which is in accordance with the needs of the embodiments of the present invention.
根据本实用新型实施例的底座可由金属制成。优选地，环形框架310和/或热管330可由铜管制成。铜管可以弯曲、变形，它常常可以做成弯头和接头。铜管可以以几乎任何角度被折弯。另外，铜不渗漏、不助燃、不产生有毒气体并且耐腐蚀，因此是安全的材料。这样即使所应用的移动终端(例如手机)被摔落，也不会轻易碰坏散热屏蔽装置的结构。The base according to an embodiment of the present invention may be made of metal. Preferably, the annular frame 310 and/or the heat pipe 330 may be made of a copper tube. Copper tubes can be bent and deformed, and they can often be made into elbows and joints. The copper tube can be bent at almost any angle. In addition, copper does not leak, does not support combustion, does not produce toxic gases and is resistant to corrosion, so it is a safe material. Thus, even if the applied mobile terminal (for example, a mobile phone) is dropped, the structure of the heat shielding device is not easily damaged.
根据本实用新型实施例，环形框架和热管的中空管可以具有类似的结构。According to an embodiment of the present invention, the annular frame and the hollow tube of the heat pipe may have a similar structure.
参见图4，其中示意性地示出了根据本实用新型的第四实施例的屏蔽装置的底座400。底座400包括多个环形框架410和热管430。多个环形框架410围绕各自的被屏蔽元件，其中的一个或多个被屏蔽元件在工作中发热、即成为热源。Referring to Figure 4, there is shown schematically a base 400 of a shielding apparatus in accordance with a fourth embodiment of the present invention. The base 400 includes a plurality of annular frames 410 and a heat pipe 430. A plurality of annular frames 410 surround respective shielded elements, one or more of which are heated during operation, i.e., become a source of heat.
环形框架410由相互流体连通的中空管构成。热管430同样由中空管构成，并且与环形框架410的中空管流体连通，从而一起构成相对于外界密闭的内腔。The annular frame 410 is constructed of hollow tubes that are in fluid communication with one another. The heat pipe 430 is also constructed of a hollow tube and is in fluid communication with the hollow tube of the annular frame 410 to together form a lumen that is sealed relative to the outside.
在工作中，围绕热源的环形框架410的中空管的内腔成为蒸发端(或发热室)，而远离热源的温度相对较低的热管远端段433的内腔则成为冷凝端(或冷却室)。In operation, the inner cavity of the hollow tube of the annular frame 410 surrounding the heat source becomes the evaporation end (or the heating chamber), and the inner cavity of the distal end section 433 of the heat pipe which is relatively low away from the heat source becomes the condensation end (or cooling) room).
根据本实用新型实施例，在热管远端段333、433和屏蔽盖10的外侧有相对大的面积，这些部位也可以被充分利用。例如，可在热管远端段和屏蔽盖的外表面覆盖石墨散热片。与石墨片散热相叠加，散热屏蔽装置可以获得更好的散热效果。According to an embodiment of the present invention, there is a relatively large area on the outer sides of the heat pipe distal sections 333, 433 and the shield cover 10, and these parts can also be fully utilized. For example, the graphite fins may be covered on the outer end of the heat pipe and the outer surface of the shield cover. Superimposed with the heat dissipation of the graphite sheet, the heat shielding device can obtain better heat dissipation effect.
以上已经参考实施例对本实用新型进行了描述，但需要指出的是，以上所述的实施例均是示例性的，而不是限制性的。在以上所述的实施例中描述的各个技术特征在不互相抵触的情况下可以任意地在不同的实施例中结合和使用。并且本领域技术人员可以认识到，在不脱离本实用新型的精 神和范围的情况下，可以作出多种变化，这些变化都应被涵盖在本实用新型的范围之内。 The present invention has been described above with reference to the embodiments, but it should be noted that the embodiments described above are illustrative and not restrictive. The various technical features described in the above-described embodiments can be arbitrarily combined and used in different embodiments without being mutually contradictable. And those skilled in the art can recognize that without departing from the essence of the present invention Many variations are possible in the case of God and scope, and such variations are intended to be included within the scope of the present invention.

Claims (11)

  1. 一种散热屏蔽装置，所述散热屏蔽装置包括位于被屏蔽元件上方的屏蔽盖以及支撑所述屏蔽盖的底座，所述底座包括一个或多个包围被屏蔽元件的环形框架，所述环形框架由中空管构成，所述中空管具有相对于外界密闭的内腔，所述内腔中填充有导热介质。A heat dissipation shielding device comprising a shielding cover over a shielded element and a base supporting the shielding cover, the base comprising one or more annular frames surrounding the shielded element, the annular frame being The hollow tube has a lumen that is sealed relative to the outside, and the lumen is filled with a heat conductive medium.
  2. 根据权利要求1所述的散热屏蔽装置，其中，所述底座还包括热管，所述热管与所述中空管流体连通，所述热管包括远离所述环形框架的热管远端段。The heat shield apparatus of claim 1 wherein said base further comprises a heat pipe in fluid communication with said hollow pipe, said heat pipe comprising a heat pipe distal section remote from said annular frame.
  3. 根据权利要求1或2所述的散热屏蔽装置，其中，所述中空管包括设置在所述内腔中的多孔部。The heat dissipation shielding device according to claim 1 or 2, wherein the hollow tube comprises a porous portion provided in the inner cavity.
  4. 根据权利要求3所述的散热屏蔽装置，其中，所述多孔部由多重金属网孔衬垫构成。The heat dissipation shielding device according to claim 3, wherein the porous portion is composed of a multiple metal mesh gasket.
  5. 根据权利要求3所述的散热屏蔽装置，其中，所述多孔部是通过对所述中空管的内壁进行表面处理而形成的多孔结构。The heat-dissipating shield device according to claim 3, wherein the porous portion is a porous structure formed by surface-treating an inner wall of the hollow tube.
  6. 根据权利要求1或2所述的散热屏蔽装置，其中，所述散热屏蔽装置还包括设置在所述屏蔽盖与所述被屏蔽元件之间的附加导热材料，所述附加导热材料与所述屏蔽盖面接触，并且与所述被屏蔽元件面接触。The heat dissipation shielding device according to claim 1 or 2, wherein the heat dissipation shielding device further comprises an additional heat conductive material disposed between the shield cover and the shielded member, the additional heat conductive material and the shield The cover is in contact and is in surface contact with the shielded component.
  7. 根据权利要求6所述的散热屏蔽装置，其中，所述附加导热材料是硅脂或硅胶片。The heat shield device of claim 6 wherein said additional thermally conductive material is a silicone grease or silicone sheet.
  8. 根据权利要求1或2所述的散热屏蔽装置，其中，所述导热介质是石油醚。The heat shield device according to claim 1 or 2, wherein the heat transfer medium is petroleum ether.
  9. 根据权利要求1或2所述的散热屏蔽装置，其中，所述底座由金属制成。The heat dissipation shielding device according to claim 1 or 2, wherein the base is made of metal.
  10. 一种终端，所述终端包括根据权利要求1-9中的任一项所述的散热屏蔽装置。 A terminal comprising the heat dissipation shielding device according to any one of claims 1-9.
  11. 根据权利要求10所述的终端，其中，所述终端是手机或平板电脑。 The terminal of claim 10, wherein the terminal is a mobile phone or a tablet.
PCT/CN2015/084520 2015-02-12 2015-07-20 Heat radiation shielding device and terminal WO2016127579A1 (en)

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