498024 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（） 發明背景： 本發明是有關於一種多層陶瓷基材的製造方法，且特 別是有關於一種使用厚層薄膜技術形成之導電性表面襯 墊（electrically conductive surface pad)的方法，其具有改 進的機械與電性穩定性。 多層陶瓷基材一般用在積體電路元件之間的内連 線，傳統上使用二段製程製作，積體電路元件係用在資訊 處理系統，比如電腦、控制系統以及電路板。最早的製程 為構築（build up)製程，從燒過的陶瓷層開始，在其上藉由 屏蔽（screening)操作依序交替地沉積圖案化的介電層與金 屬導電層，藉以形成多層結構。這些層可以在每一次沉積 之後進行燒結，或是在沉積所有層之後再進行燒結。在足 夠的高溫下燒結，將金屬、陶瓷以及玻璃顆粒結合成緊 密、不滲透的塊料，提供形成在陶资介電層中之連續電路 軌跡的機械支撐。 另一種製作多層陶層基材的方法，係使用鑄造製程將 介電層做成帶，並對此帶打洞以形成孔洞或”介層窗口 n(vias)，導電之金屬導電糊（paste)延金屬軌跡沉積並填進 孔洞或介層窗中，以作為導線。對準、堆積並夾合這些打 洞與金屬化的帶而形成疊片，接著進行燒結。此方法為共 火（cofired)製程，在基本上為單一的熱製程中，但是通常 為複合的熱製程中，將陶瓷與金屬粉末結合。 燒結製程中的關鍵部分係為形成導電表面外形 (surface features)，金屬電鍍如鎳與金可能在其上沉積， 第2頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公爱) ..........-…广裝…......訂：：：·、：線 (請先閲讀背面之注意事項再填寫本頁} 498024 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（ 有時作為隨後的焊接接合製程的準備。這些表面外形提供 在陶瓷中電性導體的連接，且其機械與電性效能對多層陶 瓷基材與整個資訊處理系統的穩定性非常重要。 傳統的陶瓷基材由氧化鋁（如礬土）形成，一般在燒結 之後與熔融的玻璃粉末黏合。此氧化鋁陶瓷基材的燒結通 常是需要溫度超過1 500°C的高溫製程。使用鉬與鎢金屬粉 末作為電性導體，係因為這些材料提供高導電性，且容許 此高燒合溫度，不會融化。從燒結到周圍溫度的測試，一 般分別從160(TC到-15(TC，這些金屬在此溫度範圍内對礬 土亦具有良好的熱膨脹。礬土、鉬與鎢的熱膨脹係數（CTE) 相似，分別約為7、5與4ppn^ 在共火製程中，使用玻璃粉末混入厚層薄膜導電糊， 以形成圖案化的表面外形，一般這些金屬做成的表面外形 對陶资會有良好的結合。由於表面外形跟陶瓷之間具有相 近的CTE匹配，因此表面外形具有良好的附著，並且礬土 陶瓷非常堅硬，在熱循環製程期間，對在下層的陶資有一 點點應力。 當表面外形（一般作為陣列）藉由焊接技術比如陶受球 栅陣列（CBGA)與陶瓷柱柵陣列（CCGA)電性連接到印刷電 路板時，表面金屬形狀與陶瓷之間的結合強度非常重要。 在CBGA附著技術中，焊接球用作基材與印刷電路板之間 的間隔。使用南於焊接時之較高的熔化溫度，將焊接球接 合於陶瓷基材與電路板。同樣地，在CCGA附著技術中， 柱狀焊接線可用在陶瓷基材與電路板之間的連接。 第3頁 .........卜：Γ裝-:......訂：··：：·線 (請先閱讀背面之注意事項再填寫本頁) A7498024 Printed A7 B7 by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Background of the invention: The present invention relates to a method for manufacturing a multilayer ceramic substrate, and more particularly to a conductive layer formed using a thick film technology. Electrically conductive surface pad method, which has improved mechanical and electrical stability. Multilayer ceramic substrates are generally used for interconnects between integrated circuit components. Traditionally, they are manufactured using a two-stage process. Integrated circuit components are used in information processing systems such as computers, control systems, and circuit boards. The earliest process was a build up process, starting from the burned ceramic layer, and sequentially depositing a patterned dielectric layer and a metal conductive layer by a screening operation thereon to form a multilayer structure. These layers can be sintered after each deposition, or sintered after all layers have been deposited. Sintering at a sufficiently high temperature combines metals, ceramics, and glass particles into tight, impermeable blocks, providing mechanical support for the continuous circuit trajectories formed in the ceramic dielectric layer. Another method of making a multilayer ceramic layer substrate is to use a casting process to form a dielectric layer into a tape, and punch holes in the tape to form holes or "vias", conductive metal conductive pastes A metal track is deposited and filled into a hole or interstitial window as a wire. The holes, metallized strips are aligned, stacked, and sandwiched to form a laminate, and then sintered. This method is cofired In the process, which is basically a single thermal process, but usually a composite thermal process, ceramics and metal powder are combined. The key part of the sintering process is to form conductive surface features, and metal plating such as nickel and Gold may be deposited on it. Page 2 This paper is sized for China National Standard (CNS) A4 (210X 297 public love) ...............-... ：：： 、、: line (please read the notes on the back before filling this page) 498024 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The invention description (sometimes used as preparation for the subsequent welding process. These Surface profile provides electrical properties in ceramics And the mechanical and electrical performance are very important for the stability of the multilayer ceramic substrate and the entire information processing system. Traditional ceramic substrates are formed of alumina (such as alumina), and are usually sintered with molten glass. Powder bonding. The sintering of this alumina ceramic substrate usually requires a high-temperature process at a temperature exceeding 1 500 ° C. Molybdenum and tungsten metal powders are used as electrical conductors because these materials provide high conductivity and allow this high firing temperature , Will not melt. From sintering to ambient temperature tests, generally from 160 (TC to -15 (TC), these metals also have good thermal expansion of alumina in this temperature range. Thermal expansion coefficients of alumina, molybdenum and tungsten (CTE) are similar, about 7, 5 and 4 ppn respectively. In the cofire process, glass powder is mixed into a thick film of conductive paste to form a patterned surface profile. Generally, the surface profile made of these metals is useful for ceramic materials. Has a good combination. Because the surface profile has a similar CTE match with the ceramic, the surface profile has good adhesion, and the alumina ceramic is very hard. During the cyclic process, there is a little stress on the ceramic materials below. When the surface profile (usually as an array) is electrically connected to the printed circuit by soldering techniques such as ceramic ball grid array (CBGA) and ceramic pillar grid array (CCGA) In the case of a board, the bonding strength between the surface metal shape and the ceramic is very important. In the CBGA adhesion technology, the solder ball is used as the space between the substrate and the printed circuit board. Using the higher melting temperature during soldering, the The solder ball is bonded to the ceramic substrate and the circuit board. Similarly, in the CCGA attachment technology, a columnar welding wire can be used for the connection between the ceramic substrate and the circuit board. Page 3 ......... : Γ 装-: ...... Order: ·· :: · Line (Please read the precautions on the back before filling this page) A7
498024 五、發明説明（） 陶资基材與電路板之間電性連結的穩定性受到許多 的參數影響’包括陶瓷基材與電路板之間的CTE差異、兩 者的勁度、焊接陣列的尺寸以及焊接的高度。在熱循環期 間，電路板的膨脹與收縮大於陶瓷基材。此變動對電路板 與陶瓷基材之間的焊接造成大的應變，最大的應變發生在 绛接陣列之取外圍的連接，且最小在中心。反覆的熱循環 最後使焊接疲乏而損壞，且在陶瓷基材與電路板之間的電 路造成斷路。一般，焊接柱愈長，焊接疲乏的阻抗愈大。 在所有參數相同的條件下，CCGA比CBGA經得起更多導 致疲乏的熱循環，然而CCGA的需求低於CBgA，係因為 CCGA在處理時容易受損，並且增長的焊接長度增加電感 (inductance)，並會削弱電性效能。 當資訊處理系統趨向更高的速度時，需效更有力且更 高的穩定性。在此變遷部分，在半導體元件之構件封裝中 使用高效能陶瓷介電材質變得十分普遍。特別是，需要使 用具有愈來愈多層氧化矽的陶瓷基材，當適當地與其他陶 资氧化物結合’可形成低介電係數材料，藉以降低在電子 電路系統中的傳遞延遲。不像傳統的高礬土陶資，這些陶 竞基材具有較低的強度’並且可能會在焊接時因施加荷重 而破碎。 一般這些高效能陶瓷為低溫共火陶资玄分 ^ 、八岡之系統，使用銀或 銅為導體。這些高效能陶資包括跟低軟化點玻璃結合之霖 土’以及玻璃陶资系統。不像南溫共火系较 ^ 尔统，這些陶資及 金屬之間的C T E差異經常很南。例如，大却 、 入邵分這些陶瓷具 第4頁 本紙張尺度適用中國國家標準(CNS)A4規格(210Χ 297公釐) .........—f—‘：裝…......訂·……ί線 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 498024 A7 _______B7 _ 五、發明説明（） 有CTE低於6ppm，而銀與銅的CTE分別為20與17ppm。 欲共火在這些在低CTE陶瓷表面上且高金屬含量之表面 外形，經常會導致陶瓷與表面外形之間形成弱的介面，在 製程或使用之熱循環期間造成分離。 然後，在共火期間，只有藉由加入大量的低CTE補 償填充材料，這些金屬會跟陶瓷結合，形成高強度接合， 通常使用相同的陶瓷：或玻璃以產生介電層。這個在表面外 形中的非導電填充材料對導電性外形會具有嚴格的衝 擊，並且由於襯墊的非導電性部分通常將不會跟傳統的黏 貼槽貼合，在製作用於著陸柵陣列（LGA)，或是使用CBGA 或CCGA焊接附著之容易黏貼的表面外形時，會造成極大 的困難。 由於大CTE不匹配，在熱循環期間，使用高金屬含 量之表面外形通常會對底下的陶瓷造成嚴重的應力。由於 高效能陶瓷不像高溫過火礬土一樣堅固，會有造成陶瓷破 裂的傾向，最後導致表面外形下的電性連接失敗。 高金屬表面外形與底下的陶瓷材質之間缺乏附著性 已經是其他人所公認。例如，在Yokoyama et al.美國專 利第 5,549,778 號以及 Herron et al. IBM Technical Disclosure Bulletin，2i，No. 8，page 4765 (January 1 985) 之中，此後附加並參照其揭露，提出虛擬介層窗（dummy vias)，藉以支撐表面外形至底下的陶瓷。這些虛擬介層窗 不具功能，並且很少對表面外形之支撐提供機械性的幫 助。 第5頁 本紙張尺度適用中國國家標準(CNS)A4規格(21〇χ 297公楚） .........J: VI -裝........訂：.Γ ·.>:線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 498024 A7 B7 _ 五、發明説明（） 因此需要一種改進的方法去支撐表面外形，提供加強 的電性與機械穩定性。 在參照下列敘述並配合相關圖示之後’本發明的這些 及其他特徵將更加顯而易見。 發明目的及概述： 依照本發明之第一態樣，揭示一種具有支撐於内部之 墊的多層陶瓷基材，至少包括： 第一陶瓷層，具有複數個填入介層窗，以及外部表 面； 至少一外部襯蟄，鄰接於第一陶资層之外部表面，外 部襯墊附著於第一陶瓷層之填入介層窗； 第二陶瓷層，鄰接於第一陶瓷層，具有至少一填入介 層窗，與第一陶瓷層之填入介層窗連接；以及 至少一内部襯塾，介於第一陶瓷層與第二陶瓷層之 間，跟第一陶瓷層中的填入介層窗連接，在第一陶瓷層之 每一填入介層窗跟在第二陶瓷層之介層窗或内部襯螯連 依照本發明之第二態樣，揭示一種具有支撐於内部之 墊的多層陶瓷基材，至少包括： 第一陶瓷層，具有填入介層窗以及外部表面； 外部襯塾，鄰接於第一陶资層之外部表面’外部襯塾 附著於至少一填入介層窗； 第二陶瓷層，鄰接於第一陶瓷層，具有至少一填入介 第6頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐） .........卜：一·裝........訂 線 (請先閲讀背面之注意事項再填寫本頁)498024 V. Description of the invention () The stability of the electrical connection between the ceramic substrate and the circuit board is affected by many parameters, including the CTE difference between the ceramic substrate and the circuit board, the stiffness of the two, and the soldering array. Dimensions and welding height. During thermal cycling, the board expands and contracts more than the ceramic substrate. This change causes a large strain on the soldering between the circuit board and the ceramic substrate. The largest strain occurs at the peripheral connection of the bonding array, and the smallest is at the center. Repeated thermal cycling eventually fatigued and damaged the solder, and caused a break in the circuit between the ceramic substrate and the circuit board. In general, the longer the welding column, the greater the resistance to welding fatigue. Under the same conditions, CCGA can withstand more fatigued thermal cycles than CBGA. However, the demand of CCGA is lower than CBgA, because CCGA is easily damaged during processing, and the increased welding length increases inductance. , And will reduce electrical performance. As information processing systems move towards higher speeds, they need to be more powerful and more stable. In this transition, the use of high-performance ceramic dielectric materials in the packaging of semiconductor components has become very common. In particular, it is necessary to use a ceramic substrate having more and more layers of silicon oxide, which, when properly combined with other ceramic oxides', can form a low dielectric constant material, thereby reducing the propagation delay in electronic circuit systems. Unlike traditional high alumina ceramics, these ceramic substrates have a lower strength ' and may break due to the load applied during welding. Generally, these high-performance ceramics are systems of low-temperature co-fired ceramic materials, Hachioka, and silver or copper as conductors. These high-performance ceramic materials include Lin's clay combined with low softening point glass and glass ceramic materials systems. Unlike the South-Western Communist fire system, the C T E difference between these ceramics and metals is often very south. For example, these ceramics from Daque, Shaofen, etc. Page 4 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) .........— f— ': installed ... .... Order · …… Line (Please read the notes on the back before filling out this page) Printed by the Employees 'Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Employees' Cooperative of the Ministry of Economics and Intellectual Property Bureau Printed by 498024 A7 _______B7 _ V. Invention Note () CTE is below 6ppm, while CTE for silver and copper is 20 and 17ppm, respectively. The desire to co-fire on these low CTE ceramic surfaces and high metal content often results in a weak interface between the ceramic and the surface profile, causing separation during the thermal cycle of the process or use. Then, during the common fire, only by adding a large amount of low CTE to compensate the filler material, these metals will combine with the ceramic to form a high-strength joint, usually the same ceramic: or glass is used to create the dielectric layer. This non-conductive filling material in the surface shape will have a severe impact on the conductive shape, and because the non-conductive part of the pad will usually not fit with the traditional adhesive groove, it is being used in the landing grid array (LGA). ), Or when using CBGA or CCGA to weld the easily adhered surface profile, it will cause great difficulties. Due to large CTE mismatches, the use of high metal content surface profiles during thermal cycling will often cause severe stress to the underlying ceramic. Because high-performance ceramics are not as strong as high-temperature over-fired alumina, they tend to cause the ceramics to crack, and eventually cause the electrical connection under the surface profile to fail. The lack of adhesion between the high metal surface profile and the underlying ceramic material has been recognized by others. For example, in Yokoyama et al. U.S. Patent No. 5,549,778 and Herron et al. IBM Technical Disclosure Bulletin, 2i, No. 8, page 4765 (January 1 985), a virtual interlayer window is proposed and referred to thereafter (Dummy vias) to support the surface profile to the bottom ceramic. These virtual interlayer windows are not functional and rarely provide mechanical assistance in supporting surface contours. Page 5 This paper size is applicable to China National Standard (CNS) A4 (21〇χ 297 公 楚) ......... J: VI -Packing ........ Order: .Γ · . >: (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 498024 A7 B7 _ 5. Description of the invention () Therefore, an improved method is needed to support the surface shape and provide Enhanced electrical and mechanical stability. These and other features of the present invention will become more apparent upon reference to the following description and associated drawings. Object and Summary of the Invention: According to a first aspect of the present invention, a multilayer ceramic substrate having a pad supported on the inside is disclosed, including at least: a first ceramic layer having a plurality of filled interlayer windows, and an external surface; at least An outer liner is adjacent to the outer surface of the first ceramic layer, and the outer liner is attached to the filling interlayer window of the first ceramic layer; the second ceramic layer is adjacent to the first ceramic layer and has at least one filling interlayer The layer window is connected to the filled interlayer window of the first ceramic layer; and at least one internal lining is interposed between the first ceramic layer and the second ceramic layer and is connected to the filled interlayer window in the first ceramic layer. According to the second aspect of the present invention, a multi-layered ceramic substrate having a pad supported on the inside is disclosed by filling the interlayer window in each of the first ceramic layers with the interlayer window or the inner lining of the second ceramic layer. The material includes at least: a first ceramic layer having an infill interstitial window and an external surface; an outer liner adjacent to the outer surface of the first ceramic layer; the outer liner is attached to at least one infill interstitial window; the second Ceramic layer adjacent to the first Porcelain layer, with at least one fill-in page. This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) ......... b: one .... .Order (please read the notes on the back before filling this page)
五、發明説明（） 層窗，跟第一陶瓷層之填入介層窗連接； (請先閲讀背面之注意事項再填寫本頁) 内邵襯墊，介於第一陶瓷層與第二陶瓷層之間，並且 跟第一陶瓷層與第二陶瓷層的填入介層窗連接； 其中在第一陶瓷層之介層窗大於在第二陶瓷層之剖 面區域，並且第一陶瓷層厚於第二陶瓷層。 依照本發明之第三態樣，揭示一種具有支撐於内部之 墊的多層陶瓷基材，至少包括： 第一陶资層’具有複數個填入介層窗，以及外部表 面； 第二陶瓷層，鄰接於第一陶瓷層，並且具有至少一填 入介層窗； 至少一内部襯墊，介於第一陶瓷層與第二陶瓷層之 間，並且跟在第一陶瓷層之複數個填入介層窗以及在第二 陶资層之至少一填入介層窗連接； 複數個介層窗柱，從第一陶瓷層之外部表面延伸，介 層窗柱跟第一陶瓷層之填入介層窗連接；以及 至少一襯墊，附著於介層窗柱。 經濟部智慧財產局員工消費合作社印製 依照本發明之第四態樣，揭示一種具有支撐於内部之 誓的多層陶資;基材，至少包括： 陶瓷層，具有至少一填入介層窗，以及外部表面； 内部襯墊，附著於第一陶瓷層之外部表面，並且與在 第一陶資層之至少一填入介層窗連接； 複數個介層窗柱，從内部襯墊延伸；以及 外部襯墊，附著於複數個介層窗拄。 第7頁 本紙張尺度適用中國國家標準(CNS)A4規格(210x 297公楚) A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（） 依照本發明之第五態樣，揭示一種具有支撐於内部之 塾的多層陶竞基材的形成方法，該方法至少包括下列步 驟： 形成第一陶瓷生胚片，具有複數個介層窗； 在至少一介層窗内屏蔽形成金屬導電糊材質，根據導 電糊材質之固體含量，金屬導電糊材質包括至少容積百分 之80之金屬材質，剩餘為陶瓷材質； 在第一陶瓷生胚片上屏蔽形成金屬導電糊材質以形 成一 I/O襯墊，根據導電糊材質之固體含量，金屬導電糊 材質包括至少容積百分之80之金屬材質，剩餘為陶资材 質； 形成第二陶瓷生胚片，具有至少一介層窗； 在第二陶瓷生胚片之至少一介層窗内屏蔽形成金屬 導電糊材質，根據導電糊材質之固體含量，金屬導電糊材 質包括容積百分之30至70之金屬材質，剩餘為陶资材 質； 在第一或第二陶瓷生胚片上屏蔽形成金屬導電糊材 質以形成内部I/O襯墊，根據導電糊材質之固體含量，金 屬導電糊材質包括容積百分之30至70之金屬材質，剩餘 為陶瓷材質； 堆疊第一與第二生胚片以形成未燒結之多層陶瓷基 材，其中I/O襯墊在未燒結之多層陶驚基材的外部，内部 襯墊介於第一與第二陶瓷生胚片之間，並且在第一陶瓷生 胚片之每一介層窗跟在第二陶資生胚片之介層窗或内部 第8頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公楚) ..........裝........訂：：.：<:線 (請先閲讀背面之注意事項再填寫本頁) 五 經濟部智慧財產局員工消費合作社印製 A7 ^_________B7 ________________ 發明說明（） 接觸襯墊連接；以及 對未燒結之多層陶瓷基材進行燒結，形成燒結之多層 陶資基材，燒結之多層陶瓷基材具有I/O襯墊，附著於第 一陶瓷層之至少一介層窗，但是並不附著於多層陶瓷基材 之陶瓷材質。 依照本發明之第六態樣，揭示一種具有支撐於内部之 勢的多層陶瓷基材的形成方法，該方法至少包括下列步 驟： 形成第一陶瓷生胚片，具有至少一介層窗，第一陶瓷 生胚片包括陶瓷材質，選擇陶瓷材質，使其在多層陶瓷基 材之預定燒結溫度下不會燒結； 在第一陶瓷生胚片之至少一介層窗内屏蔽形成一金 屬導電糊材質，根據導電糊材質之固體含量，金屬導電糊 材質包括至少容積百分之80之金屬材質，剩餘為陶资材 質； 在第一陶瓷生胚片上屏蔽形成金屬導電糊材質以形 成外部襯墊，根據導電糊材質之固體含量，金屬導電糊材 質包括至少容積百分之80之金屬材質，剩餘為陶瓷材質； 形成第二陶瓷生胚片，具有至少一介層窗； 在第二陶瓷生胚片之至少一介層窗内屏蔽形成金屬 導電糊材質，根據導電糊材質之固體含量，金屬導電糊材 質包括容積百分之30至70之金屬材質，剩餘為陶瓷材 質； 形成第三陶瓷生胚片，第三陶瓷生胚片具有至少一介 第9頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) . *裝 訂— --------線 (請先閲讀背面之注意事項再填寫本頁) 498024 A7 B7 五、發明説明（） 層窗； (請先閲讀背面之注意事項再填寫本頁) 在第三陶瓷生胚片之至少一介層窗内屏蔽形成金屬 導電糊材質，根據導電糊材質之固體含量，金屬導電糊材 質包括容積百分之3〇至70之金屬材質，剩餘為陶瓷材 質； 在第二或第三陶瓷生胚片上屏蔽形成金屬導電糊材 質以形成内部襯墊，根據導電糊材質之固體含量，金屬導 電糊材質包括容積百分之30至70之金屬材質，剩餘為陶 瓷材質； 堆疊第一、第二與第三陶瓷生胚片以形成未燒結之多 層陶瓷基材’其中外部襯墊在未燒結之多層陶瓷基材的外 部’並且内部槪塾介於第二與第三陶堯生胚片之間；以及 在預定溫度下燒結此未燒結之多層陶瓷基材，當第二 與第三陶瓷生胚片燒結時，第一陶瓷生胚片並未燒結； 在第一陶資生胚片燒結之前，移除未燒結之陶资材 質，留下第一陶瓷生胚片之至少一介層窗，使得燒結之多 層陶瓷基材具有襯墊，只附著於第一陶瓷生胚片之至少一 介層窗，並且跟多層陶瓷基材之陶瓷材質分隔。 經濟部智慧財產局員工消費合作社印製 依照本發明之第七態樣，揭示一種具有支撐於内部之 墊的多層陶瓷基材的形成方法，該方法至少包括下列步 驟·· 形成第一陶瓷生胚片，第一陶瓷生胚片具有至少一介 層窗，第一陶瓷生胚片包括有陶瓷材質，選擇陶瓷材質， 使其在多層陶瓷基材之預定燒結溫度下不會燒結； 第10貫 498024 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（） 在第一陶瓷生胚片之至少一介層窗内屏蔽形成金屬 導電糊材質，根據導電糊材質之固體含量，金屬導電糊材 質包括至少容積百分之80之金屬材質，剩餘為陶瓷材質； 在第一陶瓷生胚片上屏蔽形成金屬導電糊材質以形 成外部襯墊，根據導電糊材質之固體含量，金屬導電糊材 質包括至少容積百分之80之金屬材質，剩餘為陶瓷材質； 形成第二陶瓷生胚片，第二陶瓷生胚片具有至少一介 層窗； 在第二陶瓷生胚片之至少一 +層窗内屏蔽形成金屬 導電糊材質，根據導電糊材質之固體含量，金屬導電糊材 質包括容積百分之30至70之金屬材質，剩餘為陶瓷材 質； 在第二陶瓷生胚片之至少一介層窗内屏蔽形成一金 屬導電糊材質，根據導電糊材質之固體含量，金屬導電糊 材質包括容積百分之30至7〇之金屬材質，剩餘為陶瓷材 質； 在第一或第二陶瓷生胚片上屏蔽形成金屬導電糊材 質以形成内部襯墊，根據導電糊材質之固體含量，金屬導 電糊材質包括容積百分之30至70之金屬材質，剩餘為陶 瓷材質； 堆疊第一與第二陶瓷生胚片以形成未燒結之多層陶 瓷基材，其中外部I/O襯墊在未燒結之多層陶瓷基材的外 部，並且内部襯墊介於第一與第二陶瓷生胚片之間；以及 在預定溫度下燒結該未燒結之多層陶瓷基材’當第二 ___ 第11頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐） ..........r 裝···......訂：：··卜-線 (請先閲讀背面之注意事項再填寫本頁) 498024 五、發明説明（） 陶瓷生胚片燒結時，第一 陶瓷生胚片並未燒結；在第一陶瓷生胚片燐，士、义疋〜夂則，移除未燒結之陶资 質，留下第一陶瓷生胚片 之材 <至y —介層窗，使得燒結 層陶瓷基材具有襯墊，^ a ^ /、附耆於第一陶瓷生胚片之至少— 介層窗，並且跟多層喻次计 5 毫基材之内部襯墊與陶瓷材質分 隔0 圖式簡單說明: 本發明之特色具新# /、f生’並且本發明之特徵構件個 在附加申請項中提出。A 、、了突顯本發明之目的，圖示未依 原尺寸繪圖。然而，發明士 J本身之操作方法及結構將配合附 加圖示，在下列敘述中進 下延仃_細的說明。 第1圖為本發明之第_眘 I施例，以及第一實施例的製作方 法0 第2圖為本發明之第二實 法0 施例，以及第二實施例的製作方 ..........r-L-裝：·......訂線 (請先閲讀背面之注意事项再填寫本頁} 經濟部智慧財產局員工消費合作社印製 第3圖為本發明之第三實施例，以及第三實施例的製作方 法。 第4圖為本發明之第四實施例，以及第四實施例的製作方 法。 第5圖為本發明之第五實施例，以及第五實施例的製作方 法。 第6圖為本發明之第六實施例，以及第六實施例的製作方 法0 本紙張尺度適用中國國家標準(CNs)A4規格(210X297公釐) 498024 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（） 第7圖為本發明之第七實施例，以及第七實施例的製作方 法。 圖號對照說明z 10 第一生胚片 11 漸細末端 12 介層窗 14 金屬導電糊 15 末端 16 表面襯塾 17 外部表面 19 背面侧 20 第二生胚片 22 介層窗 24 内部襯塾 30 生胚片層 32 介層窗 34 陶瓷層 36 開口 40 生胚片疊片 50 生胚片疊片 110 第一生胚片 112 介層窗 114 介層窗 116 表面襯整 117 外部表面 119 背面表面 120 第二生胚片 122 介層窗 124 襯塾 130 介電層 132 介層窗 134 生胚片層 136 開口區域 140 生胚片疊片 150 生胚片疊片 210 第一生胚片 212 介層窗 216 表面襯整 219 側邊 220 第二生胚片 222 介層窗 第13頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) ........w—,, 1——· — —......酣 — $ (請先閲讀背面之注意事項再填寫本頁) 498024 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（） 224 襯墊 230 生胚片層 234 開口區域 240 生胚片疊片 242 多層陶瓷基材 250 生胚片疊片 252 多層陶瓷基材 310 第一層 314 介層窗 316 外部襯塾 320 第二層 322 介廣窗 324 内部襯墊 330 選擇層 332 介層窗 340 多層陶瓷基材 發明諜細說明： 本發明之發明者發展出一種冶金結構，設計出可以改 進表面固定外形（如襯塾）之機械穩定性，以及更重要的電 性穩定性，表面固定外形用於連接陶瓷基材中的電路至另 一元件。此連接一般在低溫焊接執行，但是也可能使用加 壓式接觸，比如是以LAG插槽。 此新穎的冶金結構提供許多對形成高穩定性連接之 關鍵性的功能。首先，提供一種附著複數個導電性表面外 形至陶瓷的方法，至於其他方法未必能穩定地附著於陶 瓷。例如，由於陶瓷與表面外形冶金之間大的CTE差異導 致的應力，且或因貼合製程而造成之非常高的應力，會造 成在加熱及冷卻循環以及使用期間，表面外形由陶資而分 離’或甚至在接合部分碎裂陶瓷。本發明提出之結構隔離 這些從陶瓷表面層的應力，並且轉移到下面可以耐得住的 第14頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐)'~ ..........I::丨裝…......訂…丨…丨丨線 (請先閲讀背面之注意事項再填寫本頁) B7 五、發明說明（） 層。 (請先閲讀背面之注意事項再填寫本頁) 其’入，此結構在表面外形與陶资基材中的冶金外形之 間提供高度可撓的電性連接，並且更進一步提供額外過多 的電性連接到表面外形，改進陶瓷封裝的電性穩定性，陶 資封裳一般使用焊接接合至CTE甚大於陶瓷之印刷電路 板。在焊接固定陶瓷基材至印刷電路板之後，循環地開啟 及關閉電能，意欲配裝反覆地熱循環，藉以模擬在實際使 用狀況所遇到的應力，此結構之電性穩定性效能優於任何 只有根據CTE之評估。 第三’本發明之冶金結構亦提供更堅固的製程用於連 接陶瓷基材至電路板，其使用焊接球高度，一般是需要使 用烊接柱用於改進熱循環穩定性。此允許較低電感焊接球 用於高效能封裝需求。 最後，本發明之冶金結構允許使用高導電性金屬成 分’其容易貼合，藉以提供使用傳統貼合化學成分之高金 屬含量（至100%)表面外形。這些高金屬表面外形允許完整 的焊接可濕性，用於改進焊接接合穩定性，以及電流負載 容量。 經濟部智慧財產局員工消費合作社印製 更詳細的說明請參照圖示，且特別參照第1圖，其繪 示本發明之第一實施例。如第1A圖所示，在第一生胚片 (greens he et)10中設置複數個介層窗12 通常排列這些介 層窗12，藉以使這些介層窗12適合於隨後的表面外形區 域，或是襯墊，如此處所示。一般這些介層窗約在50與 150微米之間，用在稱為輸入/輸出（I/O)，襯墊直徑趨近於 第15頁 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐) A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（） 850微米’用在50密爾（mil)設立之CBGA的焊接連接。 介層窗末端的形狀很重要，因為隨後填入介層窗的厚層薄 膜導電糊提供導電性介層窗之機械支撐以及電性連接，至 第二内部厚層薄膜襯墊。至少需要使用雷射鑽孔製程或是 其他鑽孔製程獲得垂直的側壁，因為其將集中只有從介層 窗與内部襯墊介面之介層窗延伸而來的應變。 理想是在介層窗末端的内側逐漸變細，增加介層窗與 内部襯蟄之間的接觸面積，其將被燒結。因此，介層窗1 2 之漸細末端1 1大於介層窗1 2之末端1 5。此漸細孔洞一般 在第一生肱片1 〇之機械性打洞期間製成。 如第1 B圖所示，使用金屬導電糊1 4填滿介層窗1 2， 金屬導電糊14較佳是使用高金屬含量，以提供高導電性 與延展性。 較佳的金屬是銅，鎳、銅、銀以及其他類似的合金亦 可使用。介層窗與表面襯塾之金屬含量至少必須佔容積 80%，較佳是1〇〇。/。。必須了解的是，依據導電糊之固體含 量’咼金屬含量導電糊必須是金屬容積8 〇到1 〇 〇 〇/0。 然後，如第1B圖所示，在第一生胚片丨〇之外部表面 17遮蔽形成表面襯塾16。表面襯塾16之尺寸設計依辟需 要的I/O襯墊在表面上燒結後的尺寸。 接著’如第1C圖所示’亦將第二生胚片2〇打洞及使 用金屬導電糊填滿’以形成填滿金屬之介層窗22。在第-生胚片20上遮蔽形成内部襯墊24。必須了解的是，内部 襯墊24必須容易被遮蔽在第一生胚片1〇的背面側19。金 ..........裝…......訂………線 (請先閲讀背面之注意事項再填寫本頁) 第16頁V. Description of the invention () The layer window is connected to the interstitial window filled with the first ceramic layer; (Please read the precautions on the back before filling this page) The inner Shao pad is between the first ceramic layer and the second ceramic Between the first ceramic layer and the filled interlayer window of the first ceramic layer and the second ceramic layer; wherein the interlayer window in the first ceramic layer is larger than the cross-sectional area of the second ceramic layer, and the first ceramic layer is thicker than Second ceramic layer. According to a third aspect of the present invention, a multilayer ceramic substrate having a pad supported on the inside is disclosed, including at least: a first ceramic material layer having a plurality of filled interlayer windows, and an external surface; a second ceramic layer, Adjacent to the first ceramic layer and having at least one filled interposer window; at least one internal gasket interposed between the first ceramic layer and the second ceramic layer and following the plurality of filled interposers of the first ceramic layer The layer window and at least one filling interlayer window connection in the second ceramic material layer; a plurality of interlayer window posts extending from the outer surface of the first ceramic layer, and the interlayer window post and the first ceramic layer filling interlayer Window connection; and at least one gasket attached to the interlayer window post. The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed a fourth aspect of the present invention to reveal a multilayer ceramic material with an oath supported inside; the substrate includes at least: a ceramic layer with at least one interstitial window, And an external surface; an internal pad attached to the external surface of the first ceramic layer and connected to at least one infill window in the first ceramic layer; a plurality of interlayer window posts extending from the internal pad; and An external pad is attached to a plurality of interlayer windows. Page 7 This paper size applies the Chinese National Standard (CNS) A4 specification (210x 297 Gongchu) A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () According to the fifth aspect of the invention, a kind of A method for forming a multi-layer ceramic substrate with a support supported on the inside. The method includes at least the following steps: forming a first ceramic green sheet with a plurality of interlayer windows; shielding and forming a metal conductive paste material in at least one interlayer window; The solid content of the conductive paste material. The metal conductive paste material includes at least 80% of the volume of the metal material and the remainder is a ceramic material. The first ceramic green sheet is shielded to form a metal conductive paste material to form an I / O pad. The solid content of the conductive paste material. The metallic conductive paste material includes a metal material with a volume of at least 80%, and the remainder is a ceramic material. A second ceramic green sheet is formed with at least one interlayer window. At least one interlayer window is shielded to form a metal conductive paste material. According to the solid content of the conductive paste material, the metal conductive paste material includes a volume. 30 to 70% of the metal material, the rest is ceramic material; the first or second ceramic green sheet is shielded to form a metal conductive paste material to form an internal I / O pad. According to the solid content of the conductive paste material, the metal is conductive Paste materials include metal materials with a volume of 30 to 70 percent, and the rest are ceramic materials; stacking the first and second green slabs to form an unsintered multilayer ceramic substrate, wherein the I / O pad is in an unsintered multilayer ceramic On the outside of the substrate, an internal liner is interposed between the first and second ceramic green sheets, and each interlayer window of the first ceramic green sheet follows the internal window or interior of the second ceramic green sheet. Page 8 This paper size is applicable to China National Standard (CNS) A4 specification (210X297 Gongchu) .......... packing ........ Order::.: ≪: line (please Read the notes on the back before filling this page.) A7 printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ^ _________ B7 ________________ Description of the invention () Contact pad connection; and sintering the unsintered multilayer ceramic substrate to form a sintered Multi-layer ceramic substrate, sintered multi-layer ceramic substrate I / O pads, at least a dielectric layer is adhered to the window of the first ceramic layer, but is not attached to the multilayer ceramic substrate of the ceramic material. According to a sixth aspect of the present invention, a method for forming a multilayer ceramic substrate having a potential to be supported inside is disclosed. The method includes at least the following steps: forming a first ceramic green sheet with at least one interlayer window, and a first ceramic The green sheet includes a ceramic material. The ceramic material is selected so that it does not sinter at a predetermined sintering temperature of the multilayer ceramic substrate. A metal conductive paste material is shielded in at least one interlayer window of the first ceramic green sheet. The solid content of the paste material, the metal conductive paste material includes at least 80% of the volume of the metal material, and the remainder is a ceramic material; the first ceramic green sheet is shielded to form a metal conductive paste material to form an external pad, according to the conductive paste material The solid content of the metal conductive paste material includes at least 80% of the volume of the metal material, and the remainder is a ceramic material; forming a second ceramic green sheet with at least one interlayer window; at least one interlayer window in the second ceramic green sheet The inner shield forms a metal conductive paste material. According to the solid content of the conductive paste material, the metal conductive paste material includes a volume of one hundred 30 to 70 of the metal material, the remaining is ceramic material; forming the third ceramic green sheet, the third ceramic green sheet has at least one page9 This paper is applicable to China National Standard (CNS) A4 specification (210X297 mm) * Binding — -------- Line (please read the notes on the back before filling this page) 498024 A7 B7 V. Description of the invention () Layer window; (Please read the notes on the back before filling this page ) A metal conductive paste material is formed by shielding in at least one interlayer window of the third ceramic green sheet. According to the solid content of the conductive paste material, the metal conductive paste material includes a metal material with a volume of 30 to 70 percent, and the rest is a ceramic material. ; The second or third ceramic green sheet is shielded to form a metal conductive paste material to form an internal pad. According to the solid content of the conductive paste material, the metal conductive paste material includes a metal material with a volume of 30 to 70 percent, and the rest is ceramic. Material; stacking the first, second and third ceramic green sheets to form an unsintered multilayer ceramic substrate 'wherein the outer liner is on the outside of the unsintered multilayer ceramic substrate' and the inside is between Between the second and third ceramic green sheets; and sintering the unsintered multilayer ceramic substrate at a predetermined temperature, when the second and third ceramic green sheets are sintered, the first ceramic green sheets are not sintered; Before the first ceramic green sheet is sintered, the unsintered ceramic material is removed, leaving at least one interlayer window of the first ceramic green sheet, so that the sintered multilayer ceramic substrate has a pad and is only attached to the first ceramic At least one interlayer window of the green sheet is separated from the ceramic material of the multilayer ceramic substrate. The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed in accordance with the seventh aspect of the present invention, discloses a method for forming a multilayer ceramic substrate with a pad supported on the inside. The method includes at least the following steps ... Sheet, the first ceramic green sheet has at least one interlayer window, the first ceramic green sheet includes ceramic material, the ceramic material is selected so that it will not sinter at the predetermined sintering temperature of the multilayer ceramic substrate; Printed by the Consumers ’Cooperative of the Ministry of Intellectual Property Bureau A7 B7 V. Description of the invention () The metal conductive paste material is formed by shielding in at least one interlayer window of the first ceramic green sheet. According to the solid content of the conductive paste material, the metal conductive paste material includes The metal material with a volume of at least 80 percent, and the remainder being a ceramic material; the first ceramic green sheet is shielded to form a metal conductive paste material to form an external pad. According to the solid content of the conductive paste material, the metal conductive paste material includes at least 100 80% of the metal material, the rest is ceramic material; forming a second ceramic green sheet, the second ceramic green embryo It has at least one interlayer window; shielded to form a metal conductive paste material in at least one + layer window of the second ceramic green sheet. According to the solid content of the conductive paste material, the metal conductive paste material includes a metal material with a volume of 30 to 70 percent. The remainder is made of ceramic material; a metal conductive paste material is formed by shielding in at least one interlayer window of the second ceramic green sheet. According to the solid content of the conductive paste material, the metal conductive paste material includes a metal with a volume of 30 to 70 percent. The remaining material is a ceramic material. The first or second ceramic green sheet is shielded to form a metal conductive paste material to form an internal pad. According to the solid content of the conductive paste material, the metal conductive paste material includes a volume of 30 to 70 percent by volume. Metal material, the rest is ceramic material; the first and second ceramic green sheets are stacked to form an unsintered multilayer ceramic substrate, wherein the external I / O pad is on the outside of the unsintered multilayer ceramic substrate, and the inner pad is Between the first and second ceramic green sheets; and sintering the unsintered multilayer ceramic substrate at a predetermined temperature 'as a second ___ page 11 Paper size applies to China National Standard (CNS) A4 specification (210X 297 mm) .......... r Packing ··· ...... Order :: ·· Bu-line (Please read first Note on the back, please fill out this page again) 498024 V. Description of the invention () The first ceramic green sheet is not sintered when the ceramic green sheet is sintered; Remove the unsintered ceramic qualification, leaving the material of the first ceramic green sheet < to y-interlayer window, so that the sintered ceramic substrate has a pad, ^ a ^ /, attached to the first ceramic green sheet At least of the film — the interlayer window, and the inner liner of the substrate with a multilayer material 5 millimeters separated from the ceramic material 0 simple illustration: the features of the present invention are new # / ， 生生 'and the characteristic components of the present invention Were filed in additional applications. A. The purpose of the present invention is highlighted, and the drawings are not drawn to the original size. However, the operation method and structure of the inventor J will be accompanied by additional drawings, and detailed descriptions will be given in the following description. Fig. 1 is the _shen I embodiment of the present invention, and the manufacturing method of the first embodiment 0 Fig. 2 is the second embodiment of the present invention 0 embodiment, and the producer of the second embodiment ... ...... rL-pack: · ...... Order (please read the notes on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Three embodiments, and a manufacturing method of the third embodiment. FIG. 4 is a fourth embodiment of the present invention, and a manufacturing method of the fourth embodiment. FIG. 5 is a fifth embodiment of the present invention, and a fifth implementation. Figure 6 shows the sixth embodiment of the present invention, and the method of manufacturing the sixth embodiment. 0 This paper size applies the Chinese National Standard (CNs) A4 specification (210X297 mm) 498024 Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the consumer cooperative A7 B7 V. Description of the invention (7) Figure 7 shows the seventh embodiment of the present invention and the manufacturing method of the seventh embodiment. Layer window 14 Metal conductive paste 15 End 16 Surface lining 17 External surface 19 Back 20 Second green sheet 22 Interlayer window 24 Internal lining 30 Green sheet layer 32 Green window 34 Ceramic layer 36 Opening 40 Green sheet stack 50 Green sheet stack 110 First green sheet 112 Interlayer window 114 Via window 116 Surface finish 117 External surface 119 Back surface 120 Second green sheet 122 Via window 124 Liner 130 Dielectric layer 132 Via window 134 Green sheet layer 136 Opening area 140 Green sheet stack 150 Green sheet stack 210 First green sheet 212 Intermediate window 216 Surface finish 219 Side edge 220 Second green sheet 222 Intermediate window Page 13 This paper applies Chinese National Standard (CNS) A4 (210X 297) (Mm) ........ w— ,, 1—— · — —... 酣 — $ (Please read the notes on the back before filling out this page) 498024 A7 B7 Intellectual Property of the Ministry of Economic Affairs Printed by the Bureau ’s Consumer Cooperatives 5. Description of the invention (224) Liner 230 Green sheet layer 234 Opening area 240 Green sheet stack 242 Multilayer ceramic substrate 250 Green sheet laminate 252 Multilayer ceramic substrate 310 First layer 314 Via window 316 External lining 320 Second layer 322 Via window 324 Internal padding 330 selection layer 332 interlayer window 340 multilayer ceramic substrate invention spy description: The inventor of the present invention developed a metallurgical structure, designed to improve the mechanical stability of the surface fixed shape (such as lining), and more important electrical Stability, surface-fixed shape is used to connect the circuit in the ceramic substrate to another component. This connection is typically performed at low temperature soldering, but pressurized contacts may also be used, such as in a LAG socket. This novel metallurgical structure provides many functions that are critical to forming a highly stable connection. First, a method for attaching a plurality of conductive surfaces to ceramics is provided, and other methods may not be able to adhere to ceramics stably. For example, stresses due to large CTE differences between ceramics and surface profile metallurgy, or very high stresses caused by the bonding process, can cause the surface profile to be separated by ceramic materials during heating and cooling cycles and during use 'Or even break the ceramic at the joint. The structure proposed by the present invention isolates these stresses from the ceramic surface layer and transfers it to the following, which can withstand the following page 14 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) '~ ... ..... I :: 丨 Installation ......... Order ... 丨 ... 丨 丨 Line (Please read the precautions on the back before filling this page) B7 V. Invention Description () layer. (Please read the precautions on the back before filling out this page.) This structure provides a highly flexible electrical connection between the surface profile and the metallurgical profile in the ceramic substrate, and further provides additional excess electricity. It is connected to the surface shape to improve the electrical stability of the ceramic package. Ceramic materials are usually soldered to a printed circuit board with a CTE that is much larger than ceramic. After welding and fixing the ceramic substrate to the printed circuit board, the power is turned on and off cyclically. It is intended to be equipped with repeated geothermal cycles to simulate the stress encountered in actual use. This structure has better electrical stability performance than any Assessed by CTE. Third, the metallurgical structure of the present invention also provides a more robust process for connecting ceramic substrates to circuit boards, which uses solder ball heights, and generally requires the use of brazed posts for improved thermal cycling stability. This allows lower inductance solder balls to be used for high-performance packaging needs. Finally, the metallurgical structure of the present invention allows the use of highly conductive metal components, which are easy to adhere, thereby providing a high metal content (up to 100%) surface profile using traditional bonding chemical components. These high metal surface profiles allow complete solder wettability for improved solder joint stability and current load capacity. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics For a more detailed description, please refer to the drawings, and in particular to FIG. 1, which shows the first embodiment of the present invention. As shown in FIG. 1A, a plurality of interstitial windows 12 are generally arranged in the first greens 10, and the interstitial windows 12 are generally arranged so that the interstitial windows 12 are suitable for the subsequent surface contour area. Or a pad, as shown here. Generally, these interlayer windows are between 50 and 150 microns, and are used as input / output (I / O). The diameter of the gasket is close to page 15. This paper is applicable to China National Standard (CNS) A4 (210x297). (Mm) A7 B7 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () 850 microns' used for soldering connection of CBGA established in 50 mils. The shape of the end of the via is important because the thick thin film conductive paste that is subsequently filled into the via provides the mechanical support and electrical connection of the conductive via to the second inner thick film liner. At least a laser drilling process or other drilling process is needed to obtain vertical sidewalls, as it will concentrate only strains that extend from the via window and the via window of the inner liner interface. Ideally, the inside of the end of the via window is tapered to increase the contact area between the via window and the inner liner, which will be sintered. Therefore, the tapered end 11 of the via window 12 is larger than the end 15 of the via window 12. This tapering hole is generally made during the mechanical punching of the first humerus plate 10. As shown in FIG. 1B, the interlayer window 12 is filled with the metal conductive paste 14 and the metal conductive paste 14 preferably uses a high metal content to provide high conductivity and ductility. The preferred metal is copper. Nickel, copper, silver and other similar alloys can also be used. The metal content of the interlayer window and the surface lining must occupy at least 80% of the volume, preferably 100. /. . It must be understood that, according to the solid content of the conductive paste, the metal content of the conductive paste, the conductive paste must have a metal volume of 80 to 100/0. Then, as shown in FIG. 1B, a surface liner 16 is formed by masking on the outer surface 17 of the first green sheet. The size of the surface liner 16 is determined based on the size of the required I / O pad after sintering on the surface. Next, "as shown in Fig. 1C", the second green sheet 20 is also punched and filled with a metal conductive paste "to form a metal-filled interlayer window 22. An inner liner 24 is formed on the first green sheet 20 by masking. It must be understood that the inner pad 24 must be easily shielded on the back side 19 of the first green shim 10. Gold .......... install ......... order ......... line (Please read the precautions on the back before filling this page) Page 16
A7A7
498024 五、發明説明（） 屬填滿介層窗22以及内部襯墊24用以提供對·陶免良好的 結合，因此導電糊之金屬成分係適當的比如容積到 7 0%，且較佳是容積40到50%，而其餘的係陶受材料，必 須了解的是，這些容積量是依據導電糊的固體含量，包括 黏合劑、可塑性加強劑以及其他導電糊之成分會在燒結期 間揮發。必須進一步了解的是，當提及導電糊之適度的金 屬成分，導電糊意即依據導電糊的固體含量平均具有金屬 容積30到70%，且較佳是40到50%。金屬亦較佳是銅， 但是亦可以是鎳、銅、銀以及類似的合金，。 在組裝的最後步驟是依序堆疊及壓合第一與第二生 胚片10與20，如第1D圖所示，藉以形成多層生胚片疊 片40’在®片40之外側具有表面觀塾16。内部襯塾24 鄰近於介層窗14，藉以提供對疊片40之介層窗的支撐。 在第一生胚片10的介層窗14必須對準在第二生胚片20 的介層窗22，以提供電性連續性。正常，至少會有額外的 生胚片層30(通常會有更多額外的生胚片層30)，其具有介 層窗32以完成生胚片疊片40。介層窗32通常以金屬容積 100%做成，為了電性連續性其會對準介層窗22。然後燒 結生胚片疊片40以形成多層陶瓷基材，如第1D圖所示。 值得重視的是，具有高金屬含量之表面襯塾16與介 層窗14並未完全地附著於多層陶瓷基材之陶瓷》具有高 陶瓷含量之襯墊24以及介層窗22可完全地附著於陶瓷。 表面襯墊16對多層陶瓷基材之附著及機械穩定性經由介 層窗14與内部襯墊24而完成。 第17頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) ..........•…：丨裝丨丨丨......訂丨……：線 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 498024 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（ 包多層陶資；基材之陶瓷最好是先前提到的高效 月匕低纖共火陶免。然而，必須了解的是，本發明適合於 所有考慮表面襯墊穩定性之陶資系統。 現在請參照第2圖’其纟會示本發明之第二實施例。本 發明（第一實施例近似於先前參照第1圖之本發明之第一 實施例，第二實施例更包括如第2〇圖所示之陶資層、4。 陶瓷層34具有至少一個開口 36，開口 ％對應於表面襯墊 16，但略小於表面襯墊16。在堆疊及壓合期間，開口 ％ 對準表面襯墊16,如第2E圖所示，形成多層生胚片疊片 50。取代形成陶資層34為不動層，可將其直接屏蔽在生 胚片疊片50上。陶瓷層34具有兩個目的。第一是在燒結 期間，陶瓷層3 4壓合及支撐表面襯墊丨6的邊緣至陶瓷。 第二是陶瓷層34在接合期間扮演焊接障礙物，控制焊料 的流動’並且使’焊料运離表面觀塾1 6的周圍。 現在请參照第3圖，其繪示本發明之第三實施例。請 參照弟3Α圖’首先形成第一生胚片11〇，第一生胚片Η。 具有介層窗112 ’填入高金屬含量（如金屬容積8〇1〇〇%) 導電糊，形成金屬填入介層窗114，如第3Β圖所示。在 第一生胚片110之外部表面117上屏蔽形成表面襯墊 116。第一生胚片110基本上近似於前述之第一生胚片 10 ° 接著，如第3C圖所示，亦對第二生胚片12〇進行打 洞，藉以形成介層窗，然後以金屬導電糊填滿，形成金屬 填入介層窗112，如第3D圖所示。當層11〇與12〇堆疊 第18頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) ..........I:裝.........訂：：：：，線 (請先閲讀背面之注意事項再填寫本頁) --------------B7 五、發明説明（） (請先閲讀背面之注意事項再填寫本頁) 在一起時，這些介層窗112對準在第一生胚片11()上之襯 塾116的位置，並且完全地附著於襯整116。選擇使用金 屬導電糊屏蔽形成介層窗122，藉以提供介層窗122對陶 瓷的良好結合。一般這些如前所述之適度成分之金屬化導 電糊。亦如第3D圖所示，在介層窗122上沉積襯墊124 ’ 其對準並捉住在第一生胚片120中的介層窗112。襯墊124 沉積在第一生胚片120上’亦可替代地沉積在第一生胚片 110的背部表面119。使用金屬導電糊屏蔽形成襯墊丨24, 同時對金屬填入介層窗122與第二生胚片之陶瓷提供良好 的結合以及電性穩連接性。一般這些亦為適度成分之金屬 化導電糊。 經濟部智慧財產局員工消費合作社印製 之後，堆疊及壓合金屬化之第一及第二生胚片110與 120，特別注意内部襯墊124對準在第一生胚片層丨1()中 的金屬化介層窗114，藉以形成多層生胚片疊片140,如 第3E圖所示。在此堆疊及壓合步驟期間，包括具有金屬 填入介層窗132(較佳是容積1〇〇%)之額外的介電層130, 其在陶瓷基材中提供導線。完全地壓合第一與第二生胚片 層110與120介層窗114、122以及襯墊116、124形成金 屬結構。高金屬含量襯墊116與介層窗114未緊密地附著 於陶瓷。然而，襯墊116經由高金屬含量介層窗114支撐 於内部襯塾124。適度高金屬含量之内部襯塾丨24良好結 合於陶瓷。因此，每一介層窗Π4提供内部襯墊124與外 部襯墊1 1 6之間多餘的電性及機械連接。 本發明之第四實施例如第4圖所示。在此實施例中 第19頁 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公楚)~ 睡 4 經濟部智慧財產局員工消費合作社印製 A7 --------Β7_ 發明説明（） 在壓合之前先將額外的陶瓷層134貼用於第一生胚片層 110之外部，在燒結之後，其有助於固定金屬襯墊124於 陶資：上。在第4Α至4F圖之製程相似於第3Α至3Ε圖。 準備額外的生胚片層1 3 4，在生胚片層1 3 4打洞或是切割 開口區域136其，對應於在第一生胚片層11〇上沉積之襯 墊U 6的位置。這些開口區域i 3 6略小於襯墊i丨6之直徑人 在壓合期間，生胚片層134之開口區域136對準在第一生 胚片層110之襯墊116，並且密封在陶瓷周邊之每一襯墊 Π 6之邊緣。在燒結期間，壓合層1 3 4並且連結襯墊1 1 6 的周邊至陶瓷，藉以改進襯墊11 6的附著。若有需要，層 134可使用可遮蔽形成之介電導電糊。 本發明之第五實施例係如第5圖繪示β如第5 A圖所 示，形成具有金屬填入介層窗212以及表面襯墊216之第 一生胚片層210。然後，形成具有金屬填入介層窗222以 及内部襯墊224之第二生胚片層220。可在第二生胚片層 220上形成内部襯墊224，或是此後討論的可替代地形成 在選擇性的生胚片層230上。金屬填入介層窗222以及表 面襯墊216具有高金屬含量，對陶瓷具有不良的附著性， 内部襯墊224具有適度的金屬含量，並且對陶瓷具有良好 的附著性。然後以選擇性額外的生胚片層230堆疊及壓合 第一與第二生胚片層210及220，生胚片層230具有金屬 填入介層窗，較佳是填入金屬容積100%，藉以形成多層 生胚片疊片240。然後在傳統的條件下燒結多層生胚片疊 片240。在燒結期間並未選擇用於第一生胚片層210之陶 第20頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) ..........-·丨…裝丨丨.......訂……：丨線 (請先閲讀背面之注意事項再填寫本頁) A7 B7 五、發明說明（） 资材料，因此其不會壓合。在纟士 〇/1, 乂…之後，形成多層陶瓷基 材242，精由使用不會損害金 ^ . a , 氟程，移除第一生 胚片層2 1 〇之陶瓷，比如是藉由 , 叫嗖9，皮，目除。殘留部分的 :具有開口區域234之介層窗212，為陶资材質使用之 f。〈後’貼合金屬外形，並且使用外部概塾216之暴露 表面接合烊料或是料柱，用在隨㈣電路卡或是其他 疋件之附著。再者，值得注意的是，表面椒誓216藉由介 層窗2U、220以及對陶資良好結合之内部襯支撐 於多層陶瓷基材242。 經濟部智慧財產局員工消費合作社印製 本發明之第六實施例係如第6圖所示，其中金屬表面 襯墊對陶资基材有良好的結合。首先，藉由打洞並且使用 高金屬導電糊填入介層窗形成金屬填入介層窗212以形成 生胚片層210。選擇第一生胚片層21〇之陶資，在燒結期 間其不會有任何的壓縮。然後，使用高金屬含量導電糊在 生胚片上形成襯墊216。在燒結之後，介層窗212與襯墊 216之金屬含量較佳是容積1〇〇%β對第二生胚片層打洞， 並且使用適度的金屬屏蔽形成金屬填入介層窗222，然後 在第二生胚片層220上屏蔽形成襯墊224。選擇襯替224 之金屬組成與陶瓷填充物，藉以在燒結之後提供襯塾224 對陶瓷之良好的結合。如第6B圖所示，可以在第二生胚 片層220上屏蔽形成襯墊224，或是可替代地在第一生胚 片層210之側邊219屏蔽形成。介層窗212與襯塾216使 用高金屬襯墊，燒結後密度大於90%。額外的金屬化生胚 片層230對準第一及第二生胚片層210與220，進行堆叠 第21頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 498024 A7 B7498024 V. Description of the invention () It fills the interstitial window 22 and the inner pad 24 to provide a good combination of anti-freeze, so the metal composition of the conductive paste is appropriate, such as 70% by volume, and is preferably The volume is 40 to 50%. For the rest of the ceramic materials, it must be understood that these volume amounts are based on the solid content of the conductive paste, including adhesives, plasticity enhancers, and other conductive paste components that will volatilize during sintering. It must be further understood that when referring to the moderate metal composition of the conductive paste, the conductive paste means an average metal volume of 30 to 70%, and preferably 40 to 50%, based on the solid content of the conductive paste. The metal is also preferably copper, but it can also be nickel, copper, silver, and similar alloys. In the final step of assembly, the first and second green slabs 10 and 20 are sequentially stacked and pressed, as shown in FIG. 1D, so as to form a multi-layer green slab stack 40 'having a surface view on the outer side of the ® sheet 40.塾 16. The inner liner 24 is adjacent to the interlayer window 14 to provide support for the interlayer window of the laminate 40. The vias 14 on the first green sheet 10 must be aligned with the vias 22 on the second green sheet 20 to provide electrical continuity. Normally, there will be at least an additional green sheet layer 30 (usually there will be more additional green sheet layers 30), which have an interlayer window 32 to complete the green sheet stack 40. The interlayer window 32 is usually made of 100% metal volume, and it is aligned with the interlayer window 22 for electrical continuity. The green sheet stack 40 is then fired to form a multilayer ceramic substrate, as shown in FIG. 1D. It is worth noting that the surface lining 16 and the interlayer window 14 with high metal content are not completely attached to the ceramic of the multilayer ceramic substrate. The liner 24 with high ceramic content and the interlayer window 22 can be completely attached to ceramics. The adhesion and mechanical stability of the surface pad 16 to the multilayer ceramic substrate is accomplished through the interlayer window 14 and the inner pad 24. Page 17 This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) .......... •…: 丨 丨 丨 丨 ...... Order 丨 ……: Line (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 498024 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs The previously mentioned high-efficiency low-fiber low-fibre co-fired ceramic is preferred. However, it must be understood that the present invention is suitable for all ceramic materials systems that consider the stability of surface pads. Now refer to Figure 2 ' A second embodiment of the present invention is shown. The first embodiment of the present invention is similar to the first embodiment of the present invention previously referred to FIG. 1, and the second embodiment further includes a ceramic layer as shown in FIG. 20, 4. The ceramic layer 34 has at least one opening 36, the opening% corresponds to the surface pad 16, but is slightly smaller than the surface pad 16. During stacking and pressing, the opening% is aligned with the surface pad 16, as shown in Figure 2E , Forming a multi-layer green germ sheet stack 50. Instead of forming the ceramic material layer 34 as a fixed layer, It is directly shielded on the green sheet lamination 50. The ceramic layer 34 serves two purposes. The first is that during the sintering, the ceramic layer 34 presses and supports the edge of the surface pad 6 to the ceramic. The second is the ceramic layer 34 acts as a soldering obstacle during joining, and controls the flow of solder 'and causes the solder to be transported away from the surface and around the surface 16. Referring now to FIG. 3, there is shown a third embodiment of the present invention. Please refer to 3A Figure 'Firstly, the first green germ piece 110 is formed, and the first green germ piece Η is formed. The interlayer window 112' is filled with a conductive paste having a high metal content (such as a metal volume of 8100%) to form a metal-filled interlayer. The window 114 is shown in FIG. 3B. A surface pad 116 is formed by shielding on the outer surface 117 of the first green slab 110. The first green slab 110 is substantially similar to the aforementioned first green slab 10 °. As shown in FIG. 3C, the second green sheet 120 is also punched to form a via, and then filled with a metal conductive paste to form a metal-filled via 112, as shown in FIG. 3D. When the layers 11 and 12 are stacked, page 18 This paper is in accordance with China National Standards (CNS) A4 specifications (21 0X297mm) .......... I: install ......... Order ::::, line (Please read the precautions on the back before filling this page) ---- ---------- B7 V. Description of the invention () (Please read the precautions on the back before filling in this page) When these together, these interlayer windows 112 are aligned with the first green embryo piece 11 () The upper lining 116 is completely attached to the lining 116. The metal conductive paste is selected to form the interlayer window 122 to provide a good combination of the interlayer window 122 and the ceramic. Generally, these are moderate components as described above. Metallized conductive paste. As also shown in FIG. 3D, a spacer 124 'is deposited on the interlayer window 122, which aligns and catches the interlayer window 112 in the first green sheet 120. The pad 124 is deposited on the first green sheet 120 ', and may alternatively be deposited on the back surface 119 of the first green sheet 110. A metal conductive paste is used to form the gasket 24, and at the same time, the metal-filled interlayer window 122 and the ceramic of the second green sheet provide good bonding and electrical stability. Generally these are also metalized conductive pastes of moderate composition. After printing by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the metallized first and second green slabs 110 and 120 are stacked and pressed. Pay special attention to the inner liner 124 aligned with the first green slab layer. The metallized interlayer window 114 is used to form a multi-layer green sheet stack 140, as shown in FIG. 3E. During this stacking and pressing step, an additional dielectric layer 130 having a metal-filled interlayer window 132 (preferably 100% by volume) is included, which provides the leads in a ceramic substrate. The first and second green sheet layers 110 and 120 are completely pressed together to form the metal structure by the interlayer windows 114, 122 and the pads 116, 124. The high metal content liner 116 and the interlayer window 114 are not closely adhered to the ceramic. However, the liner 116 is supported by the inner liner 124 via a high metal content interlayer window 114. The inner lining with moderately high metal content is well bonded to ceramics. Therefore, each interlayer window UI4 provides extra electrical and mechanical connections between the inner pad 124 and the outer pad 116. A fourth embodiment of the present invention is shown in FIG. In this example, page 19 This paper size applies the Chinese National Standard (CNS) A4 specification (210x297 Gongchu) ~ Sleep 4 A7 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs -------- B7_ Description of the invention () The extra ceramic layer 134 is applied to the outside of the first green sheet layer 110 before lamination. After sintering, it helps to fix the metal gasket 124 to the ceramic material. The processes in Figures 4A to 4F are similar to Figures 3A to 3E. An additional green sheet layer 134 is prepared, and the green sheet layer 134 is punched or cut to open the area 136, which corresponds to the position of the pad U 6 deposited on the first green sheet layer 110. These opening areas i 3 6 are slightly smaller than the diameter of the pad i 丨 6. During the lamination, the opening area 136 of the green sheet layer 134 is aligned with the pad 116 of the first green sheet layer 110 and sealed around the ceramic. Edge of each pad Π 6. During the sintering, the compression layer 1 3 4 and the periphery of the gasket 1 1 6 are bonded to the ceramic, thereby improving the adhesion of the gasket 116. If desired, the layer 134 may be a masked dielectric conductive paste. The fifth embodiment of the present invention is shown in FIG. 5 as β, and as shown in FIG. 5A, a first green sheet layer 210 having a metal-filled interlayer window 212 and a surface pad 216 is formed. Then, a second green sheet layer 220 having a metal-filled interlayer window 222 and an inner pad 224 is formed. The inner liner 224 may be formed on the second green sheet layer 220, or alternatively may be formed on the selective green sheet layer 230 as discussed later. The metal-filled interlayer window 222 and the surface pad 216 have a high metal content and have poor adhesion to ceramics. The inner pad 224 has a moderate metal content and has good adhesion to ceramics. The first and second green sheet layers 210 and 220 are then stacked and laminated with an optional extra green sheet layer 230. The green sheet layer 230 has a metal filling interlayer window, preferably 100% of the metal volume. , Thereby forming a multi-layer green embryo sheet stack 240. The multilayer green sheet stack 240 is then sintered under conventional conditions. During the sintering period, the ceramic used for the first green sheet layer 210 was not selected. This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) ................. … Install 丨 丨 ...... Order…: 丨 line (please read the precautions on the back before filling this page) A7 B7 V. Invention Description () Materials, so it will not be pressed. After 纟 〇 / 1, 乂…, a multilayer ceramic substrate 242 is formed, which will not damage the gold ^. A, fluorine, and remove the ceramic of the first green sheet layer 2 1 〇, for example, by , Called 嗖 9, skin, head removed. Residual part: the interlayer window 212 with the opening area 234, which is used for ceramic materials. "Back" conforms to the metal shape, and uses the exposed surface of the external profile 216 to join the material or material column for the attachment of the circuit card or other components. Furthermore, it is worth noting that the surface of the pepper 216 is supported on the multilayer ceramic substrate 242 by the interlayer windows 2U, 220 and an internal lining which is well combined with ceramic materials. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The sixth embodiment of the present invention is shown in Fig. 6, in which the metal surface liner has a good combination with the ceramic substrate. First, a metal-filled interlayer window 212 is formed by punching holes and filling the interlayer window with a high metal conductive paste to form a green sheet layer 210. The ceramic material of the first green embryo layer 21 is selected, and there will be no compression during sintering. Then, a pad 216 is formed on the green sheet using a high metal content conductive paste. After sintering, the metal content of the interlayer window 212 and the pad 216 is preferably 100% by volume. The second green sheet layer is punched, and a moderate metal shield is used to form a metal to fill the interlayer window 222. Then, A pad 224 is formed on the second green sheet layer 220 by shielding. The metal composition of the liner 224 and the ceramic filler are selected to provide a good combination of the liner 224 to the ceramic after sintering. As shown in FIG. 6B, the pad 224 may be shielded on the second green sheet layer 220, or may be shielded on the side 219 of the first green sheet layer 210 instead. The interlayer window 212 and the liner 216 are made of a high metal gasket, and the density after sintering is greater than 90%. Additional metallized green sheet layer 230 is aligned with the first and second green sheet layers 210 and 220 and stacked. Page 21 This paper size applies to China National Standard (CNS) A4 (210X297 mm) 498024 A7 B7
經濟部智慧財產局員工消費合作社印製 五、發明説明（） 與壓合，藉以形成多層生胚片疊片25 0。壓合及燒結生胚 片堆疊，藉以形成多層電子基材。在燒結之後，形成多層 陶瓷:基材252，藉由不會損害金屬外形之製程，移除第一 生胚片層210，比如是超音波清除。殘留部分是介層窗 212’其具有開口區域234，為陶资材質使用之處。使用外 部襯墊216之暴露表面接合焊接球或是焊接柱，用在隨後 對電路卡或是其他元件之附著。在此例中，在陶資基材上 之襯墊224具有良好的結合。若有需要，在外部襯塾216 與襯墊224之間的空間234可以填入聚合物，藉以提供襯 墊216對陶瓷之額外的支撐，可藉以支撐結構並且減小利 用損害。可用於此之聚合物包括聚乙醯胺、環氧基樹脂以 及類似材質。 本發明之最後實施例可參考先前參照第1至4圖討論 之實施例，在穩定性上可以提供更大的改進。現在請參照 第7圖，纟會示多層陶瓷;基材340包括第一層310，具有單 一大型金屬填入介層窗314與外部襯墊316，以及第二層 320，具有金屬填入介層窗322。在第一層310與第二層 320之間***内部襯墊324。額外的選擇層330具有金屬 填入介層窗332。用於大型介層窗314與外部襯墊316之 金屬成分很高，較佳是金屬容積100%。此大型介層窗3 14 之直徑小於襯墊316與3 24之直徑，並且層310之厚度二 倍大於大型介層窗314之直徑。選擇適度金屬含量之襯墊 324與介層窗322，用以對多層陶瓷基材340之陶瓷材質 提供良好的結合。介層窗332如同傳統條件一般為金屬容 第22頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) ..........·----,裝........訂：：::線 (請先閲讀背面之注意事項再填寫本頁) A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（） 積 100%。 在形成前述結構中必須提出數個關键參數，藉以提供 最佳的效能與穩定性的改進。 在單位電性效能限制的情況下，具有高金屬含量之介 層W的長度必須盡量的長。介層窗愈長，則疲乏阻抗愈 高。可以藉由使用較厚的介電層，且/或堆疊多層穿越介層 窗（through-via)層在一起，増加介層窗的長度，藉以形成 長介層窗柱。 表面I/O襯塾中必須配置最高數量之介層窗。襯墊的 電性機能係由至少一個介層窗至襯墊的連接決定。連接到 襯塾的介層窗數量愈多，維持電性連接的時間愈長，藉以 提供增進的電性穩定性。 介層窗在承受熱循環時，支撐介層窗之延展性與疲乏 阻抗愈大’則穩定性愈大。因此柔軟的金屬，像銅、銀、 金及其合金將可經歷許多的應變循環。 當陶资與低匹配CTE金屬化搭配使用時，比如使用 銅、鎳、金與銀金屬化與低CTE陶瓷像具有2-6PPm CTE 之玻璃陶瓷系統，在外部介電層（如第丨圖中的層1〇)之内 與之上的金屬不會與陶瓷結合。在此金屬與鄰接的陶瓷表 面一般會存在非常小約1-10微米的空隙。由於在外層的 金屬並未化學性結合至陶資，在外部陶資層會造成非常小 的應力。外層之介層窗良好地化學性結合與電性連接至金 屬化的第二層（如第1圖中的層2〇)。金屬化的第二層(如 層20)—般良好地結合至陶瓷，並且通常藉由加入相當的 第23頁 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐） ..........- λ; -----— 面 — — ·看 $ (請先閱讀背面之注意事項再填寫本頁) 498024 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（ 介電材質而生成。此用在陶瓷生胚片層中的介電填充物一 般與介電材質相同或近似。 上述結構可以使用數種附著方法。這些包括LGA、 BGA與CGA第二層連接至陶瓷。在第i圖至第4圖以及 第7圖中所述之結構對於陶瓷特別有用，可以解決穩定鍵 結表面金屬之問題，並且可以用於LGA應用，在***及 使用期間，壓縮負載可應用至襯墊。同樣地，在第5圖與 第6圖所示之結構，在隨後製程中使用介電層填入表面襯 墊之間的空間，亦可以用於壓縮的LGA應用。在第1至7 圖所述之結構可用於BGA與CGA之應用，其使用焊料將 陶瓷:基材接合至電路板或另一陶瓷；。在這些應用中，外部 表面襯墊與支撐介層窗並未結合至陶瓷。跟襯墊直接結合 至陶瓷相比，支撐介層窗提供改進的機械與電性穩定性的 接合，並且在熱循環期間，於陶瓷與電路板之間的焊接提 供額外的應變減輕。可以使用第5圖與第6圖所述之結構 及組成，增加傳統陶瓷之第二層附著的熱循環穩定性，其 具有良好結合之表面襯墊（比如在先前討論的礬土系統）， 藉由提供表面外形，增加傳統焊接附著方法之疲勞阻抗， 比如是共晶、焊接球以及焊接柱附著。 實例 提供一個穩定性改進超越傳統附著方法的實例，準備 數個菊環（daisy chain)電路測試裝置，使用具有3ppin CTE 之32mm2的玻璃陶瓷基材，約1.9mm厚，且為銅金屬覆 第24頁 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公楚) ..........麵— : — i Λ —----#ϋ ν' - ^ (請先閲讀背面之注意事項再場寫本頁} 498024 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（） 蓋。在燒結及貼合之後，準備每個測試媒介，使用90%鉛 + 10%錫之焊接球附著，藉由共晶錫-鉛焊料，然後附著至 具有約18ppm CTE之FR4印刷電路板，再次使用共晶錫-錯焊料。然後從-5 5 °C至+1 10。(：，以每小時約2次之速率， 熱循環基材與電路板。紀錄第一次損壞發生之熱循環次 數’通常是發生在基材周緣之菊環連接。在測試中包括以 高礬土陶瓷製成，具有CTE約6ppm之控制陶瓷基材，以 及相同厚度具有良好結合之鉬金屬基底襯墊。傾向於製作 表面金屬襯墊，其良好附著於低CTE陶瓷，可給於高變化 貼合及焊接，但一般會有不良的結果。通常在低於丨〇〇次 熱循環之後，表面金屬襯墊將從陶瓷分離。 準備相同的測試裝置，使用第3圖所示之結構，在介 層窗114與外部襯墊11 6,使用90%銅與1〇%鎳金屬覆蓋， 並且在介層窗122與内部襯墊124，使用50 %銅+50 %介電 材質組成金屬覆蓋，一般在約4 5 0至5 0 〇次熱循環之後， 形成第一次電路損壞。這些結果比較優於礬土控制基材， 其在350至400次熱循ί哀之後形成第一次電路損壞。 在熱循環期間，由於3ppm陶瓷與i8ppm電路板之 CTE並不匹配’支撐介層窗承受不少的應變。紀錄菊環電 路斷路以及考慮基材具有電性損壞的時間，依照本發明， 可維持每一個焊接連接之電性連續，直到最後的導電性支 撐介層窗損壞。 對於熟習此技藝者，在不脫離本發明之精神下，可依 據在此所述之較佳實施例做其他的潤飾因此，這些潤錦 第25頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公楚)---- ----------•—…—裝…......訂…丨：…線 (請先閲讀背面之注意事項再填寫本頁) 498024 A7 _ B7_ 五、發明説明（） 係在本發明之範圍下，且受申請專利範圍所限制。 ..........:裝........訂· ： ： ！線 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 第26頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐)Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () and pressing to form a multi-layer green embryo sheet stack. The green compact is stacked and sintered to form a multilayer electronic substrate. After sintering, a multilayer ceramic: substrate 252 is formed, and the first green sheet layer 210 is removed by a process that does not damage the shape of the metal, such as ultrasonic removal. The remaining part is the via window 212 'which has an opening area 234, which is a place where ceramic materials are used. Use the exposed surface of the external pad 216 to bond solder balls or solder posts for subsequent attachment to circuit cards or other components. In this example, the pad 224 on the ceramic substrate has a good bond. If necessary, the space 234 between the outer liner 216 and the pad 224 may be filled with a polymer to provide additional support to the ceramic by the pad 216, thereby supporting the structure and reducing the use damage. Polymers that can be used for this include polyethyleneamine, epoxy resins, and similar materials. The last embodiment of the present invention can refer to the embodiment previously discussed with reference to Figs. 1 to 4 and can provide greater improvements in stability. Now referring to FIG. 7, a multi-layer ceramic is shown; the substrate 340 includes a first layer 310 having a single large metal-filled interposer window 314 and an outer pad 316, and a second layer 320 having a metal-filled interposer. Window 322. An inner pad 324 is inserted between the first layer 310 and the second layer 320. The additional selection layer 330 has a metal-filled via window 332. The metal composition for the large interlayer window 314 and the outer pad 316 is very high, preferably 100% of the metal volume. The diameter of the large interlayer window 3 14 is smaller than the diameters of the spacers 316 and 32, and the thickness of the layer 310 is twice larger than the diameter of the large interlayer window 314. The gasket 324 and the interlayer window 322 with a moderate metal content are selected to provide a good combination of the ceramic materials of the multilayer ceramic substrate 340. The interlayer window 332 is generally a metal container as in traditional conditions. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) ..............., installed. ....... Order :::: line (Please read the notes on the back before filling this page) A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description (100%). Several key parameters must be proposed in the formation of the aforementioned structure to provide the best performance and stability improvements. In the case where the unit electrical performance is limited, the length of the interlayer W having a high metal content must be as long as possible. The longer the via window, the higher the fatigue resistance. Longer dielectric window pillars can be formed by using thicker dielectric layers and / or stacking multiple through-via layers together to increase the length of the dielectric window. Surface I / O liners must be configured with the highest number of vias. The electrical function of the gasket is determined by the connection of at least one via to the gasket. The greater the number of dielectric windows connected to the lining, the longer the electrical connection is maintained, thereby providing improved electrical stability. When a via window is subjected to thermal cycling, the greater the ductility and fatigue resistance of the via window, the greater the stability is. Therefore soft metals like copper, silver, gold and their alloys will undergo many strain cycles. When ceramic materials are used with low-match CTE metallization, such as copper, nickel, gold, and silver metallization and low-CTE ceramics, such as glass-ceramic systems with 2-6PPm CTE, the external dielectric layer (as shown in Figure 丨) The metal within and above the layer 10) will not be combined with the ceramic. There are usually very small voids of about 1-10 microns on the metal and adjacent ceramic surfaces. Since the metal on the outer layer is not chemically bonded to the ceramic material, very small stresses are caused on the external ceramic layer. The outer interlayer window is well chemically bonded and electrically connected to the second metallized layer (such as layer 20 in Figure 1). The metalized second layer (such as layer 20) is as well bonded to the ceramic, and usually by adding an equivalent page 23 This paper size applies the Chinese National Standard (CNS) A4 specification (210x297 mm) ... ......- λ; -----— noodles — — · See $ (Please read the notes on the back before filling this page) 498024 A7 B7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Description (Generated by a dielectric material. The dielectric filler used in the ceramic green sheet layer is generally the same or similar to the dielectric material. The structure can use several attachment methods. These include LGA, BGA, and CGA second layers Connected to ceramics. The structures described in Figures i through 4 and 7 are particularly useful for ceramics, can solve the problem of stabilizing the bonding surface metal, and can be used in LGA applications. During insertion and use, compression The load can be applied to the pads. Similarly, the structures shown in Figures 5 and 6 use a dielectric layer to fill the space between the surface pads in subsequent processes and can also be used in compressed LGA applications. Structures shown in Figures 1 to 7 can be used for BGA and CGA Applications that use solder to bond ceramics: a substrate to a circuit board or another ceramic; In these applications, external surface pads and supporting interlayer windows are not bonded to the ceramic. Compared to bonding pads directly to ceramic, Supporting interlayer windows provide improved mechanical and electrical stability bonding and provide additional strain relief for soldering between ceramic and circuit boards during thermal cycling. The structures described in Figures 5 and 6 can be used And composition to increase the thermal cycling stability of the second layer of traditional ceramics, which has a well-bonded surface pad (such as the bauxite system discussed earlier), by providing a surface profile that increases the fatigue resistance of traditional welding attachment methods For example, eutectic, solder ball, and welding column attachment. The example provides an example of stability improvement beyond the traditional attachment method. Prepare several daisy chain circuit test devices using a 32mm2 glass ceramic substrate with 3ppin CTE. , About 1.9mm thick, and is copper-clad. Page 24 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210x297 cm) .......... Surface —: — I Λ —---- # ϋ ν '-^ (Please read the notes on the back before writing this page} 498024 A7 B7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy After sintering and bonding, prepare each test medium, use 90% lead + 10% tin solder balls to attach, eutectic tin-lead solder, and then attach to a FR4 printed circuit board with about 18 ppm CTE. Crystal tin-wrong solder. Then from -5 5 ° C to +1 10. (: Thermal cycling of substrate and circuit board at a rate of about 2 times per hour. Recording the number of thermal cycles where the first damage occurred is usually a daisy-chain connection that occurs around the periphery of the substrate. The test included a control ceramic substrate made of high alumina ceramics with a CTE of about 6 ppm, and a molybdenum metal backing of the same thickness with good bonding. Tends to make surface metal pads, which adhere well to low CTE ceramics and can give high-variation bonding and soldering, but generally have poor results. Usually after less than 1000 thermal cycles, the surface metal gasket will separate from the ceramic. Prepare the same test device, using the structure shown in Figure 3, covering the interlayer window 114 and the outer pad 11 6 with 90% copper and 10% nickel metal, and interposing the window 122 and the inner pad 124 A 50% copper + 50% dielectric material is used to form a metal cover. Generally, after about 450 to 500 thermal cycles, the first circuit damage is formed. These results are better than alumina controlled substrates, which form the first circuit damage after 350 to 400 thermal cycles. During thermal cycling, the CTE of 3ppm ceramic and i8ppm circuit boards do not match. The supporting interlayer window is subject to considerable strain. Recording the time when the daisy-ring circuit is disconnected and considering the substrate has electrical damage, according to the present invention, the electrical continuity of each soldered connection can be maintained until the last conductive support via window is damaged. For those skilled in the art, other retouching can be done according to the preferred embodiments described herein without departing from the spirit of the present invention. Therefore, these paper standards on page 25 apply Chinese National Standard (CNS) A4 specifications (210X297 公 楚) ---- ---------- • —… —install ……… Order… 丨:… (Please read the precautions on the back before filling in this page) 498024 A7 _ B7_ V. The description of the invention () is under the scope of the present invention and is limited by the scope of patent application. ..........: Equipment ........ Order · ::! (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Page 26 This paper size applies to China National Standard (CNS) A4 (210X297 mm)