TW429567B - Stack package and method of fabricating the same - Google Patents
Stack package and method of fabricating the sameInfo
- Publication number
- TW429567B TW429567B TW088115723A TW88115723A TW429567B TW 429567 B TW429567 B TW 429567B TW 088115723 A TW088115723 A TW 088115723A TW 88115723 A TW88115723 A TW 88115723A TW 429567 B TW429567 B TW 429567B
- Authority
- TW
- Taiwan
- Prior art keywords
- ceramic capsule
- metal wire
- semiconductor chip
- stack package
- capsule
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000002775 capsule Substances 0.000 abstract 6
- 239000000919 ceramic Substances 0.000 abstract 6
- 239000004065 semiconductor Substances 0.000 abstract 6
- 239000002184 metal Substances 0.000 abstract 4
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980037931A KR100290784B1 (ko) | 1998-09-15 | 1998-09-15 | 스택 패키지 및 그 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW429567B true TW429567B (en) | 2001-04-11 |
Family
ID=19550582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW088115723A TW429567B (en) | 1998-09-15 | 1999-09-13 | Stack package and method of fabricating the same |
Country Status (4)
Country | Link |
---|---|
US (1) | US6222259B1 (zh) |
JP (1) | JP3752508B2 (zh) |
KR (1) | KR100290784B1 (zh) |
TW (1) | TW429567B (zh) |
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KR100186331B1 (ko) | 1996-06-17 | 1999-03-20 | 문정환 | 적층형 패키지 |
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-
1998
- 1998-09-15 KR KR1019980037931A patent/KR100290784B1/ko not_active IP Right Cessation
-
1999
- 1999-09-10 US US09/393,869 patent/US6222259B1/en not_active Expired - Lifetime
- 1999-09-13 TW TW088115723A patent/TW429567B/zh not_active IP Right Cessation
- 1999-09-14 JP JP26066299A patent/JP3752508B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP3752508B2 (ja) | 2006-03-08 |
KR20000019697A (ko) | 2000-04-15 |
US6222259B1 (en) | 2001-04-24 |
KR100290784B1 (ko) | 2001-07-12 |
JP2000124393A (ja) | 2000-04-28 |
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