TW429462B - Manufacturing method and processing device for semiconductor device - Google Patents
Manufacturing method and processing device for semiconductor deviceInfo
- Publication number
- TW429462B TW429462B TW088106656A TW88106656A TW429462B TW 429462 B TW429462 B TW 429462B TW 088106656 A TW088106656 A TW 088106656A TW 88106656 A TW88106656 A TW 88106656A TW 429462 B TW429462 B TW 429462B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- wafer
- polishing
- semiconductor device
- irregular pattern
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 238000005498 polishing Methods 0.000 abstract 5
- 230000001788 irregular Effects 0.000 abstract 3
- 239000003082 abrasive agent Substances 0.000 abstract 1
- 239000006061 abrasive grain Substances 0.000 abstract 1
- 230000004913 activation Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22687298 | 1998-08-11 | ||
JP10127699A JP3770752B2 (ja) | 1998-08-11 | 1999-04-08 | 半導体装置の製造方法及び加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW429462B true TW429462B (en) | 2001-04-11 |
Family
ID=26442174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW088106656A TW429462B (en) | 1998-08-11 | 1999-04-26 | Manufacturing method and processing device for semiconductor device |
Country Status (4)
Country | Link |
---|---|
US (1) | US6612912B2 (zh) |
JP (1) | JP3770752B2 (zh) |
KR (1) | KR100574323B1 (zh) |
TW (1) | TW429462B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI606888B (zh) * | 2013-07-24 | 2017-12-01 | Disco Corp | Crack thickness detection device |
WO2018192285A1 (zh) | 2017-04-17 | 2018-10-25 | 王宛婷 | 复合性材料 |
CN112025547A (zh) * | 2020-09-15 | 2020-12-04 | 泉芯集成电路制造(济南)有限公司 | 激光投影虚拟校正设备和方法 |
CN113858034A (zh) * | 2021-09-18 | 2021-12-31 | 长江存储科技有限责任公司 | 抛光装置、抛光装置的检测方法和抛光*** |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6322427B1 (en) * | 1999-04-30 | 2001-11-27 | Applied Materials, Inc. | Conditioning fixed abrasive articles |
US6800020B1 (en) * | 2000-10-02 | 2004-10-05 | Lam Research Corporation | Web-style pad conditioning system and methods for implementing the same |
WO2002043923A1 (de) * | 2000-11-29 | 2002-06-06 | Infineon Technologies Ag | Reinigungsvorrichtung zum reinigen von für das polieren von halbleiterwafern verwendeten poliertüchern |
KR100857504B1 (ko) * | 2000-12-01 | 2008-09-08 | 도요 고무 고교 가부시키가이샤 | 연마 패드용 쿠션층 |
DE10314212B4 (de) * | 2002-03-29 | 2010-06-02 | Hoya Corp. | Verfahren zur Herstellung eines Maskenrohlings, Verfahren zur Herstellung einer Transfermaske |
US6910951B2 (en) * | 2003-02-24 | 2005-06-28 | Dow Global Technologies, Inc. | Materials and methods for chemical-mechanical planarization |
US9110456B2 (en) * | 2004-09-08 | 2015-08-18 | Abb Research Ltd. | Robotic machining with a flexible manipulator |
US20070087672A1 (en) * | 2005-10-19 | 2007-04-19 | Tbw Industries, Inc. | Apertured conditioning brush for chemical mechanical planarization systems |
US7749050B2 (en) * | 2006-02-06 | 2010-07-06 | Chien-Min Sung | Pad conditioner dresser |
US8142261B1 (en) | 2006-11-27 | 2012-03-27 | Chien-Min Sung | Methods for enhancing chemical mechanical polishing pad processes |
US7658187B2 (en) * | 2007-01-16 | 2010-02-09 | John Budiac | Adjustable stone cutting guide system |
US20090127231A1 (en) * | 2007-11-08 | 2009-05-21 | Chien-Min Sung | Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby |
US8210904B2 (en) * | 2008-04-29 | 2012-07-03 | International Business Machines Corporation | Slurryless mechanical planarization for substrate reclamation |
JP6243255B2 (ja) * | 2014-02-25 | 2017-12-06 | 光洋機械工業株式会社 | ワークの平面研削方法 |
CN104369104A (zh) * | 2014-09-17 | 2015-02-25 | 浙江舜宇光学有限公司 | 一种可在线修锐金刚石丸片的装置、研磨机及其使用方法 |
CN104505337B (zh) * | 2014-12-23 | 2017-05-17 | 无锡中微高科电子有限公司 | 一种不规则晶圆的减薄方法 |
US11923208B2 (en) * | 2017-05-19 | 2024-03-05 | Illinois Tool Works Inc. | Methods and apparatuses for chemical delivery for brush conditioning |
KR102674027B1 (ko) * | 2019-01-29 | 2024-06-12 | 삼성전자주식회사 | 재생 연마패드 |
CN111958356A (zh) * | 2020-08-27 | 2020-11-20 | 薛震宇 | 一种建筑板材再利用处理装置 |
CN112476243A (zh) * | 2020-11-26 | 2021-03-12 | 华虹半导体(无锡)有限公司 | 化学机械研磨装置及化学机械研磨工艺研磨垫清洗装置 |
CN112892809B (zh) * | 2021-02-05 | 2023-01-24 | 惠州大唐伟业电子有限公司 | 一种光学玻璃的超声加工装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58184727A (ja) * | 1982-04-23 | 1983-10-28 | Disco Abrasive Sys Ltd | シリコンウェ−ハの面を研削する方法 |
DE69317838T2 (de) * | 1992-09-24 | 1998-11-12 | Ebara Corp | Poliergerät |
JPH07249601A (ja) | 1994-03-10 | 1995-09-26 | Hitachi Ltd | 研削装置 |
JPH08168953A (ja) * | 1994-12-16 | 1996-07-02 | Ebara Corp | ドレッシング装置 |
JPH0929630A (ja) * | 1995-07-19 | 1997-02-04 | Tokyo Seimitsu Co Ltd | 表面研削方法 |
US6180020B1 (en) | 1995-09-13 | 2001-01-30 | Hitachi, Ltd. | Polishing method and apparatus |
US5785585A (en) * | 1995-09-18 | 1998-07-28 | International Business Machines Corporation | Polish pad conditioner with radial compensation |
US5624303A (en) | 1996-01-22 | 1997-04-29 | Micron Technology, Inc. | Polishing pad and a method for making a polishing pad with covalently bonded particles |
JP3111892B2 (ja) | 1996-03-19 | 2000-11-27 | ヤマハ株式会社 | 研磨装置 |
EP0803326B1 (en) | 1996-04-26 | 2002-10-02 | Ebara Corporation | Polishing apparatus |
WO1998014307A1 (fr) * | 1996-09-30 | 1998-04-09 | Osaka Diamond Industrial Co. | Outil superabrasif et son procede de fabrication |
US5782675A (en) | 1996-10-21 | 1998-07-21 | Micron Technology, Inc. | Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers |
JPH10128654A (ja) | 1996-10-31 | 1998-05-19 | Toshiba Corp | Cmp装置及び該cmp装置に用いることのできる研磨布 |
DE69738012T2 (de) * | 1996-11-26 | 2007-12-13 | Matsushita Electric Industrial Co., Ltd., Kadoma | Halbleitervorrichtung und deren Herstellungsverfahren |
JP3722591B2 (ja) * | 1997-05-30 | 2005-11-30 | 株式会社日立製作所 | 研磨装置 |
JP2845238B1 (ja) | 1997-08-29 | 1999-01-13 | 日本電気株式会社 | 平面研磨装置 |
US5827112A (en) * | 1997-12-15 | 1998-10-27 | Micron Technology, Inc. | Method and apparatus for grinding wafers |
US6113462A (en) * | 1997-12-18 | 2000-09-05 | Advanced Micro Devices, Inc. | Feedback loop for selective conditioning of chemical mechanical polishing pad |
SG119138A1 (en) | 1998-04-28 | 2006-02-28 | Ebara Corp | Abrading plate and polishing method using the same |
-
1999
- 1999-04-08 JP JP10127699A patent/JP3770752B2/ja not_active Expired - Fee Related
- 1999-04-26 TW TW088106656A patent/TW429462B/zh not_active IP Right Cessation
- 1999-08-10 KR KR1019990032722A patent/KR100574323B1/ko not_active IP Right Cessation
- 1999-08-10 US US09/371,003 patent/US6612912B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI606888B (zh) * | 2013-07-24 | 2017-12-01 | Disco Corp | Crack thickness detection device |
WO2018192285A1 (zh) | 2017-04-17 | 2018-10-25 | 王宛婷 | 复合性材料 |
CN112025547A (zh) * | 2020-09-15 | 2020-12-04 | 泉芯集成电路制造(济南)有限公司 | 激光投影虚拟校正设备和方法 |
CN113858034A (zh) * | 2021-09-18 | 2021-12-31 | 长江存储科技有限责任公司 | 抛光装置、抛光装置的检测方法和抛光*** |
Also Published As
Publication number | Publication date |
---|---|
JP3770752B2 (ja) | 2006-04-26 |
JP2000117616A (ja) | 2000-04-25 |
KR20000017219A (ko) | 2000-03-25 |
US6612912B2 (en) | 2003-09-02 |
US20020119733A1 (en) | 2002-08-29 |
KR100574323B1 (ko) | 2006-04-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |