TW429462B - Manufacturing method and processing device for semiconductor device - Google Patents

Manufacturing method and processing device for semiconductor device

Info

Publication number
TW429462B
TW429462B TW088106656A TW88106656A TW429462B TW 429462 B TW429462 B TW 429462B TW 088106656 A TW088106656 A TW 088106656A TW 88106656 A TW88106656 A TW 88106656A TW 429462 B TW429462 B TW 429462B
Authority
TW
Taiwan
Prior art keywords
manufacturing
wafer
polishing
semiconductor device
irregular pattern
Prior art date
Application number
TW088106656A
Other languages
English (en)
Inventor
Shigeo Moriyama
Kan Yasui
Yoshio Kawamura
Souichi Katagiri
Akinari Kawai
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW429462B publication Critical patent/TW429462B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
TW088106656A 1998-08-11 1999-04-26 Manufacturing method and processing device for semiconductor device TW429462B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22687298 1998-08-11
JP10127699A JP3770752B2 (ja) 1998-08-11 1999-04-08 半導体装置の製造方法及び加工装置

Publications (1)

Publication Number Publication Date
TW429462B true TW429462B (en) 2001-04-11

Family

ID=26442174

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088106656A TW429462B (en) 1998-08-11 1999-04-26 Manufacturing method and processing device for semiconductor device

Country Status (4)

Country Link
US (1) US6612912B2 (zh)
JP (1) JP3770752B2 (zh)
KR (1) KR100574323B1 (zh)
TW (1) TW429462B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI606888B (zh) * 2013-07-24 2017-12-01 Disco Corp Crack thickness detection device
WO2018192285A1 (zh) 2017-04-17 2018-10-25 王宛婷 复合性材料
CN112025547A (zh) * 2020-09-15 2020-12-04 泉芯集成电路制造(济南)有限公司 激光投影虚拟校正设备和方法
CN113858034A (zh) * 2021-09-18 2021-12-31 长江存储科技有限责任公司 抛光装置、抛光装置的检测方法和抛光***

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US6322427B1 (en) * 1999-04-30 2001-11-27 Applied Materials, Inc. Conditioning fixed abrasive articles
US6800020B1 (en) * 2000-10-02 2004-10-05 Lam Research Corporation Web-style pad conditioning system and methods for implementing the same
WO2002043923A1 (de) * 2000-11-29 2002-06-06 Infineon Technologies Ag Reinigungsvorrichtung zum reinigen von für das polieren von halbleiterwafern verwendeten poliertüchern
KR100857504B1 (ko) * 2000-12-01 2008-09-08 도요 고무 고교 가부시키가이샤 연마 패드용 쿠션층
DE10314212B4 (de) * 2002-03-29 2010-06-02 Hoya Corp. Verfahren zur Herstellung eines Maskenrohlings, Verfahren zur Herstellung einer Transfermaske
US6910951B2 (en) * 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
US9110456B2 (en) * 2004-09-08 2015-08-18 Abb Research Ltd. Robotic machining with a flexible manipulator
US20070087672A1 (en) * 2005-10-19 2007-04-19 Tbw Industries, Inc. Apertured conditioning brush for chemical mechanical planarization systems
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
US8142261B1 (en) 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US7658187B2 (en) * 2007-01-16 2010-02-09 John Budiac Adjustable stone cutting guide system
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
US8210904B2 (en) * 2008-04-29 2012-07-03 International Business Machines Corporation Slurryless mechanical planarization for substrate reclamation
JP6243255B2 (ja) * 2014-02-25 2017-12-06 光洋機械工業株式会社 ワークの平面研削方法
CN104369104A (zh) * 2014-09-17 2015-02-25 浙江舜宇光学有限公司 一种可在线修锐金刚石丸片的装置、研磨机及其使用方法
CN104505337B (zh) * 2014-12-23 2017-05-17 无锡中微高科电子有限公司 一种不规则晶圆的减薄方法
US11923208B2 (en) * 2017-05-19 2024-03-05 Illinois Tool Works Inc. Methods and apparatuses for chemical delivery for brush conditioning
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
CN111958356A (zh) * 2020-08-27 2020-11-20 薛震宇 一种建筑板材再利用处理装置
CN112476243A (zh) * 2020-11-26 2021-03-12 华虹半导体(无锡)有限公司 化学机械研磨装置及化学机械研磨工艺研磨垫清洗装置
CN112892809B (zh) * 2021-02-05 2023-01-24 惠州大唐伟业电子有限公司 一种光学玻璃的超声加工装置

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JPS58184727A (ja) * 1982-04-23 1983-10-28 Disco Abrasive Sys Ltd シリコンウェ−ハの面を研削する方法
DE69317838T2 (de) * 1992-09-24 1998-11-12 Ebara Corp Poliergerät
JPH07249601A (ja) 1994-03-10 1995-09-26 Hitachi Ltd 研削装置
JPH08168953A (ja) * 1994-12-16 1996-07-02 Ebara Corp ドレッシング装置
JPH0929630A (ja) * 1995-07-19 1997-02-04 Tokyo Seimitsu Co Ltd 表面研削方法
US6180020B1 (en) 1995-09-13 2001-01-30 Hitachi, Ltd. Polishing method and apparatus
US5785585A (en) * 1995-09-18 1998-07-28 International Business Machines Corporation Polish pad conditioner with radial compensation
US5624303A (en) 1996-01-22 1997-04-29 Micron Technology, Inc. Polishing pad and a method for making a polishing pad with covalently bonded particles
JP3111892B2 (ja) 1996-03-19 2000-11-27 ヤマハ株式会社 研磨装置
EP0803326B1 (en) 1996-04-26 2002-10-02 Ebara Corporation Polishing apparatus
WO1998014307A1 (fr) * 1996-09-30 1998-04-09 Osaka Diamond Industrial Co. Outil superabrasif et son procede de fabrication
US5782675A (en) 1996-10-21 1998-07-21 Micron Technology, Inc. Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
JPH10128654A (ja) 1996-10-31 1998-05-19 Toshiba Corp Ｃｍｐ装置及び該ｃｍｐ装置に用いることのできる研磨布
DE69738012T2 (de) * 1996-11-26 2007-12-13 Matsushita Electric Industrial Co., Ltd., Kadoma Halbleitervorrichtung und deren Herstellungsverfahren
JP3722591B2 (ja) * 1997-05-30 2005-11-30 株式会社日立製作所 研磨装置
JP2845238B1 (ja) 1997-08-29 1999-01-13 日本電気株式会社 平面研磨装置
US5827112A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
US6113462A (en) * 1997-12-18 2000-09-05 Advanced Micro Devices, Inc. Feedback loop for selective conditioning of chemical mechanical polishing pad
SG119138A1 (en) 1998-04-28 2006-02-28 Ebara Corp Abrading plate and polishing method using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI606888B (zh) * 2013-07-24 2017-12-01 Disco Corp Crack thickness detection device
WO2018192285A1 (zh) 2017-04-17 2018-10-25 王宛婷 复合性材料
CN112025547A (zh) * 2020-09-15 2020-12-04 泉芯集成电路制造(济南)有限公司 激光投影虚拟校正设备和方法
CN113858034A (zh) * 2021-09-18 2021-12-31 长江存储科技有限责任公司 抛光装置、抛光装置的检测方法和抛光***

Also Published As

Publication number Publication date
JP3770752B2 (ja) 2006-04-26
JP2000117616A (ja) 2000-04-25
KR20000017219A (ko) 2000-03-25
US6612912B2 (en) 2003-09-02
US20020119733A1 (en) 2002-08-29
KR100574323B1 (ko) 2006-04-26

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Legal Events

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees