TW410399B - Solder ball carrier tape and method for manufacturing the same - Google Patents

Solder ball carrier tape and method for manufacturing the same Download PDF

Info

Publication number
TW410399B
TW410399B TW088101540A TW88101540A TW410399B TW 410399 B TW410399 B TW 410399B TW 088101540 A TW088101540 A TW 088101540A TW 88101540 A TW88101540 A TW 88101540A TW 410399 B TW410399 B TW 410399B
Authority
TW
Taiwan
Prior art keywords
tape
solder ball
solder
recesses
array
Prior art date
Application number
TW088101540A
Other languages
English (en)
Chinese (zh)
Inventor
Tetsuya Tao
Original Assignee
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co filed Critical Nippon Electric Co
Application granted granted Critical
Publication of TW410399B publication Critical patent/TW410399B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
TW088101540A 1998-02-17 1999-02-01 Solder ball carrier tape and method for manufacturing the same TW410399B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10034390A JP3116888B2 (ja) 1998-02-17 1998-02-17 ハンダボール・キャリアテープ及びその製作方法

Publications (1)

Publication Number Publication Date
TW410399B true TW410399B (en) 2000-11-01

Family

ID=12412849

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088101540A TW410399B (en) 1998-02-17 1999-02-01 Solder ball carrier tape and method for manufacturing the same

Country Status (4)

Country Link
JP (1) JP3116888B2 (ja)
KR (1) KR100313729B1 (ja)
CN (1) CN1234604A (ja)
TW (1) TW410399B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6426564B1 (en) * 1999-02-24 2002-07-30 Micron Technology, Inc. Recessed tape and method for forming a BGA assembly
KR100371563B1 (ko) * 2000-10-13 2003-02-07 삼성테크윈 주식회사 플립칩 반도체 팩키지의 제조 방법과 이 법을 이용하여 제조된 팩키지
JP3997991B2 (ja) * 2004-01-14 2007-10-24 セイコーエプソン株式会社 電子装置
CN102734760A (zh) * 2011-04-13 2012-10-17 苏州世鼎电子有限公司 通过转印锡膏而在金属线路上形成电源接点的方法

Also Published As

Publication number Publication date
JPH11233568A (ja) 1999-08-27
KR19990072561A (ko) 1999-09-27
KR100313729B1 (ko) 2001-11-15
JP3116888B2 (ja) 2000-12-11
CN1234604A (zh) 1999-11-10

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees